Optical coupling structure and optical communication device

Abstract

The present application relates to an optical coupling structure and an optical communication device. The optical coupling structure includes an optical transmitter chip, an anti-reflection film, a connector, a first photon lead, and a first optical component. An anti-reflection film is provided at the light outlet of the optical transmitter chip. A connector is used to connect the light outlet to the input end of the first photon lead. The anti-reflection film and the input end of the first photon lead are separated by an air cavity in the connector. Light emitted from the light outlet of the optical transmitter chip passes through the anti-reflection film, which reduces light reflection. The light then enters the air cavity of the connector. The refractive index of the anti-reflection film matches that of air, reducing light reflection on the anti-reflection film. The light then enters the return loss enhancement surface of the first photon lead, which reduces light reflection from the input end of the first photon lead back to the light outlet. Finally, the light is guided by the first photon lead to the first optical component. This optical coupling structure can improve return loss, reduce interference, and improve coupling efficiency.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of optical communication structures, and in particular to an optical coupling structure and an optical communication device. Background Art

[0002] In optical communication technology, the function of optical devices is to realize the mutual conversion between optical signals and electrical signals. The transmitting device includes optical components such as optical transmitter chips, modulators, and arrayed waveguide gratings (AWGs). The light generated by the optical transmitter chip passes through the modulator and AWG and is then introduced into the optical fiber. The receiving device includes optical components such as photodetectors and optical splitters. The light received by the optical fiber passes through the optical splitter and is then introduced into the photodetector. The process of transferring light from one optical component (such as an optical transmitter chip) to another optical component (such as a modulator) is called optical coupling. The higher the optical coupling efficiency, the lower the power loss in light transmission.

[0003] Traditional free-space technology uses lenses and other components to couple light from one optical component to another. This approach requires high precision in the patch coupling process, including submicron precision in silicon photonic structures, making it challenging to manufacture. It also requires a large number of precision lenses, resulting in high material costs. Active coupling is also required, requiring real-time monitoring of the device's photoelectric efficiency during the coupling process to calibrate the coupling parameters, resulting in high process costs.

[0004] Photonic wire bonding (PWB) technology has emerged in the industry. It uses the two-photon polymerization effect to 3D print between two optical components to print out polymer optical waveguides (WG) to connect the optical ports of the two optical components to achieve optical coupling, which is called photonic wire bonding. Compared with the precision of the patch coupling process, the precision of 3D-printed photonic wires is much higher, achieving efficient optical coupling between optical components. PWB technology uses polymers to replace precision lenses to reduce material costs. PWB technology uses visual system positioning to achieve coupling, which is passive coupling and reduces process costs. However, in the current PWB technology, there is a large light reflection at the coupling interface between the light output port of the optical transmitter chip and the photonic wire, and the return light will affect the performance of the optical device. Summary of the Invention

[0005] The embodiments of the present application provide an optical coupling structure and an optical communication device, which solve the problem of large light reflection at the coupling interface between the light outlet of the optical transmitter chip and the photon lead in the existing PWB technology.

[0006] To achieve the above objectives, the present invention adopts the following technical solutions:

[0007] In a first aspect, an embodiment of the present application provides an optical coupling structure, which includes a light emitter chip, an anti-reflection film, a connector, a first photon lead and a first optical component; the anti-reflection film is provided at the light outlet of the light emitter chip, and the refractive index of the anti-reflection film matches the refractive index of air; the input end of the first photon lead is arranged toward the light outlet, and the input end face of the first photon lead is provided as a return loss enhancement surface; the light outlet and the input end of the first photon lead are connected by a connector, and the connector has an air cavity for separating the anti-reflection film and the input end of the first photon lead; the output end of the first photon lead is connected to the input end of the first optical component.

[0008] The first optical component may be an optical chip or an optical fiber.

[0009] The refractive index of the antireflection film matches that of air, that is, the relative refractive index of the antireflection film to air is equal to or very close to 1.

[0010] The connector can be attached to the anti-reflection film or the surface of the light emitter chip.

[0011] The optical coupling structure provided in the embodiments of the present application has an anti-reflection film at the light output port of the light emitter chip. A connector is used to connect the light output port to the input end of the first photon lead, and the anti-reflection film and the input end of the first photon lead are separated by an air cavity in the connector. Light emitted from the light output port of the light emitter chip passes through the anti-reflection film, which reduces light reflection to a certain extent. The light then enters the air cavity of the connector, where the refractive index of the anti-reflection film matches that of air, reducing light reflection on the anti-reflection film. The light then enters through the return loss enhancement surface of the first photon lead, which can reduce light reflection returning from the input end of the first photon lead to the light output port of the light emitter chip. Finally, the light is guided by the first photon lead to the first optical component. The optical coupling structure of the present application can effectively reduce the return light power at the input end of the first photon lead, improve return loss, reduce interference, and improve coupling efficiency. This allows PWB technology to adapt to existing light emitter scenarios, eliminating the need to develop new anti-reflection films to match the refractive index of the photon lead, which is conducive to the promotion and application of PWB technology.

[0012] In combination with the first aspect, in a first possible implementation manner of the first aspect, the connector and the first photon lead are an integrally formed structure.

[0013] The connector and first photon lead are manufactured using a PWB process. Using the same material, they are 3D-printed between the light output port of the light emitter chip and the input terminal of the first optical component, forming a unibody structure with a defined shape. This compact structure provides a reliable connection between the light output port of the light emitter chip and the input terminal of the first optical component.

[0014] In combination with the first aspect or the first possible implementation of the first aspect, in a second possible implementation of the first aspect, the bottom surface of the air cavity has a lead-out groove for connecting the air cavity with the outside, and the lead-out groove is used to lead out the developer in the air cavity.

[0015] After the connector with the air cavity is formed by photolithography, the developer in the air cavity is discharged to the outside through the outlet groove, forming a true air cavity. The outlet groove is located on the bottom surface of the air cavity to reduce the possibility of other substances entering the air cavity during the manufacturing process.

[0016] In conjunction with the second possible implementation of the first aspect, in a third possible implementation of the first aspect, the lead-out groove extends along the thickness direction of the light emitter chip. That is, when the light emitter chip is laid flat, the lead-out groove extends vertically downward from the bottom surface of the air cavity. Alternatively, the lead-out groove extends along a direction inclined at a predetermined angle relative to the thickness direction of the light emitter chip.

[0017] Both of these methods can guide the developer in the air cavity to the outside during the PWB process and reduce the entry of foreign matter into the air cavity during the manufacturing process.

[0018] In combination with any one of the first aspect to the third possible implementation manner of the first aspect, in a fourth possible implementation manner of the first aspect, the cross-sectional area of ​​the input end of the first photonic lead matches the light output spot area generated by the light emitter chip.

[0019] The cross-sectional area of ​​the input end of the first photon lead refers to the area of ​​the first photon lead's input end at its maximum cross-section. The light output spot area generated by the light emitter chip refers to the area of ​​the light output spot of the light generated by the light emitter chip at the cross-sectional area of ​​the first photon lead's input end. The light output spot area can be 0.9 to 1.1 times the cross-sectional area of ​​the first photon lead's input end. Light emitted by the light emitter chip can be effectively transmitted into the first photon lead, resulting in high coupling efficiency. The radial dimension of the first photon lead is also small, saving consumables.

[0020] In combination with any one of the first aspect to the fourth possible implementation manner of the first aspect, in a fifth possible implementation manner of the first aspect, the return loss enhancement surface is a spherical surface, a curved surface, or an inclined surface.

[0021] These return loss enhancement surfaces can reflect a portion of the light transmitted to the input end of the first photon lead in a predetermined direction instead of toward the light output port of the optical transmitter chip. This effectively reduces the returned optical power at the input end of the first photon lead, thereby improving the return loss.

[0022] In combination with any one of the first aspect to the fifth possible implementation of the first aspect, in a sixth possible implementation of the first aspect, the optical transmitter chip includes a light-emitting unit and an optical waveguide, one end of the optical waveguide is arranged opposite to the light-emitting unit, and the other end of the optical waveguide is a light outlet.

[0023] The light-emitting unit is used to generate light, and the optical waveguide is used to transmit the light from the light-emitting unit to the light outlet. The light emitter chip with the light-emitting unit and the optical waveguide is easy to form and facilitates the generation and transmission of light.

[0024] In combination with any one of the first aspect to the sixth possible implementation of the first aspect, in a seventh possible implementation of the first aspect, the first photon lead includes a core wire and a cladding covering the outer circumference of the core wire, and the refractive index of the core wire is greater than the refractive index of the cladding.

[0025] After light enters the core wire, it can be totally reflected at the cross section between the core wire and the cladding, so that the light is transmitted along the first photon lead.

[0026] In a second aspect, an embodiment of the present application provides an optical communication device, comprising an optical coupling structure as described in the first aspect to the seventh possible implementation manner of the first aspect.

[0027] In combination with the second aspect, in a first possible implementation of the second aspect, the first optical component is a silicon photonic modulator chip, the optical communication device also includes an optical fiber and a second photonic lead, and the input end of the optical fiber and the output end of the silicon photonic modulator chip are connected through the second photonic lead.

[0028] Using PWB technology, efficient optical coupling between different optical components is achieved, ensuring reliable connections and low material and process costs. During operation, light is output from the optical transmitter chip through the optical port. This light passes through the first photon lead and enters the silicon photonic modulator chip, where it modulates the light intensity. The light then passes through the second photon lead and enters the optical fiber, where it is transmitted to the other end of the fiber. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a top cross-sectional view of the optical coupling structure of the first comparative example;

[0030] Figure 2 is a top cross-sectional view of an optical coupling structure of a second comparative example;

[0031] Figure 3 A top cross-sectional view of the optical coupling structure provided in an embodiment of the present application;

[0032] Figure 4 A side cross-sectional view of the optical coupling structure provided in an embodiment of the present application;

[0033] Figure 5A three-dimensional structural diagram of the optical coupling structure provided in an embodiment of the present application;

[0034] Figure 6 A three-dimensional structural diagram of an optical coupling structure provided in another embodiment of the present application;

[0035] Figure 7 A schematic diagram of the structure of an optical communication device provided in an embodiment of the present application.

[0036] Among them, the reference numerals in the figures are:

[0037] 1-light transmitter chip; 1a-light output port;

[0038] 2-photon lead; 2a-input end; 2b-output end;

[0039] 3-first optical component; 3a-input end;

[0040] 4-Anti-reflective film;

[0041] 10-light emitter chip; 10a-light outlet; 11-light emitting unit; 12-optical waveguide;

[0042] 20-antireflective film;

[0043] 30-connecting piece; 31-air cavity; 32-export groove;

[0044] 40 - first photon lead; 41 - input end; 41a - return loss enhancement surface; 42 - output end;

[0045] 50-first optical component; 51-input end; 52-output end;

[0046] 60-optical fiber; 61-input end;

[0047] 70-Second photon lead. DETAILED DESCRIPTION

[0048] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clear, this application is further described in detail below with reference to the accompanying drawings and embodiments.

[0049] In the description of the embodiments of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0051] In the embodiments of the present application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections; direct connections, or indirect connections through an intermediate medium; and can refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0052] The optical coupling structures provided in the following comparative examples and the embodiments of the present application adopt PWB technology and are suitable for scenarios such as connection between optical chips and connection between optical chips and connection between optical chips and optical fibers.

[0053] Figure 1 2 is a top cross-sectional view of the optical coupling structure of the first comparative example.

[0054] See Figure 1 In the optical coupling structure of the first comparative example, it includes an optical transmitter chip 1, a photonic lead 2, and a first optical component 3. The input end 2a of the photonic lead 2 is connected to the light output port 1a of the optical transmitter chip 1, and the output end 2b of the photonic lead 2 is connected to the input end 3a of the first optical component 3. The optical transmitter chip 1 is used to transmit optical signals. The first optical component 3 can be an optical chip or an optical fiber. Optical coupling between the optical transmitter chip 1 and the first optical component 3 is achieved through the photonic lead 2.

[0055] There is significant light reflection at the coupling interface between the optical transmitter chip 1 and the photonic lead 2 (the solid arrow represents the incident light, and the dashed arrow represents the return light). This return light can affect the performance of the optical coupling structure. This significant light reflection at the coupling interface is due to a sudden change in the refractive index between the light outlet 1a of the optical transmitter chip 1 and the photonic lead 2.

[0056] Figure 2 2 is a top cross-sectional view of the optical coupling structure of the second comparative example.

[0057] See Figure 2In the optical coupling structure of the second comparative example, it includes a light emitter chip 1, a photonic lead 2, a first optical component 3, and an anti-reflection (AR) film 4. The AR film 4 is disposed at the light outlet 1a of the light emitter chip 1. The input end 2a of the photonic lead 2 faces the light outlet 1a and is connected to the AR film 4. The output end 2b of the photonic lead 2 is connected to the input end 3a of the first optical component 3. Based on the first comparative example, the second comparative example adds the AR film 4 at the light outlet 1a of the light emitter chip 1. The AR film 4 can increase the transmittance of light and reduce the reflectivity to a certain extent.

[0058] However, in the second comparative example, after adding the anti-reflection film 4 to the light outlet 1a of the light emitter chip 1, the refractive index of the anti-reflection film 4 and the photonic lead 2 is not well matched, resulting in some light reflection at the interface between the anti-reflection film 4 and the input end 2a of the photonic lead 2 (the solid arrow represents the incident light, and the dashed arrow represents the return light). Mature anti-reflection films 4 on the market match the refractive index of air, meaning the relative refractive index of the anti-reflection film 4 to air is equal to or very close to 1. The photonic lead 2 is made of a polymer material, and the relative refractive index of the photonic lead 2 to air using current processing technology is 1.53.

[0059] When light is transmitted through a transmission medium (such as an optical fiber or photonic lead), some of it is reflected and scattered back to the origin. This reduces the power of the forward-transmitted light and can alter the operating wavelength of the optical transmitter chip 1, negatively impacting the system. For light transmitted through a transmission medium, it is generally desirable to minimize the return light to minimize its impact on the system.

[0060] Return loss is used to measure the degree to which light transmitted through a transmission medium returns to its starting point after reflection and scattering. Return loss is the ratio of the returned optical power at the end face of the transmission medium to the incident optical power. It is expressed as an absolute value in logarithmic form, in dB, and is generally a positive value. The formula for return loss is:

[0061] Return loss = 10*|lg(return optical power / incident optical power)|

[0062] From the above formula, we can see that the greater the return loss, the better, that is, the smaller the returned optical power, the better.

[0063] In the first comparative example, the refractive index of the photonic lead 2 and the light output port 1a of the optical transmitter chip 1 are not sufficiently matched. In the second comparative example, the refractive index of the photonic lead 2 and the anti-reflection film 4 are not sufficiently matched. This makes it difficult to further reduce light reflections, resulting in high return light power at the input end 2a of the photonic lead 2 and low return loss, which can adversely affect the system.

[0064] Based on the second comparative example, in order to match the refractive index of the antireflection film 4 with that of the photonic lead 2, it was considered to change their refractive indices. However, changing the refractive index of the photonic lead 2 would lead to performance and stability issues, making this approach inappropriate. Changing the refractive index of the antireflection film 4 would significantly increase the cost of the transmitting device.

[0065] Figure 3 A top cross-sectional view of the optical coupling structure provided in an embodiment of the present application; Figure 4 A side cross-sectional view of the optical coupling structure provided in an embodiment of the present application.

[0066] See Figure 3 and Figure 4 An embodiment of the present application provides an optical coupling structure, which includes a light emitter chip 10, an anti-reflection film 20, a connector 30, a first photon lead 40 and a first optical component 50; the anti-reflection film 20 is provided at the light outlet 10a of the light emitter chip 10, and the refractive index of the anti-reflection film 20 matches the refractive index of air; the input end 41 of the first photon lead 40 is arranged toward the light outlet 10a, and the end face of the input end 41 of the first photon lead 40 is provided as a return loss enhancement surface 41a; the light outlet 10a and the input end 41 of the first photon lead 40 are connected by the connector 30, and the connector 30 has an air cavity 31 for separating the anti-reflection film 20 and the input end 41 of the first photon lead 40; the output end 42 of the first photon lead 40 is connected to the input end 51 of the first optical component 50.

[0067] The first optical component 50 may be an optical chip or an optical fiber.

[0068] The refractive index of the anti-reflection film 20 matches that of air, that is, the relative refractive index of the anti-reflection film 20 to air is equal to or very close to 1.

[0069] The connector 30 may be connected to the anti-reflection film 20 or the surface of the light emitter chip 10 .

[0070] The optical coupling structure provided in the present embodiment has an anti-reflection film 20 disposed at the light output port 10a of the light emitter chip 10. A connector 30 is used to connect the light output port 10a to the input end 41 of the first photon lead 40. The air cavity 31 of the connector 30 separates the anti-reflection film 20 and the input end 41 of the first photon lead 40. Light emitted from the light output port 10a of the light emitter chip 10 passes through the anti-reflection film 20, which reduces light reflection to a certain extent. The light then enters the air cavity 31 of the connector 30. The refractive index of the anti-reflection film 20 matches that of air, reducing light reflection on the anti-reflection film 20. The light then enters the return loss enhancement surface 41a of the first photon lead 40, which reduces light reflection from the input end 41 of the first photon lead 40 back to the light output port 10a of the light emitter chip 10. Finally, the light is guided by the first photon lead 40 to the first optical assembly 50. Compared with the above comparative examples, the optical coupling structure of the present application can effectively reduce the return light power at the input end 41 of the first photon lead 40, improve the return loss, reduce interference, and improve the coupling efficiency, thereby making the PWB technology adaptable to the existing light transmitter scenario. There is no need to develop a new anti-reflection film 20 to adapt to the refractive index of the photon lead, which is conducive to the promotion and application of PWB technology.

[0071] When the anti-reflection film 20 is provided, the anti-reflection film 20 can be provided at the light outlet 10 a of the light emitter chip 10 by coating, which is easy to form and has reliable connection.

[0072] When manufacturing the connector 30 , the connector 30 and the first photon lead 40 are formed into an integral structure.

[0073] The connector 30 and first photonic lead 40 are manufactured using a PWB process. They are 3D-printed from the same material (e.g., polymer) between the light output port 10a of the light emitter chip 10 and the input terminal 51 of the first optical component 50, forming a unibody structure with a defined shape. Both the connector 30 and the first photonic lead 40 are compact and precise structures, ensuring a reliable connection between the light output port 10a of the light emitter chip 10 and the input terminal 51 of the first optical component 50.

[0074] The connector 30 can be a rectangular parallelepiped or other shape. The first photon lead 40 can be configured as a three-dimensional extension. The input end 41 of the first photon lead 40 can be located within the air cavity 31 of the connector 30 and facing the light output port 10a of the light emitter chip 10, thereby providing a reliable connection between the connector 30 and the first photon lead 40.

[0075] In some embodiments, see Figure 4 The bottom surface of the air cavity 31 has a lead-out groove 32 for connecting the air cavity 31 with the outside, and the lead-out groove 32 is used to lead out the developer in the air cavity 31.

[0076] The PWB process forms a target structure by photolithography on an initial structure. The initial structure is the light emitter chip 10 and the first optical component 50, while the target structure is the connector 30 and the first photonic lead 40. Photoresist is first applied to the initial structure, and then predetermined areas of the photoresist are exposed. A developer then dissolves the soluble areas of the photoresist, leaving the photoresist fixed on the initial structure as the target structure.

[0077] The bottom surface of the air cavity 31 refers to the bottom surface of the connector 30 during fabrication. The lead-out groove 32 is provided on the connector 30 to allow the developer within the air cavity 31 to be discharged to the outside through the lead-out groove 32 after the connector 30 with the air cavity 31 is formed by photolithography, thereby forming a true air cavity 31. The lead-out groove 32 is provided on the bottom surface of the air cavity 31 to reduce the possibility of other substances entering the air cavity 31 during the fabrication process, thereby enabling efficient light transmission between the light emitter chip 10 and the first photonic lead 40 and improving structural reliability.

[0078] Figure 5 A three-dimensional structural diagram of the optical coupling structure provided in an embodiment of the present application; Figure 6 A three-dimensional structural diagram of an optical coupling structure provided in another embodiment of the present application.

[0079] There are different ways to implement the configuration of the output slot 32. For example, see Figure 5 The lead-out groove 32 extends along the thickness direction of the light emitter chip 10, that is, when the light emitter chip 10 is placed flat, the lead-out groove 32 extends vertically downward on the bottom surface of the air cavity 31. Alternatively, refer to Figure 6 The lead-out groove 32 is extended along a direction inclined at a predetermined angle relative to the thickness direction of the light emitter chip 10 .

[0080] Both of these methods can guide the developer in the air cavity 31 to the outside during the PWB process, and reduce the entry of foreign substances into the air cavity 31 during the manufacturing process.

[0081] One or more lead-out slots 32 can be provided as needed. When a plurality of lead-out slots 32 are provided, different lead-out slots 32 can extend in the same direction or in different directions.

[0082] When setting up the light emitter chip 10 and the first photon lead 40, refer to Figure 3 、 Figure 4The cross-sectional area of ​​the input end 41 of the first photon lead 40 matches the light output spot area generated by the light emitter chip 10. The cross-sectional area of ​​the input end 41 of the first photon lead 40 refers to the area of ​​the input end 41 of the first photon lead 40 at its maximum cross-section. The light output spot area generated by the light emitter chip 10 refers to the light output spot area of ​​the light generated by the light emitter chip 10 at the cross-sectional area of ​​the input end 41 of the first photon lead 40.

[0083] If the distance between the input end 41 of the first photon lead 40 and the light outlet 10a of the light emitter chip 10 is set too large, the light spot area generated by the light emitter chip 10 will be smaller, the first photon lead 40 will be made larger, and more materials will be consumed.

[0084] If the distance between the input end 41 of the first photon lead 40 and the light output port 10a of the light emitter chip 10 is set too small, the light output spot area generated by the light emitter chip 10 is larger than the cross-sectional area of ​​the input end 41 of the first photon lead 40, and the light generated by the light emitter chip 10 cannot be well transmitted to the first photon lead 40, resulting in low coupling efficiency.

[0085] The distance between the input end 41 of the first photon lead 40 and the light outlet 10a of the light emitter chip 10 is set within an appropriate range so that the light spot generated by the light emitter chip 10 roughly falls on the end face of the input end 41 of the first photon lead 40, that is, the cross-sectional area of ​​the input end 41 of the first photon lead 40 matches the area of ​​the light spot generated by the light emitter chip 10 (for example, the light spot area can be 0.9 to 1.1 times the cross-sectional area of ​​the input end 41 of the first photon lead 40). The light emitted by the light emitter chip 10 can be effectively transmitted to the first photon lead 40, with high coupling efficiency, and the radial dimension of the first photon lead 40 is small to save consumables.

[0086] For example, the light output spot area can be 0.9 times, 0.92 times, 0.95 times, 0.98 times, 1 times, 1.02 times, 1.05 times, 1.08 times, or 1.1 times the cross-sectional area of ​​the input end 41 of the first photonic lead 40. The specific setting is not limited to specific needs. When the above conditions are met, a high coupling efficiency can be achieved between the optical transmitter chip 10 and the first photonic lead 40.

[0087] When setting the return loss enhancement surface 41a, refer to Figure 4 The return loss enhancement surface 41a may be a spherical surface, an arc surface or an inclined surface.

[0088] These return loss enhancement surfaces 41a can reflect a portion of the light transmitted to the input end 41 of the first photonic lead 40 in a predetermined direction, rather than toward the light output port 10a of the optical transmitter chip 10. This effectively reduces the returned optical power at the input end 41 of the first photonic lead 40, thereby improving the return loss. The return loss enhancement surfaces 41a can be formed by grinding and polishing.

[0089] When the return loss enhancing surface 41 a is a sloped surface, the sloped surface may be set to be a sloped surface inclined at 8° relative to the cross section of the first photonic lead 40 .

[0090] When setting up the light emitter chip 10, refer to Figure 3 、 Figure 4 The optical transmitter chip 10 includes a light emitting unit 11 and an optical waveguide 12 . One end of the optical waveguide 12 is arranged opposite to the light emitting unit 11 , and the other end of the optical waveguide 12 is a light outlet 10 a .

[0091] The light emitting unit 11 is used to generate light, and the optical waveguide 12 is used to transmit the light of the light emitting unit 11 to the light outlet 10a. The light emitter chip 10 having the light emitting unit 11 and the optical waveguide 12 is easy to form and facilitates the generation and transmission of light.

[0092] When configuring the plurality of light emitting units 11 and the plurality of optical waveguides 12 , the plurality of optical waveguides 12 and the plurality of light emitting units 11 are disposed in a one-to-one correspondence, and a plurality of light outlets 10 a are formed.

[0093] When the first photon lead 40 is provided, the first photon lead 40 includes a core wire and a cladding covering the outer peripheral surface of the core wire, and the refractive index of the core wire is greater than the refractive index of the cladding.

[0094] After light enters the core wire, the light may be totally reflected at the cross section between the core wire and the cladding, so that the light is transmitted along the first photon lead 40 .

[0095] The core wire may be a polymer formed by photolithography, and the cladding may be an adhesive layer cured by ultraviolet light. The first photon lead 40 is easy to form.

[0096] See Figures 3 to 6 The optical communication device provided in the embodiment of the present application includes the above-mentioned optical coupling structure. Since the optical communication device adopts all the technical solutions of all the above-mentioned embodiments, it also has the relevant beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be detailed here.

[0097] Figure 7 A schematic diagram of the structure of an optical communication device provided in an embodiment of the present application.

[0098] In some embodiments, see Figure 7The first optical component 50 is a silicon photonic modulator chip. The optical communication device further includes an optical fiber 60 and a second photonic lead 70 . The input end 61 of the optical fiber 60 and the output end 52 of the silicon photonic modulator chip are connected via the second photonic lead 70 .

[0099] The use of PWB technology enables efficient optical coupling between different optical components, ensuring reliable connections and low material and process costs. During operation, light is output from the optical transmitter chip 10 through the optical output port 10a. This light passes through the first photonic lead 40 and enters the silicon photonic modulator chip, where it modulates the light intensity. The light then passes through the second photonic lead 70 and enters the optical fiber 60, where it is transmitted to the other end of the optical fiber 60.

[0100] The light output port 10a of the optical transmitter chip 10 and the input end 51 of the silicon optical modulator chip are arranged adjacent to each other, so that the first photonic lead 40 can be made shorter. The input end 61 of the optical fiber 60 and the output end 52 of the silicon optical modulator chip are arranged adjacent to each other, so that the second photonic lead 70 can be made shorter.

[0101] Exemplarily, the light emitter chip 10 is an indium phosphide laser array having multiple light output ports 10 a. The silicon optical modulator chip has multiple circuits, each with an input terminal 51 and an output terminal 52. The multiple light output ports 10 a of the light emitter chip 10 and the multiple input terminals 51 of the silicon optical modulator chip are connected one-to-one via first photonic leads 40.

[0102] Multiple optical fibers 60 are arranged near the output end 52 of the optical modulator chip, and the input ends 61 of the multiple optical fibers 60 are connected to the multiple output ends 52 of the silicon optical modulator chip in a one-to-one correspondence via second photonic leads 70. This enables the transmission of multiple optical signals.

[0103] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An optical coupling structure, characterized in that: include: A light emitter chip, an anti-reflection film, a connector, a first photon lead, and a first optical component; The anti-reflection film is provided at the light outlet of the light emitter chip, and the refractive index of the anti-reflection film matches the refractive index of air; The input end of the first photon lead is arranged toward the light outlet, and the input end face of the first photon lead is set as a return loss enhancement face; The light outlet and the input end of the first photon lead are connected via the connecting member, and the connecting member has an air cavity for separating the anti-reflection film and the input end of the first photon lead; The output end of the first photon lead is connected to the input end of the first optical component.

2. The optical coupling structure according to claim 1, wherein: The connecting piece and the first photon lead are an integrally formed structure.

3. The optical coupling structure according to claim 1, wherein: The bottom surface of the air cavity has a lead-out groove for connecting the air cavity with the outside, and the lead-out groove is used to lead out the developer in the air cavity.

4. The optical coupling structure according to claim 3, wherein: The lead-out groove is extended along the thickness direction of the light emitter chip; Alternatively, the lead-out groove is extended along a direction inclined at a predetermined angle relative to a thickness direction of the light emitter chip.

5. The optical coupling structure according to any one of claims 1 to 4, characterized in that: The cross-sectional area of ​​the input end of the first photon lead matches the area of ​​the light output spot generated by the light emitter chip.

6. The optical coupling structure according to any one of claims 1 to 4, characterized in that: The return loss enhancement surface is a curved surface or an inclined surface.

7. The optical coupling structure according to any one of claims 1 to 4, characterized in that: The optical transmitter chip includes a light emitting unit and an optical waveguide, one end of the optical waveguide is arranged opposite to the light emitting unit, and the other end of the optical waveguide is the light outlet.

8. The optical coupling structure according to any one of claims 1 to 4, characterized in that: The first photon lead includes a core wire and a cladding covering an outer peripheral surface of the core wire, and the refractive index of the core wire is greater than the refractive index of the cladding.

9. An optical communication device, characterized in that: The optical coupling structure comprises the optical coupling structure according to any one of claims 1 to 8.

10. The optical communication device according to claim 9, wherein The first optical component is a silicon photonic modulator chip. The optical communication device further includes an optical fiber and a second photonic lead. The input end of the optical fiber and the output end of the silicon photonic modulator chip are connected via the second photonic lead.

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