Device for preparing pudding mold, method for preparing pudding mold, device for testing adhesion of pudding mold, and method for testing adhesion of pudding mold

Abstract

The pudding mold preparation device and preparation method provided by the application, the upper clamp comprises fastening blocks and a plurality of through holes with internal threads which are uniformly distributed; the lower clamp comprises a floating block, a stepped bolt and an elastic member, the bottom of the floating block is processed with a positioning groove for fixing the adhesive surface material; the mold core is installed on the fastening block, the stepped bolt connects the upper clamp and the lower clamp and is fastened; the demolding ejection clamp comprises an ejection plate and a positioning support, the fastener formed by the upper clamp and the lower clamp is arranged on the positioning support, the bottom of the ejection plate is provided with ejection needles corresponding to the through holes, and the ejection needles can eject the formed pudding mold from the mold core. The pudding mold preparation device provided by the application adopts an elastic fixing method between the mold core and the adhesive surface material, solves the problems of adhesive leakage, adhesive surface material damage and short service life of the mold core caused by the unstable bonding force in rigid fixing, and the like. In addition, the application also provides a bonding force testing device and testing method for the pudding mold.

Description

Technical Field

[0001] This application relates to the field of polymer material processing and preparation technology, and in particular to a pudding mold preparation device, preparation method, pudding mold adhesion testing device and testing method. Background Technology

[0002] Adhesives are widely used materials in industries such as electronic packaging, building materials, aerospace, automotive manufacturing, and medical and health care. Their main function is to firmly bond two interfaces together. Adhesives are generally composed of resin, curing agent, and various trace additives (coupling agents, toughening agents, diluents, etc.). Some adhesives also contain inorganic fillers; for example, underfill adhesives for chips typically contain more than 50 wt.% silica microspheres.

[0003] Adhesive performance, specifically the adhesive strength at the bonding interface, is one of the most important performance indicators of adhesives. Currently, the adhesive strength of adhesives at a substrate interface is mainly determined using the push-shear method. Existing research reports a method for testing adhesive strength based on a sandwich structure. The sandwich structure sample used in this method consists of three layers: the bottom layer is a substrate, typically made of materials such as silicon or copper; the middle layer is an adhesive layer with a thickness of 10-50 μm; and the top layer is a load-bearing block that is the same or different from the substrate. During the test, a shear force is applied to the load-bearing block by a pusher tool until the adhesive layer separates from the substrate or load-bearing block, and the shear force value at the time of separation is recorded, thus obtaining the adhesive strength value. The main drawback of this method is that it cannot avoid the error in adhesive strength caused by crack fluctuations at the interfaces of the sandwich structure during sample failure.

[0004] Existing research has also reported a method for testing the adhesive strength of a frustum-shaped pudding mold sample. In this method, the sample consists of a substrate made of materials such as silicon copper, with a pudding-shaped frustum of adhesive adhered to the substrate. The dimensions of this frustum are typically 3-10 mm for the upper circle, 4-12 mm for the lower circle, and 5-7 mm for the height. During the test, a pushing force is applied to the adhesive frustum by a pusher blade until the frustum separates from the substrate; the shear force value at separation is the adhesive strength value. Compared to the sandwich method, this method only has one main interface, thus better reflecting the adhesive strength at the interface. However, compared to the sandwich structure, the preparation process of the pudding mold structure is more complex, less efficient, and the uniformity of the sample cannot be guaranteed.

[0005] In conclusion, in order to fully leverage the advantages of pudding mold experiments, it is urgent to develop a more efficient method for preparing pudding mold blocks. Summary of the Invention

[0006] Therefore, it is necessary to provide a preparation device and method for preparing pudding molds with high efficiency and good uniformity, as well as a testing device and method for testing the adhesion of pudding molds, to address the deficiencies in the existing technology.

[0007] To solve the above problems, this application adopts the following technical solution:

[0008] One objective of this application is to provide a pudding mold preparation apparatus, comprising: an upper clamp, a lower clamp, a mold core, and a demolding ejection clamp, wherein:

[0009] The upper clamp includes a fastening block, and the fastening block has a plurality of through holes with internal threads evenly distributed on it;

[0010] The lower clamp includes a floating block, a stepped bolt, and an elastic element. The top of the floating block is also machined with a positioning groove, which is used to fix the adhesive surface material.

[0011] The mold core is mounted on the fastening block, and the stepped bolt connects and fastens the upper clamp and the lower clamp to ensure that the mold core is in close contact with the adhesive surface material;

[0012] The demolding ejection fixture includes an ejection plate and a positioning bracket. The fastener formed by the upper fixture and the lower fixture is set on the positioning bracket. The bottom of the ejection plate is provided with an ejection pin corresponding to the through hole. The ejection pin can eject the formed pudding mold from the mold core.

[0013] In some embodiments, the fastening block is provided with connecting threads at its four corners, and the stepped bolt is connected to the upper clamp through the connecting threads.

[0014] In some embodiments, the lower clamp further includes a fixed base plate, and the floating block is fixed to the base plate by the stepped bolts.

[0015] In some embodiments, the elastic element is mounted below the floating block to allow the floating block to have room for adaptive adjustment of its planar lifting and horizontality.

[0016] In some embodiments, the mold core is made of Teflon, and the center of the mold core has a frustum of appropriate size. The mold core is installed in the fastening block by external thread in a rotatable manner.

[0017] In some embodiments, the fastening block, the floating block, and the ejector plate are all made of metal, including stainless steel, aluminum, or iron.

[0018] The second objective of this application is to provide a method for preparing the pudding mold, comprising the following steps:

[0019] The upper clamp, the lower clamp, and the mold core are ultrasonically cleaned and then dried for later use.

[0020] Place the adhesive material into the positioning groove;

[0021] Install the mold core onto the fastening block;

[0022] After aligning the upper clamp and the lower clamp, use the stepped bolts to connect the upper clamp and the lower clamp and tighten them to make the mold core and the bonding surface material in close contact;

[0023] The adhesive is injected into the mold core, and after the adhesive has cured, the pudding mold is ejected from the mold core using the ejector plate.

[0024] The third objective of this application is to provide an adhesive force testing device for the aforementioned pudding mold, comprising a thrust tester, an adjustable base, and a sample bonding plate, wherein:

[0025] The thrust tester includes a base and a pusher blade disposed on the base. The adjustable base includes a connector connected to the base and a clamping device for fixing the sample adhesive plate, wherein the pudding mold is bonded to the sample adhesive plate.

[0026] In some embodiments, the base is adjustable in the XOY plane, and the pusher can be raised and lowered.

[0027] The fourth objective of this application is to provide a testing method for the adhesive force testing device of the pudding mold, comprising the following steps:

[0028] Prepare a sample of appropriate size for testing;

[0029] The pudding mold to be tested is bonded to the sample adhesive plate;

[0030] The sample adhesive plate with the pudding mold attached is fixed to the base, so that the pudding mold is aligned with the pusher.

[0031] Adjust the relative position of the pusher and the pudding mold so that the force application position of the pusher is 10~200μm higher than the lower base of the pudding mold;

[0032] The thrust tester is activated, and the pusher gradually approaches the pudding mold until the pudding mold colloid is peeled off from the lower base, at which point the pusher automatically stops.

[0033] Record the thrust value when the pudding mold is peeled off.

[0034] In some embodiments, the pushing force of the pusher gradually increases as the pusher approaches the pudding mold.

[0035] The present application adopts the above technical solution, and its beneficial effects are as follows:

[0036] The pudding mold preparation apparatus and method provided in this application include an upper clamping device comprising a fastening block with a plurality of internally threaded through holes evenly distributed on its upper surface; a lower clamping device comprising a floating block, a stepped bolt, and an elastic element, wherein a positioning groove is machined on the top of the floating block, and an adhesive surface material can be placed on the surface of the positioning groove; a mold core is mounted on the fastening block, and the stepped bolt connects and fastens the upper clamping device and the lower clamping device to ensure close contact between the mold core and the adhesive surface material; a demolding ejection clamp comprising an ejection plate and a positioning bracket, wherein the upper clamping device and the lower clamping device form a... Fasteners are mounted on the positioning bracket, and ejector pins corresponding to the through holes are provided at the bottom of the ejector plate. The ejector pins can eject the formed pudding mold from the mold core. The pudding mold preparation device provided in this application adopts an elastic fixing method between the mold core and the adhesive surface material, which solves the problems of adhesive leakage, adhesive surface material damage and short mold core life caused by inconsistent bonding force in rigid fixing. The centralized installation of multiple sets of molds improves the sample preparation efficiency. Furthermore, a demolding ejection fixture is designed to improve the demolding efficiency and reduce the risk of sample damage.

[0037] The adhesive force testing device and method for pudding molds provided in this application involve bonding the pudding mold to be tested to a sample adhesive plate; fixing the sample adhesive plate with the pudding mold attached to it to a base, aligning the pudding mold with a pusher; adjusting the relative position of the pusher and the pudding mold so that the force application position of the pusher is 10-200 μm higher than the lower substrate of the pudding mold; starting the pusher, and the pusher gradually approaches the pudding mold until the pudding mold adhesive peels off from the lower substrate, at which point the pusher automatically stops; recording the pusher force value at the time of peeling. The adhesive force testing device and method provided in this application apply a shear force to the pudding mold at a specific height using a pusher, thereby causing the adhesive layer to separate from the bonding surface material. The shear force value at the time of separation is recorded as the adhesive force value. Using this method for adhesive force testing can effectively avoid the shortcomings of the aforementioned sandwich test method, and the sample preparation method described above avoids the disadvantage of low sample preparation efficiency in traditional pudding mold testing. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1(a) is a schematic diagram of the upper clamp provided in Embodiment 1 of this application.

[0040] Figure 1(b) is a schematic diagram of the structure of the lower clamp provided in Embodiment 1 of this application.

[0041] Figure 1(c) is a schematic diagram of the structure of the bottom surface of the ejector plate provided in Embodiment 1 of this application.

[0042] Figure 2 The flowchart illustrates the steps of the pudding mold preparation method provided in Embodiment 2 of this application.

[0043] Figure 3 This is a schematic diagram of the adhesive force testing device for the pudding mold provided in Embodiment 3 of this application.

[0044] Figure 4 The flowchart shows the steps of the test method for the adhesive force testing device for the pudding mold provided in Embodiment 4 of this application.

[0045] Figure 5 This is a comparison chart of the adhesive strength test results provided in Examples 1-3 of this application.

[0046] Figure 6 A comparison of the number of screws required to mass-produce pudding pattern blocks using this application (left) and rigid mounting molds (right) in an embodiment of this application. Detailed Implementation

[0047] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0048] In the description of this application, it should be understood that the terms "upper", "lower", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0050] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments.

[0051] Example 1

[0052] Please refer to Figures 1(a) to 1(c), which are schematic diagrams of a pudding mold preparation device according to an embodiment of this application, including: an upper clamp 110, a lower clamp 120, a mold core 130, and a demolding ejection clamp 140. The connection relationship of each component and its implementation method are described in detail below.

[0053] The upper clamp 110 includes a fastening block 111, on which a plurality of through holes 112 with internal threads are evenly distributed.

[0054] In this embodiment, the upper clamp 110 includes a stainless steel fastening block 111 with a thickness of 3-6mm, M4 connecting threads at its four corners, and 4x5 through holes 112 with internal threads evenly distributed on the plate.

[0055] The lower clamp 120 includes a floating block 121, a stepped bolt 122, and an elastic element 123. The top of the floating block 121 is also machined with a positioning groove 124, and an adhesive surface material 125 can be placed on the surface of the positioning groove 124.

[0056] In this embodiment, the lower clamp 120 includes a 3-6mm thick stainless steel fixed base plate, a 3-6mm thick stainless steel floating block 121, stepped bolts 122, and an elastic element 123. The floating block 121 is fixed to the base plate by the stepped bolts 122, and a 10x10mm positioning groove is machined on it corresponding to the center position of the bottom of the mold core. The elastic element 123 is installed below it, so that the floating block has room for planar lifting and adaptive adjustment of level.

[0057] The mold core 130 is mounted on the fastening block 111, and the stepped bolt 122 connects and fastens the upper clamp 110 and the lower clamp 120 so that the mold core 130 is in close contact with the adhesive surface material 125.

[0058] In this embodiment, the mold core 130 is made of Teflon. The central frustum mold dimensions are 3mm for the upper circle, 5mm for the lower circle, and 6mm for the height. It is installed in the fastening block by rotating it through the external thread, and a 1.5Kg torque wrench is used to ensure the consistency of the mold core installation depth and the fastening force.

[0059] The demolding ejection fixture 140 includes an ejection plate 141 and a positioning bracket 142. Fasteners formed by the upper clamp 110 and the lower clamp 120 are mounted on the positioning bracket 142. The bottom of the ejection plate 141 is provided with ejection pins 143 corresponding to the through hole 112. The ejection pins 143 eject the formed pudding mold from the mold core 130. In this embodiment, the demolding ejection fixture 140 comprises a 3-6mm thick stainless steel ejection plate, a hand press, and a positioning bracket. The ejection plate has ejection pins with a length of 3-6mm and a diameter of 2-9mm at corresponding positions on the sample. The positioning bracket is made of stainless steel and has the same dimensions as the upper clamp; its function is to align the upper clamp with the ejection plate after curing. The hand press is a commercially available product.

[0060] In this embodiment, the fastening block 111, the floating block 121 and the ejector plate 141 are all made of metal, including stainless steel, aluminum or iron.

[0061] The pudding mold preparation apparatus provided in the above embodiments of this application uses an elastic fixing method between the mold core and the adhesive surface material, which solves the problems of adhesive leakage, adhesive surface material damage and short mold core life caused by inconsistent bonding force in rigid fixing; the sample preparation efficiency is improved by the centralized installation of multiple sets of molds; and a demolding ejection fixture is designed to improve the demolding process efficiency and reduce the risk of sample damage.

[0062] Example 2

[0063] Please see Figure 2 The method for preparing the pudding mold provided in this application includes the following steps:

[0064] Step S110: The upper clamp, the lower clamp, and the mold core are ultrasonically cleaned and then dried for later use.

[0065] Specifically, the upper clamp, lower clamp, and Teflon core mold are ultrasonically cleaned 2-3 times with an ethanol solution and then dried for later use.

[0066] Step S120: Place the adhesive surface material into the positioning groove.

[0067] Specifically, the adhesive material is placed in the positioning groove of the floating block of the lower clamp; the Teflon mold core is installed into the upper clamp using a 1.5Kg torque wrench; the upper and lower clamps are aligned around the perimeter, and the upper and lower clamps are connected and tightened using stepped bolts to ensure close contact between the mold core and the adhesive material.

[0068] Step S130: Install the mold core onto the fastening block.

[0069] Step S140: After aligning the upper clamp and the lower clamp, use the stepped bolts to connect the upper clamp and the lower clamp and tighten them so that the mold core is in close contact with the adhesive surface material.

[0070] Step S150: Inject the adhesive into the mold core. After the adhesive has cured, use the ejector plate to eject the pudding mold from the mold core, thus completing the preparation of the pudding mold.

[0071] Specifically, the curing temperature is 150℃ and the curing time is 100 minutes.

[0072] The pudding mold preparation method provided in the above embodiments of this application uses an elastic fixing method between the mold core and the adhesive surface material, which solves the problems of adhesive leakage, adhesive surface material damage and short mold core life caused by inconsistent bonding force in rigid fixing; the centralized installation of multiple sets of molds improves the sample preparation efficiency; and a demolding ejection fixture is designed to improve the demolding process efficiency and reduce the risk of sample damage.

[0073] Example 3

[0074] Please see Figure 3 The present invention provides a pudding mold adhesion testing device according to Embodiment 3, which includes a thrust tester 310, an adjustable base 320 and a sample bonding plate 330. The connection relationship and implementation of each component are described in detail below.

[0075] The thrust tester 310 includes a base 311 and a pusher 312 disposed on the base 311.

[0076] In some embodiments, the base is adjustable in the XOY plane, and the pusher 312 can be raised and lowered.

[0077] The adjustable base 320 includes a connector 321 connected to the base 311 and a clamping device 322 for fixing the sample adhesive plate 330, the sample adhesive plate 330 being bonded with the pudding mold.

[0078] In this embodiment, the sample bonding plate 330 includes: a 5mm steel plate with a bottom edge size of 20mm x 80mm.

[0079] The adhesive force testing device for pudding molds provided in Embodiment 3 of this application applies a shearing force to the pudding mold at a specific height using a pusher, thereby causing the adhesive layer to separate from the bonding surface material. The shearing force value at the time of separation is recorded as the adhesive force value of the adhesive. Using this method to perform adhesive force testing can effectively avoid the shortcomings of the above-mentioned sandwich test method, and the sample preparation method described above avoids the disadvantage of low sample preparation efficiency in traditional pudding mold testing.

[0080] Example 4

[0081] Please see Figure 4 This application also provides a testing method for the adhesive force testing device of the pudding mold, comprising the following steps:

[0082] Step S210: Prepare a sample of appropriate size for testing.

[0083] Step S220: Adhere the pudding mold to be tested to the sample adhesive plate.

[0084] Step S230: Fix the sample adhesive plate with the pudding mold attached to it onto the base, so that the pudding mold is aligned with the pusher.

[0085] Step S240: Adjust the relative position of the pusher and the pudding mold so that the force application position of the pusher is 10~200μm higher than the lower base of the pudding mold.

[0086] Step S250: Start the thrust tester. The pusher gradually approaches the pudding mold until the pudding mold colloid is peeled off from the lower base, at which point the pusher automatically stops.

[0087] Step S260: Record the thrust value when the pudding mold is peeled off.

[0088] In some embodiments, the pushing force of the pusher gradually increases as the pusher approaches the pudding mold.

[0089] The adhesive force testing method for pudding molds provided in this application involves applying shear force to the pudding mold at a specific height using a pusher, thereby causing the adhesive layer to separate from the bonding surface material. The shear force value at the time of separation is recorded as the adhesive force value. Using this method for adhesive force testing can effectively avoid the shortcomings of the aforementioned sandwich test method, and the aforementioned sample preparation method avoids the disadvantage of low sample preparation efficiency in traditional pudding mold testing.

[0090] Comparative Example 1

[0091] This embodiment describes a method for testing the adhesion of adhesive A to a silicon wafer surface using a sandwich structure.

[0092] A method for testing the adhesive bonding strength of an adhesive using a sandwich structure includes a load-bearing silicon wafer B (0.5 mm thick, 2 mm × 2 mm on each side), a substrate silicon wafer B (0.5 mm thick, 5 mm × 5 mm on each side), and an adhesive A.

[0093] The above-mentioned method for preparing adhesive sandwiches includes the following steps:

[0094] S1. Clean the stress block silicon wafer B and the substrate silicon wafer B twice with ethanol solution using ultrasonic cleaning, and dry them at 100°C for 2 hours before use.

[0095] S2. Apply an appropriate amount of adhesive A onto the silicon substrate B.

[0096] S3. Cover the upper silicon wafer B with the adhesive A, so that the stress block silicon wafer B, the adhesive A and the lower substrate silicon wafer B form a sandwich structure.

[0097] S4. Place the sandwich structure described in S3 into an oven for adhesive curing at 150°C for 100 minutes. After curing, the sample to be tested, B, is obtained. An adhesive bonding force testing device includes a thrust tester, a multi-angle adjustable base, a sample bonding plate B, and the sample to be tested, B.

[0098] The thrust tester includes: a base with an adjustable position (XOY plane adjustable) and a pusher blade that can be raised and lowered. It is a commercially available product.

[0099] The multi-angle adjustable base includes: a connection structure for connecting to the base of the thrust tester, an angle rotation device, and a clamping device for the sample bonding plate. It is a commercially available product.

[0100] The sample bonding plate B comprises: a 5mm steel plate with a bottom edge length of 10mm × 10mm.

[0101] The sample B to be tested includes: a sandwich structure formed by the curing of the stress block silicon wafer B, adhesive A, and substrate silicon wafer B.

[0102] The method of using the above-mentioned adhesive adhesion strength testing device includes the following steps:

[0103] S1. Use 502 quick-drying adhesive to bond the sample A to the sample bonding plate B.

[0104] S2. Fix the sample adhesive plate B with the sample to be tested B attached to it onto the multi-angle adjustable base, and adjust the appropriate angle so that one side of the pudding mold sample to be tested is parallel to the push knife.

[0105] S3. Adjust the relative position of the pusher and the sample to be tested so that the force application position of the pusher is 50μm higher than the bottom substrate of the sample to be tested.

[0106] S4. Start the thrust tester. The pusher never touches the sample and the thrust gradually increases until the pudding mold colloid is peeled off from the lower substrate, at which point the pusher stops automatically.

[0107] S5. Record the thrust value during sample peeling; the test is now complete.

[0108] When using a sandwich structure to test adhesive strength, the fracture interface between the adhesive and the substrate shows pits and residual adhesive, indicating that the fracture path fluctuates across the substrate, the adhesive itself, and the interface, resulting in poor data stability (e.g., Figure 5 ).

[0109] Comparative Example 2

[0110] This embodiment describes a method for testing the adhesion of adhesive A to a silicon wafer surface using a frustum pudding mold structure prepared with a small rigid contact mold.

[0111] An adhesive frustum pudding mold preparation device includes an upper clamp, a lower clamp, a Teflon core mold C, a substrate C, and connecting accessories such as screws and nuts.

[0112] The upper clamp includes: a 5mm stainless steel plate with M3 connecting threads at the four corners and a 10mm diameter circular through hole in the center.

[0113] The lower clamp comprises: a 5mm stainless steel plate with M3 connecting threads at the four corners.

[0114] The Teflon core mold includes: a 5mm Teflon sheet with a side length of 20mm×20mm, and a central frustum mold with dimensions of an upper diameter of 3mm, a lower diameter of 5mm, and a height of 6mm.

[0115] The substrate includes: a 0.4mm silicon substrate with a side length of 15mm × 15mm.

[0116] The above-mentioned method for preparing the adhesive frustum pudding mold includes the following steps:

[0117] S1. The upper clamp, lower clamp, Teflon core mold C and substrate C are ultrasonically cleaned twice with ethanol solution, and then dried at 100°C for 2 hours before use.

[0118] S2. Place the substrate C in the center of the lower clamp, completely cover the Teflon core mold C on the substrate, cover the Teflon core mold C with the upper clamp and align it with the perimeter of the lower clamp, connect the upper clamp and the lower clamp with the screw and nut and tighten them, so that the substrate C and the Teflon core mold C are firmly clamped between the upper and lower clamps.

[0119] S3. Take an appropriate amount of adhesive A and inject it into the mold of the Teflon core mold. Be careful not to let the adhesive overflow.

[0120] S4. Place the entire part described in S3 into an oven for adhesive curing at 150°C for 100 minutes.

[0121] S5. After curing, remove the screw and nut, and take out the frustum pudding mold C from the Teflon core mold C. Its bottom is bonded to the substrate to complete the pudding mold preparation, which is the sample C to be tested for adhesion force.

[0122] An adhesive bonding force testing device includes a thrust tester, a multi-angle adjustable base, a sample bonding plate C, and a sample C to be tested.

[0123] The thrust tester includes: a base with an adjustable position (XOY plane adjustable) and a pusher blade that can be raised and lowered. It is a commercially available product.

[0124] The multi-angle adjustable base includes: a connection structure for connecting to the base of the thrust tester, an angle rotation device, and a clamping device for the sample bonding plate. It is a commercially available product.

[0125] The sample bonding plate C comprises: a 5mm aluminum plate with a bottom edge length of 22mm × 22mm.

[0126] The sample C to be tested includes: a frustum pudding mold colloid and a lower substrate as a whole.

[0127] The method of using the above-mentioned adhesive adhesion strength testing device includes the following steps:

[0128] S1. Use 502 quick-drying adhesive to bond the sample A to the sample bonding plate C.

[0129] S2. Fix the sample adhesive plate C with the sample to be tested C attached to it onto the multi-angle adjustable base, so that the frustum on the sample to be tested is aligned with the pusher.

[0130] S3. Adjust the relative position of the pusher and the sample to be tested so that the force application position of the pusher is 50μm higher than the bottom substrate of the sample to be tested.

[0131] S4. Start the thrust tester. The pusher never touches the sample and the thrust gradually increases until the pudding mold colloid is peeled off from the lower substrate, at which point the pusher stops automatically.

[0132] S5. Record the thrust value during sample peeling; the test is now complete.

[0133] Using small, rigid contact molds to prepare frustum-shaped pudding sample blocks cannot guarantee the uniformity of sample block quality, resulting in poor data stability (e.g., Figure 5 Furthermore, it requires disassembling and assembling a large number of screws, resulting in extremely low efficiency (e.g., Figure 6 ).

[0134] It is understood that the technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0135] The above are merely preferred embodiments of this application, and only specifically describe the technical principles of this application. These descriptions are only for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application, as well as other specific embodiments of this application that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of this application.

Claims

1. A pudding mold preparation apparatus, characterized in that, include: Upper clamp, lower clamp, mold core, and ejection clamp, wherein: The upper clamp includes a fastening block, on which a plurality of through holes with internal threads are evenly distributed; The lower clamp includes a floating block, a stepped bolt, and an elastic element. The top of the floating block is also machined with a positioning groove, which is used to fix the adhesive surface material. The mold core is mounted on the fastening block, and the stepped bolt connects and fastens the upper clamp and the lower clamp to ensure that the mold core is in close contact with the adhesive surface material; The demolding ejection fixture includes an ejection plate and a positioning bracket. The fastener formed by the upper fixture and the lower fixture is set on the positioning bracket. The bottom of the ejection plate is provided with an ejection pin corresponding to the through hole. The ejection pin can eject the formed pudding mold from the mold core.

2. The pudding mold preparation apparatus as described in claim 1, characterized in that, The fastening block has connecting threads at its four corners, and the stepped bolts are connected to the upper clamp through the connecting threads.

3. The pudding mold preparation apparatus as described in claim 2, characterized in that, The lower clamp also includes a fixed base plate, and the floating block is fixed to the base plate by the stepped bolts.

4. The pudding mold preparation apparatus as described in claim 1, characterized in that, The elastic element is installed below the floating block to allow the floating block to have room for adaptive adjustment of its plane lifting and leveling.

5. The pudding mold preparation apparatus as described in claim 1, characterized in that, The mold core is made of Teflon, and the center of the mold core has a frustum of appropriate size. The mold core is installed in the fastening block by external thread in a rotating manner.

6. The pudding mold preparation apparatus as described in claim 1, characterized in that, The fastening block, the floating block, and the ejector plate are all made of metal, including stainless steel, aluminum, or iron.

7. A method for preparing a pudding mold as described in claim 1, characterized in that, Includes the following steps: The upper clamp, the lower clamp, and the mold core are ultrasonically cleaned and then dried for later use. Place the adhesive material into the positioning groove; Install the mold core onto the fastening block; After aligning the upper clamp and the lower clamp, use the stepped bolts to connect the upper clamp and the lower clamp and tighten them to make the mold core and the bonding surface material in close contact; The adhesive is injected into the mold core, and after the adhesive has cured, the pudding mold is ejected from the mold core using the ejector plate.

8. A device for testing the adhesive force of a pudding mold as described in claim 1, characterized in that, Includes a thrust tester, an adjustable base, and a sample bonding plate, wherein: The thrust tester includes a base and a pusher blade disposed on the base. The adjustable base includes a connector connected to the base and a clamping device for fixing the sample adhesive plate, wherein the pudding mold is bonded to the sample adhesive plate.

9. The adhesive force testing device for pudding molds as described in claim 8, characterized in that, The base is adjustable in the XOY plane, and the pusher can be raised and lowered.

10. A test method for the adhesive force testing device of the pudding mold as described in claim 8, characterized in that, Includes the following steps: The pudding mold to be tested is bonded to the sample adhesive plate; The sample adhesive plate with the pudding mold attached is fixed to the base, so that the pudding mold is aligned with the pusher. Adjust the relative position of the pusher and the pudding mold so that the force application position of the pusher is 10~200μm higher than the lower base of the pudding mold; The thrust tester is activated, and the pusher gradually approaches the pudding mold until the pudding mold colloid is peeled off from the lower base, at which point the pusher automatically stops. Record the thrust value when the pudding mold is peeled off.

11. The test method of the adhesive force testing device for pudding molds as described in claim 10, characterized in that, As the pusher gradually approaches the pudding mold, the pushing force of the pusher gradually increases.

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