Refrigeration structure and electronic device

Abstract

The application discloses a refrigeration structure and an electronic device. The refrigeration structure is arranged in the electronic device and comprises a substrate, a thermoelectric layer and a phase change layer. The substrate comprises a first substrate and a second substrate. The thermoelectric layer comprises a first thermoelectric layer and a second thermoelectric layer. The first thermoelectric layer and the second thermoelectric layer are arranged on opposite sides of the first substrate and the second substrate respectively. The phase change layer is arranged between the first thermoelectric layer and the second thermoelectric layer. The thermoelectric layer comprises a plurality of first electrodes and a plurality of second electrodes. The first electrodes and the second electrodes are arranged adjacently in the first thermoelectric layer and the second thermoelectric layer. The first electrodes in the first thermoelectric layer and the second electrodes in the second thermoelectric layer are arranged oppositely, and the oppositely arranged first electrodes and the second electrodes are electrically connected.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of communication equipment, and particularly relates to a refrigeration structure and electronic equipment. BACKGROUND

[0002] At present, with the increasing integration and power consumption of electronic devices, the demand for electronic device thermal management is also increasing. Especially for terminal devices such as mobile phones and smart watches, which have very high temperature control requirements, the thermal management scheme will directly determine the quality of the product.

[0003] Due to the high requirements of mobile terminals such as mobile phones on the compactness and reliability of their structures, the widely used thermal management method is mainly passive refrigeration scheme, which introduces heat pipes, heat plates and the like to make the heat inside the mobile phone evenly distributed and quickly exported. However, with the increase of heat generated by mobile phone processors and other devices, the passive refrigeration scheme has been unable to meet the heat dissipation requirements of mobile phones in high-power scenarios. Although some products have applied active refrigeration schemes such as air cooling and water cooling to mobile phones or mobile phone accessories, the related refrigeration devices are relatively large in size and have moving parts, which seriously affect the size and structural reliability of the mobile phone after being added. In addition, conventional semiconductor refrigerators (TEC, Thermoelectric Cooler) must be matched with heat sinks on the hot end to be applied, which makes the overall device size larger, and the phase change capsules and phase change heat-conducting gels introduced into the mobile phone at present usually cannot significantly improve the heat dissipation of the mobile phone due to the small volume of the phase change material. SUMMARY

[0004] The present application aims to provide a refrigeration structure and electronic equipment, which at least solves the problems of low heat dissipation efficiency of the passive heat dissipation scheme of the current electronic equipment, large size and poor reliability of the active refrigeration scheme device such as air cooling and water cooling.

[0005] In order to solve the above technical problems, the present application is implemented as follows:

[0006] In a first aspect, the embodiments of the present application propose a refrigeration structure, comprising: a substrate, a thermoelectric layer and a phase change layer.

[0007] The substrate comprises a first substrate and a second substrate, the thermoelectric layer comprises a first thermoelectric layer and a second thermoelectric layer, the first substrate and the second substrate are respectively provided with the first thermoelectric layer and the second thermoelectric layer on the opposite sides, and the phase change layer is arranged between the first thermoelectric layer and the second thermoelectric layer.

[0008] The thermoelectric layer comprises a plurality of first electrodes and a plurality of second electrodes, the first electrodes and the second electrodes are arranged adjacently in the first thermoelectric layer and the second thermoelectric layer; the first electrodes and the second electrodes arranged oppositely in the first thermoelectric layer and the second thermoelectric layer are electrically connected.

[0009] In a second aspect, the embodiments of the present application further provide an electronic device, comprising the refrigeration structure and a heat generating device, the heat generating device is attached to the substrate of the refrigeration structure.

[0010] The refrigeration structure provided by the present application protects the thermoelectric layer by arranging the substrate on both sides of the thermoelectric layer, avoids the interference between the circuit current in the refrigeration structure and the circuit current in the electronic device, and also expands the contact area between the refrigeration structure and the electronic device, thereby improving the transfer efficiency of cold energy between the electronic device and the thermoelectric layer, so as to better control the temperature; when the first electrodes and the second electrodes are powered, the cold energy can be transferred between the phase change layer and the substrate and the electronic device under the Peltier effect, so as to realize the temperature control of the electronic device; the phase change layer can store or release cold energy through its phase change, thereby adjusting the internal temperature of the electronic device; the refrigeration structure does not need moving parts, and does not need to specially design air ducts and flow paths necessary for air cooling and liquid cooling, and can be directly embedded into the electronic device, so as to have compact structure and high reliability; in addition, the refrigeration structure can realize dynamic thermal management of the electronic device through the working mode of storing cold energy at low temperature and releasing cold energy at high temperature, effectively control the temperature of the electronic device, ensure the performance of the electronic device, and improve the user's thermal experience.

[0011] Additional aspects and advantages of the present application will be made apparent by the following description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood by considering the following detailed description, from which the singular aspects become apparent.

[0013] Figure 1 is a cross-sectional view of a refrigeration structure according to an embodiment of the present application;

[0014] Figure 2 is a perspective view of a refrigeration structure according to an embodiment of the present application;

[0015] Figure 3 is an exploded view of a refrigeration structure according to an embodiment of the present application;

[0016] Figure 4is a schematic view of an electronic device provided according to another embodiment of the present application;

[0017] Reference signs:

[0018] 1, refrigeration structure;

[0019] 10, first thermoelectric layer; 101, first electrode; 102, second electrode; 103, first partition member; 104, conductive member;

[0020] 20, phase change layer; 201, sealing member; 202, heat conducting member; 2021, heat conducting plate; 2022, heat conducting column; 203, phase change medium;

[0021] 30, second thermoelectric layer; 301, second partition member;

[0022] 40, first substrate; 50, second substrate;

[0023] 2, display screen; 3, middle frame; 4, heat spreading plate; 5, mainboard; 6, processor. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, for the purpose of explanation, and are not to be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work under the premise, belong to the scope of protection of the present application.

[0025] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified and limited, the term "a plurality of" means two or more.

[0026] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only, for the purpose of explanation, and are not to be understood as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work under the premise, belong to the scope of protection of the present application. Figures 1 to 3The application discloses a refrigeration structure for an electronic device such as a smart phone, a game console, a tablet computer, an e-book reader or a wearable device. Of course, the refrigeration structure can also be used for other devices, and the application does not limit the refrigeration structure to the electronic device.

[0028] The refrigeration structure 1 provided by the application is used in an electronic device and comprises a substrate, a thermoelectric layer and a phase change layer 20. The substrate comprises a first substrate 40 and a second substrate 50, the thermoelectric layer comprises a first thermoelectric layer 10 and a second thermoelectric layer 30, the first thermoelectric layer 10 and the second thermoelectric layer 30 are arranged on opposite sides of the first substrate 40 and the second substrate 50 respectively, and the phase change layer 20 is arranged between the first thermoelectric layer 10 and the second thermoelectric layer 30. The thermoelectric layer comprises a plurality of first electrodes 101 and a plurality of second electrodes 102, the first electrodes 101 and the second electrodes 102 are arranged adjacent to each other in the first thermoelectric layer 10 and the second thermoelectric layer 30, the first electrodes 101 in the first thermoelectric layer 10 and the second electrodes 102 in the second thermoelectric layer 30 are arranged opposite to each other, and the first electrodes 101 and the second electrodes 102 arranged opposite to each other are electrically connected.

[0029] In the embodiment, the first thermoelectric layer 10 and the second thermoelectric layer 30 are arranged between the first substrate 40 and the second substrate 50, so that the first substrate 40 and the second substrate 50 can cover the first thermoelectric layer 10, the second thermoelectric layer 30 and the phase change layer 20, protect the refrigeration structure 1, and avoid interference between the circuit current of the electronic device and the refrigeration structure 1. Meanwhile, the first substrate 40 and the second substrate 50 can expand the contact area of the refrigeration structure 1 and the electronic device, can more efficiently transfer cold energy between the electronic device and the thermoelectric layer, and has a better temperature control effect. The first electrodes 101 and the second electrodes 102 are powered on, and the first thermoelectric layer 10 and the second thermoelectric layer 30 can transfer cold energy between the substrate and the phase change layer 20 under the action of the Peltier effect. The phase change layer 20 can store or release cold energy by phase change. For example, when the temperature in the electronic device is too high, the thermoelectric layer is powered on, the thermoelectric layer transfers the cold energy in the phase change layer 20 to the electronic device under the action of the Peltier effect, thereby reducing the temperature of the electronic device and ensuring the performance of the electronic device. When the electronic device is in a low-power consumption state such as charging or screen-off standby, the refrigeration structure 1 gradually cools down, the phase change layer 20 releases heat through the thermoelectric layer and stores cold energy, so as to release the cold energy to meet the temperature control requirement when the temperature in the electronic device is too high. The whole structure does not need a moving part, has a compact structure and high reliability.

[0030] The refrigeration structure 1 provided in the application is protected by arranging the substrate on both sides of the thermoelectric layer, and the circuit current inside the refrigeration structure 1 and the circuit current inside the electronic device do not interfere with each other, and the contact area between the refrigeration structure 1 and the electronic device is also enlarged, the transfer efficiency of the cold energy between the electronic device and the thermoelectric layer is improved, so that the temperature control is better; when the first electrode 101 and the second electrode 102 are powered, the cold energy is transferred between the phase change layer 20 and the substrate under the Peltier effect, and then the cold energy is transferred between the refrigeration structure 1 and the electronic device, so that the temperature control of the electronic device is realized; the phase change layer 20 can store or release the cold energy by itself, so as to adjust the temperature inside the electronic device; the refrigeration structure 1 does not need moving parts, and does not need air ducts and flow paths specially designed for air cooling and liquid cooling, and can be directly embedded into the electronic device, and has compact structure and high reliability; in addition, the refrigeration structure 1 can adopt the working mode of storing cold energy at low temperature and releasing cold energy at high temperature, realizes the dynamic thermal management of the electronic device, can effectively control the temperature of the electronic device, ensures the performance of the electronic device, improves the user's thermal experience, and effectively solves the problems of low heat dissipation efficiency of the passive heat dissipation scheme of the electronic device, large device volume and poor reliability of the active refrigeration scheme such as air cooling and water cooling.

[0031] Specifically, the first substrate 40 and the second substrate 50 can be aluminum oxide ceramic plates or aluminum nitride ceramic plates, which have good thermal conductivity and electrical insulation performance, can avoid the mutual interference of the circuit current in the electronic device and the refrigeration structure 1, and can efficiently transfer the cold energy between the electronic device and the phase change layer 20.

[0032] Specifically, as shown in Figure 1 and Figure 3 , the thermoelectric layer further comprises a plurality of conductive pieces 104, and the adjacent first electrode 101 and second electrode 102 are electrically connected by the corresponding conductive piece 104 in the first thermoelectric layer 10 and the second thermoelectric layer 30.

[0033] In the embodiment, by arranging the conductive piece 104 on the first thermoelectric layer 10 and the second thermoelectric layer 30, and electrically connecting the conductive piece 104 with the adjacent first electrode 101 and second electrode 102 respectively, the conductive piece 104, the first electrode 101, the phase change layer 20 and the second electrode 102 form a path, and the conductive piece 104 at both ends of the path is connected with the positive and negative poles of the power supply respectively, so that the first electrode 101 and the second electrode 102 can be powered by the power supply, so as to realize the transfer of cold energy between the phase change layer 20 and the electronic device under the Peltier effect, which has simple and compact structure and high practicability.

[0034] In one specific embodiment, as shown in Figure 1 and Figure 3As shown, the conductive member 104 can be a copper electrode sheet or a copper rib plate embedded in the first substrate 40 and the second substrate 50 respectively, and the two ends of the conductive member 104 are in abutment with the adjacent first electrode 101 and second electrode 102 respectively.

[0035] In some embodiments, as shown in Figure 1 and Figure 3 As shown, the phase change layer 20 includes a phase change medium 203 and a plurality of heat-conducting members 202 arranged at intervals; the two ends of each heat-conducting member 202 are in abutment with the oppositely arranged first electrode 101 and second electrode 102 respectively, and the phase change medium 203 is filled between the plurality of heat-conducting members 202.

[0036] In the present embodiment, the phase change medium 203 can store or release cold energy (such as freon) by itself, and the heat-conducting member 202 can transfer cold energy between the phase change medium 203 and the first thermoelectric layer 10 and the second thermoelectric layer 30, so as to realize the refrigeration and cold storage functions of the refrigeration structure 1; at the same time, the heat-conducting member 202 can be connected as an electrical conductor between the oppositely arranged first electrode 101 and second electrode 102, so that the current passes through, forming a path, so that the first electrode 101 and the second electrode 102 can transfer cold energy between the heat-conducting member 202 and the substrate under the Peltier effect; by filling the phase change medium 203 between the plurality of heat-conducting members 202, the entire structure is more compact, which is conducive to reducing the volume of the refrigeration structure 1.

[0037] Specifically, as shown in Figure 1 and Figure 3 Each heat-conducting member 202 includes two heat-conducting plates 2021 and a heat-conducting column 2022, the two heat-conducting plates 2021 are respectively attached to the oppositely arranged first electrode 101 and second electrode 102, and the heat-conducting column 2022 is arranged between the two heat-conducting plates 2021.

[0038] In the present embodiment, the two heat-conducting plates 2021 and the heat-conducting column 2022 constitute an I-shaped rib structure; this structure can make the two ends of the heat-conducting plate 2021 fully contact with the oppositely arranged first electrode 101 and second electrode 102, and better play the role of heat transfer and electrical conduction between the first electrode 101 and the second electrode 102; at the same time, the heat-conducting plate 2021 and the heat-conducting column 2022 can also fully contact with the phase change medium 203, further improving the heat exchange efficiency between the phase change medium 203, the heat-conducting member 202, the first electrode 101 and the second electrode 102, and being conducive to improving the refrigeration and cold storage efficiency of the refrigeration structure 1; in addition, the gap between the plurality of I-shaped rib plates is larger, which can fill more phase change medium 203, while ensuring the refrigeration and cold storage effect of the refrigeration structure 1, the structure is more compact and occupies less volume.

[0039] Specifically, as shown in Figure 1As shown, the projection of the heat-conducting plate 2021 on the substrate coincides with the projection of the first electrode 101 on the substrate, and the projection of the heat-conducting plate 2021 on the substrate covers the projection of the heat-conducting column 2022 on the substrate.

[0040] In this embodiment, the projection of the heat-conducting plate 2021 on the substrate coincides with the projection of the first electrode 101 on the substrate, so that the contact area of the heat-conducting plates 2021 at both ends of the heat-conducting member 202 with the corresponding first electrode 101 and second electrode 102 is maximized, further ensuring the heat conduction and electrical conduction effect of the heat-conducting plates 2021 between the first electrode 101 and the second electrode 102; at the same time, by setting the projection of the heat-conducting plate 2021 on the substrate to cover the projection of the heat-conducting column 2022 on the substrate, the contact area of the heat-conducting column 2022 and the heat-conducting plate 2021 is also maximized, thereby ensuring the heat conduction and electrical conduction effect of the heat-conducting column 2022 between the heat-conducting plates 2021, which is conducive to improving the heat conduction and electrical conduction effect of the entire heat-conducting member 202 between the corresponding first electrode 101 and second electrode 102.

[0041] In some embodiments, as shown in Figures 1 to 3 The refrigeration structure 1 further includes a sealing member 201, which is arranged between the first substrate 40 and the second substrate 50 and encloses a sealed cavity with the first substrate 40 and the second substrate 50, and the thermoelectric layer and the phase change layer 20 are located in the sealed cavity. In this embodiment, by arranging the sealing member 201 between the first substrate 40 and the second substrate 50, the sealing member 201, the first substrate 40 and the second substrate 50 enclose a containing cavity, which is used to contain the first thermoelectric layer 10, the phase change layer 20 and the second thermoelectric layer 30, and seal and protect the first thermoelectric layer 10, the phase change layer 20 and the second thermoelectric layer 30; at the same time, the sealing member 201 reduces the contact area of the phase change layer 20 with the outside, which is conducive to improving the storage capacity of the phase change layer 20 for cold and heat, so as to realize dynamic thermal management of electronic equipment.

[0042] Optionally, the sealing member 201 can be a rubber sealing member.

[0043] In some embodiments, the first electrode 101 is a P-type thermoelectric arm, and the second electrode 102 is an N-type thermoelectric arm.

[0044] In this embodiment, by setting the first electrode 101 as a P-type thermoelectric arm and the second electrode 102 as an N-type thermoelectric arm, the polarities of the first electrode 101 and the second electrode 102 at both ends of the same heat-conducting member 202 are opposite, so that when the refrigeration structure 1 is powered on, the Peltier effect at the contact surface of the first electrode 101 and the second electrode 102 with the heat-conducting plate 2021 is the same, that is, the first electrode 101 and the second electrode 102 simultaneously absorb or release heat from the heat-conducting plate 2021, thereby realizing that the phase change medium 203 simultaneously absorbs or releases cold from the first thermoelectric layer 10 and the second thermoelectric layer 30.

[0045] In one embodiment, as shown in Figure 1 and Figure 3 The first thermoelectric layer 10 and the second thermoelectric layer 30 each include a thermoelectric array; the thermoelectric array includes a plurality of columns of first electrodes 101 and second electrodes 102 arranged alternately and spaced in sequence, and the first electrodes 101 and the second electrodes 102 of adjacent two columns are arranged oppositely; the heat-conducting plates 2021 at both ends of the heat-conducting member 202 abut against the first electrodes 101 of the first thermoelectric layer 10 and the second electrodes 102 of the second thermoelectric layer 30 respectively, or the heat-conducting plates 2021 at both ends of the heat-conducting member 202 abut against the first electrodes 101 of the second thermoelectric layer 30 and the second electrodes 102 of the first thermoelectric layer 10 respectively.

[0046] In the embodiment, by arranging the first electrodes 101 and the second electrodes 102 on the thermoelectric array in a spaced manner, the heat-conducting plates 2021 on the same side of the adjacent two heat-conducting members 202 abut against the first electrodes 101 and the second electrodes 102 respectively, the first electrodes 101 abutted by each heat-conducting member 202 and the second electrodes 102 abutted by the heat-conducting member 202 in the same column are electrically connected through the conductive member 104, the second electrodes 102 abutted by each heat-conducting member 202 and the first electrodes 101 abutted by the heat-conducting member 202 in the same column are electrically connected through the conductive member 104, and the first electrodes 101 or the second electrodes 102 on one side of the heat-conducting member 202 at both ends of a column and the second electrodes 102 or the first electrodes 101 abutted by the heat-conducting member 202 in the adjacent column are electrically connected through the conductive member 104, so that the heat-conducting member 202, the first electrode 101, the second electrode 102 and the conductive member 104 are connected in series to form a path, which has a compact structure and good use effect.

[0047] In some embodiments, as shown in Figure 1 and Figure 3 The thermoelectric layer further includes a first partition member 103 and a second partition member 301; the first partition member 103 is arranged in the first thermoelectric layer 10, and the second partition member 301 is arranged in the second thermoelectric layer 30; the first partition member 103 and the second partition member 301 each have a plurality of mounting holes arranged in an array and corresponding to each other on the opposite side, and each mounting hole is used for arranging a P-type thermoelectric arm or an N-type thermoelectric arm.

[0048] In the embodiment, by arranging the first electrode 101 and the second electrode 102 on the mounting holes of the first partition member 103 and the second partition member 301, the first partition member 103 and the second partition member 301 can respectively isolate the phase change medium 203 and the first substrate 40, the second substrate 50, avoid direct contact between the phase change medium 203 and the first substrate 40, the second substrate 50, avoid heat transfer between the phase change medium 203 and the first substrate 40, the second substrate 50 when the refrigeration structure 1 is not powered, avoid waste of cold energy, further improve the storage capacity of the phase change layer 20 for cold energy and heat energy, so as to realize dynamic thermal management of the electronic device; at the same time, the first partition member 103 and the second partition member 301 can also reduce the material consumption of the first electrode 101 and the second electrode 102, and reduce the cost.

[0049] Optionally, the first partition member 103 and the second partition member 301 can be plastic partitions or rubber partitions.

[0050] In some embodiments, the refrigeration structure 1 is arranged in an electronic device and can be switched between a refrigeration mode and a cold storage mode; in the refrigeration mode, the first thermoelectric layer 10 transmits cold energy in the phase change layer 20 to the electronic device, and the second thermoelectric layer 30 transmits cold energy in the phase change layer 20 to the electronic device; in the cold storage mode, the first thermoelectric layer 10 transmits cold energy in the electronic device to the phase change layer 20, and the second thermoelectric layer 30 transmits cold energy in the electronic device to the phase change layer 20.

[0051] In the embodiment, when the temperature inside the electronic device exceeds the set temperature, the refrigeration structure 1 is switched to the refrigeration mode, the refrigeration structure 1 is powered, and the first thermoelectric layer 10 and the second thermoelectric layer 30 absorb heat of the electronic device and transmit the cold energy in the phase change layer 20 to the electronic device under the action of the Peltier effect, effectively reducing the temperature of the electronic device and ensuring the performance of the electronic device; when the electronic device is charging or in a screen-off standby state, the refrigeration structure 1 is switched to the cold storage mode, the refrigeration structure 1 is slowly cooled, the first thermoelectric layer 10 and the second thermoelectric layer 30 absorb the heat stored in the phase change layer 20 and release the cold energy to the phase change layer 20, so that when the refrigeration structure 1 is switched to the refrigeration mode subsequently, the phase change layer 20 has enough cold energy to release to reduce the temperature of the electronic device; through the above working mode of storing cold energy at low temperature and releasing cold energy at high temperature, the heat generated by the electronic device at high temperature can be cleverly transported and released at low temperature, realizing dynamic thermal management of the electronic device, effectively controlling the temperature of the electronic device, ensuring the performance of the electronic device, and improving the user's thermal experience.

[0052] Optionally, the refrigeration structure 1 further comprises a temperature sensor, when the temperature sensor senses that the temperature inside the electronic device reaches the set temperature, the refrigeration structure 1 is switched to the refrigeration mode to release cold energy to reduce the temperature of the electronic device.

[0053] Optionally, when the refrigeration structure 1 switches to the cold storage mode, the phase change layer 20 can slowly transfer the heat to the electronic device through the first thermoelectric layer 10 and the second thermoelectric layer 30 by natural cooling and release to the outside to store the cold; or the refrigeration structure 1 can also be reversed to be powered (relative to the refrigeration mode), and the first thermoelectric layer 10 and the second thermoelectric layer 30 absorb the heat of the phase change layer 20 under the action of the Peltier effect and transfer it to the electronic device and release it to the outside to store the cold.

[0054] On the other hand, as Figure 4 shown, the electronic device also includes a display screen 2, a middle frame 3; the refrigeration structure 1 is arranged between the display screen 2 and the middle frame 3.

[0055] It can be understood that when the temperature of the heat generating device is higher than the first temperature, the heat generating device is in a high temperature state, such as the electronic device is in a high power consumption working state, the heat of the heat generating device is conducted to the refrigeration structure 1, and the substrate of the refrigeration structure 1 transfers the heat to the thermoelectric layer and the phase change layer 20, wherein the thermoelectric layer converts the heat into electron and hole pairs through the Peltier effect, and then consumes the heat; the heat not consumed by the thermoelectric layer is transferred to the phase change layer 20, and the phase change layer 20 absorbs heat to change phase, such as melting, to further consume the heat; at this time, the refrigeration structure 1 is in the refrigeration mode, so that the heat generated by the heat generating device during work can be dissipated through the refrigeration structure 1.

[0056] When the temperature of the heat generating device is lower than the second temperature, the heat generating device is in a low temperature state, such as the electronic device is in a standby state, at this time, the refrigeration structure 1 is in the cold storage mode, and the phase change layer 20 in the refrigeration structure 1 condenses to slowly release the stored heat, so that the refrigeration mode can be entered when the heat generating device works to generate more heat, and the working mode is cycled. It can be understood that the first temperature is higher than the second temperature.

[0057] By adopting the refrigeration structure 1 provided in the above embodiments, the electronic device of the present application also has the advantages of the above refrigeration structure 1, which will not be repeated here.

[0058] Specifically, as Figure 4 shown, the electronic device also includes a display screen 2, a middle frame 3; the refrigeration structure 1 is arranged between the display screen 2 and the middle frame 3.

[0059] In the embodiment, the display screen 2 and the middle frame 3 are generally components where heat is easily accumulated when the electronic device is in use. By arranging the refrigeration structure 1 between the display screen 2 and the middle frame 3 and adopting the following working mode: when the temperature in the electronic device reaches the set temperature, the refrigeration structure 1 is switched to the refrigeration mode, the cold quantity is transferred from the phase change layer 20 to the display screen 2 and the middle frame 3 on both sides, the temperature of the display screen 2 and the middle frame 3 is reduced, and the phase change medium 203 inside the refrigeration structure 1 is heated, and the heat is stored through the phase change of the phase change medium 203; when the electronic device is in the charging or standby screen-off state, the phase change medium 203 slowly cools and releases heat, and stores cold quantity. Through the above working mode of storing cold at low temperature and releasing cold at high temperature, the heat generated by the electronic device at high temperature can be cleverly transported to be released at low temperature, realizing dynamic thermal management of the electronic device, ensuring performance of the electronic device, and improving user experience.

[0060] Specifically, as shown in Figure 4 , the electronic device further comprises a vapor chamber 4, the vapor chamber 4 is arranged opposite to the display screen 2, and the vapor chamber 4 is provided with a through hole for avoiding the refrigeration structure 1, the refrigeration structure 1 passes through the through hole and abuts against the display screen 2 and the middle frame 3 at both ends.

[0061] In the embodiment, by arranging the vapor chamber 4, the vapor chamber 4 is in heat transfer with the display screen 2, so that the heat distribution is more uniform, which is beneficial to improve the heat dissipation efficiency of the electronic device; meanwhile, by arranging the through hole in the vapor chamber 4 for passing the refrigeration structure 1, the refrigeration structure 1 abuts against the display screen 2 and the middle frame 3 at both ends, so that the internal structure of the electronic device is more compact and the volume is smaller while the heat dissipation efficiency of the refrigeration structure 1 is ensured.

[0062] Optionally, a groove can also be arranged on the vapor chamber 4, the size and shape of the groove are adapted to the refrigeration structure 1, one end of the refrigeration structure 1 can be embedded in the groove of the vapor chamber 4, and the other end abuts against the middle frame 3.

[0063] In some embodiments, as shown in Figure 4 , the electronic device further comprises a mainboard 5 and a processor 6; the mainboard 5 is arranged on the side of the middle frame 3 away from the refrigeration structure 1, at least a part of the mainboard 5 corresponds to the refrigeration structure 1, and the processor 6 is arranged on the mainboard 5.

[0064] In the embodiment, by arranging at least a part of the mainboard 5 to correspond to the refrigeration structure 1, that is, the projection of the refrigeration structure 1 on the plane where the middle frame 3 is located is inside the projection of the mainboard 5 on the plane where the middle frame 3 is located, when the processor 6 and other elements on the mainboard 5 work and generate heat, the heat can quickly pass through the middle frame 3 and be transferred to the refrigeration structure 1, which is beneficial to the dynamic thermal management of the refrigeration structure 1 on the electronic device, and ensures the working temperature and performance of the processor 6.

[0065] In one specific embodiment, as shown in Figure 4As shown, the projection of the refrigeration structure 1 on the plane where the middle frame 3 is located and the projection of the processor 6 on the plane where the middle frame 3 is located do not coincide, that is, the processor 6 is arranged staggered with the refrigeration structure 1, avoiding the stacking of the processor 6 and the refrigeration structure 1 to increase the size of the electronic device in the direction perpendicular to the mainboard 5, making the internal structure of the electronic device more compact and smaller in volume.

[0066] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0067] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A cooling structure, characterized in that, The cooling structure includes: a substrate, a thermoelectric layer, and a phase change layer; The substrate includes a first substrate and a second substrate, the thermoelectric layer includes a first thermoelectric layer and a second thermoelectric layer, the first thermoelectric layer and the second thermoelectric layer are respectively disposed on opposite sides of the first substrate and the second substrate, and the phase change layer is disposed between the first thermoelectric layer and the second thermoelectric layer. The thermoelectric layer includes a plurality of first electrodes and a plurality of second electrodes. In the first thermoelectric layer and the second thermoelectric layer, the first electrodes and the second electrodes are arranged adjacent to each other. The first electrodes in the first thermoelectric layer and the second electrodes in the second thermoelectric layer are arranged opposite to each other, and the oppositely arranged first electrodes and second electrodes are electrically connected. The phase change layer includes: a phase change medium and a plurality of heat-conducting elements spaced apart; Each of the heat-conducting elements has its two ends in contact with the first electrode and the second electrode respectively, which are arranged opposite to each other, and the phase change medium is filled between the plurality of heat-conducting elements; Each of the heat-conducting components includes two heat-conducting plates and a heat-conducting pillar. The two heat-conducting plates are respectively attached to the first electrode and the second electrode which are arranged opposite to each other, and the heat-conducting pillar is disposed between the two heat-conducting plates.

2. The refrigeration structure according to claim 1, characterized in that, The thermoelectric layer further includes a plurality of conductive elements, wherein adjacent first electrodes and second electrodes are electrically connected through corresponding conductive elements in the first thermoelectric layer and the second thermoelectric layer.

3. The refrigeration structure according to claim 1, characterized in that, The projection of the heat-conducting plate on the substrate coincides with the projection of the first electrode on the substrate, and the projection of the heat-conducting plate on the substrate covers the projection of the heat-conducting pillar on the substrate.

4. The refrigeration structure according to claim 1, characterized in that, The cooling structure further includes a sealing element disposed between the first substrate and the second substrate and forming a sealed cavity with the first substrate and the second substrate, wherein the thermoelectric layer and the phase change layer are both located in the sealed cavity.

5. The refrigeration structure according to any one of claims 1-4, characterized in that, The first electrode is a P-type thermoelectric arm, and the second electrode is an N-type thermoelectric arm.

6. The refrigeration structure according to claim 5, characterized in that, The thermoelectric layer further includes: a first partition and a second partition; The first partition is disposed in the first thermoelectric layer, and the second partition is disposed in the second thermoelectric layer. The first partition and the second partition are provided with a plurality of mounting holes arranged in an array and corresponding to each other on opposite sides. Each mounting hole is used to install the P-type thermoelectric arm or the N-type thermoelectric arm.

7. An electronic device, characterized in that, It includes a cooling structure and a heating device as described in any one of claims 1-6, wherein the heating device is bonded to the substrate of the cooling structure.

8. The electronic device according to claim 7, characterized in that: When the temperature of the heating device is higher than the first temperature, the heat from the heating device is transferred through the substrate to the thermoelectric layer and the phase change layer, and the phase change layer undergoes a phase change and absorbs heat. When the temperature of the heating device is lower than the second temperature, the phase change layer undergoes a phase change and releases heat. The first temperature is higher than the second temperature.

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