Packaging shell, laser radar module and automatic driving vehicle

Abstract

The embodiment of the invention relates to a packaging shell, a laser radar module and an automatic driving vehicle. The packaging shell comprises a tube shell, a first functional layer, a second functional layer, a first pin and a temperature control layer. The tube shell comprises a first side wall, a second side wall and a closed inner cavity, and the first side wall and the second side wall are used for surrounding the inner cavity. A first light-transmitting hole and a second light-transmitting hole which are arranged at an interval and penetrate through the first side wall are formed in the first side wall. A first through hole penetrating through the second side wall is formed in the second side wall. And the first functional layer is embedded and filled in the first light-transmitting hole. The first functional layer comprises a first collimating mirror and a first filter. And the second functional layer is embedded and filled in the second light-transmitting hole. And the second functional layer comprises a first light receiving mirror and a second filter. And the first pin passes through and fills the first through hole, and the first pin is used for electric connection. And the temperature control layer is accommodated in the inner cavity.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to a packaging shell, a laser radar module having the packaging shell, and an autonomous vehicle applying the laser radar module. BACKGROUND

[0002] The existing laser radar module directly fixes a plurality of exposed components (such as a light-emitting module and a light-receiving module) and components of other functional modules on a circuit board, and packages a packaging shell close to the circuit board. Therefore, the laser radar module has low airtightness, is greatly affected by environmental humidity, and has low durability of each component. In addition, the existing laser radar module also includes a filter plate packaged on the outer surface of the packaging shell, and the filter plate is usually formed by coating a film on transparent or colored glass. The coating film requires high precision and needs a relatively large piece. Specifically, the larger the size of the filter plate, the more difficult it is to improve the uniformity of the coating film, and the larger the size of the filter plate, the higher the cost of the glass and the coating film required to prepare the filter plate. When the chip components inside the laser radar module are damaged, since there are other sensor or processor modules on the circuit board, the laser radar module cannot be directly repaired, and the entire circuit board needs to be replaced, causing unnecessary waste of part of the module and generating high repair costs. SUMMARY

[0003] The first aspect of the present application provides a packaging shell. The packaging shell comprises:

[0004] a tube shell comprising a first side wall, a second side wall, and a closed inner cavity, the first side wall and the second side wall being used to surround the inner cavity; the first side wall is formed with a first light-transmitting hole and a second light-transmitting hole, the first light-transmitting hole and the second light-transmitting hole being arranged at intervals and penetrating through the first side wall; the second side wall is formed with a first through hole, the first through hole penetrating through the second side wall;

[0005] a first functional layer embedded and filled in the first light-transmitting hole, the first functional layer comprising a first collimating mirror and a first filter plate;

[0006] a second functional layer embedded and filled in the second light-transmitting hole, the second functional layer comprising a first light-receiving mirror and a second filter plate;

[0007] a first pin penetrating and filling the first through hole, the first pin being used for electrical connection; and

[0008] a temperature control layer accommodated in the inner cavity.

[0009] The packaging shell provided by the embodiments of the present application uses a tube shell with a sealed inner cavity to perform airtight packaging, so as to reduce the influence of environmental humidity on the inside, thereby improving the reliability of the overall product and reducing maintenance costs. At the same time, the packaging shell is provided with a light-transmissive first functional layer and a second functional layer on the tube shell, which enriches the functions of the packaging shell in optical applications; and the packaging shell further accommodates a temperature control layer in the inner cavity to perform refrigeration cooling, so as to prevent the packaging shell from overheating, and further improve the reliability of the overall product.

[0010] The second aspect of the present application provides a laser radar module. The laser radar module comprises:

[0011] The packaging shell as described in the first aspect above; and

[0012] A laser transceiver module is accommodated in the inner cavity of the packaging shell, and the laser transceiver module comprises:

[0013] A light-emitting module comprises a laser source, a second collimating mirror and a scanning module, the laser source is used to emit light source light, the second collimating mirror is used to collimate the light source light into parallel light, and the scanning module is used to convert at least part of the parallel light into reference light to be emitted to a target to be measured; wherein the target to be measured reflects probe light according to the reference light; and

[0014] A light-receiving module comprises a light sensor and a second light-receiving mirror, the light sensor is used to obtain position information of the target to be measured according to the probe light; and the second light-receiving mirror is used to converge and guide the probe light to the light sensor;

[0015] The reference light is transmitted to the target to be measured by the first functional layer; the probe light is transmitted to the second light-receiving mirror by the second functional layer; the first pin is electrically connected with the laser transceiver module; and the temperature control layer is in contact with the laser transceiver module to perform refrigeration cooling for the laser transceiver module.

[0016] The laser radar module provided in the embodiments of the present application contains the laser transceiver module in the inner cavity of the packaging shell with high reliability, so as to reduce the maintenance cost and facilitate the modularization, and the independent laser radar module can be directly replaced when a fault occurs. The laser transceiver module includes a light emitting module and a light receiving module, the light emitting module is used for emitting reference light, and the light receiving module is used for receiving detection light. At the same time, the first collimating mirror and the first filter of the first functional layer of the packaging shell can filter and collimate the reference light, so as to improve the detection distance and scanning accuracy. In addition, the first light receiving mirror and the second filter of the second functional layer of the packaging shell can filter and receive the detection light, which is equivalent to receiving light at a larger angle, thereby improving the detection angle. According to the above-mentioned packaging shell with the advantages of modularization, high reliability and multi-function, the assembly process of the laser radar module is simplified, the volume is reduced to improve the integration effect, the technical effect of detection automation can be effectively achieved, the maintenance is more convenient, and the maintenance cost is reduced.

[0017] The third aspect of the present application provides an autonomous vehicle. The autonomous vehicle comprises:

[0018] The laser radar module according to the second aspect described above; and

[0019] The vehicle body, and the laser radar module is located in the vehicle body.

[0020] The autonomous vehicle provided in the embodiments of the present application fixes the laser radar module according to the second aspect on the vehicle body for scanning and ranging, fully utilizes the advantages of the laser radar module, and helps the autonomous vehicle to better avoid obstacles in front of the vehicle during driving. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 The structure schematic diagram of the laser radar module according to an embodiment of the present application.

[0022] Figure 2 The structure schematic diagram of the laser radar module according to another embodiment of the present application.

[0023] Figure 3 The structure schematic diagram of the optical phased array chip in Figure 1

[0024] The structure schematic diagram of the optical phased array chip in Figure 4 Figure 2

[0025] Figure 5 The structure schematic diagram of the autonomous vehicle according to an embodiment of the present application.

[0026] Explanation of main element symbols: ​​

[0027] Laser radar module 100

[0028] Encapsulation shell 10

[0029] Tube shell 11

[0030] First side wall 111

[0031] Second side wall 112

[0032] Third side wall 113

[0033] Inner cavity 114

[0034] Functional layer 13

[0035] First functional layer 131

[0036] First collimating mirror 131a

[0037] First filter 131b

[0038] Second functional layer 132

[0039] First light receiving mirror 132a

[0040] Second filter 132b

[0041] Pin 15

[0042] First pin 151

[0043] Second pin 152

[0044] Temperature control layer 17

[0045] Laser transceiver module 20

[0046] Light emitting module 21

[0047] Laser source 211

[0048] Second collimating mirror 212

[0049] Scanning module 213

[0050] Optical phased array chip 214

[0051] Grating surface 214a

[0052] Grating unit 214b

[0053] Quarter-wave plate 215

[0054] Polarization beam splitter 216

[0055] Light receiving module 23

[0056] Light sensor 231

[0057] Second light receiving mirror 233

[0058] Built-in circuit board module 30

[0059] First circuit board 31

[0060] Second circuit board 32

[0061] Light source driving board 33

[0062] Chip driving board 35

[0063] Autonomous vehicle 200

[0064] Vehicle body 210

[0065] Object to be measured Q

[0066] First light transmission hole H1

[0067] Second light transmission hole H2

[0068] First through hole K1

[0069] Second through hole K2

[0070] Cavity surface M1, M2

[0071] Upper cover S1

[0072] Base S2

[0073] Outer wall surface W

[0074] First guide wire G1

[0075] Second guide wire G2

[0076] Third guide wire G3

[0077] Fourth guide wire G4

[0078] Light source light L1

[0079] Parallel light L2

[0080] First laser L21

[0081] Non-working light L22

[0082] Second laser L3

[0083] Reference light L4

[0084] Detection light L5

[0085] Vertical direction Z

[0086] The following detailed description will further explain the present application with reference to the above mentioned figures. DETAILED DESCRIPTION

[0087] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the figures in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0088] The present application provides a packaging shell and a laser radar module having the same.

[0089] Please refer to Figure 1 The laser radar module 100 of the first embodiment includes a packaging shell 10 and a laser transceiver module 20. The laser transceiver module 20 is accommodated in the interior of the packaging shell 10, and the packaging shell 10 is used for hermetically packaging the laser transceiver module 20.

[0090] The packaging shell 10 includes a tube shell 11, a functional layer 13, a pin 15 and a temperature control layer 17.

[0091] The tube shell 11 is a hollow shell, including a first side wall 111, a second side wall 112, a third side wall 113 and a closed inner cavity 114, and the first side wall 111, the second side wall 112 and the third side wall 113 are used to surround the inner cavity 114. Other side walls not specifically limited here are not shown in the figure. Specifically, the third side wall 113 is arranged opposite to the second side wall 112, and the third side wall 113 and the second side wall 112 are respectively connected with the first side wall 111. A first light transmission hole H1 and a second light transmission hole H2 are formed on the first side wall 111, and the first light transmission hole H1 and the second light transmission hole H2 are arranged at intervals on the first side wall 111 and penetrate the first side wall 111. At the same time, a first through hole K1 is formed on the second side wall 112, the first through hole K1 penetrates the second side wall 112, and the number of the first through hole K1 is not limited, which can be set to multiple but at least one. In addition, a second through hole K2 is also formed on the third side wall 113, the second through hole K2 penetrates the third side wall 113, and the number of the second through hole K2 is not limited, which can be set to multiple but at least one. The first through hole K1 and the second through hole K2 are arranged opposite to each other.

[0092] The functional layer 13 includes a first functional layer 131 and a second functional layer 132, both of which are light-transmissive. The first functional layer 131 is embedded in and fills the first light-transmissive hole H1, and the first functional layer 131 includes a first collimating mirror 131a and a first filter 131b; the second functional layer 132 is embedded in and fills the second light-transmissive hole H2, and the second functional layer 132 includes a first light-receiving mirror 132a and a second filter 132b; and the components in the first functional layer 131 and the second functional layer 132 are arranged in a stacked manner. When the first functional layer 131 is embedded in and fills the first light-transmissive hole H1, the first collimating mirror 131a is closer to the inner cavity 114 of the tube shell 11 than the first filter 131b, that is, the first filter 131b is closer to the outer wall surface W of the first side wall 111 away from the inner cavity 114 than the first collimating mirror 131a. When the second functional layer 132 is embedded in and fills the second light-transmissive hole H2, the first light-receiving mirror 132a is closer to the inner cavity 114 of the tube shell 11 than the second filter 132b, that is, the second filter 132b is closer to the outer wall surface W of the first side wall 111 away from the inner cavity 114 than the first light-receiving mirror 132a.

[0093] The pin 15 includes a first pin 151 and a second pin 152 for electrical connection. The first pin 151 passes through and fills the first through-hole K1, and the second pin 152 passes through and fills the second through-hole K2. Since the first through-hole K1 and the second through-hole K2 are oppositely arranged, the first pin 151 and the second pin 152 are also oppositely arranged. The pin 15 can be metal or made of other materials with electrical conductivity, which is not limited here.

[0094] The temperature control layer 17 is accommodated in the inner cavity 114 and is used for refrigeration cooling. The temperature control layer 17 is located on the cavity surface M1 opposite to the first side wall 111, or on the cavity surface M2 close to the inner cavity 114 of the first side wall 111.

[0095] The first side wall 111 can be the upper cover S1 or the base S2, and the upper cover S1 and the base S2 are two oppositely arranged side walls in the tube shell. The cavity surface on which the temperature control layer 17 is located is the surface of the base S2 close to the inner cavity 114, and the cavity surface opposite to the temperature control layer 17 is the surface of the upper cover S1 close to the inner cavity 114.

[0096] In this embodiment, the first side wall 111 is the upper cover S1, the temperature control layer 17 is located on the cavity surface M1, and the cavity surface M2 is oppositely arranged with the temperature control layer 17. At this time, the first functional layer 131 and the second functional layer 132 are located on the first side wall 111 and also on the upper cover S1.

[0097] The encapsulation housing 10 provided in this application uses a tube shell 11 with a sealed inner cavity 114 for hermetic sealing, so as to reduce the impact of ambient moisture on the internal modules, thereby improving the overall product reliability and reducing maintenance costs. At the same time, the encapsulation housing 10 adds a light-transmitting first functional layer 131 and a second functional layer 132 to the tube shell 11, enriching the functions of the encapsulation housing 10 in optical applications; and the encapsulation housing 10 also accommodates a temperature control layer 17 in the inner cavity 114 for cooling and preventing the encapsulation housing 10 from overheating, further improving the overall product reliability.

[0098] Please continue reading. Figure 1 The laser transceiver module 20 is also housed within the cavity 114 of the encapsulation housing 10. The laser transceiver module 20 includes a light-emitting module 21 and a light-receiving module 23. The light-emitting module 21 emits reference light L4 to the target Q, and the light-receiving module 23 receives the probe light L5 reflected by the target Q according to the reference light L4, and obtains the distance information of the target Q based on the probe light L5. The light-emitting module 21 includes a laser source 211, a second collimating lens 212, and a scanning module 213. The light-receiving module 23 includes a photosensor 231 and a second light-receiving lens 233.

[0099] When the laser transceiver module 20 is in working mode, the first functional layer 131 is located in the optical path of the reference light L4. After being emitted from the light-emitting module 21, the reference light L4 passes sequentially through the first collimating lens 131a and the first filter 131b of the first functional layer 131 and is emitted to the target Q. The second functional layer 132 is located in the optical path of the probe light L5. The probe light L5 passes sequentially through the second filter 132b and the first receiving lens 132a of the second functional layer 132 and is received by the receiving module 23. Therefore, the first functional layer 131 and the scanning module 213 are aligned, and the second functional layer 132 and the receiving module 23 are also aligned. In this embodiment, the first filter 131b is a low-pass filter (LPF), and the second filter 132b is a narrow-band filter (NBPF). Both the LPF and the NBPF are used to select the wavelength range of the incident light beam, which is equivalent to allowing light beams within the target wavelength band to pass through while blocking light beams outside the target wavelength band. Specifically, the LPF can filter light beams in the wavelength band below 1000 nanometers and has the advantage of low cost; the NBPF has higher filtering accuracy than the LPF and can filter out light beams in all wavelength bands of the narrow band around 1550 nanometers.

[0100] More specifically, in this embodiment, both the reference light L4 and the probe light L5 operate at a wavelength of 1550 nm. However, the photosensor 231 can sense beams in the 900-1700 nm range. Therefore, without using the second filter 132b, the beam received by the receiving module 23 cannot be filtered to purify the probe light L5. As a result, the accuracy of the photosensor 231 will be reduced by interference from ambient light (sunlight) and by interference from non-target probe light (905-940 nm) used by other lidar modules. Simultaneously, without using the first filter 131b, the ambient light or the non-target probe light will flow back into the light-emitting module 21, or even into the laser source 211, causing its temperature to become too high, resulting in the wavelength of the light source L1 being lower than 1550 nm, which will also indirectly affect the accuracy of the photosensor 231. (In other embodiments besides those described in this application) the first filter 131b and the second filter 132b can both be NBPFs.

[0101] Laser source 211 is used to emit light source light L1. Laser source 211 includes a light-emitting array composed of at least one laser, such as an array composed of edge-emitting lasers (EEL) or fiber lasers (FL) that meet range performance requirements. Accordingly, the light source light L1 includes light emitted by at least one laser in the light-emitting array. For clarity, the optical path transformation of only one beam of light emitted by one laser is shown in the figure.

[0102] The second collimating lens 212 is located in the optical path of the light source L1 and is used to collimate the light source L1 into parallel light L2. Because the laser emitted by the laser has strong divergence, it is often necessary to collimate the laser. Furthermore, because the power of a single laser is low, it is also necessary to collimate and recombine multiple lasers. In this embodiment, the second collimating lens 212 is an integrated fast and slow axis collimating lens. In optics, the direction of the light vector with a slower propagation speed in a waveplate is called the slow axis, and the direction of the light vector with a faster propagation speed in a waveplate is called the fast axis. The integrated fast and slow axis collimating lens can simultaneously collimate the fast and slow axes of the light source L1, thereby reducing the divergence of the beam on both the fast and slow axes, reducing the beam spot size, generating a symmetrical beam, and presenting a nearly circular far-field profile. The integrated fast and slow axis collimating lens includes only one lens, which further reduces the size compared to the separate collimating lenses in the prior art where the fast and slow axis collimating lenses are tightly combined. Furthermore, unlike the separate collimating lens that collimates the beam along both the fast and slow axes simultaneously, the integrated fast and slow axis collimating lens improves the beam's symmetry, effectively enhancing the uniformity of the light spot. Additionally, the first collimating lens 131a is also an integrated fast and slow axis collimating lens, located in the optical path of the reference light L4. It collimates the reference light L4, simultaneously colliding both its fast and slow axes, further reducing the light spot size to ensure the luminous effect of the light-emitting module 21 and eliminate the problem of excessively large light spots when the reference light L4 propagates over long distances. In this embodiment, the applicable distance for the reference light L4 is 200 meters.

[0103] The scanning module 213 is used to convert at least a portion of the parallel light L2 into reference light L4 for emission to the target Q. More specifically, the scanning module 213 includes an optical phased array chip 214, a quarter-wave plate 215, and a polarizing beam splitter 216. The optical phased array chip 214, the quarter-wave plate 215, and the polarizing beam splitter 216 are stacked vertically from bottom to top, meaning that the projections of these three components in the vertical direction (shown as the Z-axis direction in the figure) overlap. This vertical structure design reduces the size of the scanning module 213 and further shortens its response time. Meanwhile, the three optical components of the scanning module 213 can be fixed to each other by bonding with optical adhesive (not shown). The optical adhesive is a double-sided film made of a light-transmitting medium and matched to the optical components to be bonded, such as optically clear resin (OCR) and optically clear adhesive (OCA). Both OCR and OCA have the characteristics of high light transmittance.

[0104] In this embodiment, a polarizing beam splitter 216 is located in the optical path of the parallel light L2. The parallel light L2 includes a first laser L21 and a non-working light L22. The first laser L21 has a first polarization direction, and the non-working light L22 has a second polarization direction different from the first polarization direction. Since the polarizing beam splitter 216 can split the incident light into S-polarized light and P-polarized light, and reflect the S-polarized light while transmitting the P-polarized light, the polarizing beam splitter 216 is used to separate the first laser L21 and the non-working light L22 of the parallel light L2 and emit them in different directions, while guiding the first laser L21 to the quarter-wave plate 215. In this embodiment, the first laser L21 is S-polarized light, and the non-working light L22 is P-polarized light. (In other embodiments besides those described in this application,) the first laser L21 may be P-polarized light, and the non-working light L22 may be S-polarized light. Since the non-working light L22 does not participate in the formation of the reference light L4, the non-working light L22 can be recycled. To facilitate its differentiation from the first laser L21, the non-working light L22 is marked with a dashed line in the figure.

[0105] A quarter-wave plate 215 is located in the optical path of the first laser L21 and is used to transmit the first laser L21 from the polarizing beam splitter 216 to emit a second laser L3. The second laser L3 has a third polarization direction different from the first polarization direction and the second polarization direction. Specifically, when the first laser L21 is S-polarized light, the second laser L3 emitted after the quarter-wave plate 215 transmits the first laser L21 is circularly polarized light.

[0106] The optical phased array chip 214 is located in the optical path of the second laser L3, and is used to receive the second laser L3 from the quarter-wave plate 215 to emit reference light L4 to the target Q under test. Please refer to... Figure 3 The optical phased array chip 214 includes a grating surface 214a near the quarter-wave plate 215. Multiple grating units 214b arranged in an array are formed on the grating surface 214a. It should be noted that this application does not limit the specific structure and arrangement of the grating units 214b.

[0107] In this embodiment, the optical phased array chip 214 is a reflective optical phased array chip. When the optical phased array chip 214 is a reflective optical phased array chip, the grating unit 214b is a reflective grating. In this case, after the second laser L3 is guided to the grating surface 214a, the second laser L3 is refracted at the grating unit 214b and simultaneously reflected to generate the reference light L4. Specifically, the second laser L3 is reflected and then interferes, that is, it superimposes when overlapping in space to form the reference light L4. More specifically, the light emitted from all grating units 214b is the collection of the reference light L4 emitted along a certain direction. However, since the collection direction of the light emitted from the grating units 214b is different, that is, the direction of interference is different, the reference light L4 can be emitted in multiple directions. For ease of understanding, the figure only uses arrows to simply show the incident second laser L3 and the emitted reference light L4. Simultaneously, the quarter-wave plate 215 and the polarizing beam splitter 216 are also located in the optical path of the reference light L4. After being emitted, the reference light L4 passes through the quarter-wave plate 215 and the polarizing beam splitter 216 in sequence, and then propagates to the target Q in an emission direction different from that of the first laser L21 and the non-working light L22. After passing through the quarter-wave plate 215, the reference light L4 changes from circularly polarized light to P-polarized light.

[0108] The photosensor 231 is used to acquire distance information of the target Q based on the probe light L5. The second receiving mirror 233 is used to converge and guide the probe light L5 to the photosensor 231, and the second receiving mirror 233 is configured to surround the photosensor 231. Since the probe light L5 has already been received by the first receiving mirror 132a of the second functional layer 132, the second receiving mirror 233 is equivalent to further receiving the probe light L5 a second time. In this embodiment, the first receiving mirror 132a and the second receiving mirror 233 can be selected from lenses that meet the light receiving effect, such as aspherical lenses, Fresnel lenses, or freeform lenses. In addition, the photosensitive sensor 231 can convert the received optical signal (probe light L5) into an electrical signal, which can be used in ranging algorithms such as Time-of-Flight (TOF), Amplitude Modulated Continuous Wave (AMCW), and Frequency Modulated Continuous Wave (FMCW) to calculate and obtain the position information of the target Q.

[0109] The lidar module 100 also includes a built-in circuit board module 30, which is also housed within the cavity 114 of the package housing 10. This built-in circuit board module 30 is a small circuit board with a volume that meets the requirements for both storage space and conductivity. The built-in circuit board module 30 includes a first circuit board 31, a light source driver board 33, and a chip driver board 35.

[0110] When the first sidewall 111 is the top cover S1, the laser transceiver module 20 and the built-in circuit board module 30 are both located on the cavity surface M1 of the base S2. The first circuit board 31 and the light source driver board 33 are spaced apart and fixed to the surface of the temperature control layer 17 away from the base S2. A first wire G1 connects the first circuit board 31 and the light source driver board 33, enabling the first circuit board 31 to supply power to the light source driver board 33. The light-receiving module 23 is fixed to the surface of the first circuit board 31 away from the temperature control layer 17. A photosensor 231 is located on the surface of the temperature control layer 17, and a second light-receiving mirror 233 is located on the side of the photosensor 231 away from the temperature control layer 17. The laser source 211 is fixed to the surface of the light source driver board 33 away from the temperature control layer 17, and the light source driver board 33 drives the laser source 211 to emit light.

[0111] The chip driver board 35, the second collimating lens 212, and the scanning module 213 are fixed to the same surface at intervals from the temperature control layer 17, and the chip driver board 35 and the optical phased array chip 214 of the scanning module 213 are electrically connected through a second wire G2. The chip driver board 35 can output control voltages of different values ​​to change the physical optical properties of the grating unit 214b, thereby changing the emission direction of light at the grating unit 214b. For example, the control voltage is used to change the refractive index of the grating unit 214b. After the second laser L3 is refracted in all grating units 214b, the emission direction of the reference light L4 formed by reflection or transmission is affected by the refractive index and changes accordingly. In this embodiment, the chip driver board 35 is an application-specific integrated circuit (ASIC) chip.

[0112] The chip driver board 35 and the first pin 151 are electrically connected via the third wire G3, and the first circuit board 31 is electrically connected via the fourth wire G4. Pin 15 (first pin 151 and second pin 152) is also electrically connected to other external power supplies or soldered to a larger circuit board to power the first circuit board 31, the light source driver board 33, and the chip driver board 35, thereby powering the laser transceiver module 20. Pin 15 can be multi-layered ceramic sealed or coaxial cable sealed to meet high-speed signal interconnection requirements. In this embodiment, the first wire G1, the second wire G2, the third wire G3, and the fourth wire G4 are gold wires, which have good conductivity.

[0113] The temperature control layer 17 is used to cool the laser transceiver module 20. In this embodiment, the temperature control layer 17 is a thermoelectric cooler (TEC), which is a cooling technology capable of achieving the required cooling level and precision for optical components. Specifically, the temperature control layer 17 actively cools and controls the temperature of the first circuit board 31 and the light source driver board 33, which are in direct contact, thus preventing the temperature of the laser transceiver module 20 from becoming too high and maintaining the signal transmission efficiency and accuracy of the entire laser transceiver module 20. If the temperature is not controlled, the laser transceiver module 20 will become too hot, resulting in decreased signal transmission efficiency, changes in the wavelength of the laser, and the laser transceiver module 20 will not be able to operate normally.

[0114] Please see Figure 2 In the second embodiment, the first sidewall 111 of the lidar module 100 is a base S2, the temperature control layer 17 is located on the cavity surface M2, and the cavity surface M1 is disposed opposite to the temperature control layer 17. At this time, the first functional layer 131 and the second functional layer 132 are located on the first sidewall 111 and also on the base S2.

[0115] Please also see Figure 4 The optical phased array chip 214 is a transmissive optical phased array chip, and the grating unit 214b is a transmissive grating. When the second laser L3 is guided to the grating surface 214a, it is refracted at the grating unit 214b and simultaneously transmitted to form the reference light L4. Specifically, after transmission, the second laser L3 interferes, i.e., it superimposes when overlapping in space to form the reference light L4. After the optical phased array chip 214 emits the reference light L4, it directly passes through the first functional layer 131 and is emitted to the target Q under test.

[0116] Please continue to refer to this. Figure 2 When the first sidewall 111 is the base S2, some components of the laser transceiver module 20 and the built-in circuit board module 30 are located on the cavity surface M1 of the base S2, and some components are located on the cavity surface M2 of the upper cover S1. Specifically, the built-in circuit board module 30 also includes a second circuit board 32, which is located on the cavity surface M1 of the upper cover S1 and faces the first circuit board 31. The first circuit board 31 and the second circuit board 32 are electrically connected and bonded together by a conductive adhesive J. In addition to the aforementioned positional relationship, the light-receiving module 23 is located on the surface of the second circuit board 32 facing the temperature control layer 17, wherein the light sensor 231 is located on the surface of the temperature control layer 17, and the second light-receiving mirror 233 is located on the side of the light sensor 231 closer to the temperature control layer 17.

[0117] Apart from the differences described above compared to the first embodiment, the second embodiment also has the same technical features as the first embodiment.

[0118] The lidar module 100 provided in this application embodiment houses the laser transceiver module 20 within the cavity 114 of a highly reliable encapsulation housing 10, thereby reducing the maintenance cost of the lidar module 100 and facilitating modularity. In case of failure, the independent lidar module 100 can be directly replaced. The laser transceiver module 20 includes a light-emitting module 21 and a light-receiving module 23. The light-emitting module 21 emits reference light L4 to the target Q, and the light-receiving module 23 receives the detection light L5 reflected by the target Q based on the reference light L4, and obtains the distance information of the target Q based on the detection light L5. Simultaneously, the first collimating lens 131a and the first filter 131b of the first functional layer 131 of the encapsulation housing 10 cooperate with the second collimating lens 212 of the light-emitting module 21 to filter and purify the reference light L4 and perform double collimation, which helps to improve the detection range and scanning accuracy. Furthermore, the first light-receiving mirror 132a and the second filter 132b of the second functional layer 132 of the encapsulation housing 10 cooperate with the second light-receiving mirror 233 of the light-receiving module 23 to filter and purify the detection light L5 and perform secondary light collection, which is equivalent to collecting light at a larger angle and improving the detection angle. Based on the above-mentioned modular, highly reliable, and multifunctional encapsulation housing 10, the assembly process of the lidar module 100 is simplified, and it is beneficial to reduce the size and improve the integration effect. This effectively achieves the technical effect of automated detection, making maintenance more convenient and reducing maintenance costs.

[0119] This application also provides an autonomous driving vehicle. Please refer to... Figure 5 The autonomous vehicle 200 includes a lidar module 100 and a vehicle body 210. The lidar module 100 is fixed to the vehicle body 210 and is used to detect whether a target Q exists in the path of the vehicle body 210, and to acquire the distance information of the target Q when it is present. For example, the lidar module 100 can be mounted on structures such as the windshield, headlights, bumper, and front grille of the vehicle body 210 for automatic obstacle identification and avoidance during driving.

[0120] The autonomous vehicle 200 provided in this application embodiment uses a lidar module 100 fixed on the vehicle body 210 for scanning and ranging. It makes full use of the high reliability and low maintenance cost of the lidar module 100, which helps the autonomous vehicle 200 to better avoid obstacles in front of the vehicle while driving.

[0121] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A packaging housing, characterized in that, include: The tube shell includes a first sidewall, a second sidewall, and a sealed inner cavity. The first sidewall and the second sidewall surround the inner cavity. The first sidewall has a first light-transmitting hole and a second light-transmitting hole, which are spaced apart and penetrate the first sidewall. The second sidewall has a first through hole, which penetrates the second sidewall. A first functional layer is embedded in and fills the first light-transmitting hole. The first functional layer includes a first collimating lens and a first filter. The second functional layer is embedded in and fills the second light-transmitting hole. The second functional layer includes a first light-collecting mirror and a second filter. A first pin, passing through and filling the first through-hole, is used for electrical connection; and A temperature-controlled layer is housed within the inner cavity.

2. The packaging housing as described in claim 1, characterized in that, The first collimating lens is an integrated fast and slow axis collimating lens, used to collimate the fast and slow axes of the beam simultaneously.

3. The packaging housing as described in claim 1, characterized in that, The first filter is a low-pass filter, and the second filter is a narrowband filter; or, both the first filter and the second filter are narrowband filters.

4. The packaging housing as described in claim 1, characterized in that, The shell also includes a third sidewall, which is also used to surround the inner cavity, and the second sidewall is disposed opposite to the third sidewall; the third sidewall has a second through hole, which penetrates the third sidewall.

5. The packaging housing as described in claim 4, characterized in that, The package also includes a second pin for electrical connection, which passes through and fills the second through-hole.

6. A lidar module, characterized in that, include: The packaging housing as described in any one of claims 1-5; as well as A laser transceiver module, housed within the cavity of the encapsulation housing, the laser transceiver module comprising: A light-emitting module includes a laser source, a second collimating lens, and a scanning module. The laser source emits light, the second collimating lens collimates the light into parallel light, and the scanning module converts at least a portion of the parallel light into reference light for emission to a target. The target reflects the probe light based on the reference light. A light-receiving module includes a light sensor and a second light-receiving mirror. The light sensor is used to acquire the position information of the target under test based on the detection light. The second light-receiving mirror is used to converge and guide the detection light to the light sensor. The reference light is transmitted from the first functional layer to the target under test; the probe light is transmitted from the second functional layer to the second receiving mirror; the first pin is electrically connected to the laser transceiver module; and the temperature control layer is in contact with the laser transceiver module to cool it down.

7. The lidar module as described in claim 6, characterized in that, The second collimating lens is an integrated fast and slow axis collimating lens, used to simultaneously collimate the fast and slow axes of the light source.

8. The lidar module as described in claim 6, characterized in that, The scanning module includes: A polarizing beam splitter is located in the optical path of the parallel light and is used to split the parallel light into a first laser with a first polarization direction and a non-working light with a second polarization direction different from the first polarization direction, and to emit the first laser and the non-working light in different directions. A quarter-wave plate, located in the optical path of the first laser, is used to receive the first laser and emit a second laser, the second laser having a third polarization direction different from both the first and second polarization directions; and An optical phased array chip is located in the optical path of the second laser and is used to receive the second laser to emit the reference light.

9. The lidar module as described in claim 8, characterized in that, The optical phased array chip is either a reflective optical phased array chip or a transmissive optical phased array chip.

10. An autonomous vehicle, characterized in that, include: The lidar module as described in any one of claims 6-9; as well as The vehicle body, wherein the lidar module is located on the vehicle body.

Images