Modeling Method for Insulation of Ship Pipe System, Electronic Device, and Storage Medium

Abstract

The present invention relates to a modeling method, an electronic device, and a storage medium for ship piping insulation. An insulation component library is created based on insulation materials, thicknesses, and application locations; the insulation component library is embedded in the Smart3D platform, and the information of the insulation component library is associated with the model; the model of the Smart3D platform is obtained; insulation design is performed on the model, and a corresponding first insulation model is extended from the insulation component library, wherein the first insulation model matches the insulation location of the model; if the matching rate between the first insulation model and the insulation location of the model is less than a preset matching rate threshold, the insulation coefficient of the first insulation model is measured; a corresponding second insulation model is selected based on the insulation coefficient and the insulation size of the first insulation model, wherein the second insulation model is used as a replacement model for the first insulation model. At this time, the insulation model corresponding to the model based on the Smart3D platform is matched, and insulation design is performed on the model, and a corresponding first insulation model is extended from the insulation component library.

Description

Technical Field

[0001] This application relates to the technical field of ship piping insulation, and particularly to a modeling method, an electronic device, and a storage medium for ship piping insulation. Background Art

[0002] With the development of technology, as a part of ship design, ship piping needs to be insulated at its insulation locations. The insulation model needs to be designed based on parameters such as the pipe diameter, surface material, and insulation environment of the ship piping. At this time, the insulation model covers insulation materials, thicknesses, and application locations. Insulation models are created for the insulation locations of each ship piping, and the insulation models cannot be directly exported, resulting in low efficiency in creating existing insulation models and troublesome replacement. Summary of the Invention

[0003] The purpose of the embodiments of this application is to propose a modeling method, an electronic device, and a storage medium for ship piping insulation to solve the problems of low efficiency in creating existing insulation models and troublesome replacement.

[0004] To solve the above technical problems, the embodiments of this application provide a modeling method for ship piping insulation, adopting the following technical solutions:

[0005] Create an insulation component library based on insulation materials, thicknesses, and application locations;

[0006] Embed the insulation component library into the Smart3D platform and associate the information of the insulation component library with the model;

[0007] Obtain the model of the Smart3D platform;

[0008] Conduct insulation design on the model and extend the corresponding first insulation model from the insulation component library, where the first insulation model matches the insulation location of the model;

[0009] If the matching rate between the first insulation model and the insulation location of the model is less than the preset matching rate threshold, then measure the insulation coefficient of the first insulation model;

[0010] Screen the corresponding second insulation model based on the insulation coefficient and the insulation size of the first insulation model, where the second insulation model is used as the replacement model for the first insulation model.

[0011] To solve the above technical problems, the embodiments of this application also provide an electronic device, adopting the following technical solutions:

[0012] It includes a memory and a processor. Computer-readable instructions are stored in the memory, and when the processor executes the computer-readable instructions, the steps of the above-mentioned modeling method for ship piping insulation are implemented.

[0013] To solve the above technical problems, the present application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon.

[0014] To solve the above technical problems, an embodiment of the present application also provides a modeling system for ship piping insulation, including: a creation module for creating an insulation component library based on insulation materials, thicknesses, and application locations; an embedding module for embedding the insulation component library into the Smart3D platform and associating information of the insulation component library with the model; an acquisition module for acquiring the model of the Smart3D platform; an insulation module for performing insulation design on the model and extending a corresponding first insulation model from the insulation component library, where the first insulation model matches the insulation location of the model; a measurement module for calculating the insulation coefficient of the first insulation model if the matching rate between the first insulation model and the insulation location of the model is less than a preset matching rate threshold; and a screening module for screening a corresponding second insulation model based on the insulation coefficient and the insulation size of the first insulation model, where the second insulation model serves as a replacement model for the first insulation model.

[0015] The present application provides a modeling method, an electronic device, and a storage medium for ship piping insulation, which match a corresponding insulation model based on the model of the Smart3D platform, perform insulation design on the model, and extend a corresponding first insulation model from the insulation component library to facilitate the automatic creation of the first insulation model, affect the creation efficiency of the first insulation model, and avoid on-site design of the insulation model. Additionally, if the matching rate between the first insulation model and the insulation location of the model is less than a preset matching rate threshold, the insulation coefficient of the first insulation model is calculated; a corresponding second insulation model is screened based on the insulation coefficient and the insulation size of the first insulation model, thereby realizing rapid replacement of the insulation model and reducing model modification caused by inconvenient construction in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the solutions in the present application, the following will briefly introduce the drawings required for description in the embodiments of the present application. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 is a flowchart of the implementation of the modeling method for ship piping insulation provided in Embodiment 1 of the present application;

[0018] Figure 2 is Figure 1 a flowchart of a specific implementation manner of step S110 in

[0019] Figure 3 is Figure 1Flow chart of a specific implementation manner of step S120 in

[0020] Figure 4 is Figure 1 Flow chart of another specific implementation manner of step S130 in

[0021] Figure 5 is Figure 1 Flow chart of another specific implementation manner of step S140 in

[0022] Figure 6 is Figure 1 Flow chart of another specific implementation manner of step S150 in

[0023] Figure 7 is Figure 1 Flow chart of another specific implementation manner of step S160 in

[0024] Figure 8 is Figure 1 Flow chart of another specific implementation manner of step S170 in

[0025] Figures 9 to 12 is the actual flow chart of the modeling method for ship piping insulation

[0026] Figure 13 is the basic structural block diagram of an electronic device according to an embodiment of the electronic device of the present application

[0027] Figure 14 is the schematic diagram of the modeling system for ship piping insulation provided in Embodiment 1 of the present application Specific implementation manner

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and not to describe a specific order.

[0029] References to "embodiments" in this specification mean that the particular features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0030] To enable those skilled in the art to better understand the solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0031] Embodiment 1

[0032] Continue to refer to Figures 1 to 12 , which shows the implementation flowchart of the modeling method for ship piping insulation provided by Embodiment 1 of this application. The modeling method for ship piping insulation includes steps S110 to S170.

[0033] Step S110: Create an insulation component library based on the insulation material, thickness, and application location.

[0034] Specifically, it includes:

[0035] Step S111: Obtain the insulation material based on the material library;

[0036] Step S112: Associate the insulation material with the thickness, and regulate the insulation grade of the insulation material based on different thicknesses. The insulation grades of the insulation material are A, E, B, F, and H grades;

[0037] Step S113: Obtain the application location of the ship piping, and collect application parameters based on the application location of the ship piping;

[0038] Step S114: Determine the actual insulation grade based on the application parameters and the insulation grade;

[0039] Step S115: Associate the insulation material, thickness, and application location, and model and output multiple insulation components, and mark the actual insulation grade;

[0040] Step S116: Aggregate the multiple insulation components and create an insulation component library.

[0041] Specifically, the insulation material, thickness, and application location are sequentially associated. The insulation material is associated with the thickness, and the insulation grade of the insulation material is regulated based on different thicknesses. The insulation grades of the insulation material are A, E, B, F, and H. At this time, seven allowable maximum temperatures are specified for different insulation materials according to their high-temperature tolerance capabilities. Arranged in ascending order of temperature, they are: Y, A, E, B, F, H, and C. Their allowable operating temperatures are: 90, 105, 120, 130, 155, 180, and above 180 °C.

[0042] In addition, the application location of the ship piping system is obtained, and application parameters are collected based on the application location of the ship piping system; the actual insulation grade is determined based on the application parameters and the insulation grade, so as to perform different insulation matching according to different application locations of the ship piping system, and the insulation material, thickness, and application location are associated, and multiple insulation components are modeled and output, and the actual insulation grade is marked. At this time, the multiple insulation components are grouped together, and an insulation component library is created. Among them, each insulation model in the insulation component library corresponds to a set actual insulation grade, so as to facilitate subsequent matching of the actual insulation grade.

[0043] Step S120: Embed the insulation component library into the Smart3D platform and associate the information of the insulation component library model.

[0044] Specifically, it includes:

[0045] Step S121: Output the insulation component library to the applet model and output the corresponding insulation component library program;

[0046] Step S122: Embed the insulation component library program into the Smart3D platform;

[0047] Step S123: Associate the insulation component library program with the modeling program to associate the information of the insulation component library model;

[0048] Step S124: During the modeling process of the model, traverse the insulation application locations of the model, mark the corresponding actual insulation grades for the insulation application locations, and traverse the corresponding insulation component library program based on the actual insulation grades.

[0049] Among them, outputting the insulation component library to the applet model and outputting the corresponding insulation component library program facilitates the programming of the insulation component library and facilitates embedding the insulation component library into the Smart3D platform in the form of a program. At this time, the insulation component library program is embedded into the Smart3D platform.

[0050] Associate the insulation component library program with the modeling program to associate the information of the insulation component library model; during the modeling process of the model, traverse the insulation application locations of the model, and mark the corresponding actual insulation levels at the insulation application locations. Based on the actual insulation levels, traverse the corresponding insulation component library programs, so as to select the corresponding insulation models from the insulation component library programs, and directly output the insulation models to the insulation application locations of the adapted model, so as to facilitate the automatic creation of the first insulation model, improve the creation efficiency of the first insulation model, and avoid on-site design of the insulation model.

[0051] Step S130: Obtain the model of the Smart3D platform.

[0052] Specifically include:

[0053] Step S131: Obtain the drawings of the ship piping system;

[0054] Step S132: Perform modeling based on the drawings of the ship piping system and build the model in the Smart3D platform;

[0055] Step S133: Output the corresponding ship piping system model based on the Smart3D platform.

[0056] Among them, model the drawings of the ship piping system in the modeling environment of Smart3D, and output the corresponding ship piping system model based on the Smart3D platform. Among them, Smart3D is used as the modeling software and acts on the model of the ship piping system.

[0057] Step S140: Perform insulation design on the model and extend the corresponding first insulation model in the insulation component library, where the first insulation model matches the insulation location of the model.

[0058] Specifically include:

[0059] Step S141: Perform insulation design on the model, traverse the model of the ship piping system, and obtain the insulation outer diameter at the insulation location or connection of the ship piping system;

[0060] Step S142: Select the corresponding insulation model from the entire insulation component library program based on the insulation outer diameter and extend the corresponding first insulation model in the insulation component library.

[0061] Step S150: If the matching rate between the first insulation model and the insulation location of the model is less than the preset matching rate threshold, then measure the insulation system of the first insulation model.

[0062] Specifically include:

[0063] Step S151: Move the first insulation model to the insulation location of the model and measure the matching rate between the first insulation model and the insulation location of the model;

[0064] Step S152: If the matching rate between the first insulation model and the insulated part of the model is lower than the preset matching rate threshold, then adjust the first insulation model and adjust the first insulation model according to the difference between the first insulation model and the insulated part of the model.

[0065] Step S153: Measure the insulation coefficient of the first insulation model and adjust the change amount of the first insulation model according to the insulation coefficient of the first insulation model.

[0066] Among them, traverse the model of the ship piping system, and obtain the insulation outer diameter at the insulated part or connection part of the ship piping system, so as to select the corresponding insulation model from the entire insulation component library program based on the insulation outer diameter, and extend the corresponding first insulation model in the insulation component library. At this time, the insulated part or connection part of the ship piping system is the main insulated place, and select the corresponding insulation model from the entire insulation component library program based on the insulation outer diameter, so as to initially determine the insulation model and facilitate further adjustment in the follow-up.

[0067] At this time, move the first insulation model to the insulated part of the model, and measure the matching rate between the first insulation model and the insulated part of the model; if the matching rate between the first insulation model and the insulated part of the model is lower than the preset matching rate threshold, then adjust the first insulation model and adjust the first insulation model according to the difference between the first insulation model and the insulated part of the model; at this time, measure the insulation coefficient of the first insulation model and adjust the change amount of the first insulation model according to the insulation coefficient of the first insulation model.

[0068] Step S160: If a corresponding second insulation model is selected based on the insulation coefficient and the insulation size of the first insulation model, where the second insulation model is used as a replacement model for the first insulation model.

[0069] Specifically include:

[0070] Step S161: If a corresponding second insulation model is selected based on the insulation coefficient and the insulation size of the first insulation model;

[0071] Step S162: The second insulation model is a model obtained by adjusting the first insulation model, and the second insulation model is used as a replacement model for the first insulation model;

[0072] Step S163: Move the second insulation model to the insulated part of the model, and measure the matching rate between the second insulation model and the insulated part of the model. At this time, the matching rate between the second insulation model and the insulated part of the model reaches the preset matching rate threshold.

[0073] Step S170: Form the preprocessed ship piping system model based on the modified attributes.

[0074] Specifically include:

[0075] Step S171: Obtain the attributes of the second insulation model and use the attributes of the second insulation model as the modified attributes;

[0076] Step S172: Add the modified attributes to the model and form a preprocessed ship piping system model.

[0077] Among them, the model based on the Smart3D platform matches the corresponding insulation model, and conducts insulation design on this model, and extends the corresponding first insulation model in the insulation component library to facilitate the automatic creation of the first insulation model, affecting the creation efficiency of the first insulation model, avoiding on-site design of the insulation model. In addition, if the matching rate between the first insulation model and the insulation part of the model is less than the preset matching rate threshold, then calculate the insulation coefficient of the first insulation model; screen the corresponding second insulation model based on the insulation coefficient and the insulation size of the first insulation model, so as to realize the rapid replacement of the insulation model and reduce the model modification caused by inconvenient construction in the later stage.

[0078] In the actual scenario of the modeling method for ship piping insulation:

[0079] Configuration file

[0080] Sort out the process documents and relevant standards, and extract information such as insulation materials, thickness, and application locations;

[0081] According to the sorted list, formulate insulation configuration rules;

[0082] Create an insulation component library

[0083] Create a model

[0084] By extracting the location information in the model attributes and defining the attributes of the model, an insulation model will be generated according to the rules.

[0085] This method is based on the Smart 3D piping specialty, modeling the insulation model in the modeling stage, reducing the model modification caused by inconvenient construction in the later stage, and reserving space for on-site construction.

[0086] This application provides a modeling method, an electronic device, and a storage medium for ship piping insulation. The model based on the Smart3D platform matches the corresponding insulation model, and conducts insulation design on this model, and extends the corresponding first insulation model in the insulation component library to facilitate the automatic creation of the first insulation model, affecting the creation efficiency of the first insulation model, avoiding on-site design of the insulation model. In addition, if the matching rate between the first insulation model and the insulation part of the model is less than the preset matching rate threshold, then calculate the insulation coefficient of the first insulation model; screen the corresponding second insulation model based on the insulation coefficient and the insulation size of the first insulation model, so as to realize the rapid replacement of the insulation model and reduce the model modification caused by inconvenient construction in the later stage.

[0087] This application can be used in numerous general-purpose or special-purpose computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, and so on. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This application can also be practiced in a distributed computing environment where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0088] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through computer-readable instructions. These computer-readable instructions can be stored in a computer-readable storage medium. When these computer-readable instructions are executed, they can include the processes of the embodiments of the above methods. Among them, the aforementioned storage medium can be a non-volatile storage medium such as a magnetic disk, an optical disk, a Read-Only Memory (ROM), or a Random Access Memory (RAM), etc.

[0089] It should be understood that although the steps in the flowchart of the accompanying drawings are shown in sequence according to the indication of the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this article, the execution of these steps has no strict order restriction, and they can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same moment, but can be executed at different moments, and their execution order is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or sub-steps or stages of other steps.

[0090] To solve the above technical problems, an embodiment of this application also provides an electronic device. For details, please refer to Figure 13 , Figure 13 which is the basic structural block diagram of the electronic device in this embodiment.

[0091] The electronic device 300 includes a memory 310, a processor 320, and a network interface 340 that are communicatively connected to each other via a system bus. It should be noted that only the electronic device 300 with components 310 - 340 is shown in the figure, but it should be understood that it is not required to implement all the shown components, and more or fewer components can be implemented alternatively. Among them, those skilled in the art of this technology can understand that the electronic device here is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to microprocessors, application specific integrated circuits (ASICs), field - programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0092] The electronic device can be a computing device such as a desktop computer, a notebook, a palm computer, and a cloud server. The electronic device can interact with the user through means such as a keyboard, a mouse, a remote control, a touchpad, or a voice control device.

[0093] The memory 310 includes at least one type of readable storage medium, and the readable storage medium includes flash memory, a hard disk, a multimedia card, a card - type memory (such as an SD or DX memory, etc.), a random access memory (RAM), a static random access memory (SRAM), a read - only memory (ROM), an electrically erasable programmable read - only memory (EEPROM), a programmable read - only memory (PROM), a magnetic memory, a magnetic disk, an optical disk, etc. In some embodiments, the memory 310 can be an internal storage unit of the electronic device 300, such as the hard disk or memory of the electronic device 300. In other embodiments, the memory 310 can also be an external storage device of the electronic device 300, such as a plug - in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the electronic device 300. Of course, the memory 310 can also include both the internal storage unit and the external storage device of the electronic device 300. In this embodiment, the memory 310 is generally used to store the operating system and various application software installed on the electronic device 300, such as computer - readable instructions for the modeling method of ship piping insulation. In addition, the memory 310 can also be used to temporarily store various types of data that have been output or will be output.

[0094] In some embodiments, the processor 320 may be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chips. The processor 320 is generally used to control the overall operation of the electronic device 300. In this embodiment, the processor 320 is used to run the computer-readable instructions stored in the memory 310 or process data, such as running the computer-readable instructions of the modeling method for ship pipe system insulation.

[0095] The network interface 340 may include a wireless network interface or a wired network interface, and this network interface 340 is generally used to establish a communication connection between the electronic device 300 and other electronic devices.

[0096] The present application also provides another implementation manner, that is, to provide a computer-readable storage medium storing computer-readable instructions that can be executed by at least one processor, so that the at least one processor executes the steps of the modeling method for ship pipe system insulation as described above.

[0097] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-described embodiment methods can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation manner. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disc) and includes several instructions for causing a terminal device (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in various embodiments of the present application.

[0098] Continue to refer to Figure 14, to solve the above technical problems, the embodiments of the present application further provide a modeling system for ship piping insulation, including: a creation module 210, configured to create an insulation component library based on insulation materials, thicknesses, and application locations; an embedding module 220, configured to embed the insulation component library into the Smart3D platform and associate the information of the insulation component library with the model; an acquisition module 230, configured to acquire the model of the Smart3D platform; an insulation module 240, configured to perform insulation design on the model and extend a corresponding first insulation model from the insulation component library, where the first insulation model matches the insulation location of the model; a measurement module 250, configured to measure the insulation coefficient of the first insulation model if the matching rate between the first insulation model and the insulation location of the model is less than a preset matching rate threshold; a screening module 260, configured to screen a corresponding second insulation model based on the insulation coefficient and the insulation size of the first insulation model, where the second insulation model serves as a replacement model for the first insulation model.

[0099] Obviously, the above-described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The accompanying drawings show the preferred embodiments of the present application, but do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structures directly or indirectly using the content of the specification and drawings of the present application in other related technical fields are equally within the scope of the patent protection of the present application.

Claims

1. A modeling method for ship piping insulation, characterized in that Including: Create an insulation component library based on insulation materials, thickness, and application locations; Embed the insulation component library into the Smart3D platform and associate the information of the insulation component library with the model; Obtain the model of the Smart3D platform; Conduct insulation design on the model and extend the corresponding first insulation model from the insulation component library, where the first insulation model matches the insulation location of the model; If the matching rate between the first insulation model and the insulation location of the model is less than the preset matching rate threshold, measure the insulation coefficient of the first insulation model; Screen the corresponding second insulation model based on the insulation coefficient and the insulation size of the first insulation model, where the second insulation model serves as the replacement model for the first insulation model; The conducting insulation design on the model and extending the corresponding first insulation model from the insulation component library, where the first insulation model matches the insulation location of the model, includes: Conduct insulation design on the model, traverse the model of the ship piping system, and obtain the insulation outer diameter at the insulation location or connection of the ship piping system; Select the corresponding insulation model from the entire insulation component library program based on the insulation outer diameter and extend the corresponding first insulation model from the insulation component library; The if the matching rate between the first insulation model and the insulation location of the model is less than the preset matching rate threshold, measure the insulation coefficient of the first insulation model, includes: Move the first insulation model to the insulation location of the model and measure the matching rate between the first insulation model and the insulation location of the model; If the matching rate between the first insulation model and the insulation location of the model is lower than the preset matching rate threshold, adjust the first insulation model and adjust the first insulation model according to the difference between the first insulation model and the insulation location of the model; Measure the insulation coefficient of the first insulation model and adjust the change amount of the first insulation model according to the insulation coefficient of the first insulation model; The if screening the corresponding second insulation model based on the insulation coefficient and the insulation size of the first insulation model, where the second insulation model serves as the replacement model for the first insulation model, includes: If screening the corresponding second insulation model based on the insulation coefficient and the insulation size of the first insulation model; The second insulation model is the model after adjustment of the first insulation model, and the second insulation model serves as the replacement model for the first insulation model; Move the second insulation model to the insulation location of the model and measure the matching rate between the second insulation model and the insulation location of the model. At this time, the matching rate between the second insulation model and the insulation location of the model reaches the preset matching rate threshold.

2. The modeling method of ship piping insulation according to claim 1, characterized in that The creating an insulation component library based on insulation materials, thickness, and application locations, includes: Obtain insulation materials based on the material library; Associate the insulation materials with the thickness, adjust the insulation grade of the insulation materials based on different thicknesses, and the insulation grades of the insulation materials are A, E, B, F, and H grades; Obtain the application locations of the ship piping system and collect application parameters based on the application locations of the ship piping system; Determine the actual insulation grade based on the application parameters and the insulation grade; Associate the insulation materials, thickness, and application locations, and model and output multiple insulation components, and mark the actual insulation grade; Collect multiple insulation components and create an insulation component library.

3. The modeling method of ship piping insulation according to claim 2, wherein The embedding the insulation component library into the Smart3D platform and associating the information of the insulation component library with the model, includes: Output the insulation component library to the applet model and output the corresponding insulation component library program; Embed the insulation component library program into the Smart3D platform; Associate the insulation component library program with the modeling program to associate the information of the insulation component library with the model; During the modeling process of the model, traverse the insulation application locations of the model, mark the corresponding actual insulation levels at the insulation application locations, and traverse the corresponding insulation component library program based on the actual insulation levels.

4. The modeling method of ship piping insulation according to claim 3, characterized in that, The obtaining of the model of the Smart3D platform includes: Obtain the drawings of the ship piping system; Perform modeling based on the drawings of the ship piping system and build the model in the Smart3D platform; Output the corresponding ship piping system model based on the Smart3D platform.

5. The modeling method of ship piping system insulation according to claim 1, characterized in that The ship piping system model based on the preprocessing of forming with the modified attributes includes: Obtain the attributes of the second insulation model and use the attributes of the second insulation model as the modified attributes; Add the modified attributes to the model and form the preprocessed ship piping system model.

6. An electronic device, characterized in that, It includes a memory and a processor. Computer-readable instructions are stored in the memory. When the processor executes the computer-readable instructions, the steps of the ship piping system insulation modeling method according to any one of claims 1 to 5 are implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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