Mobile electronic devices

Abstract

This disclosure provides a mobile electronic device comprising: a circuit board; a first device including a first magnetic member; a second device including a second magnetic member; a first metal member configured to shield the second device from magnetic forces generated by the first magnetic member; and a second metal member configured to support the circuit board, wherein the first metal member is disposed between the first device and the second device in a vertically upright orientation relative to the circuit board, wherein the first metal member and the second metal member are attached to each other, and wherein the first metal member is formed of a metal material different from the metal material forming the second metal member.

Description

[0001] This application is a divisional application of patent application No. 201980014387.7, filed on February 21, 2019, entitled "Electronic device comprising at least a shielding member for shielding magnetic forces generated by a magnetic material and a connection portion connected to the shielding member containing the properties of a non-magnetic material". Technical Field

[0002] This disclosure relates to electronic devices including structures for shielding magnetic forces between electronic components. Background Technology

[0003] Today, with the development of digital technology, various types of electronic devices, such as mobile communication terminals, smartphones, tablet PCs, laptops, personal digital assistants (PDAs), wearable devices, or digital cameras, are widely used.

[0004] Electronic devices (such as smartphones) may include various electronic components (e.g., receivers, speakers, cameras, magnetic sensors, and accelerometers) that include magnetic materials for their operation. For example, a receiver may include coils and magnets as actuators for a diaphragm. As another example, a camera may include coils and magnets as actuators for moving a lens. Because electronic components including magnetic materials are mounted within the limited space of an electronic device, they can influence adjacent electronic components through magnetic forces. For example, electronic components each including magnetic materials may be arranged adjacent to each other within the internal space of the electronic device; and in this case, the magnetic materials can influence each other; therefore, errors may occur in the operation of the electronic components. According to one embodiment, errors may occur in the operation of other adjacent electronic components due to the influence of magnetic forces radiated from the magnetic materials of the electronic components.

[0005] The above information is presented as background information only to aid in understanding this disclosure. There is no determination or assertion as to whether any of the above content is applicable to the prior art relating to this disclosure. Summary of the Invention

[0006] Technical issues

[0007] The present disclosure aims to at least address the aforementioned problems and / or disadvantages, and to provide at least the following advantages. Therefore, one aspect of the present disclosure is to provide an electronic device that enables the electronic components to operate without errors caused by magnetic forces, even when electronic components, each comprising a magnetic material, are mounted adjacent to each other.

[0008] Another aspect of this disclosure is to provide an electronic device capable of effectively shielding the magnetic force between two adjacent magnetic materials.

[0009] Another aspect of this disclosure is to provide an electronic device that can design a minimum shielding structure (magnetic shielding member) based at least on a driving method of electronic components when designing a shielding structure for shielding the magnetic force between two adjacent magnetic materials.

[0010] Another aspect of this disclosure is to provide an electronic device including a shielding structure that can increase the magnetic shielding effect while minimizing the separation distance between electronic components including magnetic materials.

[0011] Another aspect of this disclosure is to provide an electronic device including a shielding structure that can shield the magnetic force between adjacent magnetic materials by providing a non-magnetic material and a magnetic shielding material, wherein the magnetic shielding material is a magnetic material constructed on a circuit board between electronic components installed in the electronic device.

[0012] Additional aspects will be set forth in part in the following description and will be apparent in part from the description, or may be learned by practice of the embodiments given.

[0013] Technical solution

[0014] According to one aspect of this disclosure, an electronic device is provided. The electronic device includes: a first device including a first magnetic material; a second device including a second magnetic material; and a shielding structure configured to shield at least a portion of a magnetic force generated between the first magnetic material and the second magnetic material, wherein the shielding structure includes a shielding member disposed between the first device and the second device and including properties of the magnetic material, and a connecting member physically connected to at least a portion of the shielding member and including properties of a non-magnetic material, wherein at least a portion of the connecting member is physically connected to a circuit board.

[0015] According to another aspect of this disclosure, an electronic device is provided. The electronic device includes: a circuit board; a first device including a first magnetic material; a second device including a second magnetic material; and a shielding structure configured to shield at least a portion of a magnetic force generated between the first magnetic material and the second magnetic material, wherein the shielding structure includes a shielding member disposed between the first device and the second device and including the properties of a magnetic material capable of shielding at least a portion of the magnetic force, and a connecting member physically connected to at least a portion of the shielding member and fixed to the circuit board, wherein the connecting member has the properties of a non-magnetic material magnetically separable from at least a portion of the magnetic force.

[0016] According to another aspect of this disclosure, an electronic device is provided. The electronic device includes: a device comprising a magnetic material; a circuit board; and a shielding structure configured to shield at least a portion of a magnetic field generated by the magnetic material, wherein the shielding structure includes a shielding member disposed between the device and another device included in the electronic setup and comprising the properties of a ferromagnetic material capable of shielding at least a portion of the magnetic field, and a connecting member physically connected between the circuit board and at least a portion of the shielding member, wherein the connecting member has the properties of a non-magnetic material magnetically separable from at least a portion of the magnetic field.

[0017] Other aspects, advantages, and salient features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of this disclosure, which is disclosed in conjunction with the accompanying drawings.

[0018] Beneficial effects

[0019] According to various embodiments, a shielding structure (shielding member) can be formed by incorporating (e.g., formed by SMD method) a non-magnetic material (e.g., nickel silver) and a magnetic shielding material (which is a magnetic material formed on a circuit board between electronic components of an electronic device). Thus, according to various embodiments, a contact structure can be achieved without limitation while minimizing the distance between electronic components.

[0020] According to various embodiments, by using a shielding structure (shielding member) made of a heterogeneous material capable of shielding the magnetic force between two adjacent magnetic materials, the degree of freedom regarding the mounting position of electronic components including magnetic materials can be increased, and by maximizing the shielding performance between magnetic materials, operational (functional) errors caused by the influence (interference) of magnetic forces between electronic components can be prevented.

[0021] According to various embodiments, in electronic devices, even when electronic components, each comprising magnetic materials, are arranged adjacent to each other, they can operate without error while shielding the magnetic force from affecting another electronic component. According to various embodiments, by simplifying the construction of the shielding structure, the shielding structure can be easily manufactured and installed without needing to be removed from a fixed component (e.g., a circuit board). Attached Figure Description

[0022] The above and other aspects, features and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0023] Figure 1 This is a front perspective view showing an electronic device according to various embodiments of the present disclosure;

[0024] Figure 2 This illustrates one embodiment according to the present disclosure. Figure 1 Rear perspective view of the electronic device;

[0025] Figure 3 This illustrates one embodiment according to the present disclosure. Figure 1 An exploded perspective view of an electronic device;

[0026] Figure 4 This illustrates one embodiment according to the present disclosure. Figure 3 A plan view showing the connections of some components of an electronic device;

[0027] Figure 5 This is a diagram illustrating a shielding structure in an electronic device for shielding against magnetic forces from a device comprising a magnetic material, according to various embodiments of the present disclosure.

[0028] Figure 6 This is a plan perspective view showing a shielding structure connected to a circuit board according to various embodiments of the present disclosure;

[0029] Figure 7 This illustrates an embodiment of the present disclosure. Figure 6 A cut perspective view of the shielding structure taken by line B-B';

[0030] Figure 8 This illustrates a shielding structure contact according to an embodiment of the present disclosure. Figure 6 A projected perspective view of the state of the circuit board;

[0031] Figure 9 This illustrates a shielding structure contact according to an embodiment of the present disclosure. Figure 6 A rear perspective view of the circuit board's condition;

[0032] Figure 10 This is a rear perspective view showing another form of the shielding structure of a contact circuit board according to various embodiments of the present disclosure;

[0033] Figure 11 This is a rear perspective view showing another form of the shielding structure of a contact circuit board according to various embodiments of the present disclosure;

[0034] Figure 12 This is a rear perspective view showing another form of the shielding structure of a contact circuit board according to various embodiments of the present disclosure;

[0035] Figure 13 and Figure 14 This is a diagram illustrating a shielding structure in an electronic device for shielding against magnetic forces from a device comprising a magnetic material, according to various embodiments of the present disclosure.

[0036] Figure 15 This is a diagram illustrating an example of the structure of the magnetic force between the shielding devices in various embodiments of the present disclosure;

[0037] Figure 16 This is a diagram illustrating an example of the structure of the magnetic force between the shielding devices in various embodiments of the present disclosure; and

[0038] Figure 17 This is a diagram illustrating an example of the structure of the magnetic force between the shielding devices in various embodiments of the present disclosure.

[0039] Throughout the accompanying drawings, the same reference numerals will be understood to refer to the same parts, components, and structures. Detailed Implementation

[0040] The following description, provided with reference to the accompanying drawings, is intended to aid in a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. It includes various specific details to aid this understanding, but these details will be considered exemplary only. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and constructions may be omitted.

[0041] The terms and words used in the following description and claims are not limited to their literal meaning, but are used by the inventors only to enable this disclosure to be clearly and consistently understood. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this disclosure is provided for illustrative purposes only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.

[0042] It will be understood that the singular forms of “one” and “the” include plural referents unless the context clearly indicates otherwise. Thus, for example, a reference to “part surface” includes a reference to one or more such surfaces.

[0043] Figure 1 This is a front perspective view showing an electronic device according to various embodiments of the present disclosure. Figure 2 This illustrates one embodiment according to the present disclosure. Figure 1 Rear perspective view of an electronic device.

[0044] Reference Figure 1 and Figure 2 An electronic device 100 according to various embodiments may include a housing 110, the housing 110 including a first plate (or front surface) 110A, a second plate (or rear surface) 110B, and a side surface 110C surrounding the space between the first plate 110A and the second plate 110B. According to one embodiment (not shown), the housing 110 may refer to a structure forming... Figure 1The structure comprises a first plate 110A, a second plate 110B, and a side surface 110C. According to one embodiment, the first plate 110A may include a front plate 102 (e.g., a polymer plate or glass plate comprising various coatings), wherein at least part of it is substantially transparent. The second plate 110B may be formed from a substantially opaque rear plate 111. The rear plate 111 may be formed from, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. The side surface 110C may be formed from a side frame structure (or “side member”) 118 that connects the front plate 102 and the rear plate 111 and comprises metal and / or polymer. In some embodiments, the rear plate 111 and the side frame structure 118 may be integrally formed and comprise the same material (e.g., a metallic material such as aluminum).

[0045] According to one embodiment, the electronic device 100 may include at least one of the following: a display 101, a microphone hole 103, a speaker hole 107, a speaker hole 114, a first sensor module 104, a second sensor module 119, a first camera device 105, a second camera device 112, a flash 113, a home button 115, a touch button 116, a side button 117, an indicator 106, a first connector hole 108, or a second connector hole 109. In some embodiments, the electronic device 100 may omit at least one of these components, or may additionally include other components.

[0046] Display 101 may be exposed through, for example, a significant portion of front panel 102. Display 101 may be coupled to or located adjacent to touch sensing circuitry, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for a stylus used to detect magnetic fields.

[0047] The device may include a microphone hole 103, a speaker hole 107, and a speaker hole 114. A microphone may be positioned at the microphone hole 103 to receive external sound, and in some embodiments, multiple microphones may be provided to detect the direction of sound. One or more speakers may be positioned at the speaker hole 107 for outputting sound to the outside of the electronic device 100. A speaker may be positioned at the speaker hole 114 for outputting sound to the outside of the electronic device 100 to an ear adjacent to the electronic device 100. In some embodiments, the speaker hole 107, speaker hole 114, and microphone hole 103 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be formed without the speaker hole 107 and speaker hole 114.

[0048] The first sensor module 104 and the second sensor module 119 can generate electrical signals or data values ​​corresponding to the operating state within the electronic device 100 or the external environmental state. The first sensor module 104 may be a proximity sensor and / or a fingerprint sensor disposed on the first plate 110A of the housing 110. The second sensor module 119 may be a heart rate monitoring (HRM) sensor disposed on the second plate 110B of the housing 110. The fingerprint sensor may be disposed on the second plate 110B of the housing 110 in addition to being disposed on the first plate 110A (e.g., the home button 115) of the housing 110. The electronic device 100 may include sensor modules (not shown) of at least one of the following: gesture sensor, gyroscope sensor, barometer sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor (e.g., red, green, and blue (RGB) sensor), infrared (IR) sensor, biosensor (medical sensor, biometric sensor), temperature sensor, humidity sensor, or illuminance sensor.

[0049] The device may include a first camera device 105 disposed on a first board 110A, a second camera device 112 disposed on a second board 110B, and / or a flash 113. The first camera device 105 and the second camera device 112 may include one or more lenses, an image sensor, and / or an image signal processor (ISP). The flash 113 may include, for example, a light-emitting diode (LED) or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and the image sensor may be disposed on a single surface of the electronic device 100.

[0050] This may include a home button 115 located on the first plate 110A of the housing 110, a touch button 116 located around the home button 115, and / or a side button 117 located on the side surface 110C of the housing 110. In another embodiment, the electronic device 100 may not include some or all of the aforementioned home button 115, touch button 116, and side button 117, and the excluded home button 115, touch button 116, and side button 117 may be implemented in different forms, such as soft keys on the display 101.

[0051] Indicator 106 may be located, for example, at the first plate 110A of housing 110. For example, indicator 106 may provide status information of electronic device 100 in an optical form and include LEDs.

[0052] The first connector hole 108 may receive a connector (e.g., a Universal Serial Bus (USB) connector) for sending power and / or data to and from an external electronic device, and / or the second connector hole 109 may be a headphone jack that can receive a connector for sending audio signals to and from an external electronic device.

[0053] Figure 3 This illustrates one embodiment according to the present disclosure. Figure 1 An exploded perspective view of an electronic device.

[0054] Reference Figure 3 The electronic device 300 may include a side frame structure 310, a first support member 311 (e.g., a bracket), a front panel 320, a display 330, a printed circuit board (PCB) 340, a receiver 341 (or a speaker), at least one front-facing camera 342 (or a selfie camera), at least one rear-facing camera 343, a battery 350, a second support member 360 (e.g., a back cover), an antenna 370, and a rear panel 380.

[0055] In some embodiments, the first support member 311, PCB 340, and second support member 360 may form recesses (e.g., fixing recesses) for fixing and mounting the receiver 341, at least one front-facing camera 342, and at least one rear-facing camera 343; and the receiver 341, at least one front-facing camera 342, and at least one rear-facing camera 343 may be fixed to and mounted in the electronic device 300 at least based on the fixing recesses of the PCB 340. In some embodiments, the electronic device 300 may omit at least one of the components (e.g., the first support member 311, the second support member 360), or may further include other components. At least one of the components of the electronic device 300 may be related to... Figure 1 or Figure 2 At least one of the components of the electronic device 100 is the same or similar, and repeated descriptions are omitted below.

[0056] The first support member 311 may be disposed inside the electronic device 300 to connect to the side bezel structure 310, or may be integrally formed with the side bezel structure 310. The first support member 311 may be made of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The display 330 may be coupled to one side of the first support member 311, and the PCB 340 may be coupled to the other side of the first support member 311.

[0057] A processor, memory, and / or interface may be installed in PCB 340. The processor may include at least one of, for example, a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an ISP, a sensor hub processor, or a communication processor (CP).

[0058] The memory may include, for example, volatile memory or non-volatile memory.

[0059] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital (SD) card interface, and / or an audio interface. The interface may, for example, enable electrical or physical connection of an electronic device to an external electronic device; and include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0060] Battery 350 is a device for supplying power to at least one component of electronic device 300, and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. At least a portion of battery 350 may be disposed substantially flush with PCB 340, for example. Battery 350 may be integrally disposed within electronic device 300, or may be detachably disposed with electronic device 300.

[0061] Antenna 370 may be disposed between rear panel 380 and battery 350. Antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. For example, antenna 370 may perform short-range communication with external devices, or may wirelessly send and receive power required for charging. In other embodiments, the antenna element may be formed from a portion or combination of the first support member 311 and / or side frame structure 310.

[0062] Figure 4 This illustrates one embodiment according to the present disclosure. Figure 3 A plan view showing the connections of some components of an electronic device.

[0063] Reference Figure 4 This illustrates an example of connecting two devices (or electronic components) that can be mounted in electronic device 300 to circuit board 430. For example, Figure 4 An example of a structure is shown in which a first device 410 (or a first electronic component) and a second device 420 (or a second electronic component) are fixed (or coupled) in an electronic device 300 to a designated location on a circuit board 430 (e.g., a recess for fixing each of the first device 410 and the second device 420).

[0064] In various embodiments, at least one electronic component may be provided on one side of the circuit board 430. For example, the circuit board 430 may mechanically (or physically) mount the first device 410, the second device 420, and various electronic components (e.g., processors, memory, and / or interfaces), and may be Figure 3 The PCB 340 is configured to be connected via circuit (or ground) based on the circuit design between the respective electronic components.

[0065] In various embodiments, each of the first device 410 and the second device 420 may be mounted within the housing (e.g., side frame structure 310) of the electronic device 300 and may be an electronic component comprising a magnetic material. According to one embodiment, the first device 410 may be an electronic component in the electronic device 300 comprising a first magnetic material (e.g., Figure 3 The receiver 341). According to one embodiment, the second device 420 may be an electronic component in the electronic device 300 that includes a second magnetic material (e.g., the receiver 341). Figure 3 (Rear camera 343). In various embodiments, devices 410 and 420 may include the aforementioned electronic components and various other electronic components containing magnetic materials (e.g., magnetic sensors, accelerometers, and speakers).

[0066] According to one embodiment, when devices 410 and 420 are mounted adjacent to each other in electronic device 300, the magnetic materials of devices 410 and 420 may affect each other; therefore, errors may occur during the operation of devices 410 and 420. To prevent such errors, electronic devices are designed to shield against magnetic forces by means of a shielding structure, either a device or an adjacent shielding structure made of a conductive material (e.g., SUS, ferrite).

[0067] According to various embodiments, the electronic device 300 may include a shielding structure for shielding magnetic forces caused by the first magnetic material or the second magnetic material between a first device 410 including a first magnetic material and a second device 420 including a second magnetic material. The shielding method and structure of the shielding structure for shielding magnetic forces will be described in detail below.

[0068] In the following description, for ease of description, various embodiments are described in which the first device (or first electronic component) and the second device (or second electronic component) include their respective magnetic materials, but this disclosure is not limited thereto. For example, in various embodiments, in structures where the first device or the second device includes a magnetic material and the other device does not, this disclosure can be applied to structures that shield at least a portion of the magnetic force generated by the device including the magnetic material. According to one embodiment, in structures where the first device includes a magnetic material and the second device does not, this disclosure can include structures that shield at least a portion of the magnetic force generated by the magnetic material of the first device.

[0069] Figure 5 This is a diagram illustrating a shielding structure in an electronic device for shielding against magnetic forces from a device comprising a magnetic material, according to various embodiments of the present disclosure.

[0070] Reference Figure 5 It is a schematic representation of the path along Figure 4 A diagram showing one side of the electronic component cut off by line A-A'.

[0071] Reference Figure 5 The electronic device 500 may include: a first device 510 (e.g., Figure 4 The receiver 410 includes a first magnetic material 515; and a second device 520 (e.g., a receiver 410). Figure 4 The rear camera, including a second magnetic material 525; circuit board 530 (e.g., the rear camera), includes a second magnetic material 525; Figure 4 The first device 510 (PCB 430) and the second device 520 (shielding structure 560) are used to shield at least a portion of the magnetic force generated between the first magnetic material 515 and the second magnetic material 525. In various embodiments, the first device 510 and the second device 520 respectively include magnetic materials 515 and 525, but this disclosure is not limited thereto. Therefore, this disclosure may include structures in which any one device (e.g., the first device 510) includes a magnetic material (e.g., the first magnetic material 515) and the other device (e.g., the second device 520) does not include a magnetic material (e.g., the second magnetic material 525). For example, in various embodiments, this disclosure may include structures in which at least a portion of the magnetic force generated by the first magnetic material 515 of the first device 510 is shielded so as not to affect the structure of the second device 520, which does not include a magnetic material.

[0072] According to one embodiment, the shielding structure 560 may include a magnetic shielding member (or shielding portion) 540 for shielding magnetic forces, and a connecting member (or connecting portion) 550 for physically fixing the shielding member 540 to the circuit board 530.

[0073] In various embodiments, the shielding member 540 may be disposed between the first device 510 and the second device 520. The shielding member 540 may be made of a shielding material (or a first material metal or magnetic material) capable of shielding at least a portion of the magnetic force generated between the first magnetic material 515 and the second magnetic material 525. According to one embodiment, the shielding material may be a material (metal) that includes properties of ferromagnetic materials. For example, the shielding material may be implemented using SUS (e.g., elements or alloys such as iron (Fe), cobalt (Co), and nickel (Ni)).

[0074] In various embodiments, the connecting member 550 may contact (or be physically connected to) at least a portion of the shielding member 540 based on a portion of one side, and may contact (or be physically connected to) and be secured to the circuit board 530 based on the other side. The connecting member 550 may be made of a non-magnetic material (or a second material metal) that is magnetically separable from at least a portion of the magnetic force generated between the first magnetic material 515 and the second magnetic material 525. According to one embodiment, the non-magnetic material may be a material (metal) unaffected by the magnetic field formed by a magnetic material (e.g., a magnet). For example, nickel silver (or pure iron) may be used to achieve a non-magnetic material.

[0075] In various embodiments, the shielding structure 560 (e.g., shielding member 540, connecting member 550) can be disposed in a specific manner (e.g., formed using a surface mount device (SMD) method) at the circuit board 530 to contact the circuit board 530. According to one embodiment, when implementing the shielding structure 560, the shielding structure 560 can be divided into a shielding member 540 for shielding magnetic forces (e.g., a material for magnetic field absorption (e.g., a magnetic material)) and a connecting member 550 (e.g., an unmagnetized material (e.g., a non-magnetic material)), and the shielding structure can be implemented by joining the two materials (e.g., the shielding member 540 and the connecting member 550). In the case of the shielding structure according to various embodiments, the non-magnetic material formed using the SMD method (e.g., the connecting member 550) can be designed to ensure only the minimum area to be formed using the SMD method, thereby allowing for greater freedom in designing the contact structure and / or position between the device (or the magnetic material of the device) and the circuit board 530.

[0076] According to various embodiments, the placement position of the shielding member 540 (e.g., adjacent to either device) can be determined based on whether the functional characteristics (or driving (operation) method) of the devices (e.g., the first device 510, the second device 520) are affected by the magnet (or magnetic force, magnetic field) between the first device 510 and the second device 520. According to one embodiment, the shielding member 540 can be positioned closer to (or biased towards) either device (e.g., the first device 510, which includes magnetic materials that affect the operation of the other device), at least based on the functional characteristics of the first device 510 and the second device 520. According to one embodiment, the shielding member 540 can have a structure different in distance and / or thickness from the structure of a device in which the placement position is determined to correspond to the strength (or magnetic force) of each magnetic material between the first magnetic material 515 and the second magnetic material 525.

[0077] According to one embodiment, the intensity of the magnetic flux emitted from each of the magnetic materials (e.g., first magnetic material 515, second magnetic material 525) of the electronic components (e.g., first device 510 and second device 520) of the electronic device 500 may be different. For example, the first magnetic material 515 provided in the first device 510 may have a stronger magnetism than the second magnetic material 525 provided in the second device 520. Furthermore, the device may have a second driving method (or driving function) affected by the magnetic flux of the magnetic material of the other device (e.g., the autofocus (AF) function of a camera, zoom magnification / zoom reduction function), or the device may have a first driving method unaffected by the magnetic flux of the magnetic material of the other device (e.g., a device that is not affected by other magnetic fluxes in terms of driving, such as a speaker). In one embodiment, a device including a first driving method and / or relatively strong magnetism may be referred to as the first device 510, and a device including a second driving method and / or relatively weak magnetism may be referred to as the second device 520.

[0078] According to one embodiment, the magnetic flux emitted from the second magnetic material 525 of the second device 520 may not significantly affect the operation of the first device 510, but the magnetic flux emitted from the first magnetic material 515 of the first device 510 may cause serious errors in the operation of the second device 520. According to one embodiment, the shielding member 540 may absorb the magnetic force of the first magnetic material 515 of the first device 510 to form a magnetic field with the first magnetic material 515. Therefore, when the length B between the shielding member 540 and the second device 520 (or the second magnetic material 525 of the second device 520) is short (or when the shielding member 540 and the second device 520 are arranged adjacent to each other, and when the shielding member 540 and the second device 520 are within a magnetic field range), the magnetic flux emitted through the shielding member 540 may affect the operation of the second device 520.

[0079] Therefore, the shielding structure 560 of the electronic device 500 according to various embodiments can be arranged adjacent to the device of the first driving method and / or the device that emits a relatively strong magnetic flux in the first device 510 and the second device 520 (e.g., the first device 510).

[0080] According to one implementation method, such as Figure 5 As shown, the shielding structure 560 (particularly the shielding member 540) can be positioned closer to the first device 510 than to the second device 520. Therefore, even within a fixed (or finite) length A between the first device 510 and the second device 510, the separation distance (e.g., length B) between the shielding member 540 and the second magnetic material 525 (e.g., an unshielded magnetic material that may be affected by magnetic forces) can be maximized (e.g., the maximum separation distance). According to one embodiment, the distance between the first device 510 and the second device 520 (e.g., length A) may include a first radius (e.g., about 15 mm, about 20 mm), and the distance between the shielding member 540 and the second magnetic material 525 (e.g., length B) may include a second radius smaller than the first radius (e.g., about 10 mm, about 15 mm).

[0081] The structure of a shielding structure 560 for shielding magnetic forces in an electronic device 500 according to various embodiments will be described in detail below. For ease of description, the first device 510 and the second device 520 are each described as comprising a magnetic material; however, in a structure in which only the first device 510 comprises a magnetic material and the second device 520 does not, the electronic device 500 may include a structure that shields at least a portion of the magnetic force generated by the magnetic material of the first device 510.

[0082] Figure 6 , Figure 7 , Figure 8 and Figure 9 This is a diagram illustrating a structure in an electronic device for shielding against magnetic forces from a device comprising a magnetic material, according to various embodiments of the present disclosure.

[0083] Reference Figure 6 It is a plan perspective view showing an example in which a shielding structure 560 (e.g., shielding member 540, connecting member 550) is disposed between two devices (e.g., first device 510, second device 520) and contacts (or is connected to) a circuit board 530. Figure 7 It is along Figure 6 The cut perspective view taken by line B-B'. Figure 8 This is a diagram showing a projected perspective view in which the shielding structure 560 contacts (or connects to) the shielding structure. Figure 6The circuit board is in the form of 530. Figure 9 This shows the shielding structure 560 contact. Figure 6 Rear perspective view of circuit board 530.

[0084] Reference Figure 6 Describe the contact (connection) structure of the shielding structure 560 and the circuit board 530.

[0085] Reference Figure 6 The first device 510 is an electronic component including a first magnetic material 515; and in one embodiment, the first device 510 may correspond to a receiver or a speaker. The second device 520 is an electronic component including a second magnetic material 525; and in one embodiment, the second device 520 may correspond to a camera. In various embodiments, in addition to the above-described electronic components, the device may also correspond to various electronic components including magnetic materials (e.g., magnetic sensors, accelerometers).

[0086] According to one embodiment, when at least two devices (e.g., first device 510 and second device 520) are mounted adjacent to each other in an electronic device 500, at least two magnetic materials (e.g., first magnetic material 515 and second magnetic material 525) of devices 510 and 520 can influence the other device in either direction or in both directions. Therefore, errors may occur during the operation of devices 510 and 520. To prevent such errors, shielding members made of conductive materials (e.g., SUS, ferrite) are used. Figures 6 to 9 The shielding component 540 can be disposed between the devices 510 and 520.

[0087] According to one embodiment, the circuit board 530 may form a first recess 630 and a second recess 640, in which a connecting member (e.g., Figures 6 to 9 One end of the connecting member 550 (e.g., the first member (or the first reinforcing member) 610 may contact one side of the circuit board 530 (e.g., the circuit board 530 is on the side of the circuit board 530). Figure 6 (on the left side in the direction of observation), in the second groove 640, the other end of the connecting member 550 (e.g., the second member (or the second reinforcing member) 620 can contact the opposite side of one side (the circuit board 530 in the opposite direction). Figure 6 (The right surface in the direction of observation).

[0088] According to one embodiment, the first groove 630 and the second groove 640 may have structures including widths of different dimensions. For example, the first groove 630 and the second groove 640 may be formed to correspond to one end (e.g., the first reinforcing member 610) and the other end (e.g., the second member 620) of the contact connecting member 550. According to one embodiment, the first groove 630 may have a width corresponding to one end of the connecting member 550 (e.g., the first reinforcing member 610) (e.g., the width that can accommodate the first reinforcing member 610), and the second groove 640 may have a width corresponding to the other end of the connecting member 550 (e.g., the second reinforcing member 620) (e.g., the width that can accommodate the second reinforcing member 620). For example, in Figures 6 to 9 In this embodiment, the first groove 630 may be relatively smaller than the second groove 640, and the second groove 640 may have a relatively larger width than the first groove 630. According to some embodiments, the circuit board 530 may not have the first groove 630 and the second groove 640, and may have a structure in which the lower surface of the circuit board 530 contacts (or adheres to) the connecting member 550.

[0089] Reference Figures 6 to 9 Describe the structure of shielding structure 560.

[0090] The shielding structure 560 may include a magnetic shielding member 540 and a non-magnetic connecting member 550. According to one embodiment, the shielding structure 560 may include a shielding member 540 (e.g., a magnetic material) for shielding magnetic forces and a connecting member 550 for securing the shielding member 540 to a circuit board 530. According to one embodiment, the shielding structure 560 may be made of dissimilar materials, such as a magnetic shielding member 540 and a non-magnetic connecting member 550; and the dissimilar materials are bonded to the circuit board 530 using an SMD (Surface Mount Device) method. For example, the shielding member 540 may have the properties of a ferromagnetic material capable of shielding magnetic forces, and the connecting member 550 may have the properties of a non-magnetic material that can be magnetically separated from magnetic forces.

[0091] Reference Figure 7 The shielding member 540 may have a plate-like structure and may contact (physically attach to) one side of the circuit board 530 via the connecting member 550. According to one embodiment, the shielding member 540 may have a curved structure including a first curved portion 740 (e.g., the upper portion in the longitudinal direction in the figure) and / or a second curved portion (e.g., the lower portion in the longitudinal direction in the figure). For example, the shielding member 540 may be at least partially curved.

[0092] According to one embodiment, the bent portion (e.g., the first bent portion 740) of the shielding member 540 may have a shape that is bent in a predetermined direction. According to one embodiment, the bent structure of the shielding member 540 can be designed into a shape by bending the upper or lower portion. or shape Alternatively, the shape can be designed by bending the upper and lower parts. For example, the number of bent portions of the shielding member 540 can be multiple. Figures 6 to 9 An example is shown in which the upper part of the shielding member 540 is designed as a curved structure.

[0093] According to one embodiment, the bent portion (e.g., the first bent portion 740) in the shielding member 540 can be formed in the outward direction of the circuit board 530, for example, in the direction of the device (or the magnetic material of the device) to be shielded. According to one embodiment, the bending angle and bending direction of the bent portion can be varied depending on the size (magnetic force) and / or dimensions (e.g., height) of the magnetic material to be shielded. According to one embodiment, the shielding member 540 may not include the bent portion, or it may be bent at a predetermined angle (e.g., 90°, 120°, 150°) (or radius of curvature). According to one embodiment, the entire height (or length) and / or area of ​​the shielding member 540 can be the same as or relatively larger than the dimensions (e.g., height and / or area) of the magnetic material to be shielded. Thus, greater effects can be expected in terms of magnetic field formation and magnetic shielding using the magnetic material to be shielded.

[0094] According to one embodiment, the shielding member 540 can be designed to have a variable thickness depending on the magnetic force of the magnetic material to be shielded. For example, the shielding member 540 can be designed in thickness sufficient to absorb the magnetism of the magnetic material to be shielded. According to one embodiment, the shielding member 540 can have a thickness of approximately 0.15 mm.

[0095] According to one embodiment, the shielding member 540 can contact (connect to) the circuit board 530 via an SMD method based on the connecting member 550.

[0096] Reference Figure 7 , Figure 8 and Figure 9At least one electronic component may be provided on one side (e.g., the upper side) of the circuit board 530, and the connecting member 550 contacts the other side (lower surface 655) of the circuit board 530. According to one embodiment, the connecting member 550 may have a shape that surrounds the circuit board 530 in a concave (“U”) shape. According to one embodiment, the connecting member 550 may contact fixing recesses (e.g., first recess 630, second recess 640) on both sides (e.g., left portion 635 and right portion 645) of the circuit board 530 and a portion of the lower surface 655 of the circuit board 530.

[0097] According to one embodiment, the connecting member 550 may be, for example, a reinforcing member, which is formed with a plurality of portions (e.g., a first portion, a second portion, and a third portion) divided according to its shape and / or function. According to one embodiment, the connecting member 550 may be divided into: a first reinforcing member 710 (e.g., a vertical member, a rod member), which is a first portion of the reinforcing member and is used to fix to a first groove 630 on one side of the circuit board 530; a second reinforcing member 720, which is a second portion of the reinforcing member and is used to fix to the circuit board 530 through a second groove 640 on the other side of the circuit board 530; or a third reinforcing member 730 (e.g., a bottom member), which is a third portion of the reinforcing member and contacts the lower surface 655 of the circuit board 530.

[0098] According to one embodiment, a first reinforcing member 710 (e.g., a first portion of the reinforcing member) and a second reinforcing member 720 (e.g., a second portion of the reinforcing member) can be vertically fixed to both sides of a third reinforcing member 730 (e.g., a third portion of the reinforcing member). For example, the connecting member 550 can be formed such that a first portion (first region) is provided corresponding to a first groove 630 of the circuit board 530, a second portion (second region) is provided corresponding to a second groove 640 of the circuit board 530, and a third portion (third region) contacts the lower surface of the circuit board 530. According to one embodiment, the connecting member 550 can be formed such that the first reinforcing member 710 (e.g., a first portion of the reinforcing member), the second reinforcing member 720 (e.g., a second portion of the reinforcing member), and the third reinforcing member 730 (e.g., a third portion of the reinforcing member) each have different functions (or different shapes).

[0099] According to one embodiment, in the connecting member 550, one surface 810 (e.g., the inner surface) of the first reinforcing member 710 at one end can contact the first groove 630 of the circuit board 530, and at least one surface 820 (e.g., a portion of the inner surface side) of the second reinforcing member 720 at the other end can contact the second groove 640 of the circuit board 530. According to one embodiment, the shielding member 540 can contact the entire other surface 830 (e.g., the outer surface) of the second reinforcing member 720. For example, one side of the connecting member 550 can contact the other surface 830 of the second reinforcing member 720.

[0100] According to one embodiment, the first reinforcing member 710 and the second reinforcing member 720 may have different widths and lengths (or heights). According to one embodiment, in Figures 6 to 9 In this configuration, the first reinforcing member 710 may have a relatively smaller width and length than the second reinforcing member 720, and the second reinforcing member 720 may have a relatively larger width and length than the first reinforcing member 710 (e.g., a structure including a wide width and a long length). For example, considering the bending prevention and contact force of the shielding member 540, the second reinforcing member 720 may make contact over a larger area.

[0101] According to one embodiment, the first reinforcing member 710 may have a height corresponding to (or equal to) the height of the circuit board 530 (e.g., the upper surface of the circuit board 530). The second reinforcing member 720 may protrude at a height higher than the height of the circuit board 530 (e.g., a structure protruding from the upper surface of the circuit board 530). For example, considering the contact area with the shielding member 540, the second reinforcing member 720 may have a relatively larger area than the first reinforcing member 710. With such a structural shape, one side (e.g., the inner side) of the second reinforcing member 720 can be fixed to and contact the circuit board 530, and its other side (e.g., the outer side) can be more stably fixed to and contact the shielding member 540.

[0102] According to one embodiment, the third reinforcing member 730 may have a shape in which the entire upper surface 830 (or inner surface) contacts the circuit board 530.

[0103] Figures 10 to 14Various embodiments of the shielding structure according to various embodiments of the present disclosure are shown. According to one embodiment, a circuit board (e.g., a PCB) may have a relatively small width w between at least two devices (e.g., a first device, a second device) (e.g., a weak point) and may be more susceptible to damage than other parts of the circuit board. In various embodiments, the shielding structure (e.g., a shielding member, a connecting member) may reinforce the narrowly formed portion (e.g., a weak point) between the devices. According to one embodiment, in a circuit board, the shielding structure may be disposed in a portion (e.g., a weak point) that can benefit from reinforcement, and the shielding structure may reinforce the weak point based on an elongated plate-like structure or a curved structure bent at a predetermined angle (e.g., about 90°). According to one embodiment, the connecting member of the shielding structure may be used as a member for strengthening.

[0104] Figure 10 This is a rear perspective view showing another form of the shielding structure of a contact circuit board according to various embodiments of the present disclosure.

[0105] Figure 10 It is shown in reference Figures 5 to 9 Another form of the shielding structure 560 (e.g., shielding member 540 and connecting member 550) described in the preceding description. According to one embodiment, such as... Figure 10 As shown, the shielding structure 1060 (e.g., shielding member 1040, connecting member 1050) may have a shape (or structure) corresponding to the shielding structure 560 according to the foregoing example, and may also have a function for strengthening the strength of the circuit board 1030 using the connecting member 1050 (e.g., a member for strengthening).

[0106] Reference Figure 10 In circuit board 1030, one end and the other end of connecting member 1050 can contact each other on one side and the opposite side of circuit board 1030 between at least two devices (e.g., a first device (not shown) and a second device (not shown)). According to one embodiment, circuit board 1030 may also have a groove (e.g., for securing connecting member 1050 to at least one of the sides) for fixing the connecting member 1050 to at least one of the sides. Figure 6 The first groove 630, Figure 6 (The second groove 640). According to one embodiment, Figure 10 An example is shown in which a groove is formed, wherein one end of the connecting member 1050 (e.g., the first member 1010) can contact either side of the circuit board 1030 (e.g., the circuit board 1030 on the side of the circuit board 1030). Figure 10 (Left side of the observation direction).

[0107] According to one embodiment, the shielding member 1040 of the shielding structure 1060 can correspond to a reference. Figures 5 to 9The description of the shielding member 540 is provided, and its detailed description will be omitted.

[0108] According to one embodiment, the connecting member 1050 of the shielding structure 1060 can extend further than the reference. Figures 5 to 9 The described connecting member 550 is longer, having a length (or width) longer than the connecting member 550. According to one embodiment, in the circuit board 1030, the portion between two devices (e.g., a first device (not shown), a second device (not shown)) (hereinafter referred to as the weak portion) may have relatively weaker strength than other portions of the circuit board 1030 due to its narrow width w. In various embodiments, the connecting member 1050 of the shielding structure 1060 can be used as a reinforcing member to strengthen the weak portion of the circuit board 1030. For example, the connecting member 1050 can be used as a member for increasing strength.

[0109] According to one implementation method, such as Figure 10 As shown, the connecting member 1050 can extend in a direction corresponding to the longitudinal direction of the weak portion of the circuit board 1030, to have a shape that covers at least a portion (e.g., all or some) of the weak portion. Figure 10 As shown, in circuit board 1030, connecting member 1050 may be formed inwardly with a width w' smaller than the width w of the weak portion, where one end of connecting member 1050 (e.g., the first member 1010) can contact the weak portion in the groove 1015. According to one embodiment, the length of connecting member 1050 may correspond to the length of the weak portion, or may be shorter or longer than the length of the weak portion, depending on the fastening structure of connecting member 1050. According to one embodiment, connecting member 1050 may have a shape corresponding to the shape of the weak portion.

[0110] According to various embodiments, the connecting member 1050 may be disposed in the circuit board 1030 in a specific manner (e.g., formed using an SMD method) to contact the circuit board 1030. In the case of the shielding structure according to various embodiments, the non-magnetic material formed using an SMD method (e.g., the connecting member 1050) may be designed to ensure the largest (or larger) area to be formed using an SMD method, thereby strengthening the weak points in the circuit board 1030 between devices.

[0111] Figure 11 This is a rear perspective view showing another form of the shielding structure of a contact circuit board according to various embodiments of the present disclosure.

[0112] Figure 11 References are shown Figure 10Another form of the shielding structure 1060 described. For example, Figure 11 An example of another structure of the connecting member 1150 of the shielding structure 1160 is shown.

[0113] Reference Figure 11 In circuit board 1130, one end and the other end of connecting member 1150 can respectively contact one side of circuit board 1130 and the opposite side of said side through at least two devices (e.g., a first device (not shown) and a second device (not shown)). According to one embodiment, Figure 11 An example of a structure in which the circuit board 1130 contacts the connecting member 1150 on one side and the other side without forming grooves on one side and the other side is shown.

[0114] According to one embodiment, the shielding member 1140 of the shielding structure 1160 can correspond to a reference. Figures 5 to 10 The shielding component is described, and its detailed description will be omitted.

[0115] According to one embodiment, the connecting member 1150 of the shielding structure 1160 has a reference value. Figure 10 The described connecting member 1050 has a larger extension width, contacting either side of the circuit board 1130 (e.g., the circuit board 1130 is on...). Figure 11 The first member 1110 (on the left side in the direction of observation) may have a length corresponding to the length of the connecting member 1050. According to one embodiment, the connecting member 1150 may have an extension length equal to the height of the side surface of the circuit board 1130 at one end of the weak portion of the circuit board 1130. According to one embodiment, the first member 1110 may have a structure in which the extension portion of the connecting member 1150 bends at the end (or edge portion) of the width w of the weak portion.

[0116] According to one implementation method, such as Figure 11 As shown, the connecting member 1150 may have a length corresponding to the length of the weak portion of the circuit board 1130 and a width corresponding to the width w of the weak portion, so as to be formed into a shape that includes the area corresponding to the weak portion (or covers the entire weak portion).

[0117] Figure 12 This is a rear perspective view showing another form of the shielding structure of a contact circuit board according to various embodiments of the present disclosure.

[0118] Figure 12 References are shown Figure 11 Another form of the shielding structure 1160 described. For example, Figure 12 An example of another structure of the connecting member 1250 of the shielding structure 1260 is shown.

[0119] Reference Figure 12 The circuit board 1230 may include at least one circuit terminal (or contact portion) (e.g., a GND terminal) associated with at least one device (e.g., a first device (not shown) and a second device (not shown)). According to one embodiment, the circuit board 1230 may include circuit terminals for electrical connections to a particular device (e.g., a speaker) in a weak portion. Figure 12 An example is shown in which a hole 1203 for electrical wiring connection is formed in the connecting member 1250 at a position corresponding to a circuit terminal formed in a weak portion.

[0120] According to one embodiment, the shielding member 1240 of the shielding structure 1260 can correspond to a reference. Figures 5 to 10 The shielding component is described, and its detailed description will be omitted.

[0121] According to one embodiment, Figure 12 An example is shown in which two circuit terminals (e.g., GND terminals) for electrical connection to a device are formed in a weak portion of a circuit board 1230. According to one embodiment, the connecting member 1250 may have two holes 1203 at locations corresponding to each location of the circuit terminal. According to one embodiment, connection wiring from the device may be connected to the circuit terminals of the circuit board 1230 exposed through the two holes 1203 of the connecting member 1250. According to one embodiment, as... Figure 12 As shown, when the area of ​​the connecting member 1250 is reduced to avoid the circuit terminals, such as Figure 11 or Figure 12 As shown, the first member 1210 of the connecting member 1250 extends the height of the circuit board 1230 (or the weak part), and the portion extending the height (e.g., the first member 1210) bends at the end in the width direction of the weak part, thereby strengthening the weak part.

[0122] Figure 13 and Figure 14 This is a diagram illustrating a shielding structure in an electronic device for shielding against magnetic forces from a device comprising a magnetic material, according to various embodiments of the present disclosure.

[0123] Reference Figure 13 It schematically shows the device placed in Figures 10 to 12 A diagram showing one side of an electronic component cut in any direction while it is in a certain state.

[0124] Reference Figure 13 The electronic device 1300 may include: a first device 1301 (e.g., Figure 4 The receiver 410 includes a magnetic material 1305; the second device 1302 (e.g., a magnetic material 1305); Figure 4The second device 420, excluding magnetic materials; circuit board 1330 (e.g. Figure 4 The first device 1301 includes a PCB 430; and a shielding structure 1360 for shielding at least a portion of the magnetic force generated between the first device 1301 and the second device 1302. In various embodiments, the first device 1301 includes a magnetic material 1305, but this disclosure is not limited thereto. According to various embodiments, the first device 1301 and the second device 1302 may each include a structure containing a magnetic material. For example, the electronic device 1300 of this disclosure may include a structure in which one device (e.g., the first device 1301) contains a magnetic material and the other device (e.g., the second device 1302) does not contain a magnetic material, or a structure in which one device and at least one other device each contain a magnetic material.

[0125] In various embodiments, the electronic device 1300 may include a structure in which at least a portion of the magnetic force generated by the magnetic material 1305 of the first device 1301 is shielded so as not to affect at least one second device 1302 affected by the magnetic material 1305.

[0126] According to one embodiment, the shielding structure 1360 may include a shielding member 1340 for shielding magnetic forces and a connecting member 1350 for physically fixing the shielding member 1340 to the circuit board 1330.

[0127] In various embodiments, a shielding member 1340 may be disposed between the first device 1301 and the second device 1302. The shielding member 1340 may be made of a shielding material (or a first material metal or magnetic material) capable of shielding at least a portion of the magnetic force between the first device 1301 (or the magnetic material 1305 of the first device 1301) and the second device 1302. According to one embodiment, the shielding material may be a material (metal) that includes properties of ferromagnetic materials. For example, the shielding material may be implemented using SUS (e.g., made of elements or alloys such as iron (Fe), cobalt (Co), and nickel (Ni)).

[0128] In various embodiments, the connecting member 1350 may contact (or be physically connected to) at least a portion of the shielding member 1340 based on a portion of one side (e.g., the outer side), and may contact (or be physically connected to) the circuit board 1330 based on the other side (e.g., the inner side). According to one embodiment, the connecting member 1350 may be made of a non-magnetic material (or a second material metal) that is at least partially magnetically separable from the magnetic force generated between the first device 1301 (or the magnetic material 1305 of the first device 1301) and the second device 1302. According to one embodiment, the non-magnetic material may be a material (metal) unaffected by the magnetic field formed by a magnetic material (e.g., a magnet). For example, the non-magnetic material may be nickel silver (or pure iron).

[0129] According to various embodiments, the shielding structure 1360 (e.g., shielding member 1340, connecting member 1350) can be arranged in a specific manner (e.g., formed by SMD method) in the circuit board 1330 to contact the circuit board 1330. According to one embodiment, in implementing the shielding structure 1360, the shielding member 1340 (e.g., a material for absorbing magnetic fields (e.g., a magnetic material)) and the connecting member 1350 (e.g., an unmagnetized material (e.g., a non-magnetic material)) for shielding magnetic forces can be separated, and the shielding structure can be realized by combining the two materials (e.g., shielding member 1340 and connecting member 1350). In the case of the shielding structure according to one embodiment, the non-magnetic material to be formed by the SMD method (e.g., connecting member 1350) can be designed to ensure a minimal area to be formed by the SMD method; therefore, the contact structure and / or position between the device (or the magnetic material of the device) and the circuit board 1330 can be designed with greater freedom. In the case of the shielding structure according to one embodiment, the non-magnetic material to be formed by the SMD method (e.g., connecting member 1350) can be designed to ensure the largest area to be formed by the SMD method (e.g., the bonding area in the circuit board 1330 to be formed by the SMD method). Thus, in various embodiments, the strength of weak portions of the circuit board 1330 can be enhanced (e.g., torsional reinforcement), and the connecting member 1350 can be bonded to the circuit board 1330 over a large area to prevent the shielding structure 1360 from separating from the circuit board 1330.

[0130] According to various embodiments, the placement position of the shielding member 1340 (e.g., adjacent to the device on either side) can be determined based on whether the functional characteristics (or driving (operation) method) of the devices (e.g., the first device 1301, the second device 1302) are affected by the magnet (or magnetic force or magnetic field) between the first device 1301 and the second device 1302. According to one embodiment, the shielding member 1340 may be positioned closer to (or biased towards) either device (e.g., the first device 1301, which includes magnetic material that affects the operation of the other device), at least based on the functional characteristics of the first device 1301 and the second device 1302. According to one embodiment, the shielding member 1340 may have a different distance and / or thickness than the device in which the placement position is determined to correspond to the magnitude (or magnetic force) of the magnetic material 1305 of the first device 1301 and the magnetic material of the second device 1302 (or the magnetic material of the second device 1302 (not shown)).

[0131] According to various embodiments, the shielding structure 1360 of the electronic device 1300 can be disposed adjacent to a device (e.g., the first device 1301) in devices 1301 and 1302 that emits a relatively strong magnetic flux. According to one embodiment, such as... Figure 13 As shown, the shielding structure 1360 (especially the shielding member 1340) can be positioned closer to the first device 1301 than to the second device 1302.

[0132] According to various embodiments, the shielding member 1340 may have a plate-like structure and may be contacted (physically fixed) on one side of the circuit board 1330 by means of the connecting member 1350. According to one embodiment, the shielding member 1340 may form at least one of the two ends in a curved structure (e.g., the upper or lower part in the length (or height) direction in the figure). For example, the shielding member 1340 may be at least partially curved.

[0133] According to one embodiment, the bent portion of the shielding member 1340 may have a shape that bends in a predetermined direction. According to one embodiment, the bent structure of the shielding member 1340 may be designed by bending the upper or lower portion. or The shape, or can be designed by bending the upper or lower part. The shape. For example, the number of bent portions of the shielding member 1340 can be multiple. According to one embodiment, the shielding member 1340 may not include bent portions and may be formed as a plate-like structure (or flat plate structure, or shape). ),like Figure 13 As shown.

[0134] According to one embodiment, the entire height (or length) and / or area of ​​the shielding member 1340 can be equal to or relatively larger than the dimensions (e.g., height and / or area) of the magnetic material to be shielded. Therefore, greater effectiveness can be expected in terms of utilizing the magnetic field formation and magnetic shielding of the magnetic material to be shielded.

[0135] According to one embodiment, the shielding member 1340 can be designed to have a variable thickness depending on the magnetic force of the magnetic material to be shielded. For example, the thickness of the shielding member 1340 can be designed to completely absorb the magnetism of the magnetic material to be shielded. According to one embodiment, the shielding member 1340 can have a thickness of approximately 0.15 mm. According to one embodiment, the shielding member 1340 can be contacted (connected) to the circuit board 1330 using an SMD method based on the connecting member 1350.

[0136] According to various embodiments, at least one electronic component may be provided on one side of the circuit board 1330 (e.g., the upper side in the figure), and the connecting member 1350 may contact the other side of the circuit board 1330 (e.g., the lower side in the figure).

[0137] According to one embodiment, since at least a portion of the circuit board 1330 has a narrow width w between the first device 1301 and the second device 1302, the circuit board 1330 may include a portion containing relatively weak strength (e.g., a weak portion). In various embodiments, the connecting member 1350 of the shielding structure 1360 may be used as a reinforcing member for strengthening the weak portion of the circuit board 1330. For example, the connecting member 1350 may be used as a member for strengthening. According to one embodiment, the connecting member 1350 of the shielding structure 1360 may surround the weak portion to correspond to the width w of the weak portion. According to one embodiment, the connecting member 1350 may have a concave shape (or shape) The structure surrounds the circuit board 1330 (e.g., a weak portion of the circuit board 1330) in a shape. According to one embodiment, the connecting member 1350 may contact at least one of the two sides of the circuit board 1330 (e.g., at least a portion of the left side, at least a portion of the right side), or the fixing recesses or lower surfaces of the two sides of the circuit board 1330. According to one embodiment, the connecting member 1350 may have a shape... (or shape along the direction of observation) The shape of the curved structure.

[0138] According to one embodiment, the connecting member 1350 may be a reinforcing member formed with multiple portions (e.g., a first portion, a second portion, and a third portion) divided according to its shape and / or function. According to one embodiment, the connecting member 1350 may be divided into: a first reinforcing member (e.g., a vertical member, a rod member), which is the first portion of the reinforcing member and is used to fix it to a first side (e.g., the weakest part of the circuit board 1330). Figure 13 (The groove or left surface of the left side in the direction of observation); the second reinforcing member 1352, which is the second part of the reinforcing member and is used to pass through the second side of the circuit board 1330 (e.g., the weak part of the circuit board 1330 in the second side of the circuit board 1330). Figure 13 The groove or right surface of the right side in the direction of observation is fixed to the circuit board 1330; or the third reinforcing member 1353 (e.g., the bottom member), which is the third part of the reinforcing member and contacts the lower surface of the circuit board 1330.

[0139] According to one embodiment, a first reinforcing member 1351 (e.g., a first portion of a reinforcing member) and a second reinforcing member 1352 (e.g., a second portion of a reinforcing member) can be vertically fixed to both sides of a third reinforcing member 1353 (e.g., a third portion of a reinforcing member). For example, the connecting member 1350 can be formed such that a first portion (first region) corresponds to a first surface of the circuit board 1330 (e.g., the left side in the figure), a second portion (second region) corresponds to a second surface of the circuit board 1330 (e.g., the right side in the figure), and a third portion (third region) contacts the lower surface of the circuit board 1330. According to one embodiment, the connecting member 1350 can be formed such that the first reinforcing member 1351 (e.g., a first portion of a reinforcing member), the second reinforcing member 1352 (e.g., a second portion of a reinforcing member), or the third reinforcing member 1353 (e.g., a third portion of a reinforcing member) has different functions (or different shapes).

[0140] According to one embodiment, in the connecting member 1350, one surface (e.g., the inner surface) of the first reinforcing member 1351 at one end can contact the first surface of the circuit board 1330, and at least one surface (e.g., a portion of the inner surface side) of the second reinforcing member 1352 at the other end can contact the second surface of the circuit board 1330. According to one embodiment, the shielding member 1340 can contact the other surface (e.g., the outer surface) of the second reinforcing member 1352.

[0141] According to one embodiment, the first reinforcing member 1351 and the second reinforcing member 1352 can be formed as structures including widths or lengths (or heights) of corresponding or different dimensions. According to one embodiment, the second reinforcing member 1352 may have a relatively smaller width and length than the first reinforcing member 1351, and the first reinforcing member 1351 may have a structure including a relatively larger width and length than the second reinforcing member 1352 (e.g., a structure including a wide width and a long length). For example, considering the bending prevention and contact force of the shielding member 1340, the first reinforcing member 1351 can contact the shielding member 1340 over a larger area.

[0142] According to one embodiment, the second reinforcing member 1352 may have a height corresponding to (or equal to) the height of the circuit board 1330 (e.g., a weak portion) (e.g., up to the upper surface of the circuit board 1330). The first reinforcing member 1351 may protrude to a height greater than the height of the circuit board 1330 (e.g., a structure that protrudes further than the upper surface of the circuit board 1330). According to one embodiment, the third reinforcing member 1353 may have a shape in which its entire upper surface (or inner surface) contacts the circuit board 1330 (e.g., a weak portion of the circuit board 1330).

[0143] According to one embodiment, the connecting member 1350 may have a concave (or shaped) form based on the overall shape of the first reinforcing member 1351, the second reinforcing member 1352, and the third reinforcing member 1353. The structure surrounds the weak portion of the circuit board 1330. According to one embodiment, the connecting member 1350 may have a shape based on the overall shape of the first reinforcing member 1351 and the third reinforcing member 1353, excluding the second reinforcing member 1352. (or shape along the direction of observation) The shape of the curved structure.

[0144] Figure 14 It shows that from Figure 13 The shielding structure 1360 (especially the connecting member 1350) and part of the circuit board 1330 (e.g., weak part 1410) at the observation point of the first device 1301 are viewed from the second device 1302 side.

[0145] like Figure 14 As shown, in the connecting member 1350, a third reinforcing member 1353 is stacked on the circuit board 1330, a second reinforcing member 1352 is bent, and at least a portion of the third reinforcing member 1353 extends to a length corresponding to the height H of the circuit board 1330.

[0146] According to one embodiment, the weak portion 1410 of the circuit board 1330 may have a predetermined length (hereinafter referred to as "length L"), and the third reinforcing member 1353 of the connecting member 1350 may be stacked in a shape including a length corresponding to length L, a length shorter than length L, or a length longer than length L. Figure 14 An example is shown in which the third reinforcing member 1353 is formed to be longer than the length L formed by the weak part 1410.

[0147] According to one embodiment, the second reinforcing member 1352 of the connecting member 1350 can be bent from the third reinforcing member 1353 to have a length corresponding to or smaller than the length L of the weak portion 1410. Figure 14 An example is shown in which the second reinforcing member 1352 is formed with a length corresponding to the length L formed in the weak portion 1410. According to one embodiment, when a groove for fixing and mounting the second reinforcing member 1352 is formed in the weak portion 1410 of the circuit board 1330, the second reinforcing member 1352 may have a length corresponding to or less than the length (or width) of the groove in the weak portion 1410.

[0148] Figure 15 , Figure 16 and Figure 17 This is a diagram illustrating the structure of the magnetic force between the shielding devices in various embodiments of the present disclosure.

[0149] Reference Figure 15 The first device 1501, the second device 1502 and the third device 1503 can be disposed on a circuit board (not shown), and the second device 1502 and the third device 1503 can each be disposed adjacent to the first device 1501 so as to be affected by the magnetic force generated by the magnetic material 1500 of the first device 1501.

[0150] According to one implementation method, such as Figure 15 As shown, the first device 1501 may be a speaker (or receiver) including a magnetic material 1500, the second device 1502 may be a rear camera disposed adjacent to the first device 1501 and affected by the magnetic flux of the magnetic material 1500, and the third device 1503 may be a front camera disposed adjacent to the first device 1501 and affected by the magnetic flux of the magnetic material 1500. Although not shown in Figure 15 As shown, however, a weak portion of the circuit board may be formed between the first device 1501, the second device 1502, or the third device 1503, and a shielding structure may be formed in the weak portion. Figure 15 The shielding member 1540 in the shielding structure is shown schematically.

[0151] Reference Figure 15In various embodiments, the shielding member 1540 may have shielding structures at the shielding space between the first device 1501 and the second device 1502 (hereinafter referred to as the "first shielding space") and the shielding space between the first device 1501 and the third device 1503 (hereinafter referred to as the "second shielding space") to avoid affecting the second device 1502 and the third device 1503 affected by the magnetic material 1500. According to one embodiment, the shielding member 1540 may have a structure that bends around (or based on) the first device 1501 (or the magnetic material 1500 of the first device 1501) to shield the magnetic force of the magnetic material 1500 in the first shielding space and the second shielding space. For example, the shielding member 1540 may be at least partially bent to shield each space between the devices (e.g., the first shielding space, the second shielding space).

[0152] According to one embodiment, the shielding member 1540 may have a curved shape in a predetermined direction. According to one embodiment, the curved structure of the shielding member 1540 may be designed as follows: or The shape, or can be designed into or The shape of the shielding member 1540. For example, the shielding member 1540 can be configured to shield the entire shielding space based on the location (e.g., arrangement) and number of devices to be shielded. According to one embodiment, a shielding member 1540 can shield the magnetic forces of multiple devices around it through a curved structure of the shielding member 1540. According to one embodiment, although not shown, the shielding member 1540 can be fixed by a connecting member (not shown) formed in any of the weak points formed between the devices on the circuit board.

[0153] Reference Figure 16 The first device 1601, the second device 1602 and the third device 1603 can be disposed on a circuit board (not shown). The second device 1602 can be disposed adjacent to the first device 1601 and the third device 1603 can be disposed adjacent to the second device 1602. The second device 1602 and the third device 1603 can be affected by the magnetic force generated by the magnetic material 1600 of the first device 1601.

[0154] According to one implementation method, such as Figure 16As shown, the first device 1601 may be a speaker (or receiver) including a magnetic material 1600, the second device 1602 may be a first rear camera disposed adjacent to the first device 1601 and affected by the magnetic flux of the magnetic material 1600, and the third device 1603 may be a second rear camera disposed adjacent to the second device 1602 but affected by the magnetic flux of the magnetic material 1600. For example, Figure 16 An example is shown in which the magnetic material 1600 has an effect on the third device 1603. Although not shown in… Figure 16 As shown, however, a weak portion of the circuit board may be formed between the first device 1601, the second device 1602, or the third device 1603, and a shielding structure may be formed in the weak portion. Figure 16 The shielding member 1640 in the shielding structure is shown schematically.

[0155] Reference Figure 16 In various embodiments, the shielding member 1640 may have a shielding structure such that the second device 1602 and the third device 1603 are unaffected by the magnetic material 1600 in the shielding space between the first device 1601 and the second device 1602 (hereinafter referred to as the "first shielding space") and the shielding space between the first device 1601 and the third device 1603 (hereinafter referred to as the "second shielding space"). According to one embodiment, the shielding member 1640 may extend its length to shield the magnetic force of the magnetic material 1600 in the first and second shielding spaces. For example, the shielding member 1640 may be formed as long as the second device 1602 and the third device 1603, thereby shielding both the second device 1602 and the third device 1603. According to one embodiment, the shielding member 1640 may be formed as a flat plate structure (or shape) extending to a length to cover both the second device 1602 and the third device 1603. According to one embodiment, although not in Figure 16 As shown in, but in Figure 16 In the arrangement structure of the device shown, the shielding member 1640 is formed as follows: Figure 15 The curved structure shown may include a shielding member 1640 that can shield the magnetic material 1600 so that the magnetic material 1600 does not affect the structure of the second device 1602 and the third device 1603.

[0156] Reference Figure 17The first device 1701, the second device 1702 and the third device 1703 can be disposed on a circuit board (not shown). The second device 1702 can be disposed adjacent to the first device 1701, and the third device 1703 can be disposed adjacent to the second device 1702. Only the second device 1702 can be affected by the magnetic force generated by the magnetic material 1700 of the first device 1701.

[0157] According to one implementation method, such as Figure 17 As shown, the first device 1701 may be a speaker (or receiver) including a magnetic material 1700, the second device 1702 may be a first rear camera positioned adjacent to and below the first device 1701 and affected by the magnetic flux of the magnetic material 1700, and the third device 1703 may be a second rear camera positioned adjacent to and next to the second device 1702 but not affected by the magnetic flux of the magnetic material 1700. For example, Figure 17 An example is shown in which the influence of the magnetic material 1700 does not reach the third device 1703.

[0158] Reference Figure 17 In various embodiments, the shielding member 1740 may include a shielding structure such that the second device 1702 is unaffected by the magnetic material 1700 in the space between the first device 1701 and the second device 1702 affected by the magnetic material 1700 (hereinafter referred to as the shielding space). According to one embodiment, the shielding member 1740 may form the magnetic force of the magnetic material 1700 in the shielding space to be as long as the shieldable length. For example, with... Figure 16 Compared to the shielding member 1640, the shielding member 1740 can be formed along the length of the second device 1602, thereby shielding only the second device 1602. According to one embodiment, the shielding member 1740 can be formed as a flat plate structure (or shape) capable of covering the second device 1702. ).

[0159] An electronic device according to various embodiments includes: a first device 510 including a first magnetic material 515; a second device 520 including a second magnetic material 525; and a shielding structure 560 for shielding at least a portion of the magnetic force generated between the first magnetic material 515 and the second magnetic material 525, wherein the shielding structure 560 includes a shielding member 540 disposed between the first device 510 and the second device 520 and having the properties of a magnetic material, and a connecting member 550 physically connected to at least a portion of the shielding member 540 and having the properties of a non-magnetic material, wherein at least a portion of the connecting member 550 is physically connected to a circuit board 530.

[0160] According to various embodiments, the shielding member 540 may be made of a magnetic material capable of shielding at least part of the magnetic force.

[0161] According to various embodiments, the shielding member 540 can be formed using SUS, which includes properties of ferromagnetic materials.

[0162] According to various embodiments, the connecting member 550 may be made of a non-magnetic material that can be at least partially magnetically separable from the magnetic material.

[0163] According to various implementation methods, non-magnetic materials can be made of metals that are unaffected by magnetic fields.

[0164] Depending on the implementation method, the metal may include nickel or silver.

[0165] According to various embodiments, the shielding member 540 and the connecting member 550 can be made in contact with each other using the SMD method.

[0166] According to various embodiments, at least one end of the shielding member 540 may be formed as a curved structure.

[0167] According to various embodiments, grooves (e.g., first groove 630 and second groove 640) for fixing the connecting member 550 may be formed in the circuit board 530.

[0168] According to various embodiments, the connecting member 550 may include: first reinforcing members 610 and 710, including a surface of a first groove 630 that contacts the circuit board 530; second reinforcing members 620 and 720, including a surface of a second groove 640 that contacts the circuit board 530; and a third reinforcing member 730, including an upper surface of a lower surface 655 that contacts the circuit board 530.

[0169] According to various embodiments, other surfaces of the second reinforcing members 620 and 720 may contact one surface of the shielding member 540.

[0170] According to various embodiments, the first reinforcing members 610 and 710 and the second reinforcing members 720 and 720 can be vertically fixed to both sides of the third reinforcing member 730.

[0171] According to various embodiments, the first reinforcing members 610 and 710 and the second reinforcing members 620 and 720 may have different widths and lengths.

[0172] According to various implementation methods, the circuit board (e.g.) Figure 10 The circuit board 1030 may include a weak portion that can benefit from reinforcement between the first and second devices, a shielding structure (e.g. Figure 10 The shielding structure 1060 can be placed at the weak part, and the shielding structure can use an elongated plate structure or a curved structure to strengthen the weak part.

[0173] According to various embodiments, the connecting member (e.g.) Figure 10 The connecting member 1050 in the middle can be used as a member to strengthen the weak part.

[0174] According to various embodiments, the connecting member (e.g.) Figure 10 The connecting member 1050 may have a length and width corresponding to the length and width of the weak part.

[0175] According to various embodiments, the shielding member 540 may be positioned closer to (or biased toward) any device (e.g., the first device 510) at least based on the functional characteristics of the first device 510 and the second device 520.

[0176] According to various implementations, functional characteristics may include features that vary depending on whether the device's driving method is affected by magnetic force.

[0177] According to various embodiments, the shielding member 540 may be larger than or equal to the size of the magnetic material to be shielded (e.g., the first magnetic material 515).

[0178] According to various embodiments, at the distance (e.g., length A) between the first device 510 and the second device 520, the distance (e.g., length B) between the shielding member 540 and another magnetic object (e.g., the first magnetic material 515) that will not be shielded can be the maximum separation distance.

[0179] An electronic device according to various embodiments includes: a circuit board 530; a first device 510 including a first magnetic material 515; a second device 520 including a second magnetic material 525; and a shielding structure 560 for shielding at least a portion of the magnetic force generated between the first magnetic material 515 and the second magnetic material 525, wherein the shielding structure 560 includes a shielding member 540 disposed between the first device 510 and the second device 520 and having the properties of a magnetic material capable of shielding at least a portion of the magnetic force, and a connecting member 550 physically connected to at least a portion of the shielding member 540 and fixed to the circuit board 530, the connecting member 550 having the properties of a non-magnetic material that can be magnetically separated from at least a portion of the magnetic force.

[0180] According to various embodiments, at least a portion of the connecting member 550 may be physically connected to the circuit board 530, and at least another portion may be physically connected to the shielding member 540.

[0181] According to various embodiments, the shielding member 540 may be positioned closer to (or biased toward) either device (e.g., the first device 510) based at least on the functional characteristics of the first device 510 and the second device 520, but the distance (e.g., length B) between the shielding member 540 and another magnetic material (e.g., the second magnetic material 525) that will not be shielded may be set to have a maximum separation distance and may be equal to or greater than the size of the magnetic material to be shielded.

[0182] An electronic device according to various embodiments includes: a device (e.g., a first device 510) including a magnetic material; a circuit board 530; and a shielding structure 560 for shielding at least a portion of a magnetic field generated by the magnetic material, wherein the shielding structure 560 includes a shielding member 540 disposed between the device (e.g., the first device) and another device included in the electronic device (e.g., a second device excluding the magnetic material) and having the properties of a ferromagnetic material capable of shielding at least a portion of the magnetic field, and a connecting member 550 physically connected between at least a portion of the shielding member 540 and the circuit board 530, wherein the connecting member 550 has the properties of a nonmagnetic material that can be magnetically separated from at least a portion of the magnetic field.

[0183] According to various embodiments, the shielding member 540 and the connecting member 550 can be connected using the SMD method.

[0184] According to various embodiments, the shielding member 540 can be at least partially bent.

[0185] According to various embodiments, in the connecting member 550, the first members 610 and 710 may be configured as a first groove 630 corresponding to the circuit board 530, the second members 620 and 720 may be configured as a second groove 640 corresponding to the circuit board 530, the third regions 630 and 730 may contact the lower surface 655 of the circuit board 530, the first region 710 and the second region may be vertically fixed to both sides of the third region, and the second region may contact at least a portion of the shielding member 540.

[0186] Although this disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. A mobile electronic device, comprising: The first device includes a first magnetic component; The second device includes a second magnetic component; The circuit board includes a relatively weak section of weak strength between the first device and the second device; A first metal component is configured to shield the magnetic force generated by the first magnetic component from the second device; as well as A second metal component is configured to reinforce the weak portion of the circuit board. The first metal component is disposed between the first device and the second device in a vertical orientation relative to the circuit board. The first metal component and the second metal component are attached to each other, and The first metal component is formed of a metal material different from the metal material forming the second metal component.

2. The mobile electronic device according to claim 1, wherein the first metal component has a plate-like structure capable of shielding the magnetic force generated between the first device and the second device.

3. The mobile electronic device of claim 1, wherein the first metal member is positioned closer to either the first device or the second device.

4. The mobile electronic device of claim 1, wherein the second metal component is made of a metal that is not affected by the magnetic force generated by the first magnetic component in the first device.

5. The mobile electronic device of claim 1, wherein the first metal component is made of a first element or an alloy based on the first element.

6. The mobile electronic device according to claim 5, wherein the first element comprises cobalt (Co).

7. The mobile electronic device of claim 1, wherein the second metal component is made of a second element or an alloy based on the second element and is non-magnetic.

8. The mobile electronic device according to claim 7, wherein the second element comprises at least one of iron (Fe) or nickel (Ni).

9. The mobile electronic device of claim 1, wherein the first metal component and the second metal component are in contact with each other using a surface mount device (SMD) method.

10. The mobile electronic device of claim 1, wherein the first metal member is at least partially bent.

11. The mobile electronic device of claim 1, wherein the circuit board has a groove configured to secure the second metal member.

12. The mobile electronic device of claim 1, wherein at least a portion of the first metal member is physically connected to the circuit board via the second metal member.

13. The mobile electronic device of claim 12, wherein the second metal component is adhered to a surface of the circuit board.

14. The mobile electronic device of claim 12, wherein the first metal member and the second metal member are formed perpendicularly.

15. The mobile electronic device of claim 1, wherein the first metal member and the second metal member have different widths and lengths.

16. The mobile electronic device of claim 1, wherein the first metal component comprises the properties of a magnetic material for the shielding.

17. The mobile electronic device of claim 16, wherein at least a portion of the first metal member is directly connected to at least a portion of the second metal member on one side.

18. The mobile electronic device of claim 1, wherein the first metal component is positioned closer to one of the devices based at least on the functional characteristics of the first device and the second device.

19. A mobile electronic device, comprising: The first component includes a first magnetic member; The second component includes a second magnetic member; The circuit board includes a relatively weak section of weak strength between the first component and the second component; The first metal component is arranged to stand vertically relative to the circuit board, thereby absorbing the magnetic flux generated by the first magnetic component. as well as A second metal component is configured to reinforce the weak portion of the circuit board. The first metal component and the second metal component are attached to each other, and The first metal component is formed of a metal material, which has a stronger magnetic flux absorption performance than the metal material forming the second metal component.

20. The mobile electronic device of claim 19, wherein the second component corresponds to a camera component, and the first metal member is made of an alloy including cobalt (Co) to shield the autofocus mechanism of the camera component from the magnetic flux of the first magnetic member.

Images