A state detection device and method

Abstract

The application discloses a state detection device and method. The device comprises a fixed component, a movable component, a first conductive layer, a second conductive layer, a capacitor detection device and a processor. The fixed component comprises a connecting portion, and the movable component is connected to the connecting portion of the fixed component. The first conductive layer is arranged in the interior or on the surface of the fixed component, and the second conductive layer is arranged in the interior or on the surface of the movable component. When the fixed component is stationary and the movable component is movable, the capacitance value between the first conductive layer and the second conductive layer changes. The capacitor detection device can detect the capacitance value between the first conductive layer and the second conductive layer and send the capacitance value to the processor. The processor can determine the moving state of the movable component according to the obtained capacitance value. Thus, during the movement of the movable component, the changing capacitance value between the first conductive layer and the second conductive layer can be used to obtain various moving states of the movable component.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of detection, in particular to a state detection device and method. BACKGROUND

[0002] Generally, some devices include fixed parts and movable parts, when the fixed parts are not moved and the movable parts are moved, some control operations of the devices can be implemented according to the moving state of the movable parts. For example, the device is a flip phone, the fixed part is the body of the flip phone, and the movable part is the flip cover of the flip phone. The screen of the flip phone can be controlled to display according to the flipping state of the flip cover. Therefore, the accurate detection of the moving state of the movable part in the device is very important.

[0003] At present, the moving state of the movable part in the device can be detected by a mechanical switch plus a limiting device or a Hall switch plus a permanent magnet. However, the above two ways have limitations in detecting the moving state of the movable part. SUMMARY

[0004] In order to solve the above technical problems, the present application provides a state detection device and method, which can realize accurate detection of various states of the movable part.

[0005] In order to achieve the above purpose, the technical scheme provided by the present application is as follows:

[0006] The present application provides a state detection device, which comprises a fixed part, a movable part, a first conductive layer, a second conductive layer, a capacitor detection component and a processor; the fixed part comprises a connecting part, and the movable part is connected to the connecting part of the fixed part;

[0007] The first conductive layer is placed in the interior or on the surface of the fixed part; the second conductive layer is placed in the interior or on the surface of the movable part; when the fixed part is not moved and the movable part is moved, the capacitance value between the first conductive layer and the second conductive layer changes;

[0008] The capacitor detection component is used for detecting the capacitance value between the first conductive layer and the second conductive layer, and sending the capacitance value to the processor;

[0009] The processor is used for determining the moving state of the movable part according to the capacitance value.

[0010] Optionally, when the fixed part is not moved and the movable part rotates around the central axis of the fixed part, the moving state of the movable part includes the rotating direction and the rotating angle of the movable part;

[0011] The central axis of the fixed part and the central axis of the connecting part are perpendicular to each other.

[0012] Optionally, the processor is specifically configured to determine the rotation direction of the movable component according to the change direction of the capacitance value and a first corresponding relationship, and determine the rotation angle of the movable component according to the size of the capacitance value and a second corresponding relationship.

[0013] The first corresponding relationship is a corresponding relationship between the change direction of the capacitance value and the rotation direction of the movable component, and the second corresponding relationship is a corresponding relationship between the size of the capacitance value and the rotation angle of the movable component; the first corresponding relationship and the second corresponding relationship are obtained through calibration.

[0014] Optionally, when the fixed component is stationary and the movable component is flipped around the central axis of the connecting part, the activity state of the movable component includes the flipping direction and the flipping angle of the movable component.

[0015] The central axis of the connecting part and the central axis of the fixed component are perpendicular to each other.

[0016] Optionally, the processor is specifically configured to determine the flipping direction of the movable component according to the change direction of the capacitance value and a third corresponding relationship, and determine the flipping angle of the movable component according to the size of the capacitance value and a fourth corresponding relationship.

[0017] The third corresponding relationship is a corresponding relationship between the change direction of the capacitance value and the flipping direction of the movable component, and the fourth corresponding relationship is a corresponding relationship between the size of the capacitance value and the flipping angle of the movable component; the third corresponding relationship and the fourth corresponding relationship are obtained through calibration.

[0018] Optionally, the connecting part of the fixed component is a connecting shaft, the movable component includes a sleeve, and the fixed component and the movable component are rotationally connected through the connecting shaft and the sleeve; in the process that the sleeve rotates around the connecting shaft while the connecting shaft is stationary, the movable component is flipped around the central axis of the connecting shaft.

[0019] The first conductive layer is specifically placed inside or on the surface of the connecting shaft, and the second conductive layer is specifically placed inside or on the surface of the sleeve; the first conductive layer and the second conductive layer have a preset bending radius; in the process that the sleeve rotates around the connecting shaft while the connecting shaft is stationary, the second conductive layer rotates around the first conductive layer.

[0020] Optionally, the first conductive layer is placed inside the fixed component by means of in-mold injection or laser direct structuring, or is placed on the surface of the fixed component by means of surface plating.

[0021] The second conductive layer is disposed inside the movable component by in-mold injection or laser direct forming, or is disposed on the surface of the movable component by surface plating.

[0022] The application further provides a state detection method, which is applied to a state detection device, and the state detection device comprises a fixed component, a movable component, a first conductive layer, a second conductive layer, a capacitor detection device and a processor.

[0023] The method comprises:

[0024] The capacitor detection component detects the capacitor value between the first conductive layer and the second conductive layer, and sends the capacitor value to the processor.

[0025] The processor determines the activity state of the movable component according to the capacitor value.

[0026] Optionally, when the fixed component is stationary and the movable component rotates around the central axis of the fixed component, the processor determines the activity state of the movable component according to the capacitor value, comprising:

[0027] The processor obtains a first corresponding relationship and a second corresponding relationship.

[0028] The processor determines the rotation direction of the movable component according to the change direction of the capacitor value and the first corresponding relationship.

[0029] The processor determines the rotation angle of the movable component according to the size of the capacitor value and the second corresponding relationship.

[0030] The first corresponding relationship is the corresponding relationship between the change direction of the capacitor value and the rotation direction of the movable component, and the second corresponding relationship is the corresponding relationship between the size of the capacitor value and the rotation angle of the movable component.

[0031] Optionally, when the fixed component is stationary and the movable component flips around the central axis of the connecting portion, the processor determines the activity state of the movable component according to the capacitor value, comprising:

[0032] The processor obtains a third correspondence relationship and a fourth correspondence relationship;

[0033] The processor determines a flipping direction of the movable component according to the change direction of the capacitance value and the third correspondence relationship;

[0034] The processor determines a flipping angle of the movable component according to the size of the capacitance value and the fourth correspondence relationship;

[0035] The third correspondence relationship is a correspondence relationship between the change direction of the capacitance value and the flipping direction of the movable component, and the fourth correspondence relationship is a correspondence relationship between the size of the capacitance value and the flipping angle of the movable component. In the process of calibrating the fourth correspondence relationship, the flipping angle of the movable component is obtained by an angle measuring device.

[0036] According to the above technical solution, the present application has the following beneficial effects:

[0037] The present application provides a state detection device and method. The state detection device comprises a fixed component, a movable component, a first conductive layer, a second conductive layer, a capacitance detection device and a processor. The fixed component comprises a connecting portion, and the movable component is connected to the connecting portion of the fixed component. The first conductive layer is placed inside or on the surface of the fixed component, and the second conductive layer is placed inside or on the surface of the movable component. When the fixed component is stationary and the movable component is active, the capacitance value between the first conductive layer and the second conductive layer changes. Based on this, the capacitance detection device can detect the capacitance value between the first conductive layer and the second conductive layer and send the capacitance value to the processor. The processor can then determine the activity state of the movable component according to the obtained capacitance value. In this way, based on the state detection device provided by the present application, the changing capacitance value between the first conductive layer and the second conductive layer can be used to obtain various activity states of the movable component during the activity of the movable component. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0039] Figure 1a It is a structural schematic diagram of a traditional mechanical switch and a limiting mechanism;

[0040] Figure 1b It is a structural schematic diagram of a traditional Hall switch and a permanent magnet;

[0041] Figure 2aA schematic diagram of a state detection device provided by an embodiment of the present application;

[0042] Figure 2b A schematic diagram of another state detection device provided by an embodiment of the present application;

[0043] Figure 2c A schematic diagram of another state detection device provided by an embodiment of the present application;

[0044] Figure 3 A schematic diagram of a connecting piece provided by an embodiment of the present application;

[0045] Figure 4a A schematic diagram of a relative position of a first conductive layer and a second conductive layer provided by an embodiment of the present application;

[0046] Figure 4b A schematic diagram of another relative position of a first conductive layer and a second conductive layer provided by an embodiment of the present application;

[0047] Figure 5a A schematic diagram of another state detection device provided by an embodiment of the present application;

[0048] Figure 5b A schematic diagram of another state detection device provided by an embodiment of the present application;

[0049] Figure 5c A schematic diagram of another state detection device provided by an embodiment of the present application;

[0050] Figure 6 A schematic diagram of a device to be detected provided by an embodiment of the present application;

[0051] Figure 7 A flowchart of a state detection method provided by an embodiment of the present application. DETAILED DESCRIPTION

[0052] In order to make the above objectives, features and advantages of the present application more apparent, further detailed description of the embodiments of the present application will be given below with reference to the accompanying drawings and specific embodiments.

[0053] Generally, some devices include fixed components and movable components, when the fixed components are not moved and the movable components are moved, some control operations of the devices can be implemented according to the moving state of the movable components. For example, the device is a flip phone, the fixed component is the body of the flip phone, and the movable component is the flip cover of the flip phone. The screen of the flip phone can be controlled to display according to the flipping state of the flip cover. In addition, the fixed components and the movable components composed of the structures exist in the devices such as notebook computers, mobile phone cases, flip toilets, cameras, steering wheels, etc. Therefore, the accurate detection of the moving state of the movable components in the devices is very important.

[0054] Taking a flip phone as an example, currently, the activity state of the flip cover in the flip phone can be detected by a mechanical switch plus a limiting device. Referring to Figure 1a , Figure 1a is a structural schematic diagram of a traditional mechanical switch and limiting mechanism. As shown in Figure 1a , a limiting mechanism is arranged on the flip cover of the flip phone, and a mechanical switch is arranged on the body of the phone. When the mechanical switch plus the limiting device is used to detect the state of the flip cover, the flip cover must be opened to an angle greater than the triggering angle of the switch to trigger the switch, which makes the detected activity state of the flip cover have limitations. For example, when the activity state of the flip cover includes the flip angle of the flip cover, the mechanical switch plus the limiting device can only detect one flip angle of the flip cover, and the overall detection performance is poor. If multiple flip angles are to be detected, a large number of mechanical switches and limiting devices are required. The mechanical switch has a relatively large volume, which makes the structure limitation of installing multiple mechanical switches and limiting devices strong, and it is not easy to integrate and implement the product. In addition, when the number of mechanical switches and limiting devices is large, more leads are required for connection, which makes the structure space requirement large and the circuit connection difficult. In addition, the on-off of the switch is controlled by the structural limiting device, which has high requirements for structural design. The mechanical switch belongs to physical contact and triggering, and whether it is a limiting device or a mechanical switch, it will be worn out after a long time of use, and the service life will be affected. Moreover, the mechanical switch is easy to be affected by vibration during use, and the deformation caused by force will cause poor contact, which will further cause the problems of misoperation or misjudgment.

[0055] In addition to the mechanical switch plus limiting device, a Hall switch plus permanent magnet can also be used to detect the activity state of the flip cover. The Hall switch plus permanent magnet needs to use a permanent magnet and a Hall switch. Referring to Figure 1b , Figure 1b is a structural schematic diagram of a traditional Hall switch and permanent magnet. As shown in Figure 1b , a permanent magnet 1 and a permanent magnet 2 are arranged on the flip cover of the phone. A Hall switch 1 and a Hall switch 2 are arranged on the body of the phone. The permanent magnet 1 and the Hall switch 1 form a group, and the permanent magnet 2 and the Hall switch 2 form another group. The Hall switch is a kind of magnetic sensitive element, which will cause the state inside the Hall switch to change when the magnetic field strength around the Hall switch reaches a certain strength, thereby outputting different level states. By using this characteristic and special design of structure, the on-off of the Hall switch is controlled by controlling the distance between the permanent magnet and the Hall switch, thereby realizing the detection of the activity state of the flip cover.

[0056] However, the Hall switch plus permanent magnet mode makes the number of flip angles that can be detected when detecting the activity state of the flip cover limited by the number of Hall switches and the number of permanent magnets, and the overall performance is poor. Therefore, if multiple flip angles of the flip cover are to be detected, multiple sets of Hall switches and permanent magnets need to be provided in the device. The volume occupied by the Hall switch and the permanent magnet is large, and when multiple sets of Hall switches and permanent magnets are provided, the structural space requirement is large, which causes the structure to be strongly limited. Moreover, more leads need to be connected, making the circuit connection difficult. Figure 1b As shown in FIG. 13, the Hall switch plus permanent magnet has only two sets, and therefore only two angles in the flip process of the flip cover can be known. In addition, the reliability of the Hall switch plus permanent magnet mode has certain shortcomings. For example, the Hall scheme needs to use a permanent magnet, and there is always a strong magnetic field around the permanent magnet, which is easy to attract some iron filings and the like, which may cause the product to malfunction. Moreover, the permanent magnet rotates when the flip cover rotates, at which time the magnetic field of the magnet also rotates. When the magnetic field rotates, it cuts the surrounding metal to induce voltage and current, which generates interference. The magnetic flux of the permanent magnet is proportional to the distance that can be sensed by the Hall, and the smaller the magnetic flux, the smaller the sensing distance, and the greater the interference. In addition, the permanent magnet and the Hall switch are installed inside the shell, and the structure design and installation distance are limited and required.

[0057] Therefore, the application provides a state detection device and method. The state detection device includes a fixed component, a movable component, a first conductive layer, a second conductive layer, a capacitance detection device, and a processor. The fixed component includes a connecting portion, and the movable component is connected to the connecting portion of the fixed component. The first conductive layer is disposed inside or on the surface of the fixed component, and the second conductive layer is disposed inside or on the surface of the movable component. When the fixed component is stationary and the movable component is movable, the capacitance value between the first conductive layer and the second conductive layer changes. Based on this, the capacitance detection device can detect the capacitance value between the first conductive layer and the second conductive layer and send the capacitance value to the processor. The processor can determine the activity state of the movable component according to the obtained capacitance value. In this way, based on the state detection device provided by the application, the changing capacitance value between the first conductive layer and the second conductive layer can be used to obtain various activity states of the movable component during the movement of the movable component.

[0058] In order to facilitate understanding of the application, the state detection device provided by the embodiments of the application will be described below with reference to the accompanying drawings.

[0059] The state detection device provided by the embodiments of the application includes a fixed component, a movable component, a first conductive layer, a second conductive layer, a capacitance detection device, and a processor. The fixed component includes a connecting portion, and the movable component is connected to the connecting portion of the fixed component.

[0060] It can be understood that the fixed part and the movable part are components in the device. The device is a flip phone, a notebook computer, a mobile phone case, a flip toilet, a steering wheel, etc. For example, when the device is a flip phone, the fixed part in the flip phone is the body, and the movable part is the flip cover. When the device is a notebook computer, the fixed part in the notebook computer is the main unit, and the movable part is the display unit. When the device is a mobile phone case, the fixed part in the mobile phone case is the base plate, and the movable part is the flip cover plate. When the device is a flip toilet, the fixed part in the flip toilet is the toilet body, and the movable part is the toilet flip cover. When the device is a steering wheel, the movable part in the steering wheel is the steering wheel body, and the fixed part is the fixed connection head connected to the steering wheel body. It can be seen that in the notebook computer, the mobile phone case, the flip toilet, etc., the movable part is specifically flipped relative to the fixed part when the movable part is active. In the steering wheel and other devices, the movable part is specifically rotated relative to the fixed part when the movable part is active.

[0061] The first conductive layer is disposed in the interior or on the surface of the fixed part, and the second conductive layer is disposed in the interior or on the surface of the movable part.

[0062] In one or more embodiments, the first conductive layer is disposed in the interior of the fixed part by means of in-mold injection or laser direct forming, or is disposed on the surface of the fixed part by means of surface plating. Correspondingly, the second conductive layer can also be disposed in the interior of the movable part by means of in-mold injection of metal or laser direct forming, or is disposed on the surface of the movable part by means of surface plating.

[0063] As an optional example, the first conductive layer and the second conductive layer can be metal materials or semiconductor materials, as long as the first conductive layer and the second conductive layer have the function of conducting electricity.

[0064] It can be seen that there will be a distributed capacitance (referred to as capacitance) between any two conductive layers. There is also a capacitance between the first conductive layer and the second conductive layer in the embodiments of the present application. The capacitance value between the first conductive layer and the second conductive layer is affected by the distance and the overlapping area between the first conductive layer and the second conductive layer. When the overlapping area between the first conductive layer and the second conductive layer is constant, the capacitance value is inversely proportional to the distance. The greater the distance between the first conductive layer and the second conductive layer, the smaller the capacitance value between the first conductive layer and the second conductive layer. When the distance between the first conductive layer and the second conductive layer is constant, the capacitance value is proportional to the overlapping area. The greater the overlapping area between the first conductive layer and the second conductive layer, the greater the capacitance value between the first conductive layer and the second conductive layer.

[0065] Based on this, in the embodiments of the present application, the shape and thickness of the first conductive layer and the second conductive layer are not limited, as long as the capacitance value between the first conductive layer and the second conductive layer changes when the fixed part is stationary and the movable part is active.

[0066] Based on this, the capacitive detection device can detect the capacitance value between the first conductive layer and the second conductive layer at a certain detection frequency, and send the detected capacitance value to the processor. Then the processor can process the obtained capacitance value to determine the activity state of the movable component.

[0067] As an optional example, the capacitive detection device is a capacitive detection chip. At this time, when the detection type supported by the capacitive detection chip is self-capacitance detection, the first conductive layer is connected to the capacitive detection chip, and the second conductive layer is grounded. Specifically, the detection input pin of the capacitive detection chip is connected to the first conductive layer. Alternatively, when the detection type supported by the capacitive detection chip is mutual-capacitance detection, the first conductive layer and the second conductive layer are both connected to the capacitive detection chip.

[0068] It can be understood that the architecture of the capacitive detection chip will be different when the selected capacitive detection chip is different. In some possible implementations, the processor can be integrated into the capacitive detection chip, and then the capacitive detection chip can directly process the capacitance value after detecting the capacitance value between the first conductive layer and the second conductive layer and output the activity state of the movable component based on the capacitance value. When the processor is not integrated into the capacitive detection chip, a separate processor can be used to process the capacitance value output by the capacitive detection chip. For example, the processor is a single-chip microcomputer.

[0069] It can also be understood that the installation positions of the capacitive detection device and the processor are not limited in the embodiments of the present application. As an optional example, the capacitive detection device and the processor can be installed in the fixed component. As another optional example, the capacitive detection device and the processor can also be arranged independently of the fixed component and the movable component.

[0070] In actual applications, the activity mode of the movable component can be different. For example, the activity mode of the movable component can be flipping, can be rotating, and can also be translating. In different activity modes, the activity state of the movable component to be analyzed is different.

[0071] As an optional example, when the fixed component is stationary and the movable component rotates around the central axis of the fixed component, the activity state of the movable component includes the rotation direction and the rotation angle of the movable component. The rotation direction is forward rotation and reverse rotation. When the rotation direction is forward rotation, the rotation angle is a positive rotation angle; when the rotation direction is reverse rotation, the rotation angle is a negative rotation angle. In this example, reference can be made to notebook computers, mobile phone cases, flip toilets and other devices, that is, in these devices, the activity mode of the movable component is flipping.

[0072] It can be understood that when the activity state of the movable component includes the rotation direction and the rotation angle of the movable component, the processor is specifically configured to determine the rotation direction of the movable component according to the change direction of the capacitance value and a first corresponding relationship, and determine the rotation angle of the movable component according to the size of the capacitance value and a second corresponding relationship. The first corresponding relationship is a corresponding relationship between the change direction of the capacitance value and the rotation direction of the movable component, and the second corresponding relationship is a corresponding relationship between the size of the capacitance value and the rotation angle of the movable component; the first corresponding relationship and the second corresponding relationship are obtained through calibration.

[0073] The change direction of the capacitance value includes increase and decrease. There is a first corresponding relationship between the change direction of the capacitance value and the rotation direction of the movable component, which can be determined according to the actual situation of calibration. For example, if the rotation direction of the movable component is positive rotation, the capacitance value between the first conductive layer and the second conductive layer decreases, and if the rotation direction of the movable component is reverse rotation, the capacitance value between the first conductive layer and the second conductive layer increases, then the first corresponding relationship is that the increase of the capacitance value corresponds to the reverse rotation, and the decrease of the capacitance value corresponds to the positive rotation. In addition, there is a second corresponding relationship between the size of the capacitance value and the rotation angle of the movable component, and the corresponding relationship between the values can be obtained through calibration in practice. In the calibration process, the rotation angle can be obtained through an angle measuring device. Therefore, after obtaining a capacitance value, the corresponding rotation angle of the capacitance value can be obtained according to the second corresponding relationship.

[0074] As another optional example, when the fixed component is stationary and the movable component flips around the central axis of the connecting part, the activity state of the movable component includes the flipping direction and the flipping angle of the movable component. The flipping direction is upward flipping and downward flipping. When the flipping direction is upward flipping, the flipping angle is the upward flipping angle; when the flipping direction is downward flipping, the flipping angle is the downward flipping angle. In this example, reference can be made to devices such as steering wheels, i.e., in these devices, the activity mode of the movable component is rotation.

[0075] The central axis of the connecting part and the central axis of the fixed component are perpendicular to each other.

[0076] It can be understood that when the activity state of the movable component includes the flipping direction and the flipping angle of the movable component, the processor is specifically configured to determine the flipping direction of the movable component according to the change direction of the capacitance value and a third corresponding relationship, and determine the flipping angle of the movable component according to the size of the capacitance value and a fourth corresponding relationship. The third corresponding relationship is a corresponding relationship between the change direction of the capacitance value and the flipping direction of the movable component, and the fourth corresponding relationship is a corresponding relationship between the size of the capacitance value and the flipping angle of the movable component; the third corresponding relationship and the fourth corresponding relationship are obtained through calibration.

[0077] The change direction of the capacitance value includes increase and decrease. There is a third correspondence relationship between the change direction of the capacitance value and the flipping direction of the movable component, which can be determined according to actual calibration. For example, if the flipping direction of the movable component is upward flipping, the capacitance value between the first conductive layer and the second conductive layer decreases, and if the flipping direction of the movable component is downward flipping, the capacitance value between the first conductive layer and the second conductive layer increases, then the third correspondence relationship is that the increase of the capacitance value corresponds to the upward flipping, and the decrease of the capacitance value corresponds to the downward flipping. In addition, there is a fourth correspondence relationship between the capacitance value and the flipping angle of the movable component, and the correspondence relationship between the values can be obtained through calibration in practice. In the calibration process, the flipping angle can be obtained through an angle measuring device. Then, after obtaining a capacitance value, the flipping angle corresponding to the capacitance value can be obtained according to the fourth correspondence relationship.

[0078] As another optional example, when the fixed component is stationary and the movable component translates relative to the fixed component, the activity state of the movable component includes the translation direction and the translation distance of the movable component. The translation direction is forward translation and backward translation. When the translation direction is forward translation, the translation distance is forward translation distance; when the translation direction is backward translation, the translation distance is backward translation distance. In this example, a device such as a slide phone can be referred to. The movable component of the slide phone is the upper half of the body, and the fixed component is the lower half of the body. That is, in these devices, the activity mode of the movable component is translation.

[0079] It can be understood that when the activity state of the movable component includes the translation direction and the translation distance of the movable component, the processor is specifically configured to determine the translation direction of the movable component according to the change direction of the capacitance value and a fifth correspondence relationship, and determine the translation distance of the movable component according to the size of the capacitance value and a sixth correspondence relationship. The fifth correspondence relationship is a correspondence relationship between the change direction of the capacitance value and the translation direction of the movable component, and the sixth correspondence relationship is a correspondence relationship between the size of the capacitance value and the translation distance of the movable component; the fifth correspondence relationship and the sixth correspondence relationship are obtained through calibration.

[0080] The change direction of the capacitance value includes increase and decrease. There is a fourth correspondence relationship between the change direction of the capacitance value and the translation direction of the movable component, which can be determined according to actual calibration. For example, if the translation direction of the movable component is forward translation, the capacitance value between the first conductive layer and the second conductive layer decreases, and if the flip direction of the movable component is backward translation, the capacitance value between the first conductive layer and the second conductive layer increases, then the fifth correspondence relationship is that the increase of the capacitance value corresponds to the forward translation, and the decrease of the capacitance value corresponds to the backward translation. In addition, there is a sixth correspondence relationship between the size of the capacitance value and the translation distance of the movable component, and the correspondence relationship between the values can be obtained through actual calibration. In the calibration process, the translation distance can be obtained by a distance measuring device. After obtaining a capacitance value, the translation distance corresponding to the capacitance value can be obtained according to the sixth correspondence relationship.

[0081] The state detection device provided by the embodiments of the present application has simple industrial design and structure design, and has less influence on the industrial design of the device to be detected. The implementation process of the conductive layer belongs to a conventional process and has low overall cost. When the activity state of the movable component includes direction and angle, the state detection device can realize detection of direction and detection of any angle based on the first conductive layer and the second conductive layer, and has good overall performance. The first conductive layer and the second conductive layer basically do not occupy structural space, and the capacitance detection chip has no position requirement, so the overall space occupied is small, which makes the structure of the state detection device of the present application less restrictive. Moreover, only two connection lines are needed when the capacitance detection chip is connected with the conductive layer, the circuit connection is simple, and the connection lines have less demand for space. The state detection device provided by the embodiments of the present application has no mechanical contact and wear, and has no problems of magnetic field interference and magnetic adsorption, and has good reliability and long service life.

[0082] A flip phone is taken as an example for illustration, Figure 2a , Figure 2b and Figure 2c are schematic diagrams of the state detection device provided by the embodiments of the present application. Figure 2a , Figure 2b and Figure 2c show the situation of the flip cover of the flip phone at different flip angles. As shown in Figure 2a , the flip phone includes a fixed component 1 and a movable component 2. The fixed component 1 is the body of the flip phone, and the movable component 2 is the flip cover of the flip phone. The movable component 2 and the fixed component 1 are connected together through a connecting piece. The connecting piece includes a connecting part in the fixed component.

[0083] As shown in Figure 2a , Figure 2b and Figure 2cAs shown, the first conductive layer 3 (dark gray area in the figure) is disposed on the surface of the fixed part 1, and the second conductive layer 4 (another dark gray area in the figure) is disposed on the surface of the flip cover 2. The shapes of the first conductive layer 3 and the second conductive layer 4 are set according to the flip cover mobile phone, and have a certain thickness. The movable part 2 can be flipped around the central axis of the connecting part (as shown in Figure 2c The fixed part 1 is stationary during the flipping of the movable part 2. During the flipping of the movable part 2, the capacitance value between the first conductive layer 3 and the second conductive layer 4 changes. The detection input pin of the capacitance detection chip (not shown in the figure) is connected to the first conductive layer 3, and the second conductive layer 4 is grounded. The capacitance detection chip detects the capacitance value between the first conductive layer 3 and the second conductive layer 4 and sends it to the processor (not shown in the figure) for processing to determine the activity state of the movable part 2. The activity state of the movable part 2 includes the flipping direction and the flipping angle.

[0084] As shown in Figure 2a , Figure 2b and Figure 2c , different flipping angles of the movable part 2 and the relative positions between the first conductive layer 3 and the second conductive layer 4 at different flipping angles are shown. It can be seen that when the device is a flip cover mobile phone, opening the flip cover indicates that the flipping direction of the movable part 2 is upward flipping, and closing the flip cover indicates that the flipping direction of the movable part 2 is downward flipping.

[0085] It can be understood that when the angle between the movable part 2 and the fixed part 1 is 0 degrees, it can represent that the flipping angle of the movable part 2 is 0 degrees. At this time, the movable part 2 (i.e. the flip cover) is in a closed state. When the movable part 2 is from the closed state to the open state, the distance and the overlapping area between the first conductive layer 3 and the second conductive layer 4 change at the same time, so that the capacitance value between the first conductive layer 3 and the second conductive layer 4 changes.

[0086] Based on this, Figure 2a , Figure 2b and Figure 2c The mounting positions of the first conductive layer 3 and the second conductive layer 4 are only described as examples. In actual application, the first conductive layer 3 can be disposed on any surface position or internal position in the fixed part 1, and the second conductive layer 4 can be disposed on any surface position or internal position in the movable part 2, as long as the capacitance between the first conductive layer 3 and the second conductive layer 4 changes during the flipping of the movable part 2. As an optional example, the overlapping area between the first conductive layer 3 and the second conductive layer 4 can be set to be the largest and the capacitance value can be the largest when the movable part 2 is in the closed state. During the process of the movable part 2 from the closed state to the open state, the capacitance value between the first conductive layer 3 and the second conductive layer 4 gradually decreases.

[0087] In this way, the third and fourth corresponding relationships can be calibrated in advance, so that the processor determines the flipping direction and the flipping angle of the movable component 2 according to the third and fourth corresponding relationships and the obtained capacitance value.

[0088] The calibration manner specifically includes: obtaining the flipping angle of the movable component 2 in the flipping process and the capacitance value detected by the capacitance detection device when the fixed component 1 is stationary; recording a first corresponding relationship between the flipping direction and the change direction of the capacitance value, and recording a second corresponding relationship between the flipping angle and the capacitance value. The flipping angle of the movable component 2 in the flipping process can be obtained by measuring by an angle measuring device, for example, a protractor.

[0089] It can be understood that the first and second corresponding relationships can be integrated in the processor in the form of firmware.

[0090] It can be understood that the first and second corresponding relationships can be integrated in the processor in the form of firmware. Figure 2a 、 Figure 2b and Figure 2c The first conductive layer and the second conductive layer are arranged in a certain shape and are installed in a certain position. Figure 2a 、 Figure 2b and Figure 2c The first conductive layer and the second conductive layer are arranged in a certain shape and are installed in a certain position.

[0091] In a possible implementation, the first conductive layer and the second conductive layer are arranged in another shape and are installed in another position. Specifically, the connecting part of the fixed component is a connecting shaft, and the movable component includes a sleeve, and the fixed component and the movable component are rotationally connected through the connecting shaft and the sleeve. Referring to Figure 3 , Figure 3 The connecting part provided by the embodiment of the application is shown in a schematic view. Figure 3 The connecting part includes the connecting shaft 8 and the sleeve 9. In the process that the connecting shaft 8 is stationary and the sleeve 9 rotates around the connecting shaft 8, the movable component 2 flips around the central axis of the connecting shaft 8.

[0092] As shown in Figure 3 , the first conductive layer 3 is specifically arranged inside or on the surface of the connecting shaft 8 of the fixed component 1, and the second conductive layer 4 is specifically arranged inside or on the surface of the sleeve 9 of the movable component 2. The first conductive layer 3 and the second conductive layer 4 have a preset curved radius; in the process that the connecting shaft 8 is stationary and the sleeve 9 rotates around the connecting shaft 8, the second conductive layer 4 rotates around the first conductive layer 3.

[0093] As an optional example, the first conductive layer 3 is embedded in the connecting shaft 8 by a process of in-mold injection, and the second conductive layer 4 is also embedded in the sleeve 9 by a process of in-mold injection. Alternatively, the first conductive layer 3 is plated on the surface of the connecting shaft 8 by a process of surface plating, and the second conductive layer 4 is also plated on the surface of the sleeve 9 by a process of surface plating.

[0094] As shown in Figure 3 , the first conductive layer 3 and the second conductive layer 4 can be semi-annular conductive layers with a preset bending radius. One cross section of the semi-annular conductive layer is semi-annular. It can be understood that, in the structure shown in Figure 3 , the distance between the first conductive layer 3 and the second conductive layer 4 does not change with the flipping of the movable part 22.

[0095] It can be understood that, Figure 3 the shapes and positions of the first conductive layer and the second conductive layer shown in the drawings are described as examples. The scope of application of the embodiments of the present application is not limited by any aspect of the schematic diagram.

[0096] Referring to Figure 4a , Figure 4a , a relative position schematic diagram of the first conductive layer and the second conductive layer provided by the embodiments of the present application is provided. The first conductive layer 3 and the second conductive layer 4 are semi-annular conductive layers. As shown in Figure 4a , one cross section of the first conductive layer 3 and the second conductive layer 4 is semi-annular, and the annular cross section of the first conductive layer 3 and the annular cross section of the second conductive layer 4 are concentric annular.

[0097] In the opening or closing process of the movable part 2 (i.e. the flip cover), the connecting shaft 8 is in a fixed state, the sleeve 9 rotates around the connecting shaft 8, so that the first conductive layer 3 is stationary, and the second conductive layer 4 rotates around the first conductive layer 3.

[0098] As an optional example, when the movable part 2 is in a closed state, the first conductive layer 3 and the second conductive layer 4 are completely overlapped as shown in Figure 4a . At this time, the overlapping area of the first conductive layer 3 and the second conductive layer 4 is maximum. Referring to Figure 4b , Figure 4b , another relative position schematic diagram of the first conductive layer and the second conductive layer provided by the embodiments of the present application is provided. Figure 4b The relative position of the first conductive layer and the second conductive layer shown in the drawing indicates that the movable part 2 is flipped clockwise by a certain angle, and the movable part 2 is in an open state at a certain flip angle. In the opening process of the movable part 2, the distance between the first conductive layer 3 and the second conductive layer 4 does not change, the overlapping area decreases, resulting in a decrease in the capacitance between the first conductive layer 3 and the second conductive layer 4.

[0099] In addition, the degree of change in the capacitance value between the first conductive layer 3 and the second conductive layer 4 can be achieved by controlling the distance between the first conductive layer 3 and the second conductive layer 4 and the central axis of the connecting shaft. The closer the first conductive layer 3 and the second conductive layer 4 are to the central axis of the connecting shaft, the more obvious the trend of the capacitance value changing with the flip angle of the movable component 2, and the farther the first conductive layer 3 and the second conductive layer 4 are from the central axis of the connecting shaft, the less obvious the trend of the capacitance value changing with the flip angle of the movable component 2.

[0100] In another possible implementation, the movable component 2 can include the connecting shaft 8, and the fixed component 1 includes the sleeve 9. The fixed component 1 and the movable component 2 are rotationally connected through the connecting shaft 8 and the sleeve 9.

[0101] During the opening of the movable component 2, the connecting shaft 8 rotates in the sleeve 9, and the sleeve 9 is in a fixed state. Based on this, another specific implementation structure of the first conductive layer 3 and the second conductive layer 4 is provided in the embodiments of the present application.

[0102] Referring to Figure 5a , Figure 5b and Figure 5c , Figure 5a , Figure 5b and Figure 5c are schematic diagrams of another state detection device provided in the embodiments of the present application. As shown in Figure 5a , Figure 5b and Figure 5c , the first conductive layer 3 is located in the sleeve 9 of the fixed component 1, and the second conductive layer 4 is located in the connecting shaft 8 of the flip cover 2. The first conductive layer 3 and the second conductive layer 4 are semi-ring conductive layers, one cross section of the first conductive layer 3 and the second conductive layer 4 is a semi-ring shape, and the ring in which the cross section of the first conductive layer 3 is located and the ring in which the cross section of the second conductive layer 4 is located are concentric rings. During the opening of the movable component 2, the second conductive layer 4 rotates with the rotation of the connecting shaft 8.

[0103] Figure 5a , Figure 5b and Figure 5c show different flip angles of the movable component 2 (i.e., the flip cover), and the relative positional relationship between the first conductive layer 3 (the gray semi-ring area in the figure) and the second conductive layer 4 (the other gray semi-ring area in the figure) at different flip angles of the movable component 2. In Figure 5a , the first conductive layer 3 and the second conductive layer 4 completely overlap, and the overlapping area between the first conductive layer 3 and the second conductive layer 4 is maximum. In Figure 5b , the flip angle of the flip cover increases, the second conductive layer 4 rotates with the rotation of the connecting shaft 8, so that the overlapping area of the first conductive layer 3 and the second conductive layer 4 decreases. In Figure 5c , the flip angle of the flip cover further increases, so that the overlapping area of the first conductive layer 3 and the second conductive layer 4 is 0.

[0104] It can be understood that, Figure 2a , Figure 2b , Figure 2c and Figure 5a , Figure 5b , Figure 5c The schematic diagram shown in the figure is only one example in which the embodiments of the present application can be implemented. The fixed parts, the movable part 2, the first conductive layer and the second conductive layer shown in the figure are shown as examples. The scope of application of the embodiments of the present application is not limited by any aspect of the schematic diagram.

[0105] In addition, referring to Figure 6 , Figure 6 is a schematic diagram of a device to be detected provided by the embodiments of the present application. The device to be detected is a camera. Figure 6 The first part 5 and the second part 6 in Figure 6 The first part 5 in the device to be detected shown in the figure is a reversible part. When the first part 5 is flipped up and down, the first part 5 can be regarded as a movable part, and at this time the second part 6 can be regarded as a fixed part. The first conductive layer can be placed inside or on the surface of the second part 6, and the second conductive layer can be placed inside or on the surface of the first part 5, so that during the flipping of the first part 5 up and down, the flipping direction and the flipping angle of the first part 5 can be determined by detecting the capacitance value between the first conductive layer and the second conductive layer.

[0106] It should be noted that the embodiments of the present application do not limit the shape of the first conductive layer and the position of the first conductive layer in the second part 6, nor the shape of the second conductive layer and the position of the second conductive layer in the first part 5, as long as there is a change in the capacitance value between the first conductive layer and the second conductive layer during the flipping of the first part 5.

[0107] In another case, the third part 7 is a rotatable part, and the third part 7 can also be regarded as a movable part, and at this time the fourth part 8 can be regarded as a fixed part. The third part 7 rotates around the center axis of the fourth part 8. The first conductive layer can be placed inside or on the surface of the third part 7, and the second conductive layer can be placed inside or on the surface of the fourth part 8, so that during the rotation of the third part 7 in the forward and reverse directions, the rotation direction and the rotation angle of the third part 7 can be determined by detecting the capacitance value between the first conductive layer and the second conductive layer.

[0108] It should be noted that the embodiments of the present application do not limit the shape of the first conductive layer and the position of the first conductive layer in the third component 7, nor the shape of the second conductive layer and the position of the second conductive layer in the fourth component 8, as long as the capacitance value between the first conductive layer and the second conductive layer changes during the rotation of the third component 7.

[0109] Based on the state detection device provided by the above method embodiment, the embodiments of the present application further provide a state detection method, which is applied to the state detection device of the above embodiments. The state detection device comprises a fixed component, a movable component, a first conductive layer, a second conductive layer, a capacitance detection device and a processor. The fixed component comprises a connecting portion, and the movable component is connected to the connecting portion of the fixed component. The first conductive layer is arranged inside or on the surface of the fixed component. The second conductive layer is arranged inside or on the surface of the movable component. When the fixed component is stationary and the movable component is movable, the capacitance value between the first conductive layer and the second conductive layer changes.

[0110] The state detection method will be described in combination with the drawings. Referring to FIG. 7, Figure 7 as shown in the figure, the flowchart of the state detection method provided by the embodiments of the present application is shown, which can comprise S701-S702: Figure 7

[0111] S701: The capacitance detection component detects the capacitance value between the first conductive layer and the second conductive layer, and sends the capacitance value to the processor.

[0112] S702: The processor determines the activity state of the movable component according to the capacitance value.

[0113] In a possible implementation, when the fixed component is stationary and the movable component rotates around the central axis of the fixed component, the embodiments of the present application provide a specific implementation of S902 in which the processor determines the activity state of the movable component according to the capacitance value, which comprises:

[0114] The processor acquires the first corresponding relationship and the second corresponding relationship;

[0115] The processor determines the rotation direction of the movable component according to the change direction of the capacitance value and the first corresponding relationship;

[0116] The processor determines the rotation angle of the movable component according to the size of the capacitance value and the second corresponding relationship;

[0117] ​The first corresponding relationship is a corresponding relationship between a change direction of the capacitance value and a rotation direction of the movable component, and the second corresponding relationship is a corresponding relationship between a size of the capacitance value and a rotation angle of the movable component; the first corresponding relationship and the second corresponding relationship are obtained through calibration, and in the process of calibrating the second corresponding relationship, the rotation angle of the movable component is obtained through the angle measuring device.

[0118] In another possible implementation, the embodiment of the present application provides a specific implementation of the method for determining the activity state of the movable component according to the capacitance value when the fixed component is stationary and the movable component is flipped around the central axis of the connecting part in the S902, comprising:

[0119] The processor obtains a third corresponding relationship and a fourth corresponding relationship;

[0120] The processor determines a flipping direction of the movable component according to the change direction of the capacitance value and the third corresponding relationship;

[0121] The processor determines a flipping angle of the movable component according to the size of the capacitance value and the fourth corresponding relationship;

[0122] The third corresponding relationship is a corresponding relationship between the change direction of the capacitance value and the flipping direction of the movable component, and the fourth corresponding relationship is a corresponding relationship between the size of the capacitance value and the flipping angle of the movable component; in the process of calibrating the fourth corresponding relationship, the flipping angle of the movable component is obtained through the angle measuring device.

[0123] As an optional example, the angle measuring device is a protractor.

[0124] It can be understood that the state detection method provided by the embodiment of the present application is applied to the state detection device described in any of the above embodiments. Therefore, the technical details of the state detection method provided by the embodiment of the present application can refer to any of the above state detection devices, which will not be described here.

[0125] From the above description of the embodiments, those skilled in the art can clearly understand that all or part of the steps of the above-mentioned embodiment methods can be implemented by means of software and a necessary general hardware platform. Based on such understanding, the technical solutions of the present application can be embodied in the form of a software product, which can be stored in a storage medium, such as a ROM / RAM, a magnetic disk, an optical disk, etc., and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network communication device such as a media gateway, etc.) to execute the methods described in the various embodiments or some parts of the embodiments of the present application.

[0126] It should be noted that the various embodiments described herein are described in progressive order of complexity where appropriate. Therefore, features and concepts described in one or more embodiments described with or without the aforementioned proviso can be combined with or added to features and concepts described in other embodiments, even though such features or concepts are not mentioned in the alternative embodiments.

[0127] Also, the term "comprising" or "including" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a... " does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0128] The above description of disclosed embodiments provides enough information to enable those skilled in the art to make and use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles described herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A state detection device, characterized in that, The device includes: a fixed component, a movable component, a first conductive layer, a second conductive layer, a capacitance detection device, and a processor; the fixed component includes a connecting portion, and the movable component is connected to the connecting portion of the fixed component; The first conductive layer is placed inside or on the surface of the fixed component; the second conductive layer is placed inside or on the surface of the movable component; when the fixed component is stationary and the movable component moves, the capacitance value between the first conductive layer and the second conductive layer changes; The capacitance detection component is used to detect the capacitance value between the first conductive layer and the second conductive layer, and send the capacitance value to the processor; The processor is used to determine the active state of the movable component based on the capacitance value. The connecting part of the fixed component is a connecting shaft. The movable component includes a sleeve. The fixed component and the movable component are rotatably connected through the connecting shaft and the sleeve. During the process where the connecting shaft is stationary and the sleeve rotates around the connecting shaft, the movable component flips around the central axis of the connecting shaft. The first conductive layer is specifically placed inside or on the surface of the connecting shaft, and the second conductive layer is specifically placed inside or on the surface of the sleeve; the first conductive layer and the second conductive layer have a preset curvature; during the process of the connecting shaft being stationary and the sleeve rotating around the connecting shaft, the second conductive layer rotates around the first conductive layer; When the fixed component remains stationary and the movable component rotates around the central axis of the connecting part, the movement state of the movable component includes the rotation direction and rotation angle of the movable component; The central axis of the connecting part is perpendicular to the central axis of the fixing component; The processor is specifically configured to determine the flipping direction of the movable component based on the direction of change of the capacitance value and a third correspondence; and to determine the flipping angle of the movable component based on the magnitude of the capacitance value and a fourth correspondence. The third correspondence is the correspondence between the direction of change of the capacitance value and the rotation direction of the movable component, and the fourth correspondence is the correspondence between the magnitude of the capacitance value and the rotation angle of the movable component; the third and fourth correspondences are obtained through calibration.

2. The apparatus according to claim 1, characterized in that, When the fixed component is stationary and the movable component rotates around the central axis of the fixed component, the movement state of the movable component includes the rotation direction and rotation angle of the movable component; The central axis of the fixing component is perpendicular to the central axis of the connecting part.

3. The apparatus according to claim 2, characterized in that, The processor is specifically configured to determine the rotation direction of the movable component based on the direction of change of the capacitance value and a first correspondence; and to determine the rotation angle of the movable component based on the magnitude of the capacitance value and a second correspondence. The first correspondence is the correspondence between the direction of change of the capacitance value and the rotation direction of the movable component, and the second correspondence is the correspondence between the magnitude of the capacitance value and the rotation angle of the movable component; the first correspondence and the second correspondence are obtained through calibration.

4. The apparatus according to claim 1, characterized in that, The first conductive layer is placed inside the fixing component by in-mold injection molding or laser direct forming, or it is placed on the surface of the fixing component by surface electroplating. The second conductive layer is placed inside the moving part by in-mold injection molding or laser direct forming, or placed on the surface of the moving part by surface electroplating.

5. A state detection method, characterized in that, The method is applied in a state detection device, which includes: a fixed component, a movable component, a first conductive layer, a second conductive layer, a capacitance detection device, and a processor; the fixed component includes a connecting portion, and the movable component is connected to the connecting portion of the fixed component; the first conductive layer is disposed inside or on the surface of the fixed component; the second conductive layer is disposed inside or on the surface of the movable component; when the fixed component is stationary and the movable component moves, the capacitance value between the first conductive layer and the second conductive layer changes; The method includes: The capacitance detection component detects the capacitance value between the first conductive layer and the second conductive layer, and sends the capacitance value to the processor; The processor determines the active state of the movable component based on the capacitance value. The connecting part of the fixed component is a connecting shaft. The movable component includes a sleeve. The fixed component and the movable component are rotatably connected through the connecting shaft and the sleeve. During the process where the connecting shaft is stationary and the sleeve rotates around the connecting shaft, the movable component flips around the central axis of the connecting shaft. The first conductive layer is specifically placed inside or on the surface of the connecting shaft, and the second conductive layer is specifically placed inside or on the surface of the sleeve; the first conductive layer and the second conductive layer have a preset curvature; during the process of the connecting shaft being stationary and the sleeve rotating around the connecting shaft, the second conductive layer rotates around the first conductive layer; When the fixed component remains stationary and the movable component rotates around the central axis of the connecting part, the movement state of the movable component includes the rotation direction and rotation angle of the movable component; The central axis of the connecting part is perpendicular to the central axis of the fixing component; The flipping direction of the movable component is determined based on the direction of change of the capacitance value and the third correspondence; the flipping angle of the movable component is determined based on the magnitude of the capacitance value and the fourth correspondence. The third correspondence is the correspondence between the direction of change of the capacitance value and the rotation direction of the movable component, and the fourth correspondence is the correspondence between the magnitude of the capacitance value and the rotation angle of the movable component; the third and fourth correspondences are obtained through calibration.

6. The method according to claim 5, characterized in that, When the fixed component is stationary and the movable component rotates around the central axis of the fixed component, the processor determines the activity state of the movable component based on the capacitance value, including: The processor acquires the first correspondence and the second correspondence; The processor determines the rotation direction of the movable component based on the direction of change of the capacitance value and the first correspondence. The processor determines the rotation angle of the moving part based on the magnitude of the capacitance value and the second correspondence. The first correspondence is the correspondence between the direction of change of the capacitance value and the rotation direction of the movable component, and the second correspondence is the correspondence between the magnitude of the capacitance value and the rotation angle of the movable component. The first and second correspondences are obtained through calibration. During the calibration of the second correspondence, the rotation angle of the movable component is obtained through an angle measuring device.

7. The method according to claim 5, characterized in that, When the fixed component remains stationary and the movable component rotates around the central axis of the connecting portion, the processor determines the active state of the movable component based on the capacitance value, including: The processor acquires the third and fourth correspondence relationships; The processor determines the flipping direction of the movable component based on the direction of change of the capacitance value and the third correspondence. The processor determines the flip angle of the movable component based on the capacitance value and the fourth correspondence. The third correspondence is the correspondence between the direction of change of the capacitance value and the rotation direction of the movable component, and the fourth correspondence is the correspondence between the magnitude of the capacitance value and the rotation angle of the movable component. During the calibration of the fourth correspondence, the rotation angle of the movable component is obtained by an angle measuring device.

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