An unencapsulated CPU heat simulation fixture and a heat dissipation test method

Abstract

The present invention relates to the technical field of servers, and specifically provides a heating simulation jig for an unpackaged CPU and a heat dissipation test method, including: a heating block and a temperature-sensitive diode sensor. The heating block and the temperature-sensitive diode sensor are encapsulated in a jig housing. The jig housing is provided with a power interface and a temperature measurement interface. The power interface is connected to a power supply to enable the power supply to supply power to the heating block and the temperature-sensitive diode sensor respectively; the temperature-sensitive diode sensor outputs a detection voltage to a detection device through the temperature measurement interface, and the detection voltage is used to characterize the temperature of the jig. The present invention can realize the measurement of the TTV temperature when the TTV of the bare die CPU cannot directly open a slot to embed a thermocouple wire for temperature measurement, ensure the smooth progress of the heat dissipation test of the bare die CPU system, evaluate the system heat dissipation condition in advance, optimize the heat dissipation scheme, and greatly reduce the system heat dissipation risk.

Description

Technical Field

[0001] The invention belongs to the technical field of servers, and in particular relates to a heat simulation jig and a heat dissipation testing method for an unpackaged CPU. Background Art

[0002] The CPU development cycle is long. Before getting a fully functional CPU, it is necessary to conduct system heat dissipation testing to evaluate the heat dissipation status in advance and reduce heat dissipation risks. TTV (Thermal test vehicle) is a fixture that simulates CPU heating and can achieve the purpose of replacing the CPU for system heat dissipation testing.

[0003] The heating simulation jig TTV is a heating block that has the same appearance and size as the CPU. After power is supplied, the design power consumption of the CPU can be achieved through the adjustment of voltage and current. The temperature measurement method of the traditional heating simulation jig is to make grooves on the heating simulation jig, bury the thermocouple wire, and directly read the temperature.

[0004] Compared with traditional heat simulation jigs, due to the limitation of the unpackaged CPU shape, the heat simulation jigs used for unpackaged CPUs cannot directly make grooves to bury thermocouple wires for temperature measurement. How to evaluate the temperature of an unpackaged CPU before getting the CPU and apply the heat simulation jigs suitable for unpackaged CPUs to testing is a technical problem. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the present invention provides a heat simulation jig and a heat dissipation testing method for an unpackaged CPU to solve the above-mentioned technical problems.

[0006] In a first aspect, the present invention provides a heat simulation tool for an unpackaged CPU, comprising:

[0007] A heating block and a temperature-sensitive diode sensor are encapsulated in a jig housing, and the jig housing is provided with a power supply interface and a temperature measurement interface, the power supply interface is connected to a power supply so that the power supply supplies power to the heating block and the temperature-sensitive diode sensor respectively; the temperature-sensitive diode sensor outputs a detection voltage to a detection device through the temperature measurement interface, and the detection voltage is used to characterize the jig temperature.

[0008] Furthermore, the temperature sensitive diode sensor uses a dynamic temperature sensitive diode circuit that measures temperature using a temperature sensitive diode based on a pulse power supply.

[0009] Furthermore, the temperature sensitive diode sensor includes a two-stage amplifier circuit, which rectifies and amplifies the direct current and pulse current flowing through the temperature sensitive diode.

[0010] Further, the size of the jig housing is the same as the size of the unencapsulated CPU.

[0011] Further, the power supply uses a current-controllable DC power supply.

[0012] Further, the power interface includes a first sub-interface and a second sub-interface. The first sub-interface is used to dock with the first power supply, and the second sub-interface is used to dock with the second power supply; the first sub-interface is connected to the heating block; the second sub-interface is connected to the temperature-sensitive diode sensor.

[0013] Further, the second sub-interface includes a first branch and a second branch. The first branch and the second branch are in parallel. The first branch is connected to the first input end of the temperature-sensitive diode sensor, and the second branch is connected to the second input end of the temperature-sensitive diode sensor through an oscillator.

[0014] Further, the detection device includes a voltage difference detection circuit based on MOS transistors and an analog-to-digital converter. The input end of the voltage difference detection circuit is docked with the output end of the temperature-sensitive diode sensor; the output end of the voltage difference detection circuit is connected to the analog-to-digital converter, and the analog-to-digital converter is connected to the data processor.

[0015] In a second aspect, the present invention provides a heat dissipation test method, including:

[0016] Configuring a DC power supply current regulation script based on the test requirements and deploying the script in the controller of the DC power supply that powers the heating block, and using the script to control the output current value and the current state duration of the DC power supply;

[0017] The data processor receives the voltage difference of the temperature-sensitive diode sensor output by the detection device, and converts the voltage difference into temperature data based on a preset conversion mechanism;

[0018] The data processor compares the temperature data with the pre-stored theoretical temperature value. If the temperature data reaches the theoretical temperature value, an alarm prompt is generated.

[0019] Further, configuring a DC power supply current regulation script based on the test requirements and deploying the script in the DC power supply controller, and using the script to control the output current value and the current state duration of the DC power supply, includes:

[0020] Setting corresponding current values based on the normal operating power and the maximum operating power of the CPU;

[0021] Setting the duration of different current values by simulating the CPU operating scenario.

[0022] The beneficial effects of the present invention are as follows. The heating simulation jig and heat dissipation method for the unpackaged CPU provided by the present invention can measure the temperature of the heating simulation jig when it is impossible to directly groove and embed thermocouple wires for temperature measurement, ensure the smooth progress of the heat dissipation test of the unpackaged CPU system, evaluate the system heat dissipation condition in advance, optimize the heat dissipation solution, and greatly reduce the system heat dissipation risk.

[0023] In addition, the design principle of the present invention is reliable and the structure is simple, having a very broad application prospect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 is a schematic structural diagram of a heating simulation jig for an unpackaged CPU according to an embodiment of the present invention.

[0026] Figure 2 is a schematic diagram of a dynamic temperature sensitive diode circuit of a heating simulation jig for an unpackaged CPU according to an embodiment of the present invention.

[0027] Figure 3 is a schematic diagram of a voltage difference detection circuit of a heating simulation jig for an unpackaged CPU according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0029] The following explains the key terms appearing in the present invention.

[0030] The CPU (Central Processing Unit), as the operation and control core of a computer system, is the final execution unit for information processing and program operation.

[0031] A bare die (die, bare die, chip, die form, wafer form) is the product form before packaging after semiconductor device manufacturing is completed. It usually exists in the form of a large wafer (wafer form) or a single chip (die form), and becomes a component of a semiconductor device, integrated circuit, or more complex circuit (hybrid circuit) after packaging.

[0032] TTV is an emulated CPU with heating elements set inside according to a real CPU. There are grooves precisely machined by a high-speed CNC machine tool on its surface copper cover. Thermocouples are soldered at low temperature to the center of the CPU, so that the surface temperature Tc of the CPU can be obtained. The ambient temperature Ta can be obtained by taking the arithmetic mean of the measured values of four groups of temperature sensors arranged above the air inlet of the radiator to be measured. As for the CPU power P, it can be obtained by multiplying the externally input voltage and current. Thus, we have obtained all the parameters for calculating the thermal resistance of the radiator through TTV, and the thermal resistance data can be obtained through simple calculations.

[0033] Please refer to Figure 1 , in an embodiment of the present invention, a heating simulation jig for an unpackaged CPU is provided, including: a heating block and a temperature-sensitive diode sensor. The heating block and the temperature-sensitive diode sensor are encapsulated in a jig housing. The jig housing is provided with a power interface and a temperature measurement interface. The power interface is connected to a power supply to supply power to the heating block and the temperature-sensitive diode sensor respectively by the power supply; the temperature-sensitive diode sensor outputs a detection voltage to a detection device through the temperature measurement interface, and the detection voltage is used to characterize the temperature of the jig.

[0034] The heating simulation jig has the same external dimensions as the unpackaged CPU and integrates a heating block and a temperature-sensitive diode inside. The heating block and the temperature-sensitive diode are respectively connected to external devices through a power supply interface and a temperature measurement interface. The heating simulation jig is installed in the corresponding CPU slot in the server. The power supply interface of the heating simulation jig is connected to an external DC Source. The DC source can input different power consumptions to the heating block of the heating simulation jig. By adjusting the current and voltage of the DC source, the designed power consumption of the CPU is input to the heating simulation jig to simulate the heating condition of the CPU in actual situations. The heating block of the heating simulation jig is in series with the temperature-sensitive diode, and the two internal lines of the temperature measurement interface are respectively connected to both sides of the temperature-sensitive diode. The temperature measurement interface of the heating simulation jig is connected to an external data acquisition instrument. The temperature-sensitive diode of the heating simulation jig will output different voltage values according to different temperatures of the heating block. This voltage value is output to the external data acquisition instrument through the temperature measurement interface. The data acquisition instrument converts the voltage value into a temperature value according to the characteristic curve of the diode of the heating simulation jig, that is, the temperature value of the heating simulation jig under the given power consumption.

[0035] Among them, through the analysis of semiconductor diodes, it can be known that under a certain bias current, the voltage drop across the PN junction of a semiconductor diode is a function of temperature, and the curve of this function is approximately a straight line. Temperature-sensitive diodes used for temperature measurement are not suitable to be made of germanium materials because germanium diodes have a large reverse current and poor linearity. Therefore, semiconductor materials used to manufacture temperature-sensitive diodes mostly choose silicon and gallium arsenide materials. Under a constant operating current, there is a good linear relationship between the forward voltage of the temperature-sensitive diode and temperature. After calibration, the voltage of the temperature-sensitive diode will indicate the corresponding temperature. The forward voltage of the temperature-sensitive diode will change linearly with the change of temperature.

[0036] Therefore, in specific applications, a voltage sensor can be used to collect the voltage value of the temperature-sensitive diode in real time. The voltage value signal output by the voltage sensor is converted into a digital signal through an analog-to-digital converter, and the processor analyzes the digital signal. Temperature sensing parameters of the temperature-sensitive diode are pre-stored in the processor, that is, the relationship curve of the voltage value changing with temperature. This curve can be obtained through a large number of experiments. The processor converts the voltage value into a temperature value based on the temperature sensing parameters, so as to realize the internal temperature monitoring of the heating simulation jig.

[0037] When conducting a heat dissipation test, the heating simulation jig is installed in the corresponding CPU slot of the server. By adjusting the current and voltage of the DCSource3 power supply, a given power consumption is input to the heating simulation jig. After the temperature-sensitive diode integrated in the heating simulation jig senses the temperature change of the heating block, it outputs a voltage value to the data acquisition instrument, and the data acquisition instrument outputs the temperature value of the heating simulation jig after conversion.

[0038] In order to improve the temperature detection accuracy, in an embodiment of the present invention, the structure of the temperature-sensitive diode sensor is as Figure 2 shown. According to the differential principle of the temperature-sensitive diode, the temperature is measured by using the dynamic characteristics. Specifically, a pulse current is input to the temperature-sensitive diode, and the current components of the temperature-sensitive diode are rectified by two operational amplifiers A1 and A2. The relationship function between the output voltage difference and temperature can be obtained as:

[0039]

[0040] where E1 is a constant DC voltage, E2 is a pulse voltage, and k0 and q are characteristic parameters of the temperature-sensitive diode.

[0041] Based on the power supply requirements of the dynamic temperature-sensitive diode circuit, the structure of the power supply interface is as follows: The power supply interface includes a first sub-interface and a second sub-interface. The first sub-interface is used to connect to the first power supply, and the second sub-interface is used to connect to the second power supply; the first sub-interface is connected to the heating block; the second sub-interface is connected to the temperature-sensitive diode sensor. The second sub-interface includes a first branch and a second branch. The first branch and the second branch are in parallel. The first branch is connected to the first input terminal of the temperature-sensitive diode sensor, and the second branch is connected to the second input terminal of the temperature-sensitive diode sensor through an oscillator.

[0042] It can be seen that the power supply requirements of the temperature-sensitive diode sensor and the heating block are different, so two independent power supplies need to be set up.

[0043] Use a voltage sensor to detect the voltage value of the temperature-sensitive diode sensor, convert the voltage value signal output by the voltage sensor into a digital signal through an analog-to-digital converter, and the processor analyzes the digital signal. The temperature sensing parameters of the temperature-sensitive diode are pre-stored in the processor, that is, the relationship curve of the voltage value changing with temperature. This curve can be obtained through a large number of experiments. The processor converts the voltage value into a temperature value based on the temperature sensing parameters, so as to realize the internal temperature monitoring of the heating simulation jig.

[0044] In the above embodiment, the output voltage difference of the dynamic temperature-sensitive diode circuit is detected by a voltage sensor. However, since the input voltage of the dynamic temperature-sensitive diode circuit is a pulsed voltage, this instantaneous change in voltage has an adverse effect on the voltage detection accuracy. Based on this, in another embodiment of the present invention, the detection device is optimized. Specifically, the optimized heating simulation jig for the unpackaged CPU includes: a heating block and a temperature-sensitive diode sensor. The heating block and the temperature-sensitive diode sensor are encapsulated in the jig housing. The jig housing is provided with a power supply interface and a temperature measurement interface. The power supply interface is connected to the power supply to supply power to the heating block and the temperature-sensitive diode sensor respectively; the temperature-sensitive diode sensor outputs a detection voltage to the detection device through the temperature measurement interface, and the detection voltage is used to characterize the temperature of the jig.

[0045] The heating simulation jig has the same external dimensions as the bare die CPU and integrates a heating block and a temperature-sensitive diode inside. The heating block and the temperature-sensitive diode are respectively connected to external devices through a power supply interface and a temperature measurement interface. The heating simulation jig is installed in the corresponding CPU slot in the server. The power supply interface of the heating simulation jig is connected to an external DC Source. The DC Source can input different power consumptions to the heating block of the heating simulation jig, and simulate the heating condition of the CPU in actual situations by adjusting the current and voltage of the DC source to input the designed power consumption of the CPU to the heating simulation jig.

[0046] Among them, through the analysis of semiconductor diodes, it can be known that under a certain bias current, the voltage drop across the PN junction of a semiconductor diode is a function of temperature, and the curve of this function is approximately a straight line. For temperature-sensitive diodes used for temperature measurement, germanium materials are not suitable for manufacturing because germanium diodes have a large reverse current and poor linearity. Therefore, semiconductor materials used to manufacture temperature-sensitive diodes mostly choose silicon and gallium arsenide materials. Under a constant operating current, there is a good linear relationship between the forward voltage of the temperature-sensitive diode and temperature. After calibration, the voltage of the temperature-sensitive diode will indicate the corresponding temperature. The forward voltage of the temperature-sensitive diode will change linearly with the change of temperature.

[0047] The temperature-sensitive diode sensor measures temperature based on the differential principle of the temperature-sensitive diode and utilizes the dynamic characteristics. Specifically, a pulsed current is input to the temperature-sensitive diode, and the current components of the temperature-sensitive diode are rectified by two operational amplifiers A1 and A2. The relationship function between the output voltage difference and temperature can be obtained as follows:

[0048]

[0049] Among them, E1 is a constant DC voltage, E2 is a pulsed voltage, and k0 and q are the characteristic parameters of the temperature-sensitive diode.

[0050] Based on the power supply requirements of the dynamic temperature-sensitive diode circuit, the structure of the power supply interface is as follows: The power supply interface includes a first sub-interface and a second sub-interface. The first sub-interface is used to connect to the first power supply, and the second sub-interface is used to connect to the second power supply; the first sub-interface is connected to the heating block; the second sub-interface is connected to the temperature-sensitive diode sensor. The second sub-interface includes a first branch and a second branch. The first branch and the second branch are in parallel. The first branch is connected to the first input terminal of the temperature-sensitive diode sensor, and the second branch is connected to the second input terminal of the temperature-sensitive diode sensor through an oscillator. It can be seen that the power supply requirements of the temperature-sensitive diode sensor and the heating block are different, so two independent power supplies need to be set.

[0051] The output terminal of the dynamic temperature-sensitive diode circuit is connected to the voltage difference detection circuit, and the voltage difference detection circuit is connected as Figure 3 shown, including: two conversion circuits, a comparator COMP, and a transient response circuit. One of the conversion circuits is connected to the voltage to be measured and converts the difference of the voltage to be measured into a current; the other conversion circuit is used to convert the current into a voltage Vdelta; the comparator COMP is used to compare the voltage Vdelta and the reference voltage VREF and output a detection signal; the transient response circuit is connected between the two conversion circuits and is also connected to a voltage to be measured, and is used to improve the transient response speed of the voltage Vdelta when the voltage to be measured changes rapidly.

[0052] The voltage difference detection circuit converts the detected voltage difference into a digital signal through an analog-to-digital converter and then sends it to the data processor. The data processor can select a complex programmable logic device, and the complex programmable logic device converts the voltage difference into a temperature value based on the voltage difference and the relationship function between the voltage difference and temperature.

[0053] The present invention also provides a heat dissipation test method based on a heat generation simulation fixture for an unpackaged CPU. The fixture includes a heating block and a temperature-sensitive diode sensor. The heating block and the temperature-sensitive diode sensor are encapsulated in the fixture housing. The fixture housing is provided with a power supply interface and a temperature measurement interface. The power supply interface is connected to a power supply to supply power to the heating block and the temperature-sensitive diode sensor respectively; the temperature-sensitive diode sensor outputs a detection voltage to a detection device through the temperature measurement interface, and the detection voltage is used to characterize the temperature of the fixture.

[0054] The heat generation simulation fixture has the same external dimensions as the unpackaged CPU and integrates a heating block and a temperature-sensitive diode inside. The heating block and the temperature-sensitive diode are respectively connected to external devices through a power supply interface and a temperature measurement interface. The heat generation simulation fixture is installed in the corresponding CPU slot in the server. The power supply interface of the heat generation simulation fixture is connected to an external DC Source. The DC source can input different power consumptions to the heating block of the heat generation simulation fixture. By adjusting the current and voltage of the DC source, the designed power consumption of the CPU is input to the heat generation simulation fixture to simulate the heat generation condition of the CPU in actual situations. The heating block of the heat generation simulation fixture is in series with the temperature-sensitive diode, and the two internal lines of the temperature measurement interface are respectively connected to both sides of the temperature-sensitive diode. The temperature measurement interface of the heat generation simulation fixture is connected to an external data acquisition instrument. The temperature-sensitive diode of the heat generation simulation fixture will output different voltage values according to different temperatures of the heating block. This voltage value is output to the external data acquisition instrument through the temperature measurement interface. The data acquisition instrument converts the voltage value into a temperature value according to the characteristic curve of the diode of the heat generation simulation fixture, that is, the temperature value of the heat generation simulation fixture under the given power consumption.

[0055] Among them, through the analysis of semiconductor diodes, it can be known that under a certain bias current, the voltage drop across the PN junction of a semiconductor diode is a function of temperature, and the curve of this function is approximately a straight line. For a temperature-sensitive diode used for temperature measurement, germanium material is not suitable for manufacturing because the reverse current of a germanium diode is large and the linearity is poor. Therefore, most of the semiconductor materials used to manufacture temperature-sensitive diodes are silicon and gallium arsenide materials. Under a constant operating current, there is a good linear relationship between the forward voltage of the temperature-sensitive diode and temperature. After calibration, the voltage of the temperature-sensitive diode will indicate the corresponding temperature. The forward voltage of the temperature-sensitive diode will change linearly with the change of temperature.

[0056] Therefore, in specific applications, a voltage sensor can be used to collect the voltage value of the temperature-sensitive diode in real time. The voltage value signal output by the voltage sensor is converted into a digital signal through an analog-to-digital converter, and the processor analyzes the digital signal. Temperature sensing parameters of the temperature-sensitive diode are pre-stored in the processor, that is, the relationship curve of the voltage value changing with temperature. This curve can be obtained through a large number of experiments. The processor converts the voltage value into a temperature value based on the temperature sensing parameters, so as to realize the internal temperature monitoring of the heating simulation fixture.

[0057] When performing the heat dissipation test, the heating simulation fixture is installed in the corresponding CPU slot of the server. By adjusting the current and voltage of the DC Source3 power supply, the given power consumption is input to the heating simulation fixture. After the temperature-sensitive diode integrated in the heating simulation fixture senses the temperature change of the heating block, it outputs a voltage value to the data acquisition instrument 1, and the data acquisition instrument outputs the temperature value of the heating simulation fixture after conversion.

[0058] In another implementation method, in order to improve the temperature detection accuracy, the temperature-sensitive diode and the detection device of the heating simulation fixture are optimized, and the heat dissipation test is carried out based on the optimized unencapsulated CPU heating simulation fixture. The optimized unencapsulated CPU heating simulation fixture includes:

[0059] A heating block and a temperature-sensitive diode sensor. The heating block and the temperature-sensitive diode sensor are encapsulated in the fixture housing. The fixture housing is provided with a power supply interface and a temperature measurement interface. The power supply interface is connected to the power supply to supply power to the heating block and the temperature-sensitive diode sensor respectively; the temperature-sensitive diode sensor outputs a detection voltage to the detection device through the temperature measurement interface, and the detection voltage is used to characterize the fixture temperature.

[0060] The heating simulation fixture has the same external dimensions as the bare die CPU and integrates a heating block and a temperature-sensitive diode. The heating block and the temperature-sensitive diode are respectively connected to external devices through the power supply interface and the temperature measurement interface. The heating simulation fixture is installed in the corresponding CPU slot in the server. The power supply interface of the heating simulation fixture is connected to the external DC Source, and the DC source can input different power consumptions to the heating block of the heating simulation fixture. By adjusting the current and voltage of the DC source, the designed power consumption of the CPU is input to the heating simulation fixture to simulate the heating condition of the CPU in the actual situation.

[0061] Among them, through the analysis of semiconductor diodes, it can be known that under a certain bias current, the voltage drop across the PN junction of a semiconductor diode is a function of temperature, and the curve of this function is approximately a straight line. Temperature-sensitive diodes used for temperature measurement are not suitable to be made of germanium materials because germanium diodes have a large reverse current and poor linearity. Therefore, most of the semiconductor materials used to manufacture temperature-sensitive diodes are silicon and gallium arsenide materials. Under a constant operating current, there is a good linear relationship between the forward voltage of the temperature-sensitive diode and temperature. After calibration, the voltage of the temperature-sensitive diode will indicate the corresponding temperature. The forward voltage of the temperature-sensitive diode will change linearly with the change of temperature.

[0062] The temperature-sensitive diode sensor measures temperature based on the differential principle of the temperature-sensitive diode and utilizes its dynamic characteristics. Specifically, a pulsed current is input to the temperature-sensitive diode, and the current components of the temperature-sensitive diode are rectified by two operational amplifiers A1 and A2. The relationship function between the output voltage difference and temperature can be obtained as follows:

[0063]

[0064] Among them, E1 is a constant DC voltage, E2 is a pulsed voltage, and k0 and q are characteristic parameters of the temperature-sensitive diode.

[0065] Based on the power supply requirements of the dynamic temperature-sensitive diode circuit, the structure of the power supply interface is as follows: The power supply interface includes a first sub-interface and a second sub-interface. The first sub-interface is used to connect to the first power supply, and the second sub-interface is used to connect to the second power supply; the first sub-interface is connected to the heating block; the second sub-interface is connected to the temperature-sensitive diode sensor. The second sub-interface includes a first branch and a second branch. The first branch and the second branch are in parallel. The first branch is connected to the first input terminal of the temperature-sensitive diode sensor, and the second branch is connected to the second input terminal of the temperature-sensitive diode sensor through an oscillator. It can be seen that the power supply requirements of the temperature-sensitive diode sensor and the heating block are different, so two independent power supplies need to be set up.

[0066] The output terminal of the dynamic temperature-sensitive diode circuit is connected to the voltage difference detection circuit, and the voltage difference detection circuit is connected as Figure 3 shown, including: two conversion circuits, a comparator COMP, and a transient response circuit. One of the conversion circuits is connected to the voltage to be measured and converts the difference of the voltage to be measured into a current; the other conversion circuit is used to convert the current into a voltage Vdelta; the comparator COMP is used to compare the voltage Vdelta and the reference voltage VREF and output a detection signal; the transient response circuit is connected between the two conversion circuits and is also connected to a voltage to be measured, and is used to improve the transient response speed of the voltage Vdelta when the voltage to be measured changes rapidly.

[0067] The voltage difference detection circuit converts the detected voltage difference into a digital signal through an analog-to-digital converter and then sends it to the data processor. The data processor can select a complex programmable logic device. The complex programmable logic device converts the voltage difference into a temperature value based on the voltage difference and the relationship function between the voltage difference and temperature.

[0068] The voltage difference detection circuit converts the detected voltage difference into a digital signal through an analog-to-digital converter and then sends it to the data processor. The data processor can select a complex programmable logic device (FPGA). FPGA (Field Programmable Gate Array) is a further development based on programmable devices such as PAL (Programmable Array Logic) and GAL (Generic Array Logic). It emerged as a semi-custom circuit in the field of application-specific integrated circuits (ASICs), solving the deficiencies of custom circuits and overcoming the shortcomings of limited gate circuits in the original programmable devices. Compared with the traditional chip design mode, the FPGA chip is not simply limited to researching and designing chips, but can optimize the design for products in many fields with a specific chip model. From the perspective of chip devices, the FPGA itself constitutes a typical integrated circuit in semi-custom circuits, which contains a digital management module, an embedded unit, an output unit, and an input unit, etc. On this basis, it is necessary to comprehensively focus on the comprehensive chip optimization design for the FPGA chip, add new chip functions by improving the current chip design, and thus simplify the overall chip structure and improve the performance. The relationship function between the voltage difference and temperature is pre-burned into the complex programmable logic device. After receiving the voltage difference in digital signal format, the complex programmable logic device converts the voltage difference into a temperature value based on the relationship function.

[0069] When performing the test, the following steps are specifically executed:

[0070] S1. Configure a DC power supply current regulation script based on the test requirements and deploy the script in the controller of the DC power supply that powers the heating block, and use the script to control the output current value and the current state duration of the DC power supply.

[0071] Set the corresponding current values based on the normal operating power and the maximum operating power of the CPU; set the duration of different current values by simulating the CPU operating scenario.

[0072] For example, the normal operating power is P1, the maximum operating power is P2. When the voltage is fixed, the normal current value is I1, and the maximum current value is I2. Configure the continuous output for 30 min in the state of normal current I1, increase the current to I2 within 15 s, and maintain it for 30 min. Or, switch between the I1 state and the I2 state in a cycle, and each state lasts for 30 min.

[0073] S2. The data processor receives the voltage difference of the temperature-sensitive diode sensor output by the detection device, and converts the voltage difference into temperature data based on a preset conversion mechanism.

[0074] S3. The data processor compares the temperature data with the pre-stored theoretical temperature value. If the temperature data reaches the theoretical temperature value, an alarm prompt is generated.

[0075] While monitoring and warning the maximum temperature value, the temperature change curve can also be recorded to make the test traceable. The tester analyzes the heating rate of the temperature change curve to evaluate the heat dissipation performance.

[0076] Therefore, when the temperature measurement of the heat simulation fixture for the bare die CPU cannot directly groove and embed the thermocouple wire for temperature measurement, the present invention can realize the temperature measurement of the heat simulation fixture, ensure the smooth progress of the heat dissipation test of the bare die CPU system, evaluate the system heat dissipation condition in advance, optimize the heat dissipation scheme, greatly reduce the system heat dissipation risk. The technical effects that can be achieved by this embodiment can be seen in the above description and will not be elaborated here.

[0077] Although the present invention has been described in detail by referring to the drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those of ordinary skill in the art can make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions should all be within the scope of the present invention. / Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A heat simulation jig for an unpackaged CPU, characterized in that, Comprising: A heating block and a temperature-sensitive diode sensor, the heating block and the temperature-sensitive diode sensor are encapsulated in a jig housing, the jig housing is provided with a power interface and a temperature measurement interface, and the power interface is connected to a power supply to supply power to the heating block and the temperature-sensitive diode sensor respectively by the power supply; The temperature-sensitive diode sensor outputs a detection voltage to a detection device through the temperature measurement interface, and the detection voltage is used to characterize the temperature of the jig; the temperature-sensitive diode sensor adopts a dynamic temperature-sensitive diode circuit with a temperature-sensitive diode for temperature measurement based on a pulsed power supply; The temperature-sensitive diode sensor includes two-stage amplifier circuits, and the two-stage amplifier circuits rectify and amplify the direct current and pulsed current flowing through the temperature-sensitive diode; The temperature-sensitive diode sensor measures the temperature based on the differential principle of the temperature-sensitive diode and utilizes the dynamic characteristics; Input a pulsed current to the temperature-sensitive diode, and after rectifying the current component of the temperature-sensitive diode by two operational amplifiers, the relationship function between the output voltage difference and the temperature can be obtained as: Wherein, E1 is a constant DC voltage, E2 is a pulsed voltage, and k0 and q are characteristic parameters of the temperature-sensitive diode; The output end of the temperature-sensitive diode circuit is connected to a voltage difference detection circuit, and the voltage difference detection circuit includes: two conversion circuits, a comparator COMP and a transient response circuit; one of the conversion circuits is connected to the voltage to be measured and converts the difference of the voltage to be measured into a current; the other conversion circuit is used to convert the current into a voltage Vdelta; the comparator COMP is used to compare the voltage Vdelta with a reference voltage VREF and output a detection signal; the transient response circuit is connected between the two conversion circuits and is also connected to a voltage to be measured, and is used to improve the transient response speed of the voltage Vdelta when the voltage to be measured changes rapidly; The voltage difference detection circuit converts the detected voltage difference into a digital signal through an analog-to-digital converter and sends it to a data processor. The data processor can select a complex programmable logic device, and the complex programmable logic device converts the voltage difference into a temperature value based on the voltage difference and the relationship function between the voltage difference and the temperature; 2. The heat generation simulation fixture for the unpackaged CPU according to claim 1, wherein The size of the jig housing is the same as the size of the unencapsulated CPU.

3. The heat generation simulation fixture for the unpackaged CPU according to claim 1, wherein, The power supply adopts a current-controllable DC power supply.

4. The heat generation simulation fixture for the unpackaged CPU according to claim 1, characterized in that, The power interface includes a first sub-interface and a second sub-interface. The first sub-interface is used to connect to a first power supply, and the second sub-interface is used to connect to a second power supply; the first sub-interface is connected to the heating block; the second sub-interface is connected to the temperature-sensitive diode sensor.

5. The heat generation simulation fixture for the unpackaged CPU according to claim 4, wherein The second sub-interface includes a first branch and a second branch. The first branch and the second branch are in parallel. The first branch is connected to the first input end of the temperature-sensitive diode sensor, and the second branch is connected to the second input end of the temperature-sensitive diode sensor through an oscillator.

6. A heat dissipation test method, based on the heat generation simulation fixture for the unpackaged CPU according to any one of claims 1-5, characterized in that, Comprising: Configure a DC power supply current regulation script based on test requirements and deploy the script in the controller of the DC power supply that powers the heating block, and use the script to control the output current value and the current state duration of the DC power supply; The data processor receives the voltage difference of the temperature-sensitive diode sensor output by the detection device, and converts the voltage difference into temperature data based on a preset conversion mechanism; The data processor compares the temperature data with the pre-stored theoretical temperature value. If the temperature data reaches the theoretical temperature value, an alarm prompt is generated.

7. The method according to claim 6, wherein Configure a DC power supply current regulation script based on the test requirements and deploy the script on the DC power supply controller. Use the script to control the output current value and the current state duration of the DC power supply, including: Set corresponding current values based on the normal operating power and the maximum operating power of the CPU; Set the duration of different current values by simulating the CPU operating scenario.

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