An optical module suitable for a CS optical port

Abstract

The application provides an optical module suitable for a CS optical port, comprising a base, a PCB, an upper cover, a first optical emitting assembly and a second optical emitting assembly, wherein the base is located at the lower end of the PCB, the upper cover is located at the upper end of the PCB, the periphery of the base is connected with the periphery of the upper cover, and the PCB, the first optical emitting assembly and the second optical emitting assembly are encapsulated between the base and the upper cover; the first optical emitting assembly and the second optical emitting assembly are staggered along the length direction of the PCB; the first optical emitting assembly and the second optical emitting assembly are staggered along the width direction of the PCB; the optical device units of the two optical emitting assemblies are staggered, the density of heat source devices in the optical assembly is reduced, heat concentration is avoided, and the upper cover is further provided with copper blocks and heat pipes with good heat conduction efficiency and corresponding to the PCB, so that the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical modules, in particular to an optical module suitable for CS optical port. BACKGROUND

[0002] With the rapid development of optical communication and Internet in recent years, the market demand for network is increasing, which leads to the rapid growth of traffic of the backbone network of telecommunications; in order to adapt to the market demand for high-speed data transmission, the transmission speed of optical modules is also rapidly increasing, and now 100G, 200G, 400G and even 800G optical modules appear, the increase of electromagnetic density and heat flow density in a certain space caused by the increase of the speed of optical modules will cause problems such as layout problem and heat dissipation problem.

[0003] Usually, the external environment and the case are already available, and if the external environment is to be changed, the cost is usually too high, so it is necessary to consider from the optical module itself, and since the size of the optical module is defined by the protocol size, the internal layout space is certain, and it is difficult to change the optical and hardware aspects after the overall scheme and device selection are determined, and the CS optical port has four channels, and there are many optical fibers and internal devices, and there are also many heat dissipation elements, so how to consider the reasonable layout and heat dissipation problem in the limited space of the optical module from the structural design is a common problem in the industry, and the current technical solution generally uses high thermal conductivity materials (thermal conductive pads, thermal conductive paste, thermal conductive glue, etc.) on the heat dissipation devices to solve the heat dissipation problem, which is relatively limited, and some high thermal conductivity materials have problems such as high cost, difficult assembly and use, and poor reliability, and the internal heat source devices of the optical module are usually arranged densely, which leads to heat concentration and further reduces the heat dissipation efficiency.

[0004] Therefore, it is urgent to overcome the defects of the prior art in the technical field. SUMMARY

[0005] The technical problem to be solved by the present application is how to reduce the density of internal heat source devices of the optical module of the CS optical port, prevent heat concentration, and improve the heat dissipation efficiency.

[0006] The present application adopts the following technical scheme:

[0007] In a first aspect, an optical module suitable for a CS optical port is provided, comprising a base 1, a PCB board 2, an upper cover 3, a first light emitting assembly 4 and a second light emitting assembly 5, wherein:

[0008] The base 1 is located at the lower end of the PCB board 2, the upper cover 3 is located at the upper end of the PCB board 2, the periphery of the base 1 is connected with the periphery of the upper cover 3, and the PCB board 2, the first light emitting assembly 4 and the second light emitting assembly 5 are encapsulated between the base 1 and the upper cover 3;

[0009] The first light emitting assembly 4 and the second light emitting assembly 5 are staggered along the length direction of the PCB board 2, and are staggered along the width direction of the PCB board 2.

[0010] Preferably, the light receiving assembly 6 is encapsulated between the base 1 and the upper cover 3.

[0011] The first light emitting assembly 4, the second light emitting assembly 5 and the light receiving assembly 6 are staggered along the length direction of the PCB board 2, and the first light emitting assembly 4 is located between the second light emitting assembly 5 and the light receiving assembly 6.

[0012] In the width direction of the PCB board 2, the projection of the second light emitting assembly 5 on the side edge of the PCB board 2 at least partially overlaps the projection of the light receiving assembly 6 on the side edge of the PCB board 2.

[0013] Preferably, the first light emitting assembly 4 comprises a first light emitting head 41 and a first light device unit 42, and the first light emitting head 41 and the first light device unit 42 are connected; the second light emitting assembly 5 comprises a second light adapter 51 and a second light device unit 52, and the second light adapter 51 and the second light device unit 52 are connected; the light receiving assembly 6 comprises a first light receiving head 61, a second light receiving head 62 and a fiber array block 63, and the first light receiving head 61 and the second light receiving head 62 are respectively connected with the fiber array block 63.

[0014] The first light emitting head 41, the first light receiving head 61, the second light adapter 51 and the second light receiving head 62 are sequentially and side by side arranged outside the first end of the PCB board 2; the fiber array block 63 is arranged close to the second end of the PCB board 2; the second light device unit 52 is arranged close to the first end of the PCB board 2; and the first light device unit 42 is arranged in the middle of the PCB board 2.

[0015] Preferably, the first light emitting assembly 4 further comprises a first fiber 43, a ferrule 44, a buckle 45, a first light adapter 46 and a first soft belt 47, wherein:

[0016] The first light emitting head 41, the first optical fiber 43 and the ferrule 44 are connected in sequence, the first optical adapter 46, the first optical device unit 42 and the first flexible band 47 are connected in sequence, the ferrule 44 and the first optical adapter 46 are connected through the buckle 45, the first optical device unit 42 is connected with the first solder pad 21 on the upper surface of the PCB board 2 through the first flexible band 47, and the first light emitting head 41, the first optical fiber 43, the ferrule 44, the buckle 45, the first optical adapter 46 and the first optical device unit 42 are located outside the PCB board 2.

[0017] Preferably, the second light emitting assembly 5 further comprises a second flexible band 53, wherein:

[0018] The second optical adapter 51, the second optical device unit 52 and the second flexible band 53 are connected in sequence, the second optical device unit 52 is connected with the second solder pad 22 on the upper surface of the PCB board 2 through the second flexible band 53, the second optical adapter 51 and the second optical device unit 52 are located outside the first end of the PCB board 2, and the second optical adapter 51 is arranged side by side with the first light emitting head 41.

[0019] Preferably, the light receiving assembly 6 further comprises a second optical fiber 64 and a third optical fiber 65, wherein:

[0020] One end of the second optical fiber 64 is connected with the first light receiving head 61, and the other end is connected with the optical fiber array block 63;

[0021] One end of the third optical fiber 65 is connected with the second light receiving head 62, and the other end is connected with the optical fiber array block 63;

[0022] The optical fiber array block 63 is connected with the detector chip 25 on the PCB board 2, and the first light receiving head 61 and the second light receiving head 62 are arranged side by side with the second optical adapter 51 and the first light emitting head 41.

[0023] Preferably, the lower surface of the upper cover 3 is provided with a copper block 31 and a heat pipe 32, and the width of the copper block 31 is greater than the width of the heat pipe 32;

[0024] The copper block 31 is arranged at the tail end of the upper cover 3, and in the width direction of the upper cover 3, the two side surfaces of the copper block 31 are respectively close to the corresponding side wall;

[0025] The heat pipe 32 extends along the length direction of the upper cover 3, and one end of the heat pipe 32 is arranged close to the copper block 31, and the other end is arranged close to the optical port end of the upper cover 3;

[0026] The copper block 31 and the heat pipe 32 correspond to the chips on the PCB board 2, and the chips are filled with a heat-conducting material between the copper block 31 and the heat pipe 32, which is used to transfer the heat of the chips on the PCB board 2 to the outside.

[0027] Preferably, the lower surface of the upper cover 3 is further provided with a first heat dissipation boss 34, a first heat dissipation groove 35 and a second heat dissipation groove 36.

[0028] The first heat dissipation boss 34 is arranged at the inner side of the joint of the copper block 31 and the heat pipe 32, and the first heat dissipation boss 34 corresponds to the position of the first driving chip 23 on the PCB board 2.

[0029] The first heat dissipation groove 35 is arranged at the middle of the lower surface of the upper cover 3 and is located at the side of the heat pipe 32, and the first heat dissipation groove 35 corresponds to the position of the first light device unit 42 of the first light emitting assembly 4.

[0030] The second heat dissipation groove 36 is arranged at the light port end of the upper cover 3 and is located at the outer side of the end surface of the heat pipe 32, and the second heat dissipation groove 36 corresponds to the position of the second light device unit 52 of the second light emitting assembly 5.

[0031] Preferably, the upper surface of the base 1 is further provided with a third heat dissipation groove 12 and a fourth heat dissipation groove 13.

[0032] The third heat dissipation groove 12 is arranged at the middle position of the upper surface of the base 1 and is close to the side wall of one side of the base 1, and the third heat dissipation groove 12 corresponds to the position of the first light device unit 42.

[0033] The fourth heat dissipation groove 13 is arranged at the light port end of the base 1 and is close to the side wall of the other side of the base 1, and the fourth heat dissipation groove 13 corresponds to the position of the second light device unit 52.

[0034] Preferably, the upper surface of the upper cover 3 is further provided with a fin-shaped boss 38, which is arranged close to the light port end of the optical module.

[0035] The lower surface of the base 1 is provided with a dot matrix boss 16, which is arranged close to the light port end of the optical module.

[0036] The embodiment of the application provides an optical module suitable for a CS optical port, which fixes a PCB board through an upper cover and a base, two light emitting assemblies are connected with the PCB board, and the light device units of the two light emitting assemblies are arranged in a staggered manner, so that the density of heat source devices in the light assembly is reduced, heat concentration is avoided, and the heat dissipation efficiency is improved.

[0037] Further, the upper cover is further provided with a copper block and a heat pipe, which are attached to the PCB, so as to improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can also be obtained according to these drawings without any creative labor for those skilled in the art.

[0039] Figure 1 is an exploded view of an optical module suitable for a CS optical port provided by the embodiments of the present application;

[0040] Figure 2 is a structural schematic view of the optical module suitable for the CS optical port provided by the embodiments of the present application;

[0041] Figure 3 is a structural schematic view of an upper cover of the optical module suitable for the CS optical port provided by the embodiments of the present application;

[0042] Figure 4 is a structural schematic view of a base of the optical module suitable for the CS optical port provided by the embodiments of the present application;

[0043] Figure 5 is a structural schematic view of a PCB of the optical module suitable for the CS optical port provided by the embodiments of the present application;

[0044] Figure 6 is an exploded view of another optical module suitable for the CS optical port provided by the embodiments of the present application;

[0045] Figure 7 is a structural schematic view of a first optical transmitting assembly of the optical module suitable for the CS optical port provided by the embodiments of the present application;

[0046] Figure 8 is an exploded view of still another optical module suitable for the CS optical port provided by the embodiments of the present application;

[0047] Figure 9 is a structural schematic view of a second optical transmitting assembly of the optical module suitable for the CS optical port provided by the embodiments of the present application;

[0048] Figure 10 is an exploded view of still another optical module suitable for the CS optical port provided by the embodiments of the present application;

[0049] Figure 11 is a structural schematic view of an optical receiving assembly of the optical module suitable for the CS optical port provided by the embodiments of the present application;

[0050] Figure 12 is an exploded view of still another optical module suitable for CS optical port provided by an embodiment of the present application;

[0051] Figure 13 is an exploded view of still another optical module suitable for CS optical port provided by an embodiment of the present application;

[0052] Figure 14 is a structural schematic view of a dustproof cover of an optical module suitable for CS optical port provided by an embodiment of the present application;

[0053] Figure 15 is a structural schematic view of an upper cover of another optical module suitable for CS optical port provided by an embodiment of the present application;

[0054] Figure 16 is a structural schematic view of a base of another optical module suitable for CS optical port provided by an embodiment of the present application;

[0055] Figure 17 is a structural schematic view of a PCB of another optical module suitable for CS optical port provided by an embodiment of the present application;

[0056] Figure 18 is a structural schematic view of an upper cover of another optical module suitable for CS optical port provided by an embodiment of the present application, in which the upper cover is separated from its cover plate 39;

[0057] Figure 19 is a structural schematic view of a base of still another optical module suitable for CS optical port provided by an embodiment of the present application;

[0058] In the drawings, the reference signs are as follows:

[0059] Base 1; second limiting table 11; third heat dissipation protrusion 12; fourth heat dissipation protrusion 13; third limiting table 14; support boss 15; dot matrix boss 16; PCB 2; first solder pad 21; second solder pad 22; first driving chip 23; control chip 24; detector chip 25; second driving chip 26; dustproof cover 27; avoiding opening 271; upper cover 3; copper block 31; heat pipe 32; first limiting table 33; first heat dissipation protrusion 34; first heat dissipation recess 35; second heat dissipation recess 36; abutting boss 37; fin boss 38; cover plate 39; first light emitting assembly 4; first light emitting head 41; first light device unit 42; first optical fiber 43; ferrule 44; buckle 45; first optical adapter 46; first soft band 47; second light emitting assembly 5; second optical adapter 51; second light device unit 52; second soft band 53; light receiving assembly 6; first light receiving head 61; second light receiving head 62; optical fiber array block 63; second optical fiber 64; third optical fiber 65. DETAILED DESCRIPTION

[0060] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0061] In the description of the present application, the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and do not require the present application to be constructed and operated in a particular orientation, and therefore should not be understood as a limitation on the present application.

[0062] In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as there is no conflict.

[0063] Embodiment 1:

[0064] Embodiment 1 of the present application provides an optical module suitable for CS optical port, as shown in the figure, comprising a base 1, a PCB board 2, an upper cover 3, a first optical transmitting assembly 4 and a second optical transmitting assembly 5, wherein: Figure 1

[0065] As shown in the figures, the base 1 is located at the lower end of the PCB board 2, the upper cover 3 is located at the upper end of the PCB board 2, the periphery of the base 1 is connected with the periphery of the upper cover 3, and the PCB board 2, the first optical transmitting assembly 4 and the second optical transmitting assembly 5 are encapsulated between the base 1 and the upper cover 3. Figure 1 Figure 2 As shown in the figures, the base 1 is located at the lower end of the PCB board 2, the upper cover 3 is located at the upper end of the PCB board 2, the periphery of the base 1 is connected with the periphery of the upper cover 3, and the PCB board 2, the first optical transmitting assembly 4 and the second optical transmitting assembly 5 are encapsulated between the base 1 and the upper cover 3.

[0066] Along the length direction of the PCB board 2, the first optical transmitting assembly 4 and the second optical transmitting assembly 5 are arranged staggered; along the width direction of the PCB board 2, the first optical transmitting assembly 4 and the second optical transmitting assembly 5 are arranged staggered.

[0067] In this embodiment, the PCB board is fixed by the upper cover and the base, the two optical transmitting assemblies are connected with the PCB board, and the optical device units of the two optical transmitting assemblies are arranged staggered, which reduces the density of heat source devices inside the optical assembly, avoids heat concentration, and improves the heat dissipation efficiency.

[0068] In this embodiment, as shown in the figure, the optical module suitable for CS optical port further comprises an optical receiving assembly 6, and the optical receiving assembly 6 is encapsulated between the base 1 and the upper cover 3. Figure 1

[0069] ​​​Along the length direction of the PCB board 2, the first light emitting assembly 4, the second light emitting assembly 5 and the light receiving assembly 6 are arranged staggeredly, and the first light emitting assembly 4 is located between the second light emitting assembly 5 and the light receiving assembly 6.

[0070] In the width direction of the PCB board 2, the projection of the second light emitting assembly 5 on the side edge of the PCB board 2 and the projection of the light receiving assembly 6 on the side edge of the PCB board 2 at least partially overlap. One of the benefits of such an arrangement is that the second light emitting assembly 5 and the light receiving assembly 6 are already spaced apart in the length direction of the PCB board, and the heat is not so focused; it can not be spaced apart in the width direction. Such an arrangement can reduce the width of the PCB board.

[0071] The optical assembly of the embodiment is applied to a CS optical port, which includes four optical channels, i.e., two optical transmitting channels and two optical receiving channels.

[0072] In the embodiment, the upper cover 3 is made of a high-thermal-conductivity metal material, and the base 1 is also made of a high-thermal-conductivity metal material. The base 1 is used to carry the PCB board 2 and the various optical transceiver devices inside.

[0073] As shown in Figure 3 and Figure 4 , at least two threaded holes (not shown in the figure) are arranged on the lower surface of the periphery of the two sides of the upper cover 3 and the upper surface of the periphery of the two sides of the base 1. The threaded holes of the upper cover 3 and the base 1 are in corresponding positions. The upper cover 3 and the base 1 are fixed by cooperating the corresponding threaded holes of the upper cover 3 and the base 1 through screws.

[0074] As shown in Figure 3 and Figure 4 , a plurality of abutting bosses 37 are further arranged on the lower surface of the periphery of the upper cover 3, and a plurality of supporting bosses 15 are further arranged on the upper surface of the periphery of the base 1. The supporting bosses 15 are used to support the lower surface of the PCB board 2, and the abutting bosses 37 are used to abut the upper surface of the PCB board 2, so as to encapsulate and fix the PCB board 2 between the upper cover 3 and the base 1, and avoid movement of the PCB board 2.

[0075] As shown in Figure 5 , a first pad 21 is arranged on the PCB board 2, and the first pad 21 is used to be connected with the first light emitting assembly 4. A second pad 22 is further arranged on the PCB board 2, and the second pad 22 is used to be connected with the second light emitting assembly 5. The specific connection mode is described below, and will not be described here.

[0076] Further, the chip on the PCB board 2 in the embodiment includes one or more of a first driving chip 23, a control chip 24, a detector chip 25 and a second driving chip 26.

[0077] As shown in Figure 6 , the first light emitting assembly 4 comprises a first light emitting head 41 and a first light device unit 42, and the first light emitting head 41 and the first light device unit 42 are connected; the second light emitting assembly 5 comprises a second light adapter 51 and a second light device unit 52, and the second light adapter 51 and the second light device unit 52 are connected; the light receiving assembly 6 comprises a first light receiving head 61, a second light receiving head 62 and a fiber array block 63, and the first light receiving head 61 and the second light receiving head 62 are respectively connected with the fiber array block 63; wherein, the first light device unit 42 and the second light device unit 52 are provided with devices for emitting laser, which will generate heat in operation.

[0078] The first light emitting head 41, the first light receiving head 61, the second light adapter 51 and the second light receiving head 62 are at the first end of the PCB board 2, and in combination Figure 6 , the first end is the outside of one end of the back-to-light module insertion direction, and is sequentially and side-by-side arranged; the fiber array block 63 is close to the second end of the PCB board 2 in combination Figure 6 , the second end is the one end of the light assembly insertion direction; the second light device unit 52 is close to the first end of the PCB board 2; the first light device unit 42 is arranged in the middle part of the PCB board 2; so as to stagger the first light device unit 42, the second light device unit 52 and the light receiving assembly 6, and avoid heat concentration.

[0079] In this embodiment, the first light emitting assembly 4, the second light emitting assembly 5 and the light receiving assembly 6 are all arranged on the same side of the PCB board 2, since the first light device unit 42 and the second light device unit 52 are of the same size and have a large width, the width of the PCB board 2 cannot accommodate the side-by-side arrangement of the first light device unit 42 and the second light device unit 52, and if the first light device unit 42 and the second light device unit 52 are too close, the heat source will be too concentrated, and the heat dissipation efficiency will be reduced; in this embodiment, the lengths of the first light emitting assembly 4 and the second light emitting assembly 5 are different, only the first light receiving head 61 and the second light adapter 51 are side-by-side arranged, so as to stagger the first light device unit 42 and the second light device unit 52; and in order to make room for the first light emitting assembly 4, as shown in Figure 5 , the upper half of the first end of the PCB board 2 is provided with a gap such as Figure 5 the dashed line, for accommodating part of the first light emitting assembly 4, so as to avoid the first light emitting assembly 4 occupying extra space, and to compensate for the length difference between the first light emitting assembly 4 and the second light emitting assembly 5, so as to ensure that the light outlets of the first light emitting assembly 4 and the second light emitting assembly 5 are side-by-side arranged.

[0080] In order to stagger the first optical device unit 42 and the second optical device unit 52, but at the same time, the light emitting ports of the first light emitting assembly 4 and the second light emitting assembly 5 need to be arranged side by side, therefore, the length of the first light emitting assembly 4 and the second light emitting assembly 5 needs to be differentiated, therefore, the embodiment relates to the following design:

[0081] As shown in Figure 7 and Figure 8 , the first light emitting assembly 4 specifically comprises: a first light emitting head 41, a first optical fiber 43, a ferrule 44, a buckle 45, a first optical adapter 46, a first optical device unit 42 and a first soft band 47, wherein:

[0082] As shown in Figure 7 , the first light emitting head 41, the first optical fiber 43 and the ferrule 44 are connected in sequence, the first optical adapter 46, the first optical device unit 42 and the first soft band 47 are connected in sequence, the ferrule 44 and the first optical adapter 46 are connected by the buckle 45, as shown in Figure 8 , the first optical device unit 42 is connected to the first solder pad 21 on the upper surface of the PCB board 2 through the first soft band 47, the first light emitting head 41, the first optical fiber 43, the ferrule 44, the buckle 45, the first optical adapter 46 and the first optical device unit 42 are located outside the PCB board 2; the optical signal is emitted from the first optical adapter 46, and then emitted after passing through the ferrule 44, the first optical fiber 43 and the first light emitting head 41. Wherein, the buckle 45 can be a plastic buckle.

[0083] As shown in Figure 5 and Figure 8 , the first light emitting head 41, the first optical fiber 43 and the ferrule 44 are used to lengthen the overall length of the first light emitting assembly 4 without affecting the light emitting signal; as shown in Figure 8 , the first solder pad 21 is located near the inner end face of the gap opening of the PCB board 2, when the first optical device unit 42 is connected to the first solder pad 21 through the first soft band 47, only the first soft band 47 is welded on the surface of the first solder pad 21, and the first optical device unit 42 is still in the gap opening of the PCB board 2, not arranged on the surface of the PCB board 2, but carried by the lower base 1, thereby reducing the occupation of vertical space.

[0084] As shown in Figure 9 and Figure 10 , the second light emitting assembly 5 specifically comprises: a second optical adapter 51, a second optical device unit 52 and a second soft band 53, wherein:

[0085] As shown in Figure 10As shown, the second optical adapter 51, the second optical device unit 52 and the second flexible band 53 are sequentially connected, the second optical device unit 52 is connected to the second pad 22 on the upper surface of the PCB board 2 through the second flexible band 53, the second optical adapter 51 and the second optical device unit 52 are located outside the first end of the PCB board 2, and the second optical adapter 51 is arranged side by side with the first optical transmitting head 41; the optical signal is emitted from the second optical adapter 51.

[0086] In combination with Figure 5 and Figure 10 , the second pad 22 is located near the first end surface of the PCB board 2, when the second optical device unit 52 is connected to the second pad 22 through the second flexible band 53, only the second flexible band 53 is welded on the surface of the second pad 22, and the second optical device unit 52 is still located outside the first end of the PCB board 2, instead of arranging the second optical device unit 52 on the surface of the PCB board 2, thereby reducing the occupation of the vertical space.

[0087] Compared with the first optical transmitting assembly 4, the second optical transmitting assembly 5 does not add the first optical transmitting head 41, the first optical fiber 43 and the ferrule 44, and the second optical adapter 51, the second optical device unit 52 and the second flexible band 53 of the second optical transmitting assembly 5 are consistent with the first optical adapter 46, the first optical device unit 42 and the first flexible band 47 of the first optical transmitting assembly 4 in type and size, so the length difference between the first optical transmitting assembly 4 and the second optical transmitting assembly 5 is the total length of the first optical transmitting head 41, the first optical fiber 43 and the ferrule 44; the gap of the PCB board 2 is used to compensate for the length difference between the first optical transmitting assembly 4 and the second optical transmitting assembly 5, so the length of the gap of the PCB board 2 should be greater than or equal to the total length of the first optical transmitting head 41, the first optical fiber 43 and the ferrule 44, and the width of the gap of the PCB board 2 should be greater than or equal to the width of the first optical device unit 42.

[0088] Since the optical receiving head needs to be arranged side by side with the optical transmitting head, the present embodiment relates to the following design:

[0089] As shown in Figure 11 and Figure 12 , the optical receiving assembly 6 further comprises a second optical fiber 64 and a third optical fiber 65, wherein:

[0090] One end of the second optical fiber 64 is connected to the first optical receiving head 61, and the other end is connected to the optical fiber array block 63.

[0091] One end of the third optical fiber 65 is connected to the second optical receiving head 62, and the other end is connected to the optical fiber array block 63.

[0092] The optical fiber array block 63 is connected with the detector chip 25 in the middle of the PCB board 2, and the first optical receiving head 61 and the second optical receiving head 62 are arranged side by side with the second optical adapter 51 and the first optical transmitting head 41.

[0093] As shown in Figure 12 and 13 , therefore, in this embodiment, the first optical transmitting head 41, the first optical receiving head 61, the second optical adapter 51 and the second optical receiving head 62 are arranged side by side in this order, and the second optical fiber 64 and the third optical fiber 65 are respectively routed from the two sides of the second optical adapter 51 and connected with the optical fiber array block 63; the detector chip 25 is located in the lower half of the middle of the PCB board 2, the optical fiber array block 63 is coupled with the detector chip 25, and the optical fiber array block 63 is adhered to the PCB board 2 by the COB (Chip On Board) process; as shown in Figure 12 and Figure 14 , wherein Figure 14 is a structural diagram of the dustproof cover 27, and a dustproof cover 27 is further arranged above the optical fiber array block 63 and the detector chip 25, the bottom of the dustproof cover 27 is adhered to the upper surface of the PCB board 2, the dustproof cover 27 covers part of the optical fiber array block 63 and the detector chip 25, for protecting and dustproofing the optical fiber array block 63 and the detector chip 25, and the side of the dustproof cover 27 is further provided with a clearance 271, and the clearance 271 is used for avoiding the second optical fiber 64 and the third optical fiber 65.

[0094] Since the first optical transmitting head 41, the first optical receiving head 61, the second optical adapter 51 and the second optical receiving head 62 are arranged side by side in turn, they also need to be limited and fixed, therefore, this embodiment relates to the following design:

[0095] The first optical transmitting head 41, the second optical adapter 51, the first optical receiving head 61 and the second optical receiving head 62 are arranged side by side outside the first end of the PCB board 2, and specifically comprising:

[0096] As shown in Figure 15 and Figure 16 , the lower surface of the upper cover 3 is provided with a first limiting table 33, and the first limiting table 33 is arranged at the optical port end of the upper cover 3; the upper surface of the base 1 is provided with a second limiting table 11, and the second limiting table 11 is arranged at the optical port end of the base 1.

[0097] The optical port end in this embodiment is one end of the upper cover 3 and the base 1 which is away from the insertion direction of the optical module, and can also be understood as one end which is provided with optical transmitting heads and optical receiving heads.

[0098] The first limiting table 33 and the second limiting table 11 each include four limiting grooves arranged side by side, for sequentially placing the first light emitting head 41, the first light receiving head 61, the second light adapter 51 and the second light receiving head 62, so as to fix the first light emitting head 41, the first light receiving head 61, the second light adapter 51 and the second light receiving head 62 side by side.

[0099] The first limiting table 33 and the second limiting table 11 each correspond to the positions of the first light emitting head 41, the first light receiving head 61, the second light adapter 51 and the second light receiving head 62; the four limiting grooves each are semicircular grooves corresponding to the first light emitting head 41, the first light receiving head 61, the second light adapter 51 and the second light receiving head 62 of the same cylindrical shape.

[0100] As shown in Figure 15 and Figure 17 The lower surface of the upper cover 3 is provided with a copper block 31 and a heat pipe 32, the width of the copper block 31 is greater than the width of the heat pipe 32. The copper block 31 is arranged at the tail end of the upper cover 3, and in the width direction of the upper cover 3, the two side faces of the copper block 31 are respectively close to the corresponding side wall; the copper block 31 corresponds to the control chip 24 on the PCB board 2, and the copper block 31 is used for corresponding to the control chip 24, and a heat-conducting material is filled between the copper block 31 and the control chip 24, so as to exchange heat for the control chip 24, and transmit heat to the outside through the upper cover 3. Wherein, the tail end in this embodiment is the end of the upper cover 3 and the base 1 towards the insertion direction of the optical module.

[0101] As shown in Figure 15 and Figure 16 The side wall in this embodiment is a certain height step around the periphery of the upper cover 3, for packaging and limiting the internal devices.

[0102] The heat pipe 32 extends along the length direction of the upper cover 3, and one end of the heat pipe 32 is arranged close to the copper block 31, and the other end is arranged close to the light port end of the upper cover 3; the position of the heat pipe 32 on the lower surface of the upper cover 3 corresponds to the positions of the detector chip 25 and the second driving chip 26 on the PCB board 2, the heat pipe 32 is used for corresponding to the detector chip 25 and the second driving chip 26, and a heat-conducting material is filled between the heat pipe 32 and the detector chip 25 and the second driving chip 26, so as to exchange heat for the detector chip 25 and the second driving chip 26, and transmit heat to the outside through the upper cover 3.

[0103] As shown in Figure 15 and Figure 17As shown, the control chip 24 is located at the right side of the middle part of the PCB 2, and the control chip 24 is in the shape of a square, so the copper block 31 in this embodiment is also in the shape of a square, which corresponds to the shape of the control chip 24. The copper block 31 has good heat conduction performance, which can further improve the heat dissipation performance. The detector chip 25 is located at the lower half of the middle part of the PCB 2, and the second driving chip 26 is located at the lower half of the first end of the PCB 2. Therefore, the detector chip 25 and the second driving chip 26 are both located at the lower half of the PCB 2. Therefore, when the heat pipe 32 covers the lower half of the PCB 2, the second driving chip 26 and the detector chip 25 are both covered, so the heat pipe 32 is in the shape of a strip, which can cover most of the lower half of the PCB 2.

[0104] In the preferred embodiment, the heat-conducting material includes heat-conducting pads, heat-conducting paste, heat-conducting glue, and the like, so as to improve the heat conduction efficiency between the chip and the copper block 31 and the heat pipe 32.

[0105] Since the main heat generating components of the first light emitting assembly 4 and the second light emitting assembly 5 are the first light device unit 42 and the second light device unit 52, the first light device unit 42 and the second light device unit 52 also need to be cooled, and a plurality of driving chips are also arranged on the PCB 2 and need to be cooled. Therefore, the present embodiment also relates to the following design:

[0106] As shown in Figure 17 and Figure 15 , the lower surface of the upper cover 3 is also provided with a first heat dissipation boss 34, a first heat dissipation groove 35, and a second heat dissipation groove 36, wherein:

[0107] The first heat dissipation boss 34 is arranged on the inner side of the junction of the copper block 31 and the heat pipe 32. The first heat dissipation boss 34 corresponds to the position of the first driving chip 23 on the PCB 2. The first heat dissipation boss 34 is filled with heat-conducting material between the first driving chip 23 on the PCB 2, which exchanges heat with the first driving chip 23 and transfers heat to the outside through the upper cover 3.

[0108] As shown in Figure 17 , the first driving chip 23 is arranged on the inner side of the first pad 21 and located at the upper half of the middle part of the PCB 2.

[0109] As shown in Figure 15 and Figure 6As shown, the first heat dissipation groove 35 is arranged at the middle of the lower surface of the upper cover 3 and is located at the side of the heat pipe 32. The first heat dissipation groove 35 corresponds to the position of the first light device unit 42 of the first light emitting assembly 4. The first heat dissipation groove 35 and the first light device unit 42 are filled with heat conductive material, which exchanges heat with the first light device unit 42 and transmits the heat to the outside through the upper cover 3.

[0110] As shown in Figure 16 and Figure 16 , the second heat dissipation groove 36 is arranged at the light port end of the upper cover 3. In the width direction, the projection of the second heat dissipation groove 36 at the side of the PCB board 2 coincides with the projection of the heat pipe 32 at the side of the PCB board 2. The second heat dissipation groove 36 corresponds to the position of the second light device unit 52 of the second light emitting assembly 5. The second heat dissipation groove 36 and the second light device unit 52 are filled with heat conductive material, which exchanges heat with the second light device unit 52 and transmits the heat to the outside through the upper cover 3.

[0111] As shown in Figure 6 , the upper surface of the base 1 is further provided with a third heat dissipation groove 12, a fourth heat dissipation groove 13 and a third limiting table 14.

[0112] As shown in Figure 16 and Figure 6 , the third heat dissipation groove 12 is arranged at the middle position of the upper surface of the base 1 and is close to the side wall of one side of the base 1. The third heat dissipation groove 12 corresponds to the position of the first light device unit 42. The third heat dissipation groove 12 and the first light device unit 42 are filled with heat conductive material, which exchanges heat with the first light device unit 42 and transmits the heat to the outside through the base 1.

[0113] As shown in Figure 16 and Figure 7 , the fourth heat dissipation groove 13 is arranged at the light port end of the base 1 and is close to the side wall of the other side of the base 1. The fourth heat dissipation groove 13 corresponds to the position of the second light device unit 52. The fourth heat dissipation groove 13 and the second light device unit 52 are filled with heat conductive material, which exchanges heat with the second light device unit 52 and transmits the heat to the outside through the base 1.

[0114] As shown in Figure 16 and Figure 18 , the third limiting table 14 is arranged at one side of the third heat dissipation groove 12 and corresponds to the position of the first light adapter 46, which is used to limit and fix the first light adapter 46.

[0115] To further improve heat dissipation, thermally conductive materials are provided between the first heat dissipation protrusion 34, the first heat dissipation groove 35, and the second heat dissipation groove 36 and their respective chips.

[0116] like Figure 18 As shown, the lower surface of the base 1 is also provided with a number of square grooves to avoid taller components on the PCB board 2.

[0117] To further improve the heat exchange efficiency between the top cover 3 and the base 1 and the outside environment, this embodiment also involves the following design:

[0118] like Figure 19 As shown, Figure 19 The diagram shows the structure of the upper cover 3. The upper surface of the upper cover 3 is further provided with finned bosses 38. These finned bosses 38 are positioned near the optical port end of the optical module to increase the heat dissipation area of ​​the upper surface of the upper cover 3, thereby improving its heat dissipation efficiency. A cover plate 39 is also provided on the finned bosses 38. Limiting holes are provided on both sides of the cover plate 39, which cooperate with the limiting bosses on both sides of the finned bosses 38 to fix the cover plate 39 onto the finned bosses 38, thus protecting the finned bosses 38.

[0119] like ​ As shown, ​ The diagram shows the structure of the base. The lower surface of the base 1 is also provided with a dot matrix protrusion 16. The dot matrix protrusion 16 is located near the optical port end of the optical module to increase the heat dissipation area of ​​the lower surface of the base 1, thereby improving the heat dissipation efficiency of the base 1.

[0120] This embodiment provides an optical module suitable for CS optical ports. The optical transmitter adopts a BOX package, and the optical receiver adopts COB (chip on board) technology. This embodiment of the invention has at least the following advantages:

[0121] (1) The two optical emitting devices are staggered to disperse the heat dissipation devices and prevent heat concentration; it can also increase the PCB board area, which can better arrange the board and route the traces, and reduce one optical fiber and one ferrule, simplifying the structure.

[0122] (2) Heat pipe and copper block design. Disperse the heat of the high-power control chip; conduct the heat of the high-power control chip to a location where it is easy to dissipate.

[0123] (3) The base has a dot matrix protrusion design and the top cover has a fin-type protrusion design to enhance heat conduction efficiency.

[0124] (4) BOX packaging and COB packaging are combined. The BOX packaging is larger, and the COB packaging is small in volume, and both are combined to fully utilize the space. The BOX is high in cost and high in reliability, and the COB is low in cost and good in reliability.

[0125] The above merely describes preferred embodiments of the present application but is not used to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An optical module suitable for a CS optical port, characterized in that, Includes a base (1), a PCB board (2), a top cover (3), a first light-emitting component (4), and a second light-emitting component (5), wherein: The base (1) is located at the lower end of the PCB board (2), the upper cover (3) is located at the upper end of the PCB board (2), the outer periphery of the base (1) is connected to the outer periphery of the upper cover (3), and the PCB board (2), the first light emitting component (4) and the second light emitting component (5) are encapsulated between the base (1) and the upper cover (3). Along the length direction of the PCB board (2), the first light emitting component (4) and the second light emitting component (5) are staggered; along the width direction of the PCB board (2), the first light emitting component (4) and the second light emitting component (5) are staggered. The upper half of the first end of the PCB board (2) is provided with a gap to accommodate part of the first light emitting component (4), thereby avoiding the first light emitting component (4) from occupying extra space and compensating for the length difference between the first light emitting component (4) and the second light emitting component (5), ensuring that the light outlets of the first light emitting component (4) and the second light emitting component (5) are arranged side by side.

2. The optical module with a CS optical port according to claim 1, characterized in that, It also includes a light receiving component (6), which is encapsulated between the base (1) and the top cover (3); Along the length of the PCB board (2), the first light emitting component (4), the second light emitting component (5) and the light receiving component (6) are staggered, and the first light emitting component (4) is located between the second light emitting component (5) and the light receiving component (6); In the width direction of the PCB board (2), the projection of the second light emitting component (5) on the side of the PCB board (2) and the projection of the light receiving component (6) on the side of the PCB board (2) overlap at least partially.

3. The optical module suitable for CS optical ports according to claim 2, characterized in that, The first optical transmitting component (4) includes a first optical transmitting head (41) and a first optical device unit (42), which are connected; the second optical transmitting component (5) includes a second optical adapter (51) and a second optical device unit (52), which are connected; the optical receiving component (6) includes a first optical receiving head (61), a second optical receiving head (62), and an optical fiber array block (63), which are connected to the optical fiber array block (63). The first optical transmitter (41), the first optical receiver (61), the second optical adapter (51) and the second optical receiver (62) are arranged side by side on the outer side of the first end of the PCB board (2); the fiber array block (63) is arranged near the second end of the PCB board (2); the second optical device unit (52) is arranged near the first end of the PCB board (2); the first optical device unit (42) is arranged in the middle of the PCB board (2).

4. The optical module suitable for CS optical ports according to claim 3, characterized in that, The first optical transmitting assembly (4) further includes: a first optical fiber (43), a ferrule (44), a snap-fit ​​(45), a first optical adapter (46), and a first flexible tape (47), wherein: The first optical transmitter (41), the first optical fiber (43) and the ferrule (44) are connected in sequence. The first optical adapter (46), the first optical device unit (42) and the first flexible band (47) are connected in sequence. The ferrule (44) and the first optical adapter (46) are connected to each other through the buckle (45). The first optical device unit (42) is connected to the first pad (21) on the upper surface of the PCB board (2) through the first flexible band (47). The first optical transmitter (41), the first optical fiber (43), the ferrule (44), the buckle (45), the first optical adapter (46) and the first optical device unit (42) are located on the outside of the PCB board (2).

5. The optical module suitable for CS optical ports according to claim 3, characterized in that, The second optical emitting component (5) further includes a second flexible strip (53), wherein: The second optical adapter (51), the second optical device unit (52), and the second flexible strip (53) are connected in sequence. The second optical device unit (52) is connected to the second pad (22) on the upper surface of the PCB board (2) through the second flexible strip (53). The second optical adapter (51) and the second optical device unit (52) are located on the outside of the first end of the PCB board (2). The second optical adapter (51) is arranged side by side with the first optical emitting head (41).

6. The optical module suitable for CS optical ports according to claim 3, characterized in that, The optical receiving component (6) further includes a second optical fiber (64) and a third optical fiber (65), wherein: One end of the second optical fiber (64) is connected to the first optical receiver head (61), and the other end is connected to the optical fiber array block (63); One end of the third optical fiber (65) is connected to the second optical receiver head (62), and the other end is connected to the optical fiber array block (63); The fiber array block (63) is connected to the detector chip (25) on the PCB board (2), and the first optical receiver (61) and the second optical receiver (62) are arranged side by side with the second optical adapter (51) and the first optical transmitter (41).

7. The optical module suitable for CS optical ports according to claim 1, characterized in that, The lower surface of the upper cover (3) is provided with a copper block (31) and a heat pipe (32), wherein the width of the copper block (31) is greater than the width of the heat pipe (32); The copper block (31) is disposed at the tail end of the upper cover (3), and in the width direction of the upper cover (3), both sides of the copper block (31) are close to their corresponding side walls. The heat pipe (32) extends along the length of the upper cover (3), and one end of the heat pipe (32) is disposed near the copper block (31), and the other end is disposed near the light port end of the upper cover (3); The copper block (31) and heat pipe (32) correspond to the chip on the PCB board (2), and thermally conductive material is filled between the chip and the copper block (31) and heat pipe (32) to transfer the heat of the chip on the PCB board (2) to the outside.

8. The optical module suitable for CS optical ports according to claim 7, characterized in that, The lower surface of the upper cover (3) is also provided with a first heat dissipation protrusion (34), a first heat dissipation groove (35), and a second heat dissipation groove (36), wherein: The first heat dissipation protrusion (34) is located on the inner side of the junction of the copper block (31) and the heat pipe (32), and the first heat dissipation protrusion (34) corresponds to the position of the first driving chip (23) on the PCB board (2); The first heat dissipation groove (35) is located in the middle of the lower surface of the upper cover (3) and on the side of the heat pipe (32). The first heat dissipation groove (35) corresponds to the position of the first optical device unit (42) of the first light emitting component (4). The second heat dissipation groove (36) is disposed at the light port end of the upper cover (3) and is located on the outer side of the end face of the heat pipe (32). The second heat dissipation groove (36) corresponds to the position of the second optical device unit (52) of the second light emitting component (5).

9. The optical module suitable for a CS optical port according to claim 8, characterized in that, The upper surface of the base (1) is also provided with a third heat dissipation groove (12) and a fourth heat dissipation groove (13), wherein: The third heat dissipation groove (12) is located in the middle of the upper surface of the base (1) and close to the side wall of one side of the base (1). The third heat dissipation groove (12) corresponds to the position of the first optical device unit (42). The fourth heat dissipation groove (13) is disposed at the optical port end of the base (1) and close to the side wall of the other side of the base (1). The fourth heat dissipation groove (13) corresponds to the position of the second optical device unit (52).

10. The optical module suitable for a CS optical port according to claim 1, characterized in that, The upper surface of the cover (3) is also provided with a finned boss (38), which is located near the optical port end of the optical module. The lower surface of the base (1) is provided with a dot matrix protrusion (16), which is located near the optical port end of the optical module.

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