Soldering apparatus

Abstract

The present invention relates to a soldering apparatus comprising: a vibration sensor; a heating unit for heating a soldering tip; a temperature sensor for detecting the temperature of the soldering tip; and a control unit for controlling the heating unit based on a vibration detection signal input from the vibration sensor and a temperature detection signal input from the temperature sensor. The soldering apparatus is characterized by comprising: an evaluation unit for evaluating the normality of the vibration sensor; and a notification unit for notifying the evaluation result of the evaluation unit.

Description

Technical Field

[0001] This invention relates to a soldering apparatus. Background Technology

[0002] Patent Document 1 discloses a soldering iron with a vibration sensor. This soldering iron is a tweezer-type soft soldering device that uses a vibration sensor to detect vibrations caused by the operator holding the housing. When vibration is detected by the vibration sensor in standby mode, the temperature of the tweezers (soldering tip) is raised to a preset target temperature.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-142723 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] In addition, the soldering device equipped with a vibration sensor can significantly reduce the temperature of the soldering tip in standby (dormant) mode below the target temperature, thereby suppressing oxidation of the soldering tip and extending its lifespan. Furthermore, it can reduce power consumption.

[0008] However, vibration sensors, which detect vibrations through mechanical contact, are electronic components that risk malfunctioning due to wear and tear on the solder pads at the contact surface. In soldering apparatus equipped with vibration sensors, if the vibration sensor malfunctions, the soldering tip temperature cannot be set to the desired target temperature, rendering the soldering apparatus unusable.

[0009] The present invention was made in view of the above circumstances, and its object is to provide a soldering device capable of notifying the normality of a vibration sensor.

[0010] Solution to the above technical problems

[0011] To achieve the above objectives, in this invention, as a first solution related to the soldering apparatus, the following approach is adopted: A soldering apparatus comprising: a vibration sensor; a heating unit for heating a soldering iron tip; a temperature sensor for detecting the temperature of the soldering iron tip; and a control unit for controlling the heating unit based on a vibration detection signal input from the vibration sensor and a temperature detection signal input from the temperature sensor. The soldering apparatus is characterized by comprising: an evaluation unit for evaluating the normality of the vibration sensor; and a notification unit for notifying the evaluation result of the evaluation unit.

[0012] In this invention, as a second solution related to the soldering apparatus, the following solution is adopted: In the first solution described above, the evaluation unit includes an operation unit that receives an operation instruction to confirm the operation of the vibration sensor, and evaluates the normality based on the vibration detection signal input from the vibration sensor during a first evaluation period after the operation unit receives the operation instruction.

[0013] In this invention, as a third solution related to the soldering apparatus, the following approach is adopted: In the first or second solution described above, the evaluation unit evaluates the normality based on the vibration detection signal input from the vibration sensor during the second evaluation period after startup.

[0014] In this invention, as a fourth solution related to the soldering apparatus, the following solution is adopted: In any of the solutions of the first to third above, if the evaluation unit determines that the vibration sensor is faulty, and the temperature detection signal indicates a sudden temperature change of the soldering tip, the control unit causes the heating unit to start heating the soldering tip.

[0015] In this invention, as the fifth solution related to the soldering apparatus, the following solution is adopted: In any of the solutions of the first to fourth above, when the heating unit does not heat the soldering tip, and the vibration detection signal indicates vibration exceeding a predetermined vibration intensity, the control unit causes the heating unit to start heating the soldering tip.

[0016] Invention Effects

[0017] According to the present invention, a soldering device capable of notifying the normality of a vibration sensor can be provided. Attached Figure Description

[0018] Figure 1A This is a perspective view showing the appearance of a soldering apparatus A according to an embodiment of the present invention.

[0019] Figure 1B This is a top view showing the appearance of a soldering apparatus A according to an embodiment of the present invention.

[0020] Figure 2 This is a block diagram illustrating the electrical configuration of a soldering apparatus A according to an embodiment of the present invention.

[0021] Figure 3 This is a flowchart illustrating the basic operation of a soldering apparatus A according to an embodiment of the present invention.

[0022] Figure 4This is a waveform diagram showing the changes in the temperature detection signal and vibration detection signal of the soldering apparatus A according to an embodiment of the present invention.

[0023] Figure 5 This is a timing diagram illustrating the operation of a soldering apparatus A according to an embodiment of the present invention. Detailed Implementation

[0024] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0025] The soldering device A involved in this embodiment is referred to as a "soldering iron," such as... Figure 1A As shown, it includes a main body 1, a heating element 2, and a power cable 3.

[0026] The main body 1 is also a grip for the user, and is a rod-shaped part with a specified thickness. The electronic circuitry described later is built into this main body 1. Furthermore, a heating element 2 is provided at one end (front end), and a power cable 3 is provided at the other end (rear end). Further, in this main body 1, an operating part 1a is provided on the peripheral surface near the rear end.

[0027] The operation unit 1a is a part that receives various setting operations performed by the user and displays (prompts) the setting status to the user, such as... Figure 1B As shown, it includes a setting key 1b, a down key 1c, an up key 1d, a heating lamp 1e, and a display window 1f. That is, the user operates the operation unit 1a to set the functions of the soldering device A, and confirms the above function settings based on the information displayed on the operation unit 1a.

[0028] Setting key 1b is used to switch between function settings (setting items). Pressing setting key 1b for multiple settings cycles through them. The settings include temperature settings and various parameters; any setting can be selected based on the number of times setting key 1b is pressed. Further details will be described later. Setting key 1b also receives an operation instruction to confirm the operation of vibration sensor 1h as one of the setting items.

[0029] The down arrow key 1c is an operation key that reduces the value (setting value) of the setting item selected by the setting key 1b. Each setting item is preset with a predetermined amount of change in the setting value that will be reduced by pressing the down arrow key 1c once. The user can reduce the setting amount according to the number of times the down arrow key 1c is pressed.

[0030] The Up key 1d is an operation key that increases the value (setting value) of the setting item selected by the setting key 1b. Each setting item is preset with a change in setting value that will be increased by pressing the Up key 1d once, and the user can increase the setting amount in accordance with the number of times the Up key 1d is pressed.

[0031] Here, the setting values ​​for each setting item using the setting key 1b, down key 1c, and up key 1d include, for example, the temperature control target value in normal mode (normal temperature setting value Ta), the temperature control target value in sleep mode (sleep temperature setting value Tb), and the sleep start time H. Details will be described later. The soldering apparatus A according to this embodiment controls its operation based on these setting values ​​for each setting item.

[0032] The heating lamp 1e is an LED (light-emitting diode) that indicates the heating state of the heating unit 2. As described later, a heater, which serves as a heating element, is built into the heating unit 2, and the heating lamp 1e is a light-emitting element that indicates the heating state of the heating unit 2 by showing the operating state of the heater. For example, the state in which the heating lamp 1e is lit indicates that the heating unit 2 is being heated by the heater, and the state in which the heating lamp 1e is off indicates that the heating unit 2 is not being heated by the heater.

[0033] Display window 1f is an LCD liquid crystal display that displays the aforementioned setting values. Furthermore, display window 1f displays the setting values ​​by intermittently flashing at a predetermined period, or by alternating between two setting values ​​at a predetermined period, thereby visually indicating the confirmed state of the setting values.

[0034] As described above, the heating element 2 has a built-in heater and is a metal rod-shaped body that heats up by the heater. This heating element 2 is a so-called soldering tip, which is concentrically mounted on the front end side of the main body 1. Due to continuous use, the front end 2a of this heating element 2, which contacts the solder or the electrode of the electronic component, wears and deteriorates. Therefore, it can be easily installed and removed from the main body 1. That is, the rear end side of the heating element 2 is easily detached and mounted to the front end side of the main body 1.

[0035] like Figure 1A As shown, the aforementioned front end portion 2a is a portion that protrudes more finely from the front end of the heating part 2. This front end portion 2a contacts the solder of the electrode close to the electronic component, causing the solid solder to rise to a temperature above its melting point and melt it, thereby electrically connecting and mechanically bonding the electrode of the electronic component to the pattern wiring on the printed wiring board.

[0036] The power cable 3 is a wire of a predetermined length extending from the front end of the main body 1, and a socket is provided at the front end. That is, the front end of the power cable 3 is connected to a commercial power supply, thereby supplying operating power to the electronic circuitry built into the main body 1, and supplying driving power for driving (heating) the heater.

[0037] Next, refer to Figure 2 The electrical configuration of the soldering apparatus A according to this embodiment will be described. Furthermore, in this… Figure 2 In the main body 1, electronic components or electronic circuits surrounded by dashed lines are disposed on the main body 1, and electronic components surrounded by dotted lines are disposed on the heating part 2.

[0038] That is, in the soldering apparatus A according to this embodiment, as electrical components, in addition to the setting key 1b, down key 1c, up key 1d, heating lamp 1e and display window 1f mentioned above, it also includes an interrupt switch 1g, vibration sensor 1h, amplifier circuit 1i, microcomputer 1j and power supply circuit 1k, heater 2b, temperature sensor 2c and three-terminal bidirectional thyristor switch 4.

[0039] For simplicity, we will first describe the heater 2b and temperature sensor 2c of the heating element 2. The heater 2b is a heating element located inside the heating element 2 that heats the front end 2a (soldering tip) based on the drive current input from the triac switch 4. More specifically, the heater 2b is a ceramic heater that uses a ceramic-coated conductive heating element such as tungsten to heat the front end 2a from the inside. Such a heater 2b can heat the front end 2a with good responsiveness.

[0040] Temperature sensor 2c is disposed inside the heating element 2, close to the heater 2b, and detects the temperature of the tip 2a (soldering tip). Temperature sensor 2c outputs a temperature detection signal, indicating the temperature of the tip 2a, to amplifier circuit 1i. This temperature detection signal is a voltage signal indicating the temperature of the tip 2a but with a relatively small amplitude.

[0041] Interrupt switch 1g is an operation switch that generates a reset signal to forcibly reset microcomputer 1j. This interrupt switch 1g is located at a predetermined position on the main body 1, and when pressed by the user, it outputs a reset signal to microcomputer 1j. Furthermore, if a reset signal is input from interrupt switch 1g, microcomputer 1j initializes its control processing based on the control program, similar to when power is turned on.

[0042] The vibration sensor 1h is a sensor that detects vibrations applied to the main body 1. Known vibration sensors include contact and non-contact types. This vibration sensor 1h is a mechanical (contact) sensor that detects the intensity of vibration based on the number of on-off cycles within a certain time period. Such a vibration sensor 1h outputs an electrical signal indicating the intensity of the vibration as a vibration detection signal to the microcomputer 1j.

[0043] Here, the vibration sensor 1h has become unable to make normal contact with the contact terminal due to years of deterioration. That is, the vibration sensor 1h is unable to properly act on the pressing part due to years of deterioration, and as a result, there is a risk that it will become unable to properly detect the state of vibration (acceleration) acting on the sensor as an external force.

[0044] Amplifier circuit 1i is an amplifier that amplifies the temperature detection signal input from temperature sensor 2c. As mentioned above, the temperature detection signal is a voltage signal with a relatively small amplitude, which cannot be properly processed by the microcomputer 1j if directly input to it. Amplifier circuit 1i is electrically located between temperature sensor 2c and microcomputer 1j, amplifies the temperature detection signal at a specified amplification rate, and outputs it to microcomputer 1j.

[0045] The microcomputer 1j is a control unit that controls the heater 2b (heating unit) based on vibration detection signals input from vibration sensor 1h and temperature detection signals input from temperature sensor 2c. This microcomputer 1j is a so-called single-chip microcomputer, equipped with a CPU (Central Processing Unit), FLASH ROM (Read Only Memory), RAM (Random Access Memory), and various input / output circuits.

[0046] The microcomputer 1j has multiple input ports, which are respectively input to the operation signals of the setting key 1b, the down key 1c and the up key 1d, the reset signal of the interrupt switch 1g, the vibration detection signal of the vibration sensor 1h and the temperature detection signal of the amplifier circuit 1i.

[0047] The microcomputer 1j generates control signals, lighting signals, and display signals based on a control program pre-stored in flash memory (FLASH ROM) and the aforementioned operation signals, reset signals, vibration detection signals, and temperature detection signals. The microcomputer 1j has multiple output ports, outputting control signals to the three-terminal bidirectional thyristor switch 4, lighting signals to the heating lamp 1e, and display signals to the display window 1f.

[0048] Furthermore, the microcomputer 1j evaluates the normality of the vibration sensor 1h based on the vibration detection signal input from the vibration sensor 1h. The microcomputer 1j generates an evaluation signal (vibration sensor evaluation signal) showing the evaluation result of the vibration sensor 1h and outputs this vibration sensor evaluation signal to the display window 1f. Additionally, the display window 1f notifies the user of the normality of the vibration sensor 1h based on the vibration sensor evaluation signal.

[0049] Here, the microcomputer 1j corresponds to the evaluation unit of the present invention for evaluating the normality of the vibration sensor 1h. Furthermore, the microcomputer 1j and the display window 1f correspond to the notification unit of the present invention for notifying the evaluation unit of the evaluation results.

[0050] The power supply circuit 1k is an electrical circuit that supplies a DC power supply of a specified voltage to each of the aforementioned components. This power supply circuit 1k converts the commercial power supply (AC100V) input from the power cable 3 into a DC power supply of a specified voltage and supplies it to the various components, including the microcomputer 1j. Each component uses this DC power supply as its operating power to perform its specified function.

[0051] Here, the settings for each item set by the user using the setting key 1b, down key 1c, and up key 1d are stored in the flash memory (FLASH ROM) within the microcomputer 1j. That is, once the user sets the settings for each item, such as the normal temperature setting Ta, the sleep temperature setting Tb, and the sleep start time H, the settings will be retained even if the power supply from the power circuit 1k to the microcomputer 1j is cut off.

[0052] The three-terminal bidirectional thyristor switch 4 is a current control element that generates drive current based on the control signal input from the microcomputer 1j and the commercial power supply. That is, the three-terminal bidirectional thyristor switch 4 generates drive current by using the control signal to turn the commercial power supply on / off (ON / OFF), and outputs the drive current to the heater 2b, thereby causing the heater 2b to heat up.

[0053] Next, according to Figure 3 The flowchart shown illustrates in detail the operation of the soldering apparatus A according to this embodiment. Furthermore, the operation of the soldering apparatus A described below is achieved by a microcomputer 1j executing predetermined control processing based on a control program, etc.

[0054] First, if power is supplied from the power supply circuit 1k (step S1), the microcomputer 1j begins the following control processing. Next, the microcomputer 1j begins to output drive current to the heater 2b and continues to output drive current to the heater 2b until the temperature of the front end 2a (soldering tip temperature) detected by the temperature sensor 2c is equal to the normal temperature setting value Ta stored in the flash memory (FLASH ROM).

[0055] That is, the microcomputer 1j performs heating treatment on the front end 2a (soldering tip) using the heater 2b based on the temperature detection signal indicating the temperature of the soldering tip and the normal temperature setpoint Ta (step S2). The feedback control of the soldering tip temperature based on the temperature detection signal and the normal temperature setpoint Ta is the normal mode in the operation mode of the microcomputer 1j.

[0056] The microcomputer 1j performs feedback control on the heater 2b based on the temperature detection signal and the normal temperature setpoint Ta, such as... Figure 4 and Figure 5 As shown, this causes the soldering iron tip temperature to rise to the normal temperature setting value Ta.

[0057] The user performs soldering operations using a soldering device A in normal mode, with the soldering tip temperature set to the normal temperature setting value Ta. During this soldering operation, the front end 2a of the heating element 2 contacts the solder and the electrodes of the electronic components; therefore, as... Figure 4 As shown, the actual soldering tip temperature varies from the normal temperature setting value Ta towards the low temperature side.

[0058] Here, during the period when the user is performing soldering operations using the soldering device A, vibration will naturally act on the main body 1. That is, during the period when the user is performing soldering operations using the soldering device A, such as Figure 4 As shown, the vibration sensor 1h continuously outputs a vibration detection signal to the microcomputer 1j. During the period when the vibration sensor 1h inputs the vibration detection signal, the microcomputer 1j continuously performs feedback control of the soldering iron tip temperature in normal mode.

[0059] However, if the sleep start time H has elapsed since the vibration detection signal was no longer input, the microcomputer 1j determines whether the vibration sensor 1h has malfunctioned (step S3). If the microcomputer 1j determines in step S3 that the vibration sensor 1h is normal, i.e., "no", then the operating mode is switched from the normal mode to the sleep mode (step S4). That is, the microcomputer 1j performs feedback control on the soldering tip temperature based on the temperature detection signal and the sleep temperature setpoint Tb.

[0060] The feedback control of the soldering tip temperature based on the sleep temperature setpoint Tb is the sleep mode in the operating modes of the microcomputer 1j. That is, in this sleep mode, the soldering tip temperature is as follows: Figure 4 The temperature is reduced from the normal temperature setting Ta to the sleep temperature setting Tb.

[0061] When the power is cut off in this sleep mode (step S5), the microcomputer 1j enters standby mode until the front end 2a (soldering tip) needs to be reheated (step S6). Then, if the power is turned on again, the judgment in step S6 becomes "yes", the microcomputer 1j confirms the operation of the vibration sensor 1h (step S7), and then repeats the process of step S2. That is, the heating process of the front end 2a (soldering tip) in normal mode is restarted.

[0062] On the other hand, if it is determined in step S3 that the vibration sensor 1h is abnormal (i.e., "yes"), then the microcomputer 1j begins sensor fault handling (step S8). Then, the microcomputer 1j determines whether an operating mode selection instruction has been input by using the user operation unit 1a (step S9).

[0063] Here, when the user selects sleep mode, the microcomputer 1j performs the processing described in step S4 above. That is, the microcomputer 1j performs feedback control on the soldering tip temperature based on the temperature detection signal and the sleep temperature setting value Tb, thereby setting the soldering tip temperature to the sleep temperature setting value Tb.

[0064] Furthermore, if the user selects forced operation mode instead of hibernation mode, the microcomputer 1j switches the operating mode to forced operation mode (step S10). That is, in forced operation mode, the microcomputer 1j invalidates settings related to hibernation mode and settings related to shutdown mode until the power is cut off. If step S10 is completed, the microcomputer 1j repeats the process of step S2 described above.

[0065] The above describes the overall operation of the soldering device A. When vibration sensor 1h malfunctions, the vibration detection signal is no longer input to microcomputer 1j. As a result, microcomputer 1j becomes unable to properly switch between normal and sleep modes. To avoid this, microcomputer 1j monitors the normal operation of vibration sensor 1h based on the vibration detection signal.

[0066] For example, such as Figure 5 As shown, if a power operation signal is input from the operation unit 1a to set the power supply of the soldering device A to ON, the microcomputer 1j, after receiving the power operation signal, evaluates the normality of the vibration sensor 1h based on the vibration detection signal input from the vibration sensor 1h during the first evaluation period Ha.

[0067] Then, if the microcomputer 1j detects a malfunction in the vibration sensor 1h, a warning indicating that the vibration sensor 1h is not functioning properly is displayed on the display window 1f. This warning indicates that the problem can be stopped by setting the sleep mode to OFF in the settings menu. Additionally, as... Figure 5 As shown, whenever a power operation signal is input from the operation unit 1a, the microcomputer 1j evaluates the normality of the vibration sensor 1h described above.

[0068] That is, if no vibration detection signal is input during the first evaluation period Ha, the microcomputer 1j determines that the vibration sensor 1h has malfunctioned; if a vibration detection signal is input during the first evaluation period Ha, it determines that the vibration sensor 1h is normal. Next, the microcomputer 1j generates a vibration sensor evaluation signal showing this evaluation result and outputs it to the display window 1f. As a result, the display window 1f displays (notifies) the user of the normality (fault / normal) of the vibration sensor 1h based on the vibration sensor evaluation signal.

[0069] Furthermore, the microcomputer 1j evaluates the normality of the vibration sensor 1h based on the vibration detection signal input from the vibration sensor 1h during the second evaluation period Hb after the soft soldering device A is started. That is, when the device is started by supplying power from the power supply circuit 1k, the microcomputer 1j monitors whether a vibration detection signal is input from the start-up time to the second evaluation period Hb.

[0070] Then, if no vibration detection signal is input during the second evaluation period Hb, the microcomputer 1j determines that the vibration sensor 1h has malfunctioned; if a vibration detection signal is input during the second evaluation period Hb, it determines that the vibration sensor 1h is normal. The microcomputer 1j then generates a vibration sensor evaluation signal showing this evaluation result and outputs it to the display window 1f. As a result, the display window 1f displays (notifies) the user of the normality (fault / normal) of the vibration sensor 1h based on the vibration sensor evaluation signal.

[0071] Here, the microcomputer 1j evaluates the normality of the vibration sensor 1h not only based on the presence or absence of vibration detection signals during the first evaluation period Ha or the second evaluation period Hb, but also based on the number of on / off cycles of the vibration detection signals within a specified period. That is, if the number of on / off cycles of the vibration detection signals during the first evaluation period Ha or the second evaluation period Hb is less than a preset threshold, the microcomputer 1j determines that the vibration sensor 1h has malfunctioned; if the number of on / off cycles is above the threshold, the microcomputer 1j determines that the vibration sensor 1h is normal.

[0072] Additionally, after the aforementioned evaluation period Ha, such as Figure 5 As shown, a hibernation monitoring period of a specified time span is then set, followed by a power-off monitoring period of a specified time span. During the hibernation monitoring period, the microcomputer 1j monitors whether the operating mode is switched to hibernation mode, and during the power-off monitoring period, it monitors whether the power is turned off.

[0073] Furthermore, if the microcomputer 1j determines that the vibration sensor 1h is faulty, and the temperature detection signal input from the temperature sensor 2c indicates a sudden temperature change in the tip 2a (soldering tip), then the heater 2b (heating section) will begin heating the tip 2a (soldering tip). That is, if the vibration sensor 1h malfunctions, the microcomputer 1j cannot switch from sleep mode to normal mode based on the vibration detection signal. Therefore, it determines the user's use of the soldering device A based on the temperature detection signal, thereby raising the soldering tip temperature from the sleep temperature setpoint Tb to the normal temperature setpoint Ta.

[0074] According to such a soft soldering device A, even if the vibration sensor 1h fails, normal soft soldering operations based on the usual temperature setpoint Ta can be performed by giving the user attention and switching the operating mode.

[0075] Furthermore, when the heater 2b (heating section) is not heating the front end 2a (soldering tip), if the vibration detection signal input from the vibration sensor 1h indicates vibration exceeding a predetermined vibration intensity, the microcomputer 1j outputs a drive current to the heater 2b to begin heating the front end 2a. That is, this relates to the control of the soldering tip temperature when the vibration sensor 1h is functioning normally; when the main body 1 is subjected to strong vibrations due to the user, normal soldering operations based on the normal temperature setting Ta can be performed by raising the soldering tip temperature to the normal temperature setting Ta.

[0076] As explained above, according to this embodiment, the microcomputer 1j evaluates the normality of the vibration sensor 1h and displays it on the display window 1f. Therefore, the user of the soldering device A can easily determine whether the vibration sensor 1h is normal or malfunctioning by visually confirming the evaluation result displayed on the display window 1f. Thus, according to this embodiment, a soldering device A capable of notifying the user of the normality of the vibration sensor 1h can be provided. Furthermore, if the microcomputer 1j detects a sensor malfunction, it displays the sensor malfunction status for a certain period of time and then switches the operating mode.

[0077] Furthermore, according to this embodiment, the soldering apparatus A includes an operation unit 1a that receives an operation instruction from a user to confirm the operation of the vibration sensor 1h. After receiving the operation instruction from the user, the operation unit 1a evaluates the normality of the vibration sensor 1h based on the vibration detection signal input from the vibration sensor 1h during the first evaluation period Ha. According to this embodiment, the user can confirm the operation of the vibration sensor 1h through their own judgment. Therefore, a soldering apparatus A that is convenient for the user to use is provided.

[0078] Furthermore, according to this embodiment, the microcomputer 1j evaluates the normality of the vibration sensor 1h based on the vibration detection signal input from the vibration sensor 1h during the second evaluation period Hb after startup. That is, without the aforementioned operation instructions from the user, the normality evaluation of the vibration sensor 1h can be performed automatically whenever the microcomputer 1j starts. According to this embodiment, since the normality evaluation of the vibration sensor 1h can be performed automatically without user attention, a soldering apparatus A with good user convenience can be provided.

[0079] Furthermore, according to this embodiment, if the microcomputer 1j determines that the vibration sensor 1h is faulty, and the temperature detection signal input from the temperature sensor 2c indicates a sudden temperature change in the front end 2a (soldering tip), then the heater 2b (heating section) begins to heat the soldering tip. Therefore, even if the vibration sensor 1h malfunctions, it can switch from sleep mode to normal mode. Thus, according to this embodiment, even if the vibration sensor 1h malfunctions, normal soldering operations can still be performed, thereby providing a soldering apparatus A that is convenient for the user to use.

[0080] Furthermore, according to this embodiment, when the heater 2b (heating section) is not heating the front end 2a (soldering tip), and the vibration detection signal input from the vibration sensor 1h indicates vibration exceeding a predetermined vibration intensity, the microcomputer 1j causes the heater 2b to begin heating the front end 2a, thus enabling the temperature of the front end 2a to rapidly rise to the normal temperature setpoint Ta. Therefore, according to this embodiment, a soldering apparatus A that is convenient for the user to use can also be provided.

[0081] In addition, in this embodiment, the vibration sensor 1h is a mechanical (contact) sensor, but other types of sensors, such as acceleration detection sensors, can also be used instead of this sensor to monitor the input voltage with a threshold judgment value.

[0082] Explanation of reference numerals in the attached figures

[0083] A soft soldering device

[0084] 1. Main body

[0085] 1a Operations Section

[0086] 1b Setting button

[0087] 1c Down arrow key

[0088] 1d Up arrow key

[0089] 1e heating lamp

[0090] 1f Display Window (Notification Section)

[0091] 1g Interrupt Switch

[0092] 1h vibration sensor

[0093] 1i amplifier circuit

[0094] 1j Microcomputer (Control Department, Evaluation Department, Notification Department)

[0095] 1k power supply circuit

[0096] 2 Heating section

[0097] 2a Front end

[0098] 2b Heater (Heating Section)

[0099] 2C temperature sensor

[0100] 3 Power cable

[0101] 4. Three-terminal bidirectional thyristor switch.

Claims

1. A soldering apparatus comprising: a vibration sensor; a heating unit for heating a soldering tip; a temperature sensor for detecting the temperature of the soldering tip; and a control unit that, when vibration is detected based on a vibration detection signal input from the vibration sensor, controls the heating unit based on a temperature detection signal input from the temperature sensor, thereby raising the temperature of the soldering tip to a preset target temperature. The feature of this soldering device is that it has the following characteristics: The evaluation department evaluates the normality of the vibration sensor; The notification department will inform the evaluation department of the evaluation results.

2. The soldering apparatus as described in claim 1, characterized in that, The evaluation unit includes an operation unit that receives an operation instruction to confirm the operation of the vibration sensor, and evaluates the normality based on the vibration detection signal input from the vibration sensor during a first evaluation period after the operation unit receives the operation instruction.

3. The soldering apparatus according to claim 1 or 2, wherein The evaluation unit evaluates the normality based on the vibration detection signal input from the vibration sensor during the second evaluation period after startup.

4. The soldering apparatus according to claim 1 or 2, wherein If the evaluation unit determines that the vibration sensor is faulty, and the temperature detection signal indicates a sudden temperature change in the soldering tip, the control unit causes the heating unit to start heating the soldering tip.

5. The soldering apparatus according to claim 1 or 2, wherein When the heating unit is not heating the soldering iron tip, and the vibration detection signal indicates a vibration exceeding a predetermined intensity, the control unit causes the heating unit to start heating the soldering iron tip.

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