Stacked coil components

Abstract

This invention relates to a stacked coil component that is easily filled with magnetic resin throughout a through-hole. In the stacked coil component (10), the stack (30) has multiple insulating layers and a through-hole (TH). The through-hole (TH) extends along a third positive direction (Z1). A first coil (61) extends inside the stack (30) to surround the outside of the through-hole (TH). Magnetic resin (56) fills the through-hole (TH). An upper adhesive resin layer (52) is stacked on a first surface (30A) of the stack (30). An upper magnetic substrate (40) is bonded to the stack (30) via the upper adhesive resin layer (52). The upper adhesive resin layer (52) has a receiving space (CS). The receiving space (CS) is connected to the through-hole (TH). When the stacked coil component (10) is viewed toward the third positive direction (Z1), the outer edge of the receiving space (CS) is located further outward than the outer edge of the through-hole (TH). A portion of the magnetic resin (56) is located within the containment space (CS).

Description

Technical Field

[0001] This invention relates to laminated coil components. Background Technology

[0002] Patent Document 1 describes a laminated coil component comprising a laminate, a coil, and magnetic resin. The laminate has multiple insulating layers. These insulating layers are stacked along a lamination direction. The laminate has a through-hole in the shape of a quadrangular prism extending along the lamination direction. The coil extends spirally inside the laminate, surrounding the through-hole from the outside. Magnetic resin fills the interior of the through-hole. Therefore, the magnetic resin is approximately quadrangular prism-shaped, reflecting the shape of the through-hole. Furthermore, the laminated coil component includes two magnetic substrates. The two magnetic substrates clamp the laminate from the lamination direction and their opposite directions.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2010-80594 Summary of the Invention

[0004] In the laminated coil component described in Patent Document 1, during the process of filling the through-hole with magnetic resin, it is difficult to fill the entire area of ​​the through-hole with magnetic resin, resulting in voids inside the through-hole. If there are many voids inside the through-hole, the amount of magnetic resin decreases accordingly, which may adversely affect the characteristics of the laminated coil component.

[0005] To address the aforementioned issues, the present invention provides a stacked coil component comprising: a stacked body having a plurality of insulating layers stacked along a stacking direction and through holes penetrating the plurality of insulating layers along the stacking direction; a coil extending inside the stacked body in a manner that surrounds the outside of the through holes; a magnetic resin comprising resin and magnetic material, filled within the through holes; an adhesive resin layer stacked on the outer surface of the stacked body facing the stacking direction; and a magnetic substrate bonded to the stacked body via the adhesive resin layer, the adhesive resin layer having a receiving space connected to the through holes, wherein, when viewed in the stacking direction, the outer edge of the receiving space is located further outward than the outer edge of the through holes, and a portion of the magnetic resin is located within the receiving space.

[0006] Based on the above structure, during the manufacturing process of the laminated coil component, the receiving space of the adhesive resin layer can function as a space for the magnetic resin filling the through-hole to escape. That is, the maximum amount of magnetic resin can be set to the sum of the volume of the through-hole and the volume of the receiving space. Therefore, even if the amount of magnetic resin deviates due to manufacturing errors, it is less likely that the amount of magnetic resin will be less than the volume of the through-hole. As a result, the possibility of magnetic resin being distributed throughout the entire through-hole is increased.

[0007] It is easy to fill the entire through hole with magnetic resin. Attached Figure Description

[0008] Figure 1 This is a perspective view of a stacked coil component according to one embodiment.

[0009] Figure 2 This is a perspective view of the stacked coil component of this embodiment.

[0010] Figure 3 This is an exploded perspective view of the stacked coil component of this embodiment.

[0011] Figure 4 This is a top view of the second layer L2 in this embodiment.

[0012] Figure 5 It is along Figure 4 A cross-sectional view of the 5-5 line stacked coil component shown.

[0013] Figure 6 This is a cross-sectional view of the modified stacked coil component.

[0014] Figure 7 This is a cross-sectional view of the modified stacked coil component.

[0015] Figure 8 This is a cross-sectional view of the modified stacked coil component.

[0016] Explanation of reference numerals in the attached figures

[0017] 10, 110, 210, 310…Layered coil components; 20…Lower magnetic substrate; 30…Layer; 40…Upper magnetic substrate; 51…Lower adhesive resin layer; 52…Upper adhesive resin layer; 56, 156, 256, 356…Magnetic resin; 61…First coil; 62…Second coil; 63…Third coil; 64…Fourth coil; 81…First insulating layer; 82…Second insulating layer; 83…Third insulating layer; 84…Fourth insulating layer; 85…Fifth insulating layer; 86…Sixth insulating layer; 87…Seventh insulating layer; 88…Eighth insulating layer; CS…Receiving space; TH…Through hole. Detailed Implementation

[0018] <One implementation method>

[0019] The following describes one embodiment of the stacked coil component. Furthermore, the accompanying drawings sometimes show enlarged components for ease of understanding. Additionally, the dimensional ratios of the components may sometimes differ from the actual values ​​or from those in other drawings.

[0020] (Regarding the overall structure)

[0021] like Figure 1 As shown, the stacked coil component 10 includes a lower magnetic substrate 20, a lower adhesive resin layer 51, a laminate 30, an upper adhesive resin layer 52, and an upper magnetic substrate 40. The lower magnetic substrate 20, the lower adhesive resin layer 51, the laminate 30, the upper adhesive resin layer 52, and the upper magnetic substrate 40 are stacked sequentially along the stacking direction. In addition to the stacked structures described above, the stacked coil component 10 also includes magnetic resin 56.

[0022] like Figure 3 As shown, the lower magnetic substrate 20 is approximately cuboid in shape. The lower magnetic substrate 20 has a first main surface MF1. The first main surface MF1 is the surface with the largest area among the planes constituting the outer surface of the lower magnetic substrate 20. Furthermore, as... Figure 2 As shown, the lower magnetic substrate 20 has a second main surface MF2. The second main surface MF2 is parallel to the first main surface MF1.

[0023] like Figure 3 As shown, when the lower magnetic substrate 20 is viewed in a direction perpendicular to the first main surface MF1, the lower magnetic substrate 20 has a generally rectangular shape with its four corners cut off. Therefore, when viewed in a direction perpendicular to the first main surface MF1, the lower magnetic substrate 20 has four straight sides. In the following description, when the lower magnetic substrate 20 is viewed in a direction perpendicular to the first main surface MF1, the axis parallel to one of the four sides is designated as the first axis X. Furthermore, when the lower magnetic substrate 20 is viewed in a direction perpendicular to the first main surface MF1, the axis perpendicular to the first axis X is designated as the second axis Y. Additionally, the axis perpendicular to the first main surface MF1 is designated as the third axis Z. Moreover, one direction parallel to the first axis X is designated as the first positive direction X1, and the direction along the first axis X opposite to the first positive direction X1 is designated as the first negative direction X2. Furthermore, one direction along the second axis Y is designated as the second positive direction Y1, and the direction along the second axis Y opposite to the second positive direction Y1 is designated as the second negative direction Y2. Furthermore, the direction in which the first principal surface MF1 faces along the third axis Z is designated as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is designated as the third negative direction Z2. In addition, the third positive direction Z1 is the stacking direction.

[0024] The dimension of the lower magnetic substrate 20 along the second axis Y is larger than the dimension of the lower magnetic substrate 20 along the first axis X. That is, the first main surface MF1 and the second main surface MF2 of the lower magnetic substrate 20 are collectively elongated into a rectangular shape along the second axis Y. The lower magnetic substrate 20 is made of a magnetic material. The magnetic material is, for example, a sintered body of ferrite ceramic.

[0025] The lower magnetic substrate 20 has four cutouts 21A to 21D connecting the first main surface MF1 and the second main surface MF2. When the lower magnetic substrate 20 is viewed in the third positive direction Z1, each cutout 21 is present at one of the four corners. That is, the cutouts 21 are spaces present at the four corners of the lower magnetic substrate 20. In addition, when the lower magnetic substrate 20 is viewed in the third positive direction Z1, the area of ​​each cutout 21 decreases as it approaches the first main surface MF1 from the second main surface MF2. Furthermore, hereinafter, without distinguishing between the four cutouts 21A to 21D, they will be referred to as cutouts 21.

[0026] Viewed from the center of the lower magnetic substrate 20, cut 21A is located at the corner on the side of the first positive direction X1 and the second positive direction Y1. Viewed from the center of the lower magnetic substrate 20, cut 21B is located at the corner on the side of the first negative direction X2 and the second positive direction Y1. Viewed from the center of the lower magnetic substrate 20, cut 21C is located at the corner on the side of the first negative direction X2 and the second negative direction Y2. Viewed from the center of the lower magnetic substrate 20, cut 21D is located at the corner on the side of the first positive direction X1 and the second negative direction Y2.

[0027] like Figure 3 As shown, the stacked coil component 10 has a stacked structure consisting of a first layer L1 to an eleventh layer L11 on the side of the lower magnetic substrate 20 relative to the third positive direction Z1. The main surface of each layer is parallel to the first main surface MF1 of the lower magnetic substrate 20. The first layer L1 to the eleventh layer L11 are arranged sequentially along the third positive direction Z1.

[0028] The first layer L1 includes a lower adhesive resin layer 51 and a first magnetic portion 56A. The lower adhesive resin layer 51 is composed of an organic adhesive such as polyimide resin. When the first layer L1 is viewed in the third negative direction Z2, the first layer L1 covers most of the first main surface MF1 of the lower magnetic substrate 20. Therefore, when the first layer L1 is viewed in the third negative direction Z2, the first layer L1, like the lower magnetic substrate 20, has a roughly rectangular shape with its four corners cut off.

[0029] The lower adhesive resin layer 51 has a hole H1 extending along the third axis Z. When the lower adhesive resin layer 51 is viewed in the third positive direction Z1, the hole H1 appears to be quadrilateral. When the lower adhesive resin layer 51 is viewed in the third negative direction Z2, the hole H1 is located approximately at the center of the rectangular shape of the lower adhesive resin layer 51.

[0030] The first magnetic part 56A is located inside the hole H1. The first magnetic part 56A fills the internal space of the hole H1. The first magnetic part 56A is made of resin and magnetic material. Specifically, the resin is epoxy resin. The magnetic material is ferrite powder and metallic magnetic powder such as iron-based magnetic powder.

[0031] like Figure 4 As shown, the second layer L2 includes a first coil 61, six leads 71A to 71F, a first insulating layer 81, and a second magnetic part 56B. When viewed towards the third negative direction Z2, the second layer L2 has the same rectangular shape along the first axis X and along the second axis Y as the first layer L1. Furthermore, the second layer L2 does not have a corner-cut shape like the first layer L1. The thickness of the second layer L2 is, for example, 9 μm or more and 11 μm or less.

[0032] Lead-out portion 71A is located at the corner of the second layer L2 on the side of the first positive direction X1 and the second positive direction Y1. Lead-out portion 71B is located at the corner of the second layer L2 on the side of the first negative direction X2 and the second positive direction Y1. Lead-out portion 71C is located at the corner of the second layer L2 on the side of the first negative direction X2 and the second negative direction Y2. Lead-out portion 71D is located at the corner of the second layer L2 on the side of the first positive direction X1 and the second negative direction Y2. Lead-out portion 71E is located on the side of the second positive direction Y1 relative to the center of the second layer L2, and is located at the center along the first axis X. Lead-out portion 71F is located on the side of the second negative direction Y2 relative to the center of the second layer L2, and is located at the center along the first axis X. Lead-out portions 71A to 71F are made of conductive materials such as copper and silver.

[0033] When the second layer L2 is observed in the third negative direction Z2, the first coil 61 extends in a spiral shape with the center of the second layer L2 as the center. The first end of the first coil 61 is connected to the lead-out portion 71A. The second end of the first coil 61 is connected to the lead-out portion 71E. When the second layer L2 is observed in the third negative direction Z2, the first coil 61 is wound clockwise from the first end to the second end. The first coil 61 is made of a conductive material such as copper or silver. In this embodiment, the first coil 61 is made of the same conductive material as the leads 71A to 71F.

[0034] In the second layer L2, most of the portion excluding the first coil 61 and leads 71A-71F is the first insulating layer 81. The first insulating layer 81 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the first insulating layer 81 is made of the same material as the lower adhesive resin layer 51, namely polyimide resin.

[0035] The first insulating layer 81 has a hole H2 extending along the third axis Z. When the first insulating layer 81 is viewed in the third positive direction Z1, the hole H2 appears to be quadrilateral. When the first insulating layer 81 is viewed in the third negative direction Z2, the hole H2 is located approximately at the center of the second layer L2. The interior space of the hole H2 is connected to the interior space of the hole H1. Furthermore, the hole H2 is located inside the first coil 61. That is, the first coil 61 surrounds the outside of the hole H2.

[0036] The second magnetic part 56B is located inside the hole H2. The second magnetic part 56B fills the internal space of the hole H2. Therefore, the second magnetic part 56B is connected to the first magnetic part 56A. The material of the second magnetic part 56B is the same resin and magnetic material as the first magnetic part 56A.

[0037] like Figure 3 As shown, the third layer L3 has six leads 72A-72F, a second insulating layer 82, and a third magnetic part 56C. When viewed in the third negative direction Z2, the third layer L3 has the same rectangular shape as the second layer L2. The thickness of the third layer L3 is less than the thickness of the second layer L2.

[0038] The lead-out portion 72A is located at the corner of the third layer L3 on the side of the first positive direction X1 and the side of the second positive direction Y1. Therefore, the lead-out portion 72A is stacked on the side of the lead-out portion 71A of the second layer L2 facing the third positive direction Z1.

[0039] The lead-out portion 72B is located at the corner of the third layer L3 on the side of the first negative direction X2 and the side of the second positive direction Y1. Therefore, the lead-out portion 72B is stacked on the side of the lead-out portion 71B of the second layer L2 facing the third positive direction Z1.

[0040] The lead-out portion 72C is located at the corner of the third layer L3 on the side of the first negative direction X2 and the side of the second negative direction Y2. Therefore, the lead-out portion 72C is stacked on the side of the lead-out portion 71C of the second layer L2 facing the third positive direction Z1.

[0041] The lead-out portion 72D is located at the corner of the third layer L3 on the side of the first positive direction X1 and the side of the second negative direction Y2. Therefore, the lead-out portion 72D is stacked on the side of the lead-out portion 71D of the second layer L2 facing the third positive direction Z1.

[0042] The lead-out portion 72E is located on the second positive direction Y1 side relative to the center of the third layer L3, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 72E of the third layer L3 is located at the same position as the lead-out portion 71E of the second layer L2. Therefore, the lead-out portion 72E is stacked on the surface of the lead-out portion 71E of the second layer L2 facing the third positive direction Z1.

[0043] The lead-out portion 72F is located on the second negative direction Y2 side relative to the center of the third layer L3, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 72F of the third layer L3 is located at the same position as the lead-out portion 71F of the second layer L2. Therefore, the lead-out portion 72F is stacked on the surface of the lead-out portion 71E of the second layer L2 facing the third positive direction Z1. The lead-out portions 72A to 72F are made of conductive materials such as copper and silver. In this embodiment, the lead-out portions 72A to 72F are made of the same conductive material as the first coil 61.

[0044] In the third layer L3, most of the portion excluding the leads 72A to 72F is a second insulating layer 82. The second insulating layer 82 is composed of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the second insulating layer 82 is made of the same material as the first insulating layer 81, i.e., an insulator.

[0045] The second insulating layer 82 has a hole H3 extending along the third axis Z. When the second insulating layer 82 is viewed in the third positive direction Z1, the hole H3 appears to be quadrilateral. When the second insulating layer 82 is viewed in the third negative direction Z2, the hole H3 is located approximately at the center of the third layer L3. The interior space of the hole H3 is connected to the interior space of the hole H2.

[0046] The third magnetic part 56C is located inside the hole H3. The third magnetic part 56C fills the internal space of the hole H3. Therefore, the third magnetic part 56C is connected to the second magnetic part 56B. The material of the third magnetic part 56C is the same resin and magnetic material as the first magnetic part 56A.

[0047] The fourth layer L4 includes a second coil 62, six leads 73A-73F, a third insulating layer 83, and a fourth magnetic part 56D. When viewed in the third negative direction Z2, the fourth layer L4 has the same rectangular shape as the third layer L3. The thickness of the fourth layer L4 is the same as the thickness of the second layer L2.

[0048] The lead-out portion 73A is located at the corner of the fourth layer L4 on the side of the first positive direction X1 and the side of the second positive direction Y1. Therefore, the lead-out portion 73A is stacked on the surface of the lead-out portion 72A of the third layer L3 facing the third positive direction Z1.

[0049] The lead-out portion 73B is located at the corner of the fourth layer L4 on the side of the first negative direction X2 and the second positive direction Y1. Therefore, the lead-out portion 73B is stacked on the surface of the lead-out portion 72B of the third layer L3 facing the third positive direction Z1.

[0050] The lead-out portion 73C is located at the corner of the fourth layer L4 on the side of the first negative direction X2 and the side of the second negative direction Y2. Therefore, the lead-out portion 73C is stacked on the surface of the lead-out portion 72C of the third layer L3 facing the third positive direction Z1.

[0051] The lead-out portion 73D is located at the corner of the fourth layer L4 on the side of the first positive direction X1 and the side of the second negative direction Y2. Therefore, the lead-out portion 73D is stacked on the surface of the lead-out portion 72D of the third layer L3 facing the third positive direction Z1.

[0052] The lead-out portion 73E is located on the second positive direction Y1 side relative to the center of the fourth layer L4, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 73E of the fourth layer L4 is located at the same position as the lead-out portion 72E of the third layer L3. Therefore, the lead-out portion 73E is stacked on the surface of the lead-out portion 72E of the third layer L3 facing the third positive direction Z1.

[0053] Lead-out portion 73F is located on the second negative direction Y2 side relative to the center of the fourth layer L4, and is located at the center along the first axis X. Lead-out portions 73A to 73F are made of conductive materials such as copper and silver. In this embodiment, lead-out portions 73A to 73F are made of the same conductive material as the first coil 61.

[0054] When viewed from the third negative direction Z2, the fourth layer L4 extends in a spiral shape with the center of the fourth layer L4 as the center. The first end of the second coil 62 is connected to the lead-out portion 73D. The second end of the second coil 62 is connected to the lead-out portion 73F. When viewed from the third negative direction Z2, the second coil 62 is wound clockwise from the first end to the second end. Furthermore, when viewed from the first coil 61, the second coil 62 is located on the third positive direction Z1 side. The second coil 62 is made of a conductive material such as copper or silver. In this embodiment, the second coil 62 is made of the same conductive material as the first coil 61.

[0055] In the fourth layer L4, most of the portion excluding the second coil 62 and the leads 73A-73F is the third insulating layer 83. The third insulating layer 83 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the third insulating layer 83 is made of the same material as the first insulating layer 81, i.e., an insulator.

[0056] The third insulating layer 83 has a hole H4 extending along the third axis Z. When the third insulating layer 83 is viewed in the third positive direction Z1, the hole H4 appears to be quadrilateral. When the third insulating layer 83 is viewed in the third negative direction Z2, the hole H4 is located approximately at the center of the third layer L3. The interior space of the hole H4 is connected to the interior space of the hole H3. Furthermore, the hole H4 is located inside the second coil 62; that is, the second coil 62 surrounds the outside of the hole H4.

[0057] The fourth magnetic part 56D is located inside the hole H4. The fourth magnetic part 56D fills the internal space of the hole H4. The fourth magnetic part 56D is connected to the third magnetic part 56C. The fourth magnetic part 56D is made of the same resin and magnetic material as the first magnetic part 56A.

[0058] The fifth layer L5 has six leads 74A-74F, a fourth insulating layer 84, and a fifth magnetic part 56E. When viewed in the third negative direction Z2, the fifth layer L5 has the same rectangular shape as the fourth layer L4. The thickness of the fifth layer L5 is the same as the thickness of the third layer L3.

[0059] The lead-out portion 74A is located at the corner of the fifth layer L5 on the side of the first positive direction X1 and the side of the second positive direction Y1. Therefore, the lead-out portion 74A is stacked on the surface of the lead-out portion 73A of the fourth layer L4 facing the third positive direction Z1.

[0060] The lead-out portion 74B is located at the corner of the fifth layer L5 on the side of the first negative direction X2 and the second positive direction Y1. Therefore, the lead-out portion 74B is stacked on the surface of the lead-out portion 73B of the fourth layer L4 facing the third positive direction Z1.

[0061] The lead-out portion 74C is located at the corner of the fifth layer L5 on the side of the first negative direction X2 and the side of the second negative direction Y2. Therefore, the lead-out portion 74C is stacked on the surface of the lead-out portion 73C of the fourth layer L4 facing the third positive direction Z1.

[0062] The lead-out portion 74D is located at the corner of the fifth layer L5 on the side of the first positive direction X1 and the side of the second negative direction Y2. Therefore, the lead-out portion 74D is stacked on the surface of the lead-out portion 73D of the fourth layer L4 facing the third positive direction Z1.

[0063] The lead-out portion 74E is located on the second positive direction Y1 side relative to the center of the fifth layer L5, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 74E of the fifth layer L5 is located at the same position as the lead-out portion 73E of the fourth layer L4. Therefore, the lead-out portion 74E is stacked on the surface of the lead-out portion 73E of the fourth layer L4 facing the third positive direction Z1.

[0064] The lead-out portion 74F is located on the second negative direction Y2 side relative to the center of the fifth layer L5, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 74F of the fifth layer L5 is located at the same position as the lead-out portion 73F of the fourth layer L4. Therefore, the lead-out portion 74F is stacked on the surface of the lead-out portion 73F of the fourth layer L4 facing the third positive direction Z1. The lead-out portions 74A to 74F are made of conductive materials such as copper and silver. In this embodiment, the lead-out portions 74A to 74F are made of the same conductive material as the first coil 61.

[0065] In the fifth layer L5, most of the portion excluding the leads 74A to 74F is the fourth insulating layer 84. The fourth insulating layer 84 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the fourth insulating layer 84 is made of the same material as the first insulating layer 81, i.e., an insulator.

[0066] The fourth insulating layer 84 has a hole H5 extending along the third axis Z. When the fourth insulating layer 84 is viewed in the third positive direction Z1, the hole H5 appears to be quadrilateral. When the fourth insulating layer 84 is viewed in the third negative direction Z2, the hole H5 is located approximately at the center of the fifth layer L5. The interior space of the hole H5 is connected to the interior space of the hole H4.

[0067] The fifth magnetic part 56E is located inside the hole H5. The fifth magnetic part 56E fills the internal space of the hole H5. The fifth magnetic part 56E is connected to the fourth magnetic part 56D. The material of the fifth magnetic part 56E is the same resin and magnetic material as the first magnetic part 56A.

[0068] The sixth layer L6 includes a third coil 63, six leads 75A-75F, a fifth insulating layer 85, and a sixth magnetic part 56F. When viewed in the third negative direction Z2, the sixth layer L6 has the same rectangular shape as the fifth layer L5. The thickness of the sixth layer L6 is less than the thickness of the second layer L2. Specifically, the thickness of the sixth layer L6 is, for example, 7 μm or more and less than 9 μm.

[0069] The lead-out portion 75A is located at the corner of the sixth layer L6 on the side of the first positive direction X1 and the side of the second positive direction Y1. Therefore, the lead-out portion 75A is stacked on the surface of the lead-out portion 74A of the fifth layer L5 facing the third positive direction Z1.

[0070] The lead-out portion 75B is located at the corner of the sixth layer L6 on the side of the first negative direction X2 and the second positive direction Y1. Therefore, the lead-out portion 75B is stacked on the surface of the lead-out portion 74B of the fifth layer L5 facing the third positive direction Z1.

[0071] The lead-out portion 75C is located at the corner of the sixth layer L6 on the side of the first negative direction X2 and the side of the second negative direction Y2. Therefore, the lead-out portion 75C is stacked on the surface of the lead-out portion 74C of the fifth layer L5 facing the third positive direction Z1.

[0072] The lead-out portion 75D is located at the corner of the sixth layer L6 on the side of the first positive direction X1 and the side of the second negative direction Y2. Therefore, the lead-out portion 75D is stacked on the surface of the lead-out portion 74D of the fifth layer L5 facing the third positive direction Z1.

[0073] The lead-out portion 75E is located on the second positive direction Y1 side relative to the center of the sixth layer L6, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 75E of the sixth layer L6 is located at the same position as the lead-out portion 74E of the fifth layer L5. Therefore, the lead-out portion 75E is stacked on the surface of the lead-out portion 74E of the fifth layer L5 facing the third positive direction Z1.

[0074] The lead-out portion 75F is located on the second negative direction Y2 side relative to the center of the sixth layer L6, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 75F of the sixth layer L6 is located at the same position as the lead-out portion 74F of the fifth layer L5. Therefore, the lead-out portion 75F is stacked on the surface of the lead-out portion 74F of the fifth layer L5 facing the third positive direction Z1. The lead-out portions 75A to 75F are made of conductive materials such as copper and silver. In this embodiment, the lead-out portions 75A to 75F are made of the same conductive material as the first coil 61.

[0075] When viewed in the third negative direction Z2, the sixth layer L6 extends in a spiral shape around the center of the sixth layer L6. The first end of the third coil 63 is connected to the lead-out portion 75E. The second end of the third coil 63 is connected to the lead-out portion 75B. When viewed in the third negative direction Z2, the third coil 63 is wound clockwise from the first end to the second end. The third coil 63 is made of a conductive material such as copper or silver. In this embodiment, the third coil 63 is made of the same conductive material as the first coil 61.

[0076] In the sixth layer L6, most of the portion excluding the third coil 63 and leads 75A-75F is the fifth insulating layer 85. The fifth insulating layer 85 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the fifth insulating layer 85 is made of the same material as the first insulating layer 81, i.e., an insulator.

[0077] The fifth insulating layer 85 has a hole H6 extending along the third axis Z. When the fifth insulating layer 85 is viewed in the third positive direction Z1, the hole H6 appears to be quadrilateral. When the fifth insulating layer 85 is viewed in the third negative direction Z2, the hole H6 is located approximately at the center of the sixth layer L6. The interior space of the hole H6 is connected to the interior space of the hole H5. Furthermore, the hole H6 is located inside the third coil 63; that is, the third coil 63 surrounds the outside of the hole H6.

[0078] The sixth magnetic part 56F is located inside the hole H6. The sixth magnetic part 56F fills the internal space of the hole H6. The sixth magnetic part 56F is connected to the fifth magnetic part 56E. The material of the sixth magnetic part 56F is the same resin and magnetic material as the first magnetic part 56A.

[0079] The seventh layer L7 has six leads 76A to 76F, a sixth insulating layer 86, and a seventh magnetic part 56G. When viewed in the third negative direction Z2, the seventh layer L7 has the same rectangular shape as the sixth layer L6. The thickness of the seventh layer L7 is the same as the thickness of the third layer L3.

[0080] The lead-out portion 76A is located at the corner of the seventh layer L7 on the side of the first positive direction X1 and the side of the second positive direction Y1. Therefore, the lead-out portion 76A is stacked on the surface of the lead-out portion 75A of the sixth layer L6 facing the third positive direction Z1.

[0081] The lead-out portion 76B is located at the corner of the seventh layer L7 on the side of the first negative direction X2 and the second positive direction Y1. Therefore, the lead-out portion 76B is stacked on the surface of the lead-out portion 75B of the sixth layer L6 facing the third positive direction Z1.

[0082] The lead-out portion 76C is located at the corner of the seventh layer L7 on the side of the first negative direction X2 and the side of the second negative direction Y2. Therefore, the lead-out portion 76C is stacked on the surface of the lead-out portion 75C of the sixth layer L6 facing the third positive direction Z1.

[0083] The lead-out portion 76D is located at the corner of the seventh layer L7 on the side of the first positive direction X1 and the side of the second negative direction Y2. Therefore, the lead-out portion 76D is stacked on the surface of the lead-out portion 75D of the sixth layer L6 facing the third positive direction Z1.

[0084] The lead-out portion 76E is located on the second positive direction Y1 side relative to the center of the seventh layer L7, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 76E of the seventh layer L7 is located at the same position as the lead-out portion 75E of the sixth layer L6. Therefore, the lead-out portion 76E is stacked on the surface of the lead-out portion 75E of the sixth layer L6 facing the third positive direction Z1.

[0085] Lead-out portion 76F is located on the second negative direction Y2 side relative to the center of the seventh layer L7, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 76F of the seventh layer L7 is located at the same position as the lead-out portion 75F of the sixth layer L6. Therefore, lead-out portion 76F is stacked on the surface of the lead-out portion 75F of the sixth layer L6 facing the third positive direction Z1. Lead-out portions 76A to 76F are made of conductive materials such as copper and silver. In this embodiment, lead-out portions 76A to 76F are made of the same conductive material as the first coil 61.

[0086] In the seventh layer L7, most of the portion excluding the leads 76A to 76F is the sixth insulating layer 86. The sixth insulating layer 86 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the sixth insulating layer 86 is made of the same material as the first insulating layer 81, i.e., an insulator.

[0087] The sixth insulating layer 86 has a hole H7 extending along the third axis Z. When the sixth insulating layer 86 is viewed in the third positive direction Z1, the hole H7 appears to be quadrilateral. When the sixth insulating layer 86 is viewed in the third negative direction Z2, the hole H7 is located approximately at the center of the seventh layer L7. The interior space of the hole H7 is connected to the interior space of the hole H6.

[0088] The seventh magnetic part 56G is located inside the hole H7. The seventh magnetic part 56G fills the internal space of the hole H7. The seventh magnetic part 56G is connected to the sixth magnetic part 56F. The seventh magnetic part 56G is made of the same resin and magnetic material as the first magnetic part 56A.

[0089] The eighth layer L8 includes a fourth coil 64, six leads 77A-77F, a seventh insulating layer 87, and an eighth magnetic section 56H. When viewed in the third negative direction Z2, the eighth layer L8 has the same rectangular shape as the seventh layer L7. The thickness of the eighth layer L8 is the same as the thickness of the sixth layer L6.

[0090] The lead-out portion 77A is located at the corner of the eighth layer L8 on the side of the first positive direction X1 and the side of the second positive direction Y1. Therefore, the lead-out portion 77A is stacked on the side of the lead-out portion 76A of the seventh layer L7 facing the third positive direction Z1.

[0091] The lead-out portion 77B is located at the corner of the eighth layer L8 on the side of the first negative direction X2 and the second positive direction Y1. Therefore, the lead-out portion 77B is stacked on the surface of the lead-out portion 76B of the seventh layer L7 facing the third positive direction Z1.

[0092] The lead-out portion 77C is located at the corner of the eighth layer L8 on the side of the first negative direction X2 and the side of the second negative direction Y2. Therefore, the lead-out portion 77C is stacked on the surface of the lead-out portion 76C of the seventh layer L7 facing the third positive direction Z1.

[0093] The lead-out portion 77D is located at the corner of the eighth layer L8 on the side of the first positive direction X1 and the side of the second negative direction Y2. Therefore, the lead-out portion 77D is stacked on the surface of the lead-out portion 76D of the seventh layer L7 facing the third positive direction Z1.

[0094] The lead-out portion 77E is located on the second positive direction Y1 side relative to the center of the eighth layer L8, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 77E of the eighth layer L8 is located at the same position as the lead-out portion 76E of the seventh layer L7. Therefore, the lead-out portion 77E is stacked on the surface of the lead-out portion 76E of the seventh layer L7 facing the third positive direction Z1.

[0095] Lead-out portion 77F is located on the second negative direction Y2 side relative to the center of the eighth layer L8, and is located at the center along the first axis X. That is, when the stacked coil component 10 is viewed towards the third negative direction Z2, the lead-out portion 77F of the eighth layer L8 is located at the same position as the lead-out portion 76F of the seventh layer L7. Therefore, lead-out portion 77F is stacked on the surface of the lead-out portion 76F of the seventh layer L7 facing the third positive direction Z1. Lead-out portions 77A to 77F are made of conductive materials such as copper and silver. In this embodiment, lead-out portions 77A to 77F are made of the same conductive material as the first coil 61.

[0096] When viewed from the third negative direction Z2, the eighth layer L8 extends in a spiral shape around the center of the eighth layer L8. The first end of the fourth coil 64 is connected to the lead-out portion 77F. The second end of the fourth coil 64 is connected to the lead-out portion 77C. When viewed from the third negative direction Z2, the fourth coil 64 is wound clockwise from the first end to the second end. Furthermore, when viewed from the third coil 63, the fourth coil 64 is located on the third positive direction Z1 side. The fourth coil 64 is made of a conductive material such as copper or silver. In this embodiment, the fourth coil 64 is made of the same conductive material as the first coil 61.

[0097] In the eighth layer L8, most of the portion excluding the fourth coil 64 and leads 77A-77F is the seventh insulating layer 87. The seventh insulating layer 87 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the seventh insulating layer 87 is made of the same material as the first insulating layer 81, i.e., an insulator.

[0098] The seventh insulating layer 87 has a hole H8 extending along the third axis Z. When the seventh insulating layer 87 is viewed in the third positive direction Z1, the hole H8 appears to be quadrilateral. When the seventh insulating layer 87 is viewed in the third negative direction Z2, the hole H8 is located approximately at the center of the eighth layer L8. The interior space of the hole H8 is connected to the interior space of the hole H7. Furthermore, the hole H8 is located inside the fourth coil 64; that is, the fourth coil 64 surrounds the outside of the hole H8.

[0099] The eighth magnetic part 56H is located inside the hole H8. The eighth magnetic part 56H fills the internal space of the hole H8. The eighth magnetic part 56H is connected to the seventh magnetic part 56G. The material of the eighth magnetic part 56H is the same resin and magnetic material as the first magnetic part 56A.

[0100] The ninth layer L9 includes an eighth insulating layer 88 and a ninth magnetic part 56I. When viewed in the third negative direction Z2, the ninth layer L9 has the same rectangular shape as the eighth layer L8. The thickness of the ninth layer L9 is the same as the thickness of the third layer L3.

[0101] The eighth insulating layer 88 is composed of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the eighth insulating layer 88 is composed of the same material as the first insulating layer 81, i.e., an insulator.

[0102] The eighth insulating layer 88 has a hole H9 extending along the third axis Z. When the eighth insulating layer 88 is viewed in the third positive direction Z1, the hole H9 appears to be quadrilateral. When the eighth insulating layer 88 is viewed in the third negative direction Z2, the hole H9 is located approximately at the center of the ninth layer L9. The interior space of the hole H9 is connected to the interior space of the hole H8.

[0103] The ninth magnetic part 56I is located inside the hole H9. The ninth magnetic part 56I fills the internal space of the hole H9. The ninth magnetic part 56I is connected to the eighth magnetic part 56H. The material of the ninth magnetic part 56I is the same resin and magnetic material as the first magnetic part 56A.

[0104] The tenth layer L10 has a first adhesive portion 52A and a tenth magnetic portion 56J. When viewed in the third negative direction Z2, the tenth layer L10 has the same rectangular shape as the ninth layer L9.

[0105] The first adhesive portion 52A is made of an organic adhesive such as polyimide resin. In this embodiment, the first adhesive portion 52A is made of the same material as the lower adhesive resin layer 51.

[0106] The first adhesive portion 52A has a hole H10 extending along the direction of the third axis Z. The shape and size of the hole H10 will be described later. The internal space of the hole H10 is connected to the internal space of the hole H9.

[0107] The tenth magnetic part 56J is located inside the hole H10. The tenth magnetic part 56J fills the internal space of the hole H10. The tenth magnetic part 56J is connected to the ninth magnetic part 56I. The tenth magnetic part 56J is made of the same resin and magnetic material as the first magnetic part 56A.

[0108] The eleventh layer L11 is composed of the second adhesive portion 52B. When viewed in the third negative direction Z2, the eleventh layer L11 has the same rectangular shape as the tenth layer L10. The second adhesive portion 52B is composed of an organic adhesive such as polyimide resin. The second adhesive portion 52B is integral with the first adhesive portion 52A.

[0109] By layering the second layer L2 to the ninth layer L9 described above, a laminate 30 consisting of the first insulating layer 81 to the eighth insulating layer 88 is formed. Furthermore, the first adhesive portion 52A of the tenth layer L10 and the second adhesive portion 52B of the eleventh layer L11 constitute the upper adhesive resin layer 52. Additionally, the first magnetic portion 56A to the tenth magnetic portion 56J constitute the magnetic resin 56.

[0110] Furthermore, the first coil 61 to the fourth coil 64 extend inside the laminate 30. The first coil 61 and the third coil 63 are electrically connected through leads 71E to 75E. The spiral-shaped first coil 61 and the spiral-shaped third coil 63 are arranged sequentially in the third positive direction Z1, thereby extending the first coil 61 and the third coil 63 in a spiral shape as a whole. In addition, the first coil 61 and the third coil 63 are exposed outside the laminate 30 and the lower adhesive resin layer 51 through leads 71A and leads 71B to 75B.

[0111] Furthermore, the second coil 62 and the fourth coil 64 are electrically connected via leads 73F to 77F. The spiral-shaped second coil 62 and the spiral-shaped fourth coil 64 are arranged sequentially in the third positive direction Z1, thus extending in a spiral shape overall. Additionally, the second coil 62 and the fourth coil 64 are exposed outside the laminate 30 and the lower adhesive resin layer 51 via leads 71D to 73D and leads 71C to 77C. Therefore, the second coil 62 and the fourth coil 64, together with the first coil 61 and the third coil 63, constitute a common-mode choke coil.

[0112] The upper magnetic substrate 40 is rectangular parallelepiped. The upper magnetic substrate 40 is composed of a magnetic material, such as a sintered ferrite ceramic. In this embodiment, the upper magnetic substrate 40 is composed of the same magnetic material as the lower magnetic substrate 20. The upper magnetic substrate 40 is laminated on the upper surface 30A of the upper adhesive resin layer 52, which faces the third positive direction Z1. Therefore, the upper magnetic substrate 40 is bonded to the upper surface 30A of the laminate 30 via the upper adhesive resin layer 52.

[0113] like Figure 2 and Figure 3 As shown, the stacked coil component 10 has four connectors 91A to 91D and four external electrodes 92A to 92D.

[0114] Connector 91A is located on the inner surface of cut 21A. Connector 91A exists throughout the entire inner surface of cut 21A. Connector 91B is located on the inner surface of cut 21B. Connector 91B exists throughout the entire inner surface of cut 21B. Connector 91C is located on the inner surface of cut 21C. Connector 91C exists throughout the entire inner surface of cut 21C. Connector 91D is located on the inner surface of cut 21D. Connector 91D exists throughout the entire inner surface of cut 21D. These connectors 91A to 91D are made of a conductor with copper as the main component.

[0115] Since connector 91A covers the entire inner surface of cut 21A, the lead-out portion 71A exposed outside the laminate 30 and the lower adhesive resin layer 51 is connected to connector 91A. Similarly, since connector 91B covers the entire inner surface of cut 21B, the lead-out portion 71B exposed outside the laminate 30 and the lower adhesive resin layer 51 is connected to connector 91B. Since connector 91C covers the entire inner surface of cut 21C, the lead-out portion 71C exposed outside the laminate 30 and the lower adhesive resin layer 51 is connected to connector 91C. Since connector 91D covers the entire inner surface of cut 21D, the lead-out portion 71D exposed outside the laminate 30 and the lower adhesive resin layer 51 is connected to connector 91D.

[0116] External electrode 92A is located on the second main surface MF2 and is connected to connector 91A. External electrode 92B is located on the second main surface MF2 and is connected to connector 91B. External electrode 92C is located on the second main surface MF2 and is connected to connector 91C. External electrode 92D is located on the second main surface MF2 and is connected to connector 91D. External electrodes 92A to 92D are not connected to each other.

[0117] Thus, external electrode 92A is connected to the first coil 61 via connector 91A and lead-out portion 71A. External electrode 92B is connected to the first coil 61 via connector 91B and lead-out portion 71B. External electrode 92C is connected to the second coil 62 via connector 91C and lead-out portion 71C. External electrode 92D is connected to the second coil 62 via connector 91D and lead-out portion 71D.

[0118] The external electrodes 92A to 92D are made of a conductor with copper as the main component. In this embodiment, the external electrodes 92A to 92D are made of the same conductor material as the connectors 91A to 91D.

[0119] The dimension of the stacked coil component 10 configured in this way along the first axis X is 0.35 mm or less. In addition, the dimension of the stacked coil component 10 along the second axis Y is 0.50 mm or less.

[0120] (Regarding the through hole and containment space)

[0121] like Figure 5 As shown, the laminate 30 has a through hole TH. The through hole TH penetrates the laminate 30 along the third axis Z. The through hole TH is formed by the holes H2 to H9 mentioned above. The through hole TH is truncated pyramidal in shape, such that the cross-sectional area decreases as it moves towards the third negative direction Z2. That is, holes H2 to H9 are all quadrilateral in shape when viewed from above, but the opening area gradually decreases as one moves from hole H9 toward hole H2.

[0122] The first coil 61 to the fourth coil 64 surround the outer sides of the holes H2 to H8, which exist in the same layer. Therefore, the first coil 61 to the fourth coil 64 extend in a spiral shape to surround the outer side of the through hole TH.

[0123] The upper adhesive resin layer 52 has a receiving space CS. The receiving space CS is the internal space of the aforementioned hole H10. The receiving space CS is connected to the internal space of the hole H9. That is, the receiving space CS is connected to the through hole TH.

[0124] Furthermore, when observing the stacked coil component 10 in the third positive direction Z1, the outer edge of the housing space CS is located further outward than the outer edge of the through hole TH. That is, the hole H10 of the tenth layer L10 is a quadrilateral shape with a larger area than the hole H9 of the ninth layer L9. In addition, the opening edge of the hole H10 is separated from the opening edge of the hole H9 over the entire area. As a result, the housing space CS extends in a direction perpendicular to the third axis Z than the through hole TH. In addition, when we say that we are observing the stacked coil component 10, we mean observing the outer edge of the housing space CS and the outer edge of the through hole TH through the stacked coil component 10, rather than actually visually recognizing them.

[0125] Furthermore, when viewing the stacked coil component 10 in the third positive direction Z1, a portion of the housing space CS overlaps with the first coil 61 to the fourth coil 64. Specifically, the innermost turn extends from the inner end of the first coil 61 to the portion that has been wound 360 degrees. The inner end of the first coil 61 refers to the portion of the first coil 61 that connects to the lead-out portion 71E. Moreover, when viewing the stacked coil component 10 in the third positive direction Z1, the housing space CS only overlaps with this innermost turn. That is, when viewing the stacked coil component 10 in the third positive direction Z1, the housing space CS does not extend beyond the portion that has been wound more than 360 degrees from the inner end of the first coil 61.

[0126] As described above, the eleventh layer L11 is entirely comprised of the second adhesive portion 52B. Furthermore, the second adhesive portion 52B does not have any holes. Therefore, the receiving space CS opens on the through-hole TH side but does not open on the upper magnetic substrate 40 side. Thus, an upper adhesive resin layer 52 exists between the receiving space CS and the upper magnetic substrate 40. Moreover, the opening of the receiving space CS simply means that it is not blocked by the upper adhesive resin layer 52. That is, if the receiving space CS has an opening when the upper adhesive resin layer 52 is viewed alone, it is also referred to as an opening of the receiving space CS even if the entire area of ​​the opening of the receiving space CS is occupied by other components.

[0127] Furthermore, the magnetic resin 56 fills the through-hole TH and the receiving space CS. That is, the magnetic resin 56 fills the through-hole TH and the receiving space CS. In addition, the receiving space CS in the stacked coil component 10 does not necessarily need to be a gap, void, or vacuum. Therefore, the receiving space CS can also be filled by other components. Specifically, the receiving space CS also includes the case where it is completely filled with magnetic resin 56 as in this embodiment and does not exist as a gap or vacuum. Furthermore, the magnetic resin 56 fills not only the through-hole TH and the receiving space CS, but also the internal space of the hole H1. Therefore, the magnetic resin 56 is in contact with the lower magnetic substrate 20. Furthermore, in Figure 3 and Figure 5 The diagram shows that the magnetic resin 56 fills the entire containment space CS, but sometimes the magnetic resin 56 does not cover a part of the containment space CS, and gaps are created in a part of the containment space CS.

[0128] Furthermore, the opening area of ​​the through-hole TH on the upper surface 30A is 8% to 11% of the area obtained by adding the opening areas of the upper surface 30A and the through-hole TH. That is, when the laminated coil component 10 is viewed towards the third negative direction Z2, the opening area of ​​the through-hole TH is 8% to 11% of the area of ​​the outer shape of the laminate 30 on the upper surface 30A.

[0129] (Regarding methods for forming magnetic resins)

[0130] The process of forming magnetic resin 56 in the manufacturing method of the above-mentioned stacked coil component 10 will be described.

[0131] First, a laminate 30 without through-hole TH is prepared. Specifically, an insulating resin and a conductive resin are laminated on the first main surface MF1 of the lower magnetic substrate 20 to obtain the desired circuit pattern using photolithography, thereby preparing a lower adhesive resin layer 51 without hole H1 and a laminate 30 without through-hole TH.

[0132] Next, a first adhesive portion 52A is formed on the surface of the laminate 30 facing the third positive direction Z1. For example, the hole H10 is made to open within the area of ​​the receiving space CS by photolithography.

[0133] Next, the through hole TH is opened in the laminate 30. For example, the through hole TH is formed by laser irradiation or shot peening. At this time, the hole H1 is opened in the lower adhesive resin layer 51. However, when the through hole TH is formed by laser irradiation or shot peening, it is difficult to form the inner peripheral surface of the through hole TH parallel to the third axis Z. Therefore, the opening of the through hole TH decreases as it faces the third negative direction Z2.

[0134] Then, magnetic resin 56 is filled into the through-hole TH. First, magnetic resin 56 is filled to overflow from the through-hole TH into the receiving space CS. Next, a second adhesive portion 52B is formed on the surface of the upper magnetic substrate 40 facing the third negative direction Z2. Next, the laminate 30 and the upper magnetic substrate 40 are stacked so that the first adhesive portion 52A and the second adhesive portion 52B are bonded together. As a result, magnetic resin 56 is held in a state containing more than the amount filling the through-hole TH, so magnetic resin 56 can easily fill the interior of the through-hole TH. Therefore, voids are less likely to form inside the through-hole TH. In addition, the magnetic resin 56 overflowing from the through-hole TH is received in the receiving space CS.

[0135] (Regarding the effects of the implementation method)

[0136] According to the above implementation method, the following effects are achieved.

[0137] (1) According to the above embodiment, the upper adhesive resin layer 52 has a receiving space CS. During the manufacturing process of the laminated coil component 10, the receiving space CS of the upper adhesive resin layer 52 can function as a space for the magnetic resin 56 to escape. That is, the maximum amount of magnetic resin 56 can be set to the sum of the volume of the through hole TH and the volume of the receiving space CS. Therefore, even if the amount of magnetic resin 56 deviates due to manufacturing errors, it is not easy for the amount of magnetic resin 56 to be less than the volume of the through hole TH. As a result, the possibility of magnetic resin 56 being distributed throughout the entire through hole TH is increased.

[0138] Furthermore, the magnetic resin 56 that overflows from the through-hole TH during filling is contained in the receiving space CS. Therefore, the overflowing magnetic resin 56 exists within the upper adhesive resin layer 52 in the direction along the third axis Z. If this is the location, the possibility of adverse effects on the characteristics of the laminated coil component 10, even if magnetic resin 56 is present, is low.

[0139] (2) According to the above embodiment, when the stacked coil component 10 is viewed in the third positive direction Z1, a portion of the housing space CS overlaps with the first coil 61 to the fourth coil 64. That is, the housing space CS extends to the portion overlapping with the first coil 61 to the fourth coil 64 where there is no through hole TH. Therefore, a sufficient volume can be ensured as the volume of the housing space CS. Therefore, when filling with magnetic resin 56, the amount of magnetic resin 56 filled can be set to an amount that is substantially greater than the volume of the through hole TH. Therefore, the possibility of the magnetic resin 56 being distributed throughout the entire through hole TH is further increased.

[0140] (3) According to the above embodiment, when the stacked coil component 10 is viewed in the third positive direction Z1, the receiving space CS only overlaps with the innermost turn. Therefore, the receiving space CS will not expand excessively. In other words, the area of ​​the first adhesive portion 52A in the upper adhesive resin layer 52 will not become too small. Therefore, the adhesion between the laminate 30 based on the upper adhesive resin layer 52 and the upper magnetic substrate 40 can be sufficiently ensured.

[0141] (4) According to the above embodiment, the receiving space CS is open on the through hole TH side and not open on the upper magnetic substrate 40 side. Therefore, an upper adhesive resin layer 52 is also present between the magnetic resin 56 filling the receiving space CS and the upper magnetic substrate 40, thereby enabling the laminate 30 to be firmly bonded by the upper magnetic substrate 40 and preventing the presence of the through hole TH from reducing the adhesive on the laminate 30.

[0142] (5) According to the above embodiment, the magnetic resin 56 is in contact with the lower magnetic substrate 20. Therefore, the magnetic resin 56 fills the opening on the third negative direction Z2 side of the through hole TH. Therefore, the magnetic flux density from the magnetic resin 56 to the lower magnetic substrate 20 can be increased. As a result, the inductance value obtained from the laminated coil component 10 is further improved.

[0143] (6) According to the above embodiment, the opening area of ​​the through-hole TH on the upper surface 30A is 8% to 11% of the area obtained by adding the upper surface 30A and the opening area. Therefore, it is possible to prevent the magnetic resin 56 filling the through-hole TH from becoming too large. Therefore, it is possible to sufficiently ensure the area where the first coil 61 to the fourth coil 64 extend. In addition, as a result of ensuring that the opening area of ​​the through-hole TH is 8% or more, there is a sufficient amount of magnetic resin 56 to increase the inductance value. Compared with the case where there is no magnetic resin 56, the inductance value obtained from the stacked coil component 10 is significantly improved.

[0144] <Other Implementation Methods>

[0145] The above-described embodiments can be modified as follows. The above-described embodiments and the following modifications can be combined and implemented within a technically compatible framework.

[0146] The size of the laminated coil component 10 is not limited to the examples of the above embodiments. The dimension of the laminated coil component 10 along the first axis X can also exceed 0.35 mm. The dimension of the laminated coil component 10 along the second axis Y can also exceed 0.50 mm.

[0147] • When viewing the lower magnetic substrate 20 in the third positive direction Z1, the lower magnetic substrate 20 can also be square in shape. That is, the maximum dimension of the lower magnetic substrate 20 along the first axis X can also be equal to the maximum dimension of the lower magnetic substrate 20 along the second axis Y. In addition, the shapes of the laminate 30 and the upper magnetic substrate 40 can be changed simply according to the shape of the lower magnetic substrate 20.

[0148] • The structure of the laminate 30 can be appropriately modified. For example, the extension method of each coil, the number of coils, the position of each lead, and the shape of each lead can be appropriately modified according to the characteristics required for the laminated coil component 10. As long as the laminate 30 has at least a plurality of insulating layers and through holes TH penetrating the plurality of insulating layers, the technology related to the aforementioned housing space CS can be applied. In addition, the thickness of each layer can be all the same or different from each other.

[0149] • The lower magnetic substrate 20 may be omitted, or it may not be a sintered body but a resin containing magnetic powder. The upper magnetic substrate 40 may also not be a sintered body but a resin containing magnetic powder.

[0150] • The lower adhesive resin layer 51 may also be omitted. In this case, the lower magnetic substrate 20 and the laminate 30 can also be connected by pressing or the like. Furthermore, if the lower adhesive resin layer 51 is omitted, the magnetic resin 56 is in contact with the lower magnetic substrate 20.

[0151] • The lower adhesive resin layer 51 may also not have a hole H1. In this case, the magnetic resin 56 does not contact the lower magnetic substrate 20.

[0152] • As long as the outer edge of the housing space CS is located outside the outer edge of the through hole TH, the size of the housing space CS when viewing the stacked coil component 110 in the third positive direction Z1 can be appropriately changed. For example, in Figure 6 In the modified example of the stacked coil component 110 shown, when the stacked coil component 110 is viewed in the third positive direction Z1, the receiving space CS does not overlap with the first coil 61 to the fourth coil 64. Thus, as long as the receiving space CS can accommodate an amount of magnetic resin 156 greater than the amount filling the through hole TH, it may not extend to the first coil 61 to the fourth coil 64 when the stacked coil component 110 is viewed in the third positive direction Z1.

[0153] Additionally, for example, in Figure 7 In the modified example of the stacked coil component 210 shown, when the stacked coil component 110 is viewed in the third positive direction Z1, a portion of the receiving space CS overlaps with the portion extending from the inner end of the first coil 61 to the point where it is wound 1080 degrees. In other words, the receiving space CS overlaps within a range extending from the inner end of the first coil 61 to approximately half the length of the first coil 61. Therefore, it is easy to ensure space for more magnetic resin 256 to leak. Moreover, it is not limited to... Figure 7 In the modified example shown, when viewing the stacked coil component 110 in the third positive direction Z1, a portion of the receiving space CS may overlap with more than half of the winding range of the first coil 61, or it may overlap with the entire first coil 61. Thus, the extent to which the receiving space CS overlaps with the first coil 61 is not limited to the example of the above embodiment.

[0154] • The second adhesive part 52B can also be omitted. In this case, such as Figure 8As shown in the modified example of the stacked coil component 310, the upper adhesive resin layer 52 is composed only of the first adhesive portion 52A. Furthermore, since the hole H10 passes through the upper adhesive resin layer 52, i.e., the first adhesive portion 52A, the hole H10 is open on both the through-hole TH side and the upper magnetic substrate 40 side. Thus, when the housing space CS passes through the upper adhesive resin layer 52 in the direction along the third axis Z, the magnetic resin 356 can contact the upper magnetic substrate 40. Therefore, the magnetic resin 356 penetrates the stacked body 30 and the upper adhesive resin layer 52 to reach the upper magnetic substrate 40. Therefore, when current flows through the first coil 61 to the fourth coil 64, the magnetic flux density from the magnetic resin 356 to the upper magnetic substrate 40 increases. Therefore, the inductance value obtained from the stacked coil component 10 can be increased.

[0155] The shape of the through hole TH is not limited to the examples of the above embodiments. For example, the through hole TH can also be cylindrical, polygonal, or other columnar shapes.

[0156] • The opening area of ​​the through hole TH on the upper surface 30A can be less than 8% or more than 11% relative to the area obtained by adding the upper surface 30A and the opening area of ​​the laminate 30.

[0157] • The structure of the first coil 61 to the fourth coil 64 can be modified appropriately. For example, the second coil 62 to the fourth coil 64 can also be omitted. In this case, the first coil 61 only needs to extend while surrounding the outside of the through hole TH. In addition, in order to surround the outside of the through hole TH, the coil needs to be wound more than 360 degrees throughout the same layer or different layers.

[0158] The method for forming the magnetic resin 56 is not limited to the method described in the above embodiments. For example, the magnetic resin 56 may be formed as follows: First, a through-hole TH is formed on the laminate 30 by laser irradiation and shot peening. Next, magnetic resin 56 exceeding the volume of the through-hole TH is filled into the through-hole TH, causing the magnetic resin 56 to overflow from the through-hole TH. As a result, the magnetic resin 56 expands the opening area of ​​the through-hole TH on the surface of the laminate 30 facing the third positive direction Z1 by more than one portion. Then, adhesive resin may be applied only to the surface of the laminate 30 facing the third positive direction Z1. In this case, if adhesive resin is not applied to the magnetic resin 56, the second adhesive portion 52B can be omitted. Alternatively, if adhesive resin is applied to the surface of the magnetic resin 56 facing the third positive direction Z1, the second adhesive portion 52B can be formed. Furthermore, with this method, it is not necessary to process the upper adhesive resin layer 52, and therefore the photosensitivity function of the insulating layer used in the laminate 30 is not required, thus a resin without photosensitivity function can be used.

[0159] • In the above embodiment, the stacking direction is the third positive direction Z1, but the stacking direction can also be the third negative direction Z2.

Claims

1. A stacked coil component, wherein, have: A laminate having a plurality of insulating layers stacked along a stacking direction and through holes penetrating the plurality of insulating layers along the stacking direction; The coil extends inside the laminate in such a way that it surrounds the outside of the through hole; A magnetic resin, comprising resin and magnetic material, is filled into the through hole; An adhesive resin layer is laminated on the outer surface of the laminate, facing the lamination direction. as well as The magnetic substrate is bonded to the laminate via the adhesive resin layer. The adhesive resin layer has a receiving space connected to the through hole. When viewed in the stacking direction, the outer edge of the receiving space is located further outward than the outer edge of the through hole. A portion of the magnetic resin is located within the containment space.

2. The laminated coil component according to claim 1, wherein, When viewed in the stacking direction, a portion of the containment space overlaps with the coil.

3. The laminated coil component according to claim 2, wherein, When the innermost turn of the coil is defined as the portion extending from the inner end of the coil to the point where it has been wound 360 degrees, When viewed in the stacking direction, the containment space overlaps only with the innermost turn.

4. The laminated coil component according to any one of claims 1 to 3, wherein, The receiving space is open on the through hole side but not on the magnetic substrate side.

5. The laminated coil component according to any one of claims 1 to 3, wherein, The receiving space extends through the adhesive resin layer in the stacking direction.

6. The laminated coil component according to any one of claims 1 to 3, wherein, When the magnetic substrate is used as the upper magnetic substrate. The stacked coil component also has a lower magnetic substrate located on the side opposite to the stacking direction relative to the stacked body. The magnetic resin is in contact with the lower magnetic substrate.

7. The laminated coil component according to any one of claims 1 to 3, wherein, When the surface of the outer surface of the laminate facing the lamination direction is taken as the upper surface, the opening area of ​​the through hole in the upper surface is more than 8% and less than 11% of the area obtained by adding the upper surface area and the opening area.

Images