A kind of light sound-insulating phenolic resin and preparation method thereof

Abstract

The present invention belongs to the technical field of polymer materials, and specifically relates to a light sound-insulating phenolic resin and a preparation method thereof. By weight, the raw materials for preparing the light sound-insulating phenolic resin include: 60-80 parts of phenol, 30-40 parts of paraformaldehyde, 30-40 parts of p-coumarol, 1-2 parts of catalyst, 15-20 parts of sound-insulating material, and 5-8 parts of toughening agent; the sound-insulating material is selected from one or more of vinyl silane-modified hollow microspheres, vinyl silane-modified mica sheets, and graphene oxide. The preparation method of light sound-insulating phenolic resin comprises the following steps: mixing phenol, p-coumarol and a catalyst, adding paraformaldehyde, reacting at 70-100°C for 4-6h, and obtaining a primary product; adding a sound-insulating material and a toughening agent, reacting at 100-130°C and stirring for 0.5-1h, and obtaining a light sound-insulating phenolic resin. The phenolic resin prepared in this application has good sound insulation effect and high toughness.

Description

Technical Field

[0001] The invention belongs to the technical field of polymer materials, and in particular relates to a lightweight sound-insulating phenolic resin and a preparation method thereof. Background Art

[0002] In cities with high population density, many residents live in high-rise concrete buildings. Traffic is convenient near the buildings, vehicles pass by frequently, and noise problems are more serious. Traditional brick walls do not play a big role in sound insulation, which makes the demand for sound insulation materials increasingly greater. Sound insulation mortar can improve the sound insulation effect of brick walls. At present, the main damping materials such as rubber particles and vitrified microspheres are used to compound the sound insulation effect of the mortar. However, the content of rubber particles and vitrified microspheres with sound insulation effect in the mortar is relatively large, which is easy to reduce the strength of the mortar.

[0003] Mortar is generally composed of water, fine aggregate, coarse aggregate and admixtures. Adding phenolic resin to mortar significantly improves the strength, impermeability, electrical resistance, frost resistance, high temperature resistance and chemical resistance of mortar. Mortar containing phenolic resin has broad development prospects in the field of building materials. However, traditional unmodified phenolic resin does not have sound insulation effect and has poor toughness.

[0004] Therefore, the present application urgently needs to develop a sound-insulating phenolic resin with good toughness. Summary of the invention

[0005] In order to improve the sound insulation effect and toughness of phenolic resin, the present application provides a lightweight sound insulation phenolic resin and a preparation method thereof.

[0006] In a first aspect, the present application provides a lightweight sound-insulating phenolic resin, which is implemented by the following technical solution:

[0007] A lightweight sound-insulating phenolic resin, wherein the raw materials for its preparation include, by weight: 60-80 parts of phenol, 30-40 parts of paraformaldehyde, 30-40 parts of p-coumarol, 1-2 parts of a catalyst, 15-20 parts of a sound-insulating material, and 5-8 parts of a toughening agent;

[0008] The sound insulation material is selected from one or more of vinyl silane modified hollow microspheres, vinyl silane modified mica sheets and graphene oxide.

[0009] By adopting the above technical scheme, the vinyl silane-modified hollow microspheres increase the affinity between the vinyl silane-modified hollow microspheres and other components by treating the surface of the hollow microspheres, and the compressive strength of the mortar will not be reduced due to the high content of the vinyl silane-modified hollow microspheres, and the vinyl silane-modified hollow microspheres have a more significant sound insulation effect; the vinyl silane-modified mica flakes modify the surface of the mica, which is not easy to agglomerate, reduces the surface polarity of the mica flakes, and improves the compatibility between the mica flakes and other components. The vinyl silane-modified mica flakes are evenly dispersed in the system, which improves the toughness of the system. At the same time, it can limit the movement between the long chains of macromolecules inside the sound insulation material, increase energy loss, and achieve the sound insulation effect; the graphene oxide contains a honeycomb structure, which not only improves the sound insulation effect of the phenolic resin, but also the surface of the graphene oxide contains rich oxygen-containing groups carboxyl and hydroxyl, which can interact with the alcohol hydroxyl group on the coumarin, and also improve the toughness of the phenolic resin. The graphene oxide has a large specific surface area, which can effectively disperse the attached materials, prevent agglomeration, and improve the compressive strength of the mortar. p-Coumarol has phenolic hydroxyl groups and can replace part of phenol to react with polyformaldehyde to generate phenolic resin. p-Coumarol has carbon-carbon unsaturated bonds, which can improve the crosslinking degree of phenolic resin and the toughness of phenolic resin. It is also beneficial to improve the compatibility of vinyl silane-modified hollow microspheres and vinyl silane-modified mica sheets, and improve the compressive strength of mortar. The addition of toughening agents improves the toughness of phenolic resin.

[0010] Preferably, the sound insulation material is formed by mixing vinyl silane modified hollow microspheres, vinyl silane modified mica sheets and graphene oxide in a mass ratio of 1:(1.5-2.5):(0.05-0.08).

[0011] By adopting the above technical scheme, the sound insulation material composed of vinyl silane modified hollow microspheres, vinyl silane modified mica sheets and graphene oxide significantly improves the sound insulation effect and toughness of phenolic resin and the compressive strength of mortar due to the synergistic effect among the vinyl silane modified hollow microspheres, vinyl silane modified mica sheets and graphene oxide.

[0012] Preferably, the toughening agent is formed by mixing carboxyl nitrile rubber and polyvinyl alcohol in a mass ratio of 1:(0.3-0.5).

[0013] By adopting the above technical solution, carboxyl nitrile rubber and polyvinyl alcohol are compounded as toughening agents, and there is a synergistic effect between the two, which significantly improves the toughness of the phenolic resin.

[0014] Preferably, the graphene oxide is modified graphene oxide; and the method for preparing the modified graphene oxide comprises the following steps:

[0015] S1, adding an acyl chloride reagent to graphene oxide to react, to obtain graphene oxide acyl chloride;

[0016] S2, adding an initiator solution to activate graphene oxide acyl chloride;

[0017] S3, adding isoprene solution, polymerizing, introducing polymer chains on the surface of activated graphene oxide acyl chloride, adding a capping agent to adjust the polymer chains, and obtaining modified graphene oxide.

[0018] By adopting the above technical scheme, the modified graphene oxide contains polyisoprene, which does not destroy the original honeycomb structure of the graphene oxide, but can form an effective micro-honeycomb structure, which can improve the barrier and refraction ability of the modified graphene oxide to sound, thereby improving the sound insulation effect of the sound insulation material, and the modified graphene oxide has better compatibility with vinyl silane-modified hollow microbeads and vinyl silane-modified mica sheets, which can improve the toughness of the phenolic resin to a certain extent and improve the compressive strength of the mortar.

[0019] Preferably, the capping agent is 3-methacryloxypropyltrimethoxysilane.

[0020] 3-Methacryloxypropyltrimethoxysilane is used as a capping agent, which can terminate the polymerization reaction of isoprene and introduce the 3-methacryloxypropyltrimethoxysilane structure on the surface of graphene oxide, thereby improving the bonding force between graphene oxide and polyisoprene, and also improving the compatibility of modified graphene oxide with vinyl silane-modified hollow microspheres and vinyl silane-modified mica sheets, thereby improving the toughness and sound insulation effect of phenolic resin and the compressive strength of mortar.

[0021] Preferably, the raw materials for preparing the vinylsilane-modified hollow microspheres include vinylsilane and hollow microspheres; the mass ratio of the vinylsilane to the hollow microspheres is (0.2-0.3):1.

[0022] By adopting the above technical solution, vinyl silane is introduced on the surface of hollow microspheres, which not only does not reduce the sound insulation effect of the hollow microspheres, but also improves the dispersibility of the hollow microspheres in the system and the compatibility with other components, thereby improving the compressive strength of the mortar.

[0023] Preferably, the diameter of the hollow microspheres is 300-500 μm.

[0024] The larger the diameter of the hollow microspheres, the higher the hollow ratio of the hollow microspheres. However, when the hollow ratio of the hollow microspheres is too high, the sound insulation effect of the hollow microspheres will be reduced. Moreover, when the diameter of the hollow microspheres is too large, the dispersion uniformity of the hollow microspheres is poor, which will reduce the compatibility of the hollow microspheres with other components. During the research process, the applicant found that hollow microspheres with a diameter of 300-500 μm have good sound insulation effect, excellent compatibility with other components, and can be evenly dispersed in the system.

[0025] Preferably, the vinyl silane is 3-methacryloxypropyltrimethoxysilane.

[0026] By adopting the above technical scheme, 3-methacryloxypropyltrimethoxysilane contains -C=C- and -COO- groups, and -COO- can further improve the compatibility between vinyl silane-modified hollow microspheres and graphene oxide, thereby improving the sound insulation effect and toughness of phenolic resin, and also improving the compressive strength of mortar to a certain extent.

[0027] Preferably, the vinyl silane-modified mica sheet is a 3-methacryloxypropyltrimethoxysilane-modified mica sheet.

[0028] 3-Methacryloyloxypropyltrimethoxysilane modified mica flakes are more evenly dispersed in the system and have better compatibility with other components, which is conducive to promoting the synergistic effect of vinyl silane modified hollow microspheres, vinyl silane modified mica flakes and graphene oxide, thereby improving the sound insulation effect and toughness of phenolic resin and the compressive strength of mortar.

[0029] In a second aspect, the present application provides a method for preparing a lightweight sound-insulating phenolic resin, which is implemented by the following technical solution: A method for preparing a lightweight sound-insulating phenolic resin comprises the following steps:

[0030] Step 1: Mix phenol, p-coumarol and a catalyst, add paraformaldehyde, and react at 70-100° C. for 4-6 hours to obtain a primary product;

[0031] Step 2: Add sound insulation material and toughening agent, react at 100-130° C. with stirring for 0.5-1h to obtain lightweight sound insulation phenolic resin.

[0032] The preparation method of the lightweight sound-insulating phenolic resin provided in the present application has simple steps, low cost, and is suitable for industrial production.

[0033] In summary, this application has the following beneficial effects:

[0034] 1. This application uses p-coumarol to replace part of phenol, thereby improving the toughness of phenolic resin; and uses one or more of vinyl silane-modified hollow microspheres, vinyl silane-modified mica sheets and graphene oxide as sound insulation materials to improve the sound insulation effect of phenolic resin and the compressive strength of mortar.

[0035] 2. This application uses a sound insulation material composed of vinyl silane-modified hollow microspheres, vinyl silane-modified mica sheets and graphene oxide, which significantly improves the sound insulation effect and toughness of phenolic resin and the compressive strength of mortar.

[0036] 3. This application uses a compound of carboxylated nitrile rubber and polyvinyl alcohol as a toughening agent, which significantly improves the toughness of the phenolic resin.

[0037] 4. The modified graphene oxide in the present application contains polyisoprene, which can improve the sound barrier and refraction ability of the modified graphene oxide, thereby improving the sound insulation effect of the sound insulation material. The modified graphene oxide has better compatibility with vinyl silane-modified hollow microspheres and vinyl silane-modified mica sheets, which can improve the toughness of phenolic resin to a certain extent and improve the compressive strength of mortar.

[0038] 5. This application uses hollow microspheres with a diameter of 300-500 μm, which have good sound insulation effect, excellent compatibility with other components, and can be evenly dispersed in the system. DETAILED DESCRIPTION

[0039] The present application is further described in detail below with reference to the embodiments.

[0040] Preparation Example

[0041] Preparation Example 1-6 provides a vinylsilane-modified hollow microsphere, and Preparation Example 1 is used as an example for description below.

[0042] The preparation steps of the vinylsilane-modified hollow microspheres provided in Preparation Example 1 are as follows:

[0043] 200 g of hollow microspheres (200 μm in diameter) were added to 5 L of 50% sodium hydroxide aqueous solution, stirred at 25 ° C for 2 h to hydroxylate the surface of the hollow microspheres, filtered, washed with deionized water 10 times, vacuum dried at 80 ° C for 6 h, added to 5 L of ethanol, and then added with 40 g of vinyltriethoxysilane, stirred and reacted at 60 ° C for 5 h, filtered, washed with deionized water 3 times, and vacuum dried at 60 ° C for 6 h to obtain vinylsilane-modified hollow microspheres.

[0044] Preparation Example 2 is different from Preparation Example 1 only in that the mass of vinyltriethoxysilane is 60 g.

[0045] Preparation Example 3 is different from Preparation Example 2 only in that the mass of vinyl triethoxysilane is replaced by 3-methacryloxypropyl trimethoxysilane.

[0046] Preparation Example 4 is different from Preparation Example 3 only in that the diameter of the hollow microspheres is 300 μm.

[0047] Preparation Example 5 is different from Preparation Example 3 only in that the diameter of the hollow microspheres is 500 μm.

[0048] Preparation Example 6 is different from Preparation Example 3 only in that the diameter of the hollow microspheres is 700 μm.

[0049] Preparation Example 7-8 provides a vinylsilane-modified mica sheet, and Preparation Example 7 is used as an example for explanation below.

[0050] The vinylsilane-modified mica sheet provided in Preparation Example 7 is prepared in the following steps:

[0051] 400 g of mica flakes were added to 10 L of 50% sodium hydroxide aqueous solution, stirred at 25 ° C for 2 h to hydroxylate the surface of the mica flakes, filtered, washed with deionized water 10 times, vacuum dried at 80 ° C for 6 h, added to 10 L of ethanol, and then added with 80 g of vinyltriethoxysilane, stirred and reacted at 60 ° C for 5 h, filtered, washed with deionized water 3 times, and vacuum dried at 60 ° C for 6 h to obtain vinylsilane-modified mica flakes.

[0052] Preparation Example 8 is different from Preparation Example 7 only in that the mass of vinyl triethoxysilane is replaced by 3-methacryloxypropyl trimethoxysilane.

[0053] Preparation Examples 9-11 provide a modified graphene oxide, and Preparation Example 9 is used as an example for explanation below.

[0054] The modified graphene oxide provided in Preparation Example 9 is prepared in the following steps:

[0055] S1. Add 1L SOCl to 10g graphene oxide 2 , 200 mL of anhydrous DMF, reflux at 80°C for 20 h, centrifuge and wash 5 times with anhydrous DMF, and vacuum dry at 80°C for 6 h to obtain graphene oxide chloride;

[0056] S2. Under a nitrogen atmosphere, 1 L of anhydrous THF and 30 g of benzoyl peroxide were mixed evenly to obtain an initiator solution, and 10 g of the graphene oxide chloride obtained in step S1 was added, and the mixture was refluxed at 75° C. for 48 h. After centrifugation, the mixture was washed three times with anhydrous THF by centrifugation, and vacuum dried at 60° C. for 6 h to obtain activated graphene oxide chloride;

[0057] S3. Under a nitrogen atmosphere, 1.5 g CuBr, 2 g pentamethyldiethylenetriamine, 500 mL anhydrous toluene and 50 g isoprene were mixed to obtain an isoprene solution, and then 10 g of the activated graphene oxide chloride obtained in step S2 was added, and the mixture was stirred and refluxed at 95 ° C for 96 h, and a polymer chain was introduced on the surface of the activated graphene oxide chloride. Then 10 g of γ-(2,3-epoxypropoxy)propyltrimethoxysilane was added, and the mixture was stirred for 1 h. The mixture was then quenched with liquid nitrogen, centrifuged and washed with anhydrous toluene until the supernatant was colorless, and dried under vacuum at 80 ° C for 12 h to obtain modified graphene oxide.

[0058] Preparation Example 10 is different from Preparation Example 9 only in that γ-(2,3-epoxypropyloxy)propyltrimethoxysilane is replaced by 3-methacryloxypropyltrimethoxysilane.

[0059] Preparation Example 11 is different from Preparation Example 9 only in that isoprene is replaced by styrene.

[0060] Example

[0061] Embodiments 1-20 provide a lightweight sound-insulating phenolic resin, which is described below using Embodiment 1 as an example.

[0062] The lightweight sound-insulating phenolic resin provided in Example 1 is prepared by the following steps:

[0063] Step 1: 600 g of phenol, 300 g of p-coumarol and 10 g of 2,2-dimethylolpropionic acid were mixed, 300 g of paraformaldehyde was added, the mixture was reacted at 70° C. for 1 h, the mixture was heated to 80° C. and reacted at 80° C. for 3 h, the mixture was further heated to 100° C. and reacted at 100° C. for 1 h to obtain a primary product;

[0064] Step 2: Add 150 g of vinyl silane-modified hollow microspheres (from Preparation Example 1) and 50 g of carboxyl nitrile rubber to the primary product obtained in step 1, and react at 120° C. with stirring for 1 hour to obtain a lightweight sound-insulating phenolic resin.

[0065] The only difference between Example 2-3 and Example 1 is that the quality of the raw materials for preparing the lightweight sound-insulating phenolic resin is different, as shown in Table 1.

[0066] Table 1 The quality of each raw material for preparing the lightweight sound-insulating phenolic resin of Examples 1-3

[0067]

[0068] The only difference between Examples 4-8 and Example 3 is that the composition of the sound insulation material is different, as shown in Table 2 for details.

[0069] Table 2 Composition of sound insulation materials of Examples 3-8

[0070]

[0071] Among them, the vinylsilane-modified mica flakes come from Preparation Example 7.

[0072] The only difference between Examples 9-13 and Example 8 is that the sources of the vinylsilane-modified hollow microspheres are different, as shown in Table 3.

[0073] Table 3 Source of vinylsilane-modified hollow microspheres in Examples 8-13

[0074]

[0075] Example 14 is different from Example 12 only in that the vinylsilane-modified mica flakes are derived from Preparation Example 8.

[0076] Example 15 is different from Example 14 only in that the mass of graphene oxide is replaced by modified graphene oxide (derived from Preparation Example 9).

[0077] Example 16 is different from Example 15 only in that the modified graphene oxide is derived from Preparation Example 10.

[0078] Example 17 is different from Example 15 only in that the modified graphene oxide is derived from Preparation Example 11.

[0079] Example 18 is different from Example 16 only in that the toughening agent is polyvinyl alcohol.

[0080] Example 19 is different from Example 16 only in that the toughening agent is a mixture of carboxyl nitrile rubber and polyvinyl alcohol in a mass ratio of 1:0.3.

[0081] Example 20 is different from Example 16 only in that the toughening agent is a mixture of carboxyl nitrile rubber and polyvinyl alcohol in a mass ratio of 1:0.5.

[0082] Comparative Example

[0083] Comparative Example 1 is different from Example 1 only in that the same mass of vinylsilane-modified hollow microspheres is replaced by hollow microspheres.

[0084] Comparative Example 2 is different from Example 1 only in that no carboxyl nitrile rubber is added.

[0085] Comparative Example 3 is different from Example 1 only in that p-coumarol is replaced by phenol.

[0086] Performance testing

[0087] The following performance tests were performed on the lightweight sound-insulating phenolic resins prepared in Examples 1-20 and Comparative Examples 1-3 of the present application.

[0088] 1. Toughness: The flexural strength of lightweight sound-insulating phenolic resin (commercially available American SI Group phenolic resin SP-1068 as a control) was tested with reference to GB / T 1696-2001. The test results are shown in Table 4. High flexural strength indicates good toughness.

[0089] 2. Sound insulation effect

[0090] Portland cement, coarse sand (30-50 mesh), cellulose ether, quartz powder, thixotropic lubricant BYK OPTIBENT-987 and lightweight sound-insulating phenolic resin (commercially available American Saint-LeCoultre phenolic resin SP-1068 is used as a control) are mixed in a mass ratio of 30:60:0.1:3:4:3, placed in a dry powder mixer and stirred evenly to obtain a sound-insulating mortar;

[0091] The test specimens were demoulded 1 day after the sound insulation mortar was formed and cured for 28 days under standard conditions (temperature 23±2℃, relative humidity (50±5)%). The weighted normalized impact sound pressure level L was tested according to the national standard GB / T19889.6-2005 "Acoustics-Sound insulation measurement of buildings and building components-Part 6: Laboratory measurement of floor impact sound insulation" and GB / T 50121-2005 "Building sound insulation evaluation standard". n,w , the test results are shown in Table 4, weighted normalized impact sound pressure level L n,w Low means good sound insulation.

[0092] 3. Compressive strength

[0093] Portland cement, coarse sand (30-50 mesh), cellulose ether, quartz powder, thixotropic lubricant BYK OPTIBENT-987 and lightweight sound-insulating phenolic resin (commercially available American Saint-LeCoultre phenolic resin SP-1068 is used as a control) are mixed in a mass ratio of 30:60:0.1:3:4:3, placed in a dry powder mixer and stirred evenly to obtain a sound-insulating mortar;

[0094] The test specimens were demoulded 1 day after the sound insulation mortar was formed and cured for 28 days under standard conditions (temperature (23±2)℃, relative humidity (50±5)%). The compressive strength of the test specimens was measured according to JGJ / T 70-2009 "Standard for Test Methods for Basic Properties of Building Mortar". The test results are shown in Table 4.

[0095] Table 4 Test results

[0096]

[0097]

[0098] The following describes the present application in detail with respect to the test data in Table 4.

[0099] Compared with the commercially available American Saint-LeCoultre phenolic resin SP-1068, the lightweight sound-insulating phenolic resin prepared in the embodiment has higher compressive strength and also has more significant sound insulation effect and better toughness. This shows that the lightweight sound-insulating phenolic resin of the present application has good sound insulation effect, good toughness and can improve compressive strength.

[0100] Compared with the unmodified hollow microspheres in comparative example 1, the hollow microspheres modified with vinyl silane in the embodiment have more significant sound insulation effect and better toughness while also having high compressive strength, which indicates that the hollow microspheres modified with vinyl silane in the present application will not reduce the compressive strength due to the high content.

[0101] Compared with the comparative example 2 without adding carboxyl nitrile rubber, the carboxyl nitrile rubber used in the embodiment not only has excellent toughening effect and improves the toughness of the phenolic resin, but the addition of carboxyl nitrile rubber can also improve the sound insulation effect and compressive strength to a certain extent. This shows that the vinyl silane-modified hollow microspheres and carboxyl nitrile rubber have excellent compatibility and improve the sound insulation effect and compressive strength of the phenolic resin.

[0102] Compared with Comparative Example 3 in which p-coumarol is replaced with phenol, the embodiment uses p-coumarol to replace part of the phenol, which can not only react with polyformaldehyde to generate phenolic resin, but p-coumarol has carbon-carbon unsaturated bonds and alcohol hydroxyl groups, which improves the toughness and cross-linking degree of the phenolic resin and the compressive strength of the mortar.

[0103] From the test data of Examples 3-6, it can be seen that Example 6 uses a sound insulation material compounded by vinyl silane-modified hollow microspheres, vinyl silane-modified mica sheets and graphene oxide, which not only significantly improves the sound insulation effect of phenolic resin, but also improves the toughness of phenolic resin and the compressive strength of mortar.

[0104] From the test data of Examples 9-10, it can be seen that Example 10 uses 3-methacryloxypropyltrimethoxysilane to modify the hollow microspheres, which further improves the compatibility between the vinyl silane-modified hollow microspheres and graphene oxide, thereby improving the sound insulation effect and toughness of the phenolic resin, and also improving the compressive strength of the mortar to a certain extent.

[0105] From the test data of Examples 10-13, it can be seen that Example 12 uses hollow microspheres with a diameter of 500 μm, which has a good sound insulation effect, and Example 11 uses hollow microspheres with a diameter of 300 μm, the phenolic resin has good toughness, and the mortar has high compressive strength.

[0106] From the test data of Examples 12 and 14, it can be seen that Example 14 uses 3-methacryloxypropyltrimethoxysilane to modify the mica sheet, which further improves the sound insulation effect, bending strength and compressive strength.

[0107] From the test data of Examples 14-15, it can be seen that Example 15 uses modified graphene oxide to improve the sound insulation effect of the sound insulation material, the toughness of the phenolic resin and the compressive strength of the mortar.

[0108] From the test data of Examples 15-16, it can be seen that Example 16 uses 3-methacryloxypropyltrimethoxysilane as a capping agent, which improves the toughness and sound insulation effect of the phenolic resin and improves the compressive strength of the mortar.

[0109] From the test data of Examples 15 and 17, it can be seen that the modified graphene oxide containing polyisoprene in Example 15 improves the toughness and sound insulation effect of the phenolic resin and improves the compressive strength of the mortar.

[0110] From the test data of Examples 16, 18-19, it can be seen that Example 19 uses a compound of carboxylated nitrile rubber and polyvinyl alcohol as a toughening agent, and there is a synergistic effect between the two, which significantly improves the toughness of the phenolic resin.

[0111] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A lightweight sound-insulating phenolic resin, characterized in that: The raw materials for its preparation include, by weight: 60-80 parts of phenol, 30-40 parts of paraformaldehyde, 30-40 parts of p-coumarol, 1-2 parts of catalyst, 15-20 parts of sound insulation material, and 5-8 parts of toughening agent; The sound insulation material is selected from one or more of vinyl silane modified hollow microspheres, vinyl silane modified mica sheets and graphene oxide, wherein vinyl silane modified hollow microspheres are a must, and the raw materials for preparing the vinyl silane modified hollow microspheres include vinyl silane and hollow microspheres; the mass ratio of the vinyl silane to the hollow microspheres is (0.2-0.3):1, and the toughening agent is formed by mixing carboxyl nitrile rubber and polyvinyl alcohol in a mass ratio of 1:(0.3-0.5).

2. A lightweight sound-insulating phenolic resin according to claim 1, characterized in that: The sound insulation material is prepared by mixing vinyl silane modified hollow microspheres, vinyl silane modified mica sheets and graphene oxide in a mass ratio of 1:(1.5-2.5):(0.05-0.08).

3. A lightweight sound-insulating phenolic resin according to claim 1, characterized in that: The graphene oxide is modified graphene oxide; the preparation method of the modified graphene oxide comprises the following steps: S1, adding an acyl chloride reagent to graphene oxide to react, to obtain graphene oxide acyl chloride; S2, adding an initiator solution to activate graphene oxide acyl chloride; S3, adding isoprene solution, polymerizing, introducing polymer chains on the surface of activated graphene oxide acyl chloride, adding a capping agent to adjust the polymer chains, and obtaining modified graphene oxide, wherein the capping agent is 3-methacryloxypropyltrimethoxysilane.

4. A lightweight sound-insulating phenolic resin according to claim 1, characterized in that: The diameter of the hollow microspheres is 300-500 μm.

5. A lightweight sound-insulating phenolic resin according to claim 1, characterized in that: The vinyl silane is 3-methacryloxypropyltrimethoxysilane.

6. A lightweight sound-insulating phenolic resin according to claim 2, characterized in that: The vinyl silane modified mica sheet is a 3-methacryloxypropyltrimethoxysilane modified mica sheet.

7. A method for preparing the lightweight sound-insulating phenolic resin according to any one of claims 1 to 6, characterized in that: The steps include: Step 1: Mix phenol, p-coumarol and a catalyst, add paraformaldehyde, and react at 70-100° C. for 4-6 hours to obtain a primary product; Step 2: Add sound insulation material and toughening agent, react at 100-130° C. with stirring for 0.5-1h to obtain lightweight sound insulation phenolic resin.

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