A tin spraying equipment in PCB board production

Abstract

This invention provides a tin-spraying device for PCB board production. The tin-spraying device includes three main components: a support device, a tin-spraying device, and a loading / unloading device. In this invention, the PCB board is placed into the tin-spraying device via an external conveyor belt and mechanical grippers. The loading / unloading device is a separate device, not used for loading / unloading PCB boards, but for loading / unloading the clamping device described later. The loading / unloading device of this invention can perform unloading while loading, allowing for uninterrupted operation and improving production efficiency.

Description

Technical Field

[0001] This invention belongs to the field of PCB manufacturing, specifically relating to a tin-spraying device used in PCB manufacturing. Background Technology

[0002] The tin plating process for PCB boards involves applying a tin-aluminum alloy layer to a copper-clad laminate. Existing technology CN214937750U discloses a multi-functional horizontal tin plating machine for PCB boards, including a base. A body is fixedly connected to the top of the base. The body has an internal cavity. A fixing plate is fixedly connected to the middle of the body. A material box is fixedly connected to one side of the top of the body. A filter box is fixedly connected to the middle of the bottom of the fixing plate. Existing technology CN214757163U discloses a hot air uniform tin plating device for PCB boards, including a housing. Support legs are fixedly connected to the four corners of the lower surface of the housing. A sliding plate is movably connected to the front surface of the housing. The sliding plate is connected to the housing via a third hydraulic rod. Mounting blocks are symmetrically fixedly connected to the inner surface of the sliding plate, and fastening bolts are fixedly connected to the outer surfaces of the two mounting blocks. The prior art CN217064125U discloses an automatic tin spraying device for PCB boards, which relates to the field of PCB board processing technology. It includes a worktable, a bracket fixedly provided at the middle of the top of the worktable, a tin spraying box fixedly provided on one side of the top of the bracket, a tin pump fixedly provided at the top of the bracket, the liquid extraction end of the tin pump being connected to the inside of the tin spraying box through a liquid extraction pipe, a nozzle fixedly connected to the liquid outlet end of the tin pump, an adjustment component provided on one side of the top of the worktable, and a stirring component provided inside the tin spraying box.

[0003] In actual production, robotic arms are also used to grab PCB boards and immerse them in molten aluminum tanks. However, based on existing technology, it cannot be concluded that the current tin spraying process is inefficient and cannot be continuously produced. Therefore, there is a need for equipment that can continuously produce, automatically feed and unload materials, automatically form a tin spraying environment, automatically remove the tin spraying environment, and facilitate the disassembly of PCB boards. Summary of the Invention

[0004] In view of the above-mentioned technical problems, the present invention provides a solder spraying device for PCB board production, which aims to solve the problems in the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows:

[0006] A PCB board production tin spraying equipment includes a support device and a tin spraying device 5. The tin spraying equipment also includes a loading and unloading device 6, which is an independent device that performs unloading processing while loading. The support device includes a first support ring 1 and a second support ring 2, which are fixedly connected by a support connecting rod 3. Both the first support ring 1 and the second support ring 2 are provided with support legs 4 for fixing the support device to the ground.

[0007] The solder spraying device 5 has a first baffle plate 7 and a second baffle plate 8 on its left and right sides, respectively. There is a gap between the first baffle plate 7 and the second baffle plate 8 and the solder spraying device 5. The first baffle plate 7 and the second baffle plate 8 are fixedly connected to the first support ring 1 through a connecting block 9. The solder spraying device 5 is cylindrical. Two rolling grooves 10 are symmetrically opened on the outer side of the solder spraying device 5. A rolling wheel 11 is fixed on the first support ring 1. The rolling wheel 11 is disposed in the rolling groove 10. The rolling wheel 11 is driven to rotate by an external drive motor, thereby driving the solder spraying device 5 to rotate.

[0008] Further,

[0009] Both the first shielding plate 7 and the second shielding plate 8 are disc-shaped structures;

[0010] A first notch 12 and a second notch 13 are symmetrically provided in the vertical direction of the first shielding plate 7. Both the first notch 12 and the second notch 13 have a semi-circular arc segment and a straight line segment.

[0011] A third notch 14 is provided above the second shielding plate 8, and a fourth notch 15 is provided on the left side of the second shielding plate 8. Both the third notch 14 and the fourth notch 15 have a semi-circular arc segment and a straight line segment. A blade portion 16 is provided at the lower half edge of the fourth notch 15.

[0012] Further,

[0013] The tin spraying device 5 includes a tin spraying device body 17 and a clamping device 22;

[0014] The main body 17 of the tin spraying device is provided with four tin spraying chambers 18 evenly. Two first slide rails 19 are provided on both sides of each tin spraying chamber 18. An external tin spraying device 20 corresponding to the tin spraying chamber 18 is provided on the outside of the main body 17 of the tin spraying device, and an internal tin spraying device 21 is provided inside the main body 17 of the tin spraying device.

[0015] The clamping device 22 has two clamping rings 23 for support. The two clamping rings 23 are fixedly connected by two symmetrical clamping blocks 24 on the inner side. A support plate 25 corresponding to the first slide rail 19 is provided on the outer side of the clamping rings 23. The support plate 25 connects the two clamping rings 23. A clamping head 26 is provided on the clamping block 24. A clamping groove 27 is opened on the side of the clamping head 26. The PCB board 100 is clamped in the clamping groove 27.

[0016] Further,

[0017] A cavity 28 is provided on the clamping block 24, and a spring 29 is provided in the cavity 28. The spring 29 is used to press the clamping head 26 outward. A limit protrusion is provided on one end of the clamping head 26 in the cavity 28, and the limit protrusion restricts the clamping head 26 from leaving the cavity 28.

[0018] Further,

[0019] The loading and unloading device 6 is used to push the clamping device 22 into the solder spraying cavity 18 of the solder spraying device body 17, and to receive the clamping device 22 that has finished solder spraying in the solder spraying cavity 18.

[0020] Further,

[0021] An upper groove 30 is provided above the solder spraying cavity 18, and an upper nozzle 31 is provided in the upper groove 30. The upper nozzle 31 is connected to the external solder spraying device 20. A lower groove 32 is provided below the solder spraying cavity 18, and a lower nozzle 33 is provided in the lower groove 32. The lower nozzle 33 is connected to the internal solder spraying device 21.

[0022] Further,

[0023] The loading and unloading device 6 has a loading and unloading device body 34 and a pushing device 35. The loading and unloading device body 34 has a receiving cavity 36. The receiving cavity 36 has a second slide rail 37 on both sides. The pushing device 35 can slide in the receiving cavity 36. The loading and unloading device body 34 on both sides of the pushing device 35 has a third slide rail 38. The pushing device 35 is supported in the third slide rail 38.

[0024] Further,

[0025] The pushing device 35 has a symmetrical sliding plate 39. The sliding plate 39 is connected to the handle 41 through a support block 40. A lead screw 43 is provided on the connection end 42 where the support block 40 and the handle 41 are connected. The lead screw 43 is driven to rotate by a motor 44 provided at one end of the sliding plate 39.

[0026] A sliding plate 45 is provided on the lead screw 43. When the motor 44 drives the lead screw 43 to rotate, the sliding plate 45 moves on the lead screw 43. The sliding plate 45 is fixedly connected to the push plate 47 through the transition part 46. The push plate 47 is disposed in the receiving cavity 36. The clamping device 22 is pushed to move in the receiving cavity 36 by the push plate 47.

[0027] Further,

[0028] A sliding ring 49 is fixed to the outside of the loading and unloading device 6 by a connecting rod 48. The sliding ring 49 is disposed on the second support ring 2 and can slide on the second support ring 2. The loading and unloading device 6 is driven to rotate by an external drive motor.

[0029] Further,

[0030] On the loading and unloading device 6, the side closer to the solder spraying device 5 is the front side 101, and the side farther away from the solder spraying device 5 is the rear side 102. An air knife is provided on the side wall of the receiving cavity 36 within the range of the front side 101, and the air knife is provided on both sides of the PCB board 100.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] 1. The present invention sets the tin spraying device in a disc-shaped structure that operates intermittently, and cooperates with the loading and unloading device to achieve uninterrupted continuous operation.

[0033] 2. The present invention has a gap between the first and second shielding plates and the solder spraying device. This gap can create a molten solder environment in the solder spraying chamber within a short time when the PCB board is soldered on both sides, which is beneficial to achieving a better soldering effect. At the same time, the gap can also serve to release pressure at the end of solder spraying, and a very small amount of molten solder will overflow from the gap. Even if there is overflow, it can be collected by setting a cleaning component between the first and second shielding plates and the solder spraying device. It can automatically create and automatically release the solder spraying environment.

[0034] 3. To accommodate the intermittent operation of the rotating disc, this invention features a special first and second baffle. The first and second baffles are symmetrically positioned vertically on the first baffle, each having a semi-circular arc segment and a straight line segment. A third baffle is positioned above the second baffle, and a fourth baffle is positioned to the left of the second baffle. Both the third and fourth baffles have semi-circular arc segments and straight line segments, thus creating a solder spraying environment and enabling intermittent rotational operation.

[0035] 4. The present invention provides a blade at the lower half edge of the fourth notch. Since multiple clamping devices are arranged in a row in the receiving cavity, and since a second baffle is provided, the pushing device needs to stop when it pushes the clamping device to the junction of the second baffle. If it is not pushed to the correct position or is pushed too far, it will cause a collision when the solder spraying device or the loading and unloading device is rotating. Therefore, a blade is provided at the fourth notch, which can play a pushing role when rotating, so that the clamping device moves to the fixed position of the solder spraying cavity.

[0036] 5. The loading and unloading device of the present invention is an independent device. It is not used for loading and unloading PCB boards, but for loading and unloading clamping devices. The loading device of the present invention can perform unloading processing at the same time as loading, and can work continuously, thus improving production efficiency.

[0037] 6. The loading and unloading device of the present invention can perform solder scraping and cooling processes, and can provide cooling while working continuously.

[0038] 7. The push device can simultaneously receive the clamping device and push the clamping device. Attached Figure Description

[0039] Figure 1 A schematic diagram of the overall structure of the tin-spraying equipment of the present invention.

[0040] Figure 2 This invention Figure 1 The left view.

[0041] Figure 3 A schematic diagram of the first shielding plate structure of the present invention.

[0042] Figure 4 A schematic diagram of the second shielding plate structure of the present invention.

[0043] Figure 5 A schematic diagram of the main structure of the tin-spraying device of the present invention.

[0044] Figure 6 A schematic diagram of the clamping device of the present invention.

[0045] Figure 7 A front view of the tin spraying device of the present invention (a clamping device is installed inside the main body of the tin spraying device).

[0046] Figure 8 This invention Figure 7 Partial sectional view.

[0047] Figure 9 A schematic diagram of the end of the loading and unloading device of the present invention.

[0048] Figure 10 A schematic diagram of the overall structure of the loading and unloading device of this invention.

[0049] Figure 11 This invention Figure 9 Partial sectional view.

[0050] The components shown in the diagram are: 1. First support ring; 2. Second support ring; 3. Support rod; 4. Support leg; 5. Tin spraying device; 6. Loading / unloading device; 7. First baffle plate; 8. Second baffle plate; 9. Connecting block; 10. Rolling groove; 11. Rolling wheel; 12. First notch; 13. Second notch; 14. Third notch; 15. Fourth notch; 16. Blade; 17. Tin spraying device body; 18. Tin spraying cavity; 19. First slide rail; 20. External tin spraying device; 21. Internal tin spraying device; 22. Clamping device; 23. Clamping ring; 24. Clamping block; 25. Support plate. 5. Clamping head 26, clamping groove 27, cavity 28, spring 29, upper groove 30, upper nozzle 31, lower groove 32, lower nozzle 33, main body of loading and unloading device 34, pushing device 35, receiving cavity 36, second slide rail 37, third slide rail 38, sliding plate one 39, support block 40, handle 41, connecting end 42, lead screw 43, motor 44, sliding plate two 45, transition part 46, push plate 47, connecting rod 48, sliding ring 49, PCB board 100, front side 101, rear side 102. Detailed Implementation

[0051] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0052] In the description of this invention, it should be understood that the terms "center," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0053] In this invention, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," "link," and "fix" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection; a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms in this invention according to the specific circumstances.

[0054] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0055] This invention discloses a tin-spraying device for PCB board production. The tin-spraying device includes three main components: a support device, a tin-spraying device 5, and a loading / unloading device 6. See attached drawing. Figure 1 .

[0056] In this invention, the PCB board 100 is placed into the solder spraying device 5 by an external transmission belt and mechanical grippers; while the loading and unloading device 6 is an independent device. This loading and unloading device 6 is not used for loading and unloading the PCB board 100, but for loading and unloading the clamping device 22 described later in this article. The loading device 6 of this invention can perform unloading while loading, and can work continuously, thus improving production efficiency.

[0057] like Figure 1 As shown, the support device of the present invention includes a first support ring 1 and a second support ring 2. One first support ring 1 is provided for supporting the solder spraying device 5. Since the length of the loading / unloading device 6 is greater than the length of the solder spraying device 5, two second support rings 2 are provided, which can effectively support the loading / unloading device 6. The first support ring 1 and the second support ring 2 are fixedly connected by a support connecting rod 3. Both the first support ring 1 and the second support ring 2 are provided with support legs 4 for fixing the support device to the ground, thereby forming the main frame of the support device.

[0058] like Figure 1 As shown, a first baffle plate 7 and a second baffle plate 8 are respectively provided on the left and right sides of the solder spraying device 5. There is a gap between the first baffle plate 7 and the second baffle plate 8 and the solder spraying device 5. This gap can create a molten solder environment in the solder spraying cavity 18 for a short time when the PCB board 100 is soldered on both sides, which is beneficial to achieving a better soldering effect. This gap can also serve to release pressure when the solder spraying ends, and a very small amount of molten solder will overflow from the gap. Even if there is overflow, it can be collected by a cleaning component set between the first baffle plate 7 and the second baffle plate 8 and the solder spraying device 5. The cleaning component can be a simple cleaning strip, etc., which will not be listed here. As long as it can withstand the high temperature during solder spraying and has the function of wiping and cleaning, it is acceptable.

[0059] like Figure 1 As shown, the first shielding plate 7 and the second shielding plate 8 are fixedly connected to the first support ring 1 via a connecting block 9 (in Figure 1(Only a portion of the connecting block 9 is shown in the image to allow for the full display of the rolling grooves 10). The solder spraying device 5 is cylindrical, and two rolling grooves 10 are symmetrically formed on its outer surface. Figure 2 As shown, a rolling wheel 11 is fixed on the first support ring 1. The rolling wheel 11 is disposed in the rolling groove 10. The rolling wheel 11 is driven to rotate by an external drive motor (not shown in the figure), thereby driving the tin spraying device 5 to rotate.

[0060] like Figure 3 , 4 As shown, both the first shielding plate 7 and the second shielding plate 8 are disc-shaped structures.

[0061] like Figure 3 As shown, a first notch 12 and a second notch 13 are symmetrically provided in the vertical direction of the first shielding plate 7. Both the first notch 12 and the second notch 13 have a semi-circular arc segment and a straight line segment.

[0062] like Figure 4 As shown, a third notch 14 is provided above the second shielding plate 8, and a fourth notch 15 is provided on the left side of the second shielding plate 8. Both the third notch 14 and the fourth notch 15 have a semi-circular arc segment and a straight line segment. A blade portion 16 is provided at the lower half edge of the fourth notch 15.

[0063] like Figure 5 , 6 As shown, the solder spraying device 5 includes a solder spraying device body 17 and a clamping device 22. Figure 7 The image shows the state when the clamping device 22 is installed in the main body 17 of the solder spraying device.

[0064] like Figure 5 As shown, four solder spraying chambers 18 are evenly provided on the main body 17 of the solder spraying device. Two first slide rails 19 are provided on both sides of each solder spraying chamber 18. An external solder spraying device 20 corresponding to the solder spraying chamber 18 is provided on the outside of the main body 17 of the solder spraying device, and an internal solder spraying device 21 is provided inside the main body 17 of the solder spraying device.

[0065] like Figure 6As shown, the clamping device 22 has two clamping rings 23 for support. The two clamping rings 23 are fixedly connected by two symmetrical clamping blocks 24 on the inner side. A support plate 25 corresponding to the first slide rail 19 is provided on the outer side of the clamping rings 23. The support plate 25 connects the two clamping rings 23 and is used to support the clamping device 22 on the first slide rail 19. A clamping head 26 is provided on the clamping block 24. A clamping groove 27 is opened on the side of the clamping head 26. The PCB board 100 is clamped in the clamping groove 27. A cavity 28 is opened on the clamping block 24. A spring 29 is provided in the cavity 28. The spring 29 is used to press the clamping head 26 outward. A limiting protrusion is provided on the end of the clamping head 26 that is in the cavity 28. The limiting protrusion restricts the clamping head 26 from leaving the cavity 28.

[0066] The loading and unloading device 6 is used to push the clamping device 22 into the solder spraying chamber 18 of the main body 17 of the solder spraying device, and to receive the clamping device 22 that has finished solder spraying in the solder spraying chamber 18.

[0067] like Figure 8 As shown, an upper groove 30 is provided above the solder spraying chamber 18, and an upper nozzle 31 is provided inside the upper groove 30. The upper nozzle 31 is connected to the external solder spraying device 20. A lower groove 32 is provided below the solder spraying chamber 18, and a lower nozzle 33 is provided inside the lower groove 32. The lower nozzle 33 is connected to the internal solder spraying device 21.

[0068] like Figure 9 As shown, the loading / unloading device 6 has a loading / unloading device body 34 and a pushing device 35. The loading / unloading device body 34 has a receiving cavity 36 corresponding to the solder spraying cavity 18. Second slide rails 37 are provided on both sides of the receiving cavity 36, and the pushing device 35 can slide within the receiving cavity 36. Third slide rails 38 are provided on the loading / unloading device body 34 on both sides of the pushing device 35, and the pushing device 35 is supported within the third slide rails 38.

[0069] like Figure 9 As shown, the pushing device 35 has a symmetrical sliding plate 39, which is inserted into the third slide rail 38. The sliding plate 39 is connected to the handle 41 through the support block 40. The handle 41 is used for easy hand gripping during disassembly. By gripping the handle 41, the sliding plate 39 is inserted into the third slide rail 38 and then fixed by screws.

[0070] like Figure 10 As shown, a lead screw 43 is provided on the connecting end 42 where the support block 40 and the handle 41 are connected. The lead screw 43 can rotate on the connecting end 42. The lead screw 43 is driven to rotate by a motor 44 provided at one end of the sliding plate 39.

[0071] like Figure 10As shown, a sliding plate 45 is provided on the lead screw 43. When the motor 44 drives the lead screw 43 to rotate, the sliding plate 45 moves on the lead screw 43. Figure 11 As shown, the sliding plate 45 is fixedly connected to the push plate 47 through the transition part 46. The push plate 47 is disposed in the receiving cavity 36, and the clamping device 22 is pushed to move in the receiving cavity 36 by the push plate 47.

[0072] like Figure 9 , 10 As shown, a sliding ring 49 is fixed on the outside of the loading and unloading device 6 by a connecting rod 48. The sliding ring 49 is set on the second support ring 2 and can slide on the second support ring 2. The loading and unloading device 6 is driven to rotate by an external drive motor (not shown in the figure).

[0073] like Figure 10 As shown, on the loading and unloading device 6, the side closer to the solder spraying device 5 is the front side 101, which is divided by a dotted line, and the side farther away from the solder spraying device 5 is the rear side 102. An air knife is provided on the side wall of the receiving cavity 36 within the range of the front side 101. The air knife is set on both sides of the PCB board 100 to perform solder scraping on the PCB board 100. In the range of the rear side 102, air cooling is used to cool the PCB board 100.

[0074] The working principle of the present invention is:

[0075] The second notch 13 is used by the external transmission belt and mechanical grippers to place the PCB board 100 into the clamping groove 27 of the clamping head 26 on the clamping device 22 of the solder spraying device 5, such as... Figure 2 As shown;

[0076] The first notch 12, the solder spraying cavity 18 and the third notch 14 are connected. Under the action of the external push rod (not shown in the figure, as long as it can play a pushing role), the clamping device 22 is pushed into the receiving cavity 36 on the loading and unloading device 6.

[0077] The fourth notch 15 corresponds to a certain receiving cavity 36 on the loading and unloading device 6. Under the action of the pushing device 35, the clamping device 22 without PCB board 100 enters the solder spraying cavity 18. Since multiple clamping devices 22 are arranged in a row in the receiving cavity 36, and since the second baffle 8 is provided, the pushing device 35 needs to stop pushing the clamping device 22 to the junction of the second baffle 8. If it is not pushed to the right position or is pushed too far, it will cause a collision when the solder spraying device 5 or the loading and unloading device 6 rotates. Therefore, a blade part 16 is provided at the fourth notch 15, which can play a pushing role when rotating, so that the clamping device 22 moves to the fixed position of the solder spraying cavity 18.

[0078] like Figure 2 As shown, during work,

[0079] An external conveyor belt and mechanical grippers place the PCB board 100 through the second notch 13 into the clamping slot 27 of the clamping head 26 on the clamping device 22 of the solder spraying device 5;

[0080] according to Figure 2 For example, the solder spraying device 5 rotates counterclockwise (intermittently) to rotate the PCB board 100 to be soldered to the desired position. Figure 2 The clamping device 22 is positioned on the right side of the PCB board 100. At this time, the clamping device 22 is located between the first baffle plate 7 and the second baffle plate 8. Due to the gap, the gap can create a molten solder environment in the solder spraying cavity 18 in a short time when the PCB board 100 is soldered on both sides, which is conducive to achieving a better soldering effect.

[0081] While the tin plating is in progress, the clamping device 22 located below can continue to be inserted into the PCB board 100, and at the same time the pushing device 35 pushes the clamping device 22 without the PCB board 100 into the tin plating chamber 18 on the left (the motor 44 rotates, and the lead screw 43 drives the push plate 47 to push the clamping device 22). As it continues to rotate, the blade part 16 pushes the clamping device 22 to the fixed position of the tin plating chamber 18.

[0082] When the tin-plated clamping device 22 rotates to its highest position, the external push rod pushes the clamping device 22 to push the tin-plated PCB board 100 into the receiving cavity 36; the support plate 25 slides on the second slide rail 37 to support the clamping device 22 in the receiving cavity 36; when the clamping device 22 or the PCB board 100 is in the front 101 area, tin scraping is performed, and in the rear 102 area, air cooling is used to cool the PCB board 100.

[0083] When a cavity 36 is filled with clamping device 22, rotate loading and unloading device 6 and after it has cooled sufficiently, remove the screws, remove the pushing device 35, and disassemble the PCB board 100 on clamping device 22.

[0084] Compared with the prior art, the present invention has the following beneficial effects:

[0085] This invention integrates a tin-spraying device into an intermittently operating disc-shaped structure, cooperating with a loading and unloading device to achieve continuous, uninterrupted operation. The invention features a gap between the first and second baffles and the tin-spraying device. This gap allows for the creation of a molten solder environment within the tin-spraying chamber for a short period during double-sided tin-spraying of the PCB board, facilitating better soldering results. Simultaneously, this gap also serves to release pressure at the end of tin-spraying, allowing a very small amount of molten solder to overflow. Even if overflow occurs, it can be collected by a cleaning component located between the first and second baffles and the tin-spraying device. The invention enables automatic creation and automatic deactivation of the tin-spraying environment. To accommodate the intermittent operation of the rotating disc, this invention incorporates a special first and second baffle plate. The first baffle plate has symmetrically arranged first and second notches along its vertical direction, each notch comprising a semi-circular arc segment and a straight line segment. A third notch is located above the second baffle plate, and a fourth notch is located to its left. Both the third and fourth notches also have semi-circular arc segments and straight line segments, thus creating a solder spraying environment while enabling intermittent rotational operation. The lower edge of the fourth notch is designed as a cutting edge. Since multiple clamping devices are arranged in a row within the receiving cavity, and due to the presence of the second baffle plate, the pushing device must stop once it reaches the boundary of the second baffle plate. If it is not pushed to the correct position or is pushed too far, it will cause collisions during the rotation of the solder spraying device or the loading / unloading device. Therefore, the cutting edge at the fourth notch acts as a pusher during rotation, allowing the clamping device to move to a fixed position within the solder spraying cavity. The loading and unloading device of this invention is an independent device. It is not used for loading and unloading PCB boards, but rather for loading and unloading clamping devices. This loading device can perform unloading simultaneously, allowing for uninterrupted operation and improving production efficiency. The loading and unloading device can also perform solder scraping and cooling processes, providing cooling while operating continuously. The assisting pusher device can simultaneously receive from and push the clamping device.

[0086] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A tin-spraying device for PCB board production, the tin-spraying device comprising a support device and a tin-spraying device (5), characterized in that: The tin spraying equipment also includes a loading and unloading device (6), which is an independent device that performs unloading processing while loading. The support device includes a first support ring (1) and a second support ring (2), which are fixedly connected by a support rod (3). Both the first support ring (1) and the second support ring (2) are provided with support legs (4) for fixing the support device to the ground. The tin spraying device (5) is provided with a first shielding plate (7) and a second shielding plate (8) on its left and right sides respectively. There is a gap between the first shielding plate (7) and the second shielding plate (8) and the tin spraying device (5). The first shielding plate (7) and the second shielding plate (8) are fixedly connected to the first support ring (1) through a connecting block (9). The tin spraying device (5) is cylindrical. Two rolling grooves (10) are symmetrically opened on the outer side of the tin spraying device (5). A rolling wheel (11) is fixed on the first support ring (1). The rolling wheel (11) is set in the rolling groove (10). The rolling wheel (11) is driven to rotate by an external drive motor, thereby driving the tin spraying device (5) to rotate. Both the first shielding plate (7) and the second shielding plate (8) are disc-shaped structures; A first notch (12) and a second notch (13) are symmetrically provided in the vertical direction of the first shield (7). Both the first notch (12) and the second notch (13) have a semi-circular arc segment and a straight line segment. A third notch (14) is provided above the second shielding plate (8), and a fourth notch (15) is provided on the left side of the second shielding plate (8). Both the third notch (14) and the fourth notch (15) have a semi-circular arc segment and a straight line segment. A blade part (16) is provided at the lower half edge of the fourth notch (15).

2. The tin-spraying equipment for PCB board production according to claim 1, characterized in that: The tin spraying device (5) includes a tin spraying device body (17) and a clamping device (22). Four tin spraying chambers (18) are evenly provided on the main body (17) of the tin spraying device. Two first slide rails (19) are provided on both sides of each tin spraying chamber (18). An external tin spraying device (20) corresponding to the tin spraying chamber (18) is provided on the outside of the main body (17) of the tin spraying device. An internal tin spraying device (21) is provided inside the main body (17) of the tin spraying device. The clamping device (22) has two clamping rings (23) for support. The two clamping rings (23) are fixedly connected by two symmetrical clamping blocks (24) on the inner side. A support plate (25) corresponding to the first slide rail (19) is provided on the outer side of the clamping rings (23). The support plate (25) connects the two clamping rings (23). A clamping head (26) is provided on the clamping block (24). A clamping groove (27) is opened on the side of the clamping head (26). The PCB board (100) is clamped in the clamping groove (27).

3. The tin-spraying equipment for PCB board production according to claim 2, characterized in that: A cavity (28) is provided on the clamping block (24), and a spring (29) is provided in the cavity (28). The spring (29) is used to press the clamping head (26) outward. A limit protrusion is provided on one end of the clamping head (26) inside the cavity (28). The limit protrusion restricts the clamping head (26) from leaving the cavity (28).

4. The tin-spraying equipment for PCB board production according to claim 3, characterized in that: The loading and unloading device (6) is used to push the clamping device (22) into the tin spraying cavity (18) of the tin spraying device body (17), and to receive the clamping device (22) that has finished tin spraying in the tin spraying cavity (18).

5. The tin-spraying equipment for PCB board production according to claim 4, characterized in that: The solder spraying cavity (18) has an upper groove (30) above it, and an upper nozzle (31) is provided in the upper groove (30). The upper nozzle (31) is connected to the external solder spraying device (20). The solder spraying cavity (18) has a lower groove (32) below it, and a lower nozzle (33) is provided in the lower groove (32). The lower nozzle (33) is connected to the internal solder spraying device (21).

6. The tin-spraying equipment for PCB board production according to claim 5, characterized in that: The loading and unloading device (6) has a loading and unloading device body (34) and a pushing device (35). The loading and unloading device body (34) has a receiving cavity (36). The receiving cavity (36) has a second slide rail (37) on both sides. The pushing device (35) can slide in the receiving cavity (36). The loading and unloading device body (34) on both sides of the pushing device (35) has a third slide rail (38). The pushing device (35) is supported in the third slide rail (38).

7. The tin-spraying equipment for PCB board production according to claim 6, characterized in that: The pushing device (35) has a symmetrical sliding plate (39), which is connected to the handle (41) via a support block (40). A lead screw (43) is provided on the connection end (42) where the support block (40) and the handle (41) are connected to each other. The lead screw (43) is driven to rotate by a motor (44) located at one end of the sliding plate (39). A sliding plate 2 (45) is provided on the lead screw (43). When the motor (44) drives the lead screw (43) to rotate, the sliding plate 2 (45) moves on the lead screw (43). The sliding plate 2 (45) is fixedly connected to the push plate (47) through the transition part (46). The push plate (47) is provided in the receiving cavity (36). The clamping device (22) is pushed to move in the receiving cavity (36) by the push plate (47).

8. The tin-spraying equipment for PCB board production according to claim 7, characterized in that: A sliding ring (49) is fixed on the outside of the loading and unloading device (6) by a connecting rod (48). The sliding ring (49) is set on the second support ring (2). The sliding ring (49) can slide on the second support ring (2). The loading and unloading device (6) is driven to rotate by an external drive motor.

9. A tin-spraying device for PCB board production according to claim 8, characterized in that: On the loading and unloading device (6), the side closer to the tin spraying device (5) is the front side (101), and the side farther away from the tin spraying device (5) is the rear side (102). An air knife is provided on the side wall of the receiving cavity (36) within the range of the front side (101), and the air knife is provided on both sides of the PCB board (100).

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