Electronic component welding method

Abstract

The present invention discloses a method for soldering electronic components, comprising the following steps: S1: cleaning a work surface to keep it clean and dust-free; S2: classifying components; classifying different electronic components according to size, type, and function, so as to facilitate access during soldering; S3: cleaning the electronic components to be soldered, and heating the pins of the electronic components to remove the oxide layer on the pins; S4: processing the circuit board to which the components are to be soldered; making pits on the circuit board, and inserting the pins of the electronic components to be soldered into the holes in the pits. By using this method, when soldering electronic components, the fit of the pins of the electronic components can be improved, thereby increasing the contact area between the pins and the components and improving the soldering strength of the electronic components.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component welding, in particular to an electronic component welding method. Background Art

[0002] Conventional surface mount processes typically involve pre-applying solder paste to the surface of an FPC or PCB and then melting the solder paste in a reflow oven to solder / mount components onto the FPC or PCB. However, with technological advancements, component soldering is no longer limited to flat surfaces like FPCs and PCBs. Due to product design requirements, components are increasingly being soldered onto irregular (non-flat) surfaces. The main technical bottlenecks encountered in soldering electronic components within recessed areas are:

[0003] 1. Because the surface is irregular, not flat. Traditional stencil-based solder paste brushing is no longer applicable. Only dispensing methods, such as automated solder paste dispensers, can be used. However, the amount of solder paste and its height vary significantly during this process, and the consistency of the paste shape and height cannot be compared to stencil-based solder paste brushing. Consequently, inconsistent amounts of solder paste on both ends of the component can lead to uneven stress on the components after reflow, which can easily cause component misalignment, tombstoning, and other defects.

[0004] 2. Because the components are located within the recessed cavity, the space within the recessed cavity is less susceptible to heat than a flat surface. Therefore, to maintain the temperature within the recessed cavity, it is unavoidable to increase the wind speed within the reflow oven. This increases the probability of components being moved by the wind, a factor particularly pronounced for such miniature components. The recessed structure of the carrier, coupled with the shielding of the solder paste by the components, makes it difficult for the solder paste to receive heat, leading to defects such as cold and faulty solder joints. Summary of the Invention

[0005] (1) Technical problems solved

[0006] In view of the deficiencies in the prior art, the present invention provides a method for soldering electronic components.

[0007] (2) Technical solution

[0008] To achieve the above object, the present invention provides the following technical solution: a method for soldering electronic components, comprising the following steps:

[0009] S1: Clean the work surface and keep it clean and dust-free;

[0010] S2: Classify components;

[0011] Classify different electronic components according to size, type, and function, so that they can be easily accessed during soldering;

[0012] S3: Clean the electronic components that need to be soldered by heating the pins of the electronic components to remove the oxide layer on the pins;

[0013] S4: Process the circuit board that needs to be soldered with components;

[0014] By making pits on the circuit board, and inserting the pins of the electronic components to be soldered into the holes of the pits;

[0015] S5: Use tin wire to fill the pits in turn, and use a welding gun to dip the tin melt protective agent, and heat the tin wire with solvent, and wait for it to cool and solidify;

[0016] S6: A protective cover is made for the welding position, and the area of ​​the protective cover is larger than the position of the pit to protect it, and glue is used to bond it. The height of the protective cover is higher than the height of the pins of the electronic components and lower than the height of the electronic components;

[0017] S7: Soldering the back of the circuit board of the electronic components after soldering;

[0018] S8: Then, for the pins of the electronic components that have been soldered in S7, trim off the extra pins on the back, and then make a protective cover and glue it on the back;

[0019] S9: Then perform an appearance inspection on the soldered circuit board and perform a circuit power-on test on it.

[0020] Preferably, in S4, the volume of the recess is smaller than the volume of the component, and the solder wire is flush with the surface of the circuit board after soldering. By digging a recess on the surface of the circuit board, the solder wire can be dissolved and then filled into the recess, thereby filling the recess and making the surface of the circuit board smooth.

[0021] Preferably, the tin melt protective agent is a synthetic ester and a long-chain fatty acid. By using synthetic esters and long-chain fatty acids as protective agents, and after the tin melt protective agent is added to the pit groove, a floating protective film will be formed covering the entire tin melt surface (except for the wave crest), preventing the generation of tin slag on the tin melt surface. At the same time, the tin slag generated in other areas of the tin bath is immediately reduced to usable metal, and no tin slag accumulates in the tin bath. In addition, by continuously circulating the tin by the pump, the tin melt protective agent can continuously eliminate metal oxides on the surface and inside the tin melt, clean and purify the tin bath, and while reducing the amount of tin slag salvaged and the number of times, it also reduces the surface tension of the tin melt, enhances its wettability, and thus reduces the soldering defect rate. The use of this product can significantly reduce the amount of tin solder used and greatly improve the utilization rate. This product can reduce the cost of tin solder by 40% to 70%. It is smokeless and odorless and will not be deposited on the PCB board surface, tin-plated components or tin furnace components. By using a tin melt protective agent, the protective liquid can be covered on the surface of the molten tin liquid, isolating the contact between the molten tin and oxygen, and fundamentally preventing the generation of tin slag.

[0022] Preferably, in S3, the pins of the electronic components are heated at a temperature of 40-45° C., and the heated pins of the electronic components are adsorbed using filter paper. By heating the pins, the oil film on the surface can be removed, thereby improving the conductivity of the electronic components.

[0023] Preferably, the protective cover is made of 5-6 mm glass fiber material. By using the prepared 5-6 mm glass fiber material to prepare the protective cover, due to its transparent material, it is easy to observe the pins inside it, and its strength is high enough and the weight is light enough.

[0024] Preferably, in S4, the pins of the electronic components are inserted into the holes of the pits, and the electronic components need to be preheated. By preheating the pins of the electronic components, it is possible to facilitate the soldering and solidification of the tin wire at the pins after melting during soldering, thereby improving soldering efficiency and reducing the generation of tin slag.

[0025] Preferably, in said S4, the preheating temperature is 50-60°C, and the preheating time is 1-2 seconds by contact with the welding gun.

[0026] Preferably, in said S5, the soldered electronic components are moved to a well-ventilated place for heat dissipation and solidification. By moving them to a well-ventilated place, the heat dissipation efficiency can be improved.

[0027] (3) Beneficial effects

[0028] Compared with the prior art, the present invention provides a method for soldering electronic components, which has the following beneficial effects:

[0029] 1. This electronic component welding method can improve the fit of the pins of the electronic components by welding them, thereby increasing the contact area between the pins and the electronic components and improving the welding strength of the electronic components.

[0030] 2. This electronic component welding method uses this method to install protective covers on both sides of the pins of the electronic components on their circuit boards, thereby protecting the electronic components and improving the protection of the electronic components, thereby making them have better stability. DETAILED DESCRIPTION

[0031] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] The present invention provides an electronic component welding method, comprising the following steps:

[0033] S1: Clean the work surface and keep it clean and dust-free;

[0034] S2: Classify components;

[0035] Classify different electronic components according to size, type, and function, so that they can be easily accessed during soldering;

[0036] S3: Clean the electronic components that need to be soldered by heating the pins of the electronic components to remove the oxide layer on the pins;

[0037] S4: Process the circuit board that needs to be soldered with components;

[0038] By making pits on the circuit board, and inserting the pins of the electronic components to be soldered into the holes of the pits;

[0039] S5: Use tin wire to fill the pits in turn, and use a welding gun to dip the tin melt protective agent, and heat the tin wire with solvent, and wait for it to cool and solidify;

[0040] S6: A protective cover is made for the welding position, and the area of ​​the protective cover is larger than the position of the pit to protect it, and glue is used to bond it. The height of the protective cover is higher than the height of the pins of the electronic components and lower than the height of the electronic components;

[0041] S7: Soldering the back of the circuit board of the electronic components after soldering;

[0042] S8: Then, for the pins of the electronic components that have been soldered in S7, trim off the extra pins on the back, and then make a protective cover and glue it on the back;

[0043] S9: Then perform an appearance inspection on the soldered circuit board and perform a circuit power-on test on it.

[0044] Furthermore, in S4, the volume of the recess is smaller than the volume of the component, and the solder wire is flush with the surface of the circuit board after soldering. By digging a recess on the surface of the circuit board, the solder wire can be dissolved and then filled into the recess, thereby filling the recess and making the surface of the circuit board flat.

[0045] Furthermore, the tin bath protectant is a synthetic ester and a long-chain fatty acid. By using these agents and adding them to the concave grooves, they form a floating protective film covering the entire surface of the tin bath (except for the wave crests), preventing the formation of slag on the surface. Meanwhile, any slag generated in other areas of the bath is immediately reduced to usable metal, eliminating any slag accumulation within the bath. Furthermore, by continuously circulating the tin through a pump, the tin bath protectant continuously removes metal oxides from the surface and interior of the bath, cleaning and purifying the bath. This reduces the amount and frequency of slag salvage, while also lowering the surface tension of the bath and enhancing its wettability, thereby reducing solder defect rates. Using this product significantly reduces solder usage and significantly increases utilization, potentially reducing solder costs by 40% to 70%. It is smokeless and odorless, and will not deposit on PCB surfaces, tin-plated components, or solder pot components. By using a tin melt protective agent, the protective liquid can be covered on the surface of the molten tin liquid, isolating the contact between the molten tin and oxygen, and fundamentally preventing the generation of tin slag.

[0046] Furthermore, in S3, the pins of the electronic components are heated to a temperature of 40-45° C., and the heated pins of the electronic components are adsorbed using filter paper. By heating the pins, the oil film on the surface can be removed, thereby improving the conductivity of the electronic components.

[0047] Furthermore, the protective cover is made of 5-6 mm glass fiber material. By using the prepared 5-6 mm glass fiber material to prepare the protective cover, due to its transparent material, it is easy to observe the pins inside it, and its strength is high enough and the weight is light enough.

[0048] Furthermore, in S4, the pins of the electronic components are inserted into the holes of the pits, and the electronic components need to be preheated. By preheating the pins of the electronic components, it is possible to facilitate the soldering process, such that the tin wire is melted and then solidified at the pins during soldering, thereby improving soldering efficiency and reducing the generation of tin slag.

[0049] Furthermore, in S4, the preheating temperature is 50-60°C, and the preheating time is 1-2 seconds by contact with the welding gun.

[0050] Furthermore, in S5, the soldered electronic components are moved to a well-ventilated place for heat dissipation and solidification. By moving them to a well-ventilated place, the heat dissipation efficiency can be improved.

[0051] The present invention also provides a method for soldering electronic components, comprising the following steps:

[0052] S1: Clean the work surface and keep it clean and dust-free;

[0053] S2: Classify components;

[0054] Classify different electronic components according to size, type, and function, so that they can be easily accessed during soldering;

[0055] S3: Clean the electronic components that need to be soldered. Heat the pins of the electronic components to remove the oxide layer on the pins. Heat the pins of the electronic components at a temperature of 40-45°C. Use filter paper to absorb the heated pins of the electronic components.

[0056] S4: Process the circuit board that needs to be soldered with components;

[0057] By making a pit on the circuit board and inserting the pins of the electronic components to be soldered into the holes of the pit, the volume of the pit is smaller than the volume of the component, and the tin wire is made flush with the surface of the circuit board after soldering, and the pins of the electronic components are inserted into the holes of the pit. The electronic components also need to be preheated at a temperature of 50-60°C and a preheating time of 1-2 seconds by contact with the welding gun;

[0058] S5: Use tin wire to fill the pits in turn, and use a welding gun to dip the protective agent of tin synthetic ester and long-chain fatty acid melt, and heat the tin wire with solvent, and move the welded electronic components to a ventilated place and wait for them to cool and solidify;

[0059] S6: A protective cover is made of 5-6 mm glass fiber material for the welding position. The area of ​​the protective cover is larger than the position of the pit and is bonded with glue. The height of the protective cover is higher than the height of the pins of the electronic components and lower than the height of the electronic components.

[0060] S7: Soldering the back of the circuit board of the electronic components after soldering;

[0061] S8: Then, for the pins of the electronic components that have been soldered in S7, trim off the extra pins on the back, and then make a protective cover and glue it to the back.

[0062] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A method for soldering electronic components, characterized in that: The following steps are involved: S1: Clean the work surface and keep it clean and dust-free; S2: Classify components; Classify different electronic components according to size, type, and function, so that they can be easily accessed during soldering; S3: Clean the electronic components that need to be soldered by heating the pins of the electronic components to remove the oxide layer on the pins; S4: Process the circuit board that needs to be soldered with components; By making pits on the circuit board, and inserting the pins of the electronic components to be soldered into the holes of the pits; S5: Use tin wire to fill the pits in turn, and use a welding gun to dip the tin melt protective agent, and heat and dissolve the tin wire, and wait for it to cool and solidify; S6: A protective cover is made for the welding position, and the area of ​​the protective cover is larger than the position of the pit to protect it, and glue is used to bond it. The height of the protective cover is higher than the height of the pins of the electronic components and lower than the height of the electronic components; S7: Soldering the back of the circuit board of the electronic components after soldering; S8: Then, trim off the extra pins on the back of the electronic components after soldering in S7, and then make a protective cover and glue it on the back; S9: Then perform an appearance inspection on the soldered circuit board and perform a circuit power-on test on it; In the S4, the volume of the pit is smaller than the volume of the component, and the tin wire is flush with the surface of the circuit board after soldering; The tin melt protective agent is synthetic ester and long-chain fatty acid.

2. The electronic component welding method according to claim 1, characterized in that: In the above-mentioned S3, the pins of the electronic components are heated at a temperature of 40-45° C., and the heated pins of the electronic components are adsorbed using filter paper.

3. The electronic component welding method according to claim 1, characterized in that: The protective cover is made of 5-6 mm glass fiber material.

4. The electronic component welding method according to claim 1, characterized in that: In the above-mentioned S4, the pins of the electronic components are inserted into the holes of the pits, and the electronic components need to be preheated.

5. The electronic component welding method according to claim 4, characterized in that: In the above-mentioned S4, the preheating temperature is 50-60°C, and the preheating time is 1-2 seconds through contact with the welding gun.

6. The electronic component welding method according to claim 1, characterized in that: In S5, the soldered electronic components are moved to a ventilated place for heat dissipation and solidification.