Flexible circuit board film material lamination method, system and storage medium

Abstract

The present invention relates to a method, system, and storage medium for laminating thin film materials for flexible circuit boards. The method comprises: aligning a film roll and a circuit board roll to obtain cutting correction coordinates for a film cutting device; obtaining real-time cutting coordinates for the film roll based on the cutting correction coordinates of the film cutting device and the real-time identification coordinates of the circuit board roll; cutting the film roll according to the real-time cutting coordinates to obtain a film roll with a window; and separately conveying the film roll with the window and the circuit board roll to a film laminating device for lamination to obtain a finished flexible circuit board. The present invention can solve the problems of low lamination efficiency, low degree of automation, and easy lamination offset when laminating flexible circuit boards and film materials in related technologies, which affect product quality.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing, and in particular to a method, system and storage medium for laminating thin film materials of a flexible circuit board. Background Art

[0002] In recent years, driven by the growth of smartphones, personal computers (PCs), and new energy vehicles, the flexible printed circuit (FPC) market has maintained rapid annual growth. The FPC production process involves numerous film material positioning and lamination processes, including those for protective films, electromagnetic shielding films, and adhesive films.

[0003] During FPC production, it's often necessary to laminate film materials, such as protective films, onto flexible circuit boards. Traditionally, these materials are laminated using sheets, often requiring the use of jigs for positioning. This results in low lamination efficiency, a low degree of automation, and the tendency for lamination offset to occur, impacting product quality. Summary of the Invention

[0004] The present invention provides a method, system and storage medium for laminating a flexible circuit board film material, which can solve the problems in the related art of laminating a flexible circuit board and a film material, such as low lamination efficiency, low degree of automation, and easy lamination deviation, which affects product quality.

[0005] In a first aspect, the present invention provides a method for laminating a flexible circuit board film material, which is applied to a flexible circuit board film material laminating device; the device includes a film discharging device, a film cutting device, a waste material recycling device, a circuit board discharging device, a circuit board identification and positioning device, a film pressing device, a circuit board winding device, and a controller, wherein the controller is connected to each device;

[0006] The method comprises the following steps:

[0007] Align the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting equipment;

[0008] Obtaining the real-time cutting coordinates of the film roll according to the cutting correction coordinates of the film cutting device and the real-time identification coordinates of the circuit board roll;

[0009] Cutting the film roll according to the real-time cutting coordinates of the film roll to obtain a film roll with windows;

[0010] The film coil with the window and the circuit board coil are respectively conveyed to a film laminating device for lamination to obtain a finished flexible circuit board.

[0011] Optionally, the step of aligning the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting device comprises the following steps:

[0012] Align the film roll and the circuit board roll to obtain the lamination deviation between the film roll and the circuit board roll;

[0013] According to the original cutting coordinates of the film cutting device and the lamination deviation, the cutting correction coordinates of the film cutting device are obtained.

[0014] Optionally, the step of aligning the film roll and the circuit board roll to obtain a lamination deviation between the film roll and the circuit board roll comprises the following steps:

[0015] Obtaining initial recognition coordinates of an initial recognition mark of an initial segment of a circuit board of a circuit board coil, and clearing the initial recognition coordinates to set the initial recognition coordinates as origin coordinates;

[0016] Cutting the initial film segments of the film roll according to the original cutting coordinates of the film cutting device to obtain an initial film roll with windows;

[0017] Controlling a film laminating device to laminarize the initial film roll with the window and the initial circuit board segment of the circuit board roll to obtain an initial product segment of the circuit board product;

[0018] The optical measuring instrument is controlled to detect the initial product segment of the circuit board product, and the lamination deviation of the initial segment of the circuit board in the initial product segment relative to the initial film roll with the window in the forward direction and the transverse direction of the roll is obtained.

[0019] Optionally, obtaining the real-time cutting coordinates of the film roll according to the cutting correction coordinates of the film cutting device and the real-time identification coordinates of the circuit board roll comprises the following steps:

[0020] Obtaining real-time identification coordinates of subsequent identification marks of subsequent circuit board segments following the initial circuit board segment of the circuit board coil;

[0021] According to the obtained cutting correction coordinates and the real-time identification coordinates of the film cutting device, the real-time cutting coordinates of the subsequent film segment behind the initial film segment of the film roll are obtained.

[0022] Optionally, the step of cutting the film roll according to the real-time cutting coordinates of the film roll to obtain the film roll with the window includes the following steps:

[0023] After obtaining the real-time cutting coordinates of the film roll, locate the section of the film roll to be cut;

[0024] According to the real-time cutting coordinates of the film roll, the film cutting equipment is controlled to cut the to-be-cut segments of the film roll to obtain a film roll with windows.

[0025] Optionally, before aligning the film roll and the circuit board roll, the following steps are further included:

[0026] Controlling the initial cutting point of the film cutting device to coincide with a cutting positioning point pre-set on the film cutting device at a fixed coordinate position;

[0027] The initial cutting coordinates of the film cutting device are cleared, and the cleared coordinates are set as the origin cutting coordinates of the film cutting device.

[0028] Optionally, before aligning the film roll and the circuit board roll, the following steps are further included:

[0029] Control the film discharging equipment to continuously deliver the film roll to the film cutting equipment;

[0030] Control the circuit board discharging equipment to continuously convey the circuit board coil to the circuit board identification and positioning equipment.

[0031] Optionally, when the film roll with the window and the circuit board roll are separately conveyed to the film laminating device for lamination, the following steps are further included:

[0032] Control the waste recycling equipment to recycle the film waste generated when the film roll is cut;

[0033] After obtaining the finished flexible circuit board, the following steps are also included:

[0034] Control the circuit board winding equipment to rewind the finished flexible circuit board.

[0035] In a second aspect, the present invention provides a flexible circuit board film material laminating system, which is applied to a flexible circuit board film material laminating device; the device includes a film discharging device, a film cutting device, a waste material recycling device, a circuit board discharging device, a circuit board identification and positioning device, a film pressing device, a circuit board winding device, and a controller, wherein the controller is connected to each device;

[0036] The system comprises:

[0037] The alignment control module is used to align the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting equipment;

[0038] a cutting control module, in communication with the alignment control module, configured to obtain real-time cutting coordinates of the film roll based on the cutting correction coordinates of the film cutting device and the real-time identification coordinates of the circuit board roll; and cut the film roll according to the real-time cutting coordinates of the film roll to obtain a film roll with a window;

[0039] The laminating control module is in communication with the cutting control module and is used to separately convey the film roll with the window and the circuit board roll to the film laminating equipment for lamination to obtain a finished flexible circuit board.

[0040] In a third aspect, the present invention provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement all or part of the method steps of the flexible circuit board film material bonding method described above.

[0041] The beneficial effects brought about by the technical solution provided by the present invention include:

[0042] The flexible circuit board film material laminating method provided by the present invention can realize roll-to-roll lamination of film materials and flexible circuit boards. Before the film roll and the circuit board roll are formally laminated, the two need to be aligned and checked to detect whether there is a lamination deviation when the film roll and the circuit board roll are laminated. When it is detected that there is a lamination deviation between the film roll and the circuit board roll during the lamination process, the cutting correction coordinates of the film cutting equipment for cutting the film roll can be obtained. Then, the film roll can be formally cut according to the cutting correction coordinates. During the formal cutting, the real-time identification coordinates of the circuit board roll can be obtained first, and then the real-time cutting coordinates of the corresponding film roll can be obtained. The film roll is then cut according to the obtained real-time cutting coordinates, so that a film roll with a window that completely corresponds to the circuit board segment on the circuit board roll is cut on the film roll. Then, the cut film roll with a window and the circuit board roll are transported to a film pressing equipment for pressing and laminating, so that the film roll with the window and the circuit board segment of the circuit board roll completely correspond to each other and are laminated. In this way, not only can the roll-to-roll continuous bonding of film materials and flexible circuit boards be achieved, the degree of bonding automation and bonding efficiency can be improved, but the film materials and flexible circuit boards can also be bonded neatly without bonding deviations, providing safe and reliable protection for the flexible circuit boards and ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0044] Figure 1 This is a schematic flow chart of the steps of the flexible circuit board film material lamination method according to an embodiment of the present invention;

[0045] Figure 2 Schematic diagram of the relationship between the circuit board identification coordinates of the circuit board roll and the original cutting coordinates of the film roll in the flexible circuit board film material bonding method according to an embodiment of the present invention;

[0046] Figure 3 This is a simplified structural diagram of the flexible circuit board film material laminating device according to an embodiment of the present invention;

[0047] Figure 4 This is a simplified structural diagram of a flexible circuit board film material bonding system according to an embodiment of the present invention. DETAILED DESCRIPTION

[0048] The technical solutions of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments. It should be noted that the embodiments of the present invention and the features therein may be combined with each other unless there is a conflict.

[0049] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0050] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity direction; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above directional words are not used to limit the present invention.

[0051] During the FPC production process, film materials often need to be laminated onto flexible circuit boards. Conventional techniques typically use sheets to laminate the flexible circuit board and film materials, often requiring molds for positioning. This results in low lamination efficiency, a low degree of automation, and the tendency for lamination offset to occur, impacting product quality. To address these technical issues, the present invention proposes a method and system for laminating thin film materials onto flexible circuit boards.

[0052] Example 1

[0053] like Figure 1 As shown, this embodiment provides a flexible circuit board film material bonding method, which can be applied to a flexible circuit board film material bonding device 10 (such as Figure 3 The device may include a film discharging device 12, a film cutting device 14, a waste recycling device 16, a circuit board discharging device 13, a circuit board identification and positioning device 15, a film laminating device 17, a circuit board winding device 18, and a controller 11, which is connected to each device.

[0054] Under the control of the controller 11, the film discharging device 12 can be used to transport the film roll to the film cutting device 14, the film cutting device 14 can be used to cut the film roll to obtain a film roll with windows, the waste recycling device 16 can be used to recycle the waste generated by cutting, the circuit board discharging device 13 can be used to transport the circuit board roll to the circuit board identification and positioning device 15, the circuit board identification and positioning device 15 can be used to identify and locate the circuit board segments in the circuit board roll, the film pressing device 17 can be used to laminate the cut film roll with windows and the circuit board roll, and the circuit board winding device 18 can be used to wind up the laminated circuit board roll and the film roll with windows.

[0055] Specifically, if Figure 1 As shown, the flexible circuit board film material bonding method includes the following steps:

[0056] S100, aligning the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting device 14;

[0057] S200, obtaining the real-time cutting coordinates of the film roll according to the cutting correction coordinates of the film cutting device 14 and the real-time identification coordinates of the circuit board roll;

[0058] S300, cutting the film roll according to the real-time cutting coordinates of the film roll to obtain a film roll with windows;

[0059] S400 , conveying the film roll with the window and the circuit board roll to the film laminating device 17 for lamination to obtain a finished flexible circuit board.

[0060] The roll-to-roll bonding of film materials and flexible circuit boards can be achieved, and before the film roll and the circuit board roll are formally bonded, they need to be aligned and checked to detect whether there is a bonding deviation when the film roll and the circuit board roll are bonded; when it is detected that there is a bonding deviation between the film roll and the circuit board roll during the bonding process, the cutting correction coordinates of the film cutting device 14 for cutting the film roll can be obtained; then the film roll can be formally cut according to the cutting correction coordinates, and when formally cutting, the real-time identification coordinates of the circuit board roll can be obtained first, and then the corresponding real-time cutting coordinates of the film roll can be obtained; then the film roll is cut according to the obtained real-time cutting coordinates, so that a film roll with a window that is completely corresponding to the circuit board segment on the circuit board roll is cut on the film roll; then, the cut film roll with a window and the circuit board roll are transported to the film pressing device 17 for pressing and bonding, so that the film roll with the window and the circuit board segment of the circuit board roll are completely corresponding and bonded.

[0061] In this way, not only can the roll-to-roll continuous bonding of film materials and flexible circuit boards be achieved, the degree of bonding automation and bonding efficiency can be improved, but the film materials and flexible circuit boards can also be bonded neatly without bonding deviations, providing safe and reliable protection for the flexible circuit boards and ensuring product quality.

[0062] Furthermore, it should be noted that in this embodiment, the circuit board roll may include multiple circuit board segments connected end to end, and each circuit board segment can form a circuit board product after subsequent processing. The film roll, on the other hand, is a continuous, long strip of film material with a release film disposed on its bottom. During the lamination process of the circuit board roll and the film roll, multiple windows are cut into the continuous, long strip of film material to form a film roll with windows. Each circuit board segment corresponds to a segment of the film roll with windows, so that each segment of the film roll with windows can be completely laminated to a circuit board segment until all circuit board segments of the circuit board roll are laminated to the film roll with windows. Furthermore, when the film roll is cut, the film to be laminated attached to the release film will be cut through, but the release film will not be cut through. This ensures that the release film and the film waste attached to the release film that is cut off form a continuous roll, which is convenient for recycling.

[0063] Alternatively, multiple film sheets can be cut from a continuous strip of film material and bonded to each circuit board segment until all circuit board segments in the circuit board roll are bonded to the film sheets. A person skilled in the art can determine the bonding method for multiple film sheets to each circuit board segment by referring to the contents of this specification.

[0064] Furthermore, the film cutting device 14 may include a film cutting platform and a laser cutter located above the film cutting platform. The film cutting platform is used to place and position the film roll delivered by the film discharging device 12, while the laser cutter is used to cut the film roll positioned on the film cutting platform. To ensure accurate positioning and cutting, the film cutting platform also includes a vacuum adsorption device for vacuum adsorbing the film material on the platform. Moreover, in step 100, before aligning the film roll and the circuit board roll, the following steps may also be included:

[0065] S102 : Control the initial cutting point of the film cutting device 14 to coincide with a cutting positioning point preset on the film cutting device 14 and located at a fixed coordinate position.

[0066] Before cutting the film roll, it is necessary to first position the laser cutter of the film cutting device 14 so that the initial cutting coordinates of the laser cutter can be cleared. This makes it easier to align the film roll and the circuit board roll so that they can be accurately bonded.

[0067] When positioning the film cutting device 14 , the laser cutter of the mobile film cutting device 14 may be positioned to a cutting positioning point pre-set at a fixed coordinate position on the film cutting platform of the mobile film cutting device 14 to achieve positioning of the laser cutter.

[0068] S104 , clearing the initial cutting coordinates of the film cutting device 14 , and setting the cleared coordinates as the origin cutting coordinates of the film cutting device.

[0069] After the laser cutter of the film cutting device 14 is positioned, the origin cutting coordinates of the positioned laser cutter can be determined, so as to start cutting the film roll at the origin cutting coordinates.

[0070] In addition, the circuit board identification and positioning device 15 may include a circuit board positioning platform and a circuit board identification camera. The circuit board positioning platform is used to place and absorb the circuit board roll delivered by the circuit board discharge device 13, while the circuit board identification camera can identify and locate the circuit board roll on the circuit board positioning platform, and can obtain all the circuit board identification coordinates of the circuit board roll. Moreover, in step 100, before the film roll and the circuit board roll are aligned, the following steps may also be included:

[0071] S106 , controlling the film discharging device 12 to continuously deliver the film roll to the film cutting device 14 .

[0072] Before cutting the film roll, it is necessary to first transport the film roll on the film discharging device 12 to the film cutting platform of the film cutting device 14, and continuously place and adsorb part of the film roll on the film cutting platform to facilitate the laser cutter to cut this part of the film roll until all the film rolls are cut.

[0073] S108 , controlling the circuit board discharging device 13 to continuously convey the circuit board coil to the circuit board identification and positioning device 15 .

[0074] Before cutting the film roll, the circuit board roll must be positioned and identified so that the film roll with the window openings to be cut can be determined based on the specific information of the circuit board segments on the circuit board roll (such as the dimensions, model, coordinate position, etc.). At this time, the circuit board roll from the circuit board discharge device 13 can be transported to the circuit board positioning platform of the circuit board identification and positioning device 15. The circuit board recognition camera installed above the circuit board positioning platform can identify and locate the circuit board segments on the circuit board roll to obtain information about the circuit board segments on the circuit board roll.

[0075] Furthermore, in step 100, the film roll and the circuit board roll are aligned to obtain the cutting correction coordinates of the film cutting device 14, which may include the following steps:

[0076] S110: Align the film roll and the circuit board roll to obtain a lamination deviation between the film roll and the circuit board roll.

[0077] Before officially laminating the film roll and circuit board roll, a trial lamination and alignment check is required to detect any lamination deviation between the film roll and the circuit board roll. Deviations between the film roll and the circuit board roll indicate that they are not completely aligned, resulting in uneven lamination. Therefore, if deviations are detected during lamination, the corresponding lamination deviations can be obtained.

[0078] S120 , obtaining the corrected cutting coordinates of the film cutting device 14 according to the original cutting coordinates and the lamination deviation of the film cutting device 14 .

[0079] After obtaining the fitting deviation between the film roll and the circuit board roll during fitting through trial fitting, the laser cutter of the film cutting device 14 can be adjusted, and the cutting correction coordinates can be obtained in combination with the original cutting coordinates of the laser cutter of the film cutting device 14, so as to facilitate the subsequent cutting of the film roll according to the cutting correction coordinates to obtain a film roll with windows that can completely correspond to the circuit board segment of the circuit board roll.

[0080] Furthermore, in step S110, the film roll and the circuit board roll are aligned to obtain the lamination deviation between the film roll and the circuit board roll, which may include the following steps:

[0081] S112 , obtaining initial recognition coordinates of an initial recognition mark of an initial segment of a circuit board of the circuit board coil, and clearing the initial recognition coordinates to set the initial recognition coordinates as origin coordinates.

[0082] Before trial bonding the circuit board roll and the film roll, the circuit board recognition camera of the circuit board recognition and positioning device 15 can be controlled to first recognize the initial circuit board segment of the circuit board roll, so as to determine the initial circuit board segment of the circuit board roll, and obtain the initial recognition coordinates of the initial recognition mark of the initial circuit board segment. The initial recognition coordinates can be used as the origin coordinates of the circuit board roll, so as to calculate the coordinates of subsequent circuit board segments of the circuit board roll with the origin coordinates, and also to set the starting (cutting) coordinates of the film roll corresponding to the origin coordinates.

[0083] S114 , cutting the initial film segments of the film roll according to the original cutting coordinates of the film cutting device 14 to obtain an initial film roll with windows.

[0084] After determining the origin coordinates of the circuit board roll, the laser cutter of the film cutting device 14 can be controlled to move to the cutting origin position of the film roll, and the laser cutter of the film cutting device 14 can be controlled to cut the film roll to obtain an initial film roll with a window corresponding to the initial segment of the circuit board on the circuit board roll, and the shapes and sizes of the two correspond to each other.

[0085] Moreover, if Figure 2 As shown, when the laser cutter of the film cutting device 14 cuts the film roll, the laser cutter of the film cutting device has the original cutting coordinates (A i , B i ) (i is the serial number of the original cutting point, i = 1, 2, 3...). Specifically, since the circuit board roll and the film roll to be bonded correspond to each other, the circuit board recognition coordinates of the circuit board roll correspond to the original cutting coordinates of the film roll. Therefore, when the circuit board recognition camera obtains the circuit board recognition coordinates of the circuit board recognition point of the circuit board roll as (X j , Y j )(j is the serial number of the subsequent segment of the circuit board, j = 1, 2, 3...), the original cutting coordinates obtained by the laser cutter for cutting the film roll also correspond to (A i , B i )(i=1,2,3…).

[0086] In addition, it should be pointed out that the film roll is a continuous long strip of film material and does not need to be segmented (that is, there are no film fragments). The initial film fragments can be artificially divided fragments to correspond to the initial fragments of the circuit board. One film fragment can be cut to correspond to one flexible board fragment, or multiple film fragments can correspond to one flexible board fragment. Such a film roll can adapt to circuit board fragments of different shapes and sizes.

[0087] S116 , controlling the film laminating device 17 to laminate the initial film roll with the window and the initial circuit board segment of the circuit board roll to obtain an initial product segment of the circuit board product.

[0088] After determining the initial circuit board segment of the circuit board roll and cutting out the corresponding initial film roll with windows on the film roll, the two can be transported to the film pressing device 17 for pressing and bonding, thereby obtaining the initial product segment of the circuit board product.

[0089] S118. Control the optical measuring instrument to detect the initial product segment of the circuit board product, and obtain the lamination deviation of the initial product segment of the circuit board product relative to the initial film roll with the window in the forward direction and the transverse direction of the roll.

[0090] After obtaining the initial segment of the circuit board product, it can be inspected using an optical measuring instrument to determine whether the initial film roll with window openings and the initial segment of the circuit board are fully aligned and whether their edges completely correspond. If the initial film roll with window openings and the initial segment of the circuit board are not aligned, their edges will be misaligned. However, since the dimensions and shape of the initial film roll with window openings are cut according to the dimensions and shape of the initial segment of the circuit board, meaning that the shapes of the two are completely aligned, the misalignment between the two is due to the initial film roll with window openings being offset relative to the initial segment of the circuit board.

[0091] Therefore, when it is detected that the initial film roll with window openings and the initial circuit board segment are not aligned, the alignment deviation (X0, Y0) of the initial film roll with window openings relative to the initial circuit board segment in the length direction (i.e., the roll's forward direction) and the width direction (i.e., the roll's transverse direction) can be further detected, where X0 is the alignment deviation in the length direction and Y0 is the alignment deviation in the width direction. In this embodiment, during the lamination process, it is assumed that the film roll's forward direction and the circuit board roll's forward direction are consistent, that is, there is no angular deviation between the initial film roll with window openings and the initial circuit board segment.

[0092] Furthermore, in step S120, obtaining the corrected cutting coordinates of the film cutting device 14 according to the original cutting coordinates and the lamination deviation of the film cutting device 14 may include the following steps:

[0093] S122 , obtaining the original cutting coordinates of the film cutting device 14 . The original cutting coordinates of the film cutting device 14 are pre-set by engineers according to the pattern of the circuit board and stored in the controller 900 .

[0094] S124 , obtaining the corrected cutting coordinates of the film cutting device 14 based on the obtained original cutting coordinates of the film cutting device 14 and the obtained lamination deviation.

[0095] When it is detected that there is a fitting deviation between the initial film roll with windows and the initial segment of the circuit board, the cutting coordinate position of the film roll with windows on the film roll can be adjusted, that is, the cutting coordinates of the laser cutter of the film cutting equipment 14 can be adjusted, so that the film roll with windows obtained by cutting the film roll by the adjusted laser cutter of the film cutting equipment 14 can completely correspond to the circuit board segment of the circuit board roll, and there is no deviation.

[0096] Before adjusting the laser cutter of the film cutting device 14, the original cutting coordinates (A i , B i )(i=1, 2, 3…), combined with the lamination deviation (X0, Y0) obtained in the previous step, the cutting correction coordinates (A) of the laser cutter of the film cutting device 14 can be obtained. i -X0,B i -Y0)(i=1, 2, 3...).

[0097] Furthermore, due to the expansion and contraction characteristics of the film material, when the film material is bonded to the flexible circuit board, the film roll with windows needs to be peeled off from the release film through waste recycling equipment. During the peeling process, the film roll with windows will cause slight deformation of the film material (i.e., the expansion and contraction of the film material), which will cause the cutting correction coordinates of the laser cutter to change.

[0098] Obtain the original cutting coordinates (M1, N1) and (M2, N2) of any two original cutting points C1 and C2 on the initial film segment of the film roll. The coordinate difference between these two original cutting points during the cutting process is (M2-M1, N2-N1). There can be at least two circuit board identification points on the initial segment of the circuit board, and correspondingly, there can be at least two original cutting points on the initial film segment.

[0099] However, due to the expansion and contraction of the film material during lamination, the coordinate difference between the two original cutting points C1 and C2 after the initial segment of the circuit board and the initial segment of the film are obtained by the optical measuring instrument is (P1, Q1). The expansion and contraction deformation of the film material can be obtained as (P1 / (M2-M1), Q1 / (N2-N1)), where P1 / (M2-M1) is the expansion and contraction of the film material in the length direction (X-axis direction), and Q1 / (N2-N1) is the expansion and contraction of the film material in the width direction (Y-axis direction). Since the lamination deviation (X0, Y0) is the deviation of the film material after expansion and contraction, and the laser cutter cuts the film material before expansion and contraction, the lamination deviation (X0, Y0) needs to be corrected for the expansion and contraction before it can be used to correct the cutting correction coordinates of the laser cutter.

[0100] Therefore, after considering the expansion and contraction deformation of the film material, the cutting correction coordinates of the laser cutter can be obtained as ((A i -X0) / (P1 / (M2-M1)), (B i -Y0) / (Q1 / (N2-N1)))(i=1, 2, 3...), which are all the film cutting coordinates of the film roll.

[0101] In addition, it should be noted that this step S100 does not need to be performed every time the film roll with a window is cut and pasted, but is only performed when the device is used for the first time, or when the roll is replaced (including circuit board roll or film roll), or when the tension parameters of the device change.

[0102] In addition, in step S200, the real-time cutting coordinates of the film roll are obtained according to the cutting correction coordinates of the film cutting device 14 and the real-time identification coordinates of the circuit board roll, including the following steps:

[0103] S210: Acquire real-time identification coordinates of subsequent identification marks of subsequent circuit board segments following the initial circuit board segment of the circuit board coil.

[0104] After the film roll and the circuit board roll are aligned and the cutting correction coordinates of the laser cutter of the film cutting device 14 are obtained, the film roll and the circuit board roll can be formally bonded. At this time, the circuit board recognition camera of the circuit board recognition and positioning device 15 can be controlled to first recognize the subsequent circuit board segment of the circuit board roll (that is, the circuit board segment behind the initial circuit board segment). The subsequent circuit board segment of the circuit board roll can be determined, and the circuit board recognition coordinates (X) of the subsequent recognition mark of the subsequent circuit board segment can be obtained based on the initial recognition coordinates of the initial circuit board segment. j , Y j )(j=1,2,3…), so that it is convenient to obtain the film cutting coordinates (A) of the film roll by the circuit board identification coordinates. i+X j -X0) / (P1 / (M2-M1)), (B i +Y j -Y0) / (Q1 / (N2-N1))) (i=1, 2, 3...; j=1, 2, 3...).

[0105] Moreover, in this embodiment, both the subsequent identification mark and the initial identification mark can be identification marks such as identification dots or identification text patterns. Furthermore, a plurality of circuit board segments are sequentially arranged on the circuit board coil, wherein the first circuit board segment can be referred to as the initial circuit board segment, and the circuit board segments following the first circuit board segment (such as the second circuit board segment, the third circuit board segment, and so on) can be referred to as subsequent circuit board segments. Furthermore, each circuit board segment is provided with an identification mark, wherein the identification mark on the initial circuit board segment can be referred to as the initial identification mark, and the identification marks on the subsequent circuit board segments can be referred to as subsequent identification marks.

[0106] Specifically, the circuit board identification coordinates (X j , Y j )(j=1, 2, 3...) It can be seen that when the second circuit board segment needs to be joined, its real-time recognition coordinates can be obtained as (X1, Y1); similarly, when the third circuit board segment needs to be joined, its real-time recognition coordinates can be obtained as (X2, Y2); similarly, when the fourth circuit board segment needs to be joined, its real-time recognition coordinates can be obtained as (X3, Y3), and so on. In this embodiment, it is possible to set a circuit board recognition point on each subsequent circuit board segment, and the coordinates of the circuit board recognition point are the real-time recognition coordinates of the subsequent circuit board segment. In addition, it is possible to set multiple circuit board recognition points on each subsequent circuit board segment, and the coordinates of each circuit board recognition point are the real-time recognition coordinates of the subsequent circuit board segment.

[0107] S220 , obtaining the real-time cutting coordinates of the subsequent film segment of the film roll that is subsequent to the initial film segment of the film cutting device 14 based on the obtained cutting correction coordinates and real-time recognition coordinates of the film cutting device 14 .

[0108] Since the film roll and the circuit board roll correspond to each other during the lamination process, that is, the circuit board segment on the circuit board roll corresponds to the film segment on the film roll, and the subsequent circuit board segment on the circuit board roll corresponds to the subsequent film segment of the film roll, so that the circuit board identification coordinates (X j , Y j)(j=1, 2, 3...) corresponds to the original cutting coordinates of the subsequent film segments. Moreover, each subsequent film segment is used to cut a film segment of the film roll with a window to be bonded to a circuit board segment. In addition, it can be seen that the film segments of the film roll can be artificially divided, that is, the corresponding film segments can be divided according to the circuit board segments (including the subsequent film segments corresponding to the subsequent circuit board segments and the initial film segments corresponding to the initial circuit board segments).

[0109] Moreover, it can be seen from the above steps that the cutting correction coordinates of the laser cutter of the film cutting device 14 are ((A i -X0) / (P1 / (M2-M1)), (B i -Y0) / (Q1 / (N2-N1)))(i=1,2,3…), that is, the film cutting coordinates of all film segments of the film roll by the laser cutter are ((A i -X0) / (P1 / (M2-M1)), (B i -Y0) / (Q1 / (N2-N1)))(i=1, 2, 3...).

[0110] The real-time identification coordinates of the subsequent segments of the circuit board can be (X1, Y1), (X2, Y2), (X3, Y3), etc. The real-time cutting coordinates of the subsequent segments of the film following the initial segment of the film roll by the laser cutter of the film cutting device 14 can correspond to ((A i +X1-X0) / (P1 / (M2-M1)), (B i +Y1-Y0) / (Q1 / (N2-N1))), or ((A i +X2-X0) / (P1 / (M2-M1)), (B i +Y2-Y0) / (Q1 / (N2-N1))), or ((A i +X3-X0) / (P1 / (M2-M1)), (B i +Y3-Y0) / (Q1 / (N2-N1))), and so on.

[0111] For example, a film roll may have multiple film segments, wherein the first film segment may be referred to as an initial film segment, the second film segment may be referred to as a subsequent film segment, the third film segment may also be referred to as a subsequent film segment, and so on. When the laser cutter of the film cutting device 14 needs to cut the second film segment of the film roll, its real-time cutting coordinates may be ((A i +X1-X0) / (P1 / (M2-M1)), (B i+Y1-Y0) / (Q1 / (N2-N1))); When the laser cutter of the film cutting device 14 is to cut the third film segment of the film roll, its real-time cutting coordinates can be ((A i +X2-X0) / (P1 / (M2-M1)), (B i +Y2-Y0) / (Q1 / (N2-N1))), and so on.

[0112] In addition, in step S300, cutting the film roll according to the real-time cutting coordinates of the film roll to obtain the film roll with the window may include the following steps:

[0113] S310: After obtaining the real-time cutting coordinates of the film roll, locate the segment of the film roll to be cut.

[0114] After obtaining the real-time cutting coordinates for cutting the subsequent film segments of the film roll, the film cutting platform of the film cutting device 14 can be controlled to position the segment to be cut (i.e., the subsequent film segment) of the film roll and fix it in a fixed position to facilitate the laser cutter of the film cutting device 14 to cut the subsequent film segment, thereby avoiding offset during the cutting process that affects the cutting accuracy.

[0115] S320 , controlling the film cutting device 14 to cut the to-be-cut segments of the film roll according to the real-time cutting coordinates of the film roll to obtain a film roll with windows.

[0116] After the film cutting platform adsorbs and positions the film segment to be cut (segment to be cut), the laser cutter of the film cutting device 14 is controlled to obtain the real-time cutting coordinates (such as (A i +X1-X0) / (P1 / (M2-M1)), (B i +Y1-Y0) / (Q1 / (N2-N1))), or ((A i +X2-X0) / (P1 / (M2-M1)), (B i +Y2-Y0) / (Q1 / (N2-N1))), or ((A i +X3-X0) / (P1 / (M2-M1)), (B i +Y3-Y0) / (Q1 / (N2-N1))), etc.), etc.), the segments to be cut are cut to obtain a film roll with windows that can be correspondingly bonded to the circuit board segments (subsequent segments of the circuit board).

[0117] Then, the above steps S200 and S300 may be repeated to complete all the cutting processes of the film roll in sequence.

[0118] After finishing cutting the second film segment at the back of the initial segment of the film roll, the third film segment can be continued to be cut, and then the fourth film segment can be continued to be cut, etc., until finishing cutting the whole film roll.

[0119] Moreover, after completing the cutting of a roll of film material, when the film of the flexible circuit board needs to be laminated, a new roll of film material can be docked at the end of the original roll of film material and the cutting of the new roll of film material can be continued.

[0120] In addition, in step S400, the film roll with the window and the circuit board roll are respectively conveyed to the film laminating device for lamination to obtain a finished flexible circuit board, which may include the following steps:

[0121] S410: peeling off the film waste attached to the film roll with windows to obtain a separate film roll with windows, and conveying the separate film roll with windows to a film laminating device.

[0122] Since the film material on the film roll is attached to the release film, when the film material is cut to obtain the film roll with windows, the film roll with windows is still attached to the release film. Therefore, when the film roll with windows is attached to the circuit board segment, it is necessary to peel off the film roll with windows from the release film, and use waste recycling equipment to recycle the release film and the cut film attached to it and other film waste, so that the separate film roll with windows can be transported to the film pressing equipment for pressing with the circuit board segment.

[0123] S420 , conveying the circuit board segments of the circuit board roll to the film laminating device, controlling the film laminating device 17 to press the circuit board segments and the corresponding film roll with windows to obtain a finished flexible circuit board.

[0124] The circuit board segments of the circuit board roll and the corresponding film roll with openings can be simultaneously conveyed to film laminating equipment 17 for alignment and lamination. During the lamination process, the lamination pressure, temperature, and time can be adjusted to ensure a tight and reliable adhesion between the film roll with openings and the circuit board segments. The lamination pressure, temperature, and time are known from the prior art and are not described in detail here.

[0125] In addition, in step S400, when the film roll with the window and the circuit board roll are respectively conveyed to the film laminating device for lamination, the following steps may also be included:

[0126] The waste recycling device 16 is controlled to recycle film waste generated during film roll cutting. When the film roll with the window is peeled off from the release film and conveyed to the film laminating device 17 for lamination, the waste film, such as the release film, separated from the film roll with the window can be recycled by the waste recycling device 16, which is also conducive to the automatic separation of film waste such as the release film from the film roll with the window.

[0127] Furthermore, in step S400, after obtaining the finished flexible circuit board, the following steps may also be included:

[0128] The circuit board winding device 18 is controlled to wind up the finished flexible circuit board. After the film roll with the window and the circuit board segments of the circuit board roll are pressed together to form the finished flexible circuit board, the film roll can be wound up by the circuit board winding device 18 until the film lamination of the entire circuit board roll is completed.

[0129] In this embodiment, when cutting the film roll, the circuit board identification and positioning device 15 is controlled to identify the identification mark on the flexible circuit board (circuit board roll), and the laser cutter is controlled to cut the film material (film roll). By sequentially identifying multiple identification marks continuously set on the flexible circuit board, during the cutting process of the film roll, the device can continuously adjust the coordinates of the cutting coordinate position, so that the cut film roll with the window can accurately correspond to the circuit board segment on the circuit board roll, thereby achieving precise positioning and fitting of the film material and the flexible circuit board; and, during the entire process, there is no need to adjust the film material and the flexible circuit board material, and continuous roll-to-roll operation can be achieved, which can greatly improve production efficiency.

[0130] Example 2

[0131] like Figure 4 As shown, this embodiment provides a flexible circuit board film material bonding system 100, which can be applied to a flexible circuit board film material bonding device 10 (such as Figure 3 The device may include a film discharging device 12, a film cutting device 14, a waste recycling device 16, a circuit board discharging device 13, a circuit board identification and positioning device 15, a film laminating device 17, a circuit board winding device 18, and a controller 11, which is connected to each device.

[0132] Under the control of the controller 11, the film discharging device 12 can be used to transport the film roll to the film cutting device 14, the film cutting device 14 can be used to cut the film roll to obtain a film roll with windows, the waste recycling device 16 can be used to recycle the waste generated by cutting, the circuit board discharging device 13 can be used to transport the circuit board roll to the circuit board identification and positioning device 15, the circuit board identification and positioning device 15 can be used to identify and position the circuit board roll, the film laminating device 17 can be used to laminate the cut film roll with windows and the circuit board roll, and the circuit board winding device 18 can be used to wind up the laminated circuit board roll and the film roll with windows.

[0133] Specifically, if Figure 3 As shown, the flexible circuit board film material bonding system 100 may include:

[0134] The alignment control module 102 is used to align the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting device 14;

[0135] The cutting control module 104 is in communication with the alignment control module 102 and is configured to obtain the real-time cutting coordinates of the film roll based on the cutting correction coordinates of the film cutting device 14 and the real-time identification coordinates of the circuit board roll; and cut the film roll according to the real-time cutting coordinates of the film roll to obtain a film roll with a window;

[0136] The laminating control module 106 is in communication with the cutting control module 104 and is used to separately convey the film roll with the window and the circuit board roll to the film laminating device 17 for lamination to obtain a finished flexible circuit board.

[0137] Furthermore, the flexible circuit board film material laminating system 100 may further include a discharge control module 101, which may be used to:

[0138] Controlling the film discharging device 12 to continuously deliver the film roll to the film cutting device 14;

[0139] The circuit board discharging device 13 is controlled to continuously convey the circuit board coil to the circuit board identification and positioning device 15 .

[0140] In addition, before being used to align the film roll and the circuit board roll, the alignment control module 102 can also be used to:

[0141] Controlling the initial cutting point of the film cutting device 14 to coincide with a cutting positioning point pre-set on the film cutting device at a fixed coordinate position;

[0142] The initial cutting coordinates of the film cutting device 14 are cleared, and the cleared coordinates are set as the origin cutting coordinates of the film cutting device 14 .

[0143] Furthermore, when the alignment control module 102 is used to align the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting device 14, it can be further used to:

[0144] Align the film roll and the circuit board roll to obtain the lamination deviation between the film roll and the circuit board roll;

[0145] According to the original cutting coordinates of the film cutting device 14 and the lamination deviation, the cutting correction coordinates of the film cutting device 14 are obtained.

[0146] Furthermore, when the alignment control module 102 is used to align the film roll and the circuit board roll and obtain the lamination deviation between the film roll and the circuit board roll, it can be used to:

[0147] Obtaining initial recognition coordinates of an initial recognition mark of an initial segment of a circuit board of a circuit board coil, and clearing the initial recognition coordinates to set the initial recognition coordinates as origin coordinates;

[0148] Cutting the initial film segments of the film roll according to the original cutting coordinates of the film cutting device 14 to obtain an initial film roll with windows;

[0149] Controlling the film laminating device 17 to laminarize the initial film roll with the window and the initial circuit board segment of the circuit board roll to obtain an initial product segment of the circuit board product;

[0150] The optical measuring instrument is controlled to detect an initial product segment of the circuit board product to obtain a fitting deviation of the initial product segment of the circuit board product relative to an initial film roll with a window in a forward direction and a transverse direction of the roll.

[0151] Furthermore, when the alignment control module 102 is used to obtain the corrected cutting coordinates of the film cutting device 14 based on the original cutting coordinates and the lamination deviation of the film cutting device, it can be further used to:

[0152] Obtaining the original cutting coordinates of the film cutting device 14;

[0153] According to the obtained original cutting coordinates of the film cutting device 14 and in combination with the obtained lamination deviation, the cutting correction coordinates of the film cutting device 14 are obtained.

[0154] In addition, when the cutting control module 104 is used to obtain the real-time cutting coordinates of the film roll according to the cutting correction coordinates of the film cutting device 14 and the real-time identification coordinates of the circuit board roll, it can be further used to:

[0155] Obtaining real-time identification coordinates of subsequent identification marks of subsequent circuit board segments following the initial circuit board segment of the circuit board coil;

[0156] According to the obtained cutting correction coordinates and real-time identification coordinates of the film cutting device 14 , the real-time cutting coordinates of the subsequent film segment behind the initial film segment of the film roll by the film cutting device 14 are obtained.

[0157] In addition, when the cutting control module 104 is used to cut the film roll according to the real-time cutting coordinates of the film roll to obtain the film roll with the window, it can be further used to:

[0158] After obtaining the real-time cutting coordinates of the film roll, locate the section of the film roll to be cut;

[0159] According to the real-time cutting coordinates of the film roll, the film cutting device 14 is controlled to cut the to-be-cut segments of the film roll to obtain a film roll with a window;

[0160] Repeat the above steps to complete all the cutting processes of the film roll.

[0161] In addition, when the lamination control module 106 is used to separately convey the film roll with the window and the circuit board roll to the film laminating device 17 for lamination to obtain the finished flexible circuit board, it can be further used to:

[0162] Stripping the film waste attached to the film roll with windows to obtain a separate film roll with windows, and conveying the separate film roll with windows to the film laminating device 17;

[0163] The circuit board segments of the circuit board roll are conveyed to the film laminating device 17 , and the film laminating device 17 is controlled to press the circuit board segments and the corresponding film roll with windows to obtain a finished flexible circuit board.

[0164] In addition, when the lamination control module 106 is used to separately convey the film roll with the window and the circuit board roll to the film lamination device 17 for lamination, it can also be used to:

[0165] The waste recycling device 16 is controlled to recycle the film waste generated when the film roll is cut.

[0166] Furthermore, after the lamination control module 106 is used to obtain the finished flexible circuit board, it may further include the following steps:

[0167] The circuit board rewinding device 18 is controlled to rewind the finished flexible circuit board.

[0168] The flexible circuit board film material bonding system 100 described in this embodiment corresponds to the flexible circuit board film material bonding method described above. The functions of each module in the flexible circuit board film material bonding system 100 in this embodiment are described in detail in the corresponding method embodiment and will not be repeated here.

[0169] In addition, the present invention also proposes a computer-readable storage medium, which stores computer-executable instructions. When the computer-executable instructions are executed by a processor, they are used to implement all or part of the method steps of the flexible circuit board film material bonding method described above.

[0170] The present invention implements all or part of the process in the above method, and can also be completed by instructing related hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, it can implement the steps of each of the above method embodiments. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device that can carry computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0171] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program running on the processor, and when the processor executes the computer program, all or part of the method steps in the above method are implemented.

[0172] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor. The processor is the control center of a computer device, connecting all parts of the entire computer device using various interfaces and lines.

[0173] The memory can be used to store computer programs and / or models. The processor implements various functions of the computer device by running or executing the computer programs and / or models stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system and at least one application required for a function (such as a sound playback function, an image playback function, etc.); the data storage area can store data created based on the use of the mobile phone (such as audio data, video data, etc.). In addition, the memory can include a high-speed random access memory and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (SmartMedia Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage device.

[0174] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, servers, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage and optical storage) containing computer-usable program code.

[0175] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), servers, and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0176] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0177] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0178] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A method for laminating thin film materials for flexible circuit boards, applied to a device for laminating thin film materials for flexible circuit boards; the device comprises a film discharging device, a film cutting device, a waste material recycling device, a circuit board discharging device, a circuit board identification and positioning device, a film laminating device, a circuit board winding device, and a controller, wherein the controller is connected to each device; It is characterized in that The method comprises the following steps: Align the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting equipment; Obtaining the real-time cutting coordinates of the film roll according to the cutting correction coordinates of the film cutting device and the real-time identification coordinates of the circuit board roll; Cutting the film roll according to the real-time cutting coordinates of the film roll to obtain a film roll with windows; The film coil with the window and the circuit board coil are respectively conveyed to a film laminating device for lamination to obtain a finished flexible circuit board.

2. The method for laminating a flexible circuit board film material according to claim 1, wherein: The method of aligning the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting device includes the following steps: Align the film roll and the circuit board roll to obtain the lamination deviation between the film roll and the circuit board roll; According to the original cutting coordinates of the film cutting device and the lamination deviation, the cutting correction coordinates of the film cutting device are obtained.

3. The method for laminating a flexible circuit board film material according to claim 2, wherein: The method of aligning the film roll and the circuit board roll to obtain the lamination deviation between the film roll and the circuit board roll comprises the following steps: Obtaining initial recognition coordinates of an initial recognition mark of an initial segment of a circuit board of a circuit board coil, and clearing the initial recognition coordinates to set the initial recognition coordinates as origin coordinates; Cutting the initial film segments of the film roll according to the original cutting coordinates of the film cutting device to obtain an initial film roll with windows; Controlling a film laminating device to laminarize the initial film roll with the window and the initial circuit board segment of the circuit board roll to obtain an initial product segment of the circuit board product; The optical measuring instrument is controlled to detect the initial product segment of the circuit board product, and the lamination deviation of the initial circuit board segment relative to the initial film roll with the window in the forward direction and the transverse direction of the roll is obtained.

4. The method for laminating a flexible circuit board film material according to claim 3, characterized in that: The method of obtaining the real-time cutting coordinates of the film roll according to the cutting correction coordinates of the film cutting device and the real-time identification coordinates of the circuit board roll comprises the following steps: Obtaining real-time identification coordinates of subsequent identification marks of subsequent circuit board segments following the initial circuit board segment of the circuit board coil; According to the obtained cutting correction coordinates and the real-time identification coordinates of the film cutting device, the real-time cutting coordinates of the subsequent film segment behind the initial film segment of the film roll are obtained.

5. The method for laminating a flexible circuit board film material according to any one of claims 1 to 4, characterized in that: The step of cutting the film roll according to the real-time cutting coordinates of the film roll to obtain the film roll with the window includes the following steps: After obtaining the real-time cutting coordinates of the film roll, the segment to be cut of the film roll is positioned; According to the real-time cutting coordinates of the film roll, the film cutting device is controlled to cut the to-be-cut segments of the film roll to obtain a film roll with windows.

6. The method for laminating a flexible circuit board film material according to any one of claims 1 to 4, characterized in that: Before aligning the film roll and the circuit board roll, the following steps are also included: Controlling the initial cutting point of the film cutting device to coincide with a cutting positioning point pre-set on the film cutting device at a fixed coordinate position; The initial cutting coordinates of the film cutting device are cleared, and the cleared coordinates are set as the origin cutting coordinates of the film cutting device.

7. The method for laminating a flexible circuit board film material according to any one of claims 1 to 4, characterized in that: Before aligning the film roll and the circuit board roll, the following steps are also included: Control the film discharging equipment to continuously deliver the film roll to the film cutting equipment; Control the circuit board discharging equipment to continuously convey the circuit board coil to the circuit board identification and positioning equipment.

8. The method for laminating a flexible circuit board film material according to any one of claims 1 to 4, characterized in that: When the film coil with the window and the circuit board coil are separately conveyed to the film laminating device for lamination, the following steps are also included: Control the waste recycling equipment to recycle the film waste generated when the film roll is cut; After obtaining the finished flexible circuit board, the following steps are also included: Control the circuit board winding equipment to rewind the finished flexible circuit board.

9. A flexible circuit board film material laminating system, applicable to a flexible circuit board film material laminating device; the device comprises a film discharging device, a film cutting device, a waste material recycling device, a circuit board discharging device, a circuit board identification and positioning device, a film laminating device, a circuit board winding device, and a controller, the controller being connected to each device; It is characterized in that The system comprises: The alignment control module is used to align the film roll and the circuit board roll to obtain the cutting correction coordinates of the film cutting equipment; a cutting control module, in communication with the alignment control module, configured to obtain real-time cutting coordinates of the film roll based on the cutting correction coordinates of the film cutting device and the real-time identification coordinates of the circuit board roll; and cut the film roll according to the real-time cutting coordinates of the film roll to obtain a film roll with a window; The laminating control module is in communication with the cutting control module and is used to separately convey the film roll with the window and the circuit board roll to the film laminating equipment for lamination to obtain a finished flexible circuit board.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement all or part of the method steps of the flexible circuit board film material bonding method according to any one of claims 1 to 8.

Images