Multi-die chip management method and apparatus, computer device, and storage medium

Abstract

The application relates to a multi-die chip management method and device, computer equipment and a storage medium, the method comprising: acquiring die data of each die; recording substrate information corresponding to each die during die picking of the die to a substrate according to the die data of each die; and storing the die data and the substrate information of each die in association to obtain a database with a corresponding relationship. By storing the die data and the substrate information of each die in association, the die data of other dies can be found according to the die data of a certain die in combination with the database, and the tracing efficiency of the data of the multi-die chip is effectively improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a multi-die chip management method, apparatus, computer device, and storage medium. Background Technology

[0002] With the development of technology and the continuous progress of society, various devices are trending towards miniaturization and portability. Chips have also evolved from traditional single-die chips to system-on-a-chip (SoC) composed of multiple dies, and this application is becoming increasingly common and miniaturized. The emergence of multi-die chips poses greater challenges to chip management methods and models. Currently, the traditional single-die chip management model has severely restricted the production management efficiency of multi-die chips, especially for registerless sensor chips. How to improve the traceability efficiency of multi-die chip data is an urgent problem to be solved. Summary of the Invention

[0003] Therefore, it is necessary to provide a multi-chip management method, apparatus, computer equipment, and storage medium that can improve the traceability efficiency of multi-chip data in order to address the above problems.

[0004] A multi-die chip management method, comprising:

[0005] Obtain the die data for each die;

[0006] During the process of selecting dies from the substrate based on the die data of each die, the substrate information corresponding to each die is recorded.

[0007] The die data and substrate information of each die are associated and stored to obtain a database with corresponding relationships.

[0008] In one embodiment, the die data includes die identification information and die test data.

[0009] In one embodiment, the die identification information includes the wafer batch number, wafer number, and the X / Y coordinates of the die on the wafer.

[0010] In one embodiment, the substrate information includes the substrate coordinates and substrate number corresponding to the position where the die is placed on the substrate.

[0011] In one embodiment, obtaining the die data of each die includes: obtaining data obtained from a first wafer-level test on the first die and other dies, and generating die data of each die.

[0012] In one embodiment, obtaining the die data of each die includes: obtaining data obtained from a first wafer-level test on the first die, and the original data of other dies at the time of manufacture, to generate the die data of each die.

[0013] In one embodiment, after associating and storing the die data and substrate information of each die to obtain a database with corresponding relationships, the method further includes:

[0014] Obtain the die identification information of the first die in the packaged chip;

[0015] Perform a second chip-level test on the chip to obtain chip test data;

[0016] The die identification information of the first die and the chip test data are associated and stored in the database.

[0017] In one embodiment, after associating and storing the die data and substrate information of each die to obtain a database with corresponding relationships, the method further includes:

[0018] Obtain the die identification information of the first die in the packaged chip;

[0019] Based on the die identification information of the first die, retrieve the die data of other corresponding dies from the database.

[0020] A multi-die chip management device, comprising:

[0021] The data acquisition module is used to acquire the dies data of each die;

[0022] The data recording module is used to record the substrate information corresponding to each die during the process of selecting dies to the substrate based on the die data of each die.

[0023] The data processing module is used to associate and store the die data and substrate information of each die to obtain a database with corresponding relationships.

[0024] A computer device includes a memory and a processor, the memory storing a computer program, the processor executing the computer program to implement the steps of the method described above.

[0025] A computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method described above.

[0026] The aforementioned multi-die chip management method, apparatus, computer equipment, and storage medium record substrate information corresponding to each die during the process of selecting dies to substrates based on their die data. The die data and substrate information of each die are linked and stored to obtain a database with corresponding relationships. By linking and storing the die data and substrate information of each die, the die data of other dies can be found simply by combining the die data of one die with the database, effectively improving the traceability efficiency of multi-die chip data. Attached Figure Description

[0027] Figure 1 This is a flowchart of a multi-chip management method in one embodiment;

[0028] Figure 2 A flowchart of a multi-die chip management method in another embodiment;

[0029] Figure 3 This is a flowchart of a multi-die chip management method in yet another embodiment;

[0030] Figure 4 This is a schematic diagram illustrating the one-to-one correspondence between the first die and the substrate in one embodiment.

[0031] Figure 5 This is a schematic diagram illustrating the one-to-one correspondence between the second and third dies and the substrate in one embodiment.

[0032] Figures 6-8 This is a schematic diagram illustrating the identification of failures due to wafer-level issues in one embodiment;

[0033] Figures 9-10 This is a schematic diagram illustrating the process of identifying a problem in the packaging process that caused the failure in one embodiment.

[0034] Figure 11 This is a schematic diagram illustrating the correlation analysis of test data at different stages in one embodiment.

[0035] Figure 12 This is a structural block diagram of a multi-chip management device in one embodiment;

[0036] Figure 13 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0038] In one embodiment, such as Figure 1 As shown, a multi-die chip management method is provided, including:

[0039] Step S110: Obtain the die data for each die.

[0040] Specifically, wafer-level first testing can be performed on all or some dies to obtain die data for the corresponding dies. For dies that have not undergone wafer-level first testing, die data can be obtained directly from the original data at the time of manufacture. The content of the die data is not unique and may include die identification information and die test data. The die test data is used to characterize whether the die test passed. The die identification information can be determined based on the data of the wafer corresponding to each die during manufacturing. In this embodiment, the die identification information may specifically include the wafer batch number, wafer number, and the X / Y coordinates of the die on the wafer. It is understood that the die identification information may also include other relevant information about the die, which can be adjusted according to actual needs. Furthermore, it is understood that there is a correspondence between die identification information and die test data; that is, after obtaining the die identification information of a certain die, the corresponding die test data can be obtained.

[0041] Step S120: During the process of selecting dies to substrates based on the die data of each die, record the substrate information corresponding to each die.

[0042] Specifically, after acquiring the die data for each die, the die data and the die itself are sent to the packaging plant for die selection based on this data. That is, valid dies that pass the die test are selected for subsequent packaging operations based on the die test data. When placing the selected, tested dies onto the substrate, the corresponding substrate information is recorded. It can be understood that the specific content of the substrate information can be adjusted according to actual needs; for example, it may include the substrate coordinates and substrate number corresponding to the die placement position. Specifically, during the die selection process, the X / Y coordinates and substrate number of the substrate corresponding to the die placement position are recorded and correlated with the die identification information to form the die's substrate information. In other words, after obtaining the die identification information of a particular die, the corresponding substrate information can be obtained. Similarly, after obtaining the substrate information, the corresponding die identification information can be obtained. It should be noted that the multi-die chip described in this application refers to a chip formed by packaging multiple dies (two or more dies) together. These dies can be of the same type or different types, depending on the actual requirements. Thus, during the die selection process onto the substrate, multiple dies are placed on the same substrate coordinates. That is, one die identification information corresponds to one substrate information, and one substrate information corresponds to multiple die identification information. The substrate information can be obtained through the die identification information of a particular die, and then the die identification information of other dies packaged in the same chip can be further obtained through that substrate information.

[0043] Step S130: Associate and store the die data and substrate information of each die to obtain a database with corresponding relationships.

[0044] After obtaining the substrate information for each die, all die data and substrate information are integrated and stored together to establish a database with corresponding relationships, so as to facilitate data traceability in the future.

[0045] The above-mentioned multi-die chip management method links and stores the die data and substrate information of each die. By combining the die identification information of one die with the database, the die data of other dies can be found, which effectively improves the traceability efficiency of multi-die chip data.

[0046] In one embodiment, such as Figure 2 As shown, step S110 includes step S112: acquiring data obtained from the first wafer-level test of the first die and other dies, and generating die data for each die.

[0047] Specifically, wafer-level first testing (e.g., wafer-level probe testing) is performed on all dies, including the first die, to obtain die test data. This data is used for selecting valid dies for packaging. Additionally, during the wafer-level first testing, the dies are identified and / or marked to obtain die identification information. The obtained die test data and die identification information are combined as die data for subsequent selection and data association storage operations. The specific content of the wafer-level first test is not unique. For example, it can be determined based on the die type; for instance, if the first die is an ASIC die, voltage is applied to the first die for electrical performance testing. The type of test data is also not unique; a test pattern (also known as bin mapping) can be used to record the die bin number, for example, bin 1 represents the passed sample, and other bin numbers represent defective products. Furthermore, the wafer-level first test can be performed once or multiple times.

[0048] In another embodiment, such as Figure 3 As shown, step S110 includes step S114: obtaining data from the first wafer-level test of the first die, as well as the original data of other dies at the time of manufacture, and generating die data for each die.

[0049] In this embodiment, a wafer-level first test is performed on the first die to obtain die test data. This die test data, along with the die identification information, is used as the die data for the first die. For other dies, a wafer-level first test may not be performed; instead, the die data for other dies can be obtained based on the original data from the wafer at the time of manufacture. For example, if other dies are sensor dies, a wafer-level first test may not be performed.

[0050] It is understood that in other embodiments not shown, other dies may undergo partial wafer-level first testing and partial non-wafer-level first testing, except for the first die.

[0051] In one embodiment, such as Figure 2 and Figure 3 As shown, after step S130, the method further includes steps S140 to S160.

[0052] Step S140: Obtain the die identification information of the first die in the packaged chip.

[0053] Specifically, after each die is selected and placed onto the substrate, subsequent packaging operations are performed. Multiple dies located on the same substrate and at the same substrate coordinates are packaged to form a single chip. Information is read from the first die in the packaged chip to obtain its die identification information, such as wafer batch number, wafer number, and X / Y coordinates on the corresponding wafer. Specifically, the first die is a die equipped with memory, which stores the die identification information. The die identification information is obtained by reading the memory of the first die.

[0054] Step S150: Perform a second chip-level test on the chip to obtain chip test data.

[0055] Step S160: Associate and store the die identification information and chip test data of the first die in the database.

[0056] When data analysis is required, the die identification information of the first die can be obtained by reading the memory of the first die. Then, the die data of other related dies and related chip test data can be retrieved from the database using the die identification information of the first die.

[0057] It is understood that in other embodiments not shown, step S150 may be executed first, followed by step S140, or steps S140 and S150 may be executed simultaneously.

[0058] It is understood that in other embodiments not shown, step S140 and S150 may be executed without executing step S160. That is, the chip test data is not stored in the database, but the corresponding relationship and die data stored in the database are directly used and analyzed in conjunction with the chip test data. Specifically, if the chip is found to be normal through step S150, it can be shipped. If the chip is found to be of low quality through step S150, the die identification information of the first die can be read according to step 140, and then the corresponding relationship and die data in the database can be called according to the die identification information of the first die, and the low quality problem can be analyzed in conjunction with the chip test data.

[0059] It's understandable that the content of the chip-level second test is not unique and can be adjusted according to actual needs. For example, the chip-level second test may include functional tests such as power supply detection, pin detection, and logic testing on the packaged chip. After completing the chip-level second test, the chip that passes the test can be packaged and shipped. Furthermore, the chip-level second test can be performed once or multiple times.

[0060] In the traditional method, chip information is identified by special markings during wafer manufacturing. However, the limitations of marking on the chip wafer are becoming increasingly apparent. First, as the chip area becomes smaller, the markings become smaller and harder to distinguish. Second, as multiple chips are stacked, the markings will inevitably be obscured, requiring complex disassembly to see them. Third, contamination or scratches on the chip surface may make the chip markings unreadable.

[0061] The multi-die chip management method provided in this application, based on the correspondence between dies and substrates during the die selection and placement process, associates and stores the die identification information of each die with substrate information, including the wafer batch number, wafer number, X / Y coordinates of the die on the wafer, and the substrate number and X / Y coordinates of the placed substrate. After the first die is recorded, the correspondence between dies and substrates during the selection process of the second die, third die, and so on, is recorded according to the same requirements. Furthermore, the first die is equipped with a memory that stores the die identification information of the first die. During the second chip-level test, the die identification information of the first die is read, and the die identification information of the first die is associated and stored with the chip test data. In this way, for a specific chip, the die identification information of the first die can be obtained by reading its memory. After extracting the die identification information of the first die, combined with the stored database, the data of all dies in the chip and the chip test data can be obtained. This allows for a one-to-one correspondence between the data of each die, thereby achieving a one-to-one correspondence between wafer-level data and package-level data. This method systematically solves the problems of traceability, monitoring, and process optimization in the entire manufacturing process of multi-die chips. It systematically solves the problems of tracking chips after shipment, tracing historical production data, and analyzing historical die data one-to-one due to client failures. It truly achieves full-process monitoring and traceability of multi-die chips, and is highly efficient and easy to operate.

[0062] This application further reduces management costs and decreases the need for wafer-level testing of multiple dies. Only dies with memory are required to undergo wafer-level testing; testing of other dies is optional and can be selected based on actual needs without affecting the functionality. This achieves cost reduction while allowing for flexible application to different requirements. Furthermore, this application minimizes the size of the first die's memory. Only the wafer batch number, wafer number, and die's X / Y coordinate information on the wafer need to be written; other information is not mandatory and can be added as needed. This facilitates a reduction in the first die's area, thereby further optimizing chip costs.

[0063] To facilitate a better understanding of the above multi-chip management method, a detailed explanation is provided below with reference to specific embodiments.

[0064] The specific implementation steps of the above multi-die chip management method are as follows:

[0065] 1. Perform wafer-level probe testing on the first die and acquire its die data. The first die has a memory that can be written to. During wafer-level probe testing, the die identification information of the first die, including the wafer batch number, wafer number, and the X / Y coordinates of the first die on the wafer, can be written to the first die's memory. Other information can be selectively written or not, depending on the available memory space and other practical needs. After completing wafer-level probe testing on the first die, die test data is generated. Test patterns are used to record the die bin numbers; typically, bin 1 represents the passed sample, and other bin numbers represent defective products. The purpose of the test patterns is to select valid dies for use during packaging.

[0066] 2. Perform wafer-level probing on the second die, third die, ..., Nth die to obtain die data. This step is optional; that is, it is not necessary to perform wafer-level probing on all dies except the first die. If wafer-level probing is performed, the test pattern is used to obtain die data. If wafer-level probing is not performed, the original pattern from the wafer's factory shipment is used to obtain die data.

[0067] 3. Based on the die test data of the first die, select the first die that passed the test and place it on the substrate. Record the wafer batch number (wafer number), wafer number, X / Y coordinates of the selected first die on the wafer, and the X / Y coordinates and substrate number of the substrate corresponding to the placement position. Figure 4 As shown.

[0068] 4. Following step 3, sequentially select the second die, and record the wafer batch number, wafer number, X / Y coordinates of the selected second die on the wafer, and the X / Y coordinates and substrate number of the substrate corresponding to the placement position; after completing the selection of the second die, continue to select and record the third die, fourth die, ..., Nth die (if any), such as... Figure 5 As shown. When selecting samples for the second die, the third die, ..., the Nth die, if a test pattern obtained from wafer-level testing is available, the sample selection is performed according to the test pattern; if wafer-level testing is not performed, the sample selection is performed according to the original pattern from the wafer fab.

[0069] 5. Integrate the data from steps 1-4 to establish a database with corresponding relationships.

[0070] 6. After the selection of multiple dies is completed, the multiple dies are packaged to form a chip. Specifically, multiple dies located on the same substrate coordinates on the same substrate are packaged together to form a chip.

[0071] 7. Perform a final test on the packaged chip and read the die identification information of the first die from the first die memory, including the wafer batch number, wafer number, and X / Y coordinates on the corresponding wafer. This is the required information to be read; other information may also be read at the same time.

[0072] 8. Store the read die identification information and final test data of the first die in the database. When data analysis is needed, the die data and final test data of all associated dies in the database can be retrieved by reading the die identification information of the first die. Alternatively, the final test data is not stored in the database. If the final test result is low yield, the die data of other dies in the database are obtained based on the die identification information of the first die, and the low yield problem is analyzed in conjunction with the final test data.

[0073] The above-mentioned multi-die chip management method can solve the following problems:

[0074] 1. Locate failures caused by wafer-level issues.

[0075] by Figures 6-8 For example: A batch of chips fails the final test with poor quality, mainly due to test item X. X can be a failure code or a test parameter value. Since the chips in the final test are random and disordered, relying solely on the final test data for troubleshooting is ineffective and often fails to identify the cause.

[0076] According to the database provided in this application, after converting the final test data into wafer-level data, the seemingly chaotic failures show clear patterns after conversion: "1" represents a good product, and "X" represents a defective product. For example... Figure 6As shown, all failed chips originated from the edge of the wafer; Figure 7 As shown, all the failed chips originated from certain regular, fixed locations on the wafer; Figure 8 As shown, all the failed chips originated from a specific area of ​​the wafer.

[0077] 2. Investigate problems in the encapsulation process.

[0078] If converted to wafer-level data, such as Figure 9 As shown, if there is no pattern, then sorting by packaging substrate information can be considered. For example... Figure 10 As shown, after sorting according to the packaging substrate information, the pattern is obvious: the failed chips all come from regularly distributed vertical bars. This information provides an efficient and direct direction for finding problems.

[0079] 3. By analyzing the correlation of test data from different stages, optimize test control standards, improve the effectiveness of test control, and save production costs. For example... Figure 11 As shown, the correlation analysis between wafer-level test item X and final test data reveals that if the value of wafer-level test item X is less than 1.46, all tests fail at the final test stage. This indicates that the wafer-level X test item control standard does not meet the final test requirements. By optimizing the wafer-level X test item control standard, dies that do not meet product performance standards can be screened out before packaging, improving the yield of subsequent production processes and saving costs.

[0080] 4. This database can integrate data from all stages for correlation analysis, view product performance parameters and process correlations, optimize and monitor the corresponding processes, and maintain process stability.

[0081] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0082] Based on the same inventive concept, this application also provides a multi-die chip management device for implementing the multi-die chip management method described above. The solution provided by this device is similar to the implementation described in the above method; therefore, the specific limitations in one or more embodiments of the multi-die chip management device provided below can be found in the limitations of the multi-die chip management method described above, and will not be repeated here.

[0083] In one embodiment, such as Figure 12 As shown, a multi-die chip management device is also provided, including: a data acquisition module 110, a data recording module 120, and a data processing module 130, wherein:

[0084] The data acquisition module 110 is used to acquire the spool data of each spool.

[0085] The data recording module 120 is used to record the substrate information corresponding to each die during the process of selecting dies to the substrate based on the die data of each die.

[0086] The data processing module 130 is used to associate and store the die data and substrate information of each die to obtain a database with corresponding relationships.

[0087] In one embodiment, the data acquisition module 110 is used to acquire data obtained from the first wafer-level first test of the first die and other dies, and generate die data for each die; the memory of the first die stores die identification information.

[0088] In one embodiment, the data acquisition module 110 is used to acquire data obtained from the first wafer-level test of the first die, as well as the original data of other dies when they leave the factory, and generate die data for each die; the memory of the first die stores die identification information.

[0089] In one embodiment, a second chip-level test is performed on the chip to obtain chip test data while reading the die identification information of the first die in the chip; the data acquisition module 110 is also used to acquire the die identification information of the first die in the packaged chip and the chip test data; the data processing module 130 is also used to associate and store the die identification information of the first die and the chip test data in a database.

[0090] In one embodiment, a second chip-level test is performed on the chip to obtain chip test data while reading the die identification information of the first die in the chip; the data acquisition module 110 is also used to acquire the die identification information of the first die in the packaged chip; the data processing module 130 is also used to retrieve the die data of other corresponding dies from the database based on the die identification information of the first die.

[0091] Each module in the aforementioned multi-chip management device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0092] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 13 As shown, this computer device includes a processor, memory, input / output interfaces (I / O), and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores data. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communication with external terminals via a network connection. When the computer program is executed by the processor, it implements a multi-die chip management method.

[0093] In one embodiment, a computer device is provided, including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to perform the following steps: acquiring die data of each die; during the process of selecting dies to a substrate based on the die data of each die, recording the substrate information corresponding to each die; and associating and storing the die data of each die and the substrate information to obtain a database with corresponding relationships.

[0094] In one embodiment, when the processor executes the computer program, it further performs the following steps: acquiring data obtained from a wafer-level first test on the first die and other dies, generating die data for each die; the memory of the first die stores die identification information.

[0095] In one embodiment, when the processor executes the computer program, it further performs the following steps: acquiring data obtained from a wafer-level first test on the first die, as well as the original data of other dies at the time of manufacture, and generating die data for each die; the memory of the first die stores die identification information.

[0096] In one embodiment, when the processor executes the computer program, it further performs the following steps: obtaining the die identification information of the first die in the packaged chip and the chip test data obtained by performing a second chip-level test on the chip; and associating and storing the die identification information of the first die and the chip test data in a database.

[0097] In one embodiment, when the processor executes the computer program, it further performs the following steps: obtaining the die identification information of the first die in the packaged chip; and retrieving the die data of other corresponding dies from the database based on the die identification information of the first die.

[0098] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, it performs the following steps: acquiring die data of each die; during the process of selecting dies to a substrate based on the die data of each die, recording the substrate information corresponding to each die; and associating and storing the die data of each die and the substrate information to obtain a database with corresponding relationships.

[0099] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: acquiring data obtained from a wafer-level first test on the first die and other dies, generating die data for each die; the memory of the first die stores die identification information.

[0100] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: acquiring data obtained from a wafer-level first test on the first die, as well as the original data of other dies at the time of manufacture, and generating die data for each die; the memory of the first die stores die identification information.

[0101] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: obtaining the die identification information of the first die in the packaged chip and the chip test data obtained by performing a second chip-level test on the chip; and associating and storing the die identification information of the first die and the chip test data in a database.

[0102] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: obtaining the die identification information of the first die in the packaged chip; and retrieving the die data of other corresponding dies from the database based on the die identification information of the first die.

[0103] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps: acquiring die data of each die; during the process of selecting dies to a substrate based on the die data of each die, recording substrate information corresponding to each die; and associating and storing the die data of each die and the substrate information to obtain a database with corresponding relationships.

[0104] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: acquiring data obtained from a wafer-level first test on the first die and other dies, generating die data for each die; the memory of the first die stores die identification information.

[0105] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: acquiring data obtained from a wafer-level first test on the first die, as well as the original data of other dies at the time of manufacture, and generating die data for each die; the memory of the first die stores die identification information.

[0106] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: obtaining the die identification information of the first die in the packaged chip and the chip test data obtained by performing a second chip-level test on the chip; and associating and storing the die identification information of the first die and the chip test data in a database.

[0107] In one embodiment, when the computer program is executed by the processor, it further performs the following steps: obtaining the die identification information of the first die in the packaged chip; and retrieving the die data of other corresponding dies from the database based on the die identification information of the first die.

[0108] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions.

[0109] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0110] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0111] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A multi-die chip management method, characterized in that, include: Obtain the die data for each die; The chip data includes chip identification information and chip test data, and there is a corresponding relationship between the chip identification information and the chip test data; During the process of selecting dies from the substrate based on the die data of each die, the substrate information corresponding to the die identification information of each die is recorded. Multiple dies are placed on the same substrate coordinates on the same substrate. One die identification information corresponds to one substrate information, and one substrate information corresponds to multiple die identification information. Multiple dies located on the same substrate coordinates on the same substrate are packaged together to form a multi-die chip; The die data and substrate information of each die are associated and stored to obtain a database with corresponding relationships.

2. The method according to claim 1, characterized in that, The die test data is used to characterize whether the die test is passed; the die identification information is determined based on the data of the wafer corresponding to each die during production.

3. The method according to claim 2, characterized in that, The die identification information includes the wafer batch number, wafer number, and the X / Y coordinates of the die on the wafer.

4. The method according to claim 1, characterized in that, The substrate information includes the substrate coordinates and substrate number corresponding to the position where the die is placed on the substrate.

5. The method according to claim 1, characterized in that, The step of acquiring the die data for each die includes: acquiring data obtained from a wafer-level first test performed on the first die and other dies, and generating die data for each die; or, The process of acquiring the chip data of each chip includes: acquiring the data obtained from the first wafer-level test of the first chip, as well as the original data of other chips at the time of manufacture, and generating the chip data of each chip.

6. The method according to claim 5, characterized in that, After associating and storing the die data and substrate information of each die to obtain a database with corresponding relationships, the method further includes: Obtain the die identification information of the first die in the packaged chip; Perform a second chip-level test on the chip to obtain chip test data; The die identification information of the first die and the chip test data are associated and stored in the database.

7. The method according to claim 5, characterized in that, After associating and storing the die data and substrate information of each die to obtain a database with corresponding relationships, the method further includes: Obtain the die identification information of the first die in the packaged chip; Based on the die identification information of the first die, retrieve the die data of other corresponding dies from the database.

8. A multi-die chip management device, characterized in that, include: The data acquisition module is used to acquire the dies data of each die; The chip data includes chip identification information and chip test data, and there is a corresponding relationship between the chip identification information and the chip test data; The data recording module is used to record the substrate information corresponding to the die identification information of each die during the process of picking the die to the substrate based on the die data of each die. Multiple dies are placed on the same substrate coordinates on the same substrate. One die identification information corresponds to one substrate information, and one substrate information corresponds to multiple die identification information. Multiple dies located on the same substrate coordinates on the same substrate are packaged together to form a multi-die chip; The data processing module is used to associate and store the die data and substrate information of each die to obtain a database with corresponding relationships.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

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