Predetermined line position correction method and device, electronic equipment and storage medium

Abstract

Embodiments of the present application provide a predetermined line position correction method and device, electronic equipment and storage medium. The method comprises: obtaining a plurality of groups of predetermined line images to be tested containing predetermined lines, each group of predetermined line images to be tested being an image collected by an image collection device for a predetermined line on a workpiece under the condition that the workpiece moves along a predetermined reference direction; based on the plurality of groups of predetermined line images to be tested, and based on a reference position point, a plurality of groups of position points are sequentially determined one by one, and the plurality of groups of predetermined line images to be tested correspond to the plurality of groups of position points one by one; after determining each group of position points, the position of the workpiece is adjusted according to the angle of the line connecting the first position point and the second position point in the group of position points relative to the line connecting the predetermined reference direction, so as to correct the position of the predetermined line on the workpiece. High-precision positioning of the predetermined line on the workpiece can be achieved in a wider range.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically to a method for correcting the position of a predetermined line of a workpiece, a device for correcting the position of a predetermined line of a workpiece, an electronic device, and a storage medium. Background Technology

[0002] In many industries, such as the semiconductor industry, vision is required for positioning certain processing equipment. For example, laser processing equipment used to dicing wafers needs to use vision to position the dicing track on the wafer so that the dicing track is parallel to the horizontal direction (X-axis movement direction, the X-axis motion mechanism drives the wafer to move along the X-axis, during which the laser processing equipment processes the wafer).

[0003] Traditional laser processing equipment relies solely on mechanical or high-precision vision methods for product positioning. Mechanical positioning has relatively low accuracy, making it difficult to level the product and failing to meet modern manufacturing requirements. While high-precision vision positioning offers high accuracy, its limited field of view makes it difficult to level a large range of products effectively.

[0004] Therefore, with the rapid development of technology, the high-end technology industry has an increasing demand for product positioning accuracy. As products become more diverse, existing positioning technologies are struggling to meet contemporary needs. Summary of the Invention

[0005] The present invention was proposed in view of the above-mentioned problems. The present invention provides a method for correcting the predetermined line position of a workpiece, a device for correcting the predetermined line position of a workpiece, an electronic device, and a storage medium.

[0006] According to one aspect of the present invention, a method for calibrating the position of a predetermined line on a workpiece is provided, wherein the predetermined line is a feature line on the workpiece, comprising: acquiring multiple sets of images of the predetermined line to be measured, each set of images of the predetermined line to be measured being an image acquired by an image acquisition device for the predetermined line on the workpiece while the workpiece moves along a preset reference direction; and determining multiple sets of position points based on the multiple sets of images of the predetermined line to be measured and based on a reference position point, wherein each set of position points includes a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point and along the preset reference direction, the multiple sets of position points... The spacing between the two position points in each set gradually increases, and multiple sets of predetermined line images to be measured correspond one-to-one with multiple sets of position points. Each set of predetermined line images to be measured includes two predetermined line images to be measured that correspond to the first position point and the second position point in the corresponding set of position points, respectively. After determining each set of position points, the position of the workpiece is adjusted according to the angle of the line connecting the first position point and the second position point in the set of position points relative to the preset reference direction, so as to correct the position of the predetermined line on the workpiece. Among the reference position point and the multiple sets of position points, different position points are the position points corresponding to different feature points on the predetermined line.

[0007] For example, based on multiple sets of images of a predetermined line to be tested, and based on reference position points, multiple sets of position points are sequentially determined, including: obtaining a preset template image, wherein the preset template image contains position features associated with the predetermined line and reference points; matching the preset template image with any current image of the predetermined line to be tested according to the position features contained in the preset template image; and based on the matching result, determining the point in the current image of the predetermined line to be tested that corresponds to the reference point in the preset template image as the current feature point corresponding to the current image of the predetermined line to be tested.

[0008] For example, the workpiece to be processed includes a first predetermined line and a second predetermined line intersecting the first predetermined line. In a preset template image, the intersection of the first predetermined line and the second predetermined line is used as a reference point.

[0009] For example, in the reference position point and multiple sets of position points, each position point is the image position point of the corresponding feature point in the image of the corresponding predetermined line to be measured. Each image position point corresponds to a physical position point in the world coordinate system. The distance between the physical position points corresponding to the two position points in each set of position points is an integer multiple of the spacing between adjacent predetermined lines.

[0010] For example, before determining multiple sets of position points based on multiple sets of images of the predetermined line to be tested and based on reference position points, the method further includes: acquiring a preset template image, wherein the preset template image contains position features associated with the predetermined line and reference points; matching the preset template image with an initial predetermined line image based on the position features contained in the preset template image, wherein the initial predetermined line image is an image acquired by the image acquisition device for the predetermined line when the workpiece is in an initial position; determining the points in the initial predetermined line image corresponding to the reference points in the preset template image as initial feature points based on the matching result; adjusting the relative position between the image acquisition device and the workpiece based on the deviation between the image position of the initial feature points in the initial predetermined line image and the image center of the initial predetermined line image, so that the initial feature points are aligned with the field of view center of the image acquisition device; and determining the position point corresponding to the aligned initial feature points as reference position points.

[0011] For example, in the reference position point and multiple sets of position points, each position point is the image position point of the corresponding feature point in the corresponding predetermined line image. Each image position point corresponds to a physical position point in the world coordinate system. Based on multiple sets of predetermined line images to be measured, and based on the reference position point, multiple sets of position points are determined sequentially, including: for each set of position points in the multiple sets of position points, with the physical position point corresponding to the reference position point as the center, controlling the workpiece to be processed to move along the first direction axis to the first physical position and acquiring the first predetermined line image to be measured after the movement, and controlling the workpiece to be processed to move along the second direction axis opposite to the first direction axis to the second physical position and acquiring the second predetermined line image to be measured after the movement; based on the first predetermined line image to be measured and the second predetermined line image to be measured, determining the first position point and the second position point of the set of position points; wherein, the first direction axis and the second direction axis are axes in the preset reference direction, the first physical position is the physical position point corresponding to the first position point in the set of position points, and the second physical position is the physical position point corresponding to the second position point in the set of position points.

[0012] For example, adjusting the position of the workpiece to correct the position of a predetermined line on the workpiece based on the angle of the line connecting the first and second position points in the set of position points relative to a preset reference direction includes: performing the following correction operations: when the line angle is greater than a preset angle threshold, determining a corresponding adjustment angle based on the line angle, and adjusting the position of the workpiece based on the adjustment angle to correct the position of the predetermined line on the workpiece; when the line angle is less than or equal to the preset angle threshold, stopping the correction; wherein, after the step of determining the corresponding adjustment angle based on the line angle and adjusting the position of the workpiece based on the adjustment angle when the line angle is greater than the preset angle threshold, the step of determining the next set of position points is performed, wherein, along the preset reference direction, the distance between two position points in the next set of position points is greater than the distance between two position points in the current set of position points.

[0013] For example, the method further includes: outputting a user interface; receiving a preset angle threshold and a correction count threshold set by the user on the user interface; and outputting an alarm message when the number of times the correction operation is performed reaches the correction count threshold and the angle of the line corresponding to the current group position point is greater than the preset angle threshold.

[0014] According to another aspect of the present invention, a device for correcting the position of a predetermined line on a workpiece is also provided, comprising: an acquisition module, configured to acquire multiple sets of images of a predetermined line to be measured, each set of images of the predetermined line to be measured being an image acquired by an image acquisition device for the predetermined line on the workpiece as the workpiece moves along a preset reference direction; and a determination module, configured to determine multiple sets of position points based on the multiple sets of images of the predetermined line to be measured and based on a reference position point, each set of position points including a first position point and a second position point, the first position point and the second position point being located on both sides of the reference position point and along the preset reference direction, each set of position points being... The spacing between the two location points gradually increases, and multiple sets of predetermined line images to be measured correspond one-to-one with multiple sets of location points. Each set of predetermined line images to be measured includes two predetermined line images to be measured that correspond to the first location point and the second location point in the corresponding set of location points, respectively. The correction module is used to adjust the position of the workpiece to be processed according to the angle of the line connecting the first location point and the second location point in the set of location points relative to the preset reference direction after each set of location points is determined, so as to correct the position of the predetermined line on the workpiece. Among the reference location point and multiple sets of location points, different location points are the location points corresponding to different feature points on the predetermined line.

[0015] According to another aspect of the present invention, an electronic device is also provided, including a processor and a memory, wherein the memory stores computer program instructions, which, when executed by the processor, are used to perform the above-described method for correcting the predetermined line position of a workpiece.

[0016] According to another aspect of the present invention, a storage medium is also provided, on which program instructions are stored, wherein the program instructions, when executed, are used to perform the above-described method for correcting the predetermined line position of a workpiece.

[0017] According to embodiments of the present invention, a method, apparatus, electronic device, and storage medium for correcting the position of a predetermined line on a workpiece determine multiple sets of position points. The position of the workpiece is adjusted by the angle between the line connecting two position points in each set and the line connecting them relative to a preset reference direction, thereby correcting the position of the predetermined line on the workpiece. By setting multiple sets of position points, high-precision positioning of the predetermined line on the workpiece can be achieved over a wider range.

[0018] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0019] The above and other objects, features, and advantages of the present invention will become more apparent from the more detailed description of the embodiments of the invention in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same parts or steps.

[0020] Figure 1 A schematic flowchart of a method for correcting the predetermined line position of a workpiece according to an embodiment of the present invention is shown;

[0021] Figure 2 An image of a cutting path according to an embodiment of the present invention is shown;

[0022] Figure 3 A schematic diagram of a preset template image according to an embodiment of the present invention is shown;

[0023] Figure 4 A schematic block diagram of a predetermined line position correction device for a workpiece according to an embodiment of the present invention is shown;

[0024] Figure 5 A schematic block diagram of an electronic device according to an embodiment of the present invention is shown.

[0025] To make the objectives, technical solutions, and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of the present invention, and not all of the embodiments of the present invention. It should be understood that the present invention is not limited to the exemplary embodiments described herein. Based on the embodiments of the present invention described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of the present invention.

[0026] To at least partially solve the above problems, embodiments of the present invention provide a method for correcting the position of a predetermined line on a workpiece. The predetermined line is a feature line on the workpiece. Figure 1 A schematic flowchart of a predetermined line position correction method 100 for a workpiece according to an embodiment of the present invention is shown. Figure 1 As shown, the method 100 may include the following steps S110, S120 and S130.

[0027] Step S110: Acquire multiple sets of images of the predetermined lines to be tested, each set of images of the predetermined lines to be tested being an image acquired by the image acquisition device for the predetermined lines on the workpiece as the workpiece moves along a preset reference direction.

[0028] For example, the predetermined line is a feature line on the workpiece to be processed. The workpiece to be processed can be any item, such as ceramics, wafers, etc. The predetermined line can be any feature line, such as a dicing line on a wafer. The image of the predetermined line to be tested can be an image containing any number of predetermined lines. For example, each set of images of the predetermined lines to be tested can be an image acquired by an image acquisition device for the predetermined lines on the wafer while the wafer moves along a preset reference direction. The preset reference direction can be any direction, such as a horizontal direction, a vertical direction, etc. For ease of description and understanding, the embodiments shown below are described with the preset reference direction as the horizontal direction. Each set of images of the predetermined lines to be tested can be a static image or any video frame in a dynamic video. The image of the predetermined lines to be tested can be the original image acquired by the image acquisition device, or it can be an image obtained after preprocessing (such as digitization, normalization, smoothing, etc.) the original image acquired by the image acquisition device. It can be understood that the preprocessing of the original image can include the operation of extracting sub-images containing the predetermined lines to be tested from the original image acquired by the image acquisition device to obtain multiple sets of images of the predetermined lines to be tested.

[0029] Step S120: Based on multiple sets of images of the predetermined line to be tested, and based on the reference position points, multiple sets of position points are sequentially determined. Each set of position points includes a first position point and a second position point. The first position point and the second position point are located on both sides of the reference position point. Along the preset reference direction, the distance between the two position points contained in each set of position points gradually increases. The multiple sets of images of the predetermined line to be tested correspond one-to-one with the multiple sets of position points. Any set of images of the predetermined line to be tested includes two images of the predetermined line to be tested that correspond to the first position point and the second position point in the corresponding set of position points, respectively. Among the reference position points and the multiple sets of position points, different position points are position points corresponding to different feature points on the predetermined line.

[0030] To facilitate understanding later, the methods for measuring physical location and image location mentioned in this article will be described first.

[0031] The image position of any object (e.g., any feature point) described in this article can be represented by pixel coordinates in the image coordinate system in which the object is located. For example, an image coordinate system can be established with the top-left corner vertex of any image as the origin o, the side passing through the origin o and parallel to the top edge of the image as the x-axis, and the side passing through the origin o, perpendicular to the x-axis, and parallel to the left edge of the image as the y-axis. For example, any image contains a total of 1000 × 1000 pixels. If any object is located at the 15th pixel in the X direction and the 30th pixel in the Y direction, then the image position of the object can be represented as (15, 30).

[0032] The various physical positions described herein can be represented by coordinates in the same world coordinate system. An example of establishing such a world coordinate system is described below. A workpiece can be placed on a movable device (e.g., a movable stage). The movable stage can translate within a plane (which may be called the "movement plane") or rotate within that plane about a fixed axis of rotation. The workpiece moves synchronously with the movable stage; therefore, the physical position of the movable stage described herein can be considered the same as the physical position of the workpiece, and they can be interchanged. Within the movement range of the movable stage, two mutually perpendicular grating rulers can be provided. For example, when the movable stage stops at a predetermined initial physical position, the reading of the grating rulers can be set to 0, and this physical position can be defined as the origin O of the world coordinate system. A first grating ruler can be provided along a first direction through the origin O, and the axis containing the first grating ruler can be used as the X-axis of the world coordinate system. A second grating ruler is provided perpendicular to the X-axis and through the origin O. The axis containing the second grating ruler can be used as the Y-axis of the world coordinate system. The first direction can be defined as needed. For ease of description, this paper defines the first direction as the horizontal direction, which is also the X-axis direction. The Y-axis direction, perpendicular to the X-axis direction, is defined as the vertical direction. After establishing the above world coordinate system, each time the movable stage moves, i.e., when the workpiece moves, the corresponding X-axis and Y-axis coordinates can be read from the first and second grating rulers. This (X,Y) coordinate can be used to represent the physical position of the workpiece. It can be understood that (X,Y) can be coordinate data used to represent the displacement of the workpiece.

[0033] There is a certain conversion relationship between the image position and the physical position. This conversion relationship can be pre-stored in a storage device. The storage device can be included in the apparatus (e.g., a host computer) used to execute the predetermined line position correction method 100 for the workpiece, or it can be a separate storage device. The apparatus used to execute the predetermined line position correction method 100 for the workpiece can be communicatively connected to this separate storage device. Knowing the image position allows the physical position to be determined based on the conversion relationship, and vice versa.

[0034] Based on multiple sets of images of the predetermined lines to be tested, and based on reference position points, multiple sets of position points are sequentially determined. Among the reference position points and the multiple sets of position points, different position points correspond to different feature points on the predetermined lines. Feature points can be any identifiable feature point on the workpiece to be processed. For example, feature points can be feature points inherent to the workpiece itself, or feature points additionally marked on the workpiece, for example, manually or by a processing device. In one example, a feature point can be the center point of the intersection region of two mutually perpendicular dicing tracks on the workpiece (referred to as the "dicing track center"). Different feature points can be dicing track centers at different locations on the wafer. The position point corresponding to any feature point can be the image position point corresponding to that feature point in the aforementioned image coordinate system, or the physical position point corresponding to that feature point in the aforementioned world coordinate system.

[0035] For example, Figure 2 A cut track image according to an embodiment of the present invention is shown. The reference position point can be represented by an image position point (i.e., an image position) or a physical position point (i.e., a physical position) corresponding to the center of the cut tracks contained in the first and second cut tracks. A first set of images of the predetermined line to be tested may include a first image of the predetermined line to be tested and a second image of the predetermined line to be tested. The first image of the predetermined line to be tested may include at least the following: Figure 2 The dashed area on the left side of the image represents the image acquired by the image acquisition device at the intersection of the first and third dicing kerfs as the wafer moves horizontally to the right from the reference point. The second predetermined line image may include at least the following: Figure 2 The dashed area on the right side of the image represents the image acquired by the image acquisition device at the intersection of the first and fourth dicing trajectories as the wafer moves horizontally to the left from the reference position. Therefore, by moving horizontally to both sides based on the reference position, a first set of images of the predetermined test line can be acquired, and then the first position point A1 and the second position point A2 can be determined based on these images. The first position point A1 can be an image position point or a physical position point corresponding to the center of the dicing trajectories included in the first and third dicing trajectories. The second position point A2 can be an image position point or a physical position point corresponding to the center of the dicing trajectories included in the first and fourth dicing trajectories. Similarly, multiple sets of position points B1B2, C1C2, etc., can be determined sequentially, and each set of position points can contain both the first and second position points. Along the horizontal direction, the distance between the two position points contained in each set of position points gradually increases. That is, the distance between C1C2 is greater than the distance between B1B2. For example, the number of multiple sets of images of the predetermined line to be tested is the same as the number of multiple sets of location points, and the multiple sets of images of the predetermined line to be tested correspond one-to-one with the multiple sets of location points.

[0036] It is understood that the "points" described in this invention, such as location points, feature points, reference points, etc., correspond to a "region" when the corresponding image is magnified. Figure 2 The center of the cutting path where the first and second cutting paths intersect, as shown above, is described as an "image location point," but from... Figure 2 As can be seen in the illustration, what is shown is a "region". Here, a "region" can be an image area composed of a single pixel or multiple pixels in the image.

[0037] Step S130: After determining a set of position points each time, adjust the position of the workpiece to be processed according to the angle of the line connecting the first position point and the second position point in the set of position points relative to the preset reference direction, so as to correct the position of the predetermined line on the workpiece.

[0038] For example, during step S120, after each set of position points is determined, the following operations can be performed to correct the position of predetermined lines on the wafer. For instance, after determining the first set of position points, the wafer position can be adjusted based on the angle of the line connecting the first position point A1 and the second position point A2 in that set relative to the horizontal direction. If the line connecting the first position point A1 and the second position point A2 is tilted counterclockwise by 2 degrees relative to the horizontal direction, the wafer can be rotated clockwise by 2 degrees so that the line connecting the first position point A1 and the second position point A2 on the wafer coincides with the horizontal direction. This corrects the predetermined lines to tend to be parallel to a preset reference direction. It can be understood that by adjusting the workpiece, the direction of all predetermined lines on it can be corrected.

[0039] According to the predetermined line positioning method of the present invention, multiple sets of position points are determined, and the position of the workpiece is adjusted by the angle of the line connecting two position points in each set relative to a preset reference direction, thereby correcting the position of the predetermined line on the workpiece. By setting multiple sets of position points, high-precision positioning of the predetermined line on the workpiece can be achieved over a wide range.

[0040] For example, based on multiple sets of images of a predetermined line to be tested, and sequentially determining multiple sets of position points based on reference position points, the method may include: obtaining a preset template image, wherein the preset template image contains position features associated with the predetermined line and reference points; matching the preset template image with any current image of the predetermined line to be tested according to the position features contained in the preset template image; and determining the point in the current image of the predetermined line to be tested that corresponds to the reference point in the preset template image as the current feature point corresponding to the current image of the predetermined line to be tested based on the matching result.

[0041] In one embodiment, the method for obtaining the preset template image is similar to step S110, and for simplicity, it will not be described again here. The preset template image can be an image containing any positional features associated with the predetermined line on the workpiece to be processed, as well as reference points. The workpiece to be processed can be any product used for processing, such as ceramics or wafers. The preset template image can be the same size as or smaller than the image of the predetermined line to be tested. The preset template image is pre-marked with positional features associated with the predetermined line and reference points. The reference points can be any identifiable point on the predetermined line. The reference points are of the same type as the feature points described above, and are used to compare with each image of the predetermined line to be tested to determine the location of the marker point. For example, the reference point can be the center of the cutting track. Figure 3 A schematic diagram of a preset template image according to an embodiment of the present invention is shown. Figure 3 As shown, the preset template image includes the center of the cutting path (represented by a black dot), which can be used as a reference point. Furthermore, Figure 3 It also shows a cross-shaped white area, which is part of two mutually perpendicular cutting lines. The intersection area is the region within the rectangle indicated by the dashed line in the middle. Additionally, the preset template image may also include a region within a preset range surrounding the intersection area (which can be called a preset region), such as... Figure 3 The four gray sub-regions and two cutting paths shown are located outside the intersection region. The preset range is set such that the image features contained within the intersection region and the preset region are sufficient for the image processing algorithm to identify the location of the intersection region and the preset region from the image acquired by the image acquisition device. For example... Figure 3 As shown, the image features contained in the intersection area are not obvious and are difficult to distinguish. Therefore, they can be combined with the surrounding preset areas to form sufficiently distinguishable image features, which can help identify the positions of the intersection area and the preset areas. The main purpose is to identify the position of the intersection area and thus determine the position of the identification features. The positional features contained in the preset template image can refer to the aforementioned intersection area and preset areas.

[0042] Based on the positional features contained in the preset template image, the preset template image can be matched with any current pre-defined line image to be tested. This can be achieved by identifying a second positional feature in the pre-defined line image to be tested that matches the positional feature in the preset template image, and determining the image position of the second positional feature in the pre-defined line image to be tested as the image position of the positional feature in the preset template image in the pre-defined line image to be tested. Furthermore, based on the matching result on the current pre-defined line image to be tested, and based on the relative positional relationship between the reference point and the positional feature in the preset template image, the point in the current pre-defined line image to be tested that corresponds to the reference point in the preset template image can be determined as the current feature point corresponding to the current pre-defined line image to be tested.

[0043] According to the above technical solution, by matching the preset template image with any current pre-defined line image to be tested, the current feature points corresponding to the current pre-defined line image to be tested can be determined. This method does not require complex operations and calculations, and can accurately and efficiently obtain feature points in the pre-defined line image to be tested.

[0044] For example, the workpiece to be processed may include a first predetermined line and a second predetermined line intersecting the first predetermined line, and the intersection of the first predetermined line and the second predetermined line is used as a reference point in the preset template image.

[0045] In one embodiment, the wafer may include a first predetermined line and a second predetermined line. The first predetermined line and the second predetermined line intersect each other. The angle between the first predetermined line and the second predetermined line can be any angle, such as 45 degrees, 60 degrees, 90 degrees, etc. In a preset template image, the intersection point of the first predetermined line and the second predetermined line can be used as a reference point. For example, when the first predetermined line and the second predetermined line represent two dicing paths respectively, the center point of their intersection area can be used as a reference point.

[0046] According to the above technical solution, the intersection of the first and second predetermined lines is used as a reference point. This reference point is relatively easy to identify, and it is also easier to determine the feature points in the image of the predetermined line to be tested, which helps to improve the efficiency and accuracy of the predetermined line position correction method.

[0047] For example, in the reference position point and multiple sets of position points, each position point is the image position point of the corresponding feature point in the corresponding predetermined line image, and each image position point corresponds to a physical position point in the world coordinate system. The distance between the physical position points corresponding to the two position points in each set of position points is an integer multiple of the spacing between adjacent predetermined lines.

[0048] In one embodiment, each of the reference location point and multiple sets of location points is an image location point of the corresponding feature point in the corresponding image of the predetermined line to be tested. It can be understood that the feature point is a fixed feature on the wafer, such as the center of a dicing. The spacing between any two adjacent feature points can be consistent. As the wafer moves horizontally, the physical location point corresponding to each feature point changes. For the first set of images of the predetermined line to be tested, the first location point A1 and the second location point A2 can respectively correspond to the image location points of the feature points in the two images of the predetermined line to be tested. For example, the first location point A1 can correspond to the image location point of the feature point in the image of the predetermined line to be tested in which it is located. Each image location point corresponds to a physical location point in the world coordinate system. The distance between the physical location points corresponding to the two location points in each set of location points can be an integer multiple of the spacing between adjacent predetermined lines. (Refer to...) Figure 2Assume the distance between any two vertical kerfs is L, and the distance between the physical locations corresponding to the first position point A1 and the second position point A2 is an integer multiple of L, such as 2L, 3L, etc. For example, in the process of moving the wafer horizontally to obtain images of different predetermined test lines, the wafer displacement can be made an integer multiple of L each time, and the current image of the predetermined test line can be acquired each time the movement stops. Moving the wafer in this way can ensure that the next kerf (which is an integer multiple of L from the current kerf) can also appear within the image acquisition range of the image acquisition device as much as possible. Since the kerf itself may be tilted relative to the horizontal direction, if the wafer is moved by other non-integer multiples of the displacement, the next kerf may not appear within the image acquisition range of the image acquisition device.

[0049] According to the above technical solution, the distance between the physical location points corresponding to the two location points in each group of multiple location points is an integer multiple of the distance between adjacent predetermined lines. This can better ensure that each group of predetermined line images to be tested can contain the first location point and the second location point, so as to facilitate the correction of the predetermined line.

[0050] For example, before determining multiple sets of position points based on multiple sets of images of the predetermined line to be tested and based on reference position points, the method may further include: acquiring a preset template image, wherein the preset template image contains position features associated with the predetermined line and reference points; matching the preset template image with an initial predetermined line image based on the position features contained in the preset template image, the initial predetermined line image being an image acquired by the image acquisition device for the predetermined line when the workpiece is in an initial position; determining the points in the initial predetermined line image corresponding to the reference points in the preset template image as initial feature points based on the matching result; adjusting the relative position between the image acquisition device and the workpiece based on the deviation between the image position of the initial feature points in the initial predetermined line image and the image center of the initial predetermined line image, so that the initial feature points are aligned with the field of view center of the image acquisition device; and determining the position point corresponding to the aligned initial feature points as reference position points.

[0051] In one embodiment, the method for obtaining a preset template image has been described in detail above and will not be repeated here for brevity. For example, when the wafer is in its initial position, the image acquisition device can acquire an image of a predetermined line on the wafer, which serves as the initial predetermined line image. Based on the kerf intersection area contained in the preset template image, the preset template image and the initial predetermined line image can be matched in a manner similar to that described above. Based on the matching result, a point in the initial predetermined line image corresponding to a reference point in the preset template image can be obtained. This point can serve as an initial feature point. Subsequently, based on the deviation between the image position of the initial feature point in the initial predetermined line image and the image center of the initial predetermined line image, the relative position between the image acquisition device and the wafer can be adjusted, for example, by moving the wafer, so that the initial feature point is aligned with the field of view center of the image acquisition device. The position point corresponding to the aligned initial feature point is taken as the reference position point. The above-described operation of adjusting the relative position between the image acquisition device and the wafer based on the deviation to align the initial feature point with the field of view center of the image acquisition device is optional; if necessary, the position point corresponding to the initial feature point can also be directly used as the reference position point.

[0052] According to the above technical solution, the relative position between the image acquisition device and the workpiece is adjusted by measuring the deviation between the image position of the initial feature point in the initial predetermined line image and the image center of the initial predetermined line image, so that the initial feature point is aligned with the field of view center of the image acquisition device. This helps to accurately locate the reference position point, and thus also helps to improve the positioning accuracy of other subsequent position points.

[0053] For example, in the reference position point and multiple sets of position points, each position point is the image position point of the corresponding feature point in the corresponding predetermined line image. Each image position point corresponds to a physical position point in the world coordinate system. Based on multiple sets of predetermined line images to be measured, and based on the reference position point, multiple sets of position points are determined sequentially. For each set of position points in the multiple sets of position points, it may include: using the physical position point corresponding to the reference position point as the center, controlling the workpiece to be processed to move along the first direction axis to the first physical position and acquiring the first predetermined line image to be measured after the movement, and controlling the workpiece to be processed to move along the second direction axis opposite to the first direction axis to the second physical position and acquiring the second predetermined line image to be measured after the movement; based on the first predetermined line image to be measured and the second predetermined line image to be measured, determining the first position point and the second position point of the set of position points; wherein, the first direction axis and the second direction axis are axes in the preset reference direction, the first physical position is the physical position point corresponding to the first position point in the set of position points, and the second physical position is the physical position point corresponding to the second position point in the set of position points.

[0054] In one embodiment, each set of location points may include the following operations: Centered on the physical location point corresponding to the reference location point, the direction to the right along the horizontal direction can be represented by a first direction axis (e.g., the X+ axis); the direction to the left along the horizontal direction can be represented by a second direction axis (e.g., the X- axis). After the movable stage carrying the wafer moves to the first physical position along the X+ axis, an image acquisition device can be used to acquire a first image of a predetermined test line on the wafer at the first physical position. Then, the movable stage is controlled to move to a second physical position along the X- axis, and the image acquisition device is used to acquire a second image of a predetermined test line on the wafer at the second physical position.

[0055] Based on the acquired first and second pre-determined line images, the centers of the cutting paths in the first and second pre-determined line images can be determined as a first physical location point and a second physical location point, respectively. The first physical location point is the physical location point corresponding to the first physical location point in the set of location points, and the second physical location point is the physical location point corresponding to the second physical location point in the set of location points.

[0056] According to the above technical solution, the workpiece is controlled to move to both sides along a preset reference direction and images of the first and second predetermined lines to be measured are acquired. Then, based on the first and second predetermined lines to be measured, the first and second position points of the set of position points are determined. This method is simple to operate, therefore highly efficient, and also facilitates accurate determination of the deviation of the predetermined line relative to the preset reference direction.

[0057] For example, adjusting the position of the workpiece to correct the position of a predetermined line on the workpiece based on the angle of the line connecting the first and second position points in the set of position points relative to a preset reference direction may include: performing the following correction operation: if the line angle is greater than a preset angle threshold, determining a corresponding adjustment angle based on the line angle, and adjusting the position of the workpiece based on the adjustment angle to correct the position of the predetermined line on the workpiece; if the line angle is less than or equal to the preset angle threshold, stopping the correction; wherein, after the step of determining the corresponding adjustment angle based on the line angle and adjusting the position of the workpiece based on the adjustment angle when the line angle is greater than the preset angle threshold, the step of determining the next set of position points is performed, wherein, along the preset reference direction, the distance between two position points in the next set of position points is greater than the distance between two position points in the current set of position points.

[0058] In one embodiment, a user can preset an angle threshold to determine whether a predetermined line needs correction. The preset angle threshold can be any angle greater than 0. Exemplarily, but not limitingly, the preset angle threshold can be in the range of [0.001, 0.2] degrees, such as 0.1 degrees, 0.03 degrees, 0.006 degrees, or 0.002 degrees. Correcting the position of a predetermined line on the wafer can include the following correction operation. If the angle between the line connecting the first position point A1 and the second position point A2 is 0.7 degrees, which is greater than the preset angle threshold of 0.002 degrees, then the wafer needs to be rotated at an angle opposite to the tilt direction of the line connecting the first position point A1 and the second position point A2 so that the line coincides with the horizontal direction. Then, a second set of images of the predetermined line to be tested is obtained. For the first position point B1 and the second position point B2 in the second set of images of the predetermined line to be tested, it is determined whether the angle between the line connecting the first position point B1 and the second position point B2 is greater than the preset angle threshold of 0.002 degrees in a manner similar to that described above. If it is greater, a correction operation is performed. After performing the above correction operations sequentially, the correction stops when the angle between the first and second position points in a certain group of pre-defined line images is less than or equal to a preset angle threshold of 0.002. It should be noted that the distance between two position points in the next group (e.g., B1B2) is greater than the distance between two position points in the current group (e.g., A1A2).

[0059] According to the above technical solution, by performing the above correction operations in sequence, the position of the predetermined line can be corrected repeatedly. This repeated correction method helps to improve the correction accuracy.

[0060] For example, the method may further include: outputting a user interface; receiving a preset angle threshold and a correction count threshold set by the user on the user interface; and outputting an alarm message when the number of correction operations reaches the correction count threshold and the angle of the line corresponding to the current group position point is greater than the preset angle threshold.

[0061] Users can input any user input information described herein, such as a preset angle threshold, a correction count threshold, etc., into the device (e.g., a host computer system) used to perform the predetermined line position correction method 100 for a workpiece. The input device may include, but is not limited to, one or more of the following: mouse, keyboard, touchscreen, and microphone. In one embodiment, a user interface can be displayed on a display device. Users can interact with operable controls in the user interface using a mouse, keyboard, etc., to input the aforementioned user input information. For example, users can set a preset angle threshold and a correction count threshold within the user interface using information input controls and operable controls. For example, the user interface contains two lines of information; the first line is the preset angle threshold. The user clicks the information input box to the right of the preset angle threshold, enters "0.002", and clicks the "Confirm" control. This indicates that the user has completed setting the preset angle threshold. Similarly, the second line can be the correction count threshold. The correction count threshold can be set to any integer greater than 0. For example, it can be equal to 3, 4, 6, etc. The user clicks the information input box to the right of the correction count threshold, enters "4", and clicks the "Confirm" control. This indicates that the user has completed setting the correction count threshold. If the calibration operation has been performed four times, and the angle of the line connecting the current group's position points is still greater than the preset angle threshold of 0.002 degrees, an alarm message may optionally be output to prompt the user to adjust the position of the workpiece or take other countermeasures in a timely manner. Optionally, the aforementioned preset angle threshold and / or calibration count threshold may also be preset fixed values.

[0062] According to the above technical solution, users can set preset angle thresholds and correction count thresholds through the user interface. This allows users to control the execution of correction operations according to their own needs, thereby meeting their diverse and personalized requirements.

[0063] For example, the conversion relationship described above can be determined in the following way: acquiring multiple test images, which are images acquired by an image acquisition device for the workpiece when it is in multiple different third physical positions, and the number of multiple test images is greater than or equal to 3; for each test image, determining the image position of the identification feature in the test image based on the template image; and determining the conversion relationship based on the image position of the identification feature in the multiple test images and the multiple third physical positions.

[0064] For example, the template image can be an image containing any identifying features on the workpiece to be processed. The identifying features can be any identifiable feature on the workpiece to be processed. For example, the identifying features can be features inherent to the workpiece itself, such as features of certain shapes or structures. For example, the identifying features can also be features additionally marked on the workpiece by hand or by a processing device, such as some easily identifiable symbol, pattern, etc. The identifying features can be of any shape, such as a circle, cross, or star. Preferably, the identifying feature is the center of the cutting track.

[0065] In one embodiment, the number of multiple images to be tested is greater than or equal to three. Exemplarily, but not limitingly, the number of multiple images to be tested is greater than or equal to three and less than or equal to nine. For example, there are a total of nine images to be tested. These nine images can be images acquired by the image acquisition device for the workpiece when it is in nine different third physical positions. The nine different third physical positions K1, K2, ..., K9 can be arbitrary.

[0066] For each of the nine test images, the image position of the identifier feature in the test image can be determined based on the acquired template image. Determining the image position of the identifier feature in the test image based on the template image can be achieved as follows: identify a second identifier feature in the test image that matches the identifier feature in the template image, and determine the image position of the second identifier feature in the test image as the image position of the identifier feature in the test image.

[0067] Based on the identification features at the image positions F1, F2, ..., F9 in the nine test images and their corresponding nine third physical positions K1, K2, ..., K9, a mapping relationship (X) between the coordinates corresponding to the image positions and the coordinates corresponding to the physical positions can be established. K ,Y K )=f(w)(x F ,y F ). (X) K ,Y K (x) represents each third physical location, F ,y F The coordinates () represent the positions of each image. Using the nine determined coordinate points, the f(w) matrix can be calculated, thus determining the transformation relationship between each image position and its corresponding third physical position. Based on this transformation relationship, the transformation relationship between any image position and its corresponding physical position can be determined.

[0068] According to the above technical solution, the transformation relationship can be determined based on the image locations of the identification features in multiple images to be tested, as well as multiple third physical locations of the identification features. This method determines the transformation relationship through multiple image locations and multiple third physical locations; the algorithm is simple and easy to implement.

[0069] According to another aspect of the present invention, a device for correcting the position of a predetermined line of a workpiece is also provided. Figure 4 A schematic flowchart of a predetermined line position correction device 400 for a workpiece according to an embodiment of the present invention is shown, such as... Figure 4 As shown, the device 400 may include an acquisition module 410, a determination module 420, and a correction module 430.

[0070] The acquisition module 410 is used to acquire multiple sets of images of the predetermined lines to be tested, each set of images of the predetermined lines to be tested being images acquired by the image acquisition device for the predetermined lines on the workpiece as the workpiece moves along a preset reference direction.

[0071] The determining module 420 is used to determine multiple sets of position points based on multiple sets of images of the predetermined line to be tested and based on reference position points. Each set of position points includes a first position point and a second position point. The first position point and the second position point are located on both sides of the reference position point. Along the preset reference direction, the distance between the two position points contained in each set of position points gradually increases. The multiple sets of images of the predetermined line to be tested correspond one-to-one with the multiple sets of position points. Any set of images of the predetermined line to be tested includes two images of the predetermined line to be tested that correspond to the first position point and the second position point in the corresponding set of position points, respectively. Among the reference position points and the multiple sets of position points, different position points are position points corresponding to different feature points on the predetermined line.

[0072] The correction module 430 is used to adjust the position of the workpiece to be processed according to the angle of the line connecting the first position point and the second position point in the set of position points relative to the preset reference direction after each set of position points is determined, so as to correct the position of the predetermined line on the workpiece.

[0073] According to another aspect of the present invention, an electronic device is also provided. Figure 5 A schematic block diagram of an electronic device 500 according to an embodiment of the present invention is shown, such as... Figure 5 As shown, the electronic device 500 may include a processor 510 and a memory 520. The memory 520 stores a computer program, and the processor 510 executes the computer program to implement the aforementioned method for correcting the predetermined line position of the workpiece.

[0074] According to another aspect of the present invention, a storage medium is also provided. Program instructions are stored on the storage medium, which, when executed, perform the aforementioned method for correcting the predetermined line position of a workpiece. The storage medium may, for example, include a storage component of a tablet computer, a hard disk of a personal computer, a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a portable compact disc read-only memory (CD-ROM), a USB memory, or any combination of the above storage media. The computer-readable storage medium may be any combination of one or more computer-readable storage media.

[0075] Those skilled in the art can understand the specific implementation scheme and beneficial effects of the above-mentioned predetermined line position correction device, electronic device and storage medium for the workpiece by reading the relevant description of the predetermined line position correction method for the workpiece. For the sake of brevity, they will not be described in detail here.

[0076] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of the invention. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of the invention. All such changes and modifications are intended to be included within the scope of the invention as claimed in the appended claims.

[0077] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0078] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed.

[0079] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0080] Similarly, it should be understood that, in order to streamline the invention and aid in understanding one or more of the various aspects of the invention, features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention. However, this approach should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, its inventive point lies in solving the corresponding technical problem with fewer features than all of those in a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of the invention.

[0081] Those skilled in the art will understand that, apart from the mutual exclusion of features, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus so disclosed can be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0082] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0083] The various component embodiments of the present invention can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that microprocessors or digital signal processors (DSPs) can be used in practice to implement some or all of the functions of some modules in the predetermined line position correction device for a workpiece according to embodiments of the present invention. The present invention can also be implemented as an apparatus program (e.g., a computer program and computer program product) for performing part or all of the methods described herein. Such programs implementing the present invention can be stored on a computer-readable medium or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0084] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0085] The above description is merely a specific embodiment of the present invention or an explanation of that embodiment. The scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for correcting the position of a predetermined line on a workpiece, wherein the predetermined line is a feature line on the workpiece, characterized in that, include: Acquire multiple sets of images of the predetermined line to be tested, each set of images of the predetermined line to be tested being an image acquired by the image acquisition device for the predetermined line on the workpiece to be processed when the workpiece to be processed moves along a preset reference direction; Based on the multiple sets of images of the predetermined line to be tested, and based on the reference position points, multiple sets of position points are sequentially determined. The reference position points are the position points corresponding to the initial feature points. The initial feature points are the feature points in the image acquired for the predetermined line when the workpiece is in the initial position, corresponding to the reference points of the preset template reference image. Each set of position points includes a first position point and a second position point. The first position point and the second position point are located on both sides of the reference position point along the preset reference direction. Along the preset reference direction, the distance between the two position points contained in each of the multiple sets of position points gradually increases. The multiple sets of images of the predetermined line to be tested correspond one-to-one with the multiple sets of position points. Any set of images of the predetermined line to be tested includes two images of the predetermined line to be tested that correspond to the first position point and the second position point in the corresponding set of position points, respectively. After determining a set of position points each time, the position of the workpiece to be processed is adjusted according to the angle of the line connecting the first and second position points in the set of position points relative to the preset reference direction, so as to correct the position of the predetermined line on the workpiece to be processed. Among the reference position point and the multiple sets of position points, the different position points are the position points corresponding to different feature points on the predetermined line, and the feature points are fixed features on the workpiece to be processed.

2. The method according to claim 1, characterized in that, The step of determining multiple sets of position points based on the multiple sets of pre-defined lines to be tested and based on the reference position points includes: Obtain a preset template image, wherein the preset template image contains positional features and reference points associated with the predetermined line; Based on the positional features contained in the preset template image, the preset template image is matched with any current pre-defined line image to be tested; Based on the matching results, the points in the current pre-defined line image to be tested that correspond to the reference points in the preset template image are determined as the current feature points corresponding to the current pre-defined line image to be tested.

3. The method according to claim 2, characterized in that, The workpiece to be processed includes a first predetermined line and a second predetermined line intersecting the first predetermined line. In the preset template image, the intersection of the first predetermined line and the second predetermined line is used as the reference point.

4. The method according to any one of claims 1-3, characterized in that, In the reference location point and the multiple sets of location points, each location point is the image location of the corresponding feature point in the image of the predetermined line to be measured, and each image location point corresponds to a physical location point in the world coordinate system. The distance between the physical location points corresponding to the two location points in each of the multiple sets of location points is an integer multiple of the spacing between adjacent predetermined lines.

5. The method according to any one of claims 1-3, characterized in that, Before determining multiple sets of position points based on the multiple sets of pre-defined lines to be tested and the reference position points, the method further includes: Obtain a preset template image, wherein the preset template image contains positional features and reference points associated with the predetermined line; Based on the positional features contained in the preset template image, the preset template image is matched with the initial predetermined line image, wherein the initial predetermined line image is an image acquired by the image acquisition device for the predetermined line when the workpiece is in the initial position; Based on the matching results, the points in the initial pre-defined line image that correspond to the reference points in the preset template image are determined as initial feature points; Based on the deviation between the image position of the initial feature point in the initial predetermined line image and the image center of the initial predetermined line image, the relative position between the image acquisition device and the workpiece to be processed is adjusted so that the initial feature point is aligned with the field of view center of the image acquisition device; The position point corresponding to the initial feature point after alignment is determined as the reference position point.

6. The method according to any one of claims 1-3, characterized in that, In the reference position point and the multiple sets of position points, each position point is the image position point of the corresponding feature point in the corresponding predetermined line image, and each image position point corresponds to a physical position point in the world coordinate system. The step of determining the multiple sets of position points based on the multiple sets of predetermined line images to be measured and sequentially corresponding to the reference position point includes: For each of the multiple sets of location points Centered on the physical position point corresponding to the reference position point, the workpiece to be processed is controlled to move along the first direction axis to the first physical position and the first predetermined line image to be measured is acquired after the movement. The workpiece to be processed is then controlled to move along the second direction axis opposite to the first direction axis to the second physical position and the second predetermined line image to be measured is acquired after the movement. Based on the first image of the pre-defined line to be tested and the second image of the pre-defined line to be tested, determine the first and second position points of the set of position points; Wherein, the first direction axis and the second direction axis are axes in the preset reference direction, the first physical position is the physical position point corresponding to the first position point in the group of position points, and the second physical position is the physical position point corresponding to the second position point in the group of position points.

7. The method according to any one of claims 1-3, characterized in that, The step of adjusting the position of the workpiece to be processed based on the angle of the line connecting the first and second position points in the set of position points relative to the preset reference direction, in order to correct the position of the predetermined line on the workpiece, includes performing the following correction operations: If the angle of the connecting line is greater than a preset angle threshold, a corresponding adjustment angle is determined based on the connecting line angle, and the position of the workpiece to be processed is adjusted based on the adjustment angle to correct the position of the predetermined line on the workpiece to be processed. If the angle of the connection line is less than or equal to the preset angle threshold, the correction shall be stopped. Wherein, when the connecting angle is greater than the preset angle threshold, after the step of determining the corresponding adjustment angle based on the connecting angle and adjusting the position of the workpiece to be processed based on the adjustment angle, the step of determining the next set of position points is executed, wherein, along the preset reference direction, the distance between two position points in the next set of position points is greater than the distance between two position points in the current set of position points.

8. The method according to claim 7, characterized in that, The method further includes: Output user interface; Receive the preset angle threshold and correction count threshold set by the user on the user interface; If the number of times the correction operation is performed reaches the correction count threshold, and the angle of the line corresponding to the current group position point is greater than the preset angle threshold, an alarm message is output.

9. A device for correcting the position of a predetermined line on a workpiece, comprising: The acquisition module is used to acquire multiple sets of images of the predetermined line to be tested, each set of images of the predetermined line to be tested being an image acquired by the image acquisition device for the predetermined line on the workpiece to be processed when the workpiece to be processed moves along a preset reference direction. The determining module is used to determine multiple sets of position points based on the multiple sets of images of the predetermined line to be tested and based on reference position points in sequence. The reference position points are position points corresponding to initial feature points. The initial feature points are feature points in the image acquired for the predetermined line when the workpiece is in the initial position, corresponding to reference points of a preset template reference image. Each set of position points includes a first position point and a second position point. The first position point and the second position point are located on both sides of the reference position point along the preset reference direction. Along the preset reference direction, the distance between the two position points contained in each of the multiple sets of position points gradually increases. The multiple sets of images of the predetermined line to be tested correspond one-to-one with the multiple sets of position points. Any set of images of the predetermined line to be tested includes two images of the predetermined line to be tested that correspond to the first position point and the second position point in the corresponding set of position points, respectively. The correction module is used to adjust the position of the workpiece to be processed according to the angle of the line connecting the first and second position points in the set of position points relative to the preset reference direction after each set of position points is determined, so as to correct the position of the predetermined line on the workpiece to be processed. Among the reference position point and the multiple sets of position points, the different position points are the position points corresponding to different feature points on the predetermined line, and the feature points are fixed features on the workpiece to be processed.

10. An electronic device comprising a processor and a memory, wherein, The memory stores computer program instructions, which, when executed by the processor, are used to perform the predetermined line position correction method for the workpiece as described in any one of claims 1 to 8.

11. A storage medium on which program instructions are stored, wherein, The program instructions, when executed, are used to perform the predetermined line position correction method for the workpiece as described in any one of claims 1 to 8.

Images