A lead bonding device suitable for aluminum substrates

Abstract

This invention relates to the field of aluminum substrate welding technology, and more particularly to a pin welding device suitable for aluminum substrates. The technical solution includes: a moving drive mechanism mounted on a worktable, a welding device mounted on the moving drive mechanism, multiple substrate placement mechanisms evenly distributed on the worktable, with the aluminum substrate positioned within each substrate placement mechanism during welding, a fume extraction device mounted on the worktable, and a control device also mounted on the worktable. The moving drive mechanism and the welding device are linearly connected to the control device, which pre-inputs the position coordinates of the multiple substrate placement mechanisms. This invention increases the number of aluminum substrates that can be welded simultaneously, thus improving efficiency compared to traditional equipment. Furthermore, the fumes generated during welding are absorbed through the suction port by activating a suction fan, preventing harm to workers.

Description

Technical Field

[0001] This invention relates to the field of aluminum substrate welding technology, and more particularly to a pin welding device suitable for aluminum substrates. Background Technology

[0002] Aluminum-based copper-clad laminates are metal-based boards with good heat dissipation. A typical single-sided board consists of three layers: a circuit layer (copper foil), an insulating layer, and a metal base layer. Aluminum-based boards are commonly used for mounting electronic components. When mounting electronic components on aluminum-based boards, soldering is required, and current methods generally involve manual soldering.

[0003] The document with publication number CN210351826U points out that by using a second slider and bolts on the movable seat, the movable seat can be moved and adjusted on the base. The fixture on the movable seat is equipped with a movable clamping plate and a fixed clamping plate, and the clamp can be adjusted by a screw, so that the clamp can adapt to aluminum substrates of various sizes. Furthermore, a first motor is installed inside the base to move the support through three sets of gears, so that the device can move on the X, Y and Z axes to perform pin welding on the aluminum substrate. This solves the problems of low efficiency of manual welding and the simple structure of existing welding equipment, which cannot adjust the installation of aluminum substrates.

[0004] The document with publication number CN107414399A points out that it has multiple LED aluminum substrate slots on the positioning plate, and connecting slots between adjacent LED aluminum substrate slots. Side slots are provided next to the LED aluminum substrate slots on the upper edge of the positioning plate. On the one hand, it realizes the welding positioning of LED aluminum substrates, ensuring the stability and quality of welding. On the other hand, it realizes the welding positioning of LED aluminum substrates of different thicknesses, avoiding the use of multiple positioning devices.

[0005] The document with publication number CN110919261A indicates that a sliding groove is provided on the top left and right sides of the worktable. A slider is movably installed inside the sliding groove and extends through the worktable to the top of the worktable. A lead screw is movably installed on the top of the left and right sides of the worktable, passing through the worktable and the slider and movably connected to the sliding groove. This positioning mechanism for hot aluminum substrate processing and welding can limit the aluminum substrate to be welded from the top, left and right sides and the rear side, so as to avoid the aluminum substrate from becoming loose or unstable, and can ensure the stability of aluminum substrate welding, avoiding uneven welding or misalignment.

[0006] Based on the aforementioned documents and existing welding equipment on the market, the following problems still exist: 1. In actual use, as shown in document CN109752384A, although it can replace manual welding, it can only weld a single aluminum substrate at a time. This requires consideration of the time spent on installing and removing the aluminum substrate, resulting in low efficiency. Furthermore, documents CN107414399A and CN110919261A only address the fixation of a single aluminum substrate and do not consider the issue of fixing multiple aluminum substrates simultaneously when a large number of operations are required. Therefore, based on the above, it can be seen that improving work efficiency is not just about replacing manual labor with machinery, but also about maximizing time utilization. This requires welding multiple aluminum substrates simultaneously. Thus, it can be pointed out that the existing equipment cannot effectively perform welding operations on multiple aluminum substrates simultaneously to improve welding efficiency.

[0007] 2. Furthermore, during the lead soldering process on the aluminum substrate, solder fumes are generated, which can be harmful to workers if inhaled. Summary of the Invention

[0008] The purpose of this invention is to address the problems existing in the prior art by proposing a pin bonding device suitable for aluminum substrates.

[0009] The technical solution of the present invention: a lead welding device suitable for aluminum substrates, including a worktable, a moving drive mechanism mounted on the worktable, a welding device mounted on the moving drive mechanism, a plurality of substrate placement mechanisms evenly distributed on the worktable, the aluminum substrate being placed within the substrate placement mechanism during welding, a fumigation mechanism mounted on the worktable, the fumigation mechanism including a suction pipe disposed next to the substrate placement mechanism, and a suction port located on the side of the substrate placement mechanism on the suction pipe;

[0010] A control device is also installed on the workbench. The moving drive mechanism and the welding device are both linearly connected to the control device. The control device inputs the position coordinates of multiple substrate placement mechanisms in advance.

[0011] Preferably, the moving drive mechanism includes a support arm, a first electric slide rail, a second electric slide rail, and a third electric slide rail. The support arm is fixedly mounted on the worktable, the first electric slide rail is mounted between the support arms, the second electric slide rail is slidably mounted on the first electric slide rail, and the third electric slide rail is mounted on the first electric slide rail.

[0012] Preferably, a mounting platform is slidably mounted on the second electric slide rail, a third electric slide rail is fixedly mounted on one side of the mounting platform, a movable seat is slidably mounted on the third electric slide rail, the welding device includes a welding box and a solder injection nozzle, the welding box is fixedly mounted on the mounting platform, the solder injection nozzle is mounted on the movable seat, a guide tube is provided between the welding box and the solder injection nozzle, and the output end of the solder injection nozzle faces the substrate placement mechanism.

[0013] Preferably, the substrate placement mechanism includes an operating chamber located on the workbench, a heating plate installed in the operating chamber, aluminum substrates located on the heating plate, each aluminum substrate placed on each heating plate at the same angle, and multiple aluminum substrates of the same type welded each time. The heating plate has arc-shaped moving openings on both sides, and movable fixing components are provided in the arc-shaped moving openings. The substrate placement mechanism also includes a mounting base below the heating plate, and arc-shaped moving grooves corresponding to the arc-shaped moving openings are opened on both sides of the mounting base. The fixing components are slidably installed in the arc-shaped moving grooves. The substrate placement mechanism also includes an electric push rod for pushing the fixing components to move.

[0014] Preferably, the fixing component includes a bottom slider slidably mounted in the arc-shaped moving groove, a connecting rod that passes through the arc-shaped moving opening is mounted on the bottom slider, and a pressing stabilizing plate is rotatably mounted on the top of the connecting rod.

[0015] Preferably, the substrate mounting mechanism further includes a housing, which is located below the worktable. The electric push rod is installed inside the housing, and at least two electric push rods are provided inside the housing. A connecting plate is installed between the pushing ends of the two electric push rods, and multiple mounting seats in the same row are installed on the connecting plate.

[0016] Preferably, the suction pipe is fixed and connected to the air inlet of the suction fan, the suction fan has multiple suction ports, the suction fan also has an exhaust port, and the exhaust port is connected to an external filter device.

[0017] Preferably, the smoking mechanism further includes an insulated enclosure, which is fastened to the base plate mounting mechanism and has a connecting pipe fixed thereon, which is inserted into the air intake.

[0018] Compared with existing technologies, the beneficial effects of this invention are:

[0019] 1. The present invention, through the setting of the moving drive mechanism, enables movement along the three axes of XYZ via the first electric slide rail, the second electric slide rail and the third electric slide rail, thereby forming omnidirectional movement. By inputting the coordinate information of multiple substrate placement mechanisms through the control device, the welding device can be driven to perform welding operations on the aluminum substrates in each substrate placement mechanism in sequence. As a result, the number of aluminum substrates welded at the same time is increased, thereby bringing about an improvement in efficiency compared to traditional equipment.

[0020] 2. This invention, through the setting of a fixing component, allows for the placement of the aluminum substrate on the heating plate during welding. Because the pin positions on different aluminum substrates vary, the fixing component needs to be moved to find a position that avoids the pins. Once the fixing component is moved to find a position that avoids the pins, the electric push rod can be activated to lower the mounting base, thereby lowering the entire fixing component. This rotates the pressing and stabilizing plates above the aluminum substrate to avoid the pins. When the entire fixing component is lowered, the pressing and stabilizing plates on both sides will press and fix the aluminum substrate, thus facilitating the fixing of aluminum substrates of different shapes. This allows multiple aluminum substrates to be fixed simultaneously, thereby improving efficiency.

[0021] 3. This invention utilizes a fume extraction mechanism to draw in fumes generated during welding by activating a suction fan. The fumes are absorbed through the suction port, preventing harm to workers. When an insulated enclosure is attached to the substrate mounting mechanism, the fumes are prevented from spreading, improving the absorption rate. Furthermore, because welding aluminum substrates requires specific temperature control due to their rapid heat dissipation, the insulated enclosure provides effective insulation. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a lead bonding device for aluminum substrates proposed in this invention;

[0023] Figure 2 This is a schematic diagram of the structure of a moving drive mechanism for a pin bonding device suitable for aluminum substrates, as proposed in this invention.

[0024] Figure 3 This is a schematic diagram of the fumigation mechanism of a lead bonding device for aluminum substrates proposed in this invention;

[0025] Figure 4 This is a schematic diagram of a substrate mounting mechanism for a pin bonding device suitable for aluminum substrates, as proposed in this invention.

[0026] Figure 5 This is a schematic diagram of the structure of a pin bonding equipment fixing assembly suitable for aluminum substrates proposed in this invention;

[0027] Figure 6 This is a schematic diagram of a lead bonding equipment mounting base suitable for aluminum substrates proposed in this invention;

[0028] Figure 7 This is a schematic diagram of the installation structure of an insulation enclosure for a pin welding equipment suitable for aluminum substrates, as proposed in this invention.

[0029] Reference numerals: 1. Workbench; 2. Moving drive mechanism; 3. Substrate placement mechanism; 4. Smoke extraction mechanism; 5. Control device; 6. Welding device; 21. Support arm; 22. First electric slide rail; 23. Second electric slide rail; 24. Mounting platform; 25. Third electric slide rail; 26. Moving seat; 31. Operating room; 32. Heating plate; 33. Fixing component; 34. Arc-shaped moving port; 35. Mounting seat; 36. Arc-shaped moving groove; 37. Connecting plate; 38. Electric push rod; 39. Outer casing; 331. Bottom slider; 332. Connecting rod; 333. Pressing stabilizing plate; 41. Fan; 42. Suction pipe; 43. Suction outlet; 44. Exhaust outlet; 45. Insulation enclosure; 46. Connecting pipe; 61. Welding box; 62. Soldering nozzle; 63. Material guide pipe. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0031] Example 1

[0032] See attached document Figure 1 and 2A pin-welding device for aluminum substrates includes a worktable 1, a moving drive mechanism 2 mounted on the worktable 1, a welding device 6 mounted on the moving drive mechanism 2, and multiple substrate placement mechanisms 3 evenly distributed on the worktable 1. The aluminum substrate is placed within the substrate placement mechanism 3 during welding. The moving drive mechanism 2 includes support arms 21, a first electric slide rail 22, a second electric slide rail 23, and a third electric slide rail 25. The support arms 21 are fixedly mounted on the worktable 1, the first electric slide rail 22 is installed between the support arms 21, the second electric slide rail 23 is slidably mounted on the first electric slide rail 22, and the third electric slide rail 25 is mounted on the first electric slide rail 22. Movement along the XYZ axes is achieved through the first electric slide rail 22, the second electric slide rail 23, and the third electric slide rail 25. The system achieves omnidirectional movement. By inputting coordinate information from multiple substrate placement mechanisms 3 via the control device 5, the welding device 6 can sequentially perform welding operations on the aluminum substrates within each substrate placement mechanism 3. This increases the number of aluminum substrates that can be welded simultaneously, resulting in improved efficiency compared to traditional equipment. A mounting platform 24 is slidably mounted on the second electric slide rail 23. A third electric slide rail 25 is fixedly mounted on one side of the mounting platform 24, and a movable seat 26 is slidably mounted on the third electric slide rail 25. The welding device 6 includes a welding box 61 and a solder injection nozzle 62. The welding box 61 is fixedly mounted on the mounting platform 24, and the solder injection nozzle 62 is mounted on the movable seat 26. A guide tube 63 is provided between the welding box 61 and the solder injection nozzle 62. The output end of the solder injection nozzle 62 faces the substrate placement mechanism 3. Figure 2 As shown in the diagram, only a small portion of the length of the feed tube 63 is shown in this schematic diagram. In actual applications, its length is sufficient to allow the normal movement of the soldering nozzle 62. Both the solder box 61 and the soldering nozzle 62 are applications of existing technology, so they will not be described in detail. It should be noted that in this embodiment, the solder box 61 is the HX-CXH solder box from Shenzhen Haoxin Technology Co., Ltd., and the length of the feed tube 63 is increased.

[0033] Example 2

[0034] See attached document Figure 1-6Based on Embodiment 1, the substrate placement mechanism 3 includes an operating chamber 31 on the workbench 1. A heating plate 32 is installed inside the operating chamber 31, and aluminum substrates are placed on the heating plate 32. Each aluminum substrate is placed on each heating plate 32 at the same angle, and the multiple aluminum substrates welded each time are of the same type. This is to facilitate subsequent fixation by the fixing component 33 and to facilitate welding operations by the welding device 6. Arc-shaped moving openings 34 are provided on both sides of the heating plate 32, and movable fixing components 33 are provided in the arc-shaped moving openings 34. The substrate placement mechanism 3 also includes a mounting base 35 below the heating plate 32. Arc-shaped moving openings 35 are provided on both sides of the mounting base 35. The fixed assembly 33 is slidably installed in the arc-shaped moving groove 36 corresponding to the arc-shaped moving opening 34. The substrate placement mechanism 3 also includes an electric push rod 38 for pushing the fixed assembly 33 to move. The fixed assembly 33 includes a bottom slider 331 slidably installed in the arc-shaped moving groove 36. A connecting rod 332 passing through the arc-shaped moving opening 34 is installed on the bottom slider 331. A pressing stabilizing piece 333 is rotatably installed on the top of the connecting rod 332. Thus, during aluminum substrate welding, after placing it on the heating plate 32, because the pin positions on different aluminum substrates are different, the fixed assembly 33 needs to be moved to find a position that avoids the pins. Figure 4As shown, A and B represent two common aluminum substrate shapes on the market. A is circular, with its pins typically located on its outer ring; B is square, with its pins typically located at its four corners. Once the moving fixing component 33 finds a position that avoids the pins, the electric push rod 38 can be activated to lower the mounting base 35, causing the fixing component 33 to descend as a whole. This rotates the pressing stabilizing plate 333 above the aluminum substrate, away from the pins. When the fixing component 33 descends as a whole, the pressing stabilizing plates 333 on both sides will press and fix the aluminum substrate, facilitating the fixing of aluminum substrates of different shapes. Furthermore, because the pressing stabilizing plate 333 can rotate, rotating it outside the aluminum substrate will not obstruct its removal. It should be noted that when using the fixing component 33, the two fixing components 33 should be distributed... The aluminum substrates are positioned so that their two sides correspond to each other, which improves stability. Furthermore, when placing aluminum substrates in each substrate placement mechanism 3, their positions are identical, facilitating simultaneous fixing and welding operations of the welding device 6. The substrate placement mechanism 3 also includes a housing 39 located below the worktable 1. Electric push rods 38 are installed inside the housing 39, which contains at least two electric push rods 38. A connecting plate 37 is installed between the pushing ends of the two electric push rods 38. Multiple mounting seats 35 in the same row are mounted on the connecting plate 37. With this arrangement, after placing aluminum substrates on the heating plates 32 in the same row and adjusting the position of the fixing components 33, the electric push rods 38 can be activated to simultaneously lower multiple mounting seats 35 in the same row, thereby fixing multiple aluminum substrates simultaneously and improving efficiency.

[0035] Example 3

[0036] Based on the above embodiments one or two, a fumigation mechanism 4 is installed on the workbench 1. The fumigation mechanism 4 includes a suction pipe 42 disposed next to the substrate mounting mechanism 3. The suction pipe 42 has a suction port 43 located on the side of the substrate mounting mechanism 3. The suction pipe 42 is fixed and connected to the air inlet of a suction fan 41. The suction fan 41 has multiple suction ports 43 and an exhaust port 44 connected to an external filter device. The fumigation mechanism 4 also includes an insulation enclosure 45, which is fastened to the substrate mounting mechanism 3. A connecting pipe 46 is fixed to the insulation enclosure 45 and inserted into the suction port 43. Figure 3 and 7As shown, by activating the suction fan 41 to generate suction, the fumes are absorbed through the suction port 43, thus preventing the fumes from harming the workers. When the heat insulation barrier 45 is fastened to the substrate mounting mechanism 3, it prevents the fumes from spreading and improves the fumes absorption rate. Furthermore, since the aluminum substrate has certain temperature requirements during welding operations due to its rapid heat dissipation, it is necessary to effectively control the welding temperature. The installation of the heat insulation barrier 45 can provide a certain degree of heat preservation. In this embodiment, there are two suction fans 41, and the same suction port 43 is installed between the air inlets of the two suction fans 41. Increasing the number of suction fans 41 is to improve the smoke extraction effect.

[0037] The working principle of a lead soldering device suitable for aluminum substrates is as follows: When soldering aluminum substrates, multiple aluminum substrates are first manually placed into each substrate placement mechanism 3. It should be noted that multiple aluminum substrates are of the same type. The aluminum substrates are placed on the heating plate 32, and each aluminum substrate is placed at the same angle.

[0038] After the aluminum substrate is placed and fixed, observe the shape of the aluminum substrate to find the position that avoids the pins, and then move the connecting rod 332 so that the bottom slider 331 slides in the arc-shaped moving groove 36. This can move the pressing stabilizing piece 333 to the position of the aluminum substrate that avoids the pins. The fixed components 33 on both sides should correspond to each other after they are moved. Then, the arc-shaped moving groove 36 is activated by the control device 5 so that the telescopic end of the arc-shaped moving groove 36 is lowered, thereby driving the connecting plate 37 to fall down. This will cause the fixed components 33 to fall down as a whole, so that the pressing stabilizing piece 333 will press on the aluminum substrate. Thus, the pressing stabilizing piece 333 on both sides will stabilize the aluminum substrate.

[0039] After the aluminum substrate is stabilized, the insulation enclosure 45 is installed, and the connecting pipe 46 of the insulation enclosure 45 is inserted into the air intake 43, so that the insulation enclosure 45 surrounds the substrate placement mechanism 3.

[0040] After the insulation enclosure 45 is installed, the moving drive mechanism 2 is started by the control device 5. The control device 5 has the coordinate information of each substrate placement mechanism 3. Then, the first electric slide rail 22 will drive the second electric slide rail 23 to move. The second electric slide rail 23 will drive the soldering box 61 and the third electric slide rail 25 to move through the mounting table 24. The third electric slide rail 25 will drive the solder injection nozzle 62 to move up and down, thus forming the movement of the XYZ three axes. Then, the welding device 6 can be started to perform welding. During welding, the moving drive mechanism 2 will insert the solder injection nozzle 62 into the substrate placement mechanism 3, so that the aluminum substrate on the heating plate 32 can be welded. After the aluminum substrate in one substrate placement mechanism 3 is welded, the moving drive mechanism 2 will move sequentially according to the input coordinate information of multiple substrate placement mechanisms 3, so as to gradually complete the welding operation of the aluminum substrate in all substrate placement mechanisms 3.

[0041] During welding, the suction fan 41 is activated to generate suction. The suction will absorb the fumes in the substrate placement mechanism 3 through the suction pipe 42. After all aluminum substrates have been welded, the heat insulation barrier 45 is removed, and the pressing and stabilizing plate 333 is rotated to the side away from the aluminum substrate. The aluminum substrates on the heating plate 32 can then be removed manually, thus completing the operation.

[0042] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A pin bonding apparatus suitable for aluminum substrates, comprising a worktable (1), characterized in that: The workbench (1) is equipped with a moving drive mechanism (2), the moving drive mechanism (2) is equipped with a welding device (6), the workbench (1) is provided with a plurality of substrate placement mechanisms (3) distributed at equal intervals, the aluminum substrate is located in the substrate placement mechanism (3) during welding, the workbench (1) is equipped with a fumigation mechanism (4), the fumigation mechanism (4) includes a suction pipe (42) provided next to the substrate placement mechanism (3), the suction pipe (42) is provided with a suction port (43) located on the side of the substrate placement mechanism (3). The workbench (1) is also equipped with a control device (5). The moving drive mechanism (2) and the welding device (6) are both linearly connected to the control device (5). The control device (5) inputs the position coordinates of multiple substrate placement mechanisms (3) in advance. The substrate placement mechanism (3) includes an operating chamber (31) opened on the workbench (1), a heating plate (32) is installed in the operating chamber (31), an aluminum substrate is located on the heating plate (32), each aluminum substrate is placed on each heating plate (32) at the same angle, and the multiple aluminum substrates welded each time are of the same type. The heating plate (32) is provided with arc-shaped moving openings (34) on both sides, and a movable fixing component (33) is provided in the arc-shaped moving openings (34). The substrate placement mechanism (3) also includes a mounting base (35) below the heating plate (32), and arc-shaped moving grooves (36) corresponding to the arc-shaped moving openings (34) are opened on both sides of the mounting base (35). The fixing component (33) is slidably installed in the arc-shaped moving grooves (36). The substrate placement mechanism (3) also includes an electric push rod (38) for pushing the fixing component (33) to move. The fixing component (33) includes a bottom slider (331) that is slidably installed in the arc-shaped moving groove (36), a connecting rod (332) that passes through the arc-shaped moving opening (34) is installed on the bottom slider (331), and a pressing stabilizer (333) is rotatably installed on the top of the connecting rod (332). The suction pipe (42) is fixed and connected to the air inlet of the suction fan (41). The suction fan (41) has multiple suction ports (43) and an exhaust port (44) connected to an external filter device. The smoking mechanism (4) also includes an insulated enclosure (45), which is fastened to the substrate mounting mechanism (3). The insulated enclosure (45) is fixed with a connecting pipe (46), which is inserted into the air intake (43).

2. The pin bonding equipment suitable for aluminum substrates according to claim 1, characterized in that, The moving drive mechanism (2) includes a support arm (21), a first electric slide rail (22), a second electric slide rail (23), and a third electric slide rail (25). The support arm (21) is fixedly installed on the workbench (1). The first electric slide rail (22) is installed between the support arms (21). The second electric slide rail (23) is slidably installed on the first electric slide rail (22). The third electric slide rail (25) is installed on the first electric slide rail (22).

3. The pin bonding equipment suitable for aluminum substrates according to claim 2, characterized in that, A mounting platform (24) is slidably mounted on the second electric slide rail (23). A third electric slide rail (25) is fixedly mounted on one side of the mounting platform (24). A movable seat (26) is slidably mounted on the third electric slide rail (25). The welding device (6) includes a welding box (61) and a solder injection nozzle (62). The welding box (61) is fixedly mounted on the mounting platform (24). The solder injection nozzle (62) is mounted on the movable seat (26). A guide tube (63) is provided between the welding box (61) and the solder injection nozzle (62). The output end of the solder injection nozzle (62) faces the substrate placement mechanism (3).

4. The pin bonding equipment suitable for aluminum substrates according to claim 1, characterized in that, The substrate mounting mechanism (3) also includes a housing (39), which is located below the workbench (1). The electric push rod (38) is installed inside the housing (39). At least two electric push rods (38) are provided inside the housing (39). A connecting plate (37) is installed between the pushing ends of the two electric push rods (38). Multiple mounting seats (35) in the same row are installed on the connecting plate (37).

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