Fully automatic production line for batch preparation of piezoelectric films using the sol-gel method

Abstract

The present invention discloses a fully automatic production line for batch preparation of piezoelectric films using a sol-gel method, which relates to the preparation of semiconductor materials. The production line mainly comprises a conveying component, a robotic arm, a robotic claw, a multi-layer automatic film coating device and an annealing furnace device. The production line can continuously perform sol spin coating and annealing for film preparation, greatly improving the degree of automation of the production line and the efficiency of preparing piezoelectric films. The production line can also prepare piezoelectric films in batches and can repeatedly perform sol spin coating and annealing during the preparation of the piezoelectric films, thereby helping to achieve automated, batch and continuous production of the piezoelectric films.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor material preparation, and in particular to a fully automatic production line for batch preparation of piezoelectric films using a sol-gel method. Background Art

[0002] In the process of preparing piezoelectric thin films using the sol-gel method, sol spin coating and film annealing are very important processing steps. Spin coating can evenly apply the sol to the silicon wafer surface to ensure the uniform thickness of the prepared film. Annealing can eliminate residual stress generated within the film, effectively reducing the probability of internal cracks in the film and achieving better film quality.

[0003] In the current state of the art, piezoelectric thin films are prepared using separate processes for sol-gel spin coating and thin-film annealing. During this process, workers are required to manually remove the coated silicon wafers and place them in an annealing furnace for annealing. This results in a low degree of automation and low efficiency in the overall process. Furthermore, the preparation of piezoelectric thin films requires repeated sol-gel spin coating and annealing, which is labor-intensive and difficult to achieve mass production with current state-of-the-art technology. Currently, there is still a lack of a production line that can continuously perform sol-gel spin coating and thin-film annealing, has a high degree of automation, and is capable of mass-producing piezoelectric thin films. Summary of the Invention

[0004] In view of the above shortcomings, the present invention provides a fully automatic production line for batch preparation of piezoelectric films by the sol-gel method, which can solve the technical problems of low automation level, low working efficiency, discontinuous sol spin coating and film annealing process in the existing technology of piezoelectric film preparation production line.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A fully automatic production line for batch preparation of piezoelectric films using a sol-gel method, comprising:

[0007] Multi-layer automatic coating equipment, which is used for sol-gel spin coating of silicon wafers;

[0008] Annealing furnace equipment, which is used to anneal the silicon wafers that have been spin-coated with sol;

[0009] a first conveyor belt and a second conveyor belt, wherein the discharge end of the second conveyor belt is connected to the feed end of the first conveyor belt, the discharge end of the first conveyor belt is connected to the feed end of the annealing furnace equipment, and the feed end of the second conveyor belt is connected to the discharge end of the annealing furnace equipment;

[0010] At least one material tray, the material tray is used to load silicon wafers, and the material tray can be conveyed on the annealing furnace equipment, the first conveyor belt and the second conveyor belt;

[0011] A robotic arm is provided with a robotic claw, which can drive the robotic claw to grab the silicon wafers on the material tray conveyed by the first conveyor belt and place them on the multi-layer automatic coating equipment to perform sol spin coating on the silicon wafers, and put the sol-coated silicon wafers back on the material tray of the first conveyor belt.

[0012] Furthermore, the second conveyor belt is provided with a discharge platform on one side surface near the discharge end, and a cylinder is provided on the opposite side surface, and a push rod is provided on the output rod of the cylinder, and the push rod faces the discharge platform;

[0013] An identification code is provided on the material tray, and a barcode scanner is provided at a position near the discharge end of the second conveyor belt for scanning and identifying the identification code on the material tray, so that when the barcode scanner records that a certain material tray has passed the barcode scanner a certain number of times, the cylinder can drive the push rod to push the material tray to the discharge platform.

[0014] Furthermore, the fully automatic production line for batch preparation of piezoelectric films by the sol-gel method further includes a monitoring system, which includes a first camera, a second camera, and an alarm system;

[0015] The first camera is arranged at a position close to the feeding end of the annealing furnace equipment to record the time when the material tray enters the annealing furnace equipment and take pictures of the silicon wafers after the sol spin coating to collect data. If the data collection finds that the film on the silicon wafer does not meet the requirements, an alarm is issued through the alarm system and the operation of the production line is stopped;

[0016] The second camera is arranged at a position close to the discharge end of the annealing furnace equipment to record the moment when the material tray comes out of the annealing furnace equipment, so as to detect whether the material tray passes through the annealing furnace equipment within the specified time. If the second camera fails to monitor the material tray coming out of the annealing furnace equipment within the specified time, an alarm will be issued through the alarm system and the operation of the production line will be stopped.

[0017] Furthermore, the first conveyor belt is connected to a feed conveyor belt at one side surface near the feed end, and the material tray can be conveyed to the first conveyor belt through the feed conveyor belt.

[0018] Furthermore, the annealing furnace equipment includes:

[0019] Annealing furnace rack;

[0020] A furnace shell assembly is mounted on the annealing furnace frame. The furnace tube assembly includes a furnace chamber, a furnace tube, and a heating wire. The furnace tube is located in the furnace chamber, and the heating wire is nested in the furnace chamber.

[0021] A conveying assembly is installed on the annealing furnace frame, the feed end of the conveying assembly is connected to the discharge end of the first conveyor belt, the discharge end of the conveying assembly is connected to the feed end of the second conveyor belt, and the conveying assembly partially passes through the furnace tube assembly, and is used to convey the material tray and the silicon wafers thereon so that the silicon wafers are annealed in the furnace tube assembly.

[0022] Furthermore, the multi-layer automatic coating equipment includes:

[0023] A coating machine is provided with a wafer support that can be driven and rotated by the coating machine, and a suction cup is provided on the wafer support to absorb the silicon wafer through negative pressure;

[0024] A mounting platform is provided with a glue dripping slide rail and a glue dripping screw parallel to each other, the glue dripping screw is driven to rotate by a glue dripping motor installed on the mounting platform, a glue dripping slider is slidably provided on the glue dripping slide rail, a nut connector is provided on the glue dripping slider, and the nut connector is connected to the glue dripping screw through a thread;

[0025] The glue-drip slider is also provided with a slide seat, a laterally arranged linear slide rail is provided on the slide seat, a fixture is mounted on the linear slide rail, a servo is installed on the fixture, a lifting bar is vertically slidably provided on the fixture, the lifting bar is a rack, a gear is provided on the output shaft of the servo and meshes with the lifting bar; a glue dispenser for dripping glue onto the silicon wafer on the wafer holder is provided on the lifting bar.

[0026] Furthermore, the mechanical claw includes a motor frame, a connecting rod and a crank;

[0027] The mechanical claw is provided with a mechanical claw motor, and a connecting disk is provided at the bottom of the motor frame. A plurality of connecting members are provided around the circumference of the connecting disk. The connecting rods are provided with a plurality of connecting rods, one end of which is rotatably connected to the connecting member, and the other end is rotatably connected to the hand claw, and every two mutually parallel connecting rods form a group and are distributed on the same side of the connecting member;

[0028] The output shaft of the mechanical claw motor is connected to a vertically arranged connecting screw through a coupling, a flange nut is sleeved on the connecting screw, and a plurality of crank connecting parts are arranged around the flange nut in a circumferential direction. The connecting disk is also provided with a guide rod extending in the same direction as the connecting screw, and a through hole is opened on the crank connecting part for the guide rod to pass through;

[0029] The number of the cranks is consistent with the number of crank connecting parts and hand claws. One end of the crank is rotatably connected to the crank connecting part, and the other end is rotatably connected to the connecting rod corresponding to the hand claw.

[0030] Furthermore, the claw tip of the claw is a thin slice facing inward laterally, and the claw tip of the thin slice is provided with an upward protrusion structure at a distance from the tip.

[0031] Furthermore, the annealing furnace equipment is a multi-temperature section annealing furnace.

[0032] Furthermore, the material tray includes a tray, a limit card and a base support, and the tray or the base support is provided with a rotating clip, the tray is connected to the base support through the rotating clip, and the base support is provided with a slide groove, and the limit card is slidably arranged in the slide groove to clamp the silicon wafer placed on the tray.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] 1. The fully automatic production line for batch preparation of piezoelectric films using the sol-gel method provided by the present invention can continuously perform sol spin coating and annealing for film preparation, greatly improving the degree of automation of the production line and the efficiency of preparing piezoelectric films. It can also prepare piezoelectric films in batches and can repeatedly perform sol spin coating and annealing during the preparation of piezoelectric films, thereby helping to achieve automated, batch, and continuous production of piezoelectric films.

[0035] 2. By setting up a special mechanical claw structure, the mechanical claw will not affect the coating when grabbing the silicon wafer, thus ensuring the quality of sol spin coating and film annealing of the piezoelectric film;

[0036] 3. The tray is designed with a detachable limit card and tray structure. By adjusting the position of the limit card and the size of the tray, the tray can be loaded with silicon wafers of different sizes, so as to be suitable for preparing piezoelectric films for silicon wafers of different sizes;

[0037] 4. By improving the coating machine structure, the glue dripping and leveling process is automated, making the spin coating more uniform and improving the coating efficiency;

[0038] 5. By improving the traditional annealing furnace and designing a multi-temperature zone annealing structure, the annealing temperature and time can be precisely controlled;

[0039] 6. By setting the barcode scanner to record the number of spin coating and annealing, the film thickness can be accurately controlled, and the repeated sol spin coating and annealing work during the preparation of the piezoelectric film can be assisted;

[0040] 7. By setting up a monitoring device, the process effects of the sol spin coating and thin film annealing process can be monitored in real time. When problems occur in the process, an alarm can be issued in time to minimize losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments.

[0042] Figure 1This is a schematic structural diagram of a fully automatic production line for batch preparation of piezoelectric films using the sol-gel method of the present invention;

[0043] Figure 2 It is a structural schematic diagram of the material tray in the present invention;

[0044] Figure 3 Schematic diagram of the structure of the robotic arm and the robotic claw in the present invention (partial);

[0045] Figure 4 Schematic diagram of the structure of the mechanical claw in the present invention;

[0046] Figure 5 for Figure 4 A magnified schematic diagram of point A in the middle;

[0047] Figure 6 It is a structural schematic diagram of the multi-layer automatic coating equipment of the present invention;

[0048] Figure 7 This is a structural diagram of the annealing furnace equipment of the present invention (outer furnace shell is turned up).

[0049] 1-feed conveyor belt, 2-feed tray, 201-tray, 202-limiting card, 203-bottom support, 3-first conveyor belt, 4-multi-layer automatic coating equipment, 401-coating machine, 402-sheet support, 403-glue dispenser, 404-lifting strip, 405-servo, 406-clamp, 407-linear slide, 408-slide, 409-glue slider, 410-glue slide rail, 411-glue motor, 412-glue screw, 413- Nut connector, 415-mounting table, 5-mechanical claw, 501-mechanical claw motor, 502-motor frame, 503-connecting plate, 504-connector, 505-connecting rod, 506-hand claw, 507-flange nut, 508-screw, 509-guide rod, 510-crank, 511-crank stud, 512-crank connecting part, 513-coupling, 514-protruding structure, 6-mechanical arm, 601-X axis motor, 602-X Axis reducer, 603-X axis gear, 604-X axis reducer mounting plate, 605-X axis first slider, 606-X axis first guide rail, 607-X axis rack, 608-X axis rack mounting plate, 609-X axis aluminum profile, 610-X axis second guide rail, 611-X axis second slider, 612-Y axis reducer mounting plate, 613-Y axis slider, 614-Y axis slide rail, 615-mechanical claw mounting plate, 616-Y axis rack, 61 7-Y-axis gear, 618-Y-axis reducer, 619-Y-axis motor, 620-Y-axis rack mounting plate, 621-Y-axis aluminum profile, 7-frame, 8-column, 9-first camera, 10-annealing furnace equipment, 101-furnace shell opening device, 102-transmission assembly, 103-furnace shell assembly, 104-annealing furnace frame, 11-second camera, 12-second conveyor belt, 13-cylinder, 14-push rod, 15-code scanner, 16-discharging table. DETAILED DESCRIPTION

[0050] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0051] The preferred embodiment of the present invention provides a fully automatic production line for batch preparation of piezoelectric films by the sol-gel method. Figures 1 to 7 The production line mainly includes six parts: a transmission component, a robotic arm 6, a robotic claw 5, a multi-layer automatic coating equipment 4, an annealing furnace equipment 10 and a monitoring system.

[0052] Please refer to Figure 1The conveying assembly includes a feeding conveyor belt 1, a material tray 2, a first conveyor belt 3, a frame 7, a second conveyor belt 12, a cylinder 13, a push rod 14, a barcode scanner 15 and a discharge platform 16. The conveying assembly can realize the transportation of the material tray 2 and the silicon wafers thereon.

[0053] The first conveyor belt 3 and the second conveyor belt 12 are respectively mounted on rollers on the frame 7. The feed conveyor belt 1 is arranged on a side surface of the first conveyor belt 3 near the feed end, and is connected to the feed end of the first conveyor belt 3. The discharge end of the first conveyor belt 3 is connected to the feed end of the annealing furnace equipment 10, and the discharge end of the annealing furnace equipment 10 is connected to the feed end of the second conveyor belt 12. The discharge table 16 is arranged on a side surface of the second conveyor belt 12 near the discharge end, and the discharge end of the second conveyor belt 12 is connected to the discharge table 16. The cylinder 13 is fixedly mounted on the loading platform via a foot. The cylinder 13 is arranged on the other side surface of the second conveyor belt 12 near the discharge end. The push rod 14 is mounted on the output rod of the cylinder 13 via a threaded fit, and the push rod 14 faces the discharge table 16 and is directly opposite the discharge table 16.

[0054] The frame 7 is designed in a two-section splicing format for the installation of the first conveyor belt 3 and the second conveyor belt 12. The frame 7 is provided with an opening at the outlet corresponding to the feed conveyor belt 1 for the transmission of the tray 2. The frame 7 is provided with openings at the discharge platform 16, the cylinder 13 and the push rod 14, which can facilitate the push rod 14 to push the tray 2 onto the discharge platform 16. The first conveyor belt 3 and the second conveyor belt 12 are respectively controlled by different motors, and the transmission speeds are set differently. There is at least one tray 2, and multiple trays 2 can be provided to load multiple silicon wafers to achieve continuous operation of multiple silicon wafers. The tray 2 is used to load silicon wafers, and the tray 2 can be transmitted on the annealing furnace equipment 10, the feed conveyor belt 1, the first conveyor belt 3 and the second conveyor belt 12. The tray 2 is provided with an identification code, preferably a QR code, for later scanning and recording. The second conveyor belt 12 is provided with a barcode scanner 15 at a position near the discharge end for scanning and identifying the identification code on the material tray 2. When the barcode scanner 15 records that a certain material tray 2 has passed the barcode scanner 15 a certain number of times, the cylinder 13 can drive the push rod 14 to push the material tray 2 onto the discharge platform 16.

[0055] The tray 2 is provided with a detachable limit card and a tray. Figure 2As shown, the material tray 2 includes a tray 201, a limit clamp 202, and a base 203. A rotating buckle is provided on the tray 201 or the base 203, connecting the tray 201 to the base 203 via the rotating buckle. The base 203 is provided with a slide slot, and the limit clamp 202 slides in the slide slot to clamp the silicon wafers placed on the tray 201. In other words, multiple limit clamps 202 form a silicon wafer placement slot for the silicon wafers. By adjusting the position of the limit clamp 202 and the size of the tray 201, the material tray 2 can be loaded with 4-8 inch silicon wafers. The movement path of the material tray 2 between the first conveyor belt 3 and the second conveyor belt 12 is a fixed path, and the conveying speed is slow. During transportation, the material tray 2 does not move relative to the conveyor belt when it starts or stops. When the feed conveyor belt 1 transports the material tray 2 onto the first conveyor belt 3, the first conveyor belt 3 stops conveying. The first conveyor belt 3 resumes conveying only when the material tray 2 is completely on the first conveyor belt 3.

[0056] A mechanical claw 5 is provided on the robotic arm 6, which can drive the mechanical claw 5 and drive the mechanical claw 5 to grab the silicon wafers on the material tray 2 conveyed by the first conveyor belt 3 and place them on the multi-layer automatic coating equipment 4 to perform sol spin coating on the silicon wafers, and put the sol spin-coated silicon wafers back on the material tray 2 of the first conveyor belt 3.

[0057] Please refer to Figure 3 The robotic arm 6 includes an X-axis motor 601, an X-axis reducer 602, an X-axis gear 603, an X-axis reducer mounting plate 604, an X-axis first slider 605, an X-axis first guide rail 606, an X-axis gear 603, an X-axis rack mounting plate 608, an X-axis aluminum profile 609, an X-axis second guide rail 610, an X-axis second slider 611, a Y-axis reducer mounting plate 612, a Y-axis slider 613, a Y-axis guide rail 614, a gripper mounting plate 615, a Y-axis rack 616, a Y-axis gear 617, a Y-axis reducer 618, a Y-axis motor 619, a Y-axis rack mounting plate 620, and a Y-axis aluminum profile 621. The X-axis is horizontal and the Y-axis is vertical, perpendicular to each other. The robotic arm 6 is used to move the gripper 5 to a designated position, thereby helping the gripper 5 to grasp and place a silicon wafer.

[0058] Among them, the X-axis aluminum profile 609 is fixedly installed on the column 8 by boat-shaped nuts and bolts, the X-axis first guide rail 606, the X-axis second guide rail 610 and the X-axis rack mounting plate 608 are fixedly installed on the X-axis aluminum profile 609 by boat-shaped nuts and bolts, the X-axis first guide rail 606 is located on the top surface of the X-axis aluminum profile 609, the X-axis second guide rail 610 is located on the side of the X-axis aluminum profile 609, the X-axis rack 607 is fixedly installed on the X-axis rack mounting plate 608 by screws, the X-axis first slider 605 and the X-axis second slider 610 are fixedly installed on the X-axis rack mounting plate 608, The two sliders 611 are respectively mounted on the X-axis first guide rail 606 and the X-axis second guide rail 610. The X-axis reducer mounting plate 604 is fixedly mounted on the X-axis first slider 605 and the X-axis second slider 611 by screws. The X-axis reducer 602 is fixedly mounted on the X-axis reducer mounting plate 604 by screws. The X-axis motor 601 is mounted on the X-axis reducer 602 by screws. The X-axis gear 603 is mounted on the output shaft of the X-axis reducer 602 by a key. The X-axis gear 603 is fully engaged with the X-axis rack 607. The Y-axis slider 613 is fixed to the X-axis reducer mounting plate 604 with screws. The Y-axis guide rail 614 is fixed to the Y-axis aluminum profile 621 with boat-shaped nuts and bolts. The Y-axis guide rail 614 is mounted on the Y-axis slider 613. The Y-axis rack mounting plate 620 is fixed to the Y-axis aluminum profile 621 with boat-shaped nuts and bolts. The Y-axis rack 616 is fixed to the Y-axis rack mounting plate 620 with screws. The Y-axis reducer mounting plate 612 is fixed to the X-axis reducer mounting plate 604 with screws. The Y-axis motor 619 is fixed to the Y-axis reducer 618 with screws. The Y-axis gear 617 is mounted to the output shaft of the Y-axis reducer 618 with a key, and the Y-axis gear 617 is fully meshed with the Y-axis rack 616. The mechanical claw mounting plate 615 is fixed to the Y-axis rack mounting plate 620 with screws.

[0059] The robotic arm 6 is a two-axis arm with two coordinate systems, X and Y. It has two first X-axis sliders 605, two second X-axis sliders 611, and two Y-axis sliders 613. The coordinate origin of the robotic arm 6 is the position where the gripper 5 can just place the silicon wafer on the coating machine 401 of the multi-layer automatic coating system 4. The range of motion in the X-axis direction is -690 mm to 690 mm, and the range of motion in the Y-axis direction is 0-100 mm. The robotic arm controls the gripper 5 to move along a predefined path within the specified range without colliding with other devices or the machine frame.

[0060] Please refer to Figures 3 to 5The mechanical gripper 5 includes a mechanical gripper motor 501, a motor frame 502, a connecting plate 503, a connector 504, a connecting rod 505, a gripper 506, a flange nut 507, a screw 508, a guide rod 509, a crank 510, a crank stud 511, a crank connecting component 512, and a coupling 513. The mechanical gripper 5 is used to grasp a silicon wafer and, with the assistance of the robotic arm 6, place the wafer in a designated location.

[0061] The motor frame 502 is fixedly mounted on the mechanical claw mounting plate 615 by screws, the mechanical claw motor 501 is fixedly mounted on the motor frame 502, the connecting plate 503 is fixedly connected to the motor frame 502 by screws, and the connecting piece 504 is fixedly mounted on the connecting plate 503 by screws. There are multiple connecting pieces 504, which are evenly distributed around the connecting plate 503. One end of the connecting rod 505 is rotatably mounted on the connecting piece 504 by a bolt, and the other end is rotatably mounted on the hand claw 506 by a bolt, and every two mutually parallel connecting rods 505 form a group and are distributed on the same side of the connecting piece 504; one end of the crank 510 is rotatably mounted on the connecting rod 505 by a stud and a nut, and the other end The hand gripper 506 is rotatably mounted on the connecting rod 505 via bolts. The screw 508 is vertically arranged and connected to the output shaft of the mechanical gripper motor 501 via a coupling 513. The flange nut 507 is threadedly connected to the screw 508. The crank connection component 512 is fixedly connected to the flange nut 507 via screws. There are multiple crank connection components 512, evenly distributed around the flange nut 507. The guide rod 509 is fixedly mounted on the connecting plate 503 via screws. The crank 510 is connected to the crank connection component 512 via a crank stud 511. The connecting plate 503 is also provided with a guide rod 509 extending in the same direction as the connecting screw 508. The number of cranks 510 matches the number of crank connection components 512 and hand grippers 506.

[0062] The mechanical claw 5 is designed as a four-claw type, with four connectors 504, cranks 510, claws 506, and guide rods 509, for a total of sixteen connecting rods 505. Each of the four connecting rods 505, a crank 510, and claws 506 constitutes a claw of the mechanical claw 5. The connecting rods 505 on each claw are parallel to each other when connected. The guide rods 509, inserted through circular holes in the crank connector 512 during installation, serve only as guides. The crank 510 is not fully secured when connected to the crank connector 512 and the connecting rod 505, allowing relative rotation around the studs. The connecting rod 505 is fully secured when connected to the connector 504 and claw 506 via bolts, allowing relative rotation around the bolts.

[0063] The claw tips of gripper 506 are thin, laterally inward-facing blades with upward-facing protrusions 514 located at the tip. The blades are 2mm thick, and the protrusions 514 are located at the ends of the blades. These protrusions secure the silicon wafer when gripping it. Specifically, the claw tips of gripper 506 support the bottom of the wafer, while the inward-facing sidewalls of the protrusions 514 grip the outer sidewalls of the wafer, ensuring a secure grip. When gripper 5 is fully open, the distance between the claw tips is 250mm.

[0064] Please refer to Figure 6 The multi-layer automatic coating equipment 5 includes a coating machine 401, a sheet support 402, a glue dispenser 403, a lifting bar 404, a servo 405, a clamp 406, a linear slide 407, a slide 408, a glue dripping slider 409, a glue dripping slide 410, a glue dripping motor 411, a glue dripping screw 412, a nut connector 413 and a mounting platform 415.

[0065] Among them, the coating machine 401 and the mounting platform 415 are fixedly installed on the loading platform, the glue dripping motor 411 is fixedly installed on the mounting platform 415 through the mounting plate, the glue dripping screw 412 is connected to the output shaft of the glue dripping motor 411 through a coupling, the glue dripping screw 412 is connected to the nut connector 413 through a threaded connection, and the nut connector 413 is fixed on the glue dripping slider 409. The glue-dispensing rail 410 is fixed to the mounting platform 415 via screws. The glue-dispensing rail 410 is parallel to the glue-dispensing screw 412. The glue-dispensing slider 409 is mounted on the glue-dispensing rail 410. The slide 408 is fixed to the glue-dispensing slider 409 via screws. The linear slide 407 is fixed to the slide 408 via screws. The clamp 406 is mounted on the linear slide 407 and can be manually moved to change the position of the clamp 406 on the linear slide 407. The servo 405 is fixed to the clamp 406 via a frame. The lifting bar 404 is a rack and slides on the clamp 406. The output shaft of the servo 405 is equipped with a gear that meshes with the lifting bar 404. The glue dispenser 403 is fixed to the lifting bar 404 and is used to dispense glue to the silicon wafer on the wafer holder 402.

[0066] The mounting platform 415 is installed parallel to the coating machine 401, with an installation interval of 50mm, and the coating machine 401 is installed in consideration of the coordination with the movement of the mechanical claw 5. The mounting platform 415 is provided with a positioning surface for the installation of the glue dripping slide 410. The movement range of the glue dripping slider 409 is 0-200mm; the glue dripping slider 409 is within the movement range of the glue dripping slide 410 and the lead screw nut during movement. The movement range of the linear guide 407 is 0-230mm; the lifting strip 404 is provided with a toothed opening, which can be engaged with the gear on the output shaft of the servo 405; the clamp 406 is provided with an opening, and the clamp 406 can move along the linear slide 407. The glue dispenser 403 is provided with a needle and a hose connector. The hose connector is used to connect the hose to introduce glue, and the glue can drip downward through the needle to achieve glue dripping. When the needle of glue dispenser 403 is aligned with the center of wafer holder 402, clamp 406 is at the farthest limit of linear guide 407. Wafer holder 402 is a truncated cone, driven by coating machine 401. Its top diameter is 198 mm. A suction cup is provided on wafer holder 402 to absorb and secure the silicon wafer through negative pressure.

[0067] Please refer to Figure 7 The annealing furnace equipment 10 includes a furnace shell opening device 101, a conveying assembly 102, a furnace tube assembly 103, and an annealing furnace frame 104. The conveying assembly 102 is mounted on the annealing furnace frame 104 using screws and nuts, the furnace shell assembly 103 is mounted on the annealing furnace frame 104 via a flange seat, and the furnace shell opening device 101 is connected to the furnace tube assembly 103 via a steel wire rope.

[0068] The furnace tube assembly 103 includes a furnace chamber, furnace tubes, heating wires, and other components. The furnace tubes are located within the furnace chamber, and the heating wires are nested within the furnace chamber, enabling high-temperature baking of silicon wafers to achieve annealing. The annealing furnace equipment 10 is a multi-temperature zone annealing furnace, with multiple temperature zones divided within the furnace tubes to easily achieve multi-temperature zone annealing. The furnace shell opening device 101 can open the outer furnace shell of the furnace tube assembly 103 using a steel wire rope. If the furnace shell opening device 101 is provided with a mechanism for pulling the steel wire rope, it can drive the outer furnace shell to flip, allowing the annealing of the silicon wafers inside the furnace tubes to be observed. The conveyor assembly 102 is mounted on the annealing furnace frame 104. The feed end of the conveyor assembly 102 is connected to the discharge end of the first conveyor belt 3, and the discharge end of the conveyor assembly 102 is connected to the feed end of the second conveyor belt 12. The conveyor assembly 102 partially passes through the furnace tubes and is used to convey the material tray 2 and the silicon wafers thereon so that the silicon wafers can be annealed within the furnace tubes of the furnace tube assembly 103. The conveying assembly 102 is provided with an independent mesh belt in the portion corresponding to the furnace tube assembly 103 to transport the material tray 2 .

[0069] The monitoring system includes a first camera 9, a second camera 11, and an alarm system. The first camera 9 and the second camera 11 are used in conjunction with a barcode scanner 15. The first camera 19 is located near the feed end of the annealing furnace 10 and is used to record the moment when the material tray 2 enters the annealing furnace 10 and to take pictures of the sol-coated silicon wafers to collect data. For example, it is used to monitor whether the film on the silicon wafer is intact. If the data collection shows that the film on the silicon wafer does not meet the requirements, the alarm system will sound an alarm and stop the operation of the production line.

[0070] The second camera 11 is arranged at a position close to the discharge end of the annealing furnace equipment 10 and is used to record the moment when the material tray 2 comes out of the annealing furnace equipment 10, so as to detect whether the material tray 2 passes through the annealing furnace equipment 10 within the specified time. If the second camera 11 fails to monitor the material tray 2 coming out of the annealing furnace equipment 10 within the specified time, an alarm will be issued through the alarm system and the operation of the production line will be stopped.

[0071] The alarm system can be an audible and visual alarm, or it can send a signal to the terminal through a communication module to alert the staff.

[0072] It can be understood that in order to achieve the control, coordination and automated production of various components, the transmission components, robotic arms 6, robotic claws 5, multi-layer automatic coating equipment 4, annealing furnace equipment 10 and monitoring systems and other devices are electrically connected to a controller to achieve coordination and unified control of various devices through the controller.

[0073] The following is a specific implementation process of the fully automatic production line for batch preparation of piezoelectric films using the sol-gel method of the present invention:

[0074] A worker places tray 2 (number one) containing silicon wafers onto feed conveyor belt 1. A motor drives feed conveyor belt 1 via a drive roller, transferring tray 2 from feed conveyor belt 1 to first conveyor belt 3, which is driven by the motor and drive roller. When tray 2 reaches the first designated position, first conveyor belt 3 stops, and robotic arm 6 and gripper 5 begin to operate.

[0075] The robot arm's X-axis motor 601 rotates forward, driving the X-axis reducer mounting plate 604 to move 690 mm in the positive X-axis direction through the coordination of the X-axis reducer 602, X-axis gear 603, and the X-axis gear 603, causing the mechanical claw 5 to reach a position directly above the first tray 2. The X-axis motor 601 stops rotating, and the mechanical claw motor 501 begins to rotate forward. The crank connecting component 512 moves downward through the coordination of the coupling 513, screw 508, and flange nut 507. During the downward movement of the crank connecting component 512, the crank 510 and connecting rod 505 cooperate to cause the claw 506 to open outward. When the claw 506 opens to the maximum angle, the mechanical claw motor 501 stops operating. The robot arm's Y-axis motor 619 begins to rotate forward. Through the Y-axis reducer 618, Y-axis rack 616, and Y-axis gear 617, the Y-axis motor 619 drives the Y-axis aluminum profile 621 downward 100 mm along the Y-axis. Upon reaching the desired position, the Y-axis motor 619 stops. The gripper motor 501 begins to rotate in the reverse direction, causing the gripper 5 to begin closing. When the protrusion 514 on the claw tip of the gripper 506 contacts the silicon wafer, the gripper motor 501 stops rotating, indicating that the gripper 5 has fully grasped the silicon wafer. The robot arm's Y-axis motor 619 then begins to rotate in the reverse direction, causing the gripper 5 to rise 100 mm along the Y-axis. After the Y-axis motor 619 stops rotating, the X-axis motor 601 begins to rotate in the reverse direction, driving the gripper 5 in the negative X-axis direction for 690 mm, arriving directly above the wafer holder 402 of the coating machine 401. Then, the Y-axis motor 619 continues to rotate, and the gripper 5 descends 80 mm along the Y-axis. At this point, the silicon wafer contacts the wafer holder 402, and the suction cups of the wafer holder 402 begin to draw air, securing the wafer. Once the wafer is fully secured, the gripper motor 501 begins to rotate forward, and the gripper 5 opens to its maximum angle. The Y-axis motor 619 then reverses, driving the gripper 5 up 80 mm.

[0076] When the mechanical claw 5 is fully raised, the glue-dispensing motor 411 begins rotating forward. Simultaneously, the coating machine 401 drives its wafer holder 402 to rotate at a set speed. The glue-dispensing motor 411 rotates the glue-dispensing screw 412, which in turn drives the slide 408 along the glue-dispensing rail 410. When the needle of the glue dispenser 403 is aligned with the center of the silicon wafer, the glue-dispensing motor 411 stops, and the servo 405 mounted on the fixture 406 begins operating. The servo 405 lowers the lifting bar 404 15 mm via a gear. Once the descent is complete, the glue dispenser 403 begins dispensing glue. During the glue-dispensing process of the multi-layer automatic coating machine 5, the feed conveyor 1 delivers the second tray 2 containing silicon wafers to the first conveyor 3. The first conveyor 3 continues to drive the first tray 2 to the second designated position. At this point, the second tray 2 has not yet reached the first designated position. After the glue dripping work is completed, the suction cup of the sheet holder 402 stops sucking air, and at the same time the servo 405 starts to reverse, the lifting bar 404 rises 15mm and resets, and then the glue dripping motor 411 starts to reverse, driving the slide 408 to the initial position.

[0077] After the coating machine finishes sol spin coating, the Y-axis motor 619 of the robotic arm continues to work, and the Y-axis motor 619 rotates forward to cause the mechanical claw 5 to drop 80mm, and then the mechanical claw motor 501 starts to reverse. When the protruding structure 514 at the tip of the mechanical claw touches the silicon wafer, the mechanical claw motor 501 stops rotating, and the Y-axis motor 619 starts to reverse. When the mechanical claw 5 rises 80mm, the X-axis motor 601 of the robotic arm starts to reverse. The X-axis motor 601 drives the mechanical claw 5 to move 690mm along the negative direction of the X-axis to the second designated position, and then the Y-axis motor 619 rotates forward to cause the mechanical claw 5 to drop 60mm. At this time, the silicon wafer is already in the silicon wafer placement slot of the No. 1 material tray 2, and the mechanical claw motor 501 controls the mechanical claw's hand 506 to open to the maximum angle, and then the Y-axis motor reverses to cause the manipulator to rise 100mm, and the X-axis motor rotates forward to cause the manipulator 5 to return to its initial position.

[0078] After the silicon wafers are placed in the No. 1 tray 2 at the second designated position after the glue is applied, the first camera 9 begins to take pictures of the silicon wafers and collect data, while recording the moment when the No. 1 tray 2 enters the annealing furnace equipment 10. If the data collection finds that the film on the silicon wafer is incomplete, the alarm system is triggered, and all devices in the production line stop working. After receiving the alarm, the staff can take appropriate measures, such as removing the unqualified silicon wafer together with the tray 2. If the film on the silicon wafer is intact, the next process continues. The first conveyor belt 3 sends the No. 1 tray to the annealing furnace equipment 10 for annealing. At the same time, the first conveyor belt 3 also sends the No. 2 tray 2 to the first designated position. The robot arm 6 and the robot hand 5 repeat the above process and spin-coat the silicon wafers on the No. 2 tray 2. During this process, the No. 3 tray 2 containing silicon wafers is sent to the first conveyor belt 3. After the No. 2 tray 2 is sent to the annealing furnace equipment 10 for annealing, the No. 3 tray 2 is transported to the first designated position. Similarly, repeat the above process for tray 2 No. 4 and tray 2 No. 5.

[0079] The annealing furnace equipment 10 is provided with three annealing zones, with independent mesh belts for transporting the trays. The mesh belts are transported slowly at a set speed. When tray 2 No. 2 is transported into the annealing furnace equipment 10, tray 1 No. 2 has just entered the first annealing zone; when tray 2 No. 3 is transported into the annealing furnace equipment 10, tray 2 No. 2 has just entered the first annealing zone, and tray 1 No. 2 has just entered the second annealing zone; similarly, when tray 2 No. 4 is transported into the annealing furnace equipment 10, trays 3, 2, and 1 have just entered the first, second, and third annealing zones, respectively; when tray 2 No. 5 is transported into the annealing furnace equipment 10, trays 4, 3, and 2 have just entered the first, second, and third annealing zones, respectively, while tray 1 has completed annealing and has just been transported to the second conveyor belt 12.

[0080] A timer begins for each tray 2 as it enters the annealing furnace 10. This timer is monitored by the first camera 9. If the second camera 11 fails to detect a tray exiting the annealing furnace 10 within the specified time, an alarm system is triggered, halting all system functions and notifying personnel to take appropriate action. If tray 2 completes the annealing process within the specified time, it can be transferred to the second conveyor 12. The second conveyor 12 drives tray 2, which continues to move. When tray 2 is directly below the barcode scanner 15, the barcode scanner 15 scans the QR code on tray 2 and records the number. This completes the entire coating annealing cycle for the silicon wafers on tray 2. After recording, tray 2 is transferred from the second conveyor 12 to the first conveyor 3, where it continues the coating annealing process described above. The first conveyor 3 then transfers tray 2 to the first designated location, where the robot 5 and robot arm 6 continue the aforementioned process. When the silicon wafers on tray 1 have completed secondary coating and are being fed into the annealing furnace 10, trays 5, 4, and 3 have just entered the first, second, and third annealing zones, respectively. The silicon wafers on tray 2 have just completed annealing and are being fed to the second conveyor belt 12, repeating the process for tray 1. Similarly, the process repeats for trays 3, 4, and 5.

[0081] The silicon wafers need to undergo a total of five coating annealing processes. When a certain numbered tray is recorded by the barcode scanner 15 for the fifth time, the second conveyor belt 12 will immediately stop transmission. At this time, the cylinder 13 starts working. The cylinder 13 pushes the tray to the discharge platform 16 through the push rod 14, and the barcode scanner 15 clears all records of the number.

[0082] The first and second designated positions refer to the positions where the center of the tray and the center of the gripper are aligned along the X-axis. The first designated position is 690 mm (approximately 100 mm) of movement of the robotic arm 6 along the X-axis, and the second designated position is -690 mm (approximately 100 mm) of movement of the robotic arm 6 along the X-axis. After reaching the designated positions, a detection and control mechanism can be installed to keep the tray 2 in place. A detection device is installed on the gripper 5 to help position the tray. When fully extended, the gripper 5 will not contact the protective cover of the coating machine 401 or the wafer placement slots of the tray.

[0083] In summary, the present invention provides a fully automatic production line for batch preparation of piezoelectric films using the sol-gel method, which can continuously perform sol spin coating and film annealing, further improving the continuity of the overall process, greatly improving the degree of automation of the sol spin coating and film annealing processes, and solving the technical problems in the prior art such as low sol spin coating efficiency, low degree of automation, and inability to batch produce piezoelectric films.

[0084] The fully automatic production line for batch preparation of piezoelectric films by the sol-gel method provided by the present invention can continuously perform sol spin coating and annealing work for film preparation, greatly improving the degree of automation of the production line and greatly improving the work efficiency of preparing piezoelectric films. It can also prepare piezoelectric films in batches and can realize repeated sol spin coating and annealing work during the preparation of piezoelectric films, thereby helping to realize the automated, batch and continuous production of piezoelectric films.

[0085] The fully automatic production line for batch preparation of piezoelectric films using the sol-gel method sets up a special mechanical claw structure so that the mechanical claw will not affect the coating when grabbing the silicon wafer, thereby ensuring the quality of the sol spin coating and film annealing of the piezoelectric film.

[0086] The fully automatic production line for batch preparation of piezoelectric films by the sol-gel method is designed with a tray structure that has detachable limit cards and a tray. By adjusting the position of the limit cards and the size of the tray, the tray can be loaded with silicon wafers of different sizes, making it suitable for the preparation of piezoelectric films for silicon wafers of different sizes.

[0087] The fully automatic production line for batch preparation of piezoelectric films by the sol-gel method automates the glue dripping and leveling process by improving the coating machine structure, making the spin coating more uniform and improving the efficiency of the coating.

[0088] The fully automatic production line for batch preparation of piezoelectric films using the sol-gel method improves the traditional annealing furnace and designs a multi-temperature zone annealing structure, so that the annealing temperature and time can be precisely controlled.

[0089] The fully automatic production line for batch preparation of piezoelectric films using the sol-gel method can accurately control the film thickness by setting up a scanner to record the number of spin coating and annealing times, and assist in the repeated sol spin coating and annealing work during the preparation of piezoelectric films.

[0090] The fully automatic production line for batch preparation of piezoelectric films using the sol-gel method can monitor the process effects of the sol spin coating and film annealing process in real time by setting up monitoring devices. When problems occur in the process, it can promptly alarm to minimize losses.

[0091] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A fully automatic production line for batch preparation of piezoelectric films using a sol-gel method, characterized in that: Includes: A multi-layer automatic coating device (4) is used for performing sol spin coating on silicon wafers; the multi-layer automatic coating device (4) comprises: A coating machine (401) is provided with a wafer support (402) that can be driven to rotate by the coating machine (401), and a suction cup is provided on the wafer support (402) to absorb the silicon wafer through negative pressure; A mounting platform (415) is provided with a glue dripping slide rail (410) and a glue dripping screw (412) which are parallel to each other. The glue dripping screw (412) is driven to rotate by a glue dripping motor (411) installed on the mounting platform (415). A glue dripping slider (409) is slidably provided on the glue dripping slide rail (410). A nut connector (413) is provided on the glue dripping slider (409). The nut connector (413) is connected to the glue dripping screw (412) by a thread. The glue-drip slider (409) is further provided with a slide seat (408), the slide seat (408) is provided with a laterally arranged linear slide rail (407), the linear slide rail (407) is sleeved with a fixture (406), the fixture (406) is installed with a steering gear (405), the fixture (406) is provided with a lifting bar (404) for vertical sliding, the lifting bar (404) is a rack, the output shaft of the steering gear (405) is provided with a gear and meshes with the lifting bar (404); the lifting bar (404) is provided with a glue dispenser (403) for dripping glue onto the silicon wafer located on the wafer holder (402); An annealing furnace device (10) is used to anneal the silicon wafers that have been spin-coated with the sol; a first conveyor belt (3) and a second conveyor belt (12), wherein the discharge end of the second conveyor belt (12) is connected to the feed end of the first conveyor belt (3), the discharge end of the first conveyor belt (3) is connected to the feed end of the annealing furnace equipment (10), and the feed end of the second conveyor belt (12) is connected to the discharge end of the annealing furnace equipment (10); a material tray (2), at least one of which is used to load silicon wafers, and the material tray (2) is capable of being conveyed on the annealing furnace equipment (10), the first conveyor belt (3) and the second conveyor belt (12); a robotic arm (6) having a robotic claw (5) disposed thereon, the robotic arm (6) being capable of driving the robotic claw (5) and driving the robotic claw (5) to grab a silicon wafer on a material tray (2) conveyed by the first conveyor belt (3) and place the wafer on the multi-layer automatic coating device (4) to perform sol spin coating on the silicon wafer, and placing the sol spin-coated silicon wafer back onto the material tray (2) of the first conveyor belt (3); The mechanical claw (5) comprises a motor frame (502), a connecting rod (505) and a crank (510); The mechanical claw (5) is provided with a mechanical claw motor (501), a connecting plate (503) is provided at the bottom of the motor frame (502), a plurality of connecting members (504) are provided around the circumference of the connecting plate (503), a plurality of connecting rods (505), one end of the connecting rod (505) is rotatably connected to the connecting member (504), and the other end is rotatably connected to the hand claw (506), and every two mutually parallel connecting rods (505) form a group and are distributed on the same side of the connecting member (504); The output shaft of the mechanical claw motor (501) is connected to a vertically arranged connecting screw (508) through a coupling (513); a flange nut (507) is sleeved on the connecting screw (508); a plurality of crank connecting components (512) are circumferentially arranged around the flange nut (507); the connecting disk (503) is further provided with a guide rod (509) extending in the same direction as the connecting screw (508); and a through hole is provided on the crank connecting component (512) for the guide rod (509) to pass through. The number of the cranks (510) is consistent with the number of the crank connecting parts (512) and the hand claws (506). One end of the crank (510) is rotatably connected to the crank connecting part (512), and the other end is rotatably connected to the connecting rod (505) corresponding to the hand claw (506).

2. The fully automatic production line for batch preparation of piezoelectric thin films by the sol-gel method according to claim 1, characterized in that: The second conveyor belt (12) is provided with a discharge platform (16) on one side surface near the discharge end, and a cylinder (13) is provided on the other side surface opposite thereto, and a push rod (14) is provided on the output rod of the cylinder (13), and the push rod (14) faces the discharge platform (16); An identification code is provided on the material tray (2), and a code scanner (15) is provided on the second conveyor belt (12) at a position close to the discharge end for scanning and identifying the identification code on the material tray (2). When the code scanner (15) records that a certain material tray (2) has passed the code scanner (15) a certain number of times, the cylinder (13) can drive the push rod (14) to push the material tray (2) to the discharge platform (16).

3. The fully automatic production line for batch preparation of piezoelectric thin films by the sol-gel method according to claim 1, characterized in that: Also included is a monitoring system, which includes a first camera (19), a second camera (11) and an alarm system; The first camera (19) is arranged at a position close to the feeding end of the annealing furnace device (10) and is used to record the moment when the material tray (2) enters the annealing furnace device (10) and to take pictures of the silicon wafers after the sol spin coating to collect data. If it is found through data collection that the film on the silicon wafer does not meet the requirements, an alarm is issued through the alarm system and the operation of the production line is stopped; The second camera (11) is arranged at a position close to the discharge end of the annealing furnace equipment (10) and is used to record the moment when the material tray (2) comes out of the annealing furnace equipment (10) to detect whether the material tray (2) passes through the annealing furnace equipment (10) within a specified time. If the second camera (11) fails to detect that the material tray (2) comes out of the annealing furnace equipment (10) within the specified time, an alarm is issued through the alarm system and the operation of the production line is stopped.

4. The fully automatic production line for batch preparation of piezoelectric thin films by the sol-gel method according to claim 1, characterized in that: The first conveyor belt (3) is connected to a feed conveyor belt (1) at a side surface near the feed end, and the material tray (2) can be conveyed to the first conveyor belt (3) through the feed conveyor belt (1).

5. The fully automatic production line for batch preparation of piezoelectric thin films by the sol-gel method according to claim 1, characterized in that: The annealing furnace equipment (10) includes: Annealing furnace rack (104); A furnace tube assembly (103) is mounted on an annealing furnace frame (104), wherein the furnace tube assembly (103) comprises a furnace chamber, a furnace tube, and a heating wire, wherein the furnace tube is located in the furnace chamber, and the heating wire is nested in the furnace chamber; A conveying assembly (102) is mounted on the annealing furnace frame (104), wherein the feed end of the conveying assembly (102) is connected to the discharge end of the first conveyor belt (3), and the discharge end of the conveying assembly (102) is connected to the feed end of the second conveyor belt (12). The conveying assembly (102) partially passes through the furnace tube assembly (103) and is used to convey the material tray (2) and the silicon wafers thereon so that the silicon wafers are annealed in the furnace tube assembly (103).

6. The fully automatic production line for batch preparation of piezoelectric thin films by the sol-gel method according to claim 1, characterized in that: The claw tip of the hand claw (506) is a thin slice facing inward laterally, and the claw tip of the thin slice is provided with an upward protruding structure (514) at a distance from the tip.

7. The fully automatic production line for batch preparation of piezoelectric films by the sol-gel method according to claim 1 or 5, characterized in that: The annealing furnace equipment (10) is a multi-temperature section annealing furnace.

8. The fully automatic production line for batch preparation of piezoelectric films by the sol-gel method according to claim 1, characterized in that: The material tray (2) comprises a tray (201), a limiting card (202) and a bottom support (203); a rotating buckle is provided on the tray (201) or the bottom support (203); the tray (201) is connected to the bottom support (203) via the rotating buckle; a slide groove is provided on the bottom support (203); the limiting card (202) is slidably arranged in the slide groove to clamp the silicon wafer placed on the tray (201).

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