A high temperature testing device and method for PCS

Abstract

The present invention provides a high temperature test device and method for PCS in the technical field of energy storage converters. The device includes a microcontroller, an AD sampling circuit, a temperature measurement module, a PWM drive circuit, a heat dissipation module, a display screen, a communication module and a host computer; the temperature measurement module includes several temperature measurement circuits; the heat dissipation module includes several heat dissipation fans; the microcontroller is respectively connected to the AD sampling circuit, the PWM drive circuit, the display screen and the communication module; the host computer is connected to the communication module; the temperature measurement circuit is connected to the AD sampling circuit; the heat dissipation fan is connected to the PWM drive circuit. The advantages of the present invention are: the safety of the high temperature aging test of PCS is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of energy storage converters, and in particular to a high temperature testing device and method for PCS. Background Art

[0002] PCS (Power Conversion System, energy storage converter) is used to control the charging and discharging process of the battery to perform AC / DC conversion, and can directly supply power to AC loads when there is no power grid. PCS needs to be adjusted when operating at high temperatures. In order to ensure the safe operation of PCS, high-temperature aging tests must be performed on PCS, and high-temperature aging tests require temperature testing to ensure safety.

[0003] Traditionally, the temperature test during the high-temperature aging test of PCS is simply a random sampling test through a temperature sensor to determine whether the temperature of the PCS is too high. It is impossible to conduct a real-time and comprehensive test on the temperature of the PCS, and it is impossible to intuitively reflect the temperature change curve. In addition, manual judgment and decision on whether to start the fan for heat dissipation are required, which has a lag and causes certain safety hazards in the high-temperature aging test.

[0004] Therefore, how to provide a high-temperature testing device and method for PCS to improve the safety of PCS high-temperature aging testing has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a high temperature testing device and method for PCS, so as to improve the safety of high temperature aging test of PCS.

[0006] In a first aspect, the present invention provides a high temperature test device for PCS, comprising a microcontroller, an AD sampling circuit, a temperature measurement module, a PWM drive circuit, a heat dissipation module, a display screen, a communication module and a host computer;

[0007] The temperature measurement module includes a plurality of temperature measurement circuits; the heat dissipation module includes a plurality of heat dissipation fans;

[0008] The microcontroller is connected to the AD sampling circuit, the PWM driving circuit, the display screen and the communication module respectively; the host computer is connected to the communication module; the temperature measurement circuit is connected to the AD sampling circuit; and the heat dissipation fan is connected to the PWM driving circuit.

[0009] Further, the PWM driving circuit includes a transistor Q1, a diode D1, a resistor RA, a resistor RB and a resistor RC;

[0010] The b-pole of the transistor Q1 is connected to the resistor RB and the resistor RC, the e-pole is connected to the resistor RC and the input end of the diode D1 and is grounded, and the c-pole is connected to the resistor RA and the output end of the diode D1;

[0011] The resistor RA is connected to the heat dissipation fan; the resistor RB is connected to the microcontroller.

[0012] Furthermore, the transistor Q1 is of NPN type.

[0013] Further, the temperature measurement circuit includes an operational amplifier OP, a temperature sensor Rpt, a resistor RL1, a resistor RL2, a resistor RL3, a resistor R11, a resistor R12, a resistor R21, a resistor R22, a resistor R3, a resistor R41 and a resistor R42;

[0014] Pin 1 of the operational amplifier OP is connected to resistors R21 and R41, pin 2 is connected to resistors R22 and R42, and pin 3 is connected to resistor R41 and an AD sampling circuit; one end of the temperature sensor Rpt is connected to resistor RL1, and the other end is connected to resistors RL2 and RL3; resistors RL2 and R42 are both grounded;

[0015] One end of the resistor R3 is connected to the resistor RL3 , and the other end is connected to the resistor R12 and the resistor R22 ; one end of the resistor R11 is connected to the resistor R12 , and the other end is connected to the resistor RL1 and the resistor R21 .

[0016] Furthermore, the model of the temperature sensor Rpt is PT100.

[0017] Furthermore, the resistance values ​​of the resistors R21 , R22 , R41 and R42 are all greater than the resistance values ​​of the temperature sensor Rpt and the resistor R3 .

[0018] Furthermore, the display screen is a touch display screen.

[0019] Furthermore, the communication module is at least one of a 2G communication module, a 3G communication module, a 4G communication module, a 5G communication module, a NB-IOT communication module, a LORA communication module, a WIFI communication module, a Bluetooth communication module, a ZigBee communication module or a wired communication module.

[0020] In a second aspect, the present invention provides a high temperature testing method for PCS, comprising the following steps:

[0021] Step S10, the microcontroller obtains the temperature range of the PCS high temperature aging test through the display screen;

[0022] Step S20, arranging each temperature measuring circuit at different points of the PCS, and the microcontroller collects the temperature value measured by the temperature measuring circuit in real time through the AD sampling circuit;

[0023] Arrange S30, the microcontroller displays the temperature value on the display screen, sends it to the host computer through the wireless communication module, and drives the PWM drive circuit to change the duty cycle based on the temperature value to adjust the speed of the cooling fan, so as to make the temperature of the PCS within the temperature range.

[0024] Furthermore, in step S20, the temperature value is calculated as follows:

[0025] Temp = 1 / K*(Rpt-100);

[0026] ΔU / Uref+R3 / (R3+R1)=Rpt / (Rpt+R1);

[0027] Rpt≈ΔU*R1 / Uref+R3*R1 / (R3+R1);

[0028] ΔU=U1-U2;

[0029] U1=(Rpt+2RL)*Uref / (Rpt+2RL+R1);

[0030] U2=(R3+2RL)*Uref / (R3+2RL+R1);

[0031] R1=(R11+R12) / 2;

[0032] RL=(RL1+RL2+RL3) / 3;

[0033] Wherein, Temp represents the tested temperature value; K represents the temperature coefficient of the temperature sensor Rpt; and Uref represents the reference voltage.

[0034] The advantages of the present invention are:

[0035] A temperature measurement module including several temperature measurement circuits is set up to perform multi-point real-time temperature measurement on the PCS, and the measured temperature values ​​are transmitted to the microcontroller through the AD sampling circuit. A heat dissipation module including several heat dissipation fans is set up to be connected to the microcontroller through the PWM drive circuit. The microcontroller can drive the PWM drive circuit to change the duty cycle to adjust the speed of the heat dissipation fan according to the received temperature value, so as to make the temperature of the PCS within the set temperature range. The microcontroller can display the temperature value change curve in real time through the display screen, and send the temperature value to the host computer through the wireless communication module for remote monitoring, so as to realize real-time and comprehensive testing and intuitive display of the temperature of the PCS, and automatically control the heat dissipation fan for heat dissipation, thereby greatly improving the safety of the high-temperature aging test of the PCS. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The present invention will be further described below in conjunction with embodiments with reference to the accompanying drawings.

[0037] Figure 1 The invention discloses a circuit principle block diagram of a high temperature testing device for PCS.

[0038] Figure 2 It is a circuit diagram of the PWM drive circuit of the present invention.

[0039] Figure 3 It is a circuit diagram of the temperature measuring circuit of the present invention.

[0040] Figure 4 It is a simplified bridge schematic diagram of the temperature measurement circuit of the present invention.

[0041] Figure 5 It is a flow chart of a high temperature testing method for PCS of the present invention.

[0042] Figure 6 It is a schematic diagram of the simulation test of the present invention. DETAILED DESCRIPTION

[0043] The technical solution in the embodiments of the present application has the following overall idea: a temperature measurement module including several temperature measurement circuits is set to measure the temperature of the PCS in real time at multiple points and transmit the temperature value to a microcontroller, a heat dissipation module including several heat dissipation fans is set to be connected to the microcontroller through a PWM drive circuit, and the microcontroller can drive the PWM drive circuit to change the duty cycle to adjust the speed of the heat dissipation fan through the received temperature value, so as to realize real-time and comprehensive testing and intuitive display of the temperature of the PCS, and automatically control the heat dissipation fan to dissipate heat, thereby improving the safety of the high-temperature aging test of the PCS.

[0044] Please refer to Figures 1 to 6As shown, a preferred embodiment of a high temperature test device for PCS of the present invention comprises a microcontroller, an AD sampling circuit, a temperature measurement module, a PWM drive circuit, a heat dissipation module, a display screen, a communication module and a host computer; the microcontroller, namely MCU, is used to control the work of the high temperature test device. In specific implementation, it is sufficient to select an MCU that can realize this function from the prior art, and it is not limited to any model, such as the MCU of the STM32F103 series of ST company, and the control program is well known to those skilled in the art, which can be obtained by those skilled in the art without creative labor; the AD sampling circuit is used to convert the analog signal of the temperature measurement module into a digital signal; the PWM drive circuit is used to adjust the rotation speed of the heat dissipation module; the heat dissipation module is used for heat dissipation of PCS; the display screen is used to control the high temperature test device and display the temperature value of the test; the communication module is used for communication between the microcontroller and the host computer; the host computer is used to remotely control the high temperature test device;

[0045] The temperature measurement module includes a plurality of temperature measurement circuits; the heat dissipation module includes a plurality of heat dissipation fans;

[0046] The microcontroller is connected to the AD sampling circuit, the PWM driving circuit, the display screen and the communication module respectively; the host computer is connected to the communication module; the temperature measurement circuit is connected to the AD sampling circuit; and the heat dissipation fan is connected to the PWM driving circuit.

[0047] The PWM drive circuit includes a transistor Q1, a diode D1, a resistor RA, a resistor RB and a resistor RC; the resistor RA and the resistor RB are used to limit the current of the transistor Q1; the resistor RC is used to protect the transistor Q1; the diode D1 is used to prevent the output voltage from overvoltage;

[0048] The b-pole of the transistor Q1 is connected to the resistor RB and the resistor RC, the e-pole is connected to the resistor RC and the input end of the diode D1 and is grounded, and the c-pole is connected to the resistor RA and the output end of the diode D1;

[0049] The resistor RA is connected to the heat dissipation fan; the resistor RB is connected to the microcontroller.

[0050] The transistor Q1 is of NPN type.

[0051] The temperature measurement circuit includes an operational amplifier OP, a temperature sensor Rpt, a resistor RL1, a resistor RL2, a resistor RL3, a resistor R11, a resistor R12, a resistor R21, a resistor R22, a resistor R3, a resistor R41 and a resistor R42; the resistors R11, R12, R3 and the temperature sensor Rpt form a bridge for measuring the resistance value of the temperature sensor Rpt; the resistors RL1, RL2 and RL3 are all line resistors; the resistors R21, R22, R41 and R42 are matching resistors of the operational amplifier OP;

[0052] Pin 1 of the operational amplifier OP is connected to resistors R21 and R41, pin 2 is connected to resistors R22 and R42, and pin 3 is connected to resistor R41 and an AD sampling circuit; one end of the temperature sensor Rpt is connected to resistor RL1, and the other end is connected to resistors RL2 and RL3; resistors RL2 and R42 are both grounded;

[0053] One end of the resistor R3 is connected to the resistor RL3 , and the other end is connected to the resistor R12 and the resistor R22 ; one end of the resistor R11 is connected to the resistor R12 , and the other end is connected to the resistor RL1 and the resistor R21 .

[0054] The model of the temperature sensor Rpt is PT100, that is, a resistance temperature sensor.

[0055] The resistance values ​​of the resistors R21 , R22 , R41 and R42 are much greater than the resistance values ​​of the temperature sensor Rpt and the resistor R3 , and their influence can be ignored when calculating the temperature value.

[0056] The display screen is a touch display screen.

[0057] The communication module is at least one of a 2G communication module, a 3G communication module, a 4G communication module, a 5G communication module, a NB-IOT communication module, a LORA communication module, a WIFI communication module, a Bluetooth communication module, a ZigBee communication module or a wired communication module.

[0058] A preferred embodiment of a high temperature testing method for PCS of the present invention comprises the following steps:

[0059] Step S10, the microcontroller obtains the temperature range of the PCS high temperature aging test through the display screen;

[0060] Step S20, arranging each temperature measuring circuit at different points of the PCS, and the microcontroller collects the temperature value measured by the temperature measuring circuit in real time through the AD sampling circuit;

[0061] Arrange S30, the microcontroller displays the temperature value on the display screen, sends it to the host computer through the wireless communication module, and drives the PWM drive circuit to change the duty cycle based on the temperature value to adjust the speed of the cooling fan, so as to make the temperature of the PCS within the temperature range; by adjusting the speed of the cooling fan in the same state, the heat dissipation energy consumption is greatly reduced.

[0062] In step S20, the temperature value is calculated as follows:

[0063] Temp = 1 / K*(Rpt-100);

[0064] ΔU / Uref+R3 / (R3+R1)=Rpt / (Rpt+R1);

[0065] Rpt≈ΔU*R1 / Uref+R3*R1 / (R3+R1);

[0066] ΔU=U1-U2;

[0067] U1=(Rpt+2RL)*Uref / (Rpt+2RL+R1);

[0068] U2=(R3+2RL)*Uref / (R3+2RL+R1);

[0069] R1=(R11+R12) / 2;

[0070] RL=(RL1+RL2+RL3) / 3;

[0071] Wherein, Temp represents the tested temperature value; K represents the temperature coefficient of the temperature sensor Rpt; and Uref represents the reference voltage.

[0072] In summary, the advantages of the present invention are:

[0073] A temperature measurement module including several temperature measurement circuits is set up to perform multi-point real-time temperature measurement on the PCS, and the measured temperature values ​​are transmitted to the microcontroller through the AD sampling circuit. A heat dissipation module including several heat dissipation fans is set up to be connected to the microcontroller through the PWM drive circuit. The microcontroller can drive the PWM drive circuit to change the duty cycle to adjust the speed of the heat dissipation fan according to the received temperature value, so as to make the temperature of the PCS within the set temperature range. The microcontroller can display the temperature value change curve in real time through the display screen, and send the temperature value to the host computer through the wireless communication module for remote monitoring, so as to realize real-time and comprehensive testing and intuitive display of the temperature of the PCS, and automatically control the heat dissipation fan for heat dissipation, thereby greatly improving the safety of the high-temperature aging test of the PCS.

[0074] Although the specific implementation modes of the present invention are described above, those skilled in the art should understand that the specific implementation modes described are only illustrative and are not intended to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A high temperature test device for PCS, Features: It includes a microcontroller, an AD sampling circuit, a temperature measurement module, a PWM drive circuit, a heat dissipation module, a display screen, a communication module and a host computer; The temperature measurement module includes a plurality of temperature measurement circuits; the heat dissipation module includes a plurality of heat dissipation fans; The microcontroller is connected to the AD sampling circuit, the PWM driving circuit, the display screen and the communication module respectively; the host computer is connected to the communication module; the temperature measurement circuit is connected to the AD sampling circuit; the heat dissipation fan is connected to the PWM driving circuit; The PWM driving circuit includes a transistor Q1, a diode D1, a resistor RA, a resistor RB and a resistor RC; The b-pole of the transistor Q1 is connected to the resistor RB and the resistor RC, the e-pole is connected to the resistor RC and the input end of the diode D1 and is grounded, and the c-pole is connected to the resistor RA and the output end of the diode D1; The resistor RA is connected to the cooling fan; the resistor RB is connected to the microcontroller; The temperature measurement circuit includes an operational amplifier OP, a temperature sensor Rpt, a resistor RL1, a resistor RL2, a resistor RL3, a resistor R11, a resistor R12, a resistor R21, a resistor R22, a resistor R3, a resistor R41 and a resistor R42; Pin 1 of the operational amplifier OP is connected to resistors R21 and R41, pin 2 is connected to resistors R22 and R42, and pin 3 is connected to resistor R41 and an AD sampling circuit; one end of the temperature sensor Rpt is connected to resistor RL1, and the other end is connected to resistors RL2 and RL3; resistors RL2 and R42 are both grounded; One end of the resistor R3 is connected to the resistor RL3 , and the other end is connected to the resistor R12 and the resistor R22 ; one end of the resistor R11 is connected to the resistor R12 , and the other end is connected to the resistor RL1 and the resistor R21 .

2. A high temperature testing device for PCS as claimed in claim 1, Features: The transistor Q1 is of NPN type.

3. A high temperature testing device for PCS as claimed in claim 1, Features: The model of the temperature sensor Rpt is PT100.

4. A high temperature testing device for PCS as claimed in claim 1, Features: The resistance values ​​of the resistor R21 , the resistor R22 , the resistor R41 , and the resistor R42 are all greater than the resistance values ​​of the temperature sensor Rpt and the resistor R3 .

5. A high temperature testing device for PCS as claimed in claim 1, Features: The display screen is a touch display screen.

6. A high temperature testing device for PCS as claimed in claim 1, Features: The communication module is at least one of a 2G communication module, a 3G communication module, a 4G communication module, a 5G communication module, a NB-IOT communication module, a LORA communication module, a WIFI communication module, a Bluetooth communication module, a ZigBee communication module or a wired communication module.

7. A high temperature test method for PCS, Features: The method requires the use of a testing device as described in any one of claims 1 to 6, comprising the following steps: Step S10, the microcontroller obtains the temperature range of the PCS high temperature aging test through the display screen; Step S20, arranging each temperature measuring circuit at different points of the PCS, and the microcontroller collects the temperature value measured by the temperature measuring circuit in real time through the AD sampling circuit; Arrange S30, the microcontroller displays the temperature value on the display screen, sends it to the host computer through the wireless communication module, and drives the PWM drive circuit to change the duty cycle based on the temperature value to adjust the speed of the cooling fan, so as to make the temperature of the PCS within the temperature range.

8. A high temperature testing method for PCS as claimed in claim 7, Features: In step S20, the temperature value is calculated as follows: Temp = 1 / K*(Rpt-100); ΔU / Uref+R3 / (R3+R1)=Rpt / (Rpt+R1); Rpt≈ΔU*R1 / Uref+R3*R1 / (R3+R1); ΔU=U1-U2; U1=(Rpt+2RL)*Uref / (Rpt+2RL+R1); U2=(R3+2RL)*Uref / (R3+2RL+R1); R1=(R11+R12) / 2; RL=(RL1+RL2+RL3) / 3; Wherein, Temp represents the tested temperature value; K represents the temperature coefficient of the temperature sensor Rpt; and Uref represents the reference voltage.

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