Wafer transmission device in epitaxial equipment

Abstract

The present invention discloses a transmission device for wafers in epitaxial equipment, comprising a base, a lifting module, a rotation module and an adjustment module. The frame in the adjustment module is used to carry all components of the transmission device, and the frame is used as a support. The adjustment component adjusts the position of the base on the X-axis and the Y-axis and the horizontality of the base by adjusting the base of the lifting module. The lifting shaft and the ejector pin of the lifting module realize the lifting and lowering of the wafer. The overall lifting drive block of the lifting module is supported by the base to realize the overall lifting and lowering of the rotation module. The rotating shaft of the rotation module drives the base to realize stable self-rotation. The transmission device for wafers in the epitaxial equipment provided by the present invention can keep the wafer on the base relatively horizontal and continuously and stably rotate, so as to ensure that the wafer is evenly exposed to the heat field and the process gas flow field during the epitaxial process, which helps to improve the quality of the chip epitaxial layer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer transmission device in epitaxial equipment. Background Art

[0002] With the rapid rise of industries such as smart manufacturing and electronic devices, and the advancement of semiconductor technology, the demand for chips is growing, while the requirements for chip cost and quality are becoming more stringent. Silicon epitaxial applications are also pursuing the processing of larger diameter silicon wafers and more uniform epitaxial layer thicknesses, which in turn places higher demands on large-diameter silicon epitaxial equipment. The uniformity of epitaxial layer thickness is not only related to the distribution and concentration of the process gas source, but also to the movement and relative levelness of the substrate during the epitaxial growth process. If the substrate and the process gas flow field form a certain angle, the epitaxial layer will inevitably become uneven, increasing the defect rate. Furthermore, a large-diameter substrate makes it more difficult to adjust the relative level of the substrate. Therefore, maintaining the substrate relatively horizontal and continuously and stably rotating to ensure that the substrate passively receives a uniform thermal field and process gas flow field during the epitaxial growth process is crucial to ensuring epitaxial layer quality and improving chip yield. Summary of the Invention

[0003] The present invention aims to at least partially address one of the technical problems in the related art. To this end, an embodiment of the present invention provides a wafer transmission device in an epitaxial growth device that can perform three functions: susceptor leveling, substrate lifting and lowering, and substrate rotation, with high adjustment accuracy.

[0004] The transmission device of the wafer in the epitaxial equipment of the embodiment of the present invention includes: a base, the base is used to carry the wafer, and the base is provided with a plurality of through holes; a lifting module, the lifting module includes a base, a wafer lifting assembly, and an overall lifting assembly, the wafer lifting assembly and the overall lifting assembly are both arranged on the base, the wafer lifting assembly includes a lifting shaft extending in the vertical direction and a plurality of ejector pins arranged at the top end of the lifting shaft, the lifting shaft is movably arranged in the vertical direction, and the plurality of ejector pins pass through the plurality of through holes from bottom to top in a one-to-one correspondence and abut against the bottom of the wafer for lifting the wafer, the overall lifting assembly includes an overall lifting drive block movably arranged in the vertical direction; a rotating module, the overall lifting drive block is connected to the rotating module for lifting the rotating module The rotating module includes a rotating shaft, a dynamic sealing assembly, and a bellows assembly. The top end of the bellows assembly is sealed and connected to the reaction chamber, and the bottom end of the bellows assembly is connected to the dynamic sealing assembly. The rotating shaft passes through the dynamic sealing assembly and the bellows assembly from bottom to top in sequence, and the top end of the rotating shaft and the base are circumferentially limited to drive the base to rotate around the central axis of the rotating shaft, and the rotating shaft is coaxial with the lifting shaft; an adjustment module, the adjustment module includes a frame and an adjustment assembly, the frame is used to be connected to the reaction chamber, the adjustment assembly is arranged on the frame and connected to the base, the adjustment assembly is used to adjust the position of the base along the X-axis direction and the Y-axis direction, and is also used to adjust the horizontality of the base, wherein the X-axis and the Y-axis are both horizontal and perpendicular to each other.

[0005] The frame in the adjustment module of the transmission device of the wafer in the epitaxial equipment provided by the embodiment of the present invention is used to carry all the components of the transmission device, with the frame as the support, and the adjustment component adjusts the position of the base on the X-axis and Y-axis and the horizontality of the base by adjusting the base of the lifting module. During the reaction, the base is located in the reaction chamber, and the lifting shaft of the wafer lifting assembly pushes out the ejector pin, and the top of the ejector pin is higher than the upper surface of the base. The wafer transfer assembly places the wafer on the ejector pin, and the lifting shaft drives the ejector pin down until the wafer falls on the base; after the reaction, the ejector pin passes through the through hole to lift the wafer off the base, and the wafer transfer assembly takes the wafer away. The overall lifting drive block of the lifting module is supported by the base to achieve the overall lifting of the rotation module.

[0006] The rotating shaft of the rotating module drives the base for stable rotation. The bellows assembly introduces purified gas into the lower tube of the reaction chamber, preventing the reaction gas from flowing into the lower tube and the area below it, thereby preventing gas reaction and deposition in the lower tube and the area below it. The dynamic seal assembly provides a rotary seal on the rotating shaft, preventing gas leakage from the bellows assembly at the connection between the rotating shaft and the bellows assembly.

[0007] The wafer transmission device in the epitaxial device provided by the embodiment of the present invention can keep the wafer on the base relatively horizontal and rotate continuously and stably to ensure that the wafer is evenly exposed to the heat field and process gas flow field during the epitaxial process, which helps to improve the quality of the epitaxial layer.

[0008] In some embodiments, the adjustment component includes a base plate, a horizontal adjustment component, an X-axis adjustment component and a Y-axis adjustment component. The horizontal adjustment component is arranged on the frame and is used to adjust the horizontality of the base plate. The X-axis adjustment component is arranged on the base plate and adjusts the position of the Y-axis adjustment component along the X-axis with the base plate as support. The Y-axis adjustment component adjusts its own position along the Y-axis with the X-axis adjustment component as support, and the Y-axis adjustment component is connected to the base.

[0009] In some embodiments, the horizontal adjustment assembly includes a plurality of wedge-shaped adjustment blocks, each of which is movably arranged on the frame along its horizontal direction. The top surface of the wedge-shaped adjustment block is an inclined surface, and the bottom plate abuts against the top surface of the wedge-shaped adjustment block. The height of the wedge-shaped adjustment block embedded in the bottom plate is adjusted by adjusting the relative position of the wedge-shaped adjustment block. The plurality of wedge-shaped adjustment blocks are arranged at intervals along the circumference to adjust the horizontality of the bottom plate, and there are at least three wedge-shaped adjustment blocks.

[0010] and / or,

[0011] The X-axis adjustment assembly includes an X-axis connecting rod, an X-axis driving block, an X-axis adjusting block, an X-axis adjusting plate, and an X-axis adjusting pin. The Y-axis adjustment assembly includes a Y-axis connecting rod, a Y-axis driving block, a Y-axis adjusting block, a Y-axis adjusting plate, and a Y-axis adjusting pin. The Y-axis adjusting plate is fixed to the base.

[0012] The X-axis adjustment plate is arranged on one side of the base plate and is parallel to the base plate, the X-axis connecting rod is rotatably connected to the base plate and is parallel to the base plate, the X-axis adjustment block is swingably connected to the base plate, the X-axis driving block is rotatably connected to one end of the X-axis adjustment block that swings, the X-axis driving block is threadedly engaged with the X-axis connecting rod and moves along the X-axis connecting rod as the X-axis connecting rod rotates, the X-axis adjusting pin is connected to the other end of the X-axis adjustment block that swings, the X-axis adjustment plate is provided with a first waist-shaped hole extending along the Y-axis, a part of the X-axis adjusting pin extends into the first waist-shaped hole, under the drive of the X-axis connecting rod, the X-axis adjustment block swings and toggles the X-axis adjustment plate along the X-axis through the X-axis adjusting pin;

[0013] The Y-axis adjustment plate is parallel to the X-axis adjustment plate and the two are connected so as to be movable relative to each other along the Y-axis. The Y-axis connecting rod is rotatably connected to the Y-axis adjustment plate and is parallel to the base plate. The Y-axis adjustment block is swingably connected to the Y-axis adjustment plate. The Y-axis driving block is rotatably connected to one end of the Y-axis adjustment block that swings. The Y-axis driving block is threadedly engaged with the Y-axis connecting rod and moves along the Y-axis connecting rod as the Y-axis connecting rod rotates. The Y-axis adjusting pin is connected to the other end of the Y-axis adjustment block that swings. The X-axis adjustment plate is provided with a second waist-shaped hole extending along the X-axis, and a part of the Y-axis adjusting pin extends into the second waist-shaped hole. Under the drive of the Y-axis connecting rod, the Y-axis adjustment block swings and uses the Y-axis adjusting pin as a support to move the Y-axis adjustment plate relative to the X-axis adjustment plate along the Y-axis.

[0014] In some embodiments, the wafer lifting assembly also includes a first driving mechanism, a first screw, a first slider, and a lifting shaft driving block. The first driving mechanism is fixed on the base to drive the first screw to rotate. The first screw extends in a vertical direction. The first slider cooperates with the first screw thread and moves up and down with the rotation of the first screw. The lifting shaft driving block and the first slider are fixed to each other, and the lifting shaft and the lifting shaft driving block are fixed to each other.

[0015] In some embodiments, the lifting shaft is sleeved with the rotating shaft, the bellows assembly includes a first bellows and a second bellows, and the wafer lifting assembly also includes a bellows separation mounting block and a lifting shaft fixing block. The bellows separation mounting block and the lifting shaft driving block are fixed to each other. The bellows separation mounting block is annular, the bottom end of the first bellows is sealed with the top end of the bellows separation mounting block, and the top end of the second bellows is sealed with the bottom end of the bellows separation mounting block. The lifting shaft fixing block is located on the inner side of the bellows separation mounting block and is fixed to the bellows separation mounting block. The lifting shaft fixing block is sleeved with the lifting shaft and fixed to the lifting shaft.

[0016] In some embodiments, the integral lifting assembly includes a second driving mechanism, a second screw rod and a second slider. The second driving mechanism is fixed on the base for driving the second screw rod to rotate. The second screw rod extends in a vertical direction. The second slider is threaded with the second screw rod and moves up and down with the rotation of the second screw rod. The integral lifting drive block and the second slider are fixed to each other.

[0017] In some embodiments, the rotation module includes a mounting frame, a rotating motor, a rotating transition piece, a meshing driving gear and a driven gear, the integral lifting drive block is connected to the mounting frame, the rotating motor is arranged on the mounting frame, and drives the driven gear to rotate by driving the driving gear, the rotating transition piece is sleeved on the rotating shaft and is circumferentially fixed to the rotating shaft, the driven gear drives the rotating shaft to rotate through the rotating transition piece, the dynamic sealing assembly is a magnetic fluid sealing assembly, the magnetic fluid sealing assembly is arranged on the mounting frame and has a rotatable inner ring, a part of the rotating transition piece is fitted inside the inner ring and is circumferentially fixed to the inner ring.

[0018] In some embodiments, the rotation module also includes a sensor assembly, which includes a sensor sheet metal, a first sensor paddle, and a first photoelectric sensor. The sensor sheet metal is installed on the mounting frame, the first photoelectric sensor is installed on the sensor sheet metal, the first sensor paddle rotates with the driven gear, and the first photoelectric sensor is used to record the number of times the first sensor paddle passes to feedback the rotational speed of the rotating shaft.

[0019] In some embodiments, the bellows assembly includes a bellows, a bellows-cavity connector, a cavity connector, a horizontal support plate, and a vertical support plate. The bellows-cavity connector is connected to the top end of the bellows, and the bellows-cavity connector is used to be connected to the reaction chamber. The bellows-cavity connector is adjustably connected to the horizontal support plate along the X-axis, the horizontal support plate is adjustably connected to the vertical support plate along the Y-axis, and the vertical support plate is adjustably connected to the base in the vertical direction.

[0020] In some embodiments, the lifting module also includes a connector lifting assembly, which includes a third driving mechanism, a third screw rod and a third slider. The third driving mechanism drives the third screw rod to rotate, and the third screw rod extends in a vertical direction. The third slider is threaded with the third screw rod and moves up and down with the rotation of the third screw rod. The third slider is fixed to the vertical support plate or the base.

[0021] In some embodiments, the vertical support plate is provided with one of a first slide rail and a first slide groove, and the horizontal support plate is provided with the other of a first slide rail and the first slide groove, both of the first slide rail and the first slide groove extend in the Y-axis direction, and the first slide rail is engaged in the first slide groove and can slide along the first slide groove; and / or, the horizontal support plate is provided with one of a second slide rail and the second slide groove, and the bellows-cavity connector is provided with the other of a second slide rail and the second slide groove, both of the second slide rail and the second slide groove extend in the X-axis direction, and the second slide rail is engaged in the second slide groove and can slide along the second slide groove.

[0022] In some embodiments, the transmission device also includes a temperature measuring module, which includes a thermocouple and a thermocouple mounting tool. The thermocouple is inserted into the rotating shaft and rotates synchronously with the rotating shaft. The top temperature measuring head is against the bottom of the base, and the bottom end passes through the rotating transition piece and extends downward. The thermocouple mounting tool includes a rotating clip assembly and a spring. The rotating clip assembly is clamped to the bottom end of the thermocouple, and the spring assembly is arranged on the rotating clip assembly. The spring applies an upward force to the thermocouple with the support of the rotating clip assembly.

[0023] In some embodiments, the thermocouple installation tool further includes a thermocouple vertical adjustment assembly, which acts on the rotary buckle assembly to adjust the position of the rotary buckle assembly in the vertical direction to adjust the position of the thermocouple in the vertical direction;

[0024] The thermocouple installation tool also includes a dial indicator, the measuring needle of the dial indicator is against the rotating buckle assembly, and is used to measure the relative displacement of the thermocouple in the vertical direction.

[0025] In some embodiments, the transmission device also includes a slip ring assembly, which includes a first gear, a second gear, a third gear, and a stepped shaft. The first gear is connected to the rotating motor, the top end of the stepped shaft is connected to the first gear, the bottom end of the stepped shaft is connected to the second gear, the third gear is meshed with the second gear, the third gear rotates synchronously with the thermocouple, and other components connected to the thermocouple are arranged on the top of the third gear and rotate with it.

[0026] In some embodiments, the lifting module also includes three second photoelectric sensors, which are arranged on the base at intervals in the vertical direction, and at least the second photoelectric sensor located in the middle is adjustable in the vertical direction. The wafer lifting assembly also includes a second sensor paddle that rises and falls with the lifting shaft, and the second sensor paddle corresponds to each second photoelectric sensor in the vertical direction so that the second photoelectric sensor can sense the position of the second sensor paddle. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the wafer transmission device provided by an embodiment of the present invention.

[0028] Figure 2 It is a bottom view of the base provided by an embodiment of the present invention.

[0029] Figure 3 It is a top view of the base provided by an embodiment of the present invention.

[0030] Figure 4 This is a schematic diagram of the structure of the adjustment module provided in an embodiment of the present invention. Figure 1 .

[0031] Figure 5 This is a schematic diagram of the structure of the adjustment module provided in an embodiment of the present invention. Figure 2 .

[0032] Figure 6 yes Figure 4 Enlarged schematic diagram of point A in the middle.

[0033] Figure 7 This is a schematic diagram of the structure of the lifting module provided by the embodiment of the present invention. Figure 1 .

[0034] Figure 8 This is a schematic diagram of the structure of the lifting module provided by the embodiment of the present invention. Figure 2 .

[0035] Figure 9 It is a cross-sectional view of a lifting module provided in an embodiment of the present invention.

[0036] Figure 10 This is a partial schematic diagram of the lifting module provided by the embodiment of the present invention. Figure 1 .

[0037] Figure 11 This is a partial schematic diagram of the lifting module provided by the embodiment of the present invention. Figure 2 .

[0038] Figure 12 This is a partial schematic diagram of the lifting module provided by the embodiment of the present invention. Figure 3 .

[0039] Figure 13 is a cross-sectional view of a rotation module provided by an embodiment of the present invention.

[0040] Figure 14 It is a partial schematic diagram of a rotation module provided by an embodiment of the present invention.

[0041] Figure 15 This is a schematic diagram of the structure of the temperature measurement module provided by the embodiment of the present invention. Figure 1 .

[0042] Figure 16 This is a schematic diagram of the structure of the temperature measurement module provided by the embodiment of the present invention. Figure 2 .

[0043] Figure 17 It is a structural schematic diagram of a thermocouple installation tool provided in an embodiment of the present invention.

[0044] Figure 18 It is a cross-sectional view of a thermocouple installation tool provided in an embodiment of the present invention.

[0045] Reference numerals:

[0046] 1-base; 11-through hole; 12-waisted blind hole; 13-spherical top blind hole;

[0047] 2-Adjustment module; 21-Frame; 211-Base plate; 22-X-axis adjustment assembly; 221-X-axis handwheel; 222-X-axis fixed end pin; 223-X-axis handwheel screw; 224-X-axis drive block; 225-X-axis adjustment block; 226-X-axis toggle pin; 227-X-axis adjustment pin; 228-X-axis adjustment plate; 2281-First waist-shaped hole; 2282-Second waist-shaped hole; 2283-Third waist-shaped hole; 23-Y-axis adjustment assembly; 231-Y-axis handwheel; 232-Y-axis fixed end pin; 233-Y-axis handwheel screw; 234-Y-axis drive block; 235-Y-axis adjustment block; 236-Y-axis toggle pin; 237-Y-axis adjustment pin; 238-Y-axis adjustment plate; 24-horizontal adjustment assembly; 241-wedge adjustment block; 242-horizontal adjustment handwheel; 243-adjustment handwheel mounting block; 244-adjustment base; 245-connecting bolt; 3-lifting module; 31-base; 311-mounting seat; 312-guide rail; 31 3-Second photoelectric sensor; 314-Sensor base; 315-Sensor mounting plate; 32-Wafer lifting assembly; 321-Lifting shaft; 322-Ejector pin; 323-Lifting tripod; 324-Guide rail slider; 325-Stepper motor; 3251-Motor base; 326-First screw rod; 327-First slider; 328-Lifting shaft drive block; 329-Bellows separation mounting block; 3210-Lifting shaft fixing block; 3211-Lifting shaft fixing pin; 3212- Second sensor paddle; 33 - overall lifting assembly; 331 - overall lifting drive block; 332 - overall lifting handwheel; 333 - second screw; 334 - second slider; 335 - bearing seat; 336 - first locking block; 337 - first locking handle; 34 - connector lifting assembly; 341 - cavity connector lifting handwheel; 342 - third screw; 343 - third slider; 344 - linear bearing; 345 - mounting plate; 346 - support plate; 347 - fixing handle;

[0048] 4-rotation module; 41-rotation axis; 411-rotation tripod; 42-dynamic seal assembly; 421-mounting frame; 422-rotation motor; 423-rotation transition piece; 424-driving gear; 425-driven gear; 426-gear fixing block; 43-bellows assembly; 431-first bellows; 4311-first flange; 432-second bellows; 4321-second flange; 433-bellows connector; 4331-second slide rail; 434-cavity connector; 435-horizontal support plate; 4351-first slide groove; 4352-second slide groove; 436-vertical support plate; 4361-first slide rail; 44-sensor assembly; 441-sensor sheet metal; 442-first sensor paddle; 443-first photoelectric sensor;

[0049] 5-temperature measurement module; 51-thermocouple; 52-thermocouple installation tool; 521-thermocouple mounting block; 522-lower end cover; 5221-O-ring clamping ring; 5231-rotating clip; 5232-rotating clip base; 5241-thermocouple adjustment fixing block; 5242-spring; 5243-spring fixing block; 5251-adjusting screw; 5252-adjusting nut; 5253-nut; 5261-support arm; 5262-dial indicator fixing block; 5263-dial indicator; 53-slip ring assembly; 531-slip ring connecting block; 532-slip ring claw; 533-slip ring; 534-first gear; 535-second gear; 536-third gear; 537-stepped shaft; 538-gear fixing block. DETAILED DESCRIPTION

[0050] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0051] The following is based on Figures 1-18 The wafer transmission device in the epitaxial growth equipment provided by the embodiment of the present invention is described. The transmission device includes a base 1, an adjustment module 2, a lifting module 3, and a rotation module 4.

[0052] The base 1 is used to support wafers and is provided with a plurality of through holes 11 .

[0053] The lifting module 3 includes a base 31, a wafer lifting assembly 32, and an integral lifting assembly 33. Both the wafer lifting assembly 32 and the integral lifting assembly 33 are mounted on the base 31. The wafer lifting assembly 32 includes a vertically extending lifting shaft 321 and a plurality of ejector pins 322 disposed at the top of the lifting shaft 321. The lifting shaft 321 is vertically movable. The ejector pins 322 pass through the plurality of through holes 11 on the base 11 from bottom to top, correspondingly contacting the bottom of the wafer above the base 1, for lifting the wafer.

[0054] The integral lifting assembly includes an integral lifting driving block 331 movably arranged in a vertical direction. The integral lifting driving block 331 is connected to the rotating module 4 for lifting the rotating module 4 .

[0055] The rotating module 4 includes a rotating shaft 41, a dynamic seal assembly 42, and a bellows assembly 43. The top end of the bellows assembly 43 is sealed with the reaction chamber, and the bottom end of the bellows assembly 43 is connected to the dynamic seal assembly 42. The top end of the rotating shaft 41 is circumferentially limited to the base 1 to drive the base 1 to rotate about the central axis of the rotating shaft 41.

[0056] Rotating shaft 41 is coaxial with lifting shaft 321. Rotating shaft 41 passes through dynamic seal assembly 42 and bellows assembly 43, extending into the reaction chamber. A portion of lifting shaft 321 is located within bellows assembly 43 and then extends upward through bellows assembly 43 into the reaction chamber. Rotating shaft 41 and lifting shaft 321 are coaxial, meaning that the central axes of rotating shaft 41 and lifting shaft 321 coincide and extend vertically. Rotating shaft 41 can be nested within lifting shaft 321, or vice versa.

[0057] The adjustment module 2 includes a frame 21 and an adjustment component. The frame 21 is used to be connected to the reaction chamber. The adjustment component is arranged on the frame 21 and connected to the base 31 of the lifting module 3. The adjustment component is used to adjust the position of the base 31 along the X-axis and Y-axis directions, and is also used to adjust the horizontality of the base 31, wherein the X-axis and Y-axis are both horizontal and perpendicular to each other.

[0058] The frame in the adjustment module of the wafer transmission device in the epitaxial equipment provided in an embodiment of the present invention is used to carry all components of the transmission device. With the frame as support, the adjustment component adjusts the base of the lifting module to achieve the adjustment of the base position on the X-axis and Y-axis and the horizontality of the base.

[0059] During the reaction, the base is located in the reaction chamber, the lifting shaft of the wafer lifting assembly pushes out the ejector pin, the top of the ejector pin is higher than the upper surface of the base, the wafer transfer assembly places the wafer on the ejector pin, and the lifting shaft drives the ejector pin down until the wafer falls on the base; after the reaction, the ejector pin passes through the through hole to lift the wafer off the base, and the wafer transfer assembly takes the wafer away.

[0060] In some embodiments, the wafer transfer assembly is a wafer insertion mechanism. The wafer insertion mechanism inserts the wafer from the magazine and transports the wafer to the top of the base. The lifting shaft drives the ejector pin to rise. The top of the ejector pin contacts the bottom of the wafer and continues to drive the wafer up, causing the wafer to detach from the wafer insertion mechanism. The wafer insertion mechanism exits the reaction chamber, and the lifting shaft drives the ejector pin back down until the wafer lands on the base. After the reaction is completed, the lifting shaft drives the ejector pin from bottom to top through the through hole to contact the bottom of the wafer and lift the wafer to detach from the base. The wafer insertion mechanism extends into the reaction chamber and is vertically located between the wafer and the base. The lifting shaft drives the ejector pin back down to place the wafer on the wafer insertion mechanism, and the wafer insertion mechanism exits the reaction chamber with the wafer.

[0061] The present invention uses an integrated base to support the wafer, and then utilizes the passive lifting of ejector pins to achieve the purpose of wafer lifting. Compared with separate bases, the integrated base has a simpler structure and a uniform surface structure. The contact area between the ejector pins and the wafer is smaller. During the epitaxial growth process, the process gas is more evenly distributed on the lower surface of the wafer, which has less interference with the epitaxial growth process on the substrate, greatly improving the yield rate of epitaxial growth.

[0062] The lifting module's overall lifting drive block is supported by the base, enabling the overall lifting of the rotating module. The overall lifting of the rotating module ultimately drives the lifting of the base.

[0063] The rotating shaft of the rotating module drives the base to achieve stable rotation. The bellows assembly is used to prevent the reaction gas in the reaction chamber from leaking from the gap between the lifting shaft and the rotating shaft and the reaction chamber. It can also introduce purified gas into the lower tube of the reaction chamber through the bellows assembly to prevent the reaction gas from flowing into the lower tube of the reaction chamber and the area below it, thereby preventing gas reaction and deposition in the lower tube of the reaction chamber and the area below it. The deformation characteristics of the bellows assembly also allow the lifting shaft to be displaced in the vertical direction. The provision of the dynamic sealing assembly realizes the rotary sealing of the rotating shaft, preventing the gas in the bellows assembly from leaking from the connection between the rotating shaft and the bellows assembly.

[0064] The wafer transmission device in the epitaxial device provided by the embodiment of the present invention can keep the wafer on the base relatively horizontal and rotate continuously and stably to ensure that the wafer is evenly exposed to the heat field and process gas flow field during the epitaxial process, which helps to improve the quality of the epitaxial layer.

[0065] Below Figures 1-18 The wafer conveying device in a specific embodiment of the present invention is described in detail as an example.

[0066] like Figure 1 As shown, the transmission device includes a base 1, an adjustment module 2, a lifting module 3, a rotation module 4, and a temperature measurement module 5.

[0067] The base 1 is located in the reaction chamber and is used to support the wafer. Figure 2 and Figure 3 As shown, the base 1 is made of graphite. Three through-holes 11 are spaced apart along its circumference. A lifting tripod 323 is mounted on top of the lifting shaft 321 of the lifting module 3. The lifting tripod 323 includes three vertically extending ejector pins 322, each corresponding to one of the three through-holes 11. When the lifting shaft 321 rises, the ejector pins 322 pass through the through-holes 11 and lift the wafer. When the lifting shaft 321 descends, the ejector pins 322 support the wafer and place it on the base 1.

[0068] The wafer transmission device in the epitaxial growth equipment provided by the embodiment of the present invention is easy to operate and accurately adjusted, and the passive lifting of the ejector pin is used to achieve the purpose of lifting and lowering the wafer. Compared with the separate base, the overall base structure is simpler and has less interference with the epitaxial growth process of the substrate, thereby greatly improving the yield rate of epitaxial growth.

[0069] like Figure 2 As shown, the bottom of the base 1 is provided with three waist-shaped blind holes 12 spaced apart along its circumference. These waist-shaped blind holes 12 extend radially along the base 1. A rotating tripod 411 is connected to the top of the rotating shaft 41 of the rotating module 4. The rotating tripod 411 and the rotating shaft 41 are mutually constrained in the circumferential direction. Rotation of the rotating shaft 41 drives the rotating tripod 411. The rotating tripod 411 has three waist-shaped pins that engage in the waist-shaped blind holes 12 to provide rotational driving force to the base 1, thereby enabling the rotating shaft 41 to drive the base 1 to rotate stably.

[0070] like Figure 4 and Figure 5 As shown, the adjustment module 2 includes a frame 21, a base plate 211, an X-axis adjustment assembly 22, a Y-axis adjustment assembly 23, and a horizontal adjustment assembly 24. The frame 21 is connected to the reaction chamber to bear the weight of all components. The horizontal adjustment assembly 24 is arranged on the frame 1 and uses the frame 1 as a support to adjust the horizontality of the base plate 211. The X-axis adjustment assembly 22 is arranged on the base plate 211 and uses the base plate 211 as a support to adjust the position of the Y-axis adjustment assembly 23 along the X-axis. The Y-axis adjustment assembly 23 uses the X-axis adjustment assembly as a support to adjust its own position along the Y-axis. The Y-axis adjustment assembly 23 is connected to the base 31 of the lifting module 3. The horizontal adjustment assembly 24 adjusts the horizontality of the base plate 211. The base plate 211 drives the X-axis adjustment assembly 22, which in turn drives the Y-axis adjustment assembly 23 to adjust. The X-axis adjustment assembly 22 adjusts the Y-axis adjustment assembly 23 along the X-axis. The Y-axis adjustment assembly 23 adjusts its own position along the Y-axis, thereby adjusting the horizontality and position of the base 31 of the lifting module 3. The rotating module 4 is connected to the lifting module 3 through an integral lifting drive block, and the base 1 is supported on the rotating shaft 41 , so the adjusting module 2 ultimately realizes the adjustment of the horizontality and position of the base 1 .

[0071] In this embodiment, if Figure 4 As shown, the frame 21 includes three vertically extending square steel tubes, the tops of which are connected to the reaction chamber base via bolts. The horizontal adjustment assembly 24 includes three wedge-shaped adjustment blocks 241, which are movably mounted on the frame 21 along their horizontal directions. The top surfaces of the wedge-shaped adjustment blocks 241 are inclined, and the bottom plate 211 abuts against the top surfaces of the wedge-shaped adjustment blocks 241. The height of the wedge-shaped adjustment blocks 241 embedded in the bottom plate 211 can be adjusted by adjusting their relative positions. Figure 4 As shown, three wedge-shaped adjustment blocks 241 are arranged at intervals along the circumferential direction to achieve Z-direction displacement of the bottom plate 211 to achieve the purpose of horizontal adjustment.

[0072] In other alternative embodiments, the number of the wedge-shaped adjustment blocks 241 is other. Preferably, there are at least three wedge-shaped adjustment blocks 241 .

[0073] Specifically, if Figure 4 As shown, the horizontal adjustment assembly 24 includes a wedge-shaped adjustment block 241, a horizontal adjustment handwheel 242, an adjustment handwheel mounting block 243, and an adjustment base 244. Each set of horizontal adjustment handwheel 242, adjustment handwheel mounting block 243, and adjustment base 244 corresponds to one wedge-shaped adjustment block 241. The adjustment base 244 is fixed to the frame 21, and the adjustment handwheel mounting block 243 is located on top of and connected to the adjustment base 244. The adjustment handwheel mounting block 243 has a mounting hole formed therein.

[0074] like Figure 6 As shown, the horizontal adjustment handwheel 242 has a screw extending horizontally and having a groove therein. The screw of the horizontal adjustment handwheel 242 passes through the mounting hole of the adjustment handwheel mounting block 243. The groove engages with the adjustment handwheel mounting block 243, and the screw is axially limited by a number of flat washers and retaining rings. The horizontal adjustment handwheel 242 is rotatable relative to the adjustment handwheel mounting block 243. The distal end of the screw of the horizontal adjustment handwheel 242 is threadedly engaged with the wedge-shaped adjustment block 241. The bottom end surface of the wedge-shaped adjustment block 241 is flat and abuts against the top end surface of the adjustment base 244 and can slide relative to the top end surface of the adjustment base 244. The top end surface of the wedge-shaped adjustment block 241 is an inclined surface, meaning that the height of the wedge-shaped adjustment block 241 gradually changes along the axial direction of the screw. The wedge-shaped adjustment block 241 is provided with an elongated through hole extending along the axial direction of the screw rod. The connecting bolt 245 passes through the elongated through hole on the bottom plate 211 and the wedge-shaped adjustment block 241 and is connected to the adjustment base 244 .

[0075] like Figure 4As shown, the bottom of the base plate 211 abuts against the top surfaces of the three wedge-shaped adjustment blocks 241. The levelness of the base plate 211 is related to the height at which the three wedge-shaped adjustment blocks 241 are embedded in the base plate 211. The screw of the leveling adjustment handwheel 242 is threadedly engaged with the wedge-shaped adjustment blocks 241. By rotating the leveling adjustment handwheel 242, the relative position of the wedge-shaped adjustment blocks 241 can be adjusted. The wedge-shaped adjustment blocks 241 slide along the top surface of the adjustment base 244, and the connecting bolts 245 slide along the elongated through-holes, changing the height at which the wedge-shaped adjustment blocks 241 are embedded in the base plate 211. By adjusting the height at which the three wedge-shaped adjustment blocks 241 are embedded in the base plate 211, the levelness of the base plate 211 can be adjusted.

[0076] In this embodiment, if Figure 5 As shown, the X-axis adjustment assembly 22 includes an X-axis connecting rod, an X-axis driving block 224, an X-axis adjusting block 225, an X-axis adjusting plate 228, an X-axis adjusting pin 227, etc. The Y-axis adjustment assembly 23 includes a Y-axis connecting rod, a Y-axis driving block 234, a Y-axis adjusting block 235, a Y-axis adjusting plate 238, a Y-axis adjusting pin 237, etc., wherein the Y-axis adjusting plate 238 is fixed to the base 31 of the lifting module 3.

[0077] The X-axis adjustment plate 228 is positioned above and parallel to the base plate 211. The X-axis connecting rod is rotatably connected to the bottom of the base plate 211, and its extension direction is parallel to the base plate 211. Specifically, the X-axis connecting rod includes an X-axis handwheel 221 and an X-axis handwheel screw 223. An X-axis fixed end pin 222 is provided at the bottom of the base plate 211. The X-axis handwheel screw 223 passes through a through hole in the X-axis fixed end pin 222 and is axially limited by a gasket and a retaining ring. The X-axis handwheel screw 223 can rotate relative to the X-axis fixed end pin 222. The X-axis drive block 224 is threadedly engaged with the end of the X-axis handwheel screw 223 and moves along the X-axis handwheel screw 223 as the X-axis handwheel screw 223 rotates.

[0078] The X-axis adjustment block 225 is swingably connected to the base plate 221. Specifically, Figure 5 As shown, the X-axis adjustment block 225 is connected to the base plate 221 via an X-axis shifting pin 226 that is perpendicular to the base plate 211. When the X-axis adjustment block 225 swings, it rotates around the X-axis shifting pin 226. The X-axis driving block 224 is rotatably connected to one end of the X-axis adjustment block 225 that swings. The rotation centerline of the X-axis driving block 224 is perpendicular to the base plate 211. The X-axis adjustment pin 227 is connected to the other end of the X-axis adjustment block 225 that swings. Figure 4As shown, the X-axis adjustment plate 228 is provided with a first waist-shaped hole 2281 extending along the Y-axis, and a portion of the X-axis adjustment pin 227 extends into the first waist-shaped hole 2281. Driven by the X-axis connecting rod, the X-axis adjustment block 225 swings and moves the X-axis adjustment plate 228 along the X-axis through the X-axis adjustment pin 227.

[0079] The Y-axis adjustment plate 238 is positioned below and parallel to the X-axis adjustment plate 228. The Y-axis adjustment plate 238 and the X-axis adjustment plate 228 are connected for relative movement along the Y-axis, allowing them to move relative to each other in the Y-axis direction. In the X-axis direction, the Y-axis adjustment plate 238 and the X-axis adjustment plate 228 are mutually restrained. Therefore, when the X-axis adjustment plate 228 moves along the X-axis, it drives the Y-axis adjustment plate 238 along the X-axis. Furthermore, because the Y-axis adjustment plate 238 is fixed to the base 31 of the lifting module 3, it drives the entire lifting module 3 along the X-axis.

[0080] The Y-axis connecting rod is rotatably connected to the Y-axis adjustment plate 228 and is parallel to the base plate 221. Specifically, the Y-axis connecting rod includes a connected Y-axis handwheel 231 and a Y-axis handwheel screw 233. A Y-axis fixed-end pin 232 is provided at the bottom of the Y-axis adjustment plate 228. The Y-axis handwheel screw 233 passes through a through-hole in the Y-axis fixed-end pin 232 and is axially limited by a gasket and a retaining ring. The Y-axis handwheel screw 233 can rotate relative to the Y-axis fixed-end pin 232. The Y-axis drive block 234 is threadedly engaged with the end of the Y-axis handwheel screw 233 and moves along the Y-axis handwheel screw 233 as the Y-axis handwheel screw 233 rotates.

[0081] The Y-axis adjustment block 235 is swingably connected to the Y-axis adjustment plate 238. Figure 5 As shown, the Y-axis adjustment block 235 is connected to the Y-axis adjustment plate 238 via a Y-axis toggle pin 236 that is perpendicular to the base plate 211. When the Y-axis adjustment block 235 swings, it rotates around the Y-axis toggle pin 236. The Y-axis drive block 234 is rotatably connected to one end of the Y-axis adjustment block 235, and the rotation centerline of the Y-axis drive block 234 is perpendicular to the base plate 211. The Y-axis adjustment pin 237 is connected to the other end of the Y-axis adjustment block 235. Figure 4 As shown, the X-axis adjustment plate 228 is provided with a second waist-shaped hole 2282 extending along the X-axis, and a portion of the Y-axis adjustment pin 237 extends into the second waist-shaped hole 2282. Driven by the Y-axis connecting rod, the Y-axis adjustment block 235 swings and, supported by the Y-axis adjustment pin 237, moves the Y-axis adjustment plate 238 relative to the X-axis adjustment plate 228 along the Y-axis.

[0082] Specifically, in order to realize that the Y-axis adjustment plate 238 and the X-axis adjustment plate 228 are connected so as to be relatively movable along the Y-axis, as shown in FIG. Figure 4As shown, the X-axis adjustment plate 228 is provided with a plurality of third waist-shaped holes 2283. The third waist-shaped holes 2283 extend along the Y-axis direction. Bolts pass through the third waist-shaped holes 2283 and connect to the Y-axis adjustment plate 238. When the Y-axis adjustment plate 238 and the X-axis adjustment plate 228 produce relative displacement in the Y-axis direction, the bolts move along the third waist-shaped holes 2283.

[0083] The specific adjustment process of the adjustment module 2 in the X-axis direction is as follows: the base plate 211 remains stationary. By rotating the X-axis handwheel 221, the X-axis handwheel screw 223 rotates relative to the X-axis fixed end pin 222. The X-axis drive block 224 at the end of the X-axis handwheel screw 223 moves along the X-axis handwheel screw 223. During this movement, the X-axis drive block 224 rotates relative to the X-axis adjustment block 225, causing the X-axis adjustment block 225 to swing about the X-axis shift pin 226. The swinging of the X-axis adjustment block 225 moves the X-axis adjustment pin 227 at the other end. Because a portion of the X-axis adjustment pin 227 fits within the first waist-shaped hole 2281, the X-axis adjustment pin 227 is not restricted in the direction of extension of the first waist-shaped hole 2281 (the Y-axis direction) during movement. Instead, it abuts the X-axis adjustment plate 228 in the X-axis direction. Therefore, the X-axis adjustment pin 227 can slide relative to the first waist-shaped hole 2281 in the Y-axis direction during movement, thereby achieving the purpose of adjusting the X-axis adjustment plate 228 in the X-axis direction. Because the X-axis adjustment plate 228 and the Y-axis adjustment plate 238 are mutually restrained in the X-axis direction, they drive the Y-axis adjustment plate 238 to move along the X-axis. Furthermore, because the Y-axis adjustment plate 238 is fixed to the base 31 of the lifting module 3, it drives the entire lifting module 3 to move along the X-axis, ultimately driving the base 1 to move along the X-axis.

[0084] The specific adjustment process for adjustment module 2 in the Y-axis direction is as follows: while base plate 211 and X-axis adjustment plate 228 remain stationary relative to each other, Y-axis handwheel 231 is rotated. This drives Y-axis handwheel screw 233 to rotate relative to Y-axis fixed-end pin 232, causing Y-axis drive block 234 at the end of Y-axis handwheel screw 233 to move along Y-axis handwheel screw 233. During this movement, Y-axis drive block 234 rotates relative to Y-axis adjustment block 235, causing Y-axis adjustment block 235 to swing about Y-axis shift pin 236. Because the Y-axis adjustment pin 237 fits within the second waist-shaped hole 2282 and is not restricted in the direction in which the second waist-shaped hole 2282 extends (the X-axis direction), the Y-axis adjustment pin 237 can slide relative to the second waist-shaped hole 2282 along the X-axis direction during movement. However, the Y-axis adjustment pin 237 abuts against the X-axis adjustment plate 228 in the Y-axis direction, maintaining its position in the Y-axis direction. As the Y-axis adjustment block 235 swings, it exerts a force on the Y-axis adjustment plate 238 via the Y-axis shifting pin 236, pushing the Y-axis adjustment plate 238 along the Y-axis. This achieves the goal of "swinging the Y-axis adjustment block 235 and using the Y-axis adjustment pin 237 as support to shift the Y-axis adjustment plate 238 relative to the X-axis adjustment plate 228 along the Y-axis," thereby achieving the purpose of adjusting the Y-axis adjustment plate 238 in the Y-axis direction and ultimately driving the base 1 to move along the Y-axis.

[0085] like Figure 7 and Figure 8 As shown, the base 31 of the lifting module 3 includes a mounting base 311 and a guide rail 312. The guide rail 312 is provided on the mounting base 311 and extends in the vertical direction. The wafer lifting assembly 32 includes a guide rail slider 324, which cooperates with the guide rail 312 and slides along the guide rail 312. The mounting base 311 is fixed to the Y-axis adjustment plate 238, and the wafer lifting assembly 32 and the entire lifting assembly 33 are also fixed to the mounting base 311.

[0086] The wafer lifting assembly 32 also includes a first driving mechanism, a first screw rod 326, a first slider 327, and a lifting shaft driving block 328. The first driving mechanism is used to drive the first screw rod 326 to rotate. The first screw rod 326 extends in the vertical direction. The first slider 327 is threadedly engaged with the first screw rod 326 and moves up and down with the rotation of the first screw rod 326. The lifting shaft driving block 328 and the first slider 327 are fixed to each other, and the lifting shaft 321 and the lifting shaft driving block 328 are fixed to each other.

[0087] Specifically, in this embodiment, Figure 7As shown, the first driving mechanism is a stepper motor 325, which is arranged on the side of the mounting base 311 via a motor base 3251. The stepper motor 325 is connected to the bottom end of the first screw rod 326 to drive the first screw rod 326 to rotate. The first slider 327 is arranged on the upper end surface of the lifting shaft driving block 328 and is fixed to it by bolts. The first screw rod 326 passes through the lifting shaft driving block 328 and the first slider 327 from bottom to top and is threadedly engaged with the first slider 327. Figure 7 In the illustrated embodiment, the top of the first screw 326 is also connected to a handwheel, so that the first screw 326 can also be rotated by rotating the handwheel. As the first screw 326 rotates, the first slider 327 drives the lifting shaft drive block 328 to move up and down, and the lifting shaft drive block 328 drives the lifting shaft 321 to move up and down, ultimately achieving the lifting and lowering of the wafer.

[0088] More specifically, Figure 9 As shown, the lifting shaft 321 is a tubular structure that is sleeved around the rotating shaft 41 and extends vertically. There is a gap between the lifting shaft 321 and the rotating shaft 41, so that the two do not affect each other. The bottom of the lifting shaft 321 is located within the bellows assembly 43, and the top extends upward from the bellows assembly 43.

[0089] The bellows assembly 43 includes a first bellows 431 and a second bellows 432. The wafer lifting assembly 32 also includes a bellows separation mounting block 329 and a lifting shaft fixing block 3210. The bellows separation mounting block 329 is fixed to the lifting shaft drive block 328. The guide rail slider 324 is specifically arranged on the side of the bellows separation mounting block 329. The bellows separation mounting block 329 is annular, wherein the bottom end of the first bellows 431 is sealedly connected to the top end of the bellows separation mounting block 329, and the top end of the second bellows 432 is sealedly connected to the bottom end of the bellows separation mounting block 329. Specifically, the top and bottom ends of the first bellows 431 are both connected to a first flange 4311, and the top and bottom ends of the second bellows 432 are both connected to a second flange 4321. The first flange 4311 at the bottom of the first bellows 431 is sealed with the bellows separation mounting block 329 via an O-ring end face seal, and the second flange 4321 at the top of the second bellows 432 is sealed with the bellows separation mounting block 329 via an O-ring end face seal.

[0090] The lifting shaft fixing block 3210 is located inside the bellows separation mounting block 329 and is fixed to the bellows separation mounting block 329. The lifting shaft fixing block 3210 is sleeved around the lifting shaft 321 and fixed to the lifting shaft 321. Optionally, the inner ring of the bellows separation mounting block 329 and the outer ring of the lifting shaft fixing block 3210 have an interference fit. Several O-rings are installed between the lifting shaft fixing block 3210 and the lifting shaft 321 to achieve a seal between the first bellows 431 and the second bellows 432 and to limit the vertical position between the two.

[0091] To further improve stability, the bellows separation mounting block 329 and the lifting shaft fixing block 3210 are prevented from rotating relative to each other. Figure 7 As shown, the wafer lifting assembly 32 further includes a lifting shaft fixing pin 3211 , which passes through the bellows separation mounting block 329 from the outside to the inside and abuts against the lifting shaft fixing block 3210 .

[0092] The operation process of the wafer lifting assembly 32 is as follows: the stepper motor 325 drives the first screw 326 to rotate, and the first slider 327 moves up and down along the first screw 326, which in turn drives the lifting shaft driving block 328, the bellows separation mounting block 329, the lifting shaft fixing block 3210, and the lifting shaft 321 to move up and down. Figure 9 As shown, a tapered clamp is provided at the top of the lifting shaft 321 , and a corresponding clamp of the lifting tripod 323 is also provided with a taper, so as to cooperate with the lifting shaft 321 to provide axial lifting motion, and realize the lifting and lowering of the wafer through the ejector pin 322 .

[0093] The integral lifting assembly 33 includes an integral lifting drive block 331, a second driving mechanism, a second screw rod 333, and a second slider 334. The second driving mechanism is used to rotate the second screw rod 333, which extends in the vertical direction. The second slider 334 is threadedly engaged with the second screw rod 333, allowing it to move up and down as the second screw rod 333 rotates. The integral lifting drive block 331 and the second slider 334 are fixed to each other. By driving the second screw rod 333 to rotate, the second driving mechanism drives the second slider 334 and the integral lifting drive block 331 to move up and down, ultimately achieving the overall lifting of the rotating module 4.

[0094] Specifically, if Figure 8 As shown, in this embodiment, the second driving mechanism is an integral lifting handwheel 332, which is fixed to the mounting base 311 via a first locking block 336 and connected to the bottom end of the second screw rod 333. A bearing seat 335 is provided above the first locking block 336, and a bearing is provided in the bearing seat 335. The bearing fits between the second screw rod 333 and the bearing seat 335. The second slider 334 is fixed above the integral lifting drive block 331. By manually rotating the integral lifting handwheel 332, the second slider 334 drives the integral lifting drive block 331 to move axially along the second screw rod 333, thereby achieving the purpose of lifting the rotating module 4 as a whole. After adjusting the axial displacement, the first locking handle 337 on the first locking block 336 is tightened to limit the circumferential rotation of the integral lifting handwheel 332, thereby achieving locking.

[0095] like Figure 13As shown, the rotating module 4 includes a rotating shaft 41, a dynamic seal assembly 42, a bellows assembly 43, and also includes a mounting frame 421, a rotating motor 422, a rotating transition piece 423, a driving gear 424, and a driven gear 425. The driving gear 424 and the driven gear 425 are meshed. The integral lifting drive block 331 is connected to the mounting frame 421. The rotating motor 422 is arranged on the mounting frame 421 and drives the driven gear 425 to rotate by driving the driving gear 424. The rotating transition piece 423 is sleeved on the rotating shaft 41 and is circumferentially fixed to the rotating shaft 41. The driven gear 425 drives the rotating shaft 41 to rotate through the rotating transition piece 423. The dynamic seal assembly 42 is a magnetic fluid seal assembly, which is arranged on the mounting frame 421 and has a rotatable inner ring. A portion of the rotating transition piece 423 fits inside the inner ring and is circumferentially fixed to the inner ring.

[0096] Specifically, the integral lift drive block 331 is bolted to the mounting bracket 421. The mounting bracket 421 is horizontally arranged and has two mounting holes. The rotary motor 422 is mounted in one mounting hole on one side of the mounting bracket 421, and the magnetic fluid seal assembly is mounted in the other mounting hole on the mounting bracket 421. The bottom of the rotary motor 422 is in driving connection with the driving gear 424. The rotary transition piece 423 has an inverted T-shaped structure and is sleeved around the rotary shaft 41. Several O-rings provide sealing and friction with the rotary shaft 41, transmitting power to the rotary shaft 41 and causing the rotary shaft 41 to rotate about its axis.

[0097] The upper portion of rotating transition piece 423 extends into the inner ring of the magnetic fluid seal assembly and is sealed by an O-ring, remaining stationary relative to the inner ring of the magnetic fluid seal assembly. The bottom of rotating transition piece 423 is in driving connection with driven gear 425 via gear fixing block 426, and driving gear 424 meshes with driven gear 425. The magnetic fluid seal assembly is connected to second bellows 432 via second flange 4321 at its bottom.

[0098] Rotating shaft 41 extends upward, passing through the magnetic fluid seal assembly and bellows assembly 43. A rotating tripod 411 is mounted on top of rotating shaft 41. A tapered chuck is provided at the top of rotating shaft 41. This tapered chuck mates with rotating shaft 41, providing axial rotational motion. The waist-shaped pin of rotating tripod 411 cooperates with waist-shaped blind hole 12 to achieve stable rotation of base 1.

[0099] The rotation module 4 drives the base 1 to rotate as follows: the rotation motor 422 operates, driving the driven gear 425 through the driving gear 424. The rotation of the driven gear 425 drives the rotation transition member 423 and the rotating shaft 41, ultimately driving the base 1 to rotate. The dynamic seal assembly 42 provides a dynamic seal for the rotating shaft 41.

[0100] like Figure 7-11 As shown, the bellows assembly 43 includes a bellows, a bellows-to-cavity connector, a horizontal support plate 435, and a vertical support plate 436. The bellows includes a first bellows 431 and a second bellows 431, which are connected via a bellows separation mounting block 329. The bellows connector 433 is sealedly connected to a first flange 4311 at the top end of the first bellows 431, and the bellows-to-cavity connector is connected to the top end of the bellows connector 433. The bellows-to-cavity connector is used to connect to the reaction chamber.

[0101] The bellows-cavity connector specifically includes a bellows connector 433 and a cavity connector 434 . The bellows connector 433 is connected to the top of the first bellows 431 , and the cavity connector 434 is connected to the top of the bellows connector 433 .

[0102] In order to facilitate accurate connection with the reaction chamber, the bellows-cavity connector (bellows connector 433) is connected to the horizontal support plate 435 in an adjustable position along the X-axis, the horizontal support plate 435 is connected to the vertical support plate 436 in an adjustable position along the Y-axis, and the vertical support plate 436 is connected to the base 31 of the lifting module 3 in an adjustable position in the vertical direction.

[0103] like Figure 8 As shown, the lifting module 3 also includes a connecting part lifting assembly 34, and the connecting part lifting assembly 34 includes a third driving mechanism, a third screw rod 342 and a third slider 343. The third driving mechanism drives the third screw rod 342 to rotate, and the third screw rod 342 extends in the vertical direction. The third slider 343 is threadedly engaged with the third screw rod 342 and moves up and down with the rotation of the third screw rod 342. The third slider 343 is fixed to the vertical support plate 436 or the base 31.

[0104] Specifically, if Figure 8 As shown, the connector lifting assembly 34 further includes a linear bearing 344, a mounting plate 345, and a support plate 346. The support plate 346 is fixedly connected to the mounting seat 311, and the mounting plate 345 extends in the horizontal direction and is fixedly connected to the support plate 346. The third slider 343 is fixedly arranged on the upper surface of the mounting plate 345. The third driving mechanism is a cavity connector lifting handwheel 341, and the cavity connector lifting handwheel 341 is arranged on the third screw rod 342. The top end of the third screw rod 342 is fixedly connected to the vertical support plate 436, and the third screw rod 34 passes downward through the third slider 343 and the mounting plate 345. The linear bearing 344 is connected to the vertical support plate 436 and the mounting plate 345 as a support to prevent the third screw rod 342 from being eccentric. The third screw rod 34 is driven to rotate by the cavity connector lifting hand wheel 341, and the third slider 343 moves up and down relative to the third screw rod 34. Since the mounting seat 311 and the third slider 343 are relatively fixed, the third screw rod 34 drives the vertical support plate 436 to move up and down.

[0105] In other replaceable embodiments, the bottom end of the third screw rod 34 is fixed on the mounting seat 311, the third slider 343 is fixed on the vertical support plate 436, the third screw rod 34 is driven to rotate by the cavity connecting member lifting handwheel 341, the third slider 343 moves up and down relative to the third screw rod 34, the mounting seat 311 is relatively fixed, and the third slider 343 drives the vertical support plate 436 to rise and fall.

[0106] Furthermore, after the position of the vertical support plate 436 is adjusted, the circumferential movement of the third screw rod 342 is restricted by tightening the fixing handle 347 .

[0107] In some embodiments, the vertical support plate 436 is provided with one of the first slide rail and the first slide groove, and the horizontal support plate 435 is provided with the other of the first slide rail and the first slide groove. Both the first slide rail and the first slide groove extend along the Y-axis direction. The first slide rail is engaged in the first slide groove and can slide along the first slide groove, thereby realizing that the position of the horizontal support plate 435 relative to the vertical support plate 436 along the Y-axis can be adjusted.

[0108] In some embodiments, the horizontal support plate 435 is provided with one of the second slide rail and the second slide groove, and the bellows-cavity connector is provided with the other of the second slide rail and the second slide groove. Both the second slide rail and the second slide groove extend along the X-axis direction. The second slide rail is engaged in the second slide groove and can slide along the second slide groove, thereby realizing that the position of the bellows-cavity connector relative to the horizontal support plate 435 along the X-axis can be adjusted.

[0109] As an example, in this embodiment, Figure 10 and Figure 11 As shown, the vertical support plate 436 surrounds the horizontal support plate 435 on three sides and is open on one side facing the Y-axis. A first slide rail 4361 is provided on the inner side of the vertical support plate 436, and a first slide groove 4351 is provided on the outer side of the horizontal support plate 435. The first slide rail 4361 cooperates with the first slide groove 4351 to enable the horizontal support plate 435 to slide relative to the vertical support plate 436 along the Y-axis, thereby driving the cavity connector 434 to move in the Y-axis direction.

[0110] like Figure 10 and Figure 11 As shown, the horizontal support plate 435 surrounds the bellows connector 433 on three sides and is open on one side facing the X-axis. A second slide groove 4352 is provided on the inner side of the horizontal support plate 435, and a second slide rail 4331 is provided on the outer side of the bellows connector 433. The second slide rail 4331 cooperates with the second slide groove 4352 to allow the bellows connector 433 to slide relative to the horizontal support plate 435 along the X-axis, thereby driving the cavity connector 434 to move in the X-axis direction.

[0111] That is, the position of the bellows-cavity connector is adjusted by the horizontal support plate 435 and the vertical support plate 446 , and its height is adjusted by the connector lifting assembly 34 to achieve precise docking with the reaction chamber.

[0112] like Figure 14 As shown, the rotation module 4 also includes a sensor assembly 44, which includes a sensor sheet metal 441, a first sensor paddle 442, and a first photoelectric sensor 443. The sensor sheet metal 441 is installed on the side of the mounting frame 421, and the first photoelectric sensor 443 is installed on the sensor sheet metal 442. The first sensor paddle 442 is kept relatively stationary with the gear fixing block 426 through a pin, and the first sensor paddle 442 rotates with the driven gear 425. The first photoelectric sensor 443 is used to record the number of times the first sensor paddle 442 passes through to feedback the speed of the rotating shaft 41. The first photoelectric sensor 443 includes a light emitting end and a light receiving end relative to each other. When the first sensor paddle 442 passes through the two light emitting ends and the light receiving end of the first photoelectric sensor 443 under the drive of the driven gear 425, the first sensor paddle 442 blocks the light emitted by the light emitting end, and the light receiving end cannot receive it. The first photoelectric sensor 443 records it once. Based on the number of times the first sensor paddle 442 passes through per unit time, the rotation speed of the driven gear 425, that is, the rotation speed of the rotating shaft 41, can be obtained.

[0113] The lifting height of the lifting shaft 321 can be determined by the number of rotations of the stepping motor. In order to avoid excessive lifting of the lifting shaft 321, in some embodiments, such as Figure 12 As shown, the lifting mechanism also includes three second photosensors 313. These three second photosensors 313 are vertically spaced from top to bottom on the mounting base 311. At least the second photosensor 313 in the middle is vertically adjustable. The wafer lifting assembly 32 also includes a second sensor paddle 3212 that rises and falls with the lifting shaft 321. The second sensor paddle 3212 vertically corresponds to the second photosensor 313, allowing the second photosensor 313 to sense the position of the second sensor paddle 3212.

[0114] The second photoelectric sensor 313 at the top determines the upper limit of the second sensor paddle 3212, the second photoelectric sensor 313 at the bottom determines the lower limit of the second sensor paddle 3212, and the second photoelectric sensor 62 in the middle determines the initial position of the second sensor paddle 3212. In other words, when the second photoelectric sensor 313 at the top senses the second sensor paddle 3212, it indicates that the lifting shaft 321 has reached its upper limit, and when the second photoelectric sensor 313 at the bottom senses the second sensor paddle 3212, it indicates that the lifting shaft 321 has reached its lower limit. Before the lifting shaft 321 begins to operate, the second photoelectric sensor 313 in the middle is adjusted to a position where it can sense the second sensor paddle 3212, which serves as the origin of displacement.

[0115] As an example, the three second photoelectric sensors 313 are all vertically positionally adjustable. Specifically, the three second photoelectric sensors 313 are movably mounted on the mounting base 311 via a sensor base 314 and a sensor mounting plate 315. The sensor base 314 is fixedly mounted on the mounting base 311, and the second photoelectric sensors 313 are fixedly mounted on the sensor mounting plate 315. The sensor mounting plate 315 is vertically positionally adjustable on the sensor base 314.

[0116] like Figure 12 As shown, the sensor base 314 is provided with a vertically extending groove, and the sensor mounting plate 315 is provided with a corresponding boss. The boss extends into and slides along the groove of the sensor base 314. The sensor mounting plate 315 is provided with a vertically extending elongated hole, through which a connecting bolt passes to connect to the sensor base 314. To adjust the position of the photoelectric sensor, the connecting bolt can be manually loosened, and the sensor mounting plate 315 can be manually moved to allow the boss to slide along the groove. After adjustment, the connecting bolt can be tightened.

[0117] like Figure 8 and 12 As shown, the second sensor paddle 3212 is connected to the bellows separation mounting block 329 of the wafer lifting assembly 32, and moves with the bellows separation mounting block 329. The second sensor paddle 3212 extends in the horizontal direction and corresponds to the three second photoelectric sensors in the vertical direction. When the second sensor paddle 3212 extends into the test end of one of the photoelectric sensors, the photoelectric sensor senses it, and the relative position of the lifting shaft 321 in the vertical direction at this time can be determined.

[0118] like Figure 15-18 As shown, the temperature measurement module 5 includes a thermocouple 51, a thermocouple mounting fixture 52 and a slip ring assembly 53. The thermocouple 51 is inserted into the rotating shaft 41 and rotates synchronously with the rotating shaft 41. The top temperature measuring head of the thermocouple 51 is against the bottom of the base 1, as shown in FIG. Figure 2 As shown, there is a spherical blind hole 13 at the center of the base 1, which is used to place the temperature measuring head of the thermocouple 51 of the temperature measuring module 5 to measure the temperature of the base 1 in real time.

[0119] like Figure 18 As shown, the bottom of the rotating transition piece 423 extends downward from the bottom end of the rotating shaft 41 , and the bottom end of the thermocouple 51 extends from the bottom end of the rotating shaft 41 .

[0120] The thermocouple mounting fixture 52 includes a thermocouple mounting block 521, a lower end cap 522, and an O-ring clamping ring 5221. Both the thermocouple mounting block 521 and the lower end cap 522 are fitted with thermocouples 51. The thermocouple mounting block 521 is bolted to the bottom of the rotating transition piece 423, abutting the bottom end of the rotating shaft 41. The rotating shaft 51 extends downward through the thermocouple mounting block 521. The bottom of the thermocouple mounting block 521 has a threaded portion, which the lower end cap 522 fits over and is threadedly connected to. The inner side of the threaded portion of the thermocouple mounting block 521 has an inner conical surface, and the O-ring is pressed against the inner conical surface through the O-ring clamping ring 5221 to seal the outer ring of the thermocouple 51. The internal thread of the lower end cover 522 is engaged with the external thread of the thermocouple mounting block 521, providing a vertical upward force for the O-ring clamping ring 5221, thereby clamping the O-ring clamping ring 5221 between the lower end cover 522, the thermocouple mounting block 521 and the thermocouple 51.

[0121] The thermocouple 51 passes through the lower end cover 522 downward, and a connecting portion is provided at the lower end of the thermocouple 51 .

[0122] like Figure 17 and 18 As shown, the thermocouple installation tool 52 also includes a rotating buckle assembly and a spring assembly. The rotating buckle assembly includes a rotating buckle 5231 and a rotating buckle base 5232. The rotating buckle base 5232 is connected to the bottom of the rotating buckle 5231 and is used to clamp and fix the connecting part of the lower end of the thermocouple 51. The spring assembly includes a thermocouple adjustment fixing block 5241, a spring 5242, and a spring fixing block 5243. The spring 5242 is installed on the spring fixing block 5243, and the spring fixing block 5243 is fixed on the rotating buckle base 5232. The top of the spring 5242 is against the thermocouple 51 and always gives the thermocouple 51 a vertical upward force, so as to ensure that the thermocouple 51 probe is always in contact with the base 1. The thermocouple adjustment and fixing block 5241 is located at the bottom of the rotating snap base 5232 and is connected to it. The thermocouple adjustment and fixing block 5241 has a positioning axis. The positioning axis of the thermocouple adjustment and fixing block 5241 passes upward through the rotating snap base 5232 and extends into the spring fixing block 5243, which is used to fix the spring fixing block 5243 to prevent it from being broken open by the spring 5242.

[0123] The thermocouple installation tool 52 also includes a thermocouple vertical adjustment assembly, which specifically includes an adjustment screw 5251, an adjustment nut 5252, and a nut 5253. The adjustment screw 5251 extends in the vertical direction and passes through the rotating buckle 5231. The top of the adjustment screw 5251 is fixed to the thermocouple mounting block 521 through a retaining ring. The adjustment nut 5252 is sleeved on the adjustment screw 5251 and threadedly engaged with the adjustment screw 5251. The threaded portion of the adjustment nut 5252 passes through the rotating buckle 5231 from bottom to top, and its head abuts against the bottom end of the rotating buckle 5231. The threaded portion of the adjustment nut 5252 that extends upward from the rotating buckle 5231 is provided with an external thread, which is threadedly engaged with the nut 5253. The bottom of the nut 5253 abuts against the top of the rotating buckle 5231. By rotating the adjusting screw 5251 , the adjusting nut 5252 can be vertically lifted and lowered along the adjusting screw 5251 , thereby driving the rotating buckle 5231 to lift and lower, thereby achieving the purpose of adjusting the vertical displacement of the thermocouple 51 .

[0124] The thermocouple mounting fixture 52 also includes a thermocouple vertical displacement measurement assembly, specifically comprising a support arm 5261, a dial indicator fixing block 5262, and a dial indicator 5263. A rotating buckle 5231 is secured to the support arm 5261. The support arm 5261 is screwed to the thermocouple mounting block 521, the dial indicator fixing block 5262 is screwed to the support arm 5261, and the dial indicator 5263 is screwed to the dial indicator fixing block 5262. The measuring needle of the dial indicator 5263 rests on the rotating buckle base 5232 to measure the vertical displacement of the thermocouple 51.

[0125] like Figure 15 and Figure 16 As shown, the slip ring assembly 53 includes a slip ring connecting block 531, a slip ring claw 532, a slip ring 533, a first gear 534, a second gear 535, a third gear 536, a stepped shaft 537, and a gear fixing block 538. The first gear 534 is in driving connection with the rotating motor 422, the top end of the stepped shaft 427 is connected to the first gear 534, the bottom end of the stepped shaft 427 is connected to the second gear 535, and the third gear 536 is meshed with the second gear 535 so that the third gear 536 rotates synchronously with the thermocouple 51. Other components connected to the thermocouple 51 are arranged on the top of the third gear 536 and rotate therewith.

[0126] The slip ring connecting block 531 is connected to the mounting bracket 421 and extends downward. The gear fixing block 538 is connected to the bottom end of the slip ring connecting block 531. The stepped shaft 427 and the slip ring connecting block 531 are parallel to each other, and the bottom end is rotatably connected to the gear fixing block 538. The first gear 534 is located at the top of the stepped shaft 427 and meshes with the driven gear 425. The second gear 535 is located at the bottom of the stepped shaft 427 and above the gear fixing block 538. The gear fixing block 538 is used to limit the axial displacement of the first gear 534, the stepped shaft 427, and the second gear 535. The slip ring claw 532 is connected to the bottom end of the gear fixing block 538. The slip ring 533 is located below the third gear 536. The slip ring 533 and the third gear 536 are coaxial and transmission-connected. The slip ring claw 532 surrounds the slip ring 533 and is rotatably arranged relative to the slip ring claw 532.

[0127] When the rotating motor 422 starts working, the power is transmitted to the first gear 534 through the driven gear 425, and is transmitted downward to the second gear 535 by the stepped shaft 427. The second gear 535 transmits the power to the third gear 536. The third gear 536 drives the slip ring 533 and the driven gear 425 to rotate synchronously, thereby causing the component installed on the third gear 536 to rotate synchronously with the thermocouple 51, thereby preventing the wires connecting the thermocouple 51 and the component from being entangled due to the rotation of the thermocouple 51.

[0128] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0129] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0130] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0131] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0132] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0133] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A wafer transmission device in an epitaxial device, characterized in that: include: A base (1), the base (1) is used to carry a wafer, and the base (1) is provided with a plurality of through holes (11); A lifting module (3), the lifting module (3) comprises a base (31), a wafer lifting assembly (32), and an integral lifting assembly (33), the wafer lifting assembly (32) and the integral lifting assembly (33) are both arranged on the base (31), the wafer lifting assembly (32) comprises a lifting shaft (321) extending in a vertical direction and a plurality of ejector pins (322) arranged at the top of the lifting shaft (321), the lifting shaft (321) is movably arranged in the vertical direction, the plurality of ejector pins (322) pass through the plurality of through holes (11) from bottom to top in a one-to-one correspondence and abut against the bottom of the wafer for lifting the wafer, and the integral lifting assembly (33) comprises an integral lifting drive block (331) movably arranged in the vertical direction; A rotating module (4), wherein the integral lifting drive block (331) is connected to the rotating module (4) for lifting the rotating module (4), wherein the rotating module (4) comprises a rotating shaft (41), a dynamic sealing assembly (42), and a bellows assembly (43), wherein the top end of the bellows assembly (43) is sealed with the reaction chamber, and the bottom end of the bellows assembly (43) is connected with the dynamic sealing assembly (42), wherein the top end of the rotating shaft (41) is circumferentially limited to the base (1) to drive the base (1) to rotate around the central axis of the rotating shaft (41), wherein the rotating shaft (41) is coaxial with the lifting shaft (321), wherein the rotating shaft (41) sequentially passes through the dynamic sealing assembly (42) and the bellows assembly (43) from bottom to top and extends into the reaction chamber, and wherein a portion of the lifting shaft (321) is located in the bellows assembly (43) and passes upward through the bellows assembly (43) and then extends into the reaction chamber; An adjustment module (2), the adjustment module (2) comprising a frame (21) and an adjustment component, the frame (21) being used to be connected to the reaction chamber, the adjustment component being arranged on the frame (21) and connected to the base (31), the adjustment component being used to adjust the position of the base (31) along an X-axis direction and a Y-axis direction, and also being used to adjust the horizontality of the base (31), wherein the X-axis and the Y-axis are both in a horizontal direction and perpendicular to each other; The adjustment assembly comprises a base plate (211), a horizontal adjustment assembly (24), an X-axis adjustment assembly (22) and a Y-axis adjustment assembly (23); the horizontal adjustment assembly (24) is arranged on the frame (21) and is used to adjust the horizontality of the base plate (211); the X-axis adjustment assembly (22) is arranged on the base plate (211) and uses the base plate (211) as a support to adjust the position of the Y-axis adjustment assembly (23) along the X-axis; the Y-axis adjustment assembly (23) uses the X-axis adjustment assembly (22) as a support to adjust its own position along the Y-axis; and the Y-axis adjustment assembly (23) is connected to the base (31); The horizontal adjustment assembly (24) includes a plurality of wedge-shaped adjustment blocks (241). The wedge-shaped adjustment blocks (241) are movably arranged on the frame (21) along the horizontal direction. The top surface of the wedge-shaped adjustment block (241) is an inclined surface. The bottom plate (211) and the top surface of the wedge-shaped adjustment block (241) are against each other. The height of the wedge-shaped adjustment block (241) embedded in the bottom plate (211) is adjusted by adjusting the relative position of the wedge-shaped adjustment block (241). The plurality of wedge-shaped adjustment blocks (241) are arranged at intervals along the circumference to achieve horizontal adjustment of the bottom plate (211), and there are at least three wedge-shaped adjustment blocks (241).

2. The wafer transmission device in the epitaxial equipment according to claim 1, characterized in that: The X-axis adjustment assembly (22) includes an X-axis connecting rod, an X-axis driving block (224), an X-axis adjusting block (225), an X-axis adjusting plate (228), and an X-axis adjusting pin (227); the Y-axis adjustment assembly (23) includes a Y-axis connecting rod, a Y-axis driving block (234), a Y-axis adjusting block (235), a Y-axis adjusting plate (238), and a Y-axis adjusting pin (237); the Y-axis adjusting plate (238) and the base (31) are fixed to each other. The X-axis adjustment plate (228) is arranged on one side of the base plate (211) and is parallel to the base plate (211); the X-axis connecting rod is rotatably connected to the base plate (211) and is parallel to the base plate (211); the X-axis adjustment block (225) is swingably connected to the base plate (211); the X-axis driving block (224) is rotatably connected to one end of the X-axis adjustment block (225) that swings; the X-axis driving block (224) is threadedly engaged with the X-axis connecting rod and rotates with the X-axis. The rotation of the connecting rod moves along the X-axis connecting rod, the X-axis adjusting pin (227) is connected to the other end of the swinging X-axis adjusting block (225), the X-axis adjusting plate (228) is provided with a first waist-shaped hole (2281) extending along the Y-axis, a part of the X-axis adjusting pin (227) extends into the first waist-shaped hole (2281), and under the drive of the X-axis connecting rod, the X-axis adjusting block (225) swings and moves the X-axis adjusting plate (228) along the X-axis through the X-axis adjusting pin (227); The Y-axis adjustment plate (238) is parallel to the X-axis adjustment plate (228) and the two are connected so as to be relatively movable along the Y-axis. The Y-axis connecting rod is rotatably connected to the Y-axis adjustment plate (238) and is parallel to the base plate (211). The Y-axis adjustment block (235) is swingably connected to the Y-axis adjustment plate (238). The Y-axis driving block (234) is rotatably connected to one end of the Y-axis adjustment block (235) that is swingable. The Y-axis driving block (234) is threadedly engaged with the Y-axis connecting rod and rotates with the Y-axis connecting rod. The Y-axis adjusting block (235) is connected to the other end of the Y-axis adjusting block (235) and the Y-axis adjusting pin (237) is connected to the other end of the Y-axis adjusting block (235). The X-axis adjusting plate (228) is provided with a second waist-shaped hole (2282) extending along the X-axis. A part of the Y-axis adjusting pin (237) extends into the second waist-shaped hole (2282). Under the drive of the Y-axis connecting rod, the Y-axis adjusting block (235) swings and uses the Y-axis adjusting pin (237) as a support to move the Y-axis adjusting plate (238) relative to the X-axis adjusting plate (228) along the Y-axis.

3. The wafer transmission device in the epitaxial growth equipment according to any one of claims 1 to 2, characterized in that: The wafer lifting assembly (32) also includes a first driving mechanism, a first screw rod (326), a first slider (327), and a lifting shaft driving block (328). The first driving mechanism is used to drive the first screw rod (326) to rotate. The first screw rod (326) extends in a vertical direction. The first slider (327) and the first screw rod (326) are threadedly matched and move up and down with the rotation of the first screw rod (326). The lifting shaft driving block (328) and the first slider (327) are fixed to each other. The lifting shaft (321) and the lifting shaft driving block (328) are fixed to each other.

4. The wafer transmission device in the epitaxial equipment according to claim 3, characterized in that: The lifting shaft (321) is sleeved with the rotating shaft (41), the bellows assembly (43) includes a first bellows (431) and a second bellows (432), the wafer lifting assembly (32) also includes a bellows separation mounting block (329) and a lifting shaft fixing block (3210), the bellows separation mounting block (329) and the lifting shaft driving block (328) are fixed to each other, the bellows separation mounting block (329) is annular, the first bellows (43 1) The bottom end is sealed and connected to the top end of the bellows separation mounting block (329); the top end of the second bellows (432) is sealed and connected to the bottom end of the bellows separation mounting block (329); the lifting shaft fixing block (3210) is located inside the bellows separation mounting block (329) and is fixed to the bellows separation mounting block (329); the lifting shaft fixing block (3210) is sleeved on the lifting shaft (321) and is fixed to the lifting shaft (321).

5. The wafer transmission device in the epitaxial device according to any one of claims 1 to 2 and 4, characterized in that: The integral lifting assembly (33) comprises a second driving mechanism, a second screw rod (333) and a second slider (334); the second driving mechanism is used to drive the second screw rod (333) to rotate; the second screw rod (333) extends in a vertical direction; the second slider (334) is threadedly engaged with the second screw rod (333) and moves up and down as the second screw rod (333) rotates; the integral lifting driving block (331) and the second slider (334) are fixed to each other.

6. The wafer transmission device in the epitaxial equipment according to claim 1, characterized in that: The rotating module (4) further comprises a mounting frame (421), a rotating motor (422), a rotating transition piece (423), a meshed driving gear (424) and a driven gear (425); the integral lifting drive block (331) is connected to the mounting frame (421); the rotating motor (422) is arranged on the mounting frame (421) and drives the driven gear (425) to rotate by driving the driving gear (424); the rotating transition piece (423) is sleeved on the rotating shaft (41) and is circumferentially fixed to the rotating shaft (41); the driven gear (425) drives the rotating shaft (41) to rotate through the rotating transition piece (423); the dynamic sealing assembly (42) is a magnetic fluid sealing assembly, which is arranged on the mounting frame (421) and has a rotatable inner ring; a portion of the rotating transition piece (423) is fitted inside the inner ring and is circumferentially fixed to the inner ring.

7. The wafer transmission device in the epitaxial equipment according to claim 6, characterized in that: The rotation module (4) further includes a sensor assembly (44), the sensor assembly (44) including a sensor sheet metal (441), a first sensor paddle (442), and a first photoelectric sensor (443), the sensor sheet metal (441) being mounted on the mounting frame (421), the first photoelectric sensor (443) being mounted on the sensor sheet metal (441), the first sensor paddle (442) rotating with the driven gear (425), and the first photoelectric sensor (443) being used to record the number of times the first sensor paddle (442) passes to feed back the rotation speed of the rotating shaft (41).

8. The wafer transmission device in the epitaxial equipment according to claim 1, 6 or 7, characterized in that: The bellows assembly (43) includes a bellows, a bellows-cavity connector, a horizontal support plate (435), and a vertical support plate (436). The bellows-cavity connector is connected to the top of the bellows. The bellows-cavity connector is used to be connected to the reaction chamber. The bellows-cavity connector is connected to the horizontal support plate (435) in an adjustable manner along the X-axis. The horizontal support plate (435) is connected to the vertical support plate (436) in an adjustable manner along the Y-axis. The vertical support plate (436) is connected to the base (31) in an adjustable manner in the vertical direction.

9. The wafer transmission device in the epitaxial equipment according to claim 8, characterized in that: The lifting module (3) further includes a connecting member lifting assembly (34), the connecting member lifting assembly (34) including a third driving mechanism, a third screw rod (342) and a third slider (343), the third driving mechanism driving the third screw rod (342) to rotate, the third screw rod (342) extending in a vertical direction, the third slider (343) and the third screw rod (342) being threadedly engaged and moving up and down as the third screw rod (342) rotates, and the third slider (343) is fixed to the vertical support plate (436) or the base (31).

10. The wafer transmission device in the epitaxial equipment according to claim 8, characterized in that: The vertical support plate is provided with one of a first slide rail and a first slide groove, and the horizontal support plate is provided with the other of the first slide rail and the first slide groove, both of the first slide rail and the first slide groove extend along the Y-axis direction, and the first slide rail is engaged in the first slide groove and can slide along the first slide groove; and / or, The horizontal support plate is provided with one of the second slide rail and the second slide groove, and the bellows-cavity connector is provided with the other of the second slide rail and the second slide groove. Both the second slide rail and the second slide groove extend along the X-axis direction, and the second slide rail is engaged in the second slide groove and can slide along the second slide groove.

11. The wafer transmission device in the epitaxial equipment according to claim 6 or 7, characterized in that: The invention also includes a temperature measuring module (5), wherein the temperature measuring module (5) includes a thermocouple (51) and a thermocouple mounting tool (52), wherein the thermocouple (51) is inserted into the rotating shaft (41) and rotates synchronously with the rotating shaft (41), wherein the top temperature measuring head thereof abuts against the bottom of the base (1), and the bottom end thereof passes through the rotating transition piece (423) and extends downward, and wherein the thermocouple mounting tool (52) includes a rotating buckle assembly and a spring (5242), wherein the rotating buckle assembly is clamped to the bottom end of the thermocouple (51), and the spring is arranged on the rotating buckle assembly, and the spring (5242) applies an upward force to the thermocouple (51) with the rotating buckle assembly as support.

12. The wafer transmission device in the epitaxial equipment according to claim 11, characterized in that: The thermocouple installation tool (52) further comprises a thermocouple vertical adjustment assembly, which acts on the rotary buckle assembly and is used to adjust the position of the rotary buckle assembly in the vertical direction to adjust the position of the thermocouple (51) in the vertical direction.

13. The wafer transmission device in the epitaxial equipment according to claim 12, characterized in that: The thermocouple installation tool (52) further includes a dial indicator (5263), wherein the measuring needle of the dial indicator (5263) abuts against the rotating buckle assembly and is used to measure the relative displacement of the thermocouple (51) in the vertical direction.

14. The wafer transmission device in the epitaxial equipment according to claim 11, characterized in that: The invention also includes a slip ring assembly (53), wherein the slip ring assembly (53) includes a first gear (534), a second gear (535), a third gear (536), and a stepped shaft (537). The first gear (534) is connected to the rotating motor (422) in a transmission manner. The top end of the stepped shaft (537) is connected to the first gear (534), and the bottom end of the stepped shaft (537) is connected to the second gear (535). The third gear (536) is meshed with the second gear (535). The third gear (536) rotates synchronously with the thermocouple (51). Other components connected to the thermocouple (51) are arranged on the top of the third gear (536) and rotate with it.

15. The wafer transmission device in the epitaxial equipment according to claim 1, characterized in that: The lifting module (3) further includes three second photoelectric sensors (313), which are arranged on the base (31) at intervals in the vertical direction, wherein at least the second photoelectric sensor located in the middle is adjustable in the vertical direction. The wafer lifting assembly (32) further includes a second sensor paddle (3212) that rises and falls with the lifting shaft (321), and the second sensor paddle (3212) corresponds to each second photoelectric sensor (313) in the vertical direction, so that the second photoelectric sensor (313) can sense the position of the second sensor paddle (3212).

Images