Semiconductor panel quantitative adhesive bonding device

Abstract

The present application provides a kind of semiconductor panel quantitative adhesive bonding device, including extruding glue coating mechanism, infiltration component, push mechanism, infiltration component is located below extruding glue coating mechanism, push mechanism is located below infiltration component, infiltration component is equipped with coating plate, coating plate central is equipped with the infiltration net for infiltrating glue, extruding glue coating mechanism extrudes glue towards coating plate and back and forth brush motion, so that glue is evenly infiltrated to below by infiltration net, push mechanism is pushed to semiconductor plate material to dip the glue below infiltration net;The present application effectively carries out accurate adhesive bonding to semiconductor plate material using extruding glue coating mechanism, infiltration component, push mechanism, avoids the waste of glue;First glue brushing component, glue extruder, second glue brushing component are used to brush glue back and forth, which is beneficial to the uniform distribution of glue on the infiltration net;Two winding components, protective film and pushing device are used to push semiconductor plate material, effectively preventing the situation that glue accidentally falls on the upper surface of pushing device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing equipment, in particular to a semiconductor panel quantitative gluing device. BACKGROUND

[0002] Semiconductor refers to the material with the electrical conductivity between conductor and insulator at room temperature, and the semiconductor is applied in the fields of integrated circuit, consumer electronics, communication system, photovoltaic power generation, illumination, high-power power conversion, etc.

[0003] When some specific semiconductor products are processed, two pieces of semiconductor panel materials need to be laminated to form a double-layer semiconductor product. Before the lamination of the semiconductor panel materials, one piece of the semiconductor panel material is glued, and then another piece of the semiconductor panel material without glue is laminated on the piece of the glued semiconductor panel material. When gluing, the glue extruded by the existing glue extruding device is not uniform, and the amount of the extruded glue is large. After extrusion, the glue is scraped flat by a scraping piece. When scraping is completed, a large amount of glue remains on the scraping piece. When the scraping frequency reaches a certain number, the glue on the scraping piece accumulates to a certain volume and spills out, resulting in a large number of glue spots around the scraping piece. Although the glue extruding device can adjust the amount of the extruded glue, when the amount of the extruded glue is adjusted to be small, the peripheral part of the semiconductor panel material cannot be covered with glue, which leads to the inaccurate control of the glue used by the semiconductor panel material, and further leads to the waste of the glue and the impact on the cleanliness of the production environment.

[0004] Therefore, it is necessary to provide a semiconductor panel quantitative gluing device to solve the problem of the difficulty in accurately quantifying the gluing of the semiconductor panel material. SUMMARY

[0005] In order to solve the above problems, the present application provides a semiconductor panel quantitative gluing device to solve the problem of the difficulty in accurately quantifying the gluing of the semiconductor panel material.

[0006] The present application is realized by the following technical scheme:

[0007] The present application provides a semiconductor panel quantitative gluing device, which comprises a glue extruding and smearing mechanism, a downward infiltration assembly and an upward pushing mechanism. The downward infiltration assembly is located below the glue extruding and smearing mechanism, and the upward pushing mechanism is located below the downward infiltration assembly. A smearing plate is arranged on the downward infiltration assembly, and a central part of the smearing plate is provided with an infiltration net for infiltrating glue. The glue extruding and smearing mechanism extrudes glue towards the smearing plate and moves back and forth to make the glue infiltrate uniformly through the infiltration net. The upward pushing mechanism pushes the semiconductor panel material upwards to dip the glue below the infiltration net.

[0008] Further, the glue extruding and coating mechanism comprises a support frame, a first speed reducer motor, and an extrusion brush assembly, the first speed reducer motor is fixedly connected to the upper surface of the support frame, the extrusion brush assembly is slidably connected to the upper surface of the support frame and is threadedly connected with the rotating shaft of the first speed reducer motor, and the extrusion brush assembly faces the coating plate.

[0009] Further, the extrusion brush assembly comprises a sliding frame, a first glue brushing assembly, a glue extruder, and a second glue brushing assembly, the sliding frame is slidably connected to the upper surface of the support frame, the first glue brushing assembly, the glue extruder, and the second glue brushing assembly all penetrate the sliding frame and are fixedly connected with the sliding frame, the first glue brushing assembly and the second glue brushing assembly are symmetrically arranged, and the glue extruder is located between the first glue brushing assembly and the second glue brushing assembly.

[0010] Further, the first glue brushing assembly comprises an electric cylinder, a fixed plate, and a glue brushing head, the fixed plate is fixedly connected to the upper surface of the sliding frame, the electric cylinder is fixedly connected above the fixed plate, the push rod of the electric cylinder penetrates the fixed plate and the sliding frame in sequence, and the glue brushing head is fixedly connected with the push rod of the electric cylinder and slidably connected with the fixed plate; the first glue brushing assembly and the second glue brushing assembly are of the same structure.

[0011] Further, the glue brushing head comprises a lifting frame, a driving device, and a scraper assembly, a connecting column is arranged on the lifting frame, the connecting column is fixedly connected with the push rod of the electric cylinder, the lifting frame penetrates the fixed plate and is slidably connected with the fixed plate, the driving device is fixedly connected to one side of the lifting frame, the scraper assembly is rotatably connected to one end of the lifting frame, the rotating shaft of the driving device penetrates the shaft center of the rotating connection between the scraper assembly and the lifting frame in sequence, and the rotating shaft of the driving device is fixedly connected with the scraper assembly.

[0012] Further, one side of the scraper assembly is provided with a scale dial, and one side of the lifting frame is provided with a pointer, and the pointer points to the scale dial.

[0013] Further, a plurality of glue feeding pipes are arranged on the glue extruder in sequence, and the plurality of glue feeding pipes are located between the first glue brushing assembly and the second glue brushing assembly and face the coating plate.

[0014] Further, the pushing mechanism comprises a fixed frame, two winding assemblies, a protective film, and a pushing device, the two winding assemblies are symmetrically arranged and fixedly connected to the bottom of the fixed frame, the pushing device is fixedly connected to the top of the fixed frame and faces the coating plate, one end of the protective film is fixedly wound on one of the winding assemblies, the protective film passes over the top of the pushing device and the other end is fixedly wound on the other winding assembly.

[0015] Further, a plurality of supporting rollers are symmetrically arranged on the fixing frame and abut against the inner side of the protective film.

[0016] Further, the winding assembly comprises a second speed reducer, and a winding drum, the second speed reducer is fixedly connected to one side of the bottom of the fixing frame, the rotating shaft of the second speed reducer penetrates through the fixing frame, and the winding drum is fixedly connected to the rotating shaft of the second speed reducer, and one end of the protective film is fixedly wound on the winding drum.

[0017] The present application has the following advantages:

[0018] The present application adopts the glue extruding and smearing mechanism, the downward infiltration assembly and the upward pushing mechanism to effectively and accurately glue the semiconductor plate; when gluing the semiconductor plate, the glue extruding and smearing mechanism first extrudes glue towards the smearing plate and brushes back and forth, at this time, the glue is uniformly infiltrated to the lower side through the infiltration net, and then the upward pushing mechanism pushes the semiconductor plate upwards, and the surface of the semiconductor plate is uniformly dipped with the glue below the infiltration net, which is beneficial to regulating the amount of glue on the surface of the semiconductor plate and avoiding waste of glue.

[0019] The first glue brushing assembly, the glue extruder and the second glue brushing assembly are adopted to brush glue back and forth, which is beneficial to uniformly distributing the glue on the infiltration net; when brushing glue on the smearing plate, the glue extruder first extrudes a certain amount of glue on the surface of the smearing plate, then the first speed reducer rotates to drive the glue brushing assembly to slide forward, at this time, the first glue brushing assembly descends and scrapes or brushes the glue forward, when the glue brushing assembly slides to the end, the second glue brushing assembly descends and the first glue brushing assembly ascends, the first speed reducer reverses to drive the glue brushing assembly to slide backward, at this time, the second glue brushing assembly scrapes the glue originally scraped forward to the backward, after the glue is scraped back and forth twice, the glue is uniformly infiltrated on the infiltration net, and after the semiconductor plate is pushed upwards by the upward pushing mechanism, the semiconductor plate can be uniformly dipped with the infiltrated glue, which is beneficial to uniformly dipping the semiconductor plate.

[0020] The two winding assemblies, the protective film and the pushing device are adopted to push the semiconductor plate upwards, which effectively prevents the glue on the semiconductor plate from accidentally falling on the upper surface of the pushing device; the protective film is placed on the upper surface of the pushing device and is tightly wound by the two winding assemblies, when the semiconductor plate is pushed upwards, the protective film prevents the semiconductor plate from contacting the pushing device, the two winding assemblies release the protective film, and after the pushing action is completed, the two winding assemblies continue to wind the protective film to tighten the protective film, which can prevent the glue on the semiconductor plate from accidentally falling on the pushing device and is beneficial to keeping the pushing device clean.

[0021] In summary, the semiconductor panel quantitative glue sticking device adopts the glue extruding and coating mechanism, the downward infiltration assembly and the upward pushing mechanism to effectively accurately stick glue to the semiconductor plate material, so as to avoid waste of glue; the glue extruding and coating assembly adopts the first glue coating assembly, the glue extruder and the second glue coating assembly to back and forth coat glue, which is beneficial to uniform distribution of the glue on the infiltration net; the upward pushing mechanism adopts the two winding assemblies, the protective film and the pushing device to push the semiconductor plate material, so as to effectively prevent the glue from accidentally falling on the upper surface of the pushing device. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a whole schematic diagram of the semiconductor plate material laminating production line;

[0023] Figure 2 It is the semiconductor panel quantitative glue sticking device in the application; Figure 1 It is a partial enlarged schematic diagram of the label A;

[0024] Figure 3 It is an exploded view of the semiconductor panel quantitative glue sticking device in the application;

[0025] Figure 4 It is a schematic diagram of the glue extruding and coating mechanism of the semiconductor panel quantitative glue sticking device in the application;

[0026] Figure 5 It is a schematic diagram of the downward infiltration assembly of the semiconductor panel quantitative glue sticking device in the application;

[0027] Figure 6 It is a schematic diagram of the upward pushing mechanism of the semiconductor panel quantitative glue sticking device in the application;

[0028] Figure 7 It is another angle schematic diagram of the upward pushing mechanism of the semiconductor panel quantitative glue sticking device in the application;

[0029] Figure 8 It is a schematic diagram of the glue coating head of the semiconductor panel quantitative glue sticking device in the application;

[0030] Figure 9 It is another angle schematic diagram of the glue coating head of the semiconductor panel quantitative glue sticking device in the application;

[0031] Figure 10 It is Figure 3 It is a partial enlarged schematic diagram of the label B;

[0032] Figure 11 It is Figure 4 It is a partial enlarged schematic diagram of the label C;

[0033] Figure 12 It is Figure 8 It is a partial enlarged schematic diagram of the label D. DETAILED DESCRIPTION

[0034] In order to make the technical solutions of the present application clearer and more complete, the present application will be further described below with reference to the drawings.

[0035] Please refer to Figures 1-12 The present application provides a kind of semiconductor panel quantitative gluing device, including extruding glue coating mechanism 1, lower infiltration component 2, push mechanism 3, lower infiltration component 2 is located below extruding glue coating mechanism 1, push mechanism 3 is located below lower infiltration component 2, lower infiltration component 2 is equipped with coating plate 21, coating plate 21 central is equipped with the infiltration net 211 for infiltrating glue, extruding glue coating machine 1 constructs and moves towards coating plate 21 extruding glue and back and forth, so that glue is uniformly infiltrated to below by infiltration net 211, push mechanism 3 is pushed up to dip the glue below infiltration net 211 by semiconductor plate material.

[0036] In the present embodiment:

[0037] Extruding glue coating mechanism 1 is used to extrude glue to coating plate 21 and move back and forth;

[0038] Lower infiltration component 2 is used to provide a lower infiltration structure for glue after extruding;

[0039] Coating plate 21 is used to provide a supporting structure for glue when brushing;

[0040] Infiltration net 211 is used to infiltrate glue;

[0041] Push mechanism 3 is used to drive semiconductor plate material to push up to dip glue;

[0042] Specifically, when gluing semiconductor plate material, extruding glue coating mechanism 1 first extrudes glue towards coating plate 21 and moves back and forth, at this time, glue will be uniformly infiltrated to below by infiltration net 211, then push mechanism 3 pushes semiconductor plate material upwards, the surface of semiconductor plate material is uniformly dipped to the glue below infiltration net 211, which is conducive to regulating the amount of glue on the surface of semiconductor plate material and avoids waste of glue.

[0043] Further, the glue extruding and applying mechanism 1 comprises a support frame 11, a first speed reducer motor 12 and a glue extruding brush assembly 13. The first speed reducer motor 12 is fixedly connected to the upper surface of the support frame 11. The glue extruding brush assembly 13 is slidingly connected to the upper surface of the support frame 11 and is threadedly connected to the rotating shaft of the first speed reducer motor 12. The glue extruding brush assembly 13 faces the applying plate 21. The glue extruding brush assembly 13 comprises a sliding frame 131, a first glue brushing assembly 132, a glue extruder 133 and a second glue brushing assembly 134. The sliding frame 131 is slidingly connected to the upper surface of the support frame 11. The first glue brushing assembly 132, the glue extruder 133 and the second glue brushing assembly 134 all penetrate through the sliding frame 131 and are fixedly connected to the sliding frame 131. The first glue brushing assembly 132 and the second glue brushing assembly 134 are symmetrically arranged. The glue extruder 133 is located between the first glue brushing assembly 132 and the second glue brushing assembly 134. The first glue brushing assembly 132 comprises an electric cylinder 1321, a fixed plate 1322 and a glue brushing head 1323. The fixed plate 1322 is fixedly connected to the upper surface of the sliding frame 131. The electric cylinder 1321 is fixedly connected above the fixed plate 1322. The push rod of the electric cylinder 1321 penetrates through the fixed plate 1322 and the sliding frame 131 in sequence. The glue brushing head 1323 is fixedly connected to the push rod of the electric cylinder 1321 and is slidingly connected to the fixed plate 1322. The first glue brushing assembly 132 and the second glue brushing assembly 134 are of the same structure. The glue brushing head 1323 comprises a lifting frame 13231, a driving device 13232 and a scraper assembly 13233. A connecting column 101 is arranged on the lifting frame 13231. The connecting column 101 is fixedly connected to the push rod of the electric cylinder 1321. A sliding rod 102 is arranged on the lifting frame 13231. The sliding rod 102 penetrates through the fixed plate 1322 and is slidingly connected to the fixed plate 1322. The driving device 13232 is fixedly connected to one side of the lifting frame 13231. The scraper assembly 13233 is rotatably connected to one end of the lifting frame 13231. The rotating shaft of the driving device 13232 penetrates through the scraper assembly 13233 and the rotating shaft of the lifting frame 13231 in sequence. The rotating shaft of the driving device 13232 is fixedly connected to the scraper assembly 13233. One side of the scraper assembly 13233 is provided with a dial 13234. One side of the lifting frame 13231 is provided with a pointer 103. The pointer 103 points to the dial 13234. A plurality of glue feeding pipes 1331 are arranged on the glue extruder 133 in sequence. The plurality of glue feeding pipes 1331 are located between the first glue brushing assembly 132 and the second glue brushing assembly 134 and face the applying plate 21.

[0044] In the present embodiment,

[0045] The support frame 11 is used to provide a stable support structure for the first speed reducer motor 12 and the glue extruding brush assembly 13.

[0046] The first speed reducer motor 12 is used to drive the glue extruding brush assembly 13 to slide back and forth.

[0047] The glue extruding brush assembly 13 is used to extrude glue and brush or scrape glue.

[0048] The sliding frame 131 is used to provide a stable support structure for the first glue brushing assembly 132, the glue extruder 133 and the second glue brushing assembly 134;

[0049] The first glue brushing assembly 132 is used to brush or scrape the glue on the coating plate 21;

[0050] The electric cylinder 1321 is used to drive the glue brushing head 1323 to move up and down;

[0051] The fixed plate 1322 is used to provide a stable support structure for the electric cylinder 1321;

[0052] The glue brushing head 1323 is used to brush or scrape the glue;

[0053] The lifting frame 13231 is used to drive the glue brushing head 1323 to move up and down;

[0054] The connecting column 101 is used to provide a structure for the lifting frame 13231 to be fixedly connected with the push rod of the electric cylinder 1321;

[0055] The sliding rod 102 is used to provide a structure for the lifting frame 13231 to be slidingly connected with the fixed plate 1322;

[0056] The pointer 103 is used to display the angle between the current scraper assembly 13233 and the horizontal plane;

[0057] The driving device 13232 is used to drive the scraper assembly 13233 to adjust the angle with the horizontal plane;

[0058] The scraper assembly 13233 is used to brush or scrape the glue;

[0059] The dial 13234 is used to display the angle between the current scraper assembly 13233 and the horizontal plane;

[0060] The glue extruder 133 is used to extrude the glue onto the coating plate 21;

[0061] The glue feeding pipe 1331 is used to feed the glue onto the coating plate 21;

[0062] The second glue brushing assembly 134 has the same structure as the first glue brushing assembly 132;

[0063] Specifically, when the glue brushing assembly 13 brushes glue on the coating plate 21, the glue extruder 133 first extrudes a certain amount of glue on the upper surface of the coating plate 21, and then the first reduction motor 12 drives the glue brushing assembly 13 to slide forward, at this time the first glue brushing assembly 132 descends and scrapes or brushes the glue forward, when the glue brushing assembly 13 slides to the end of the coating plate 21, the second glue brushing assembly 134 descends and the first glue brushing assembly 132 rises, and the first reduction motor 12 drives the glue brushing assembly 13 to slide backward, at this time the second glue brushing assembly 134 scrapes the glue that was scraped forward to the rear, and after the glue is scraped back and forth twice, the permeable net 211 is covered with glue, and the glue on the permeable net 211 is evenly infiltrated, after the semiconductor plate material is pushed up by the pushing mechanism 3, the semiconductor plate material can be evenly dipped in the infiltrated glue, which is beneficial to the uniform dipping of the semiconductor plate material.

[0064] Further, the pushing mechanism 3 includes a fixed frame 31, two winding assemblies 32, a protective film 33, and a pushing device 34. The two winding assemblies 32 are symmetrically arranged and fixedly connected to the bottom of the fixed frame 31. The pushing device 34 is fixedly connected to the top of the fixed frame 31 and faces the coating plate 21. One end of the protective film 33 is fixedly wound on one of the winding assemblies 32, and the other end of the protective film 33 passes over the top of the pushing device 34 and is fixedly wound on the other winding assembly 32. A plurality of support rollers 311 are symmetrically arranged on the fixed frame 31, and each of the support rollers 311 abuts the inner side of the protective film 33.

[0065] In the embodiment, the pushing mechanism 3 includes a fixed frame 31, two winding assemblies 32, a protective film 33, and a pushing device 34. The two winding assemblies 32 are symmetrically arranged and fixedly connected to the bottom of the fixed frame 31. The pushing device 34 is fixedly connected to the top of the fixed frame 31 and faces the coating plate 21. One end of the protective film 33 is fixedly wound on one of the winding assemblies 32, and the other end of the protective film 33 passes over the top of the pushing device 34 and is fixedly wound on the other winding assembly 32. A plurality of support rollers 311 are symmetrically arranged on the fixed frame 31, and each of the support rollers 311 abuts the inner side of the protective film 33.

[0066] The fixed frame 31 is used to provide a stable support structure for the two winding assemblies 32, the protective film 33, and the pushing device 34.

[0067] The support rollers 311 are used to support the protective film 33.

[0068] The two winding assemblies 32 are used to tighten the protective film 33.

[0069] The second reduction motor 321 is used to drive the winding drum 322 to rotate to tighten the protective film 33.

[0070] The winding drum 322 is used to wind the protective film 33.

[0071] The protective film 33 is used to prevent the glue on the semiconductor plate material from accidentally falling onto the pushing device 34.

[0072] The pushing device 34 is used to push the semiconductor plate material upward to dip glue;

[0073] Specifically, the protective film is placed on the upper surface of the pushing device 34, and both ends are tightened by the winding assembly 32. When the semiconductor plate material is pushed upward, the protective film 33 isolates the semiconductor plate material from the pushing device 34. The two winding assemblies 32 release the protective film 33. After the pushing action is completed, the two winding assemblies 32 continue to wind the protective film 33 to tighten the protective film 33. In this way, the situation that the glue on the semiconductor plate material accidentally falls on the pushing device 34 can be prevented, which is beneficial to maintain the cleanliness of the pushing device 34, and also prevents the bottom of the semiconductor plate material from being scratched by the pushing device 34.

[0074] Of course, the present application can have other various embodiments. Based on the present embodiment, other embodiments obtained by those of ordinary skill in the art without any creative labor fall within the scope of the present application.

Claims

1. A semiconductor panel quantitative adhesive bonding apparatus, characterized by, The utility model provides a glue spreading device, including extruding glue coating mechanism, infiltration subassembly, push mechanism, the infiltration subassembly is located extruding glue coating mechanism below, push mechanism is located the infiltration subassembly below, be equipped with the coating plate on the infiltration subassembly, the coating plate central location is equipped with the infiltration net for infiltrating glue, extruding glue coating mechanism includes support frame, first speed reducer motor, extruding brush subassembly, first speed reducer motor fixed connection on the support frame upper surface, extruding brush subassembly sliding connection is in the support frame upper surface with the rotation axis screw joint of first speed reducer motor, extruding brush subassembly is toward the coating plate, extruding brush subassembly includes sliding frame, first glue brushing subassembly, extruding glue ware, second glue brushing subassembly, sliding frame sliding connection is in the support frame upper surface, first glue brushing subassembly, extruding glue ware, second glue brushing subassembly all are through the sliding frame with the fixed connection of sliding frame, first glue brushing subassembly with second glue brushing subassembly symmetrical setting, extruding glue ware is located first glue brushing subassembly with second glue brushing subassembly between, first glue brushing subassembly includes electric jar, fixed plate, glue brushing head, fixed plate fixed connection is on the sliding frame upper surface, electric jar fixed connection is on the fixed plate top, the push rod of electric jar is in turn through fixed plate, sliding frame, glue brushing head with the push rod fixed connection of electric jar and with fixed plate sliding connection, first glue brushing subassembly with second glue brushing subassembly same structure, push mechanism includes fixed frame, two winding subassembly, protective film, push device, two winding subassembly symmetrical setting and fixed connection in the fixed frame bottom, push device fixed connection is in the fixed frame top and is toward the coating plate, one end of protective film is fixed winding in one winding subassembly, protective film is from the top of push device and is around and is fixed winding in another winding subassembly on the other end, extruding glue ware first extrudes the quantitative glue on the coating plate upper surface, then first speed reducer motor positive rotation drives extruding brush subassembly to slide forward, at this time, first glue brushing subassembly drops and scrape or brushes the glue forward, when extruding brush subassembly slides to the end of coating plate, second glue brushing subassembly drops, first glue brushing subassembly rises, first speed reducer motor reverses and drives extruding brush subassembly to slide back, at this time, second glue brushing subassembly then scrapes the glue originally scraped to the front to the rear, after the glue is scraped back and forth twice, the infiltration net is full of glue, and the glue is evenly infiltrated on the infiltration net, after the push mechanism pushes up the semiconductor plate material, the semiconductor plate material can evenly dip the infiltrated glue.

2. The apparatus according to claim 1, wherein The glue brushing head includes a lifting frame, a driving device, and a scraper assembly. The lifting frame is fixedly connected with the push rod of the electric jar and penetrates through the fixed plate and is slidingly connected with the fixed plate. The driving device is fixedly connected to one side of the lifting frame. The scraper assembly is rotationally connected to one end of the lifting frame. The rotation shaft of the driving device penetrates through the shaft of the scraper assembly and the lifting frame in sequence. The rotation shaft of the driving device is fixedly connected with the scraper assembly.

3. The apparatus according to claim 2, wherein One side of the scraper assembly is provided with a dial, one side of the lifting frame is provided with a pointer, the pointer points to the dial.

4. The apparatus according to claim 1, wherein A plurality of glue feeding pipes are arranged on the glue extruder in sequence, and the plurality of glue feeding pipes are located between the first glue brushing assembly and the second glue brushing assembly and face the coating plate.

5. The apparatus according to claim 1, wherein A plurality of supporting rollers are symmetrically arranged on the fixing frame, and each of the plurality of supporting rollers abuts against the inner side of the protective film.

6. The apparatus according to claim 1, wherein The winding assembly comprises a second speed reducer and a winding drum. The second speed reducer is fixedly connected to one side of the bottom of the fixing frame. The rotating shaft of the second speed reducer penetrates through the fixing frame. The winding drum is fixedly connected to the rotating shaft of the second speed reducer. One end of the protective film is fixedly wound on the winding drum.

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