Liquid crystal phase shifter and liquid crystal antenna

Abstract

The application discloses a liquid crystal phase shifter and a liquid crystal antenna, and relates to the technical field of antennas, and specifically discloses a liquid crystal phase shifter, which comprises a first substrate and a second substrate arranged oppositely, and a liquid crystal layer between the first substrate and the second substrate; the side of the second substrate close to the first substrate comprises a first conductive layer, and the first conductive layer is connected to a fixed potential; the side of the first substrate close to the second substrate comprises a second conductive layer, and the second conductive layer comprises a transmission electrode; the first substrate comprises a first area, and the first area is bound with a circuit board; the liquid crystal phase shifter further comprises a radio frequency connector and a driving chip, and the radio frequency connector and the driving chip are both located in the first area; and the radio frequency connector and the driving chip transmit signals through the circuit board. The application can reduce the frame of the liquid crystal phase shifter, reduce the wiring difficulty in the liquid crystal box, and improve the splicing usability of the liquid crystal phase shifter.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wireless communication, and more particularly to a liquid crystal phase shifter and a liquid crystal antenna. BACKGROUND

[0002] The liquid crystal phase shifter is a programmable optical phased array using liquid crystal as electro-optic material. When a periodic voltage is applied to the electrodes of the liquid crystal phase shifter, the liquid crystal in the electrode region will form a periodic phase distribution due to the electro-optic properties of the liquid crystal. The periodic phase distribution modulates the phase of the light wave transmitted in the array, achieving the functions of scanning, focusing, beam splitting, or correcting phase defects.

[0003] The liquid crystal antenna is a new type of array antenna made on the basis of the liquid crystal phase shifter, and is widely used in satellite receiving antennas, vehicle-mounted radars, base station antennas, etc. The liquid crystal phase shifter is the core component of the liquid crystal antenna. The electric field formed by the liquid crystal phase shifter and the ground layer controls the deflection of the liquid crystal molecules, controls the equivalent dielectric constant of the liquid crystal, and further adjusts the phase of the electromagnetic wave. The liquid crystal antenna has a wide application prospect in the fields of satellite receiving antennas, vehicle-mounted radars, 5G base station antennas, etc.

[0004] The existing liquid crystal phase shifter needs to feed in a radio frequency signal through a radio frequency connector, and the liquid crystal needs a low-frequency alternating current driven bias signal. The liquid crystal phase shifter array needs to be fed with a liquid crystal driving signal through a circuit board. In the related technology, steps are arranged on both sides of the glass substrate, one of which is used for binding the circuit board, and the other is used for welding or binding the radio frequency connector. This increases the area of the frame, and the radio frequency connector step has a large area, but the glass substrate has insufficient mechanical strength for welding the radio frequency connector.

[0005] Therefore, it is urgent to provide a liquid crystal phase shifter and a liquid crystal antenna capable of reducing the frame area. SUMMARY

[0006] Therefore, the present application provides a liquid crystal phase shifter and a liquid crystal antenna to reduce the frame area.

[0007] In one aspect, the present application provides a liquid crystal phase shifter, comprising: a first substrate and a second substrate arranged oppositely, and a liquid crystal layer between the first substrate and the second substrate;

[0008] The side of the second substrate close to the first substrate comprises a first conductive layer, and the first conductive layer is connected to a fixed potential;

[0009] The side of the first substrate close to the second substrate comprises a second conductive layer, and the second conductive layer comprises a transmission electrode;

[0010] The first substrate comprises a first region, and the first region is bound with a circuit board;

[0011] The liquid crystal phase shifter further comprises a radio frequency connector and a driving chip, both of which are located in the first region, and the radio frequency connector and the driving chip transmit signals through the circuit board.

[0012] In another aspect, the application further provides a liquid crystal antenna comprising the above liquid crystal phase shifter, and further comprising a radiator located on the side of the second substrate away from the first substrate, the first conductive layer comprises a coupling port, and the normal projection of the radiator on the plane where the first substrate is located, the normal projection of the coupling port on the plane where the first substrate is located, and the normal projection of the transmission electrode on the plane where the first substrate is located at least partially overlap.

[0013] Compared with the prior art, the liquid crystal phase shifter and the liquid crystal antenna provided by the application at least achieve the following beneficial effects:

[0014] The liquid crystal phase shifter of the application comprises a first edge and a second edge opposite in the second direction, and a third edge and a fourth edge opposite in the first direction, and a circuit board is bound in the first region, and the radio frequency connector and the driving chip in the first region transmit signals through the circuit board, so that the radio frequency connector and the driving chip are arranged on the same side of the liquid crystal phase shifter, compared with the related art in which the radio frequency connector and the driving chip are arranged on both sides of the liquid crystal phase shifter, the application can reduce the area of the frame in the liquid crystal phase shifter.

[0015] Of course, any product implementing the application does not necessarily need to achieve all the technical effects described above at the same time.

[0016] Other features of the application and its advantages will become apparent from the following detailed description of exemplary embodiments thereof, with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0018] Figure 1 is a schematic plan structure of a liquid crystal phase shifter of the related art;

[0019] Figure 2 is a schematic plan structure of a liquid crystal phase shifter group in the related art;

[0020] Figure 3 is a schematic plan structure of a liquid crystal phase shifter provided by the application;

[0021] Figure 4 is Figure 3 is a sectional view in the direction of A-A' in

[0022] Figure 5 This is a schematic diagram of a planar structure of another liquid crystal phase shifter provided by the present invention;

[0023] Figure 6 This is a schematic diagram of a planar structure of a liquid crystal phase shifter assembly provided by the present invention;

[0024] Figure 7 This is a front view of a liquid crystal phase shifter provided by the present invention;

[0025] Figure 8 This is a rear view of a liquid crystal phase shifter provided by the present invention;

[0026] Figure 9 yes Figure 7 A cross-sectional view along the C-C' direction;

[0027] Figure 10 This is a schematic diagram of a planar structure of another liquid crystal phase shifter provided by the present invention;

[0028] Figure 11 yes Figure 10 A magnified view of a portion of region M in the middle;

[0029] Figure 12 yes Figure 11 A cross-sectional view along the D-D' direction;

[0030] Figure 13 This is a schematic diagram of a planar structure of another liquid crystal phase shifter provided by the present invention;

[0031] Figure 14 yes Figure 13 A magnified view of a portion of region N in the middle;

[0032] Figure 15 yes Figure 14 A cross-sectional view along the E-E' direction;

[0033] Figure 16 This is a schematic diagram of a planar structure of another liquid crystal phase shifter provided by the present invention;

[0034] Figure 17 yes Figure 16 A magnified view of a portion of region P in the middle;

[0035] Figure 18 yes Figure 3 A cross-sectional view along the B-B' direction;

[0036] Figure 19 yes Figure 7 A cross-sectional view along the F-F' direction;

[0037] Figure 20 yes Figure 3Another cross-sectional view along the direction of B-B';

[0038] Figure 21 is Figure 7 Another cross-sectional view along the direction of F-F';

[0039] Figure 22 is Figure 3 Another cross-sectional view along the direction of A-A';

[0040] Figure 23 is Figure 3 Another cross-sectional view along the direction of B-B';

[0041] Figure 24 is Figure 7 A cross-sectional view along the direction of C-C';

[0042] Figure 25 is Figure 7 Another cross-sectional view along the direction of F-F';

[0043] Figure 26 is a plane structure schematic view of another liquid crystal phase shifter provided by the present application;

[0044] Figure 27 is Figure 26 A cross-sectional view along the direction of G-G';

[0045] Figure 28 is Figure 26 A cross-sectional view along the direction of H-H';

[0046] Figure 29 is a front view of another liquid crystal phase shifter provided by the present application;

[0047] Figure 30 is Figure 29 A cross-sectional view along the direction of I-I';

[0048] Figure 31 is Figure 29 A cross-sectional view along the direction of J-J';

[0049] Figure 32 is a plane structure schematic view of another liquid crystal phase shifter provided by the present application;

[0050] Figure 33 is a front view of another liquid crystal phase shifter provided by the present application;

[0051] Figure 34 is a back view of another liquid crystal phase shifter provided by the present application;

[0052] Figure 35 is a plane structure schematic view of another liquid crystal phase shifter provided by the present application;

[0053] Figure 36 is a front view of another liquid crystal phase shifter provided by the present application;

[0054] Figure 37 is a back view of another liquid crystal phase shifter provided by the present application;

[0055] Figure 38 is a front view of another liquid crystal phase shifter provided by the present application; Figure 36 is a sectional view along K-K' direction in FIG. 7;

[0056] Figure 39 is a front view of another liquid crystal phase shifter provided by the present application;

[0057] Figure 40 is a front view of another liquid crystal phase shifter provided by the present application; Figure 39 is an enlarged view of Q region in FIG. 8;

[0058] Figure 41 is a sectional view along L-L' direction in FIG. 8; Figure 40

[0059] is a front view of another liquid crystal phase shifter provided by the present application; Figure 42

[0060] is a front view of another liquid crystal phase shifter provided by the present application; Figure 43 is a sectional view along M-M' direction in FIG. 9; Figure 42

[0061] is a front view of another circuit board provided by the present application; Figure 44

[0062] is a front view of another circuit board provided by the present application; Figure 45 is a sectional view along M-M' direction in FIG. 10; Figure 42

[0063] is a front view of another circuit board provided by the present application; Figure 46

[0064] is a front view of another circuit board provided by the present application; Figure 47 Figure 42 is a front view of another circuit board provided by the present application;

[0065] Figure 48 is a front view of another circuit board provided by the present application;

[0066] Figure 49 Figure 42 is a front view of another circuit board provided by the present application;

[0067] Figure 50 is a front view of another circuit board provided by the present application;

[0068] Figure 51 is a front view of another circuit board provided by the present application;​​

[0069] Figure 52 is another schematic plan view of a circuit board according to the present invention;

[0070] Figure 53 is another schematic plan view of a circuit board according to the present invention;

[0071] Figure 54 is another schematic plan view of a circuit board according to the present invention;

[0072] Figure 55 is another schematic plan view of a liquid crystal phase shifter according to the present invention;

[0073] Figure 56 is another back view of a liquid crystal phase shifter according to the present invention;

[0074] Figure 57 is another schematic plan view of a liquid crystal antenna according to the present invention;

[0075] Figure 58 is Figure 57 is a cross-sectional view along the N-N' direction. DETAILED DESCRIPTION

[0076] Various exemplary embodiments of the present invention will now be described in detail with reference to the figures. It should be noted that the relative arrangements, numerical expressions, and values of the components and steps set forth in these embodiments are not limiting to the scope of the present invention unless otherwise specifically stated.

[0077] The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the scope of the present invention, its application, or uses.

[0078] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein. However, where appropriate, such techniques, methods, and apparatus should be considered as being part of the specification.

[0079] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Thus, other examples of the exemplary embodiments can have different values.

[0080] It should be noted that like numbers and letters refer to like items throughout the following drawings, and that, as such, no further discussion of the same will be made.

[0081] The liquid crystal phase shifter in the related art has the problems of large frame area, the liquid crystal phase shifter can only be spliced in a linear array, large step area of the radio frequency connector, insufficient mechanical strength of the substrate radio frequency connector welding, and difficult wiring. Figure 1 and Figure 2 , Figure 1 is a planar structure schematic diagram of a liquid crystal phase shifter in the related art, Figure 2 is a planar structure schematic diagram of a liquid crystal phase shifter group in the related art, Figure 1 The liquid crystal phase shifter 010 includes a first side 01 and a second side 02 opposite in the vertical direction F1, a radio frequency connector 05 is bound on a first frame 03 of the first side 01, and a circuit board 06 is bound on a second frame 04 of the second side 02. Of course, the liquid crystal phase shifter 010 also includes a microstrip line 07. Figure 1 Only to clearly show the positional relationship of the radio frequency connector 05, the circuit board 06 and the microstrip line 07, Figure 1 Other structures in the liquid crystal phase shifter 010 are not shown. As Figure 1 shown, the first frame 03 needs to be reserved on the first side 01 to set the radio frequency connector 05, and the second frame 04 also needs to be reserved on the second side 02 to set the circuit board 06, so the overall frame area of the liquid crystal phase shifter 010 is large. In addition, referring to Figure 1 , the circuit board 06 needs to transmit a bias signal to the microstrip line 07, and the radio frequency connector 05 transmits a bias signal to the microstrip line 07. Since the circuit board 06 is located on the opposite side of the radio frequency connector 05, the signal line connecting the circuit board 06 and the microstrip line 07 is far apart, increasing the design difficulty of the signal line. Referring to Figure 2 , since the radio frequency connector 05 is set on the first side 01 and the circuit board 06 is set on the second side 02, when multiple liquid crystal phase shifters 010 are spliced for use, they can only be spliced in a linear array in the horizontal direction F2 to form a liquid crystal phase shifter group 020, and cannot be spliced in the vertical direction F1, which limits the use.

[0082] Therefore, the present application provides a liquid crystal phase shifter and a liquid crystal antenna to improve the above problems. The specific embodiments of the liquid crystal phase shifter and the liquid crystal antenna will be described in detail below.

[0083] Referring to Figure 3 , Figure 4 , Figure 5 and Figure 6 , Figure 3 is a planar structure schematic diagram of a liquid crystal phase shifter provided by the present application, Figure 4 is a cross-sectional view in the direction of A-A' in Figure 3 , and Figure 5 is another planar structure schematic diagram of a liquid crystal phase shifter provided by the present application, Figure 6 is a schematic diagram of a planar structure of a liquid crystal phase shifter set provided by the present application. The liquid crystal phase shifter 100 in the embodiment includes a first substrate 1 and a second substrate 2 arranged oppositely, and a liquid crystal layer 3 between the first substrate 1 and the second substrate 2; the side of the second substrate 2 close to the first substrate 1 includes a first conductive layer 5, and the first conductive layer 5 is connected to a fixed potential; the side of the first substrate 1 close to the second substrate 2 includes a second conductive layer 6, and the second conductive layer 6 includes a transmission electrode 7; the first substrate 1 includes a first area 8, and the first area 8 is bound with a circuit board 9; the liquid crystal phase shifter 100 further includes a radio frequency connector 10 and a driving chip 11, and the radio frequency connector 10 and the driving chip 11 are both located in the first area 8, and the radio frequency connector 10 and the driving chip 11 transmit signals through the circuit board 9.

[0084] Specifically, the liquid crystal phase shifter 100 in the embodiment includes the first substrate 1 and the second substrate 2 arranged oppositely, and the liquid crystal layer 3 between the first substrate 1 and the second substrate 2, and the liquid crystal layer 3 includes liquid crystal molecules 4, which are described with reference to Figure 4 , Figure 4 It is also shown in the figure that a frame glue 13 is included between the first substrate 1 and the second substrate 2, so that a closed space is formed between the first substrate 1 and the second substrate 2 to accommodate the liquid crystal molecules 4 between the first substrate 1 and the second substrate 2. It should be noted that the first substrate 1, the second substrate 2 and the liquid crystal layer 3 in the embodiment form a liquid crystal cell, and the specific process of forming the liquid crystal cell can be set by those skilled in the art according to the actual situation, which is not limited here. For example, the frame glue 13 is coated on the first substrate 1, then the liquid crystal is scattered by the liquid crystal injection technology, and finally the first substrate 1 and the second substrate 2 are aligned and laminated according to the alignment marks on the first substrate 1 and the second substrate 2, and the first substrate 1 and the second substrate 2 are stably laminated by curing the frame glue 13, so that the liquid crystal cell is obtained. The materials of the first substrate 1 and the second substrate 2 can also be set by those skilled in the art according to the actual situation, and exemplarily, the first substrate 1 and the second substrate 2 can be any one of glass, ceramic, or any one of polyimide, silicon nitride, which is a flexible material. Since the above-mentioned materials will not absorb radio frequency signals, i.e. the insertion loss of the microwave frequency band is small, it is beneficial to reduce the signal insertion loss, which can greatly reduce the loss of radio frequency signals in the transmission process. The first substrate 1 and the second substrate 2 in the figure of the embodiment are not pattern filled, which is not limited here.

[0085] In the embodiment, the side of the second substrate 2 close to the first substrate 1 comprises a first conductive layer 5, the first conductive layer 5 can be made of an integral surface, the first conductive layer 5 is connected to a fixed potential, for example, can be connected to the ground, the side of the first substrate 1 close to the second substrate 2 comprises a second conductive layer 6, the second conductive layer 6 comprises a transmission electrode 7, optionally, the transmission electrode 7 is a microstrip line. The embodiment does not make specific limitation to the material of the first conductive layer 5 and the second conductive layer 6, only needs to meet the requirement of being able to conduct electricity, such as metal conductive material such as copper.

[0086] It can be understood that the specific number, distribution and material of the transmission electrode 7 on the side of the first substrate 1 facing the second substrate 2 can be set by the person skilled in the art according to the actual situation, which is not specifically limited here. In the diagram of the embodiment, only the wiring structure of one transmission electrode 7 is exemplarily shown, which includes but is not limited to this, and can also be other layout structures, which are not limited by the embodiment, for example, the transmission electrode 7 can be a serpentine shape (as shown in Figure 3 ) or a spiral shape (as shown in Figure 5 ) or other structures.

[0087] The first substrate 1 comprises a first area 8, a wiring board 9 is bound in the first area 8, a radio frequency connector 10 and a driving chip 11 are further included in the first area 8, the radio frequency connector 10 transmits a radio frequency signal to the transmission electrode 7 through the wiring board 9, at the same time, the radio frequency connector 10 also provides a fixed potential to the first conductive layer 5 through the wiring board 9, the driving chip 11 transmits a bias signal to the transmission electrode 7 through the wiring board 9, at the same time, the driving chip 11 transmits a fixed potential to the first conductive layer 5 through the wiring board 9, the bias signal of the transmission electrode 7 and the fixed potential of the first conductive layer 5 form an electric field to control the deflection of the liquid crystal molecules 4 of the liquid crystal layer 3, at the same time, the radio frequency signal oscillates and transmits between the transmission electrode 7 and the first conductive layer 5, due to the deflection of the liquid crystal molecules 4, the dielectric constant of the liquid crystal layer 3 is changed, the radio frequency signal realizes phase shift in the liquid crystal layer 3, and the effect of changing the microwave phase is achieved.

[0088] It can be understood that the first area 8 in the present application can be a step area, in the schematic diagram of the embodiment, only the case that the first area 8 is a step area is shown, Figure 3 the width of the first area 8 in the second direction Y is only illustrative and is not limited as an actual product.

[0089] Optionally, the liquid crystal phase shifter 100 has one input end and one output end, Figure 3 as shown in the figure, one end of the transmission electrode 7 is electrically connected with the input end (the first input pad 22), and the other end of the transmission electrode 7 is electrically connected with the output end (the fourth output pad 301).

[0090] The liquid crystal phase shifter 100 of the present application comprises a first edge 14 and a second edge 15 opposite to each other along the second direction Y, and a third edge 16 and a fourth edge 17 opposite to each other along the first direction X, the circuit board 9 is bound in the first area 8 (close to the side of the first edge 14), the radio frequency connector 10 and the driving chip 11 in the first area 8 transmit signals through the circuit board 9, so that the radio frequency connector 10 and the driving chip 11 are arranged on the same side of the liquid crystal phase shifter 100, compared with the related art that the radio frequency connector and the driving chip are arranged on both sides of the liquid crystal phase shifter, the present application can reduce the area of the frame in the liquid crystal phase shifter 100; in the related art, the radio frequency connector and the driving chip are arranged on both sides of the liquid crystal phase shifter, so the wiring difficulty of the signal wiring connected between the driving chip and the microstrip line is increased, while in the present application, since the driving chip 11 and the radio frequency connector 10 are both electrically connected with the transmission electrode 7 through the circuit board 9, so there is no need to arrange the wiring in the liquid crystal box, which reduces the wiring difficulty in the liquid crystal box; in addition, referring to Figure 3 and Figure 6 , since the driving chip 11 and the radio frequency connector 10 are only arranged in the first area 8, so the second edge 15, the third edge 16 and the fourth edge 17 can be spliced, in the first direction X, the third edge 16 of one liquid crystal phase shifter 100 and the fourth edge 17 of another liquid crystal phase shifter 100 can be spliced, so that linear splicing is realized in the first direction X, in the second direction Y, the second edge 15 of one liquid crystal phase shifter 100 and the first edge 14 of another liquid crystal phase shifter 100 can be spliced, so that linear splicing is realized in the second direction Y, to form a liquid crystal phase shifter group 200, or in the second direction Y, the second edge 15 of one liquid crystal phase shifter 100 and the second edge 15 of another liquid crystal phase shifter 100 can be spliced (not shown in the figure), so that linear splicing is realized in the second direction Y, to form a liquid crystal phase shifter group 200, which improves the splicing practicability of the liquid crystal phase shifter 100.

[0091] In some optional embodiments, referring to Figure 7 , Figure 8 and Figure 9 , Figure 7 is a front view of a liquid crystal phase shifter provided by the present application, Figure 8 is a back view of a liquid crystal phase shifter provided by the present application, Figure 9 is Figure 7 , a cross-sectional view in the direction of C-C' in the figure. In the embodiment, the first substrate 1 further comprises a first edge 14, the circuit board 9 is bent to the side of the first substrate 1 away from the second substrate 2 along the first edge 14, and the radio frequency connector 10 and the driving chip 11 are located on the side of the first substrate 1 away from the second substrate 2.

[0092] The circuit board 9 in this embodiment can be a flexible circuit board 9, which can be made of polyimide or polyester film as a base material and has flexibility. Of course, it also has the characteristics of high wiring density, light weight, and thin thickness. The circuit board 9 is bent along the first edge 14 to the side of the first substrate 1 away from the second substrate 2, and the radio frequency connector 10 and the driving chip 11 are located on the side of the first substrate 1 away from the second substrate 2, so that the area of the frame in the front of the liquid crystal phase shifter 100 can be further reduced.

[0093] It should be noted that the first area 8 in this embodiment includes the step area for binding the circuit board 9, and also includes the partial area of the first substrate 1 away from the second substrate 2.

[0094] The front of the liquid crystal phase shifter 100 (i.e., the side of the first substrate 1 close to the second substrate 2) only needs to reserve a step area for binding the circuit board 9, and the flexible circuit board 9 is bent to the back of the first substrate 1, i.e., the side of the first substrate 1 away from the second substrate 2. By arranging the driving chip 11 and the radio frequency connector 10 on the back of the liquid crystal phase shifter 100 (i.e., the side of the first substrate 1 away from the second substrate 2), a narrow frame of the liquid crystal phase shifter 100 is achieved.

[0095] Of course, in this embodiment, the driving chip 11 and the radio frequency connector 10 are arranged on the side of the first substrate 1 away from the second substrate 2, and are electrically connected to the transmission electrode 7 through the circuit board 9, so that there is no need to arrange the wiring in the liquid crystal cell, which reduces the difficulty of wiring in the liquid crystal cell. In addition, referring to Figure 7 Since the driving chip 11 and the radio frequency connector 10 are arranged on the side of the first substrate 1 away from the second substrate 2, the second edge 15, the third edge 16, and the fourth edge 17 can be spliced. In the first direction X, the third edge 16 of one liquid crystal phase shifter 100 and the fourth edge 17 of another liquid crystal phase shifter 100 can be spliced, so that linear splicing is achieved in the first direction X. In the second direction Y, the second edge 15 of one liquid crystal phase shifter 100 and the first edge 14 of another liquid crystal phase shifter 100 can be spliced, so that linear splicing is achieved in the second direction Y, or in the second direction Y, the second edge 15 of one liquid crystal phase shifter 100 and the second edge 15 of another liquid crystal phase shifter 100 can be spliced, so that linear splicing is achieved in the second direction Y, which improves the splicing practicability of the liquid crystal phase shifter 100.

[0096] In some optional embodiments, continuing to refer to Figure 3 and Figure 4 , the radio frequency connector 10 and the driving chip 11 are located on the side of the first substrate 1 close to the second substrate 2.

[0097] In the embodiment, the radio frequency connector 10 and the driving chip 11 are arranged on the side of the first substrate 1 close to the second substrate 2, and the area of the first substrate 1 is greater than the area of the second substrate 2, that is, the first substrate 1 is enlarged, and the first area 8 is reserved on the side of the first substrate 1, and the radio frequency connector 10 and the driving chip 11 are arranged on the side of the first substrate 1 close to the second substrate 2.

[0098] The embodiment can also solve the problems in the related art, realize the narrow frame of the liquid crystal phase shifter 100, and arrange the driving chip 11 and the radio frequency connector 10 on the side of the first substrate 1 close to the second substrate 2, and electrically connect the transmission electrode 7 through the circuit board 9, without arranging the wiring in the liquid crystal box, reducing the wiring difficulty in the liquid crystal box, and realizing splicing in the first direction X and the second direction Y, improving the splicing practicability of the liquid crystal phase shifter 100.

[0099] In some optional embodiments, continuing to refer to Figure 3 、 Figure 4 、 Figure 7 、 Figure 8 and Figure 9 , the circuit board 9 includes a first end 901 and a second end 902, the first end 901 of the circuit board 9 is bound with the first area 8, the first end 901 of the circuit board 9 includes a first output pad 20, the first output pad 20 is electrically connected with a first binding pad 21 in the first area 8, and the first binding pad 21 is electrically connected with one end of the transmission electrode 7; the second end 902 of the circuit board 9 includes a first input pad 22, the radio frequency connector 10 includes a radio frequency input end 101, and the first input pad 22 is electrically connected with the radio frequency input end 101 of the radio frequency connector 10 and the driving chip 11 respectively.

[0100] The first end 901 of the circuit board 9 has the first output pad 20, the first output pad 20 is electrically connected with the first binding pad 21 in the first area 8, and the first binding pad 21 is electrically connected with one end of the transmission electrode 7, which can be electrically connected through conductive particles. In some optional embodiments, the transmission electrode 7 and the first binding pad 21 can be made of the same layer and the same process metal. In some optional embodiments, the transmission electrode 7 and the first binding pad 21 are an integral structure. If the transmission electrode 7 and the first binding pad 21 are arranged in different film layers, the overall film layer thickness of the liquid crystal phase shifter 100 will be increased. If the transmission electrode 7 and the first binding pad 21 are an integral structure, the overall film layer thickness of the liquid crystal phase shifter 100 will not be increased, and the process complexity of manufacturing the first binding pad 21 and the transmission electrode 7 can be reduced.

[0101] It should be noted that Figure 3 、 Figure 7 and Figure 8The connection line between the first input pad 22 and the first output pad 20 is not shown in the figure, and the first input pad 22 and the first output pad 20 are electrically connected one by one to transmit electrical signals. The connection line between the first input pad 22 and the first output pad 20 will be described in detail below.

[0102] The second end 902 of the circuit board 9 has the first input pad 22, which is electrically connected to the radio frequency input end 101 of the radio frequency connector 10 and the pad on the driving chip 11, respectively. Optionally, a metal trace can be provided on the first substrate 1, one end of the metal trace being electrically connected to the first input pad 22, and the other end being electrically connected to the radio frequency input end 101 of the radio frequency connector 10 and the pad on the driving chip 11, respectively. In the present application, the radio frequency signal provided by the radio frequency connector 10 and the bias signal provided by the driving pad are transmitted to the transmission electrode 7 through the first input pad 22 at the same time. Since the frequency of the radio frequency signal and the frequency of the bias signal are different, the radio frequency signal and the bias signal can be transmitted to the transmission electrode 7 through the first output pad 20 at the same time. In addition, the radio frequency signal and the bias signal can be transmitted through only one first input pad 22, so that two pads for electrically connecting the radio frequency signal to the transmission electrode 7 and for electrically connecting the bias signal to the transmission electrode 7 are not needed, thereby reducing the difficulty of wiring.

[0103] In some optional embodiments, continuing to refer to Figure 3 、 Figure 4 、 Figure 5 、 Figure 7 、 Figure 8 、 Figure 9 , the first substrate 1 includes the first connection line 31 and the second connection line 32, the first connection line 31 and the second connection line 32 are located in different film layers, one end of the first connection line 31 is electrically connected to the radio frequency input end 101 of the radio frequency connector 10, the other end of the first connection line 31 is electrically connected to the first input pad 22, one end of the second connection line 32 is electrically connected to the driving chip 11, and the other end of the second connection line 32 is electrically connected to the first connection line 31.

[0104] Specifically, Figure 4 In the embodiment, the first substrate 1 includes the first connection line 31 and the second connection line 32 on the side close to the second substrate 2, Figure 9 In the embodiment, the first substrate 1 includes the first connection line 31 and the second connection line 32 on the side away from the second substrate 2, and an insulating layer is included between the first connection line 31 and the second connection line 32 in the direction perpendicular to the plane where the second substrate 2 is located. The insulating layer is not patterned and labeled in the figure. The first connection line 31 and the second connection line 32 are distributed in different film layers, which can avoid unnecessary wiring and cross talk with other signal lines when the first connection line 31 and the second connection line 32 are arranged in the same layer. Figure 8The first connecting line 31 and the second connecting line 32 are distinguished by different line thicknesses in the drawings, and the line thicknesses are not the actual line thicknesses in the product, but only serve to distinguish the first connecting line 31 and the second connecting line 32. As can be seen from Figure 3 、 Figure 5 and Figure 8 The one end of the first connecting line 31 is electrically connected to the radio frequency input end 101 of the radio frequency connector 10, and the other end of the first connecting line 31 is electrically connected to the first input pad 22, so that the radio frequency signal output by the radio frequency input end 101 of the radio frequency connector 10 is transmitted to the first input pad 22 through the first connecting line 31. Since the first input pad 22 is electrically connected to the first binding pad 21, and the first binding pad 21 is electrically connected to the transmission electrode 7, the radio frequency signal is transmitted to the first input pad 22, the first output pad 20, the first binding pad 21, and then to the transmission electrode 7, and the radio frequency signal oscillates between the transmission electrode 7, the liquid crystal layer 3, and the first conductive layer 5, thereby realizing phase change. At the same time, one end of the second connecting line 32 is electrically connected to the driving chip 11, and the other end is electrically connected to the first connecting line 31, so that the bias signal provided by the driving chip 11 is transmitted to the first connecting line 31 through the second connecting line 32, and then transmitted to the first input pad 22, the first output pad 20, the first binding pad 21, and then to the transmission electrode 7. The bias signal and the fixed potential of the first conductive layer 5 form an electric field that controls the deflection of the liquid crystal molecules 4, thereby changing the dielectric constant of the liquid crystal layer 3.

[0105] It can be understood that the first input pad 22 is electrically connected to the first output pad 20 to ensure that the radio frequency signal and the bias signal received by the first input pad 22 can be transmitted to the first output pad 20.

[0106] It should be noted that the first connecting line 31 is directly electrically connected to the first input pad 22, and the first connecting line 31 not only transmits the radio frequency signal but also transmits the bias signal. The frequency of the bias signal is generally low, and the coupling connection can transmit the radio frequency signal but cannot transmit the bias signal, so the first connecting line 31 is directly electrically connected to the first input pad 22 in the present application. In addition, the coupling feed increases the coupling loss, and the first connecting line 31 is electrically connected to the radio frequency input end 101 of the radio frequency connector 10, thereby reducing the coupling power consumption.

[0107] One end of the first connecting line 31 is electrically connected with the radio frequency input end 101 of the radio frequency connector 10, and the other end of the first connecting line 31 is electrically connected with the first input pad 22. One end of the second connecting line 32 is electrically connected with the driving chip 11, and the other end of the second connecting line 32 is electrically connected with the first connecting line 31. Thus, the radio frequency signal and the bias signal are input through the first input pad 22 of the circuit board 9 at the same time, the wiring difficulty is reduced, and the coupling loss caused by the coupling feed is avoided.

[0108] In some optional embodiments, continuing to refer to Figure 4 and Figure 9 , the second connecting line 32 is connected with the first connecting line 31 through a via hole.

[0109] Specifically, Figure 4 in the second connecting line 32 is located on the side of the first substrate 1 close to the second substrate 2, the first connecting line 31 is located on the side of the first connecting line 31 away from the first substrate 1, and an insulating layer is included between the first connecting line 31 and the second connecting line 32. The first connecting line 31 is connected with the second connecting line 32 through a via hole. Figure 9 in the second connecting line 32 is located on the side of the first substrate 1 away from the second substrate 2, the first connecting line 31 is located on the side of the first connecting line 31 away from the first substrate 1, and an insulating layer is included between the first connecting line 31 and the second connecting line 32. The first connecting line 31 is connected with the second connecting line 32 through a via hole.

[0110] The first connecting line 31 and the second connecting line 32 are distributed in different film layers, which can avoid unnecessary winding of the first connecting line 31 and the connecting line when they are arranged in the same layer, and cross talk with other signal lines. In the embodiment, the second connecting line 32 is connected with the first connecting line 31 through a via hole, and the winding is reduced.

[0111] In some optional embodiments, referring to Figure 10 , Figure 11 and Figure 12 , Figure 10 is another planar structure schematic diagram of a liquid crystal phase shifter provided by the application, Figure 11 is a partial enlarged view of the M region in Figure 10 , Figure 12 is a partial enlarged view of the M region in Figure 11In the cross-sectional view of the line board 9 along the direction of D-D', the line board 9 comprises a third connecting line 40, the third connecting line 40 comprises a first sub-line segment 401, a second sub-line segment 402 and a third sub-line segment 403, the first sub-line segment 401 comprises the first input pad 22, the third sub-line segment 403 comprises the first output pad 20, the impedance of the output end of the first sub-line segment 401 is Z1, the impedance of the second sub-line segment 402 is Z2, the impedance of the input end of the third sub-line segment 403 is Z3, wherein the third sub-line segment 403 is a 1 / 4 wavelength transmission line,

[0112] In the embodiment, only the radio frequency connector 10 and the driving chip 11 are located on the side of the first substrate 1 close to the second substrate, and the embodiment is described by way of example, and for the case that the radio frequency connector 10 and the driving chip 11 are located on the side of the first substrate 1 away from the second substrate, the case can refer to the case of the radio frequency connector 10 and the driving chip 11 located on the side of the first substrate 1 close to the second substrate. Figure 7 and Figure 8 The case of the third connecting line 40 can refer to the case of the first connecting line 31 in the Figures 10 to 12 , and the case is not described herein.

[0113] It can be understood that in the direction perpendicular to the plane where the first substrate 1 is located, the part of the first sub-line segment 401 intersecting and electrically connected with the first connecting line 31 is the first input pad 22, and the part of the third sub-line segment 403 intersecting and electrically connected with the first binding pad 21 is the first output pad 20, of course, the first binding pad 21 can be made of the same material and process as the transmission electrode 7 of the second conductive layer 6, or the first binding pad 21 and the transmission electrode 7 of the second conductive layer 6 are an integral structure.

[0114] It should be noted that on the one hand, the material impedance of the first input pad 22 is low, and the material impedance of the first output pad 20 is high, which causes the impedance mismatch of the first input pad 22 and the first output pad 20 due to the different materials, and on the other hand, as shown in Figure 10As shown, in order to realize the miniaturization of the circuit board 9 and the liquid crystal phase shifter 100, the width of the first output pad 20 in the first direction X is smaller than the width of the first input pad 22 in the first direction X, so that if the first sub-line segment 401 is directly electrically connected with the second sub-line segment 402, the impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 are mismatched, the output end of the first sub-line segment 401 in the present application refers to one end of the first sub-line segment 401 close to the third sub-line segment 403, and the input end of the third sub-line segment 403 refers to one end of the third sub-line segment 403 close to the first sub-line segment 401, if the impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 are mismatched, then the return loss is generated. In order to realize the impedance matching of the first sub-line segment 401 and the third sub-line segment 403, that is, Z1=Z3, the embodiment sets the second sub-line segment 402 (characteristic impedance segment) between the first sub-line segment 401 and the third sub-line segment 403 to match the impedance, and the impedance matching refers to a suitable matching mode between a signal source or a transmission line and a load. Optionally, the material of the second sub-line segment 402 is different from the first sub-line segment 401 and the third sub-line segment 403, for example, different substances can be doped to change the impedance.

[0115] The impedance of the first sub-line segment 401 is Z1, and the impedance of the third sub-line segment 403 is Z3, according to the impedance formula, wherein j is an imaginary unit, j 2 =-1, βl is the phase of the radio frequency signal, according to the impedance formula, there are many influencing parameters of the impedance, so the second sub-line segment 402 in the present application is a 1 / 4 wavelength transmission line, so that Therefore, tanβl=0, and the impedance formula is Therefore

[0116] The second sub-line segment 402 in the present application is a 1 / 4 wavelength transmission line, by adjusting the impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 are matched, so as to avoid the return loss.

[0117] In some optional embodiments, continuing to refer to Figures 10 to 12 the first sub-line segment 401 includes copper, silver, gold, a combination of copper and silver, or a combination of copper and gold; and the third sub-line segment 403 includes a laminated structure of indium tin oxide, silicon nitride and copper.

[0118] The impedance of the first sub-line segment 401 is smaller than the impedance of the third sub-line segment 403, and one of the reasons is that the materials are different, the material of the first sub-line segment 401 includes copper, or the material of the first sub-line segment 401 includes silver, or gold, or a combination of copper and silver, a combination of copper and gold, copper, silver and gold are all materials with relatively small impedance, and the third sub-line segment 403 is a laminated structure including indium tin oxide, silicon nitride and copper, the impedance of the third sub-line segment 403 formed by the laminated structure is relatively high, if the first sub-line segment 401 and the third sub-line segment 403 are directly electrically connected, then the problem of impedance mismatching between the output end of the first sub-line segment 401 and the input end of the third sub-line segment 403 will occur, causing return loss. As can be seen from the above, the second sub-line segment 402 is additionally arranged between the first sub-line segment 401 and the third sub-line segment 403, the second sub-line segment 402 is an impedance matching segment, the second sub-line segment 402 is a 1 / 4 wavelength transmission line, and the impedance of the second sub-line segment 402 is adjusted by adjusting the length of the second sub-line segment 402, so that the impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 are matched, so as to avoid return loss. The impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 can be matched, so as to avoid return loss.

[0119] In some optional embodiments, referring to Figure 13 、 Figure 14 and Figure 15 , Figure 13 is another planar structure schematic view of a liquid crystal phase shifter provided by the application, Figure 14 is a partial enlarged view of the N region in Figure 13 , Figure 15 is a sectional view of the E-E' direction in Figure 14 , the width of the first sub-line segment 401 in the first direction X is greater than the width of the second sub-line segment 402, and the width of the second sub-line segment 402 is greater than the width of the third sub-line segment 403; the first direction X intersects the extension direction of the first sub-line segment 401; the second sub-line segment 402 is in series with a load structure 404.

[0120] Specifically, the width of the first sub-line segment 401 in the first direction X, the width of the second sub-line segment 402 in the first direction X and the width of the third sub-line segment 403 in the first direction X decrease in turn, and the second sub-line segment 402 is in series with a load structure 404. Optionally, the second sub-line segment 402 includes two parts, and a load structure 404 is connected in series between the two parts, and the load structure 404 can be distributed on different film layers with the second sub-line segment 402, such as Figure 15 in which the load structure 404 is located on the side of the second sub-line segment 402 close to the first substrate 1, and an insulating layer is further included between the load structure 404 and the second sub-line segment 402, and the insulating layer is not patterned in the figure, and the load structure 404 is connected in series with the two parts of the second sub-line segment 402 through a via.

[0121] The total impedance of the load structure 404 and the second sub-line segment 402 is Z2, preferably, the load structure 404 is also a 1 / 4 wavelength transmission line, thus by adjusting the total impedance Z2 of the load structure 404 and the second sub-line segment 402, The impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 are matched to avoid echo loss.

[0122] In some optional embodiments, continuing to refer to Figure 15 The load structure 404 includes a resistor 4042 and / or a capacitor 4041.

[0123] Figure 15 The load structure 404 includes a resistor 4042 and a capacitor 4041 is taken as an example for illustrative description. Alternatively, the load structure 404 can only include the resistor 4042, or the load structure 404 only includes the capacitor 4041, which is not shown in the figure.

[0124] Figure 15 In the embodiment, the load structure 404 is located on the side of the second sub-line segment 402 close to the first substrate 1, the load structure 404 is distributed on two metal layers, a first metal layer close to the second sub-line segment 402 and a second metal layer away from the second sub-line segment 402, the overlapping part of the first metal layer and the second metal layer in the direction perpendicular to the plane of the first substrate 1 constitutes the capacitor 4041, the first metal layer and the two parts of the second sub-line segment 402 are electrically connected through a via, the part of the first metal layer without overlapping with the second metal layer is the resistor 4042, the capacitor 4041 and the resistor 4042 are in series, of course, the load structure 404 in the embodiment is only one possible embodiment, which is not specifically limited here, the total impedance of the load structure 404 and the second sub-line segment 402 is Z2, the load structure 404 is also a 1 / 4 wavelength transmission line, thus by adjusting the total impedance Z2 of the load structure 404 and the second sub-line segment 402, The impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 are matched to avoid echo loss.

[0125] In some optional embodiments, referring to Figure 16 and Figure 17 , Figure 16 is a planar structure schematic diagram of another liquid crystal phase shifter provided by the present application, Figure 17 is Figure 16The local enlarged view of the middle P region, in the first direction X, the width of the first sub-line segment 401 is greater than the width of the second sub-line segment 402, and the width of the second sub-line segment 402 is greater than the width of the third sub-line segment 403; the first direction X intersects with the extension direction of the first sub-line segment 401; the second sub-line segment 402 at least includes a buffer segment 4021 and a transition segment 4022, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021.

[0126] Specifically, the width of the first sub-line segment 401 in the first direction X, the width of the second sub-line segment 402 in the first direction X, and the width of the third sub-line segment 403 in the first direction X decrease in turn, Figure 16 In the middle, only the outer edge of the transition segment 4022 is arc-shaped, of course, the outer edge of the transition segment 4022 can also be rectangular, which is not limited here.

[0127] In the embodiment, the transition segment 4022 can be located in the middle of the buffer segment 4021, of course, the transition segment 4022 can also be located at the end connected with the first sub-line segment 401, or the transition segment 4022 can also be located at the end connected with the third sub-line segment 403, which is not limited here.

[0128] In the embodiment, the width of the transition segment 4022 along the first direction X is greater than the width of the buffer segment 4021 along the first direction X, thereby adjusting the impedance Z2 of the second sub-line segment 402 to satisfy The impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 can be matched to avoid echo loss.

[0129] In some optional embodiments, continuing to refer to Figures 3 to 9 The radio frequency connector 10 provides a radio frequency signal, and the driving chip 11 provides a bias signal, and the frequency of the radio frequency signal is greater than the frequency of the bias signal.

[0130] Specifically, the radio frequency signal provided by the radio frequency connector 10 is usually much greater than the bias signal provided by the driving chip 11, and the radio frequency signal and the bias signal have different frequencies and do not affect each other, so that the radio frequency signal and the bias signal can be transmitted to the transmission electrode 7 through the traces on the flexible circuit board 9 at the same time, and the difficulty of wiring in the liquid crystal box is simplified.

[0131] In some optional embodiments, referring to Figure 18 and Figure 19 , Figure 18 is Figure 3 a sectional view in the B-B' direction, Figure 19 is Figure 7 a sectional view in the F-F' direction, in combination with Figure 3 , Figure 7 and Figure 8The radio frequency connector 10 further comprises a ground terminal 102; the second end 902 of the circuit board 9 further comprises a second input pad 23 and a third input pad 24; the ground terminal 102 is electrically connected with the second input pad 23, and the ground signal of the driving chip 11 is input to the third input pad 24; the first end 901 of the circuit board 9 further comprises a second output pad 25, and the second input pad 23 and the third input pad 24 are both electrically connected with the second output pad 25; the second output pad 25 is electrically connected with the second binding pad 26 in the first area 8, and the second binding pad 26 is electrically connected with the first conductive layer 5.

[0132] Specifically, the first conductive layer 5 needs to be connected with a fixed potential, wherein the radio frequency connector 10 and the driving chip 11 both provide the fixed potential for the first conductive layer 5.

[0133] In some optional embodiments, the second binding pad 26 is arranged in the same layer and with the same material as the transmission electrode 7, without the need to additionally arrange a metal layer on the first substrate 1, which is conducive to the thinning of the liquid crystal phase shifter 100.

[0134] In the embodiment, the second end 902 of the circuit board 9 comprises the second input pad 23 and the third input pad 24; the ground terminal 102 of the radio frequency connector 10 is electrically connected with the second input pad 23 to transmit the radio frequency ground signal to the second input pad 23, and the ground signal of the driving chip 11 is input to the third input pad 24 to transmit the bias ground signal to the third input pad 24; the first end 901 of the circuit board 9 further comprises the second output pad 25, and the second input pad 23 and the third input pad 24 are both electrically connected with the second output pad 25; the second output pad 25 is electrically connected with the second binding pad 26 in the first area 8, and the second binding pad 26 is electrically connected with the first conductive layer 5; the second output pad 25 receives the ground signal input by the second input pad 23 and the third input pad 24 and transmits the ground signal to the second binding pad 26, and the second binding pad 26 is electrically connected with the first conductive layer 5, so as to transmit the ground signal to the first conductive layer 5; the bias signal of the transmission electrode 7 and the fixed potential of the first conductive layer 5 form an electric field that controls the deflection of the liquid crystal molecules 4 in the liquid crystal layer 3, the radio frequency signal oscillates between the transmission electrode 7 and the first conductive layer 5, the liquid crystal molecules 4 are deflected, the dielectric constant of the liquid crystal layer 3 is changed, the phase shift of the radio frequency signal in the liquid crystal layer 3 is realized, and the effect of changing the microwave phase is achieved.

[0135] In some optional embodiments, continuing to refer to Figure 3 , Figure 7 , Figure 8 , Figure 18 and Figure 19The side of the first substrate 1 further comprises a fourth connecting line 33 and a fifth connecting line 34, the fourth connecting line 33 and the fifth connecting line 34 are located in different film layers; one end of the fourth connecting line 33 is electrically connected with the driving chip 11, the other end of the fourth connecting line 33 is electrically connected with the third input pad 24, one end of the fifth connecting line 34 is electrically connected with the ground end 102 of the radio frequency connector 10, the other end of the fifth connecting line 34 is electrically connected with the second input pad 23.

[0136] Optionally, the ground end 102 of the radio frequency connector 10 can be electrically connected with the second input pad 23 through the fifth connecting line 34, the driving chip 11 can be electrically connected with the third input pad 24 through the fourth connecting line 33, the fourth connecting line 33 and the fifth connecting line 34 can be distributed in different film layers, of course, the fourth connecting line 33 and the fifth connecting line 34 can be made of the same material, the fourth connecting line 33 and the fifth connecting line 34 can also be made of different materials, which is not limited here, Figure 18 In the fourth connecting line 33 is directly made on the side of the first substrate 1 close to the second substrate 2, the fifth connecting line 34 is located on the side of the fourth connecting line 33 away from the first substrate 1, and the fourth connecting line 33 and the fifth connecting line 34 have an insulating layer therebetween, and the insulating layer is not pattern filled in the figure. Figure 19 In the fourth connecting line 33 is directly made on the side of the first substrate 1 close to the second substrate 2, the fifth connecting line 34 is located on the side of the fourth connecting line 33 away from the first substrate 1, and the fourth connecting line 33 and the fifth connecting line 34 have an insulating layer therebetween, and the insulating layer is not pattern filled in the figure.

[0137] In the embodiment, the ground signal of the driving chip 11 is transmitted to the third input pad 24 through the fourth connecting line 33, and the ground signal of the radio frequency connector 10 is transmitted to the second input pad 23 through the fifth connecting line 34.

[0138] In some optional embodiments, referring to Figure 20 and Figure 21 , Figure 20 is Figure 3 another cross-sectional view of the B-B' direction in the Figure 21 is Figure 7 another cross-sectional view of the F-F' direction in the, the fifth connecting line 34 is connected with the fourth connecting line 33 through a via.

[0139] Specifically, the fourth connecting line 33 and the fifth connecting line 34 can be electrically connected through a via, since the fourth connecting line 33 and the fifth connecting line 34 transmit ground signals, the electrical connection of the fourth connecting line 33 and the fifth connecting line 34 does not affect the transmission of the ground signal.

[0140] In some optional embodiments, continuing to refer to Figure 18 and Figure 19The first substrate 1 and the second substrate 2 further comprise a frame glue 13, and the frame glue 13 comprises a first conductive body 50. One end of the first conductive body 50 is electrically connected with the first conductive layer 5, and the other end of the first conductive body 50 is electrically connected with the second binding pad 26.

[0141] Specifically, the first conductive body 50 disposed in the frame glue 13 electrically connects the second binding pad 26 with the first conductive layer 5. In the direction perpendicular to the plane where the first substrate 1 is located, the second binding pad 26 overlaps with the frame glue 13, and the first conductive body 50 in the frame glue 13 respectively contacts the second binding pad 26 and the first conductive layer 5, thereby realizing the transmission of the ground signal from the second binding pad 26 to the first conductive layer 5.

[0142] In some optional embodiments, continuing to refer to Figure 18 and Figure 19 , the first conductive body 50 comprises a conductive gold ball 51.

[0143] Specifically, when the frame glue 13 is coated, a certain amount of conductive gold balls 51 can be doped at the positions corresponding to the second binding pad 26. After the frame glue 13 is solidified, the positions corresponding to the second binding pad 26 have conductivity due to the conductive gold balls 51, thereby realizing the transmission of the ground signal from the second binding pad 26 to the first conductive layer 5.

[0144] In some optional embodiments, continuing to refer to Figure 4 and Figure 9 , the circuit board 9 comprises a substrate 60 and a wiring layer 70 located on one side of the substrate 60. The wiring layer 70 comprises a third connecting line 40. One end of the third connecting line 40 is electrically connected with the first input pad 22, and the other end of the third connecting line 40 is electrically connected with the first output pad 20.

[0145] Specifically, Figure 4 and Figure 9 only take the wiring layer 70 located on the side of the substrate 60 close to the first substrate 1 as an example for illustrative description, and no specific limitation is made herein.

[0146] As described above, the third connecting line 40 comprises the first input pad 22 and the first output pad 20. The first input pad 22 is electrically connected with the radio frequency connector 10 and the driving chip 11 through the first connecting line 31 and the second connecting line 32 respectively, thereby realizing the simultaneous input of the radio frequency signal and the bias signal.

[0147] In some optional embodiments, continuing to refer to Figure 18 , Figure 19 , and in combination with Figures 3 to 9The radio frequency connector 10 further comprises a ground terminal 102; the second end 902 of the circuit board 9 further comprises a second input pad 23 and a third input pad 24; the ground terminal 102 is electrically connected with the second input pad 23, and the ground signal of the driving chip 11 is input to the third input pad 24; the first end 901 of the circuit board 9 further comprises a second output pad 25, and the second input pad 23 and the third input pad 24 are both electrically connected with the second output pad 25; the second output pad 25 is electrically connected with a second binding pad 26 in the first area 8, and the second binding pad 26 is electrically connected with the first conductive layer 5.

[0148] The circuit board 9 further comprises a ground metal layer 80 located on the side of the substrate 60 away from the wiring layer 70.

[0149] The ground metal layer 80 is in an overall structure, and the ground metal layer 80 is electrically connected with the second output pad 25 through a via hole penetrating through the substrate 60.

[0150] Specifically, the second end 902 of the circuit board 9 comprises a second input pad 23 and a third input pad 24; the ground terminal 102 of the radio frequency connector 10 is electrically connected with the second input pad 23, and the radio frequency ground signal is transmitted to the second input pad 23; the ground signal of the driving chip 11 is input to the third input pad 24, and the bias ground signal is transmitted to the third input pad 24; the first end 901 of the circuit board 9 further comprises a second output pad 25, and the second input pad 23 and the third input pad 24 are both electrically connected with the second output pad 25; the second output pad 25 is electrically connected with a second binding pad 26 in the first area 8, and the second binding pad 26 is electrically connected with the first conductive layer 5; the second output pad 25 receives the ground signal input by the second input pad 23 and the third input pad 24 and transmits the ground signal to the second binding pad 26; the second binding pad 26 is electrically connected with the first conductive layer 5, so that the ground signal is transmitted to the first conductive layer 5; the bias signal of the transmission electrode 7 and the fixed potential of the first conductive layer 5 form an electric field for deflecting the liquid crystal molecules 4 of the liquid crystal layer 3; the radio frequency signal is transmitted between the transmission electrode 7 and the first conductive layer 5; due to the deflection of the liquid crystal molecules 4, the dielectric constant of the liquid crystal layer 3 is changed, the phase shift of the radio frequency signal in the liquid crystal layer 3 is realized, and the effect of changing the microwave phase is achieved.

[0151] Figure 18 and Figure 19 The substrate 60 is not pattern filled in the first area 8 and the second area 9.

[0152] In the present application, the circuit board 9 comprises a substrate 60, a wiring layer 70 on one side of the substrate 60, and a ground metal layer 80 located on the side of the substrate 60 away from the wiring layer 70; the wiring layer 70 and the ground metal layer 80 are distributed on both sides of the substrate 60.

[0153] The ground metal layer 80 in the application is a full-area structure, that is, the ground metal layer 80 is arranged on one side of the substrate 60, and the area of the ground metal layer 80 is larger, so that the signal is more stable when the ground signal is input.

[0154] Specifically, the second input pad 23 and the second output pad 25 and the third input pad 24 are located on the wiring layer 70, and the ground metal layer 80 is electrically connected to the second output pad 25 through a via hole penetrating the substrate 60. The ground signal of the driving chip 11 is transmitted to the third input pad 24 of the wiring layer 70 through the fourth connecting line 33, the third input pad 24 is electrically connected to the ground metal layer 80 through a via hole, and the ground metal layer 80 is electrically connected to the second output pad 25 of the wiring layer 70 through a via hole. Therefore, the ground signal passes through the full-area ground metal layer 80, so that the ground signal is more stable. Similarly, the ground signal of the radio frequency connector 10 is transmitted to the second input pad 23 of the wiring layer 70 through the fifth connecting line 34, the second input pad 23 is electrically connected to the ground metal layer 80 through a via hole (not shown in the figure), and the ground metal layer 80 is electrically connected to the second output pad 25 of the wiring layer 70 through a via hole. Therefore, the ground signal passes through the full-area ground metal layer 80, so that the ground signal is more stable.

[0155] In some optional embodiments, referring to Figure 22 、 Figure 23 、 Figure 24 and Figure 25 , Figure 22 is another sectional view of A-A' direction in Figure 3 , Figure 23 is another sectional view of B-B' direction in Figure 3 , Figure 24 is a sectional view of C-C' direction in Figure 7 , Figure 25 is another sectional view of F-F' direction in Figure 7 . The radio frequency connector 10 further comprises a ground end 102; the second end 902 of the circuit board 9 further comprises a second input pad 23 and a third input pad 24; the ground end 102 is electrically connected to the second input pad 23, and the ground signal of the driving chip 11 is input to the third input pad 24; the first end 901 of the circuit board 9 further comprises a second output pad 25, the second input pad 23 and the third input pad 24 are electrically connected to the second output pad 25, the second output pad 25 is electrically connected to the second binding pad 26 in the first area 8, and the second binding pad 26 is electrically connected to the first conductive layer 5;

[0156] The circuit board 9 further comprises a ground metal layer 80 located on one side of the substrate 60 close to the wiring layer 70, and a first insulating layer 90 located on one side of the ground metal layer 80 close to the wiring layer 70; the ground metal layer 80 is a full-area structure, and the ground metal layer 80 is electrically connected to the second output pad 25 through a via hole.

[0157] Specifically, the circuit board 9 of the embodiment includes a substrate 60, a ground metal layer 80 located on one side of the substrate 60, a first insulating layer 90 located on a side of the ground metal layer 80 away from the substrate 60, a trace layer 70 located on a side of the first insulating layer 90 away from the substrate 60, the first input pad 22, the second input pad 23, the third input pad 24, the first output pad 20 and the second output pad 25 are all located on the trace layer 70.

[0158] Specifically, the second input pad 23 and the second output pad 25, and the third input pad 24 are all located on the trace layer 70, and the ground metal layer 80 is electrically connected with the second output pad 25 through a via hole penetrating the first insulating layer 90. In combination with Figure 3 、 Figure 7 and Figure 8 , the ground signal of the driving chip 11 is transmitted to the third input pad 24 of the trace layer 70 through the fourth connecting line 33, the third input pad 24 is electrically connected with the ground metal layer 80 through a via hole penetrating the first insulating layer 90, and the ground metal layer 80 is electrically connected with the second output pad 25 of the trace layer 70 through a via hole penetrating the first insulating layer 90, so that the ground signal passes through the ground metal layer 80 arranged on the whole surface, and the ground signal is more stable. Similarly, the ground signal of the radio frequency connector 10 is transmitted to the second input pad 23 of the trace layer 70 through the fifth connecting line 34, the second input pad 23 is electrically connected with the ground metal layer 80 through a via hole penetrating the first insulating layer 90 (not shown in the figure), and the ground metal layer 80 is electrically connected with the second output pad 25 of the trace layer 70 through a via hole penetrating the first insulating layer 90, so that the ground signal passes through the ground metal layer 80 arranged on the whole surface, and the ground signal is more stable.

[0159] In some optional embodiments, referring to Figure 26 、 Figure 27 、 Figure 28 、 Figure 29 , Figure 26 is a plane structure schematic diagram of another liquid crystal phase shifter provided by the present application, Figure 27 is Figure 26 a sectional view in the G-G' direction, Figure 28 is Figure 26 a sectional view in the H-H' direction, Figure 29 is a front view of another liquid crystal phase shifter provided by the present application, Figure 30 is Figure 29 a sectional view in the I-I' direction, Figure 31 is Figure 29A sectional view of the middle J-J' direction. The radio frequency connector 10 further comprises a ground terminal 102; the second end 902 of the circuit board 9 further comprises a second input pad 23 and a third input pad 24; the ground terminal 102 is electrically connected with the second input pad 23, and the ground signal of the driving chip 11 is input to the third input pad 24; the first end 901 of the circuit board 9 further comprises a second output pad 25, the second input pad 23 and the third input pad 24 are both electrically connected with the second output pad 25, the second output pad 25 is electrically connected with the second bonding pad 26 in the first area 8, and the second bonding pad 26 is electrically connected with the first conductive layer 5; the wiring layer 70 further comprises a second signal line 35, one end of the second signal line 35 is electrically connected with the second input pad 23 and the third input pad 24, and the other end of the second signal line 35 is electrically connected with the second output pad 25.

[0160] Figures 26 to 28 The middle J-J' direction is taken as an example for illustrative description, wherein the driving chip 11 and the radio frequency connector 10 are located on the side of the first substrate 1 close to the second substrate 2, Figures 29 to 31 The middle J-J' direction is taken as an example for illustrative description, wherein the driving chip 11 and the radio frequency connector 10 are located on the side of the first substrate 1 far from the second substrate 2.

[0161] It can be understood that in the embodiment, only the substrate 60 and the wiring layer 70 located on one side of the substrate 60 are arranged in the circuit board 9, and the ground metal layer 80 is not arranged, the first input pad 22 and the first output pad 20 are connected through the third connecting line 40, the second input pad 23, the third input pad 24 and the second output pad 25 are connected through the second signal line 35, and the third connecting line 40 and the second signal line 35 are both located in the wiring layer 70, and the third connecting line 40 and the second signal line 35 are insulated, and optionally, the third connecting line 40 and the second signal line 35 have a spacing or the third connecting line 40 and the second signal line 35 are filled with an insulating layer, which is not limited here.

[0162] In the embodiment, the coplanar waveguide is adopted, that is, the third connecting line 40 connecting the first input pad 22 and the first output pad 20 and the second signal line 35 connecting the third input pad 24, the second input pad 23 and the second output pad 25 are both located in the same wiring layer 70, and the ground metal layer 80 is not needed to be arranged to realize the transmission of the ground signal, which is beneficial to the thinning of the circuit board 9.

[0163] In some optional embodiments, referring to Figure 32 , Figure 33 and Figure 34 , Figure 32 is a plane structure schematic view of another liquid crystal phase shifter provided by the application, Figure 33 is a front view of another liquid crystal phase shifter provided by the application, Figure 34It is another back view of the liquid crystal phase shifter provided by the application, the number of the first input pads 22 is greater than 1, and the plurality of first input pads 22 are electrically connected with the radio frequency input end 101 of the same radio frequency connector 10.

[0164] Figure 32 The driving chip 11 and the radio frequency connector 10 are located on the side of the first substrate 1 close to the second substrate 2 (not shown in the figure), and are schematically illustrated as an example, at this time, the driving chip 11 and the radio frequency connector 10 are arranged on the front surface of the liquid crystal phase shifter 100, Figures 33 to 34 The driving chip 11 and the radio frequency connector 10 are located on the side of the first substrate 1 away from the second substrate 2 (not shown in the figure), and are schematically illustrated as an example, at this time, the driving chip 11 and the radio frequency connector 10 are arranged on the back surface of the liquid crystal phase shifter 100. Figures 32 to 34 The number of the first input pads 22 is 2, and the two first input pads 22 are electrically connected with the radio frequency input end 101 of the same radio frequency connector 10 as an example for schematic illustration, that is, the function of power division is realized, Figure 32 The number of the first input pads 22 is 2, and the two first input pads 22 are electrically connected with the radio frequency input end 101 of the same radio frequency connector 10 as an example for schematic illustration, that is, the function of power division is realized,

[0165] It should be noted that the third connecting line 40 between the first input pad 22 and the first output pad 20 is not shown in the figure, and the structure of the third connecting line 40 can refer to the above-mentioned embodiments, that is, the third connecting line 40 is divided into the first sub-line segment 401, the second sub-line segment 402 and the third sub-line segment 403, the impedance of the output end of the first sub-line segment 401 is matched with the impedance of the input end of the third sub-line segment 403 by adjusting the impedance of the second sub-line segment 402, and details are not repeated here.

[0166] The number of the first input pads 22 is greater than 1, and the plurality of first input pads 22 are electrically connected with the radio frequency input end 101 of the same radio frequency connector 10, the power division function is realized, there are a plurality of transmission electrodes 7, and the radio frequency signals are simultaneously phase shifted.

[0167] In some optional embodiments, continuing to refer to Figure 4 、 Figure 9 、 Figure 12 、 Figure 15 、 Figure 19 、 Figure 20 、 Figure 21 、 Figure 22 、 Figure 23 、 Figure 24 、 Figure 25 、 Figure 27、 Figure 28 、 Figure 30 、 Figure 31 The circuit board 9 is bound to the first area 8 by the anisotropic conductive adhesive film 18.

[0168] It should be noted that the circuit board 9 is bound to the first area 8 by the anisotropic conductive adhesive film 18 is applicable to any of the above embodiments, which will not be repeated here.

[0169] It can be understood that the pads in the circuit board 9 need to be electrically connected with the binding pads in the first substrate 1, and the anisotropic conductive adhesive film 18 has the functions of one-way conduction and adhesive fixation, which can paste the circuit board 9 and the first substrate 1, and because the anisotropic conductive adhesive film 18 has conductive particles, the circuit board 9 and the binding pads in the first substrate 1 can be electrically connected.

[0170] In some optional embodiments, referring to Figure 35 , Figure 35 is a plane structure schematic diagram of another liquid crystal phase shifter provided by the application, Figure 36 is a front view of another liquid crystal phase shifter provided by the application, Figure 37 is a back view of another liquid crystal phase shifter provided by the application, Figure 38 is Figure 36 a cross-sectional view in the direction of K-K' in the liquid crystal phase shifter 100, the liquid crystal phase shifter 100 further comprises a driving control board 12, the radio frequency connector 10 and the driving chip 11 are arranged on the driving control board 12.

[0171] Figure 35 In the liquid crystal phase shifter 100, the driving chip 11 and the radio frequency connector 10 are located on the side of the first substrate 1 close to the second substrate 2 (not shown in the figure), which is taken as an example for schematic description, at this time, the driving chip 11 and the radio frequency connector 10 are arranged on the front of the liquid crystal phase shifter 100, Figures 36 to 38 the driving chip 11 and the radio frequency connector 10 are located on the side of the first substrate 1 away from the second substrate 2 (not shown in the figure), which is taken as an example for schematic description, at this time, the driving chip 11 and the radio frequency connector 10 are arranged on the back of the liquid crystal phase shifter 100.

[0172] Figure 35 In the liquid crystal phase shifter 100, a driving control board 12 is attached on the first substrate 1, the radio frequency connector 10 and the driving chip 11 are arranged on the driving control board 12, of course, the first connecting line 31, the second connecting line 32, the fourth connecting line 33 and the fifth connecting line 34 are also arranged on the driving control board 12. Figures 36 to 38As can be seen, in the first region 8, a drive control board 12 is provided on the side of the first substrate 1 away from the second substrate 2. The radio frequency connector 10 and the drive chip 11 are provided on the side of the drive control board 12 away from the first substrate 1. Of course, the first connecting line 31, the second connecting line 32, the fourth connecting line 33 and the fifth connecting line 34 are also provided on the side of the drive control board 12 away from the first substrate 1.

[0173] In this embodiment, the liquid crystal phase shifter 100 includes a drive control board 12, an RF connector 10 and a drive chip 11 are disposed on the drive control board 12. The arrangement of the RF connector 10 and the drive chip 11, as well as the signal lines such as the first connection line 31, the second connection line 32, the fourth connection line 33 and the fifth connection line 34, is more flexible. They do not need to be directly made on the glass of the first substrate 1. They can be made on the drive control board 12 and then bonded to the flexible circuit board 9 with anisotropic conductive adhesive.

[0174] In some alternative embodiments, refer to Figure 39 , Figure 40 , Figure 41 , Figure 42 , Figure 43 and combined Figure 8 , Figure 39 This is a schematic diagram of a planar structure of another liquid crystal phase shifter provided by the present invention. Figure 40 yes Figure 39 A magnified view of a portion of the Q region. Figure 41 yes Figure 40 A cross-sectional view along the L-L' direction. Figure 42 This is a front view of another liquid crystal phase shifter provided by the present invention. Figure 43 yes Figure 42 A cross-sectional view along the M-M' direction shows that the circuit board 9 includes a first circuit board 91 and a second circuit board 92. The first circuit board 91 is bonded to the first region 8, and the second circuit board 92 is electrically connected to the first circuit board 91 through a second conductor 52.

[0175] It is understood that, apart from the circuit board 9, the other structures of the liquid crystal phase shifter 100 can refer to any of the above embodiments, and no specific limitations are made here.

[0176] Figure 39 and Figure 40 The following example illustrates the situation with the driver chip 11 and the RF connector 10 located on the side of the first substrate 1 closer to the second substrate 2. In this case, the driver chip 11 and the RF connector 10 are positioned on the front side of the liquid crystal phase shifter 100. Figures 41 to 43 The example shown is that the driver chip 11 and the radio frequency connector 10 are located on the side of the first substrate 1 away from the second substrate 2. In this case, the driver chip 11 and the radio frequency connector 10 are disposed on the back side of the liquid crystal phase shifter 100.

[0177] In the embodiment, the transmission of the radio frequency signal and the bias signal can be realized by the electrical connection of the first circuit board 91 and the second circuit board 92. Specifically, the first circuit board 91 is bound in the first area 8, and the second circuit board 92 is electrically connected with the radio frequency connector 10 and the driving chip 11.

[0178] In some optional embodiments, continuing to refer to 39 to Figure 43 The circuit board 9 includes a third connection line 40, the third connection line 40 includes a first sub-line segment 401, a second sub-line segment 402, a third sub-line segment 403 and a fourth sub-line segment 405, the first sub-line segment 401 includes the first input pad 22, the third sub-line segment 403 includes the first output pad 20, the first sub-line segment 401 and the second sub-line segment 402 are located on the second circuit board 92; the fourth sub-line segment 405 and the third sub-line segment 403 are located on the first circuit board 91, the second sub-line segment 402 and the fourth sub-line segment 405 are electrically connected through the second conductive body 52; the impedance of the output end of the first sub-line segment 401 is Z1, the sum of the impedance of the second sub-line segment 402 and the fourth sub-line segment 405 is Z2, the impedance of the input end of the third sub-line segment 403 is Z3, the second sub-line segment 402 and the fourth sub-line segment 405 are both 1 / 4 wavelength transmission lines,

[0179] The film layer structure of the circuit board 9 in the embodiment can refer to any of the above embodiments, which will not be described here. In the embodiment, the first circuit board 91 is electrically connected with the first binding pad 21 in the first area 8. Specifically, the first circuit board 91 includes a wiring layer 70, the wiring layer 70 includes the third sub-line segment 403 of the third connection line 40, the third sub-line segment 403 is electrically connected with the first binding pad 21 through the anisotropic conductive adhesive film 18, the first circuit board 91 further includes a substrate 60 and a ground metal layer 80, the wiring layer 70 and the ground metal layer 80 are distributed on both sides of the substrate 60, the second circuit board 92 includes the first sub-line segment 401 and the second sub-line segment 402, the first sub-line segment 401 and the second sub-line segment 402 are located on the wiring layer 70 of the second circuit board 92, the wiring layer 70 and the ground metal layer 80 of the second circuit board 92 are also distributed on both sides of the substrate 60, the second sub-line segment 402 of the second circuit board 92 is electrically connected with the fourth sub-line segment 405 of the first circuit board 91 through the second conductive body 52 (which can be an anisotropic conductive adhesive film 18), to realize signal transmission.

[0180] Of course, the film layer structure of the circuit board 9 here is only one of the embodiments, and can also refer to any of the embodiments of 18 to Figure 31 .

[0181] Optionally, the film layer structure in the first circuit board 91 and the second circuit board 92 is: the substrate 60, the ground metal layer 80 on one side of the substrate 60, the trace layer 70 on the side of the ground metal layer 80 away from the substrate, the first insulating layer 90 between the ground metal layer 80 and the trace layer 70, the first circuit board 91 being electrically connected with the first bonding pad 21 in the first area 8, the trace layer 70 of the first circuit board 91 including the third sub-line segment 403 and the fourth sub-line segment 405, the third sub-line segment 403 being electrically connected with the first bonding pad 21 through the anisotropic conductive adhesive film 18, the trace layer 70 of the second circuit board 92 including the first sub-line segment 401 and the second sub-line segment 402, the second sub-line segment 402 of the second circuit board 92 being electrically connected with the fourth sub-line segment 405 of the first circuit board 91 through the second conductive body 52 (optionally, the anisotropic conductive adhesive film 18), so as to realize signal transmission. Optionally, the impedance of the second sub-line segment 402 and the fourth sub-line segment 405 can be adjusted by changing the line width of the second sub-line segment 402 and the fourth sub-line segment 405. Of course, the load device can also be arranged in the trace layer 70, so that the load device 402 is connected in series with the second sub-line segment 402 and the fourth sub-line segment 405, which is not shown in the figure. The second sub-line segment 402 and the fourth sub-line segment 405 are both 1 / 4 wavelength transmission lines, and the sum of the impedances of the second sub-line segment 402 and the fourth sub-line segment 405 is Z2, which is adjusted by adjusting the density of the conductive particles in the second conductive body 52. The impedance Z1 of the output end of the first sub-line segment 401 and the impedance Z3 of the input end of the third sub-line segment 403 can be matched, so as to avoid echo loss.

[0182] It should be noted that the fourth sub-line segment 405 is arranged in the first circuit board 91 in the present application, the fourth sub-line segment 405 is one of the third connection lines 40, and the impedance of the second sub-line segment 402 and the fourth sub-line segment 405 is adjusted to match the impedance of the output end of the first sub-line segment 401 and the input end of the second sub-line segment 402. Optionally, once the impedance of the second sub-line segment 402 and the fourth sub-line segment 405 is designed, the impedance of the output end of the first sub-line segment 401 and the input end of the second sub-line segment 402 is not matched due to process error, and then the density of the conductive particles in the second conductive body 52 can be adjusted for fine adjustment, so as to compensate for the fluctuation of the impedance of the second sub-line segment 402 and the fourth sub-line segment 405 caused by process error, and finally realize the impedance matching of the output end of the first sub-line segment 401 and the input end of the second sub-line segment 402.

[0183] In some optional embodiments, referring to Figure 44 , Figure 45 , Figure 46 , Figure 47 , Figure 48 and Figure 49 , Figure 44 is a planar structure schematic diagram of a circuit board provided by the present application, Figure 45 is Figure 42 a cross-sectional view in the direction of M-M' of yet another embodiment, Figure 46 is a schematic plan view of yet another circuit board according to the present application, Figure 47 is Figure 42 a cross-sectional view in the direction of M-M' of yet another embodiment, Figure 48 is a schematic plan view of yet another circuit board according to the present application, Figure 49 is Figure 42 a cross-sectional view in the direction of M-M' of yet another embodiment, along the first direction X, the width of the first sub-segment 401, the width of the second sub-segment 402, the width of the fourth sub-segment 405 and the width of the third sub-segment 403 decrease, the second sub-segment 402 and / or the fourth sub-segment 405 are in series with a load structure 404.

[0184] In particular, the width of the first sub-segment 401, the width of the second sub-segment 402, the width of the fourth sub-segment 405 and the width of the third sub-segment 403 decrease, which can be that the width of the first sub-segment 401, the width of the second sub-segment 402, the width of the fourth sub-segment 405 and the width of the third sub-segment 403 decrease gradually, the first sub-segment 401 and the second sub-segment 402 are located on the second circuit board 92, the fourth sub-segment 405 and the third sub-segment 403 are located on the first circuit board 91, by connecting the load structure 404 in series with the second sub-segment 402, or connecting the load structure 404 in series with the fourth sub-segment 405, or connecting the load structure 404 in series with the second sub-segment 402 and the fourth sub-segment 405, Figure 44 and Figure 45 is shown in the second sub-segment 402 in series with the load structure 404, Figure 46 and Figure 47 is shown in the fourth sub-segment 405 in series with the load structure 404, Figure 48 and Figure 49 is shown in the second sub-segment 402 and the fourth sub-segment 405 in series with the load structure 404, optionally, the load structure 404 can include resistance and / or capacitance, Figures 44 to 49 only with the load structure 404 including resistance and capacitance as an example for illustrative purposes, optionally, the load structure 404 can only include resistance, or the load structure 404 only includes capacitance, which is not shown in the example.

[0185] The second sub-segment 402 and / or the fourth sub-segment 405 of the present embodiment are in series with the load structure 404, by adjusting the sum of the impedance of the second sub-segment 402 and the fourth sub-segment 405 to be Z2, The impedance Z1 of the output end of the first sub-line segment 401 is matched with the impedance Z3 of the input end of the third sub-line segment 403, so as to avoid echo loss. In addition, when the impedance matching of the fourth sub-line segment 405 in the first circuit board 91 is improper, the impedance of the second sub-line segment 402 in the second circuit board 92 can be adjusted, so that the sum of the impedance of the second sub-line segment 402 and the fourth sub-line segment 405 is Z2, so as to increase the matching accuracy; similarly, when the impedance matching of the second sub-line segment 402 in the second circuit board 91 is improper, the impedance of the fourth sub-line segment 405 in the first circuit board 91 can be adjusted, so that the sum of the impedance of the second sub-line segment 402 and the fourth sub-line segment 405 is Z2.

[0186] In some optional embodiments, referring to Figure 50 、 Figure 51 、 Figure 52 , Figure 50 is another schematic diagram of a planar structure of a circuit board provided by the application, Figure 51 is another schematic diagram of a planar structure of a circuit board provided by the application, Figure 52 is another schematic diagram of a planar structure of a circuit board provided by the application, along the first direction X, the width of the first sub-line segment 401, the width of the second sub-line segment 402, the width of the fourth sub-line segment 405 and the width of the third sub-line segment 403 decrease, the second sub-line segment 402 and / or the fourth sub-line segment 405 at least include a buffer segment 4021 and a transition segment 4022, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021.

[0187] Specifically, the width of the first sub-line segment 401, the second sub-line segment 402, the fourth sub-line segment 405 and the third sub-line segment 403 decreases, which can be that the width of the first sub-line segment 401, the second sub-line segment 402, the fourth sub-line segment 405 and the third sub-line segment 403 gradually decreases, the first sub-line segment 401 and the second sub-line segment 402 are located in the second circuit board 92, the fourth sub-line segment 405 and the third sub-line segment 403 are located in the first circuit board 91, by at least including the buffer segment 4021 and the transition segment 4022 in the second sub-line segment 402, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021, or at least including the buffer segment 4021 and the transition segment 4022 in the fourth sub-line segment 405, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021, or at least including the buffer segment 4021 and the transition segment 4022 in the second sub-line segment 402 and the fourth sub-line segment 405, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021, Figure 50 is shown in FIG. 4 that the second sub-line segment 402 includes the buffer segment 4021 and the transition segment 4022, Figure 51 is shown in FIG. 5 that the fourth sub-line segment 405 includes the buffer segment 4021 and the transition segment 4022, Figure 52It is shown that the second sub-line segment 402 and the fourth sub-line segment 405 both include a buffer segment 4021 and a transition segment 4022. Of course, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021.

[0188] The embodiment adjusts the sum of the impedances of the second sub-line segment 402 and the fourth sub-line segment 405 to be Z2 by widening part of the second sub-line segment 402 and / or the fourth sub-line segment 405. The impedance Z1 of the output end of the first sub-line segment 401 is matched with the impedance Z3 of the input end of the third sub-line segment 403 so as to avoid echo loss. In addition, when the impedance matching of the fourth sub-line segment 405 in the first circuit board 91 is improper, the impedance of the second sub-line segment 402 in the second circuit board 92 can be adjusted so that the sum of the impedances of the second sub-line segment 402 and the fourth sub-line segment 405 is Z2, so that the matching precision can be increased; similarly, when the impedance matching of the second sub-line segment 402 in the second circuit board 91 is improper, the impedance of the fourth sub-line segment 405 in the first circuit board 91 can be adjusted so that the sum of the impedances of the second sub-line segment 402 and the fourth sub-line segment 405 is Z2.

[0189] In some optional embodiments, referring to Figure 53 and Figure 54 , Figure 53 is another schematic diagram of a planar structure of a circuit board provided by the present application, Figure 54 is another schematic diagram of a planar structure of a circuit board provided by the present application, along the first direction X, the width of the first sub-line segment 401, the width of the second sub-line segment 402, the width of the fourth sub-line segment 405 and the width of the third sub-line segment 403 decrease, wherein the second sub-line segment 402 is in series with a load structure 404, the fourth sub-line segment 405 at least includes a buffer segment 4021 and a transition segment 4022, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021; or the second sub-line segment 402 at least includes a buffer segment 4021 and a transition segment 4022, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021, and the fourth sub-line segment 405 is in series with the load structure 404.

[0190] Specifically, the width of the first sub-line segment 401, the second sub-line segment 402, the fourth sub-line segment 405 and the third sub-line segment 403 can decrease, that is, the width of the first sub-line segment 401, the second sub-line segment 402, the fourth sub-line segment 405 and the third sub-line segment 403 gradually decrease, the first sub-line segment 401 and the second sub-line segment 402 are located in the second circuit board 92, and the fourth sub-line segment 405 and the third sub-line segment 403 are located in the first circuit board 91, Figure 53The second sub-line segment 402 is in series with the load structure 404, the fourth sub-line segment 405 at least includes the buffer segment 4021 and the transition segment 4022, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021, Figure 54 The second sub-line segment 402 at least includes the buffer segment 4021 and the transition segment 4022, along the first direction X, the width of the transition segment 4022 is greater than the width of the buffer segment 4021, and the fourth sub-line segment 405 is in series with the load structure 404. The load structure 404 can adopt Figures 44 to 49 the same load structure 404 as in the first embodiment, which will not be repeated here.

[0191] The embodiment adjusts the line width of the second sub-line segment 402 and the line width of the fourth sub-line segment 405 in series with the load structure 404, or adjusts the line width of the second sub-line segment 402 in series with the load structure 404 and the line width of the fourth sub-line segment 405, so as to adjust the sum of the impedances of the second sub-line segment 402 and the fourth sub-line segment 405 to be Z2, so that the impedance Z1 of the output end of the first sub-line segment 401 matches the impedance Z3 of the input end of the third sub-line segment 403, so as to avoid echo loss. In addition, when the impedance matching of the fourth sub-line segment 405 in the first circuit board 91 is not appropriate, the impedance of the second sub-line segment 402 in the second circuit board 92 can be adjusted, so that the sum of the impedances of the second sub-line segment 402 and the fourth sub-line segment 405 is Z2, so as to increase the matching accuracy; similarly, when the impedance matching of the second sub-line segment 402 in the second circuit board 91 is not appropriate, the impedance of the fourth sub-line segment 405 in the first circuit board 91 can be adjusted, so that the sum of the impedances of the second sub-line segment 402 and the fourth sub-line segment 405 is Z2.

[0192] In some optional embodiments, referring to Figure 55 and Figure 56 , Figure 55 is a plan view of another liquid crystal phase shifter provided by the present application, Figure 56 is a back view of another liquid crystal phase shifter provided by the present application, the first area 8 further includes a third binding pad 27, one end of the transmission electrode 7 is electrically connected with the first binding pad 21, and the other end of the transmission electrode 7 is electrically connected with the third binding pad 27, the first substrate 1 further includes a radio frequency output port 28, and the third binding pad 27 is electrically connected with the radio frequency output port 28 through the circuit board 9.

[0193] Specifically, one end of the transmission electrode 7 is electrically connected with the first binding pad 21, and the other end is electrically connected with the third plate top pad. The radio frequency signal is input from the side of the first binding pad 21, and is oscillated and transmitted between the transmission electrode 7 and the first conductive layer 5. At the same time, due to the change of the dielectric constant of the liquid crystal layer 3, the phase is shifted and the radio frequency signal is output from the side of the third binding pad 27. The third binding pad 27 is electrically connected with the radio frequency output port 28 through the circuit board 9. Specifically, referring to Figure 55 and Figure 56 , and in combination with Figure 7 , the circuit board 9 includes a fourth output pad 301 electrically connected with the third binding pad 27. The fourth output pad 301 is electrically connected with a fourth input pad 302 through a signal line (not shown in the figure) of the wiring layer 70. The fourth input pad 302 is electrically connected with the radio frequency output port 28 through a signal line on the first substrate 1 (or the driving control board 12).

[0194] Based on the same inventive concept, the application also provides a liquid crystal antenna. Referring to Figure 57 and Figure 58 , Figure 57 is a schematic diagram of a planar structure of a liquid crystal antenna provided by the application, Figure 58 is a sectional view in the N-N' direction in Figure 57 . The liquid crystal antenna in the embodiment includes the liquid crystal phase shifter 100 described above (not including the radio frequency output port 28 in the above embodiment), and further includes a radiator 45 located on the side of the second substrate 2 away from the first substrate 1. The first conductive layer 5 includes a coupling port 501. The projection of the radiator 45 on the plane of the first substrate 1, the projection of the coupling port 501 on the plane of the first substrate 1, and the projection of the transmission electrode 7 on the plane of the first substrate 1 at least partially overlap.

[0195] The liquid crystal antenna in the embodiment includes the liquid crystal phase shifter 100 in any of the embodiments of Figures 3 to 41 . Here, it will not be described one by one. Only a schematic description is given by taking the example that the driving chip 11 and the radio frequency connector 10 are located on the side of the first substrate 1 away from the second substrate 2. Of course, the driving chip 11 and the radio frequency connector 10 can also be located on the side of the first substrate 1 close to the second substrate 2 (not shown in the figure).

[0196] Specifically, in addition to the structure of the liquid crystal phase shifter 100, the liquid crystal antenna further includes a radiator 45 located on the side of the second substrate 2 away from the first substrate 1. The first conductive layer 5 includes a coupling port 501. The projection of the radiator 45 on the plane of the first substrate 1, the projection of the coupling port 501 on the plane of the first substrate 1, and the projection of the transmission electrode 7 on the plane of the first substrate 1 at least partially overlap. The radiator 45 is used to radiate the microwave signal of the liquid crystal antenna.

[0197] It is understood that the first substrate 1 includes a first region 8, in which a circuit board 9 is bonded. The first region 8 also includes an RF connector 10 and a driver chip 11. The RF connector 10 transmits RF signals to the transmission electrode 7 through the circuit board 9. At the same time, the RF connector 10 also provides a fixed potential to the first conductive layer 5 through the circuit board 9. The driver chip 11 transmits a bias signal to the transmission electrode 7 through the circuit board 9. At the same time, the driver chip 11 transmits a fixed potential to the first conductive layer 5 through the circuit board 9. The bias signal of the transmission electrode 7 and the fixed potential of the first conductive layer 5 form an electric field that controls the deflection of the liquid crystal molecules 4 in the liquid crystal layer 3. Meanwhile, the RF signal oscillates and transmits between the transmission electrode 7 and the first conductive layer 5. As the liquid crystal molecules 4 deflect, the dielectric constant of the liquid crystal layer 3 is changed, realizing the phase shift of the RF signal in the liquid crystal layer 3. The transmission electrode 7 overlaps with the radiator 45, and the phase-shifted microwave signal is radiated out through the radiator 45.

[0198] The liquid crystal antenna of the present invention can also reduce the bezel area of ​​the liquid crystal antenna and reduce the wiring difficulty of the signal lines inside the liquid crystal cell; in addition, it can also improve the practicality of the liquid crystal antenna splicing. The liquid crystal antenna of the present invention has the same technical effects as the liquid crystal phase shifter 100 in any of the above embodiments, and will not be described in detail here.

[0199] As can be seen from the above embodiments, the liquid crystal phase shifter and liquid crystal antenna provided by the present invention achieve at least the following beneficial effects:

[0200] The liquid crystal phase shifter of the present invention includes a first edge and a second edge opposite to each other along a second direction, and a third edge and a fourth edge opposite to each other along the first direction. A circuit board is bonded in a first region. The radio frequency connector and the driver chip in the first region transmit signals through the circuit board. In this way, the radio frequency connector and the driver chip are located on the same side of the liquid crystal phase shifter. Compared with the related technology that places the radio frequency connector and the driver chip on both sides of the liquid crystal phase shifter, the present invention can reduce the area of ​​the bezel in the liquid crystal phase shifter.

[0201] In related technologies, the RF connector and the driver chip are located on both sides of the liquid crystal phase shifter, which increases the wiring difficulty of the signal trace connecting the driver chip and the microstrip line. However, in this invention, since the driver chip and the RF connector are electrically connected to the transmission electrode through the circuit board, there is no need to arrange traces inside the liquid crystal cell, which reduces the wiring difficulty inside the liquid crystal cell.

[0202] Since the driving chip and the radio frequency connector are arranged only in the first area, the second edge, the third edge and the fourth edge can be spliced, in the first direction, the third edge of one liquid crystal phase shifter and the fourth edge of another liquid crystal phase shifter can be spliced, so that linear splicing is realized in the first direction, in the second direction, the second edge of one liquid crystal phase shifter and the first edge of another liquid crystal phase shifter can be spliced, so that linear splicing is realized in the second direction, or in the second direction, the second edge of one liquid crystal phase shifter and the second edge of another liquid crystal phase shifter can be spliced, so that linear splicing is realized in the second direction, the splicing practicability of the liquid crystal phase shifter is improved.

[0203] Although some specific embodiments of the present application have been described in detail by way of example with reference to the drawings, it is to be understood that the examples are for illustrative purposes only and are not to be construed as limiting the scope of the present application. It is to be understood that modifications can be made to the above embodiments without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A liquid crystal phase shifter, characterized in that, include: A first substrate and a second substrate disposed opposite to each other, and a liquid crystal layer located between the first substrate and the second substrate; The second substrate includes a first conductive layer on the side near the first substrate, and the first conductive layer is connected to a fixed potential. The first substrate includes a second conductive layer on the side near the second substrate, and the second conductive layer includes a transmission electrode; The first substrate includes a first region, and a circuit board is bonded to the first region. The circuit board includes a first end and a second end. The first end of the circuit board is bonded to the first region. The first end of the circuit board includes a first output pad. The first output pad is electrically connected to a first bonded pad in the first region. The first bonded pad is electrically connected to one end of the transmission electrode. The second end of the circuit board includes a first input pad. The liquid crystal phase shifter further includes an RF connector and a driver chip, both of which are located in the first region. The RF connector includes an RF input terminal, and the first input pad is electrically connected to the RF input terminal of the RF connector and the driver chip, respectively.

2. The liquid crystal phase shifter according to claim 1, characterized in that, The first substrate further includes a first edge, and the circuit board is bent along the first edge to the side of the first substrate away from the second substrate. The radio frequency connector and the driver chip are located on the side of the first substrate away from the second substrate.

3. The liquid crystal phase shifter according to claim 1, characterized in that, The radio frequency connector and the driver chip are located on the side of the first substrate closer to the second substrate.

4. The liquid crystal phase shifter according to claim 1, characterized in that, The first substrate includes a first connection line and a second connection line, which are located in different film layers. One end of the first connection line is electrically connected to the radio frequency input terminal of the radio frequency connector, and the other end of the first connection line is electrically connected to the first input pad. One end of the second connection line is electrically connected to the driver chip, and the other end of the second connection line is electrically connected to the first connection line.

5. The liquid crystal phase shifter according to claim 4, characterized in that, The second connecting line is connected to the first connecting line through a via.

6. The liquid crystal phase shifter according to claim 1, characterized in that, The circuit board includes a third connection line, which comprises a first sub-segment, a second sub-segment, and a third sub-segment. The first sub-segment includes a first input pad, and the third sub-segment includes a first output pad. The impedance at the output terminal of the first sub-segment is Z1, the impedance at the second sub-segment is Z2, and the impedance at the input terminal of the third sub-segment is Z3. The third sub-segment is a 1 / 4 wavelength transmission line.

7. The liquid crystal phase shifter according to claim 6, characterized in that, The first sub-segment comprises copper, silver, gold, a combination of copper and silver, or a combination of copper and gold; the third sub-segment comprises a stacked structure of indium tin oxide, silicon nitride, and copper.

8. The liquid crystal phase shifter according to claim 6, characterized in that, In a first direction, the width of the first sub-segment is greater than the width of the second sub-segment, and the width of the second sub-segment is greater than the width of the third sub-segment; the first direction intersects with the extension direction of the first sub-segment; The second sub-segment is connected in series with a load structure.

9. The liquid crystal phase shifter according to claim 8, characterized in that, The load structure includes a resistor and / or a capacitor.

10. The liquid crystal phase shifter according to claim 6, characterized in that, In a first direction, the width of the first sub-segment is greater than the width of the second sub-segment, and the width of the second sub-segment is greater than the width of the third sub-segment; the first direction intersects with the extension direction of the first sub-segment; The second sub-segment includes at least a buffer segment and a transition segment, wherein the width of the transition segment is greater than the width of the buffer segment along the first direction.

11. The liquid crystal phase shifter according to claim 1, characterized in that, The RF connector provides an RF signal, the driver chip provides a bias signal, and the frequency of the RF signal is greater than the frequency of the bias signal.

12. The liquid crystal phase shifter according to claim 1, characterized in that, The radio frequency connector also includes a ground terminal; The second end of the circuit board also includes a second input pad and a third input pad; The grounding terminal is electrically connected to the second input pad, and the grounding signal of the driver chip is input to the third input pad; The first end of the circuit board also includes a second output pad, the second input pad and the third input pad are both electrically connected to the second output pad, the second output pad is electrically connected to a second bonding pad in the first region, and the second bonding pad is electrically connected to the first conductive layer.

13. The liquid crystal phase shifter according to claim 12, characterized in that, The first substrate further includes a fourth connection line and a fifth connection line, wherein the fourth connection line and the fifth connection line are located in different film layers; One end of the fourth connection line is electrically connected to the driver chip, and the other end of the fourth connection line is connected to the third input pad. One end of the fifth connection line is electrically connected to the ground terminal of the RF connector, and the other end of the fifth connection line is electrically connected to the second input pad.

14. The liquid crystal phase shifter according to claim 13, characterized in that, The fifth connecting line is connected to the fourth connecting line via a via.

15. The liquid crystal phase shifter according to claim 12, characterized in that, A frame adhesive is also included between the first substrate and the second substrate. The frame adhesive includes a first conductor. One end of the first conductor is electrically connected to the first conductive layer, and the other end of the first conductor is electrically connected to the second bonding pad.

16. The liquid crystal phase shifter according to claim 15, characterized in that, The first conductor includes conductive gold spheres.

17. The liquid crystal phase shifter according to claim 1, characterized in that, The circuit board includes a substrate and a wiring layer located on one side of the substrate; The routing layer includes a third connection line, one end of which is electrically connected to the first input pad, and the other end of which is electrically connected to the first output pad.

18. The liquid crystal phase shifter according to claim 17, characterized in that, The radio frequency connector also includes a ground terminal; The second end of the circuit board also includes a second input pad and a third input pad; The grounding terminal is electrically connected to the second input pad, and the grounding signal of the driver chip is input to the third input pad; The first end of the circuit board also includes a second output pad, the second input pad and the third input pad are both electrically connected to the second output pad, the second output pad is electrically connected to the second bonding pad in the first region, and the second bonding pad is electrically connected to the first conductive layer; The circuit board also includes a ground metal layer located on the side of the substrate away from the trace layer; The grounding metal layer is a full-surface structure, and the grounding metal layer is electrically connected to the second output pad through a via penetrating the substrate.

19. The liquid crystal phase shifter according to claim 17, characterized in that, The radio frequency connector also includes a ground terminal; The second end of the circuit board also includes a second input pad and a third input pad; The grounding terminal is electrically connected to the second input pad, and the grounding signal of the driver chip is input to the third input pad; The first end of the circuit board also includes a second output pad, the second input pad and the third input pad are both electrically connected to the second output pad, the second output pad is electrically connected to the second bonding pad in the first region, and the second bonding pad is electrically connected to the first conductive layer; The circuit board further includes a ground metal layer located on the side of the substrate near the wiring layer, and a first insulating layer located on the side of the ground metal layer near the wiring layer; The grounding metal layer is a full-surface structure, and the grounding metal layer is electrically connected to the second output pad through vias.

20. The liquid crystal phase shifter according to claim 17, characterized in that, The radio frequency connector also includes a ground terminal; The second end of the circuit board also includes a second input pad and a third input pad; The grounding terminal is electrically connected to the second input pad, and the grounding signal of the driver chip is input to the third input pad; The first end of the circuit board also includes a second output pad, the second input pad and the third input pad are both electrically connected to the second output pad, the second output pad is electrically connected to the second bonding pad in the first region, and the second bonding pad is electrically connected to the first conductive layer; The routing layer also includes a second signal line, one end of which is electrically connected to the second input pad and the third input pad, and the other end of which is electrically connected to the second output pad.

21. The liquid crystal phase shifter according to claim 1, characterized in that, The number of the first output pads is greater than one, and multiple first output pads are electrically connected to the RF input terminal of the same RF connector.

22. The liquid crystal phase shifter according to claim 1, characterized in that, The circuit board is bonded to the first region by anisotropic conductive adhesive film.

23. The liquid crystal phase shifter according to claim 1, characterized in that, The liquid crystal phase shifter also includes a drive control board, and the radio frequency connector and the drive chip are disposed on the drive control board.

24. The liquid crystal phase shifter according to any one of claims 1 to 23, characterized in that, The circuit board includes a first circuit board and a second circuit board. The first circuit board is bound to the first area, and the second circuit board is electrically connected to the first circuit board through a second conductor.

25. The liquid crystal phase shifter according to claim 23, characterized in that, The circuit board includes a first circuit board and a second circuit board, the first circuit board is bound to the first area, and the second circuit board is electrically connected to the first circuit board through a second conductor. The circuit board includes a third connection line, which includes a first sub-segment, a second sub-segment, a third sub-segment, and a fourth sub-segment. The first sub-segment includes a first input pad, and the third sub-segment includes a first output pad. The first and second sub-segments are located on the second circuit board. The fourth and third sub-segments are located on the first circuit board, and the second and fourth sub-segments are electrically connected through a second conductor. The impedance at the output of the first sub-segment is Z1, the sum of the impedances of the second and fourth sub-segments is Z2, and the impedance at the input of the third sub-segment is Z3. Both the second and fourth sub-segments are 1 / 4 wavelength transmission lines.

26. The liquid crystal phase shifter according to claim 25, characterized in that, Along the first direction, the widths of the first sub-segment, the second sub-segment, the fourth sub-segment, and the third sub-segment decrease, and the second sub-segment and / or the fourth sub-segment are connected in series with a load structure.

27. The liquid crystal phase shifter according to claim 25, characterized in that, Along the first direction, the widths of the first sub-segment, the second sub-segment, the fourth sub-segment, and the third sub-segment decrease, and the second sub-segment and / or the fourth sub-segment include at least a buffer segment and a transition segment. Along the first direction, the width of the transition segment is greater than the width of the buffer segment.

28. The liquid crystal phase shifter according to claim 25, characterized in that, Along the first direction, the widths of the first sub-segment, the second sub-segment, the fourth sub-segment, and the third sub-segment decrease, wherein, The second sub-segment is connected in series with a load structure, and the fourth sub-segment includes at least a buffer segment and a transition segment. Along the first direction, the width of the transition segment is greater than the width of the buffer segment. Alternatively, the second sub-segment may include at least a buffer segment and a transition segment, wherein the width of the transition segment is greater than the width of the buffer segment along the first direction, and the fourth sub-segment is connected in series with a load structure.

29. The liquid crystal phase shifter according to claim 1, characterized in that, The first region also includes a third bonding pad, one end of the transfer electrode is electrically connected to the first bonding pad, and the other end of the transfer electrode is electrically connected to the third bonding pad. The side of the first substrate away from the second substrate also includes an RF output port, and the third bonding pad is electrically connected to the RF output port through the circuit board.

30. A liquid crystal antenna, characterized in that, The liquid crystal phase shifter according to any one of claims 1 to 28 further includes a radiator located on the side of the second substrate away from the first substrate, the first conductive layer includes a coupling port, and the orthographic projection of the radiator on the plane of the first substrate, the orthographic projection of the coupling port on the plane of the first substrate, and the orthographic projection of the transmission electrode on the plane of the first substrate at least partially overlap.

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