Laser devices and methods for manufacturing laser devices

Abstract

The laser device of the present invention comprises: a rod-shaped laser medium extending along a first direction; a first base including a first base having a first cut through which the laser medium passes and a first light source unit having a plurality of excitation light sources mounted on the first base; and a support member supporting the laser medium and the first light source unit. At least one of the first base and the support member includes a first defining portion defining the position of the first base relative to the support member.

Description

Technical Field

[0001] This invention relates to laser devices and methods for manufacturing laser devices. Background Technology

[0002] Laser devices are known to have a rod-shaped laser medium and multiple excitation sources that emit excitation light for exciting the laser medium (for example, see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-285807 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The aforementioned laser devices can be configured such that the laser device is mounted on a laser system, and each excitation source can be detachably attached to the laser device. In such a structure, when excitation sources are exchanged, the position and orientation of each excitation source relative to the laser medium must be strictly adjusted to achieve the desired excitation distribution in the laser medium. On the other hand, the aforementioned laser devices can also be configured such that the entire laser device is detachably attached to the laser system. In such a structure, when excitation sources are exchanged, the position and orientation of the laser device in the laser system must be strictly adjusted to ensure that the optical axis of the laser medium is aligned with the optical axis of the laser system.

[0008] The object of the present invention is to provide a laser device and a method for manufacturing such a laser device, which facilitates the assembly and disassembly of multiple excitation sources and the positioning of multiple excitation sources.

[0009] Methods for solving problems

[0010] A laser device according to one aspect of the present invention comprises: a rod-shaped laser medium extending in a first direction; a first base having a first cut through which the laser medium passes and a first light source unit having a plurality of excitation light sources mounted on the first base; and a support member supporting the laser medium and the first light source unit, wherein at least one of the first base and the support member includes a first defining portion defining the position of the first base relative to the support member.

[0011] In this laser device, a first base and multiple excitation light sources are modularized as a first light source unit, which is supported by a support member. Therefore, multiple excitation light sources can be easily mounted and dismounted from the support member simply by detaching and detaching the first base. Furthermore, when the first base is mounted on the support member that supports the laser medium, the laser medium passes through a first slit in the first base, and the position of the first base relative to the support member is defined by a first pre-determining part. Therefore, multiple excitation light sources can be easily positioned on the laser medium simply by mounting the first base on the support member that supports the laser medium. As can be seen from the above description, according to this laser device, the detachment and mounting of multiple excitation light sources and the positioning of multiple excitation light sources can be simplified.

[0012] In one aspect of the laser device of the present invention, a second light source unit may be further provided, which is arranged side by side with the first light source unit in a first direction. This second light source unit includes a second base having a second cut through which the laser medium passes and a plurality of excitation light sources mounted on the second base. A support member supports the second light source unit, and at least one of the second base and the support member includes a second predefined portion that defines the position of the second base relative to the support member. Therefore, the plurality of excitation light sources can be easily mounted and dismounted from the support member simply by detaching and attaching the second base. Furthermore, the plurality of excitation light sources can be easily positioned for the laser medium simply by mounting the second base on the support member that supports the laser medium.

[0013] In one aspect of the laser device of the present invention, the support may include a first holding member and a second holding member arranged side by side in a first direction, and a connecting member connecting the first holding member and the second holding member, with the first light source unit and the second light source unit disposed between the first holding member and the second holding member. This enables miniaturization and simplification of the laser device's structure.

[0014] In one aspect of the laser device of the present invention, the first holding member, as a first defining part, may include a first protrusion disposed in the first cut, the first protrusion having a support surface that can rotatably support the first base in a circumferential direction centered on the centerline of the laser medium. This allows for adjustment of the positions of the plurality of excitation sources of the first light source unit in a circumferential direction centered on the centerline of the laser medium.

[0015] In one aspect of the laser device of the present invention, the second holding member may include a second protrusion disposed in the second cut as a second defining part, the second protrusion having a support surface capable of rotatably supporting the second base in a circumferential direction. This allows the positions of the plurality of excitation sources of the second light source unit to be adjusted in a circumferential direction centered on the centerline of the laser medium.

[0016] In one aspect of the laser device of the present invention, the support member may also include a partition member installed between the first holding member and the second holding member, mounted on the connecting member. The partition member, as a first defining part, includes a first limiter restricting rotation of the first base in the circumferential direction, and as a second defining part, includes a second limiter restricting rotation of the second base in the circumferential direction. Thus, by bringing the first base and the second base into contact with the first and second limiters of the partition member, respectively, multiple excitation light sources can be easily and reliably positioned on the laser medium.

[0017] In one aspect of the laser device of the present invention, the separating member may be made of an insulating material. This reliably prevents short circuits between the plurality of excitation sources of the first light source unit and the plurality of excitation sources of the second light source unit.

[0018] In one aspect of the laser device of the present invention, at least one of the plurality of excitation light sources mounted on the first base may overlap with the second cut when viewed from the first direction, and at least one of the plurality of excitation light sources mounted on the second base may overlap with the first cut when viewed from the first direction. This enables the homogenization of the excitation distribution in the laser medium.

[0019] In one aspect of the laser device of the present invention, the first base may include a first flow path through which a coolant flows, the second base may include a second flow path through which a coolant flows, and the support member may include a third flow path through which a coolant flows. This allows for the cooling of the laser medium and multiple excitation sources.

[0020] In one aspect of the laser device of the present invention, the first flow path, the second flow path, and the third flow path may be interconnected. This allows for efficient cooling of the laser medium and multiple excitation sources.

[0021] In one aspect of the laser device of the present invention, the support member may include a cylinder in which a laser medium is disposed on the inner side. The cylinder is transparent. The third flow path includes a main flow path containing a flow path between the laser medium and the cylinder, a first branch flow path and a second branch flow path branching from the main flow path, and a third branch flow path and a fourth branch flow path merging with the main flow path. The downstream end of the first branch flow path is connected to the upstream end of the first flow path, the downstream end of the second branch flow path is connected to the upstream end of the second flow path, the upstream end of the third branch flow path is connected to the downstream end of the first flow path, and the upstream end of the fourth branch flow path is connected to the downstream end of the second flow path. Thus, the laser medium and multiple excitation sources can be efficiently cooled with a simple flow path structure.

[0022] In one aspect of the laser device of the present invention, each of the plurality of excitation light sources may include a semiconductor laser element. This enables the excitation light source to have a long lifespan. Furthermore, since the plurality of excitation light sources are modularized as a first light source unit or a second light source unit, the precision required in processing individual semiconductor laser elements is not required.

[0023] In one aspect of the laser device of the present invention, the semiconductor laser element may also comprise a plurality of stacked semiconductor laser strips. This allows for efficient and sufficient excitation of the laser medium.

[0024] In one aspect of the laser device of the present invention, a second light source unit may be further provided, which is arranged side by side with the first light source unit in a first direction. This second base includes a second base having a second cut through which the laser medium passes and a plurality of excitation light sources mounted on the second base. A support member supports the second light source unit, and at least one of the first and second bases includes a second defining portion that defines the position of the second base relative to the first base. Therefore, multiple excitation light sources can be easily mounted and dismounted from the support member simply by detaching and attaching the second base. Furthermore, multiple excitation light sources can be easily positioned relative to the laser medium simply by mounting the second base on the support member that supports the laser medium.

[0025] A method for manufacturing a laser device according to one aspect of the present invention comprises: preparing a first light source unit including a first base having a first slit and a plurality of excitation light sources mounted on the first base; passing the laser medium through the first slit in a support member that is in a state supporting a rod-shaped laser medium extending along a first direction, and arranging the first base on the support member from one side in a second direction intersecting the first direction; and rotating the first base to one side in a circumferential direction centered on the centerline of the laser medium.

[0026] In this method of manufacturing a laser device, multiple excitation sources of the first light source unit can be easily positioned relative to the laser medium by simply passing a rod-shaped laser medium extending along a first direction through a first slit and placing a first base on a support member from one side in a second direction intersecting the first direction. This allows the first base to be rotated along a circumferential direction centered on the centerline of the laser medium. Therefore, according to this method, a laser device in which multiple excitation sources are positioned relative to the laser medium can be easily obtained.

[0027] The method for manufacturing a laser device according to one aspect of the present invention may further include: preparing a second light source unit comprising a second base having a second slit and a plurality of excitation light sources mounted on the second base; and in a support member, passing a laser medium through the second slit, and arranging the second base on the support member from one side in a second direction, and arranging the first light source unit and the second light source unit side by side in a first direction. Thus, by simply passing a rod-shaped laser medium extending in the first direction through the second slit and arranging the second base on the support member from one side in a second direction intersecting the first direction, the plurality of excitation light sources of the second light source unit can be easily positioned relative to the laser medium.

[0028] In a method for manufacturing a laser device according to one aspect of the present invention, in the step of arranging the first light source unit and the second light source unit side by side, the second base is rotated to the other side in a circumferential direction centered on the center line of the laser medium. Therefore, by simply rotating the second base in a circumferential direction centered on the center line of the laser medium, the plurality of excitation sources of the second light source unit can be easily positioned relative to the laser medium.

[0029] The effects of the invention

[0030] According to the present invention, a laser device and a method for manufacturing such a laser device are provided, which facilitate the assembly and disassembly of multiple excitation light sources and the positioning of multiple excitation light sources. Attached Figure Description

[0031] Figure 1 This is a perspective view of a laser device according to one embodiment.

[0032] Figure 2 From Figure 1 A three-dimensional view of the laser device as seen from another angle.

[0033] Figure 3 yes Figure 1 The diagram shows a cross-sectional view of the laser device.

[0034] Figure 4 It is along Figure 3 The diagram shows a cross-sectional view of the laser device along line IV-IV.

[0035] Figure 5 It is along Figure 3 The diagram shows a cross-sectional view of the laser device with VV lines.

[0036] Figure 6 It means Figure 1 A schematic diagram of the excitation distribution of the laser medium in the laser device shown.

[0037] Figure 7 It is along Figure 3A cross-sectional view of the laser device along line VII-VII.

[0038] Figure 8 It is along Figure 3 The cross-sectional view of the laser device along line VIII-VIII is shown.

[0039] Figure 9 This is a structural diagram of a laser system with a modified laser device. Detailed Implementation

[0040] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, the same or equivalent parts are labeled with the same reference numerals in the various figures, and repeated descriptions are omitted.

[0041] like Figure 1 , Figure 2 and Figure 3 As shown, the laser device 1 includes a laser medium 20, a first light source unit 30, a second light source unit 40, and a support member 50. The laser medium 20, the first light source unit 30, and the second light source unit 40 are supported by the support member 50. As an example, the laser device 1 is used as a laser amplifier to amplify the laser L in a laser system. Hereinafter, the direction in which the laser L is incident on the laser device 1 is referred to as the X direction, the direction perpendicular to the X direction is referred to as the Y direction, and the direction perpendicular to both the X and Y directions is referred to as the Z direction.

[0042] The laser medium 20 is a rod-shaped solid laser medium extending along the X direction (first direction). The laser medium 20 has a centerline CL parallel to the X direction. The shape of the laser medium 20 is, for example, a cylinder with a diameter of approximately 10 mm and a length of approximately 200 mm. The material of the laser medium 20 is, for example, Nd:YAG.

[0043] The first light source unit 30 and the second light source unit 40 are arranged side by side in the X direction. The first light source unit 30 is positioned on one side of the second light source unit 40 in the X direction. In other words, the second light source unit 40 is positioned on the other side of the first light source unit 30 in the X direction. The first light source unit 30 includes a first base 31 and a plurality of excitation light sources 32. The plurality of excitation light sources 32 are mounted on the first base 31. The second light source unit 40 includes a second base 41 and a plurality of excitation light sources 42. The plurality of excitation light sources 42 are mounted on the second base 41.

[0044] The first base 31 and the second base 41 are plate-shaped components with the X-direction as their thickness direction. For example... Figure 4 As shown, the first base 31 has a first cut 35 through which the laser medium 20 passes. On the side of the second base 41 of the first base 31 (see reference...) Figure 3The surface of the device has multiple mounting portions 31a. Each excitation light source 32 is mounted on each mounting portion 31a. Figure 5 As shown, the second base 41 has a second cut 45 through which the laser medium 20 passes. On the side of the first base 31 of the second base 41 (refer to...) Figure 3 The surface of the base 31 has multiple mounting portions 41a. Each excitation light source 42 is mounted on each mounting portion 41a. The material of the first base 31 and the second base 41 is, for example, aluminum.

[0045] like Figure 6 As shown in (a), (b), and (c), multiple excitation sources 32 and 42 emit excitation light EL to excite the laser medium 20. Figure 6 As shown in (a), multiple excitation light sources 32 are arranged at equal angular intervals along a circumference centered on the center line CL. Figure 6 As shown in (b), multiple excitation light sources 42 are arranged at equal angular intervals along another circumference centered on the center line CL. When viewed from the X direction, as... Figure 6 As shown in (c), multiple excitation light sources 32 and 42 are arranged at equal angular intervals along a circumference centered on the center line CL. In this state, one excitation light source 32 mounted on the first base 31, when viewed from the X direction, is aligned with the second cutout 45 of the second base 41 (see reference). Figure 5 An excitation light source 42, mounted on the second base 41, overlaps with the first cut 35 of the first base 31 when viewed from the X direction (refer to...). Figure 4 )overlapping.

[0046] In this embodiment, three excitation light sources 32 are arranged at 120° intervals along a circumference centered on the center line CL, and three excitation light sources 42 are arranged at 120° intervals along another circumference centered on the center line CL. Furthermore, when viewed from the X direction, the six excitation light sources 32 and 42 are arranged at 60° intervals along a circumference centered on the center line CL. Thus, the excitation light EL emitted from each excitation light source 32 and 34 imparts a uniform excitation distribution to the laser medium 20.

[0047] like Figure 4 As shown, each excitation source 32 includes a semiconductor laser element 33. The semiconductor laser element 33 emits excitation light EL into the laser medium 20. The semiconductor laser element 33 includes a plurality of semiconductor laser strips 33a and a heat sink 33b. The plurality of semiconductor laser strips 33a are stacked in a two-dimensional arrangement of their emission end faces in a plane perpendicular to the direction opposite to the semiconductor laser element 33 and the laser medium 20. The heat sink 33b is mounted on the mounting portion 31a to support the plurality of semiconductor laser strips 33a. The heat sink 33b is provided with an inlet 34a for introducing refrigerant and an outlet 34b for discharging refrigerant.

[0048] like Figure 5 As shown, each excitation source 42 includes a semiconductor laser element 43. The semiconductor laser element 43 emits excitation light EL into the laser medium 20. The semiconductor laser element 43 includes multiple semiconductor laser strips 43a and a heat sink 43b. The multiple semiconductor laser strips 43a are stacked in a two-dimensional arrangement of their emission end faces in a plane perpendicular to the direction opposite to the semiconductor laser element 43 and the laser medium 20. The heat sink 43b is mounted on the mounting portion 41a to support the multiple semiconductor laser strips 43a. The heat sink 43b is provided with an inlet 44a for introducing refrigerant and an outlet 44b for discharging refrigerant.

[0049] like Figure 1 , Figure 2 and Figure 3 As shown, the support member 50 includes a first retaining member 51, a second retaining member 52, a connecting member 53, a foot member 54, a cylinder 55, and a partition member 61. As an example, the support member 50 is installed in the setting part S of the laser system.

[0050] The first holding member 51 and the second holding member 52 are plate-shaped members with the thickness direction in the X direction. The first holding member 51 and the second holding member 52 are arranged side-by-side in the X direction at a predetermined interval. The first holding member 51 holds one end face 20a of the laser medium 20 in the X direction exposed, holding one end of the laser medium 20. The second holding member 52 holds the other end face 20b of the laser medium 20 in the X direction exposed. The first light source unit 30 and the second light source unit 40 are disposed between the first holding member 51 and the second holding member 52. The shape of each of the first holding member 51 and the second holding member 52 is, for example, a rectangular plate. The material of each of the first holding member 51 and the second holding member 52 is, for example, aluminum. When viewed from the X direction, the first light source unit 30 and the second light source unit 40 are located more inward than the outer edge of each of the first holding member 51 and the second holding member 52 (i.e., they do not protrude outward from that outer edge). Therefore, even if an impact is applied to the laser device 1 from the X direction, the first light source unit 30 and the second light source unit 40 can be reliably protected.

[0051] The connecting member 53 is a plate-shaped member with the Z-direction as its thickness direction. The connecting member 53 connects the first retaining member 51 and the second retaining member 52. In this embodiment, the connecting member 53 is mounted between the end of the first retaining member 51 on the S-side and the end of the second retaining member 52 on the S-side. The shape of the connecting member 53 is, for example, a rectangular plate. The material of the connecting member 53 is, for example, aluminum.

[0052] The foot member 54 is a plate-shaped member with the Z-direction as its thickness direction. The first retaining member 51, the second retaining member 52, and the connecting member 53 are fixed to the foot member 54. The two ends of the foot member 54 in the X-direction are located further outward from the end of the first retaining member 51 on the S-side and the end of the second retaining member 52 on the S-side. The two ends of the foot member 54 in the X-direction each have a plurality of elongated holes 54a in the Y-direction as its length direction. As an example, the support member 50 is fixed to the setting part S by being tightened to the setting part S by a plurality of bolts (not shown) through the plurality of elongated holes 54a.

[0053] like Figure 3 As shown, the cylinder 55 is a cylindrical component extending along the X direction. The cylinder 55 is mounted between the first holding member 51 and the second holding member 52, with the laser medium 20 disposed inside the cylinder 55. The cylinder 55 is translucent (transmittance of excitation light EL emitted from each excitation source 32, 42). The shape of the cylinder 55 is, for example, cylindrical. The material of the cylinder 55 is, for example, synthetic quartz.

[0054] A separating member 61 is mounted on the connecting member 53 between the first retaining member 51 and the second retaining member 52. The separating member 61 has a cut through which the laser medium 20 and the cylinder 55 pass. A first light source unit 30 is disposed between the first retaining member 51 and the separating member 61. A second light source unit 40 is disposed between the second retaining member 52 and the separating member 61. The material of the separating member 61 is, for example, an insulating material such as polytetrafluoroethylene (registered trademark). Furthermore, the thickness of the separating member 61 in the X direction is less than the thickness of each of the first base 31 and the second base 41, and the thickness of each of the first base 31 and the second base 41 is less than the thickness of each of the first retaining member 51 and the second retaining member 52. By making the separating member 61, the first base 31, and the second base 41 thinner than the first holding member 51 and the second holding member 52, the area (dead zone) not irradiated by the excitation light EL of the laser medium 20 can be minimized, thereby improving the excitation efficiency and achieving overall miniaturization of the laser device 1. Furthermore, by making the first holding member 51 and the second holding member 52 thicker than the separating member 61, the first base 31, and the second base 41, the laser medium 20, the first light source unit 30, and the second light source unit 40 can be reliably held.

[0055] like Figure 4 As shown, the first retaining member 51 includes a first protrusion (first defined portion) 57. The first protrusion 57 extends from the side of the second retaining member 52 of the first retaining member 51 (see reference). Figure 3The surface 51b of the first protrusion 57 protrudes towards the second retaining member 52. The shape of the first protrusion 57 is, for example, a cylindrical shape centered on the center line CL. The laser medium 20 and the cylinder 55 pass through the first protrusion 57. The side surface of the first protrusion 57 is a support surface 57a that can rotatably support the first base 31 in a circumferential direction centered on the center line CL. The first protrusion 57 is disposed in the first cutout 35 of the first base 31, and the support surface 57a contacts the side surface 35a of the first cutout 35. The shape of the side surface 35a is, for example, a shape that has a complementary relationship with half of the support surface 57a. The first cutout 35 extends in a straight line from both ends of the side surface 35a toward the outer edge of the first base 31.

[0056] The partition member 61 has a groove 62. The groove 62 is on the side of the first retaining member 51 of the partition member 61 (see reference). Figure 3 The surface of the groove 62 is formed. One end of the groove 62 opens in the Z direction opposite to the connecting member 53. The limiter surface (first limiter, first defining part) 62a on one side of the groove 62 in the Y direction contacts the mounting part 31a with its front end disposed in the groove 62 among the plurality of mounting parts 31a of the first base 31. The limiter surface 62a restricts the rotation of the first base 31 in the circumferential direction centered on the center line CL. Figure 4 (Counterclockwise rotation in the middle).

[0057] By inserting the first protrusion 57 into the first cutout 35 of the first base 31, the support surface 57a of the first protrusion 57 contacts the side surface 35a of the first cutout 35, and the mounting portion 31a contacts the limiting surface 62a of the partition member 61, the position of the first base 31 in the X, Y, and Z directions is defined relative to the support member 50 (and further, relative to the laser medium 20). In this state, the first base 31 is fixed to the first retaining member 51 by bolts (not shown) or the like.

[0058] like Figure 5 As shown, the second retaining member 52 includes a second protrusion (second defined portion) 58. The second protrusion 58 extends from the side of the first retaining member 51 of the second retaining member 52 (see reference). Figure 3 The surface 52b of the second protrusion 58 protrudes towards the first retaining member 51. The shape of the second protrusion 58 is, for example, a cylindrical shape centered on the center line CL. The laser medium 20 and the cylinder 55 pass through the second protrusion 58. The side surface of the second protrusion 58 is a support surface 58a that can rotatably support the second base 41 in a circumferential direction centered on the center line CL. The second protrusion 58 is disposed in the second cutout 45 of the second base 41, and the support surface 58a contacts the side surface 45a of the second cutout 45. The shape of the side surface 45a is, for example, a shape that is complementary to half of the support surface 58a. The second cutout 45 extends in a straight line from both ends of the side surface 45a toward the outer edge of the second base 41.

[0059] The partition member 61 has a groove 63. The groove 63 is on the side of the second retaining member 52 of the partition member 61 (see reference). Figure 3 The surface of the groove 63 is formed. One end of the groove 63 opens in the Z direction to the side opposite to the connecting member 53. The limiter surface (second limiter, second defining part) 63a on the other side of the groove 63 in the Y direction contacts the mounting part 41a of the second base 41, the front end of which is disposed in the groove 63. The limiter surface 63a restricts the rotation of the second base 41 in the circumferential direction centered on the center line CL. Figure 5 (Counterclockwise rotation in the middle).

[0060] By engaging the second protrusion 58 with the second cutout 45 of the second base 41, the support surface 58a of the second protrusion 58 contacts the side surface 45a of the second cutout 45, and the mounting portion 41a contacts the limiting surface 63a of the partition member 61. The positions of the second base 41 in the X, Y, and Z directions are defined relative to the support member 50 (and further, relative to the laser medium 20). In this state, the second base 41 is fixed to the second retaining member 52 by bolts (not shown) or the like.

[0061] like Figure 7 and Figure 8 As shown, the support member 50 includes a third flow path 90. (As...) Figure 4 As shown, the first base 31 includes a first flow path 70. (As indicated...) Figure 5 As shown, the second base 41 includes a second flow path 80. Refrigerant flows through the first flow path 70, the second flow path 80, and the third flow path 90. The refrigerant is, for example, water. The first flow path 70, the second flow path 80, and the third flow path 90 are connected. That is, the first flow path 70, the second flow path 80, and the third flow path 90 are connected in such a way that refrigerant supplied from a common supply source (not shown).

[0062] like Figure 7 and Figure 8 As shown, the third flow path 90 includes a main flow path 91. The main flow path 91 includes multiple flow path sections 91a, 91b, and 91c. Flow path section 91b is the flow path between the laser medium 20 and the cylinder 55.

[0063] A flow path portion 91a is formed within the first retaining member 51. The upstream end of the flow path portion 91a is located on the side 51a of the first retaining member 51. The refrigerant supply port 90a is located at the upstream end of the flow path portion 91a. Figure 4(Refer to reference). The downstream end of flow path portion 91a is connected to the upstream end of flow path portion 91b. Flow path portion 91c is formed within the second retaining member 52. The upstream end of flow path portion 91c is connected to the downstream end of flow path portion 91b. The downstream end of flow path portion 91c is located on the side 52a of the second retaining member 52. The downstream end of flow path portion 91c is the refrigerant discharge port 90b (refer to reference). Figure 5 Furthermore, since the side 51a of the first retaining member 51 and the side 52a of the second retaining member 52 are on the same side in the Y direction, it is easy to remove the external piping.

[0064] In the main flow path 91 configured as described above, refrigerant is supplied from the upstream end of the flow path section 91a. The refrigerant flows in the order of flow path sections 91a, 91b, and 91c, and is discharged from the downstream end of the flow path section 91c. As a result, the laser medium 20 is cooled.

[0065] like Figure 7 As shown, the third flow path 90 further includes a first branch flow path 93 and a second branch flow path 94. The first branch flow path 93 and the second branch flow path 94 are formed within the first retaining member 51. The first branch flow path 93 branches from the main flow path 91. The upstream end 93a of the first branch flow path 93 is connected to the middle of the flow path portion 91a of the main flow path 91 (the portion of the main flow path 91 upstream of the flow path portion 91b). Figure 4 As shown, the downstream end 93b of the first branch flow path 93 is located on the surface 51b of the first retaining member 51. Figure 7 As shown, the second branch flow path 94 branches off from the main flow path 91. The upstream end 94a of the second branch flow path 94 connects to the middle of the flow path portion 91a of the main flow path 91 via a portion of the first branch flow path 93. Figure 4 As shown, the downstream end 94b of the second branch flow path 94 is located on the surface 51b of the first retaining member 51.

[0066] like Figure 8 As shown, the third flow path 90 further includes a third branch flow path 95 and a fourth branch flow path 96. The third branch flow path 95 and the fourth branch flow path 96 are formed within the second retaining member 52. The third branch flow path 95 merges with the main flow path 91. Figure 5 As shown, the upstream end 95a of the third branch flow path 95 is located on the surface 52b of the second retaining member 52. Figure 8 As shown, the downstream end 95b of the third branch flow path 95 connects to the middle of the flow path portion 91c of the main flow path 91 (the downstream portion of the main flow path 91 compared to flow path portion 91b) via a part of the fourth branch flow path 96. The fourth branch flow path 96 merges with the main flow path 91. Figure 5As shown, the upstream end 96a of the fourth branch flow path 96 is located on the surface 52b of the second retaining member 52. The downstream end 96b of the fourth branch flow path 96 is connected to the middle of the flow path portion 91e of the main flow path 91.

[0067] Figure 4 As shown, the upstream end 70a of the first flow path 70 is connected to the downstream end 93b of the first branch flow path 93. Figure 5 As shown, the downstream end 70b of the first flow path 70 is connected to the upstream end 95a of the third branch flow path 95. In the first flow path 70, excitation sources 32 adjacent to each other along a circumference centered on the centerline CL are connected via a flexible conduit 71 (see reference). Figure 2 The outlet 34b of the upstream excitation source 32 is connected to the inlet 34a of the downstream excitation source 32. Further, in the first flow path 70, the downstream end 93b of the first branch flow path 93 is connected to the inlet 34a of the upstream excitation source 32 via a pipe 71, and the outlet 34b of the downstream excitation source 32 is connected to the upstream end 95a of the third branch flow path 95 via a pipe 71. Additionally, in... Figure 3 , Figure 4 and Figure 5 The diagram of pipe 71 is omitted.

[0068] In the first branch flow path 93, the first flow path 70, and the third branch flow path 95 configured as described above, refrigerant is supplied from the main flow path 91 at the upstream end 93a of the first branch flow path 93, and the refrigerant flows in the order of the first branch flow path 93, the first flow path 70, and the third branch flow path 95. At the downstream end 95b of the third branch flow path 95, the refrigerant merges with the main flow path 91. As a result, the multiple semiconductor laser strips 33a in the semiconductor laser elements 33 of each excitation light source 32 are cooled.

[0069] like Figure 4 As shown, the upstream end 80a of the second flow path 80 is connected to the downstream end 94b of the second branch flow path 94. Figure 5 As shown, the downstream end 80b of the second flow path 80 is connected to the upstream end 96a of the fourth branch flow path 96. In the second flow path 80, excitation light sources 42 adjacent to each other along a circumference centered on the center line CL are connected via flexible piping 81. Figure 1 (Referencing) Connecting the outlet 44b of the upstream excitation source 42 to the inlet 44a of the downstream excitation source 42. Further, in the second flow path 80, the downstream end 94b of the second branch flow path 94 is connected to the inlet 44a of the upstream excitation source 42 via pipe 81, and the outlet 44b of the downstream excitation source 42 is connected to the upstream end 96a of the fourth branch flow path 96 via pipe 81. Additionally, in Figure 3 , Figure 4 and Figure 5The diagram of pipe 81 is omitted in the text.

[0070] In the second branch flow path 94, the second flow path 80, and the fourth branch flow path 96 configured as described above, refrigerant is supplied from the main flow path 91 at the upstream end 94a of the second branch flow path 94, and the refrigerant flows in the order of the second branch flow path 94, the second flow path 80, and the fourth branch flow path 96. At the downstream end 96b of the fourth branch flow path 96, the refrigerant merges with the main flow path 91. As a result, the semiconductor laser elements 43 of each excitation light source 42, and the plurality of semiconductor laser strips 43a are cooled.

[0071] The manufacturing method of laser device 1 will be described. In this embodiment, as... Figure 4 and Figure 5 As shown, the support member 50, which supports the laser medium 20, is installed in the setting section S of the laser system. First, the first light source unit 30 is prepared (steps for preparing the first light source unit). Next, as... Figure 4 As shown, with the laser medium 20 supported by the support member 50, the laser medium 20 and the cylinder 55 pass through the first cut 35 of the first base 31, and the first base 31 is positioned on the support member 50 from the side of the Y direction (the second direction intersecting the first direction) (specifically, the side opposite to the connecting member 53) (positioning step). Then, with the first protrusion 57 inserted into the first cut 35 of the first base 31 so that the support surface 57a of the first protrusion 57 contacts the side surface 35a of the first cut 35, the first base 31 is rotated to one side in a circumferential direction centered on the center line CL, so that the mounting part 31a abuts against the limiting surface 62a of the separating member 61 (rotating the first base step). In this state, the first base 31 is fixed to the first retaining member 51 using bolts (not shown).

[0072] Next, prepare the second light source unit 40 (steps for preparing the second light source unit). Then, as... Figure 5 As shown, with the laser medium 20 supported by the support member 50, the laser medium 20 and the cylinder 55 pass through the second cut 45 of the second base 41, and the second base 41 is positioned on the support member 50 from one side in the Y direction (specifically, the side opposite to the connecting member 53). Then, with the second protrusion 58 inserted into the second cut 45 of the second base 41 so that the support surface 58a of the second protrusion 58 contacts the side surface 45a of the second cut 45, the second base 41 is rotated to the other side in a circumferential direction centered on the center line CL, so that the mounting part 41a abuts against the limiting surface 63a of the separating member 61, and the first light source unit 30 and the second light source unit 40 are arranged side by side in the X direction (side by side arrangement). In this state, the second base 41 is fixed to the second retaining member 52 using bolts (not shown).

[0073] When the first base 31 is installed on the support member 50, the first protrusion 57 is inserted into the first cut 35 of the first base 31, so that the support surface 57a of the first protrusion 57 contacts the side surface 35a of the first cut 35, and the mounting part 31a contacts the limiting surface 62a of the partition member 61. This defines the position of the first base 31 in the X, Y, and Z directions relative to the support member 50 (and further, relative to the laser medium 20). This prevents the first base 31 from contacting the cylinder 55 and causing damage to the cylinder 55.

[0074] When the second base 41 is installed on the support member 50, the second protrusion 58 is inserted into the second cutout 45 of the second base 41, so that the support surface 58a of the second protrusion 58 contacts the side surface 45a of the second cutout 45, and the mounting portion 41a contacts the limiting surface 63a of the partition member 61. This defines the position of the second base 41 in the X, Y, and Z directions relative to the support member 50 (and further, relative to the laser medium 20). This prevents the second base 41 from contacting the cylinder 55 and causing damage to the cylinder 55.

[0075] As explained above, in the laser device 1, the first base 31 and a plurality of excitation light sources 32 are unitized as a first light source unit 30, and the second base 41 and a plurality of excitation light sources 42 are unitized as a second light source unit 40. The first light source unit 30 and the second light source unit 40 are supported by the support member 50 in a side-by-side arrangement in the X direction. Therefore, the plurality of excitation light sources 32 and 42 can be easily attached and detached from the support member 50 simply by attaching and detaching the first base 31 and the second base 41 respectively. Furthermore, when the first base 31 is mounted on the support member 50 supporting the laser medium 20, the laser medium 20 passes through the first cut 35 of the first base 31, and the position of the first base 31 relative to the support member 50 is defined by the first protrusion 57 of the first holding member 51 and the limiting surface 62a of the separating member 61. Similarly, when the second base 41 is installed on the support member 50 supporting the laser medium 20, the laser medium 20 passes through the second cut 45 of the second base 41, and the position of the second base 41 relative to the support member 50 is defined by the second protrusion 58 of the second holding member 52 and the limiting surface 63a of the separating member 61. Therefore, by simply installing the first base 31 and the second base 41 on the support member 50 supporting the laser medium 20, multiple excitation sources 32, 42 can be easily positioned. As can be seen from the above description, according to the laser device 1, the assembly and disassembly of multiple excitation sources 32, 42 and the positioning of multiple excitation sources 32, 42 can be simplified.

[0076] In the laser device 1, the support member 50 includes a first holding member 51 and a second holding member 52 arranged side by side in the X direction, and a connecting member 53 connecting the first holding member 51 and the second holding member 52. The first light source unit 30 and the second light source unit 40 are disposed between the first holding member 51 and the second holding member 52. As a result, the laser device 1 can be miniaturized and its structure simplified.

[0077] In the laser device 1, the first holding member 51 includes a first protrusion 57 disposed on the first base 31 with a first cutout 35. The first protrusion 57 has a support surface 57a that can rotatably support the first base 31 in a circumferential direction centered on the center line CL. As a result, the positions of the plurality of excitation light sources 32 of the first light source unit 30 can be adjusted in the circumferential direction centered on the center line CL.

[0078] In the laser device 1, the second holding member 52 includes a second protrusion 58 disposed on the second base 41 with a second cutout 45. The second protrusion 58 has a support surface 58a that can rotatably support the second base 41 in a circumferential direction centered on the center line CL. As a result, the positions of the plurality of excitation light sources 42 of the second light source unit 40 can be adjusted in a circumferential direction centered on the center line CL.

[0079] In the laser device 1, the partition member 61 of the support member 50 includes a limiting surface 62a that restricts the rotation of a first base 31 along a circumferential direction centered on the center line CL, and a limiting surface 63a that restricts the rotation of a second base 41 along a circumferential direction centered on the center line CL. Thus, the first base 31 can abut against the limiting surface 62a of the partition member 61, and the second base 41 can abut against the limiting surface 63a of the partition member 61, making it easy and reliable to position multiple excitation sources 32, 42 on the laser medium 20.

[0080] In the laser device 1, the separating member 61 is made of insulating material. This reliably prevents short circuits between the plurality of excitation sources 32 of the first light source unit 30 and the plurality of excitation sources 42 of the second light source unit 40.

[0081] In the laser device 1, one excitation source 32 mounted on the first base 31 overlaps with the second cut 45 of the second base 41 when viewed from the X direction, and one excitation source 42 mounted on the second base 41 overlaps with the first cut 35 of the first base 31 when viewed from the X direction. This enables the homogenization of the excitation distribution in the laser medium 20.

[0082] In the laser device 1, the first base 31 includes a first flow path 70 through which a coolant flows, the second base 41 includes a second flow path 80 through which a coolant flows, and the support member 50 includes a third flow path 90 through which a coolant flows. This allows the laser medium 20 and the plurality of excitation sources 32, 42 to be cooled.

[0083] In the laser device 1, the first flow path 70, the second flow path 80, and the third flow path 90 are connected. This allows for efficient cooling of the laser medium 20 and the multiple excitation sources 32 and 42.

[0084] In the laser device 1, the third flow path 90 includes a main flow path 91 containing a flow path portion 91b between the laser medium 20 and the cylinder 55, a first branch flow path 93 and a second branch flow path 94 branching from the main flow path 91, and a third branch flow path 95 and a fourth branch flow path 96 merging with the main flow path 91. In the laser device 1, the downstream end 93b of the first branch flow path 93 is connected to the upstream end 70a of the first flow path 70, the downstream end 94b of the second branch flow path 94 is connected to the upstream end 80a of the second flow path 80, the upstream end 95a of the third branch flow path 95 is connected to the downstream end 70b of the first flow path 70, and the upstream end 96a of the fourth branch flow path 96 is connected to the downstream end 80b of the second flow path 80. Thus, the laser medium 20 and the multiple excitation light sources 32 and 42 can be efficiently cooled with a simple flow path structure.

[0085] In the laser device 1, each excitation source 32 includes a semiconductor laser element 33, and each excitation source 42 includes a semiconductor laser element 43. This enables the long lifespan of each excitation source 32 and 42. Furthermore, since multiple excitation sources 32 are modularized as a first light source unit 30, and multiple excitation sources 42 are modularized as a second light source unit 40, the precision required in processing where individual semiconductor laser elements are not needed is eliminated.

[0086] In laser device 1, semiconductor laser element 33 includes a plurality of stacked semiconductor laser strips 33a, and semiconductor laser element 43 includes a plurality of stacked semiconductor laser strips 43a. This allows for efficient and sufficient excitation of the laser medium 20.

[0087] In the manufacturing method of laser device 1, the plurality of excitation sources 32 of the first light source unit 30 can be easily positioned on the laser medium 20 simply by passing the laser medium 20 through the first cut 35 of the first base 31, placing the first base 31 on the support member 50 from one side in the Y direction, and rotating the first base 31 in a circumferential direction centered on the center line CL. Similarly, the plurality of excitation sources 42 of the second light source unit 40 can be easily positioned on the laser medium 20 simply by passing the laser medium 20 through the second cut 45 of the second base 41, placing the second base 41 on the support member 50 from one side in the Y direction, and rotating the first base 31 in a circumferential direction centered on the center line CL. Therefore, according to the manufacturing method of laser device 1, a laser device 1 in which a plurality of excitation sources 32 are positioned on the laser medium 20 can be easily obtained.

[0088] This invention is not limited to the embodiments described above. For example, in the above embodiments, the first light source unit 30 includes three excitation light sources 32, but the first light source unit 30 can simply include multiple excitation light sources 32. Similarly, in the above embodiments, the second light source unit 40 includes three excitation light sources 42, but the second light source unit 40 can simply include multiple excitation light sources 42.

[0089] In the above embodiment, both the first base 31 and the second base 41 can rotate in a circumferential direction centered on the center line CL, but it is also possible that at least one of the first base 31 and the second base 41 can rotate in a circumferential direction centered on the center line CL.

[0090] The laser device 1 may also include at least one of a first light source unit 30 and a second light source unit 40. In this case, by means of... Figure 9 As shown, the laser device 1A equipped with the first light source unit 30 and the laser device 1B equipped with the second light source unit 40 are arranged on the same optical axis. When viewed from a direction parallel to this optical axis, the multiple excitation light sources 32 and 42 that constitute the first light source unit 30 and the second light source unit 40 are arranged at equal angular intervals around the center of this optical axis, thus enabling uniform excitation of the laser L. According to this structure, for example, compared to the case where the excitation light is irradiated from a large number of excitation light sources onto a single laser medium, the irradiation area of ​​the excitation light EL on each laser medium 20 can be suppressed, and the degradation of each laser medium 20 caused by the thermal lensing effect can be prevented.

[0091] The first flow path 70 may also be a flow path formed within the main body of the first base 31 on which a plurality of excitation light sources 32 are mounted. Similarly, the second flow path 80 may also be a flow path formed within the main body of the second base 41 on which a plurality of excitation light sources 42 are mounted.

[0092] The heat sink 33b of the semiconductor laser element 33 may also not include a flow path for refrigerant, allowing heat to dissipate to the first base 31. Similarly, the heat sink 43b of the semiconductor laser element 43 may also not include a flow path for refrigerant, allowing heat to dissipate to the second base 41.

[0093] The first base 31 and the second base 41 may also omit the first flow path 70 and the second flow path 80, respectively. In this case, heat sinks may be provided on the first base 31 and the second base 41, respectively. By using air cooling or natural heat dissipation to cool the first base 31 and the second base 41, the semiconductor laser elements 33 and 43 are cooled.

[0094] Each excitation source 32 may also include an electronic cooling element for cooling the semiconductor laser element 33. Similarly, each excitation source 42 may also include an electronic cooling element for cooling the semiconductor laser element 43.

[0095] In the above embodiment, the support member 50, as the first defining portion that defines the position of the first base 31 relative to the support member 50, includes the first protrusion 57 of the first retaining member 51 and the limiting surface 62a of the separating member 61. However, the first defining portion may be included by the first base 31, or it may be included by both the first base 31 and the support member 50. That is, at least one of the first base 31 and the support member 50 may include the first defining portion that defines the position of the first base 31 relative to the support member 50. The first defining portion may also be a positioning pin and positioning hole, a positioning bolt and positioning threaded hole (in which case, it also serves to fix the first base 31 to the support member 50), etc.

[0096] In the above embodiment, the support member 50, as the second defining portion that defines the position of the second base 41 relative to the support member 50, includes the second protrusion 58 of the second retaining member 52 and the limiting surface 63a of the separating member 61. However, the second defining portion may be included by the second base 41, or both the second base 41 and the support member 50 may include the second defining portion. That is, at least one of the second base 41 and the support member 50 may include the second defining portion that defines the position of the second base 41 relative to the support member 50. The second defining portion may also be a positioning pin and positioning hole, a positioning bolt and positioning threaded hole (in which case, it also serves to fix the second base 41 to the support member 50), etc.

[0097] In the above embodiment, the support member 50, as a first defining portion that defines the position of the first base 31 relative to the support member 50, includes the first protrusion 57 of the first retaining member 51 and the limiting surface 62a of the separating member 61, and the support member 50, as a second defining portion that defines the position of the second base 41 relative to the support member 50, includes the second protrusion 58 of the second retaining member 52 and the limiting surface 63a of the separating member 61. However, it is also possible that at least one of the first base 31 and the support member 50 includes the first defining portion that defines the position of the first base 31 relative to the support member 50, and at least one of the first base 31 and the second base 41 includes the second defining portion that defines the position of the second base 41 relative to the first base 31. In this case, it is also possible to easily detach and assemble multiple excitation light sources 32, 42 from the support member 50 simply by detaching and assembling the first base 31 and the second base 41 respectively. Furthermore, multiple excitation sources 32 and 42 can be easily positioned on the laser medium 20 simply by installing the first base 31 and the second base 41 on the support member 50 supporting the laser medium 20.

[0098] The support member 50 can be configured to support the laser medium 20 and the first light source unit 30 (or, if a second light source unit 40 is included, the laser medium 20, the first light source unit 30, and the second light source unit 40). For example, it may not include the connecting member 53, or it may include either the first retaining member 51 or the second retaining member, regardless of whether the connecting member 53 is included. Furthermore, since the support member 50 is configured to support the laser medium 20 and the first light source unit 30 (or, if a second light source unit 40 is included, the laser medium 20, the first light source unit 30, and the second light source unit 40) does not need to be in contact with the support member 50 separately. For example, there is also a case where the first light source unit 30 is supported by the support member 50 in a state of contact with the support member 50, and the second light source unit 40 is supported by the support member 50 in a state of contact with the first light source unit 30 but spaced apart from the support member 50.

[0099] Explanation of reference numerals in the attached figures

[0100] 1…Laser device; 20…Laser medium; 30…First light source unit; 31…First base; 32…Excitation light source; 33…Semiconductor laser element; 33a…Semiconductor laser strip; 35…First notch; 40…Second light source unit; 41…Second base; 42…Excitation light source; 43…Semiconductor laser element; 43a…Semiconductor laser strip; 45…Second notch; 50…Support member; 51…First holding member; 52…Second holding member; 53…Connecting member; 55…Cylinder; 57…First protrusion (first specified part); 57a…Support surface; 58…Second protrusion (second specified part); 58a… …Support surface; 61…Separation member; 62a…Limiter surface (first limiter, first specified part); 63a…Limiter surface (second limiter, second specified part); 55…Cylinder; 70…First flow path; 70a…Upstream end; 70b…Downstream end; 80…Second flow path; 80a…Upstream end; 80b…Downstream end; 90…Third flow path; 91…Main flow path; 91b…Flow path portion (flow path); 93…First branch flow path; 93b…Downstream end; 94…Second branch flow path; 94b…Downstream end; 95…Third branch flow path; 95a…Upstream end; 96…Fourth branch flow path; 96a…Upstream end.

Claims

1. A laser device, wherein provided are: a rod-shaped laser medium extending in a first direction; a first light source unit including a first base having a first cutout through which the laser medium passes, and a plurality of excitation light sources mounted on the first base; a second light source unit disposed in parallel with the first light source unit in the first direction, including a second base having a second cutout through which the laser medium passes, and a plurality of excitation light sources mounted on the second base; and a support member that supports the laser medium, the first light source unit, and the second light source unit, the first light source unit and the second light source unit are respectively detachable with respect to the support member, at least one of the first base and the support member includes a first regulation portion that regulates a position of the first base with respect to the support member, at least one of the second base and the support member includes a second regulation portion that regulates a position of the second base with respect to the support member, the support member includes a first holding member and a second holding member disposed in parallel in the first direction, a link member that links the first holding member and the second holding member, and a partition member mounted on the link member between the first holding member and the second holding member, the first light source unit is disposed between the first holding member and the partition member, the second light source unit is disposed between the second holding member and the partition member, the partition member includes a first stopper that limits rotation of the first base in a circumferential direction centered on a center line of the laser medium, as the first regulation portion, and includes a second stopper that limits rotation of the second base in the circumferential direction, as the second regulation portion.

2. The laser device according to claim 1, wherein the first holding member includes a first protrusion disposed in the first cutout, as the first regulation portion, the first protrusion has a support surface that rotatably supports the first base in the circumferential direction.

3. The laser device according to claim 1 or 2, wherein the second holding member includes a second protrusion disposed in the second cutout, as the second regulation portion, the second protrusion has a support surface that rotatably supports the second base in the circumferential direction.

4. The laser device according to any one of claims 1 to 3, wherein the partition member is made of an insulating material.

5. The laser device according to any one of claims 1 to 4, wherein at least one of the plurality of excitation light sources mounted on the first base overlaps the second cutout when viewed from the first direction, at least one of the plurality of excitation light sources mounted on the second base overlaps the first cutout when viewed from the first direction.

6. The laser device according to any one of claims 1 to 5, wherein the first base includes a first flow path through which a refrigerant flows, the second base includes a second flow path through which a refrigerant flows, ​ The support includes a third flow path through which the refrigerant flows.

7. The laser device according to claim 6, wherein The first flow path, the second flow path, and the third flow path communicate with each other.

8. The laser device according to claim 7, wherein The support includes a cylindrical body in which the laser medium is disposed on the inside, The cylindrical body is light-transmissive, The third flow path includes a main flow path including a flow path between the laser medium and the cylindrical body, a first branch flow path and a second branch flow path branching from the main flow path, and a third branch flow path and a fourth branch flow path that join the main flow path, The downstream end of the first branch flow path is connected to the upstream end of the first flow path, The downstream end of the second branch flow path is connected to the upstream end of the second flow path, The upstream end of the third branch flow path is connected to the downstream end of the first flow path, The upstream end of the fourth branch flow path is connected to the downstream end of the second flow path.

9. The laser device according to any one of claims 1 to 8, wherein Each of the plurality of excitation light sources includes a semiconductor laser element.

10. The laser device according to claim 9, wherein The semiconductor laser element includes a plurality of semiconductor laser bars stacked.

11. A manufacturing method of a laser device, comprising: preparing a support in a state in which a laser medium in the form of a rod extending in a first direction is supported, the support including a first holding member and a second holding member arranged side by side in the first direction, a link member linking the first holding member and the second holding member, and a partition member installed in the link member between the first holding member and the second holding member and provided with a first stopper and a second stopper; preparing a first light source unit including a first base having a first cutout and a plurality of excitation light sources installed in the first base, and a second light source unit including a second base having a second cutout and a plurality of excitation light sources installed in the second base; passing the laser medium through the first cutout between the first holding member and the partition member, and arranging the first base in the support from one side in a second direction intersecting the first direction until rotation is restricted by the first stopper, rotating the first base to one side in a circumferential direction centered on a center line of the laser medium; and passing the laser medium through the second cutout between the second holding member and the partition member, and arranging the second base in the support from the one side in the second direction until rotation is restricted by the second stopper, rotating the second base to the other side in the circumferential direction, and arranging the first light source unit and the second light source unit side by side in the first direction. ​

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