An air-cooled static frequency converter

Abstract

The application discloses a forced air cooling static frequency converter, which comprises a frequency converter valve assembly, a press contact radiator, a thyristor device connected with the press contact radiator, a capacitor on the press contact radiator and a thyristor control unit on the press contact radiator; and a cabinet assembly, which comprises a frequency converter cabinet on the outer side of the frequency converter valve assembly and a wiring cabinet on both sides of the frequency converter cabinet. The valve group radiator and the thyristor device in the cabinet of the forced air cooling static frequency converter are alternately stacked from bottom to top, so that the structure is compact, the area occupied is small, the space utilization is high and the heat accumulation and the overheat damage are avoided.

Description

Technical Field

[0001] This invention relates to the technical field of power equipment, and more particularly to an air-cooled static frequency converter. Background Technology

[0002] In applications involving large synchronous motors in fields such as power, metallurgy, and water conservancy, static frequency converters are often used for drive and speed regulation. As a key electrical device in large pumped storage power stations, static frequency converters have advantages such as rapid start-up, excellent speed regulation performance, high success rate, and strong self-diagnostic capabilities, and are widely used for starting large pumped storage units.

[0003] Currently, most press-fit static inverters use a single thyristor connected to two trapezoidal heat sinks to form an independent module. The modules are arranged in layers and electrically connected by copper busbars. The heat sinks in each layer form a series air duct. In this series air duct, the heat dissipation conditions of the thyristor at the air inlet position are significantly better than those at the air outlet position, resulting in uneven temperature rise at each level. This causes the thyristor to accumulate heat when dissipating heat through the heat sink, leading to overheating and damage. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problem that existing air-cooled static inverters suffer from overheating damage due to heat accumulation when the thyristor is cooled by the heat sink, this invention is proposed.

[0006] Therefore, the purpose of this invention is to provide an air-cooled static frequency converter.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an air-cooled static frequency converter, comprising: a frequency converter valve assembly, including a press-fit heat dissipation device, a thyristor device connected to the press-fit heat dissipation device, a capacitor located on the press-fit heat dissipation device, and a thyristor control unit located on the press-fit heat dissipation device; and a cabinet assembly, including a frequency converter cabinet located outside the frequency converter valve assembly, and wiring cabinets located on both sides of the frequency converter cabinet.

[0008] In a preferred embodiment of the air-cooled static inverter of the present invention, the press-fit heat dissipation device and the thyristor device are stacked alternately from bottom to top; the capacitor and the thyristor control unit are integrated on the press-fit heat dissipation device.

[0009] In a preferred embodiment of the air-cooled static inverter of the present invention, the heat dissipation device includes a heat-conducting substrate, a boss is provided on one side of the heat-conducting substrate, and heat dissipation fins are uniformly arranged on the other side of the heat-conducting substrate; the size of the boss is larger than the pressing surface of the power device; the heat dissipation fins and the heat-conducting substrate are perpendicular to each other; the heat-conducting substrate and the heat dissipation fins are integrally formed by extrusion, and there is no gap between the heat-conducting substrate and the heat dissipation fins; the left and right sides of the heat dissipation fins are respectively provided with parallel transverse serrations, and the transverse serrations are asymmetrically staggered.

[0010] As a preferred embodiment of the air-cooled static inverter of the present invention, an intermediate partition is provided between the two heat-conducting substrates and heat dissipation fins, and a current-carrying bus is provided on the intermediate partition; the intermediate partition, the heat-conducting substrates and the heat dissipation fins form an annular closed air duct; the intermediate partition and the heat dissipation fins are made by vacuum welding process.

[0011] As a preferred embodiment of the air-cooled static inverter of the present invention, a resistor heat sink is further provided at the air inlet position of the press-fit heat sink, the resistor heat sink is a surface-mount heat sink, and the resistor heat sink can form an air duct independently.

[0012] As a preferred embodiment of the air-cooled static inverter of the present invention, wherein: the inverter valve assembly further includes a sheet resistor, the sheet resistor is integrated separately on a resistor heat sink, the resistor heat sink extends in the same direction as the air duct of the press-fit heat sink; and an inspection door is provided on one side of the inverter valve assembly on the inverter cabinet.

[0013] As a preferred embodiment of the air-cooled static frequency converter of the present invention, the frequency converter cabinet includes a frequency converter cabinet body, the frequency converter cabinet body is provided with an insulating partition, the insulating partition divides the frequency converter cabinet body into an air inlet area and an air outlet area, the insulating partition is provided with air holes, and the press-fit heat dissipation device and the resistor heat sink are connected to form an air duct corresponding to the air holes.

[0014] As a preferred embodiment of the air-cooled static inverter of the present invention, wherein: the wiring cabinet includes a wiring cabinet body, and the wiring cabinet body is provided with an air collection box; the inverter cabinet body is also provided with an air outlet box; the air inlet area includes an air collection box and an air inlet, the air inlet is located on the door of the wiring cabinet body, and the air inlet is equipped with louvers; the air outlet area includes an air outlet box and an air outlet, the air outlet box includes a fan cover, the fan cover is provided with a negative pressure fan, the air outlet is connected to the air outlet of the negative pressure fan, and the air outlet is provided with a wire mesh.

[0015] As a preferred embodiment of the air-cooled static inverter of the present invention, the inverter cabinet body is further provided with an air collection chamber, and the air inlet and air outlet are staggered; the resistor heat sink is provided with sealing foam, the resistor heat sink is sealed to the corresponding air hole through the sealing foam, and the resistor heat sink is connected to the air collection chamber through the air hole.

[0016] As a preferred embodiment of the air-cooled static inverter of the present invention, the inverter cabinet further includes a wind pressure sensor located inside the inverter cabinet body; and a temperature probe is also provided inside the inverter cabinet body.

[0017] The beneficial effects of this invention are as follows: the valve group heat sink and the thyristor device in the air-cooled static inverter cabinet are stacked alternately from bottom to top, which results in a compact structure, small footprint, high space utilization, and avoids heat accumulation that could lead to overheating damage. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0019] Figure 1 This is a schematic diagram of the overall structure of the air-cooled static frequency converter of the present invention.

[0020] Figure 2 This is a schematic diagram of the inverter valve assembly structure of the air-cooled static inverter of the present invention.

[0021] Figure 3 This is a schematic diagram of the inverter cabinet structure of the air-cooled static inverter of the present invention.

[0022] Figure 4 This is a schematic diagram of the press-fit heat dissipation device structure of the air-cooled static inverter of the present invention.

[0023] Figure 5 This is a cross-sectional view of the press-fit heat dissipation device described in the air-cooled static inverter of the present invention.

[0024] Figure 6 This is a schematic diagram of the resistor heat sink structure of the air-cooled static inverter of the present invention.

[0025] Figure 7 These are three views of the air-cooled static inverter of the present invention.

[0026] Figure 8 This is a schematic diagram of the insulating partition structure of the air-cooled static frequency converter of the present invention. Detailed Implementation

[0027] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0028] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0029] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0030] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0031] Example 1

[0032] Reference Figure 1 A schematic diagram of the overall structure of an air-cooled static frequency converter is provided, such as... Figure 1-3 A wind-cooled static frequency converter includes a frequency converter valve assembly 100, including a press-fit heat dissipation device 101, a thyristor device 102 connected to the press-fit heat dissipation device 101, a capacitor 103 located on the press-fit heat dissipation device 101, and a thyristor control unit 104 located on the press-fit heat dissipation device 101; and a cabinet assembly 200, including a frequency converter cabinet 201 located outside the frequency converter valve assembly 100, and wiring cabinets 202 located on both sides of the frequency converter cabinet 201. The press-fit heat dissipation device 101 can quickly dissipate heat from the thyristor device 102, the capacitor 103, and the thyristor control unit 104, thereby preventing heat accumulation. The frequency converter cabinet 201 can protect the frequency converter valve assembly 100.

[0033] Furthermore, the press-fit heat dissipation device 101 and the thyristor device 102 are stacked alternately from bottom to top; the capacitor 103 and the thyristor control unit 104 are integrated on the press-fit heat dissipation device 101. The alternating stacking of the press-fit heat dissipation device 101 and the thyristor device 102 from bottom to top allows the press-fit heat dissipation device 101 to better dissipate heat from the thyristor device 102. The integration of the capacitor 103 and the thyristor control unit 104 on the press-fit heat dissipation device 101 results in a compact structure, small footprint, and higher space utilization.

[0034] Operation process: According to the working conditions of different power levels, multiple press-fit heat dissipation devices 101 and multiple thyristor devices 102 are selected and stacked alternately. When the thyristor device 102, capacitor 103 and thyristor control unit 104 generate heat during operation, the press-fit heat dissipation device 101 can play a role in rapid heat dissipation, avoiding heat accumulation and overheating damage. The inverter cabinet 201 can protect the inverter valve assembly 100.

[0035] Example 2

[0036] Reference Figure 1-6 This embodiment differs from the first embodiment in that: the press-fit heat dissipation device 101 includes a thermally conductive substrate 101a, a boss 101a-1 is provided on one side of the thermally conductive substrate 101a, and heat dissipation fins 101a-2 are uniformly arranged on the other side of the thermally conductive substrate 101a; the size of the boss 101a-1 is larger than the surface of the power device press-fit pad; the heat dissipation fins 101a-2 and the thermally conductive substrate 101a are perpendicular to each other; the thermally conductive substrate 101a and the heat dissipation fins 101a-2 are integrally extruded structures, and the thermally conductive substrate 101a... There is no gap between the heat dissipation fins 101a-2 and the heat dissipation fins 101a-2; the heat dissipation fins 101a-2 are provided with parallel transverse serrations 101a-3 on the left and right sides respectively, and the transverse serrations 101a-3 are arranged asymmetrically and alternately. Among them, the boss 101a-1 is larger than the power device pressing plate surface, which is used to improve the pressing effect of pressing the power device. The thermally conductive substrate 101a and the heat dissipation fins 101a-2 are extruded integral profile structures, and there is no gap between the thermally conductive substrate 101a and the heat dissipation fins 101a-2, which can effectively reduce thermal resistance.

[0037] Specifically, a middle partition plate 101a-4 is provided between the two thermally conductive substrates 101a and the heat dissipation fins 101a-2, and a flow busbar 101a-5 is provided on the middle partition plate 101a-4; the middle partition plate 101a-4, the thermally conductive substrates 101a, and the heat dissipation fins 101a-2 form an annular closed air duct; the middle partition plate 101a-4 and the heat dissipation fins 101a-2 are vacuum welded, in which a large amount of heat is carried away when air passes through the annular closed air duct, giving full play to the thermal conductivity and achieving a highly efficient heat dissipation effect, and all three are seamlessly and tightly connected. The combination reduces thermal resistance and improves heat dissipation efficiency. The intermediate partition 101a-4 and the heat dissipation fins 101a-2 are vacuum welded to ensure that the intermediate partition 101a-4 and the heat dissipation fins 101a-2 are tightly fitted, which greatly enhances the overall strength of the press-fit heat dissipation device 101. This ensures that the pressing force is effectively transmitted without loss when pressing with power devices such as thyristors, further reducing thermal resistance. The intermediate partition 101a-4 has a current bus 101a-5 for valve group flow, which facilitates system wiring and does not increase flow resistance, making the valve group structure more compact and easier to install and wire.

[0038] Furthermore, a resistor heat sink 101b is also provided at the air inlet position of the press-fit heat sink 101. The resistor heat sink 101b is a surface-mount heat sink. The resistor heat sink 101b can form an air duct on its own. In this way, the resistor heat sink 101b can form an air duct on its own and can achieve heat dissipation more quickly.

[0039] Furthermore, the inverter valve assembly 100 also includes a sheet resistor 105, which is integrated separately on the resistor heat sink 101b. The resistor heat sink 101b extends in the same direction as the air duct of the press-fit heat sink 101. An inspection door is provided on one side of the inverter valve assembly 100 on the inverter cabinet 201. The inspection door facilitates the installation and maintenance of the inverter valve assembly 100. The resistor heat sink 101b can quickly dissipate heat from the sheet resistor 105. The air duct of the resistor heat sink 101b extends in the same direction as the press-fit heat sink 101 to minimize airflow loss.

[0040] The rest of the structure is the same as in Example 1.

[0041] Operation process: The thermally conductive substrate 101a of the press-fit heat sink 101 is provided with a boss 101a-1, which can improve the pressing effect of the power device and ensure the reliable operation of the power device; the thermally conductive substrate 101a and the heat sink fins 101a-2 are extruded integral profile structures with no gap between them, which can effectively reduce thermal resistance; the intermediate partition 101a-4 and the heat sink fins 101a-2 are vacuum welded to ensure a tight fit between them, further reducing thermal resistance; the intermediate partition 101a-4 has a flow bus 101a-5 for valve group flow, which facilitates system topology wiring and does not increase flow resistance; the intermediate partition 101a-4, the thermally conductive substrate 101a, and the heat sink fins 101a-2 form a ring-shaped closed air duct; considering the special structure and manufacturing process of the press-fit heat sink, when air... When passing through the annular closed air duct, a large amount of heat is carried away, giving full play to the thermal conductivity and achieving a highly efficient heat dissipation effect. Moreover, the three components are seamlessly and tightly connected, reducing thermal resistance, improving heat dissipation efficiency, ensuring that the power devices are fully cooled, and guaranteeing reliable equipment operation. A resistor heat sink 101b is also provided at the air inlet position of the press-fit heat sink 101. The resistor heat sink 101b is a surface-mount heat sink, specifically designed for cooling resistor devices. The resistor heat sink 101b extends in the same direction as the air duct of the press-fit heat sink 101 to minimize airflow loss. The resistor device and the capacitor in Example 1 form an RC circuit, which plays a role in voltage equalization and distribution among power devices, limiting commutation voltage stress, and providing AC power to the thyristor control unit. An inspection door is provided on one side of the inverter valve assembly 100 on the inverter cabinet 201 to facilitate the installation and maintenance of the inverter valve assembly 100.

[0042] Example 3

[0043] Reference Figure 1-8 This embodiment differs from the previous embodiments in that: the inverter cabinet 201 includes an inverter cabinet body 201a, and the inverter cabinet body 201a has an insulating partition 201a-1 inside. The insulating partition 201a-1 divides the inverter cabinet body 201a into an air inlet area and an air outlet area. The insulating partition 201a-1 has air holes 201a-2. The heat dissipation device 101 and the resistor heat sink 101b are connected to form an air duct corresponding to the air holes 201a-2. The air inlet area and the air outlet area are completely sealed and separated, so that the air can circulate better.

[0044] Furthermore, the wiring cabinet 202 includes a wiring cabinet body 202a, on which an air collection box 202a-1 is provided; the inverter cabinet body 201a also has an air outlet box 201a-3; the air inlet area includes the air collection box 202a-1 and an air inlet, the air inlet being located on the door of the wiring cabinet body 202a and equipped with louvers; the air outlet area includes the air outlet box 201a-3 and an air outlet, the air outlet box 201a-3 including a fan cover, inside which is provided... There is a negative pressure fan, and the air outlet is connected to the air outlet of the negative pressure fan. The air outlet is equipped with a wire mesh. When the negative pressure fan is working, negative pressure is generated in the air outlet area. The air passes through the air inlet louvers, the air collection box 202a-1, the air hole 201a-2 on the insulating partition 201a-1, the resistor heat sink 101b, the press-fit heat sink 101 and the air outlet box 201a-3 in sequence, and then is discharged from the air outlet, so that the air is as uniform as possible and the temperature rise of each stage of the thyristor is consistent.

[0045] Furthermore, the inverter cabinet body 201a also has an internal air collection chamber 201a-4, with the air inlet and outlet staggered. The resistor heat sink 101b is equipped with sealing foam 101b-1, and the resistor heat sink 101b is sealed to the corresponding air hole 201a-2 through the sealing foam 101b-1. The resistor heat sink 101b is connected to the air collection chamber 201a-4 through the air hole 201a-2. The staggered air inlet and outlet can effectively prevent hot air exchange, that is, prevent the hot air coming out of the air outlet from re-entering the air inlet, thereby greatly improving the heat dissipation effect.

[0046] Furthermore, the inverter cabinet 201 also includes a wind pressure sensor 201b located inside the inverter cabinet body 201a; the inverter cabinet body 201a is also equipped with a temperature probe. The wind pressure sensor 201b can detect the pressure on both sides of the radiator air duct in real time, and the temperature probe can detect the air temperature in the air collection cavity 201a-4 in real time, so that the equipment can be stopped when the temperature is too high.

[0047] The rest of the structure is the same as in Example 2.

[0048] Operating Procedure: Insulating partition 201a-1 divides the inverter cabinet 201 into an air inlet area and an air outlet area, completely sealing them off. Air vents 201a-2 are provided on insulating partition 201a-1, and the heat dissipation device 101 and the resistor heat sink 101b are connected to form an air duct corresponding to the air vents 201a-2. The air inlet area includes an air collection box 202a-1 and an air inlet located on the door of the wiring cabinet 202, equipped with louvers. The air outlet area includes an air outlet box 201a-3 and an air outlet. The air outlet box 201a-3 includes a fan housing, inside which a negative pressure fan is installed. After the negative pressure fan operates, negative pressure is generated in the air outlet area, and air flows... The air flows through the inlet louvers, through the air collection box 202a-1, the air holes 201a-2 on the insulating partition 201a-1, the resistor radiator 101b, the press-fit heat sink 101, and the outlet box 201a-3, before exiting from the outlet. The staggered arrangement of the inlet and outlet effectively prevents hot air recirculation, thus preventing hot air from the outlet from re-entering the inlet, thereby greatly improving the heat dissipation effect. The inverter cabinet body 201a is also equipped with a wind pressure sensor 201b and a temperature probe to monitor the pressure on both sides of the radiator air duct and the air temperature in the air collection chamber 201a-4 in real time, so that the equipment can be stopped in time when abnormal wind pressure and temperature occur.

[0049] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0050] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0051] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0052] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An air-cooled static frequency converter, characterized by: The utility model relates to a variable frequency valve assembly (100) comprising a press-fit heat sink (101), a thyristor (102) connected to the press-fit heat sink (101), a capacitor (103) located on the press-fit heat sink (101), and a thyristor control unit (104) located on the press-fit heat sink (101). A cabinet assembly (200) comprising a variable frequency cabinet (201) located outside the variable frequency valve assembly (100), A wiring cabinet (202) located on both sides of the variable frequency cabinet (201). The press-fit heat sink (101) comprises a heat-conducting base plate (101a) provided with a boss (101a-1) on one side, The other side of the heat-conducting base plate (101a) is uniformly provided with heat dissipation fins (101a-2), Two heat-conducting base plates (101a) and heat dissipation fins (101a-2) are further provided with an intermediate partition plate (101a-4) therebetween, The intermediate partition plate (101a-4) is provided with a busbar (101a-5), The intermediate partition plate (101a-4), heat-conducting base plate (101a), and heat dissipation fins (101a-2) form a ring-shaped closed air duct, The intermediate partition plate (101a-4) and heat dissipation fins (101a-2) are connected by vacuum welding, The air inlet position of the press-fit heat sink (101) is further provided with a resistance heat sink (101b), which is a surface-mounted heat sink, The variable frequency valve assembly (100) further comprises a square resistance (105) which is independently integrated on the resistance heat sink (101b), The variable frequency cabinet (201) is provided with a maintenance door on one side of the variable frequency valve assembly (100), The variable frequency cabinet (201) comprises a variable frequency cabinet body (201a) provided with an insulating partition plate (201a-1) inside, The insulating partition plate (201a-1) divides the variable frequency cabinet body (201a) into an air inlet area and an air outlet area, The insulating partition plate (201a-1) is provided with air holes (201a-2), The wiring cabinet (202) comprises a wiring cabinet body (202a) provided with a wind collecting box (202a-1), The variable frequency cabinet body (201a) is further provided with an air outlet box (201a-3), The air inlet area comprises the wind collecting box (202a-1) and an air inlet, The air inlet is provided on the door of the wiring cabinet body (202a) and is provided with a louver. The air outlet area comprises an air outlet box (201a-3) and an air outlet, the air outlet box (201a-3) comprises a wind cover shell, a negative pressure fan is arranged in the wind cover shell, and the air outlet is connected to the air outlet of the negative pressure fan, The air outlet is provided with a wire mesh.

2. The air-cooled stationary frequency converter of claim 1, wherein: The crimping heat dissipation device (101) and the silicon controlled device (102) are alternately stacked from bottom to top. The capacitor (103) and the silicon controlled unit (104) are integrated on the crimping heat dissipation device (101).

3. The air-cooled static frequency converter according to claim 1 or 2, characterized in that: The boss (101a-1) is larger in size than the crimping disc surface of the power device; The heat dissipation fins (101a-2) and the heat conduction base plate (101a) are perpendicular to each other; The heat conduction base plate (101a) and the heat dissipation fins (101a-2) are integrally formed by extrusion, and there is no gap between the heat conduction base plate (101a) and the heat dissipation fins (101a-2); The heat dissipation fins (101a-2) are respectively provided with transverse sawteeth (101a-3) on the left and right sides, and the transverse sawteeth (101a-3) are asymmetrically staggered.

4. The air-cooled stationary frequency converter of claim 3, wherein: The inside of the frequency converter cabinet body (201a) is further provided with a wind collecting cavity (201a-4), and the air inlet and the air outlet are staggered; The resistance heat dissipation device (101b) is provided with a sealing foam (101b-1), the resistance heat dissipation device (101b) is sealingly connected to the corresponding air hole (201a-2) through the sealing foam (101b-1), and the resistance heat dissipation device (101b) is connected to the wind collecting cavity (201a-4) through the air hole (201a-2).

5. The air-cooled stationary frequency converter of claim 4, wherein: The frequency converter cabinet (201) further comprises a wind pressure sensor (201b) arranged in the inside of the frequency converter cabinet body (201a). The inside of the frequency converter cabinet body (201a) is further provided with a temperature probe.

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