A chip heat dissipation structure and heat dissipation method
By introducing chip heat dissipation structures and microfluidic heat dissipation methods into flexible electronic systems, the problem of insufficient heat dissipation capacity of flexible electronic devices is solved, achieving efficient thermal management and stress buffering, and improving the heat dissipation efficiency and reliability of flexible electronic systems.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
- Filing Date
- 2023-02-23
- Publication Date
- 2026-05-05
AI Technical Summary
In the existing technology, the heat dissipation capacity of flexible electronic devices is limited, making it difficult to meet the heat dissipation requirements of high-power chips. Furthermore, the low thermal conductivity of flexible materials leads to serious thermal management problems, and the heat dissipation reliability of flexible electronic systems is low under complex operating conditions.
The chip heat dissipation structure includes a structural layer, a first flexible manifold layer, and a second flexible manifold layer. It has a cooling medium inlet and outlet, and the cooling medium is evenly distributed into the microchannel structure through a liquid distribution channel. Combined with a multi-layer flexible manifold design with gradient hardness, a heat dissipation module is formed, and the coolant is directly pumped to the hot spot of the chip for heat dissipation.
It improves heat dissipation efficiency, suppresses heat accumulation in high-power chips, enhances the heat dissipation capacity of flexible electronic systems, buffers stress impacts under complex operating conditions, and improves the operational reliability of chips.
Smart Images
Figure CN116314082B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip thermal management technology, and in particular to a chip heat dissipation structure and heat dissipation method. Background Technology
[0002] In the application of flexible electronics, such as flexible wearable devices, foldable electronic devices, and biomimetic soft robots, the pursuit of improved overall system performance and the ability to withstand more complex working conditions has driven the miniaturization, integration, and intelligence of flexible electronic chips. For example, the design of biomimetic robots is no longer limited to simple daily activities but is evolving towards full intelligence, highly mimicking human behavior. This has led to a significant increase in the demand for system computing power. Consequently, more and more high-power chips, such as high-performance computing chips, are being integrated into flexible electronic systems. However, while the use of high-performance integrated circuits improves information processing capabilities, it also causes localized heat accumulation, leading to serious thermal management problems. Furthermore, the low thermal conductivity of flexible materials poses a significant challenge to the heat dissipation of high-power chips in flexible electronic devices. Additionally, the repeated mechanical impacts required for flexible electronic devices present a major challenge to packaging reliability.
[0003] Traditional high-power chip heat dissipation solutions, mostly employing rigid structures, struggle to meet the requirements of flexible electronics, lightweight design, and deformability. Flexible substrate heat dissipation solutions for flexible electronic devices, such as flexible heat pipes and flexible heat dissipation films, enhance the thermal conductivity of flexible structures through material modification, resulting in better heat transfer and temperature uniformity while adapting to flexible operating environments. However, their heat dissipation capacity is limited and cannot meet the heat dissipation needs of high-power chips.
[0004] Therefore, a more reliable chip heat dissipation solution is provided. Summary of the Invention
[0005] The purpose of this invention is to provide a chip heat dissipation structure and method to solve the problem that the heat dissipation capacity of the prior art is limited and it is difficult to meet the heat dissipation requirements of high-power chips.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] In a first aspect, the present invention provides a chip heat dissipation structure, comprising:
[0008] Structural layer, first flexible manifold layer and second flexible manifold layer;
[0009] Both the first flexible manifold layer and the second flexible manifold layer are provided with a cooling medium inlet and a cooling medium outlet; the first flexible manifold layer is disposed above the second flexible manifold layer, and the cooling medium inlet and cooling medium outlet on the first flexible manifold layer are correspondingly connected to the cooling medium inlet and cooling medium outlet on the second flexible manifold layer.
[0010] The first flexible manifold layer is also provided with a liquid distribution channel, which is connected to the cooling medium inlet and the cooling medium outlet provided on the first flexible manifold layer;
[0011] The structural layer is disposed above the first flexible manifold layer, and a microchannel structure is provided on the side of the structural layer near the first flexible manifold layer. The cooling working fluid is uniformly dispersed into the microchannel structure through the liquid distribution channel.
[0012] Optionally, the chip heat dissipation structure includes multiple layers of flexible manifolds with gradient hardness; the first flexible manifold layer and the second flexible manifold layer each include multiple layers of flexible manifolds; the multiple layers of flexible manifolds are arranged in a ladder shape, and the hardness of the flexible manifolds located closer to the chip is greater than the hardness of the flexible manifolds located farther away from the chip.
[0013] Optionally, the microchannel structure includes multiple microchannels, and each of the microchannels is arranged parallel to each other along the length of the structural layer.
[0014] Optionally, at least one first cooling medium inlet and at least one first cooling medium outlet are provided on any one of the peripheral sidewalls of the second flexible manifold layer;
[0015] The top sidewall of the second flexible manifold layer is provided with a second cooling medium inlet for corresponding communication with the first cooling medium inlet and a second cooling medium outlet for corresponding communication with the first cooling medium outlet.
[0016] The first flexible manifold layer is provided with a third cooling medium inlet for corresponding communication with the second cooling medium inlet and a third cooling medium outlet for corresponding communication with the second cooling medium outlet.
[0017] Optionally, the dispensing channel includes a first dispensing channel and a second dispensing channel;
[0018] Multiple first liquid distribution channels and multiple second liquid distribution channels are provided between the third cooling medium inlet and the third cooling medium outlet, and each of the first liquid distribution channels is connected to the third cooling medium inlet, and each of the second liquid distribution channels is connected to the third cooling medium outlet.
[0019] Each of the first liquid distribution channels is arranged to intersect with each of the multiple second liquid distribution channels.
[0020] Optionally, the microchannel structure may be an embedded microchannel structure or a microfluidic cooling plate structure.
[0021] The microchannel structure includes at least microchannels and micropillars.
[0022] Optionally, the flexible manifold uses a flexible material as the base material, and by adding different proportions of curing agent, flexible manifolds with different hardness can be obtained;
[0023] The flexible manifolds in each layer are connected to each other, and the flexible manifolds are connected to the microchannel structure by bonding.
[0024] Optionally, the chip heat dissipation structure is applied to flexible electronic devices; the flexible electronic devices include at least flexible wearable devices, foldable electronic devices, or biomimetic soft robots.
[0025] Compared with the prior art, the present invention provides a chip heat dissipation structure, including: a structural layer, a first flexible manifold layer, and a second flexible manifold layer; the second flexible manifold layer is provided with a cooling medium inlet and a cooling medium outlet; the first flexible manifold layer is disposed above the second flexible manifold layer, and the first flexible manifold layer is also provided with a cooling medium inlet and a cooling medium outlet for corresponding communication with the cooling medium inlet and cooling medium outlet on the second flexible manifold layer; the first flexible manifold layer is also provided with a liquid distribution channel, which is connected to the cooling medium inlet and cooling medium outlet on the first flexible manifold layer; the structural layer is disposed above the first flexible manifold layer, and the structural layer is provided with a microchannel structure on the side close to the first flexible manifold layer, through which the cooling medium is uniformly dispersed into the microchannel structure. Introducing flexible manifolds and microfluidic cooling into the thermal management of high-power chips in flexible electronic systems allows for the direct pumping of coolant to the hot spots of high-power chips in flexible electronic systems via microfluidic cooling, rapidly removing heat and effectively improving heat dissipation efficiency. The flexible manifold structure not only effectively reduces the high system pressure drop of the microfluidic cooling module and shortens the flow path of fluid within the microfluidic channel, thus improving heat dissipation efficiency and effectively suppressing heat accumulation caused by high-power chips in flexible electronic systems, but also adapts to the flexible operating environment of flexible electronic systems.
[0026] In a second aspect, the present invention provides a chip heat dissipation method, which uses the above-mentioned chip heat dissipation structure for heat dissipation, the method comprising:
[0027] Cooling medium is injected into the first cooling medium inlet on the peripheral sidewall of the second flexible manifold layer;
[0028] The cooling medium enters the third cooling medium inlet of the first flexible manifold layer from the second cooling medium inlet on the top sidewall of the second flexible manifold layer through the flexible manifold of the second flexible manifold layer, and then enters the liquid distribution channel on the first flexible manifold layer through the flexible manifold of the first flexible manifold layer.
[0029] The cooling medium is dispersed into the microchannel structure of the structural layer below the chip substrate through the liquid distribution channel, and the cooling medium discharges the chip heat through the cooling medium outlets of the first flexible manifold layer and the second flexible manifold layer.
[0030] Optionally, after dispersing the cooling working fluid into the microchannel structure of the structural layer below the chip substrate through the liquid distribution channel, the method further includes:
[0031] The cooling medium passing through the microchannel structure is recovered by the liquid distribution channel;
[0032] The liquid distribution channel allows the cooling working fluid that has passed through the microfluidic structure to pass through the third cooling working fluid outlet of the first flexible manifold layer.
[0033] The cooling medium enters the flexible manifold of the second flexible manifold layer through the flexible manifold of the first flexible manifold layer from the second cooling medium outlet on the top sidewall of the second flexible manifold layer, and is discharged through the first cooling medium outlet on the peripheral sidewall of the second flexible manifold layer.
[0034] By adopting the heat dissipation structure provided in the first aspect and combining it with the liquid cooling method provided in the second aspect, the coolant is directly pumped to the hot spot of the chip to quickly remove heat, which can effectively improve heat dissipation efficiency. Attached Figure Description
[0035] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:
[0036] Figure 1 This is a schematic diagram of the chip heat dissipation structure provided by the present invention;
[0037] Figure 2 This is a schematic diagram of the chip heat dissipation method provided by the present invention;
[0038] Figure 3 This is a schematic diagram illustrating the fabrication of the chip heat dissipation structure provided by the present invention.
[0039] Figure label:
[0040] 1-Structural layer, 2-First flexible manifold layer, 3-Second flexible manifold layer, 4-Dispensing channel, 5-Microchannel structure, 6-First cooling medium inlet, 7-Second cooling medium inlet, 8-Third cooling medium inlet, 9-First cooling medium outlet, 10-Second cooling medium outlet, 11-Third cooling medium outlet. Detailed Implementation
[0041] To facilitate a clear description of the technical solutions in the embodiments of the present invention, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. For example, the first threshold and the second threshold are merely used to distinguish different thresholds and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" are not necessarily different.
[0042] It should be noted that in this invention, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in this invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.
[0043] In this invention, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, a combination of a and b, a combination of a and c, a combination of b and c, or a, b, and c, where a, b, and c can be single or multiple.
[0044] In existing technologies, traditional high-power chip heat dissipation solutions, mostly employing rigid structures, struggle to meet the requirements of flexible electronics, lightweight design, and deformability. While flexible substrate heat dissipation solutions for flexible electronic devices, such as flexible heat pipes and flexible heat dissipation films, enhance the thermal conductivity of flexible structures through material modification, resulting in better heat transfer and temperature uniformity while adapting to flexible operating environments, their heat dissipation capacity is limited and insufficient to meet the heat dissipation demands of high-power chips. In summary, to effectively suppress heat accumulation caused by high-power chips in flexible electronic systems, a highly efficient heat dissipation method adapted to flexible operating environments is needed. Furthermore, the complex operating conditions in flexible electronic systems can cause stress impacts on chips, leading to low heat dissipation reliability.
[0045] To address this issue, the present invention proposes a chip heat dissipation structure and method. The solutions provided in the embodiments of this specification will now be described in conjunction with the accompanying drawings:
[0046] Example 1
[0047] This invention provides a heat dissipation solution for high-power chips in flexible electronic devices. It involves fabricating a manifold with a multi-layered flexible substrate exhibiting gradient stiffness, assembling it into a liquid supply, collection, and distribution structure, and then bonding it to a microchannel structure to form a heat dissipation module. Compared to traditional flexible heat sinks, the flexible manifold evenly distributes coolant into the microchannels beneath the chip, relying on the coolant to carry away heat from the chip. This shortens the heat transfer path, reduces thermal resistance, and enhances heat exchange capacity, solving the problem of efficient heat dissipation for high-power chips on flexible substrates with low thermal conductivity. Furthermore, the gradient stress-buffered flexible manifold design addresses the reliability issues caused by stress shocks to the chip under complex operating conditions in flexible electronic systems. While ensuring efficient heat dissipation, it also buffers the stress shocks experienced by the chip in its flexible operating environment.
[0048] Specifically, it can be combined with Figure 1 To explain, Figure 1 This is a schematic diagram of the chip heat dissipation structure provided by the present invention. Figure 1 As shown, the chip heat dissipation structure includes at least: a structural layer 1, a first flexible manifold layer 2, and a second flexible manifold layer 3;
[0049] Both the first flexible manifold layer 2 and the second flexible manifold layer 3 are provided with a cooling medium inlet and a cooling medium outlet; the first flexible manifold layer 2 is disposed above the second flexible manifold layer 3, and the cooling medium inlet and cooling medium outlet on the first flexible manifold layer 2 are correspondingly connected to the cooling medium inlet and cooling medium outlet on the second flexible manifold layer 3.
[0050] The first flexible manifold layer 2 is also provided with a liquid distribution channel 4, which is connected to the cooling medium inlet and the cooling medium outlet provided on the first flexible manifold layer 2.
[0051] The structural layer 1 is disposed above the first flexible manifold layer 2. The structural layer 1 has a microchannel structure 5 on the side close to the first flexible manifold layer 2. The cooling working fluid is uniformly dispersed into the microchannel structure 5 through the liquid distribution channel 4.
[0052] Figure 1 The structure incorporates flexible manifolds and microfluidic heat dissipation into the thermal management of high-power chips in flexible electronic systems. Through microfluidic heat dissipation, coolant is directly pumped to the hot spots of high-power chips in flexible electronic systems, quickly removing heat and effectively improving heat dissipation efficiency. The flexible manifold structure not only effectively reduces the high system pressure drop of the microfluidic heat dissipation module and shortens the flow path of fluid inside the microfluidic channel, thus improving heat dissipation efficiency and effectively suppressing heat accumulation caused by high-power chips in flexible electronic systems, but also adapts to the flexible working environment of flexible electronic systems.
[0053] based on Figure 1 The embodiments in this specification also provide some specific structural details and connection relationships of the structure, which will be described below.
[0054] Optionally, the chip heat dissipation structure may include multiple layers of flexible manifolds with gradient hardness; the first flexible manifold layer 2 and the second flexible manifold layer 3 each include multiple layers of flexible manifolds; the multiple layers of flexible manifolds are arranged in a ladder shape, and the flexible manifolds closer to the chip have a higher hardness than the flexible manifolds farther from the chip. Figure 1 As shown, the manifold hardness in the first flexible manifold layer 2 is greater than that in the second flexible manifold layer 3.
[0055] Using the above method, a manifold with a multi-layered flexible substrate and gradient hardness is fabricated, assembled into a liquid supply, collection, and distribution structure, and then bonded to a microchannel structure to form a heat dissipation module. Compared to traditional flexible heat sinks, the flexible manifold evenly distributes the coolant into the microchannels beneath the chip, relying on the coolant to remove heat from the chip. Furthermore, the gradient stress-buffered flexible manifold design solves the reliability problem of stress impact on the chip under complex operating conditions in flexible electronic systems. While ensuring efficient heat dissipation, it can also buffer the stress impact on the chip in the flexible working environment. In other words, the gradient setting of the hardness of the multi-layered flexible manifold can buffer the stress impact on the chip in the working environment of the flexible electronic system in stages, improving the reliability of chip operation.
[0056] Optionally, the microchannel structure 5 includes multiple microchannels, and each of the microchannels is arranged parallel to each other along the length of the structural layer 1.
[0057] The above setup introduces flexible manifolds and microfluidic cooling into the thermal management of high-power chips in flexible electronic systems. Microfluidic cooling pumps coolant directly beneath the chip substrate, solving the cooling problem for flexible materials with low thermal conductivity. Through microfluidic cooling, coolant is directly pumped to the hot spots of high-power chips in flexible electronic systems, quickly removing heat and effectively improving heat dissipation efficiency.
[0058] Optionally, at least one first cooling medium inlet 6 and at least one first cooling medium outlet 9 are provided on any one of the peripheral sidewalls of the second flexible manifold layer 3.
[0059] The top sidewall of the second flexible manifold layer 3 is provided with a second cooling medium inlet 7 for communicating with the first cooling medium inlet 6 and a second cooling medium outlet 10 for communicating with the first cooling medium outlet 9.
[0060] The first flexible manifold layer 2 is provided with a third cooling medium inlet 8 for corresponding communication with the second cooling medium inlet 7 and a third cooling medium outlet 11 for corresponding communication with the second cooling medium outlet 10.
[0061] The above method sets up corresponding cooling medium inlets and outlets on each layer of flexible manifold, thereby facilitating the injection of cooling medium and connecting each manifold layer, liquid distribution channel and microfluidic structure to realize chip heat dissipation in flexible electronic systems.
[0062] Optionally, the liquid distribution channel 4 includes a first liquid distribution channel 4 and a second liquid distribution channel 4; multiple first liquid distribution channels 4 and multiple second liquid distribution channels 4 are provided between the third cooling medium inlet 8 and the third cooling medium outlet 11, and each first liquid distribution channel 4 is connected to the third cooling medium inlet 8, and each second liquid distribution channel 4 is connected to the third cooling medium outlet 11;
[0063] Each of the first liquid distribution channels 4 is arranged intersecting with each of the multiple second liquid distribution channels 4.
[0064] With the above setup, the cooling medium can be evenly dispersed into the microchannel structure through the liquid distribution channel, achieving uniform heat dissipation.
[0065] Optionally, the microchannel structure 5 may be an embedded microchannel structure 5 or a microfluidic cooling plate structure;
[0066] The microchannel structure 5 includes at least microchannels and micropillars.
[0067] With the above setup, embedded microfluidic cooling can directly fabricate the cooling structure on the chip substrate, and the coolant is directly introduced into the chip for heat dissipation. This can effectively reduce the size of the cooling system, eliminate most of the thermal resistance, and significantly improve heat dissipation efficiency.
[0068] Optionally, the flexible manifold uses a flexible material as the base material, and by adding different proportions of curing agent, flexible manifolds with different hardness can be obtained;
[0069] The flexible manifolds in each layer are connected to each other, and the flexible manifolds are connected to the microchannel structure 5 by bonding.
[0070] Flexible materials can be selected according to the actual application scenario. All flexible materials in this field are within the protection scope of this invention. For example, polydimethylsilane (PDMS) can be used as the substrate in this invention. PDMS is a widely studied and used MEMS material with good flexibility and mechanical elasticity. By adding different proportions of curing agents, PDMS with different hardness can be produced.
[0071] Optionally, the chip heat dissipation structure is applied to flexible electronic devices; the flexible electronic devices include at least flexible wearable devices, foldable electronic devices, or biomimetic soft robots.
[0072] Complex operating conditions in flexible electronic systems can easily cause stress shocks to chips, and flexible electronic devices require repeated mechanical impacts, posing a significant challenge to packaging reliability. Therefore, this invention solves the reliability problem of stress shocks to chips under complex operating conditions in flexible electronic systems through a gradient stress buffering flexible manifold design. While ensuring efficient heat dissipation, it can also buffer the stress shocks experienced by the chip in its flexible working environment.
[0073] In the chip heat dissipation structure configuration of Embodiment 1 above, the technical effects of each structural configuration are as follows:
[0074] The first flexible manifold layer can improve chip stability, shorten the flow path of fluid in the microchannels, reduce pressure drop, and improve temperature uniformity and heat transfer coefficient. The second flexible manifold layer can not only provide coolant, but also act as a primary buffer to release external stress on the chip.
[0075] Embedded microfluidic cooling can directly fabricate the cooling structure on the chip substrate, and the coolant is directly introduced into the chip for heat dissipation. This can effectively reduce the size of the cooling system, eliminate most of the thermal resistance, and significantly improve heat dissipation efficiency.
[0076] By using microfluidic heat dissipation, coolant is directly pumped to the hot spots of high-power chips in flexible electronic systems to quickly remove heat and effectively improve heat dissipation efficiency.
[0077] The flexible manifold structure can not only effectively reduce the high system pressure drop of the microfluidic structure heat dissipation module and shorten the flow path of the fluid inside the microfluidic channel, thus improving the heat dissipation efficiency, but also adapt to the flexible working environment of flexible electronic systems.
[0078] Gradual setting of the hardness of multi-layer flexible manifolds can buffer the stress impact on the chip in the working environment of flexible electronic systems in stages, thereby improving the reliability of chip operation.
[0079] Example 2
[0080] Based on the chip heat dissipation structure in Embodiment 1, Embodiment 2 also provides a heat dissipation method using this chip heat dissipation structure. The following will be combined with... Figure 2 To explain, Figure 2 This is a schematic diagram of the chip heat dissipation method provided by the present invention, as shown below. Figure 2 As shown, the process may include the following steps:
[0081] Step 210: Inject cooling medium into the first cooling medium inlet on the peripheral wall of the second flexible manifold layer;
[0082] Step 220: The cooling medium enters the third cooling medium inlet of the first flexible manifold layer from the second cooling medium inlet on the top sidewall of the second flexible manifold layer through the flexible manifold of the second flexible manifold layer, and then enters the liquid distribution channel on the first flexible manifold layer through the flexible manifold of the first flexible manifold layer.
[0083] Step 230: The cooling medium is dispersed into the microchannel structure of the structural layer below the chip substrate through the liquid distribution channel, and the cooling medium discharges the chip heat through the cooling medium outlet of the first flexible manifold layer and the second flexible manifold layer.
[0084] Figure 2 The method described in this paper adopts the heat dissipation structure provided in Example 1, combined with the liquid cooling method provided in Example 2. The coolant is directly pumped to the hot spot of the chip to quickly remove the heat, which can effectively improve the heat dissipation efficiency.
[0085] based on Figure 2 In addition to the method described herein, this specification also provides some specific implementation methods of this method, which will be described below.
[0086] Optionally, after dispersing the cooling working fluid into the microchannel structure of the structural layer below the chip substrate through the liquid distribution channel, the process may further include:
[0087] The cooling medium passing through the microchannel structure is recovered by the liquid distribution channel;
[0088] The liquid distribution channel allows the cooling working fluid that has passed through the microfluidic structure to pass through the third cooling working fluid outlet of the first flexible manifold layer.
[0089] The cooling medium enters the flexible manifold of the second flexible manifold layer through the flexible manifold of the first flexible manifold layer from the second cooling medium outlet on the top sidewall of the second flexible manifold layer, and is discharged through the first cooling medium outlet on the peripheral sidewall of the second flexible manifold layer.
[0090] In this solution, the chip heat dissipation structure in Example 1 can be combined with [other components] during fabrication. Figure 3 Explanation:
[0091] Figure 3 This is a schematic diagram illustrating the fabrication of the chip heat dissipation structure provided by the present invention. Figure 3 As shown, the preparation method includes:
[0092] Step (a): Etching the microchannel structure;
[0093] Step (b): The manifold mold in the first flexible manifold layer is cast and formed;
[0094] Step (c): The manifold mold in the second flexible manifold layer is cast and formed;
[0095] Step (d): Assemble the microchannel structure, the first flexible manifold layer, and the second flexible manifold layer;
[0096] Step (e): The three-dimensional model structure of the chip heat dissipation structure is formed after assembly.
[0097] Specifically, in step (a), the flexible manifold can be directly etched onto the chip substrate using microelectromechanical systems (MEMS) fabrication technology. The flexible manifold can be fabricated using polydimethylsilane (PDMS) as the substrate. PDMS is a widely researched and used MEMS material with good flexibility and mechanical elasticity. Different hardnesses of PDMS can be produced by adding different proportions of curing agent. The flexible manifold structure can be fabricated using a mold casting method. First, a PMMA mold is fabricated, then liquid PDMS is poured into the mold, allowed to solidify, and then demolded. In steps (b) and (c), two layers of flexible manifold are fabricated using PDMS of different hardnesses. The first flexible manifold layer prepared in step (b) has a higher hardness than the second flexible manifold layer prepared in step (c). After the microfluidic structure on the chip substrate and the flexible manifold are fabricated, they are assembled together sequentially. In step (d), plasma bonding can be used to bond the silicon-based embedded channel chip to the PDMS flexible manifold, ultimately forming an embedded microfluidic heat dissipation module of the flexible manifold.
[0098] Among them, the processing of microfluidic structures includes dry etching, wet etching, mechanical and laser scribing, such as DRIE (deep silicon etching), reactive ion etching, plasma etching, chemical etching, laser etching and mechanical scribing.
[0099] Flexible manifolds are made of flexible polymers such as PDMS.
[0100] The morphology of microchannel structures can include microchannels, micropillars, etc.
[0101] The bonding methods between microchannel structures and flexible manifolds, as well as between flexible manifolds, include plasma bonding, adhesive interlayer bonding, and ultrasonic bonding.
[0102] The embodiments described in this invention are given as examples only, but are not limited to these. For example, the microchannel structure is not limited to the embedded microchannel structure, but can also be a microfluidic cooling plate, etc.; the number of manifold layers can be a multi-layer manifold with gradient hardness; the method of pumping the cooling working fluid to the chip through a flexible manifold to achieve efficient heat dissipation of high-power chips in flexible electronic systems, while also buffering external stress in stages, all fall within the protection scope of this invention.
[0103] Although the invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit can implement several functions listed in the claims. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce good results.
[0104] Although the invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made therein without departing from the spirit and scope of the invention. Accordingly, this specification and drawings are merely exemplary descriptions of the invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. Clearly, those skilled in the art can make various alterations and modifications to the invention without departing from its spirit and scope. Thus, if such modifications and modifications of the invention fall within the scope of the claims and their equivalents, the invention is also intended to include such modifications and modifications.
Claims
1. A chip heat dissipation structure, characterized in that, include: Structural layer, first flexible manifold layer and second flexible manifold layer; Both the first flexible manifold layer and the second flexible manifold layer are provided with a cooling medium inlet and a cooling medium outlet; the first flexible manifold layer is disposed above the second flexible manifold layer, and the cooling medium inlet and cooling medium outlet on the first flexible manifold layer are correspondingly connected to the cooling medium inlet and cooling medium outlet on the second flexible manifold layer. The first flexible manifold layer is also provided with a liquid distribution channel, which is connected to the cooling medium inlet and the cooling medium outlet provided on the first flexible manifold layer; The structural layer is disposed above the first flexible manifold layer. The structural layer has a microchannel structure on the side near the first flexible manifold layer. The cooling working fluid is uniformly dispersed into the microchannel structure through the liquid distribution channel. The chip heat dissipation structure includes multiple flexible manifolds with gradient hardness. The first flexible manifold layer and the second flexible manifold layer each include multiple flexible manifolds. The multiple flexible manifolds are arranged in a ladder shape, and the hardness of the flexible manifolds located closer to the chip is greater than that of the flexible manifolds located further away from the chip.
2. The structure according to claim 1, characterized in that, The microchannel structure includes multiple microchannels, and each of the microchannels is arranged parallel to each other along the length of the structural layer.
3. The structure according to claim 1, characterized in that, At least one first cooling medium inlet and at least one first cooling medium outlet are provided on any one of the peripheral sidewalls of the second flexible manifold layer; The top sidewall of the second flexible manifold layer is provided with a second cooling medium inlet for corresponding communication with the first cooling medium inlet and a second cooling medium outlet for corresponding communication with the first cooling medium outlet. The first flexible manifold layer is provided with a third cooling medium inlet for corresponding communication with the second cooling medium inlet and a third cooling medium outlet for corresponding communication with the second cooling medium outlet.
4. The structure according to claim 3, characterized in that, The liquid distribution channel includes a first liquid distribution channel and a second liquid distribution channel; Multiple first liquid distribution channels and multiple second liquid distribution channels are provided between the third cooling medium inlet and the third cooling medium outlet, and each of the first liquid distribution channels is connected to the third cooling medium inlet, and each of the second liquid distribution channels is connected to the third cooling medium outlet. Each of the first liquid distribution channels is arranged to intersect with each of the multiple second liquid distribution channels.
5. The structure according to claim 1, characterized in that, The microchannel structure adopts an embedded microchannel structure or a microfluidic cooling plate structure; The microchannel structure includes at least microchannels and micropillars.
6. The structure according to claim 1, characterized in that, The flexible manifold uses a flexible material as the base material, and by adding different proportions of curing agent, flexible manifolds with different hardness are obtained. The flexible manifolds in each layer are connected to each other, and the flexible manifolds are connected to the microchannel structure by bonding.
7. The structure according to claim 1, characterized in that, The chip heat dissipation structure is applied to flexible electronic devices; the flexible electronic devices include at least flexible wearable devices, foldable electronic devices, or biomimetic soft robots.
8. A chip heat dissipation method, characterized in that, The method of using the chip heat dissipation structure according to any one of claims 1-7 for heat dissipation includes: Cooling medium is injected into the first cooling medium inlet on the peripheral sidewall of the second flexible manifold layer; The cooling medium enters the third cooling medium inlet of the first flexible manifold layer from the second cooling medium inlet on the top sidewall of the second flexible manifold layer through the flexible manifold of the second flexible manifold layer, and then enters the liquid distribution channel on the first flexible manifold layer through the flexible manifold of the first flexible manifold layer. The cooling medium is dispersed into the microchannel structure of the structural layer below the chip substrate through the liquid distribution channel, and the cooling medium discharges the chip heat through the cooling medium outlets of the first flexible manifold layer and the second flexible manifold layer.
9. The method according to claim 8, characterized in that, After dispersing the cooling working fluid into the microchannel structure of the structural layer below the chip substrate through the liquid distribution channel, the process further includes: The cooling medium passing through the microchannel structure is recovered by the liquid distribution channel; The liquid distribution channel allows the cooling working fluid that has passed through the microfluidic structure to pass through the third cooling working fluid outlet of the first flexible manifold layer. The cooling medium enters the flexible manifold of the second flexible manifold layer through the flexible manifold of the first flexible manifold layer from the second cooling medium outlet on the top sidewall of the second flexible manifold layer, and is discharged through the first cooling medium outlet on the peripheral sidewall of the second flexible manifold layer.