Cooling system and controller

Abstract

This application discloses a cooling system and controller. The cooling system includes a cooling housing and a cooling module connected to the cooling housing. The cooling housing has an inlet water channel, a first cooling water channel, and an outlet water channel. The cooling module has a second cooling water channel. The inlet water channel is connected to the first cooling water channel, the first cooling water channel is connected to the inlet end of the second cooling water channel, and the outlet end of the second cooling water channel is connected to the outlet water channel. The cooling system of this application has a cooling housing and a cooling module, with the water channels in the cooling housing and the cooling module connected, making the structure of the cooling system more centralized and simplifying the arrangement of the water channels. Using the controller of the cooling system can effectively save space, and the cooling system can simultaneously cool the power management module, the power module, and the capacitor module.

Description

Technical Field

[0001] This application relates to the field of drive system technology, and in particular to a cooling system and controller. Background Technology

[0002] Controllers offer the advantage of high integration, reducing space requirements during vehicle installation. However, higher integration levels result in poorer heat dissipation, necessitating a cooling system within the controller to cool its heat-generating components. Since controllers contain multiple heat-generating components, multiple cooling systems are required to dissipate heat from each, leading to a larger cooling system size, complex cooling channels, and compromised water tightness. This also impacts the overall integration of the controller. Summary of the Invention

[0003] The purpose of this application is to overcome the shortcomings of the prior art and provide a cooling system and controller with a smaller size and centralized water channels.

[0004] The technical solution of this application provides a cooling system, including a cooling housing and a cooling module connected to the cooling housing;

[0005] The cooling housing is provided with an inlet water channel, a first cooling water channel, and an outlet water channel;

[0006] The cooling module is equipped with a second cooling water channel;

[0007] The water inlet channel is connected to the first cooling channel, the first cooling channel is connected to the water inlet of the second cooling channel, and the water outlet of the second cooling channel is connected to the water outlet channel.

[0008] Furthermore, the cooling housing is provided with a receiving cavity, the cavity wall of which protrudes from the bottom plate of the cooling housing, and the first cooling water channel is formed within the cavity wall of the receiving cavity.

[0009] Furthermore, a water storage plug is provided at the outlet end of the first cooling water channel. The height of the water storage plug is greater than half the height of the first cooling water channel and less than the height of the first cooling water channel.

[0010] Furthermore, the cooling housing includes a housing and a water channel baffle;

[0011] The water channel baffle is sealed and connected to the bottom plate of the housing, and the water inlet channel, the first cooling channel and the water outlet channel are formed between the housing and the water channel baffle.

[0012] Furthermore, a connecting water channel is provided between the shell and the water channel partition, and the connecting water channel is connected to the first cooling water channel and the second cooling water channel.

[0013] Furthermore, the cooling housing is also provided with an inlet pipe and an outlet pipe;

[0014] One end of the water inlet pipe extends out of the housing from the side plate of the housing, and the other end is connected to the bottom plate of the housing so that the water inlet pipe is connected to the water inlet channel;

[0015] One end of the water outlet pipe extends out of the housing from the side plate of the housing, and the other end is connected to the bottom plate of the housing so that the water outlet pipe is connected to the water outlet channel.

[0016] The technical solution of this application also provides a controller, including a power management module, a power module, a capacitor module and a cooling system as described above;

[0017] The power management module is installed on the side of the cooling housing away from the cooling module, and the first cooling water channel is used to cool the power management module;

[0018] The power module and the capacitor module are installed on the side of the cooling housing connected to the cooling module. The capacitor module is installed in close contact with the surface of the cooling housing. The first cooling water channel is used to cool the capacitor module.

[0019] The power module is installed close to the cooling module, and the second cooling water channel is used to cool the power module.

[0020] Furthermore, the power management module includes a circuit board, a transformer mounted on the circuit board, and multiple field-effect transistors;

[0021] The cooling housing has a receiving cavity, the cavity wall of which protrudes from the bottom plate of the cooling housing, and the first cooling water channel is formed inside the cavity wall of the receiving cavity;

[0022] The transformer is installed in the receiving cavity, and the field-effect transistor is installed close to the outer surface of the cavity wall.

[0023] Furthermore, the cooling module has a double-layer mounting shell, which includes an upper shell and a lower shell, and the power module is mounted between the upper shell and the lower shell;

[0024] The second cooling water channel includes a first water channel disposed in the upper shell and a second water channel disposed in the lower shell. The inlet end of the first water channel and the inlet end of the second water channel are both connected to the first cooling water channel, and the outlet end of the first water channel and the outlet end of the second water channel are both connected to the outlet water channel.

[0025] Furthermore, the first and second water channels are provided with flow-guiding cooling fins.

[0026] Furthermore, the second cooling water channel includes a cooling cavity disposed in the cooling module, the cooling cavity being connected to the first cooling water channel and the outlet water channel;

[0027] The cooling chamber has an opening, and the upper surface of the power module is sealed and installed into the opening of the cooling chamber.

[0028] Furthermore, the power module includes at least one sub-module;

[0029] The cooling chamber includes at least one cooling chamber, and the upper surface of each sub-module is sealed and mounted into the opening of one of the sub-cooling chambers;

[0030] The second cooling channel further includes an inlet chamber and an outlet chamber disposed in the cooling module. The inlet chamber is connected to each of the cooling chambers and the first cooling channel, and the outlet chamber is connected to each of the cooling chambers and the outlet channel.

[0031] Furthermore, the upper surface of the power module is equipped with cooling fins.

[0032] The above technical solution has the following beneficial effects:

[0033] The cooling system of this application is provided with a cooling shell and a cooling module. The water channels in the cooling shell and the water channels in the cooling module are connected, which makes the structure of the cooling system more concentrated and the arrangement of the water channels simple.

[0034] The controller with a cooling system can effectively save space, and the cooling system can cool the power management module, power module and capacitor module at the same time. Attached Figure Description

[0035] The disclosure of this application will become more readily understood with reference to the accompanying drawings. It should be understood that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. In the drawings:

[0036] Figure 1 This is a schematic diagram of the cooling system in Embodiment 1 of this application;

[0037] Figure 2 This is an exploded view of the cooling system in Embodiment 1 of this application;

[0038] Figure 3 This is a bottom view of the housing of the cooling system in Embodiment 1 of this application;

[0039] Figure 4 This is a partial cross-sectional view of the controller in Embodiment 2 of this application;

[0040] Figure 5This is an exploded view of the controller in Embodiment 2 of this application;

[0041] Figure 6 This is a bottom view of the controller in Embodiment 2 of this application;

[0042] Figure 7 This is a partial exploded view of the controller in Embodiment 2 of this application;

[0043] Figure 8 This is a cross-sectional view of the cooling module in Embodiment 2 of this application;

[0044] Figure 9 This is an exploded view of the controller in Embodiment 3 of this application;

[0045] Figure 10 This is a partial exploded view of the controller in Embodiment 3 of this application;

[0046] Figure 11 This is an exploded view of the controller in Embodiment 3 of this application;

[0047] Figure 12 This is a partial exploded view of the controller in Embodiment 3 of this application.

[0048] Reference table for attached figures:

[0049] Cooling housing 001: housing 101, water channel baffle 102, first connection port 121, second connection port 122, cooling chamber 123, sub-cooling chamber 1231, water inlet chamber 124, water outlet chamber 125, water inlet channel 01, first cooling channel 02, water storage plug 21, water outlet channel 03, receiving chamber 04, metal clamp 41, connecting channel 05, water inlet pipe 06, water outlet pipe 07;

[0050] Power management module 002: Circuit board 201, transformer 202, MOSFET 203;

[0051] Power module 003;

[0052] Capacitor module 004: Heat-conducting plate 401;

[0053] Double-layer mounting shell 005: upper shell 501, lower shell 502, first water channel 503, second water channel 504, third connection port 505, fourth connection port 506, and guide cooling fins 507. Detailed Implementation

[0054] The specific embodiments of this application will be further described below with reference to the accompanying drawings.

[0055] It is readily understood that, based on the technical solution of this application, various structural and implementation methods can be interchanged by those skilled in the art without altering the essential spirit of this application. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative examples of the technical solution of this application and should not be considered as the entirety of this application or as limitations or restrictions on the technical solution of the application.

[0056] The directional terms such as up, down, left, right, front, back, front, back, top, and bottom mentioned or possibly used in this specification are defined relative to the structures shown in the accompanying drawings. These are relative concepts and may therefore vary depending on their location and usage. Therefore, these or other directional terms should not be interpreted as restrictive. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0057] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meanings of the above in this application according to the specific circumstances.

[0058] Example 1:

[0059] The cooling system in the embodiments of this application, such as Figure 1-3 As shown, it includes a cooling housing 001 and a cooling module (not shown) connected to the cooling housing;

[0060] The cooling housing 001 is provided with an inlet water channel 01, a first cooling water channel 02, and an outlet water channel 03;

[0061] The cooling module is equipped with a second cooling water channel;

[0062] The inlet water channel 01 is connected to the first cooling water channel 02, the first cooling water channel 02 is connected to the inlet end of the second cooling water channel, and the outlet end of the second cooling water channel is connected to the outlet water channel 03.

[0063] Specifically, the cooling housing 001 has a mounting cavity for mounting the heat-generating component. The water inlet channel 01, the first cooling water channel 02, and the water outlet channel 03 are arranged in the bottom plate and / or side wall of the cooling housing 001, thereby cooling the heat-generating component in the mounting cavity.

[0064] The cooling module is connected to the lower surface of the cooling housing. The second cooling water channel is connected to the first cooling water channel 02 and the outlet water channel 03. Cooling water flows in from the inlet water channel 01, flows through the first cooling water channel 02 and the second cooling water channel in sequence, and then flows out from the outlet water channel 03.

[0065] The cooling system in this embodiment has cooling water channels in the cooling housing 001, which can cool the heat-generating components installed in and around the cooling housing 001. A cooling module is connected below the cooling housing 001, so that the second cooling water channel in the cooling module is connected to the first cooling water channel 02 and the outlet water channel 03. Heat-generating components can also be arranged around the cooling module, and the heat-generating components can be cooled through a single water channel.

[0066] Furthermore, such as Figure 1 , 2 As shown, the cooling housing 001 is provided with a receiving cavity 04, the cavity wall of the receiving cavity 04 protrudes from the bottom plate of the cooling housing 001, and the first cooling water channel 02 is formed in the cavity wall of the receiving cavity 04.

[0067] In this embodiment, the cooling housing 001 is a square housing, which includes a bottom plate and side plates vertically connected to the four sides of the bottom plate. The bottom plate and the four side plates form the cooling housing 001. The cavity wall of the receiving cavity 04 protrudes from the bottom plate of the cooling housing 001. The cavity wall of the receiving cavity 04 is configured as a hollow structure, and a first cooling water channel 02 is formed inside.

[0068] like Figure 3 As shown, the receiving cavity 04 is a square cavity, and the first cooling water channel 02 is formed in three of its side walls in a U-shaped structure.

[0069] It should be noted that, as Figure 4 As shown, the height direction of the first cooling water channel 02 is the protrusion direction of the cavity wall of the receiving cavity 04. The height of the first cooling water channel 02 is close to the protrusion height of the cavity wall, so that the cross-section of the first cooling water channel 02 is square. As the cooling water flows in the first cooling water channel 02, it can carry away the heat in the receiving cavity and the cavity wall.

[0070] Furthermore, such as Figure 3 As shown, a water storage plug 21 is provided at the outlet end of the first cooling water channel 02. The height of the water storage plug 21 is greater than half the height of the first cooling water channel 02 and less than the height of the first cooling water channel 02.

[0071] Specifically, a water storage plug 21 is installed in the first cooling water channel 02 to block the outlet end of the first water channel 02. This allows the water level in the first cooling water channel 02 to rise to the height of the water storage plug 21 before flowing into the second cooling water channel after the cooling water flows into the first cooling water channel 02. This ensures the cooling water level in the first cooling water channel 02.

[0072] The height of the water storage plug 21 is the water level in the first cooling water channel 02. Therefore, the height of the water storage plug 21 is greater than half the height of the first cooling water channel 02 and less than the total height of the first cooling water channel 02. Within this range, the higher the height of the water storage plug 21, the better the cooling effect of the receiving cavity 04.

[0073] Preferably, the side of the water storage plug 21 facing the first cooling water channel 02 is set as an inclined surface, thereby reducing the pressure of the cooling water in the first cooling water channel 02 on the water storage plug 21 and ensuring the installation stability of the water storage plug 21.

[0074] Furthermore, such as Figure 2 As shown, the cooling housing 001 includes a housing 101 and a water channel baffle 102;

[0075] The water channel baffle 102 is sealed and connected to the bottom plate of the housing 101. The water inlet channel 01, the first cooling water channel 02 and the water outlet channel 03 are formed between the housing 101 and the water channel baffle 102.

[0076] Specifically, the water channel baffle 102 can be welded to the bottom plate of the housing 101 to seal the edges of the water channel baffle 102 and the housing 101. A connecting space is maintained between the housing 101 and the water channel baffle 102 as the water inlet channel 01, the first cooling water channel 02 and the water outlet channel 03.

[0077] This configuration allows the inlet water channel 01 and the outlet water channel 03 to be placed between the water channel partition 102 and the shell, increasing the bottom cooling area of ​​the cooling shell 001 and enhancing the cooling effect.

[0078] Furthermore, such as Figure 3 As shown, a connecting water channel 05 is also provided between the housing 101 and the water channel partition 102, and the connecting water channel 05 is connected to the first cooling water channel 02 and the second cooling water channel.

[0079] Specifically, after the cooling water flows in from the inlet channel, it passes through the first cooling channel 02, the connecting channel 05, and the second cooling channel in sequence before flowing to the outlet channel. Among them, the inlet channel 01 is located on the bottom surface of the cooling housing 001, the first cooling channel 02 is located on the cavity wall of the receiving cavity 04, and the connecting channel 05 and the outlet channel are both located on the bottom surface of the cooling housing 001.

[0080] By setting up connecting water channel 05 to connect the first cooling water channel 02 and the second cooling water channel, the cooling area of ​​the bottom surface of the cooling shell 001 is increased, further enhancing the cooling effect.

[0081] Furthermore, such as Figure 1-3 As shown, the cooling housing 001 is also provided with a water inlet pipe 06 and a water outlet pipe 07;

[0082] One end of the water inlet pipe 06 extends out of the housing 101 from the side plate of the housing 101, and the other end is connected to the bottom plate of the housing 101 so that the water inlet pipe 06 is connected to the water inlet channel 01.

[0083] One end of the water outlet pipe 07 extends out of the housing 101 from the side plate of the housing 101, and the other end is connected to the bottom plate of the housing 101 so that the water outlet pipe 07 is connected to the water outlet channel 03.

[0084] Specifically, the end of the inlet pipe 06 extending out of the housing 101 is used to connect to the cooling water inflow pipe, and the end of the outlet pipe 07 extending out of the housing 101 is used to connect to the cooling water recovery pipe. The other ends of the inlet pipe 06 and the outlet pipe 07 are connected to the bottom plate of the housing 101, which can effectively save space inside the cooling housing 001.

[0085] Preferably, the inlet pipe 06 and the outlet pipe 07 are located on the same side plate of the housing 101, and the inlet pipe 06 and the outlet pipe 07 are arranged in parallel, which facilitates the connection of external pipes and allows for more rational planning of the space inside the cooling housing 001.

[0086] The cooling system in this embodiment has a compact structure and is provided with two layers of cooling water channels, which can dissipate heat from multiple heat-generating components simultaneously.

[0087] Example 2:

[0088] The controller in the embodiments of this application, such as Figure 4 , 5 As shown, it includes a power management module 002, a power module 003, a capacitor module 004, and a cooling system as described in Embodiment 1;

[0089] The power management module 002 is installed on the side of the cooling housing 001 away from the cooling module, and the first cooling water channel is used to cool the power management module 002.

[0090] The power module 003 and the capacitor module 004 are installed on the side of the cooling housing 001 connected to the cooling module. The capacitor module 004 is installed close to the surface of the cooling housing 001. The water inlet channel, the first cooling channel and the water outlet channel are used to cool the capacitor module.

[0091] The power module 003 is installed close to the cooling module, and the second cooling water channel is used to cool the power module 003.

[0092] Specifically, the power management module 002 is installed in the cooling housing 001, and the upper side of the first cooling water channel cools the power management module 002.

[0093] like Figure 6 As shown, the capacitor module 004 is installed below the cooling housing 001 and is in close contact with the lower surface of the cooling housing 001. The water inlet channel, water outlet channel and connecting channel arranged on the bottom surface of the cooling housing 001 cool the capacitor module 004.

[0094] Preferably, a heat-conducting plate 401 is also provided between the capacitor module 004 and the cooling housing 001 to absorb the heat of the capacitor module 004, increase the contact area between the capacitor module 004 and the cooling housing 001, and improve the cooling efficiency.

[0095] The power module 003 is installed close to the cooling module below the cooling housing 001, so that the second cooling water channel cools the power module 003.

[0096] In this embodiment, the power management module 002, power module 003, and capacitor module 004 in the controller are centrally installed around the cooling housing 001. A single water channel can cool all the heat-generating components, which improves the integration of the controller and ensures the cooling effect.

[0097] Furthermore, such as Figure 4 As shown, the power management module 002 includes a circuit board 201, a transformer 202 mounted on the circuit board 201, and multiple field-effect transistors 203;

[0098] The cooling housing 001 is provided with a receiving cavity 04, the cavity wall of the receiving cavity 04 protrudes from the bottom plate of the cooling housing 001, and the first cooling water channel 02 is formed in the cavity wall of the receiving cavity 04.

[0099] The transformer 202 is installed in the housing cavity 04, and the field effect transistor 203 is installed close to the outer surface of the cavity wall of the housing cavity 04.

[0100] Specifically, transformer 202 and field-effect transistor 203 are mounted on the lower surface of circuit board 201, so that transformer 202 and field-effect transistor 203 face cooling housing 001. Transformer 202 is mounted into receiving cavity 04, and a first cooling water channel 02 provided in the cavity wall of receiving cavity 04 can carry away the heat of transformer 202. Field-effect transistor 203 are arranged in two rows on circuit board 201, respectively in close contact with the outer surface of cavity wall of receiving cavity 04.

[0101] like Figure 4As shown, a metal clamp 41 is installed on the cavity wall of the receiving cavity 04. The lower end of the metal clamp 41 is fixed to the cavity wall of the receiving cavity 04, and the upper end forms an installation space with the cavity wall of the receiving cavity 04. The field-effect transistor 203 is installed in the installation space and clamped by the metal clamp 41. This arrangement allows the first cooling water channel 02 to cool the transformer 202 and the field-effect transistor 203 simultaneously.

[0102] Furthermore, such as Figure 5-8 As shown, the cooling housing 001 includes a housing 101 and a water channel baffle 102. The water channel baffle 102 is sealed and connected to the bottom plate of the housing 101. The water inlet channel 01, the first cooling water channel 02 and the water outlet channel 03 are formed between the housing 101 and the water channel baffle 102.

[0103] The cooling module includes a double-layer mounting housing 005 connected below the water channel baffle 102. The double-layer mounting housing 005 includes an upper housing 501 and a lower housing 502. The power module ( Figure 5-8 (Not shown) Installed between the upper shell 501 and the lower shell 502;

[0104] The second cooling water channel includes a first water channel 503 disposed in the upper shell 501 and a second water channel 504 disposed in the lower shell 502. The water inlet end of the first water channel 503 and the water inlet end of the second water channel 504 are both connected to the first cooling water channel 02, and the water outlet end of the first water channel 503 and the water outlet end of the second water channel 504 are both connected to the water outlet channel 03.

[0105] Specifically, the upper shell 501 and the lower shell 502 are arranged in parallel, forming an installation space between them for installing the power module. The upper shell 501 and the lower shell 502 are respectively provided with a first water channel 503 and a second water channel 504 for cooling the power module. The cooling water flow directions of the first water channel 503 and the second water channel 504 are described below. Figure 5 .

[0106] like Figure 7 As shown, the waterway partition 102 is provided with a first connection port 121 and a second connection port 122. The first connection port 121 communicates with the connecting waterway 05, and the second connection port 122 communicates with the outlet waterway 03. The double-layer mounting shell 005 is provided with a third connection port 505 and a fourth connection port 506. The third connection port 505 communicates with the inlet end of the first waterway 503 and the second waterway 504, and the fourth connection port 506 communicates with the outlet end of the first waterway 503 and the second waterway 504. The first connection port 121 and the third connection port 505 are sealed together, and the second connection port 122 and the fourth connection port 506 are sealed together. Preferably, sealing rings can also be provided between the first connection port 121 and the third connection port 505, and between the second connection port 122 and the fourth connection port 506 for sealing.

[0107] like Figure 8As shown, the first water channel 503 and the second water channel 504 are provided with flow guiding cooling fins 507, which can increase the contact area with cooling water and improve cooling efficiency.

[0108] The double-layer mounting shell 005 in this embodiment is suitable for half-bridge IGBT power modules with double-sided chips and can provide double-sided cooling for the power module.

[0109] Example 3:

[0110] The controller in this embodiment differs from the controller in Embodiment 2 in that the structure of the second cooling water channel is different. This embodiment only describes the structure of the second cooling water channel; for other structures, please refer to Embodiment 2.

[0111] In this embodiment, the cooling module is integrated into the water channel baffle 102, such as Figure 9 , 10 As shown, the second cooling channel includes a cooling chamber 123 disposed in the channel partition 102, and the cooling chamber 123 is connected to the first cooling channel 02 and the outlet channel 03.

[0112] The cooling chamber 123 has an opening, and the upper surface of the power module 003 is sealed and installed into the opening of the cooling chamber 123.

[0113] The second cooling channel structure in this embodiment is suitable for single-sided chip full-bridge IGBT power modules or full-bridge SiC power modules. The upper surface of the power module 003 is sealed and installed into the cooling cavity 123, with a sealing ring used for sealing between them. The upper surface of the power module 003 seals the cooling cavity 123, forming the second cooling channel. Cooling water can flow directly over the surface of the power module 003, achieving optimal cooling performance while simplifying the structure and space requirements.

[0114] Preferably, the upper surface of the power module 003 is equipped with flow-guiding cooling fins 507, which can increase the contact area with the second cooling water channel and the cooling water, thereby improving the cooling efficiency.

[0115] Example 4:

[0116] The controller in this embodiment differs from the controller in Embodiment 2 in that the structure of the second cooling water channel is different. This embodiment only describes the structure of the second cooling water channel; for other structures, please refer to Embodiment 2.

[0117] In this embodiment, the cooling module is integrated into the water channel baffle, such as Figure 11 , 12As shown, the second cooling channel includes at least two sub-cooling chambers 1231 disposed in the channel partition 102, and an inlet chamber 124 and an outlet chamber 125 disposed in the channel partition 102. The inlet chamber 124 is connected to each sub-cooling chamber 1231 and the first cooling channel 02, and the outlet chamber 125 is connected to each sub-cooling chamber 1231 and the outlet channel 03. Each sub-cooling chamber 1231 is provided with an opening.

[0118] The second cooling water channel structure in this embodiment is suitable for a single-sided, multi-submodule half-bridge SiC power module. The upper surface of each submodule of the power module 003 is sealed and installed in a sub-cooling cavity 1231, and a sealing ring can be provided between them for sealing. Figure 11 , 12 Taking three chips as an example, the water channel partition 102 is provided with three sub-cooling chambers 1231.

[0119] Each sub-module of the power module 003 has its corresponding sub-cooling chamber 1213 sealed on its upper surface. Each sub-cooling chamber 1231 is connected to the inlet chamber 124 and the outlet chamber 125. Cooling water flows into the inlet chamber 124 from the connecting water channel 05 in the cooling housing 001, then flows into each sub-cooling chamber 1231 to cool each sub-module before converging into the outlet chamber 125, and then flows through the outlet chamber 125 to the outlet water channel 03 in the cooling housing 001. Cooling water can flow directly over the surface of the power module 003, achieving optimal cooling effect while simplifying the structure and space occupation.

[0120] Preferably, each submodule of the power module 003 is equipped with a flow-guiding cooling fin 507 on its upper surface, which can increase the contact area with the second cooling water channel and the cooling water, thereby improving the cooling efficiency.

[0121] As needed, the above technical solutions can be combined to achieve the best technical effect.

[0122] The above description is merely the principle and preferred embodiment of this application. It should be noted that for those skilled in the art, implementation methods obtained by appropriately combining the technical solutions disclosed in different embodiments are also included within the technical scope of this invention. Based on the principle of this application, several other modifications can also be made, which should also be considered within the protection scope of this application.

Claims

1. A cooling system, characterized in that, Includes a cooling housing and a cooling module connected to the cooling housing; The cooling housing is provided with an inlet water channel, a first cooling water channel, and an outlet water channel; The cooling module is equipped with a second cooling water channel; The water inlet channel is connected to the first cooling channel, the first cooling channel is connected to the water inlet of the second cooling channel, and the water outlet of the second cooling channel is connected to the water outlet channel. The cooling housing has a receiving cavity, the cavity wall of which protrudes from the bottom plate of the cooling housing, and the first cooling water channel is formed inside the cavity wall of the receiving cavity; The cooling housing includes a housing and a water channel baffle; The water channel baffle is sealed and connected to the bottom plate of the shell, and the water inlet channel, the first cooling channel and the water outlet channel are formed between the shell and the water channel baffle. The first cooling water channel is used to cool the power management module, the inlet water channel, the first cooling water channel, and the outlet water channel are used to cool the capacitor module, and the second cooling water channel is used to cool the power module.

2. The cooling system according to claim 1, characterized in that, The outlet end of the first cooling water channel is provided with a water storage plug, the height of which is greater than half the height of the first cooling water channel and less than the height of the first cooling water channel.

3. The cooling system according to claim 1, characterized in that, A connecting water channel is also provided between the shell and the water channel partition, and the connecting water channel is connected to the first cooling water channel and the second cooling water channel.

4. The cooling system according to claim 1, characterized in that, The cooling housing is also equipped with an inlet pipe and an outlet pipe; One end of the water inlet pipe extends out of the housing from the side plate of the housing, and the other end is connected to the bottom plate of the housing so that the water inlet pipe is connected to the water inlet channel; One end of the water outlet pipe extends out of the housing from the side plate of the housing, and the other end is connected to the bottom plate of the housing so that the water outlet pipe is connected to the water outlet channel.

5. A controller, characterized in that, Includes a power management module, a power module, a capacitor module, and a cooling system as described in any one of claims 1-4; The power management module is installed on the side of the cooling housing away from the cooling module, and the first cooling water channel is used to cool the power management module; The power module and the capacitor module are installed on the side of the cooling housing connected to the cooling module. The capacitor module is installed close to the surface of the cooling housing. The water inlet channel, the first cooling channel and the water outlet channel are used to cool the capacitor module. The power module is installed close to the cooling module, and the second cooling water channel is used to cool the power module.

6. The controller according to claim 5, characterized in that, The power management module includes a circuit board, a transformer mounted on the circuit board, and multiple field-effect transistors; The transformer is installed in the receiving cavity, and the field-effect transistor is installed close to the outer surface of the cavity wall.

7. The controller according to claim 5 or 6, characterized in that, The cooling module includes a double-layer mounting shell, which comprises an upper shell and a lower shell, and the power module is installed between the upper shell and the lower shell; The second cooling water channel includes a first water channel disposed in the upper shell and a second water channel disposed in the lower shell. The inlet end of the first water channel and the inlet end of the second water channel are both connected to the first cooling water channel, and the outlet end of the first water channel and the outlet end of the second water channel are both connected to the outlet water channel.

8. The controller according to claim 7, characterized in that, The first and second water channels are equipped with flow-guiding cooling fins.

9. The controller according to claim 5 or 6, characterized in that, The second cooling channel includes a cooling cavity disposed in the cooling module, the cooling cavity being connected to the first cooling channel and the outlet channel; The cooling chamber has an opening, and the upper surface of the power module is sealed and installed into the opening of the cooling chamber.

10. The controller according to claim 9, characterized in that, The power module includes at least one sub-module; The cooling chamber includes at least one sub-cooling chamber, and the upper surface of each sub-module is sealed and installed into the opening of one of the sub-cooling chambers; The second cooling channel further includes an inlet chamber and an outlet chamber disposed in the cooling module. The inlet chamber is connected to each of the cooling chambers and the first cooling channel, and the outlet chamber is connected to each of the sub-cooling chambers and the outlet channel.

11. The controller according to claim 10, characterized in that, The upper surface of the power module is equipped with cooling fins.

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