Touch sensor

Abstract

A touch sensor is provided, the touch sensor including: a substrate; a plurality of electrode units on the substrate, each including a plurality of electrode groups, each of the plurality of electrode groups including touch electrodes arranged in a first direction; a first demultiplexer on the substrate, each including a plurality of sub-demultiplexers and each electrically connected to a corresponding one of the plurality of electrode units; a driving pad on the substrate; and a second demultiplexer disposed on the substrate and configured to switch an electrical connection between the first demultiplexer and the driving pad, wherein each of the plurality of sub-demultiplexers is connected to a corresponding one of the plurality of electrode groups, and wherein the plurality of electrode groups includes a first electrode group and a second electrode group, the first electrode group and the second electrode group being adjacent to each other in a second direction that intersects the first direction.

Description

[0001] This application is a divisional application of application No. 201810293000.3 filed with the China National Intellectual Property Office on March 30, 2018 and entitled "Touch Sensor". TECHNICAL FIELD

[0002] The technical field relates to a touch sensor, a driving method of the touch sensor, and a display apparatus including the touch sensor. BACKGROUND

[0003] A display apparatus can include a touch sensor for receiving a touch input of a user in addition to a display unit for displaying an image. The user can conveniently control the display apparatus through the touch sensor.

[0004] Various types of touch sensors are available. For example, a capacitive touch sensor senses a point whose capacitance is changed due to a user's hand or an object touching the point, thereby detecting a touch position. SUMMARY

[0005] Embodiments can minimize the number of pads in a touch sensor by using one or more demultiplexers.

[0006] Embodiments can relate to a touch sensor including: a substrate; electrode units on the substrate, the electrode units each including a plurality of electrode groups; first demultiplexers on the substrate, the first demultiplexers connected to the electrode units, respectively; a driving pad on the substrate; and a second demultiplexer on the substrate, the second demultiplexer connected between the first demultiplexers and the driving pad, wherein each of the electrode groups includes a plurality of touch electrodes, and wherein each of the first demultiplexers includes a sub-demultiplexer connected to the electrode group.

[0007] Each of the electrode units can include a first electrode group, a second electrode group, a third electrode group, and a fourth electrode group.

[0008] The first electrode group and the third electrode group can be disposed adjacent to each other in a first direction. The second electrode group and the fourth electrode group can be disposed adjacent to each other in the first direction.

[0009] The first electrode group and the second electrode group can be disposed adjacent to each other in a second direction intersecting the first direction. The third electrode group and the fourth electrode group can be disposed adjacent to each other in the second direction.

[0010] The first electrode group and the third electrode group can be disposed on an i-th (i is a natural number of 1 or more) column. The second electrode group and the fourth electrode group can be disposed on an i+1-th column.

[0011] Each first demultiplexer can include a first sub-demultiplexer connected to the first electrode group, a second sub-demultiplexer connected to the second electrode group, a third sub-demultiplexer connected to the third electrode group, and a fourth sub-demultiplexer connected to the fourth electrode group.

[0012] Each second demultiplexer can electrically connect the first sub-demultiplexer to the corresponding drive pad during a first time period, electrically connect the second sub-demultiplexer to the corresponding drive pad during a second time period, electrically connect the third sub-demultiplexer to the corresponding drive pad during a third time period, and electrically connect the fourth sub-demultiplexer to the corresponding drive pad during a fourth time period.

[0013] The first sub-demultiplexer can sequentially electrically connect the touch electrodes included in the first electrode group to the corresponding drive pad during the first time period, the second sub-demultiplexer can sequentially electrically connect the touch electrodes included in the second electrode group to the corresponding drive pad during the second time period, the third sub-demultiplexer can sequentially electrically connect the touch electrodes included in the third electrode group to the corresponding drive pad during the third time period, and the fourth sub-demultiplexer can sequentially electrically connect the touch electrodes included in the fourth electrode group to the corresponding drive pad during the fourth time period.

[0014] Operations of the first demultiplexers can be controlled by the same first control signal. Operations of the second demultiplexers can be controlled by the same second control signal.

[0015] The touch sensor can further include a first control pad on the substrate, the first control pad providing the first control signal to the first demultiplexers, and a second control pad on the substrate, the second control pad providing the second control signal to the second demultiplexers.

[0016] The touch sensor can further include a first voltage pad on the substrate, and third demultiplexers connected between the electrode unit and the first voltage pad.

[0017] Each third demultiplexer can include sub-demultiplexers connected to different electrode groups, respectively.

[0018] The touch sensor can further include a second voltage pad on the substrate, and fourth demultiplexers connected between the electrode unit and the second voltage pad.

[0019] Each fourth demultiplexer can include sub-demultiplexers connected to different electrode groups, respectively.

[0020] The first voltage pad can provide a first voltage to the third demultiplexers, and the second voltage pad can provide a second voltage to the fourth demultiplexers. The first voltage can have a higher voltage value than the second voltage.

[0021] The operation of the third demultiplexer can be controlled by the same third control signal. The operation of the fourth demultiplexer can be controlled by the same fourth control signal.

[0022] The touch sensor may also include: a third control pad located on the substrate, the third control pad providing a third control signal to a third demultiplexer; and a fourth control pad located on the substrate, the fourth control pad providing a fourth control signal to a fourth demultiplexer.

[0023] The touch sensor may also include: a connecting member for connecting to the drive pad; and a touch driving unit for supplying drive signals to the drive pad via the connecting member.

[0024] The embodiments may relate to a method for driving a touch sensor. The method may include the steps of: sequentially supplying driving signals to touch electrodes included in each first electrode group during a first time period; sequentially supplying driving signals to touch electrodes included in each second electrode group during a second time period; sequentially supplying driving signals to touch electrodes included in each third electrode group during a third time period; and sequentially supplying driving signals to touch electrodes included in each fourth electrode group during a fourth time period, wherein, during each time period, touch electrodes other than those supplied with driving signals are supplied with a first voltage or a second voltage.

[0025] The first and third electrode groups can be arranged along the first direction. The second and fourth electrode groups can also be arranged along the first direction.

[0026] The first and second electrode groups can be alternately arranged along a second direction intersecting the first direction. The third and fourth electrode groups can be alternately arranged along the second direction.

[0027] The first and third electrode groups can be placed in odd-numbered columns. The second and fourth electrode groups can be placed in even-numbered columns.

[0028] During each time period, some of the other touch electrodes may be supplied with a first voltage, and some of the other touch electrodes may be supplied with a second voltage.

[0029] The first voltage can have a higher voltage value than the second voltage.

[0030] An embodiment may relate to a display device comprising the following elements: a substrate including a first region and a second region; a pixel located on the first region; an encapsulation layer located on the pixel; an electrode unit located on the encapsulation layer, each electrode unit including a plurality of electrode groups; a first demultiplexer located on the second region, the first demultiplexer being connected to the electrode units respectively; a driving pad located on the second region; and a second demultiplexer located on the second region, the second demultiplexer being connected between the first demultiplexer and the driving pad, wherein each electrode group includes a plurality of touch electrodes, and each first demultiplexer includes a sub-demultiplexer connected to the electrode group.

[0031] The display device may also include a display driver located on the second region, the display driver driving pixels.

[0032] Some of the first demultiplexers and some of the second demultiplexers may be located on one side of the display driver. Others of the first demultiplexers and other parts of the second demultiplexers may be located on the other side of the display driver.

[0033] The display device may further include: a connecting member connected to the driving pad; and a touch driving unit that supplies driving signals to the driving pad via the connecting member.

[0034] The display device may further include: a first voltage pad located on the second region; and a third demultiplexer located on the second region, the third demultiplexer being connected between the electrode unit and the first voltage pad.

[0035] The display device may further include: a second voltage pad located on the second region; and a fourth demultiplexer located on the second region, the fourth demultiplexer being connected between the electrode unit and the second voltage pad.

[0036] The first voltage pad can provide a first voltage to the third demultiplexer, and the second voltage pad can provide a second voltage to the fourth demultiplexer. The first voltage can have a higher voltage value than the second voltage.

[0037] An embodiment may relate to a touch sensor. The touch sensor may include a substrate and may include electrode units, a first demultiplexer, a second demultiplexer, and a driving pad, all located on the substrate. Each electrode unit may include multiple electrode groups, and each electrode group includes multiple touch electrodes. Each first demultiplexer may include multiple sub-demultiplexers, each electrically connected to a corresponding electrode unit within the electrode units. Each sub-demultiplexer of a first demultiplexer may be electrically connected to a corresponding electrode group within the electrode group of the corresponding electrode unit. The second demultiplexer may be connected between the first demultiplexer and the driving pad. The driving pad can be electrically connected to the first demultiplexer via the second demultiplexer. Attached Figure Description

[0038] Figure 1A This is a diagram (e.g., a plan view) illustrating a touch sensor according to an embodiment. Figure 1B This illustrates a touch sensor with a touch driving unit according to an embodiment.

[0039] Figure 2 This is a diagram (e.g., a plan view) showing the electrode unit and demultiplexer according to an embodiment.

[0040] Figure 3 This is a diagram illustrating the circuit construction of the first demultiplexer and the second demultiplexer according to an embodiment.

[0041] Figure 4 This is a diagram illustrating the signals provided in the driving method of the touch sensor according to an embodiment.

[0042] Figure 5A , Figure 5B , Figure 5C , Figure 6A , Figure 6B , Figure 6C , Figure 7A , Figure 7B , Figure 7C , Figure 8A , Figure 8B and Figure 8C It is a diagram (e.g., a plan view) showing the touch electrodes activated for different driving time periods.

[0043] Figure 9 This is a diagram (e.g., a plan view) showing the third and fourth demultiplexers according to embodiments.

[0044] Figure 10 This is a diagram illustrating the circuit construction of the third and fourth demultiplexers according to an embodiment.

[0045] Figure 11 This is a diagram (e.g., a plan view) illustrating a display device according to an embodiment.

[0046] Figure 12 It is a diagram (e.g., a plan view and / or block diagram) illustrating the display driver and pixels of a display device according to an embodiment.

[0047] Figure 13 It is shown Figure 12 An illustration of an embodiment of the pixels shown in the diagram.

[0048] Figure 14 This is a diagram (e.g., a plan view) illustrating a display device according to an embodiment.

[0049] Figure 15A and Figure 15BAccording to one or more embodiments along Figure 14 The sectional view taken by line A-A'. Figure 15C According to the embodiments along Figure 14 The sectional view taken by line B-B'.

[0050] Figure 16A This is a diagram (e.g., a plan view) illustrating a display device according to an embodiment.

[0051] Figure 16B This is a diagram illustrating a display device according to an embodiment. Detailed Implementation

[0052] Example embodiments are described with reference to the accompanying drawings. These embodiments can be implemented in different forms. These embodiments are provided for illustrative purposes.

[0053] Although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of one or more embodiments, a first element discussed below may be designated a second element. Describing an element as a “first” element may not require or imply the existence of a second element or other elements. The terms “first,” “second,” etc., may also be used herein to distinguish different categories or groups of elements. For the sake of brevity, the terms “first,” “second,” etc., may respectively represent “first class (or first group),” “second class (or second group),” etc.

[0054] In the specification, when an element is referred to as "connected" or "combined" to another element, the element may be directly connected or combined to the other element, or indirectly connected or combined (e.g., electrically connected) to the other element through one or more intermediate elements. "Signal" may refer to one or more copies of a signal. The same reference numerals may refer to the same elements.

[0055] Figure 1A This is a diagram illustrating the touch sensor 1 according to an embodiment. Figure 1B This illustrates a touch sensor including a touch driving unit according to an embodiment.

[0056] Reference Figure 1A The touch sensor 1 may include a substrate 10, multiple electrode units 100, a demultiplexer (or multiplexer) 200, and multiple drive pads (or solder pads) 310.

[0057] The substrate 10 may include a first region A1 and a second region A2. The first region A1 is the region where the electrode unit 100 is disposed, and may be referred to as the touch effective region.

[0058] In this embodiment, the remaining area located outside the first region A1 can be referred to as the touch-invalid region, and the second region A2 can be defined as at least a portion of the touch-invalid region.

[0059] The second region A2 is the region where the demultiplexer 200 and the drive pad 310 are provided, and it can be located on one side of the first region A1.

[0060] The substrate 10 may be made of an insulating material such as glass or resin. In embodiments, the substrate 10 may be made of a flexible material so that it is bendable or foldable. The substrate 10 may have a single-layer structure or a multi-layer structure.

[0061] For example, the substrate 10 may include at least one of polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, cellulose acetate propionate, and polyurethane.

[0062] In an embodiment, the substrate 10 may be made of glass fiber reinforced plastic (FRP) or the like.

[0063] Electrode units 100 may be located on a first region A1 of substrate 10, and each of electrode units 100 may include a plurality of touch electrodes 110.

[0064] The touch electrode 110 can be activated by a drive signal supplied from the demultiplexer 200.

[0065] Additionally, the touch electrode 110 may include a conductive material. For example, the conductive material may include a metal or alloy. Examples of metals may include gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and platinum (Pt).

[0066] In this embodiment, the touch electrode 110 may be made of a transparent conductive material. Examples of transparent conductive materials may include silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), zinc antimony oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes, and graphene. The touch electrode 110 may have a single-layer structure or a multi-layer structure.

[0067] The demultiplexer 200 may be located on the second region A2 of the substrate 10. In an embodiment, the demultiplexer 200 may selectively electrically connect the touch electrode 110 to the drive pad 310.

[0068] Therefore, the demultiplexer 200 can supply the drive signal applied through the drive pad 310 to the touch electrode 110 in a time-division manner.

[0069] The drive pad 310 may be located on the second region A2 of the substrate 10. In an embodiment, the drive pad 310 may receive a drive signal supplied from an external source.

[0070] For example, in the testing process before product shipment, the drive signal can be supplied to the drive pad via a separate drive unit (not shown).

[0071] In a typical touch sensor, the number of drive pads needs to be equal to the number of touch electrodes in order to supply drive signals to all touch electrodes. Instead, in this embodiment, the demultiplexer 200 is configured such that the number of drive pads 310 can be significantly less than the number of touch electrodes 110. Therefore, the total area of ​​inactive space (i.e., areas not used for displaying images or receiving touches) can be effectively minimized.

[0072] Reference Figure 1B The touch sensor 1 may include a connecting member 450 and a touch driving unit 460.

[0073] The connecting member 450 may be attached to and / or electrically connected to the drive pad 310, and the touch driving unit 460 may supply drive signals to the drive pad 310 through the connecting member 450. In an embodiment, the touch driving unit 460 may be mounted on the connecting member 450.

[0074] In this embodiment, during the testing process prior to product shipment, a separate driving device (not shown) can be used to drive the touch sensor 1, and a touch driving unit 460 can be installed separately after the testing process to drive the touch sensor 1.

[0075] In this embodiment, the connecting member 450 can be implemented as a flexible printed circuit board (FPCB), and the touch driving unit 460 can be implemented as an integrated circuit (IC).

[0076] The touch electrodes 110 described above may be spaced apart from each other. The touch electrodes 110 may output one or more sensing signals representing changes in capacitance to the touch driving unit 460.

[0077] For example, the touch driving unit 460 can receive the sensing signal output from the touch electrode 110 through the demultiplexer 200 and the driving pad 310.

[0078] When a touch is applied to the touch sensor 1, the touch-related self-capacitance of the touch electrode 110 changes. Therefore, the touch driving unit 460 can use the sensing signal output from the touch electrode 110 to detect the touch position.

[0079] Figure 2 This is a diagram illustrating the electrode unit and demultiplexer according to an embodiment.

[0080] Reference Figure 2 Each electrode unit 100 may include multiple electrode groups.

[0081] For example, each electrode unit 100 may include a first electrode group 101, a second electrode group 102, a third electrode group 103, and a fourth electrode group 104.

[0082] Electrode groups 101, 102, 103 and 104 may each include multiple touch electrodes 110.

[0083] In an embodiment, the first electrode group 101 and the third electrode group 103 may be arranged directly adjacent to each other along a first direction (e.g., the Y-axis direction), and the second electrode group 102 and the fourth electrode group 104 may be arranged directly adjacent to each other along the first direction.

[0084] In an embodiment, the first electrode group 101 and the second electrode group 102 may be arranged adjacent to each other along a second direction (e.g., the X-axis direction) different from the first direction, and the third electrode group 103 and the fourth electrode group 104 may be arranged adjacent to each other along the second direction.

[0085] In the embodiment, the first electrode group 101 and the third electrode group 103 can be arranged in the i-th column (i is a natural number of 1 or greater), and the second electrode group 102 and the fourth electrode group 104 can be arranged in the i+1-th column.

[0086] In an embodiment, a plurality of first electrode groups 101 and a plurality of third electrode groups 103 may be arranged in an odd-numbered column, and a plurality of second electrode groups 102 and a plurality of fourth electrode groups 104 may be arranged in an even-numbered column.

[0087] In an embodiment, the demultiplexer 200 may include a plurality of first demultiplexers 210 and a plurality of second demultiplexers 220.

[0088] The first demultiplexer 210 can be connected to the electrode unit 100 respectively. In the embodiment, the first demultiplexer 210 may each include a plurality of sub-demultiplexers 211, 212, 213 and 214 which are electrically connected to the electrode groups 101, 102, 103 and 104 of the corresponding electrode unit 100 respectively.

[0089] For example, the first demultiplexer 210 may include a first sub-demultiplexer 211, a second sub-demultiplexer 212, a third sub-demultiplexer 213, and a fourth sub-demultiplexer 214.

[0090] The first sub-demultiplexer 211 can be connected between the corresponding first electrode group 101 and the corresponding second demultiplexer 220. In an embodiment, the first sub-demultiplexer 211 can selectively connect the touch electrode 110 of the corresponding first electrode group 101 to the corresponding second demultiplexer 220.

[0091] The second sub-demultiplexer 212 can be connected between the corresponding second electrode group 102 and the corresponding second demultiplexer 220. In an embodiment, the second sub-demultiplexer 212 can selectively connect the touch electrode 110 of the corresponding second electrode group 102 to the corresponding second demultiplexer 220.

[0092] The third sub-demultiplexer 213 can be connected between the corresponding third electrode group 103 and the corresponding second demultiplexer 220. In an embodiment, the third sub-demultiplexer 213 can selectively connect the touch electrode 110 of the corresponding third electrode group 103 to the corresponding second demultiplexer 220.

[0093] The fourth sub-demultiplexer 214 can be connected between the corresponding fourth electrode group 104 and the corresponding second demultiplexer 220. In an embodiment, the fourth sub-demultiplexer 214 can selectively connect the touch electrode 110 of the corresponding fourth electrode group 104 to the corresponding second demultiplexer 220.

[0094] The second demultiplexer 220 can be connected between the first demultiplexer 210 and the drive pad 310.

[0095] The second demultiplexer 220 can selectively connect the sub-demultiplexers 211, 212, 213 and 214 of the corresponding first demultiplexer 210 to the corresponding drive pad 310.

[0096] For example, each second demultiplexer 220 may electrically connect the corresponding first sub-demultiplexer 211 to the corresponding drive pad 310 during a first time period, (then) during a second time period, connect the corresponding second sub-demultiplexer 212 to the drive pad 310, (then) during a third time period, connect the corresponding third sub-demultiplexer 213 to the drive pad 310, and (then) during a fourth time period, connect the corresponding fourth sub-demultiplexer 214 to the drive pad 310.

[0097] In an embodiment, each first sub-demultiplexer 211 may sequentially connect a touch electrode 110 included in a corresponding first electrode group 101 to a drive pad 310 during a first time period, and (subsequently) each second sub-demultiplexer 212 may sequentially connect a touch electrode 110 included in a corresponding second electrode group 102 to a drive pad 310 during a second time period.

[0098] In an embodiment, each third sub-demultiplexer 213 may sequentially connect the touch electrode 110 included in the corresponding third electrode group 103 to the drive pad 310 during a third time period, and each fourth sub-demultiplexer 214 may sequentially connect the touch electrode 110 included in the corresponding fourth electrode group 104 to the drive pad 310 during a fourth time period.

[0099] In an embodiment, the operation of the first demultiplexer 210 can be controlled by the same first control signal Cs1 (a copy), and the operation of the second demultiplexer 220 can be controlled by the same second control signal Cs2 (a copy).

[0100] Figure 3 This is a diagram illustrating the circuit construction of the first demultiplexer and the second demultiplexer according to an embodiment. Figure 3 The diagram shows an electrode unit 100, a first demultiplexer 210, and a second demultiplexer 220 associated with a drive pad 310.

[0101] Reference Figure 3 The first sub-demultiplexer 211 may include multiple transistors T11, T12 to T1n.

[0102] Transistors T11 to T1n can be connected between the touch electrode 110 of the first electrode group 101 and the second demultiplexer 220.

[0103] Transistors T11 to T1n can be arranged in the same number as the number of touch electrodes 110 included in the first electrode group 101. In an embodiment, n transistors T11 to T1n can be connected one-to-one with the n touch electrodes 110 included in the first electrode group 101, where n is a natural number.

[0104] For example, the first electrodes of transistors T11 to T1n can be connected to the touch electrode 110 of the first electrode group 101 respectively, and the second electrodes of transistors T11 to T1n can be connected together to the first transistor M1 of the second demultiplexer 220.

[0105] In an embodiment, the gate electrodes of transistors T11 to T1n can be connected to the first control pad 321, respectively.

[0106] Therefore, transistors T11 to T1n can be turned on in response to the electrode selection signals Es1, Es2 to Esn supplied from the first control pad 321.

[0107] The second sub-demultiplexer 212 may include multiple transistors T21, T22 to T2n.

[0108] Transistors T21 to T2n can be connected between the touch electrode 110 of the second electrode group 102 and the second demultiplexer 220.

[0109] Transistors T21 to T2n can be arranged in the same number as the number of touch electrodes 110 included in the second electrode group 102. In an embodiment, n transistors T21 to T2n can be connected one-to-one with the n touch electrodes 110 included in the second electrode group 102.

[0110] For example, the first electrodes of transistors T21 to T2n can be connected to the touch electrode 110 of the second electrode group 102 respectively, and the second electrodes of transistors T21 to T2n can be connected together to the second transistor M2 of the second demultiplexer 220.

[0111] In an embodiment, the gate electrodes of transistors T21 to T2n can be connected to the first control pad 321, respectively.

[0112] Therefore, transistors T21 to T2n can be turned on in response to electrode selection signals Es1 to Esn supplied from the first control pad 321.

[0113] The third sub-demultiplexer 213 may include multiple transistors T31, T32 to T3n.

[0114] Transistors T31 to T3n can be connected between the touch electrode 110 of the third electrode group 103 and the second demultiplexer 220.

[0115] Transistors T31 to T3n can be arranged in the same number as the number of touch electrodes 110 included in the third electrode group 103. In an embodiment, n transistors T31 to T3n can be connected one-to-one with the n touch electrodes 110 included in the third electrode group 103.

[0116] For example, the first electrodes of transistors T31 to T3n can be connected to the touch electrode 110 of the third electrode group 103 respectively, and the second electrodes of transistors T31 to T3n can be connected together to the third transistor M3 of the second demultiplexer 220.

[0117] In an embodiment, the gate electrodes of transistors T31 to T3n can be connected to the first control pad 321, respectively.

[0118] Therefore, transistors T31 to T3n can be turned on in response to electrode selection signals Es1 to Esn supplied from the first control pad 321.

[0119] The fourth sub-demultiplexer 214 may include multiple transistors T41, T42 to T4n.

[0120] Transistors T41 to T4n can be connected between the touch electrode 110 of the fourth electrode group 104 and the second demultiplexer 220.

[0121] Transistors T41 to T4n can be arranged in the same number as the number of touch electrodes 110 included in the fourth electrode group 104. In an embodiment, n transistors T41 to T4n can be connected one-to-one with the n touch electrodes 110 included in the fourth electrode group 104.

[0122] For example, the first electrodes of transistors T41 to T4n can be connected to the touch electrode 110 of the fourth electrode group 104 respectively, and the second electrodes of transistors T41 to T4n can be connected together to the fourth transistor M4 of the second demultiplexer 220.

[0123] In an embodiment, the gate electrodes of transistors T41 to T4n can be connected to the first control pad 321, respectively.

[0124] Therefore, transistors T41 to T4n can be turned on in response to electrode selection signals Es1 to Esn supplied from the first control pad 321.

[0125] The second demultiplexer 220 may include multiple transistors M1, M2, M3 and M4.

[0126] Transistors M1 to M4 can be connected between the drive pad 310 and the sub-demultiplexers 211, 212, 213 and 214 of the first demultiplexer 210.

[0127] For example, the first electrode of the first transistor M1 can be connected to transistors T11 to T1n of the first sub-demultiplexer 211, and the second electrode of the first transistor M1 can be connected to the drive pad 310.

[0128] In an embodiment, the first electrode of the second transistor M2 can be connected to transistors T21 to T2n of the second sub-demultiplexer 212, and the second electrode of the second transistor M2 can be connected to the drive pad 310.

[0129] In an embodiment, the first electrode of the third transistor M3 can be connected to transistors T31 to T3n of the third sub-demultiplexer 213, and the second electrode of the third transistor M3 can be connected to the drive pad 310.

[0130] In an embodiment, the first electrode of the fourth transistor M4 can be connected to transistors T41 to T4n of the fourth sub-demultiplexer 214, and the second electrode of the fourth transistor M4 can be connected to the drive pad 310.

[0131] The gate electrodes of the first transistor M1 to the fourth transistor M4 can be connected to the second control pad 322 respectively.

[0132] Therefore, the first transistor M1 to the fourth transistor M4 can be turned on in response to the group selection signals Gs1, Gs2, Gs3 and Gs4 supplied from the second control pad 322.

[0133] The first control pad 321 may be located on the second region A2 of the substrate 10. In an embodiment, the first control pad 321 may receive a first control signal Cs1 supplied from an external source. For example, the first control signal Cs1 may include electrode selection signals Es1 to Esn.

[0134] The second control pad 322 may be located on the second region A2 of the substrate 10. In an embodiment, the second control pad 322 may receive a second control signal Cs2 supplied from an external source. For example, the second control signal Cs2 may include group selection signals Gs1 to Gs4.

[0135] In an embodiment, during the testing process prior to product shipment, control signals Cs1 and Cs2 can be supplied to control pads 321 and 322 via separate drive devices (not shown).

[0136] In one embodiment, the connecting member 450 can be attached to the control pads 321 and 322 after the test process, and the touch driving unit 460 can supply control signals Cs1 and Cs2 to the control pads 321 and 322 through the connecting member 450.

[0137] Figure 4 This is a diagram illustrating the signals used in the driving method of the touch sensor according to an embodiment. Figures 5A to 8C This is a diagram illustrating the touch electrodes activated for different driving time periods. Specifically, in Figures 5A to 8C In the middle, the touch electrode 110, which is supplied with a copy of the signal Ds, is represented by black.

[0138] In the following text, reference will be made to Figure 3 , Figure 4 , Figures 5A to 8C A driving method for touch sensor 1 according to an embodiment is described.

[0139] Reference Figure 4 The driving method of the touch sensor 1 according to the embodiment can be executed during the driving time period divided into a first time period P1, a second time period P2, a third time period P3 and a fourth time period P4.

[0140] First, during the driving time period P1 to P4 of the touch sensor 1, the driving signal Ds can be continuously supplied to the driving pad 310.

[0141] The first set of selection signals Gs1 can be supplied to the second demultiplexer 220 during the first time period P1.

[0142] Therefore, the first transistor M1 of the second demultiplexer 220 can be turned on, and thus, the drive signal Ds can be supplied to the first sub-demultiplexer 211.

[0143] In the embodiment, since electrode selection signals Es1 to Esn are supplied sequentially during the first time period P1, transistors T11 to T1n included in the first sub-demultiplexer 211 can also be turned on sequentially.

[0144] Therefore, the drive signal Ds can be sequentially supplied to the touch electrode 110 included in the first electrode group 101.

[0145] In an embodiment, such as Figures 5A to 5C As shown, the touch electrode 110, which is included in the first electrode group 101, can be sequentially supplied with a drive signal Ds to be activated.

[0146] In an embodiment, the second set of selection signals Gs2 can be supplied to the second demultiplexer 220 during the second time period P2.

[0147] Therefore, the second transistor M2 of the second demultiplexer 220 can be turned on, and thus, the drive signal Ds can be supplied to the second sub-demultiplexer 212.

[0148] In the embodiment, since electrode selection signals Es1 to Esn are supplied sequentially during the second time period P2, transistors T21 to T2n included in the second sub-demultiplexer 212 can also be turned on sequentially.

[0149] Therefore, the drive signal Ds can be sequentially supplied to the touch electrode 110 included in the second electrode group 102.

[0150] like Figures 6A to 6C As shown, the touch electrode 110, which is included in the second electrode group 102, can be sequentially supplied with a drive signal Ds to be activated.

[0151] In an embodiment, the third set of selection signals Gs3 can be supplied to the second demultiplexer 220 during the third time period P3.

[0152] Therefore, the third transistor M3 of the second demultiplexer 220 can be turned on, and thus, the drive signal Ds can be supplied to the third sub-demultiplexer 213.

[0153] In the embodiment, since electrode selection signals Es1 to Esn are supplied sequentially during the third time period P3, transistors T31 to T3n included in the third sub-demultiplexer 213 can also be turned on sequentially.

[0154] Therefore, the drive signal Ds can be sequentially supplied to the touch electrode 110 included in the third electrode group 103.

[0155] In an embodiment, such as Figures 7A to 7C As shown, the touch electrode 110, included in the third electrode group 103, can be sequentially supplied with a drive signal Ds to be activated.

[0156] In one embodiment, the fourth selection signal Gs4 can be supplied to the second demultiplexer 220 during the fourth time period P4.

[0157] Therefore, the fourth transistor M4 of the second demultiplexer 220 can be turned on, and thus, the drive signal Ds can be supplied to the fourth sub-demultiplexer 214.

[0158] In the embodiment, since electrode selection signals Es1 to Esn are supplied sequentially during the fourth time period P4, transistors T41 to T4n included in the fourth sub-demultiplexer 214 can also be turned on sequentially.

[0159] Therefore, the drive signal Ds can be sequentially supplied to the touch electrode 110 included in the fourth electrode group 104.

[0160] In an embodiment, such as Figures 8A to 8C As shown, the touch electrode 110, included in the fourth electrode group 104, can be sequentially supplied with a drive signal Ds to be activated.

[0161] Figure 9 This is a diagram illustrating the third and fourth demultiplexers according to an embodiment.

[0162] Reference Figure 9 The demultiplexer 200 may also include a third demultiplexer 230 and a fourth demultiplexer 240.

[0163] The third demultiplexer 230 can be connected to the electrode unit 100 respectively. In the embodiment, the third demultiplexer 230 may each include a plurality of sub-demultiplexers 231, 232, 233 and 234 respectively connected to the electrode groups 101, 102, 103 and 104 of the corresponding electrode unit 100.

[0164] For example, the third demultiplexer 230 may include a first sub-demultiplexer 231, a second sub-demultiplexer 232, a third sub-demultiplexer 233, and a fourth sub-demultiplexer 234.

[0165] The first sub-demultiplexer 231 can be connected to the first electrode group 101 and is supplied with a first voltage V1. In an embodiment, the first sub-demultiplexer 231 can selectively supply the first voltage V1 supplied thereto to the touch electrode 110 included in the first electrode group 101.

[0166] The second sub-demultiplexer 232 can be connected to the second electrode group 102 and is supplied with a first voltage V1. In an embodiment, the second sub-demultiplexer 232 can selectively supply the first voltage V1 supplied to it to the touch electrode 110 included in the second electrode group 102.

[0167] The third sub-demultiplexer 233 can be connected to the third electrode group 103 and is supplied with a first voltage V1. In an embodiment, the third sub-demultiplexer 233 can selectively supply the first voltage V1 supplied to it to the touch electrode 110 included in the third electrode group 103.

[0168] The fourth sub-demultiplexer 234 can be connected to the fourth electrode group 104 and is supplied with a first voltage V1. In an embodiment, the fourth sub-demultiplexer 234 can selectively supply the first voltage V1 supplied to it to the touch electrode 110 included in the fourth electrode group 104.

[0169] The fourth demultiplexer 240 can be connected to the electrode unit 100. In an embodiment, the fourth demultiplexer 240 may each include multiple demultiplexers 241, 242, 243 and 244 that are respectively connected to the electrode groups 101, 102, 103 and 104 of the corresponding electrode unit 100.

[0170] For example, each fourth demultiplexer 240 may include a first sub-demultiplexer 241, a second sub-demultiplexer 242, a third sub-demultiplexer 243, and a fourth sub-demultiplexer 244.

[0171] The first sub-demultiplexer 241 can be connected to the first electrode group 101 and is supplied with a second voltage V2. In an embodiment, the first sub-demultiplexer 241 can selectively supply the second voltage V2 supplied thereto to the touch electrode 110 included in the first electrode group 101.

[0172] The second sub-demultiplexer 242 can be connected to the second electrode group 102 and is supplied with a second voltage V2. In an embodiment, the second sub-demultiplexer 242 can selectively supply the second voltage V2 supplied thereto to the touch electrode 110 included in the second electrode group 102.

[0173] The third sub-demultiplexer 243 can be connected to the third electrode group 103 and is supplied with a second voltage V2. In an embodiment, the third sub-demultiplexer 243 can selectively supply the second voltage V2 supplied to it to the touch electrode 110 included in the third electrode group 103.

[0174] The fourth sub-demultiplexer 244 can be connected to the fourth electrode group 104 and is supplied with a second voltage V2. In an embodiment, the fourth sub-demultiplexer 244 can selectively supply the second voltage V2 supplied thereto to the touch electrode 110 included in the fourth electrode group 104.

[0175] Here, the voltage value of the first voltage V1 can be higher than the voltage value of the second voltage V2. For example, the second voltage V2 can be set to ground voltage.

[0176] In this embodiment, the operation of the third demultiplexer 230 can be controlled by the same third control signal Cs3, and the operation of the fourth demultiplexer 240 can be controlled by the same fourth control signal Cs4.

[0177] Figure 10 This is a diagram illustrating the circuit construction of the third and fourth demultiplexers according to an embodiment. Figure 10 The diagram shows an electrode unit 100, a first demultiplexer 210, a second demultiplexer 220, a third demultiplexer 230, and a fourth demultiplexer 240 associated with a drive pad 310.

[0178] Reference Figure 10 The first sub-demultiplexer 231 of the third demultiplexer 230 may include a plurality of transistors A11, A12 to A1n.

[0179] Transistors A11 to A1n can be connected between the touch electrode 110 of the first electrode group 101 and the first voltage pad 331.

[0180] Transistors A11 to A1n can be arranged in the same number as the number of touch electrodes 110 included in the first electrode group 101. In an embodiment, n transistors A11 to A1n can be connected one-to-one with the n touch electrodes 110 included in the first electrode group 101.

[0181] For example, the first electrodes of transistors A11 to A1n can be connected to the touch electrode 110 of the first electrode group 101 respectively, and the second electrodes of transistors A11 to A1n can be connected together to the first voltage pad 331.

[0182] In an embodiment, the gate electrodes of transistors A11 to A1n can be connected to the third control pad 323, respectively.

[0183] Therefore, transistors A11 to A1n can be turned on in response to the electrode selection signals Ea1, Ea2 to Ean supplied from the third control pad 323.

[0184] The second sub-demultiplexer 232 of the third demultiplexer 230 may include a plurality of transistors A21, A22 to A2n.

[0185] Transistors A21 to A2n can be connected between the first voltage pad 331 and the touch electrode 110 of the second electrode group 102.

[0186] Transistors A21 to A2n can be arranged in the same number as the number of touch electrodes 110 included in the second electrode group 102. In an embodiment, n transistors A21 to A2n can be connected one-to-one with n touch electrodes 110 included in the second electrode group 102.

[0187] For example, the first electrodes of transistors A21 to A2n can be connected to the touch electrode 110 of the second electrode group 102 respectively, and the second electrodes of transistors A21 to A2n can be connected together to the first voltage pad 331.

[0188] In an embodiment, the gate electrodes of transistors A21 to A2n can be connected to the third control pad 323, respectively.

[0189] Therefore, transistors A21 to A2n can be turned on in response to electrode selection signals Ea1 to Ean supplied from the third control pad 323.

[0190] The third sub-demultiplexer 233 of the third demultiplexer 230 may include a plurality of transistors A31, A32 to A3n.

[0191] Transistors A31 to A3n can be connected between the first voltage pad 331 and the touch electrode 110 of the third electrode group 103.

[0192] Transistors A31 to A3n can be arranged in the same number as the number of touch electrodes 110 included in the third electrode group 103. In an embodiment, n transistors A31 to A3n can be connected one-to-one with n touch electrodes 110 included in the third electrode group 103.

[0193] For example, the first electrodes of transistors A31 to A3n can be connected to the touch electrode 110 of the third electrode group 103 respectively, and the second electrodes of transistors A31 to A3n can be connected together to the first voltage pad 331.

[0194] In an embodiment, the gate electrodes of transistors A31 to A3n can be connected to the third control pad 323, respectively.

[0195] Therefore, transistors A31 to A3n can be turned on in response to electrode selection signals Ea1 to Ean supplied from the third control pad 323.

[0196] The fourth sub-demultiplexer 234 of the third demultiplexer 230 may include a plurality of transistors A41, A42 to A4n.

[0197] Transistors A41 to A4n can be connected between the first voltage pad 331 and the touch electrode 110 of the fourth electrode group 104.

[0198] Transistors A41 to A4n can be arranged in the same number as the number of touch electrodes 110 included in the fourth electrode group 104. In an embodiment, n transistors A41 to A4n can be connected one-to-one with n touch electrodes 110 included in the fourth electrode group 104.

[0199] For example, the first electrodes of transistors A41 to A4n can be connected to the touch electrode 110 of the fourth electrode group 104 respectively, and the second electrodes of transistors A41 to A4n can be connected together to the first voltage pad 331.

[0200] In an embodiment, the gate electrodes of transistors A41 to A4n can be connected to the third control pad 323, respectively.

[0201] Therefore, transistors A41 to A4n can be turned on in response to electrode selection signals Ea1 to Ean supplied from the third control pad 323.

[0202] The first sub-demultiplexer 241 of the fourth demultiplexer 240 may include a plurality of transistors B11, B12 to B1n.

[0203] Transistors B11 to B1n can be connected between the second voltage pad 332 and the touch electrode 110 of the first electrode group 101.

[0204] Transistors B11 to B1n can be arranged in the same number as the number of touch electrodes 110 included in the first electrode group 101. In an embodiment, n transistors B11 to B1n can be connected one-to-one with the n touch electrodes 110 included in the first electrode group 101.

[0205] For example, the first electrodes of transistors B11 to B1n can be connected to the touch electrode 110 of the first electrode group 101 respectively, and the second electrodes of transistors B11 to B1n can be connected together to the second voltage pad 332.

[0206] In an embodiment, the gate electrodes of transistors B11 to B1n can be connected to the fourth control pad 324, respectively.

[0207] Therefore, transistors B11 to B1n can be turned on in response to the electrode selection signals Eb1, Eb2 to Ebn supplied from the fourth control pad 324.

[0208] The second sub-demultiplexer 242 of the fourth demultiplexer 240 may include a plurality of transistors B21, B22 to B2n.

[0209] Transistors B21 to B2n can be connected between the second voltage pad 332 and the touch electrode 110 of the second electrode group 102.

[0210] Transistors B21 to B2n can be arranged in the same number as the number of touch electrodes 110 included in the second electrode group 102. In an embodiment, n transistors B21 to B2n can be connected one-to-one with n touch electrodes 110 included in the second electrode group 102.

[0211] For example, the first electrodes of transistors B21 to B2n can be connected to the touch electrode 110 of the second electrode group 102 respectively, and the second electrodes of transistors B21 to B2n can be connected together to the second voltage pad 332.

[0212] In an embodiment, the gate electrodes of transistors B21 to B2n can be connected to the fourth control pad 324, respectively.

[0213] Therefore, transistors B21 to B2n can be turned on in response to electrode selection signals Eb1 to Ebn supplied from the fourth control pad 324.

[0214] The third sub-demultiplexer 243 of the fourth demultiplexer 240 may include a plurality of transistors B31, B32 to B3n.

[0215] Transistors B31 to B3n can be connected between the second voltage pad 332 and the touch electrode 110 of the third electrode group 103.

[0216] Transistors B31 to B3n can be arranged in the same number as the number of touch electrodes 110 included in the third electrode group 103. In an embodiment, n transistors B31 to B3n can be connected one-to-one with n touch electrodes 110 included in the third electrode group 103.

[0217] For example, the first electrodes of transistors B31 to B3n can be connected to the touch electrode 110 of the third electrode group 103 respectively, and the second electrodes of transistors B31 to B3n can be connected together to the second voltage pad 332.

[0218] In an embodiment, the gate electrodes of transistors B31 to B3n can be connected to the fourth control pad 324, respectively.

[0219] Therefore, transistors B31 to B3n can be turned on in response to electrode selection signals Eb1 to Ebn supplied from the fourth control pad 324.

[0220] The fourth sub-demultiplexer 244 of the fourth demultiplexer 240 may include a plurality of transistors B41, B42 to B4n.

[0221] Transistors B41 to B4n can be connected between the second voltage pad 332 and the touch electrode 110 of the fourth electrode group 104.

[0222] Transistors B41 to B4n can be arranged in the same number as the number of touch electrodes 110 included in the fourth electrode group 104. In an embodiment, n transistors B41 to B4n can be connected one-to-one with n touch electrodes 110 included in the fourth electrode group 104.

[0223] For example, the first electrodes of transistors B41 to B4n can be connected to the touch electrode 110 of the fourth electrode group 104 respectively, and the second electrodes of transistors B41 to B4n can be connected together to the second voltage pad 332.

[0224] In an embodiment, the gate electrodes of transistors B41 to B4n can be connected to the fourth control pad 324, respectively.

[0225] Therefore, transistors B41 to B4n can be turned on in response to electrode selection signals Eb1 to Ebn supplied from the fourth control pad 324.

[0226] The third control pad 323 may be located on the second region A2 of the substrate 10. In an embodiment, the third control pad 323 may receive a third control signal Cs3 supplied from an external source. For example, the third control signal Cs3 may include electrode selection signals Ea1 to Ean.

[0227] The fourth control pad 324 may be located on the second region A2 of the substrate 10. In an embodiment, the fourth control pad 324 may receive a fourth control signal Cs4 supplied from an external source. For example, the fourth control signal Cs4 may include electrode selection signals Eb1 to Ebn.

[0228] In an embodiment, during the testing process prior to product shipment, control signals Cs3 and Cs4 can be supplied to control pads 323 and 324 via separate drive devices (not shown).

[0229] In one embodiment, the connecting member 450 can be attached to the control pads 323 and 324 after the testing process, and the touch driving unit 460 can supply control signals Cs3 and Cs4 to the control pads 323 and 324 through the connecting member 450.

[0230] According to the above configuration, the third demultiplexer 230 can supply the first voltage V1 to some touch electrodes 110 that did not receive the drive signal Ds during the drive time period, and the fourth demultiplexer 240 can supply the second voltage V2 to other touch electrodes 110 that did not receive the drive signal Ds during the drive time period.

[0231] For example, all touch electrodes 110 except the one currently supplied with the drive signal Ds can be supplied with a first voltage V1 or a second voltage V2 during the drive time period.

[0232] In this embodiment, all touch electrodes 110 except the one currently supplied with the drive signal Ds can be set to a floating state. In this embodiment, all touch electrodes 110 except the one currently supplied with the drive signal Ds can be set to a specific voltage to minimize interference between touch signals, thereby improving touch sensitivity.

[0233] For example, regarding the above Figure 4 During each time period P1, P2, P3 or P4, the touch electrode 110, in addition to the touch electrode 110 currently supplied with the drive signal Ds, can be supplied with at least one of the first voltage V1 and the second voltage V2.

[0234] In this embodiment, some touch electrodes 110 that are not currently receiving the drive signal Ds may be supplied with a first voltage V1, and other touch electrodes 110 that are not currently receiving the drive signal Ds may be supplied with a second voltage V2.

[0235] Figure 11 This is a diagram showing the display device 2 according to an embodiment.

[0236] Reference Figure 11 The display device 2 may include a substrate 10, a pixel 410, an encapsulation layer 420, and a display driver 430.

[0237] The substrate 10 may include a first region A1 and a second region A2. The first region A1 is an area provided with pixels 410 and may be referred to as a display area for displaying an image. The display area may correspond to the aforementioned touch-enabled area.

[0238] In this embodiment, the remaining area located outside the first region A1 can be referred to as the non-display region, and the second region A2 can be defined as a portion of the non-display region.

[0239] The second area A2 is the area where the display driver 430 is located, and it can be located on one side of the first area A1.

[0240] In an embodiment, the substrate 10 may further include a curved region BA located between the first region A1 and the second region A2.

[0241] The curved region BA refers to the portion of the base 10 that is curved therein. Due to the curved region BA, the second region A2 can be located adjacent to the rear surface of the base 10.

[0242] Pixel 410 may be located on the first region A1 of the substrate 10, and each pixel 410 emits light of a specific color, so that a predetermined image can be provided to the user.

[0243] An encapsulation layer 420 may be formed on the pixel 410 to cover and protect the pixel 410.

[0244] In this embodiment, the encapsulation layer 420 can prevent the pixel 410 from being exposed to moisture, oxygen, etc., thereby preventing damage to the pixel 410.

[0245] In an embodiment, the encapsulation layer 420 may be formed as a structure comprising multiple stacked layers. For example, the encapsulation layer 420 may include at least one organic layer (not shown) and at least one inorganic layer (not shown).

[0246] When the encapsulation layer 420 is formed as a multilayer structure, organic and inorganic layers can be stacked alternately.

[0247] The display driver 430 may be located on the second region A2 of the substrate 10. The display driver 430 may control the emission operation of the pixel 410.

[0248] Figure 12 This is a diagram illustrating a display driver and pixels according to an embodiment.

[0249] Reference Figure 12 Pixel 410 can be connected to data lines D1, D2, D3, D4 to Dq and scan lines S1, S2, S3, S4 to Sp-1, Sp. For example, pixels 410 can be arranged in a matrix at the intersection of data lines D1 to Dq and scan lines S1 to Sp.

[0250] Pixel 410 can be supplied with data signals and scan signals via data lines D1 to Dq and scan lines S1 to Sp.

[0251] In an embodiment, pixel 410 may be connected to a first power supply ELVDD and a second power supply ELVSS.

[0252] Each pixel 410 may include a light-emitting device (e.g., an organic light-emitting diode). Each pixel 410 may generate light corresponding to a data signal by a current flowing from a first power supply ELVDD through the light-emitting device to a second power supply ELVSS.

[0253] Display driver 430 may include scan driver 431, data driver 432, and timing controller 435.

[0254] The scan driver 431 can supply scan signals to scan lines S1 to Sp in response to the scan driver control signal SCS. For example, the scan driver 431 can sequentially supply scan signals to scan lines S1 to Sp.

[0255] The data driver 432 can generate a data signal by receiving the data driver control signal DCS and image data DATA input from the timing controller 435.

[0256] The data driver 432 can supply the generated data signals to data lines D1 to Dq.

[0257] If a scan signal is supplied to a specific scan line, some pixels 410 connected to that specific scan line can receive the data signal supplied from data lines D1 to Dq. Some pixels 410 can emit light with a brightness corresponding to the received data signal.

[0258] The timing controller 435 can generate control signals for controlling the scan driver 431 and the data driver 432.

[0259] For example, the control signals may include a scan driver control signal SCS for controlling the scan driver 431 and a data driver control signal DCS for controlling the data driver 432.

[0260] In an embodiment, the timing controller 435 can use external input signals to generate scan driver control signal SCS and data driver control signal DCS.

[0261] In an embodiment, the timing controller 435 can supply the scan driver control signal SCS to the scan driver 431 and the data driver control signal DCS to the data driver 432.

[0262] The timing controller 435 can convert externally input image data into image data DATA of a specification suitable for the data driver 432, and supply the image data DATA to the data driver 432.

[0263] The scan driver 431, the data driver 432, and the timing controller 435 can be formed in a single integrated circuit (IC).

[0264] Figure 13 It is shown Figure 12 An illustration of an embodiment of pixels is shown. Specifically, for ease of description, Figure 13The image shows pixel 410 connected to the p-th scan line Sp and the q-th data line Dq.

[0265] First, refer to Figure 13 Pixel 410 includes an organic light-emitting diode (OLED) and a pixel circuit PC combined with the qth data line Dq and the pth scan line Sp to control the OLED.

[0266] The anode of an organic light-emitting diode (OLED) can be connected to the pixel circuit PC, and the cathode of an OLED can be connected to a second power supply ELVSS.

[0267] Organic light-emitting diodes (OLEDs) can generate light with a predetermined brightness in response to the current supplied from pixel circuits (PCs).

[0268] When a scan signal is supplied to the p-th scan line Sp, the pixel circuit PC can store the data signal supplied to the q-th data line Dq. The pixel circuit PC can then control the amount of current supplied to the organic light-emitting diode (OLED) according to the stored data signal.

[0269] For example, the pixel circuit PC may include a first transistor M1, a second transistor M2, and a storage capacitor Cst.

[0270] The first transistor M1 can be connected between the q-th data line Dq and the second transistor M2.

[0271] For example, the gate electrode of the first transistor M1 can be connected to the p-th scan line Sp, the first electrode of the first transistor M1 can be connected to the q-th data line Dq, and the second electrode of the first transistor M1 can be connected to the gate electrode of the second transistor M2.

[0272] When the scan signal is supplied to the p-th scan line Sp, the first transistor M1 can be turned on to supply the data signal from the q-th data line Dq to the storage capacitor Cst.

[0273] In an embodiment, the storage capacitor Cst may be charged with a voltage corresponding to the data signal.

[0274] The second transistor M2 can be connected between the first power supply ELVDD and the organic light-emitting diode OLED.

[0275] For example, the gate electrode of the second transistor M2 can be connected to the first electrode of the storage capacitor Cst and the second electrode of the first transistor M1, the first electrode of the second transistor M2 can be connected to the second electrode of the storage capacitor Cst and the first power supply ELVDD, and the second electrode of the second transistor M2 can be connected to the anode of the organic light-emitting diode OLED.

[0276] The second transistor M2 is a driving transistor, and can control the amount of current flowing from the first power supply ELVDD to the second power supply ELVSS via the organic light-emitting diode OLED, corresponding to the voltage value stored in the storage capacitor Cst.

[0277] In one embodiment, the organic light-emitting diode (OLED) can generate light corresponding to the amount of current supplied from the second transistor M2.

[0278] Here, the first electrode of each of transistors M1 and M2 can be set as either the source electrode or the drain electrode, and the second electrode of each of transistors M1 and M2 can be set as an electrode different from the first electrode. For example, if the first electrode is set as the source electrode, the second electrode can be set as the drain electrode.

[0279] In an embodiment, Figure 13 The diagram illustrates the case where transistors M1 and M2 are PMOS transistors. However, in another embodiment, transistors M1 and M2 can be implemented as NMOS transistors.

[0280] Figure 13 The pixel structure described above is merely an embodiment, and pixel 410 is not limited to the described pixel structure. In fact, pixel 410 may have a circuit structure that can supply current to the organic light-emitting diode (OLED), and may be selected from any of the various structures currently known in the art.

[0281] The first power supply ELVDD can be a high-potential power supply, and the second power supply ELVSS can be a low-potential power supply.

[0282] For example, the first power supply ELVDD can be set to a positive voltage, and the second power supply ELVSS can be set to a negative voltage or ground voltage.

[0283] Figure 14 This is a diagram illustrating a display device according to an embodiment.

[0284] Reference Figure 14 The display device 2 according to the embodiment may also include a touch electrode 110, demultiplexers 200a and 200b, and a drive pad 310.

[0285] The touch electrode 110 may be located on the encapsulation layer 420. As described above, the touch electrode 110 may constitute a plurality of electrode groups 101, 102, 103 and 104 and an electrode unit 100.

[0286] Demultiplexers 200a and 200b may be located on the second region A2 of the substrate 10. In an embodiment, demultiplexers 200a and 200b may selectively electrically connect the touch electrode 110 to the drive pad 310.

[0287] In an embodiment, to effectively utilize the non-display area, a portion 200a of the demultiplexers 200a and 200b can be disposed on the first side of the display driver 430, and the other portion 200b of the demultiplexers 200a and 200b can be disposed on the second side of the display driver 430 opposite to the first side of the display driver 430. According to the above configuration, the total area of ​​unnecessary inactive space (i.e., areas not used for displaying images or receiving touches) can be minimized.

[0288] For example, some of the first demultiplexers 210 and some of the second demultiplexers 220 may be located on the first side of the display driver 430, while the remaining first demultiplexers 210 and the remaining second demultiplexers 220 may be located on the second side of the display driver 430.

[0289] In an embodiment, some of the third demultiplexers 230 and some of the fourth demultiplexers 240 may be located on the first side of the display driver 430, while the remaining third demultiplexers 230 and the remaining fourth demultiplexers 240 may be located on the second side of the display driver 430.

[0290] In an embodiment, the display device 2 according to the embodiment may further include a connecting member 450 and a touch driving unit 460.

[0291] The connecting member 450 can be attached to the drive pad 310, and the touch drive unit 460 can supply drive signals to the drive pad 310 through the connecting member 450. In an embodiment, the touch drive unit 460 can be mounted on the connecting member 450.

[0292] Figure 15A and Figure 15B According to one or more embodiments along Figure 14 The sectional view taken by line A-A'. Figure 15C According to the embodiments along Figure 14 The sectional view taken by line B-B'.

[0293] Reference Figure 15A According to the embodiments, an organic light-emitting diode (OLED) may include a first electrode 511, an emitting layer 512, and a second electrode 513.

[0294] The emitting layer 512 may be located between the first electrode 511 and the second electrode 513. In an embodiment, the first electrode 511 and the second electrode 513 may be used as the anode and the cathode, respectively.

[0295] For example, the emitting layer 512 may preferably include an organic emitting layer for self-luminescence.

[0296] In one embodiment, the emitter layer 512 may be formed as a structure having a hole transport layer, an organic emitter layer, and an electron transport layer stacked together. In another embodiment, the emitter layer 512 may further include a hole injection layer and an electron injection layer.

[0297] According to the above structure, holes injected from the first electrode 511 and electrons injected from the second electrode 513 combine in the organic emission layer to form excitons, and light with a specific wavelength is generated from each emission layer 512 by the energy from the formed excitons.

[0298] In one embodiment, a plurality of pixels 410 may be located on the substrate 10. In another embodiment, each pixel 410 may be configured with pixel circuitry (not shown) including a driving transistor Tr and an organic light-emitting diode (OLED).

[0299] For ease of description, Figure 15A and Figure 15B Only the driving transistor Tr, which is directly related to the organic light-emitting diode (OLED), is shown. However, in order to control the emission of the OLED, in addition to the driving transistor Tr, the pixel circuit (not shown) may also include another transistor and capacitor, etc.

[0300] A buffer layer (not shown) for preventing the diffusion of impurities contained in the substrate 10 may be located on the substrate 10. In embodiments, the buffer layer may be formed as a single-layer structure or a multi-layer structure.

[0301] The driving transistor Tr can be formed on the substrate 10. The driving transistor Tr can be formed corresponding to each organic light-emitting diode (OLED).

[0302] The driving transistor Tr may include a gate electrode 510, a gate insulating layer 520, a semiconductor layer 530, and source / drain electrodes 540a and 540b.

[0303] The gate electrode 510 can be formed on the substrate 10.

[0304] A gate insulating layer 520 may be formed on the gate electrode 510. For example, the gate insulating layer 520 may be made of materials such as silicon oxide (SiO2). x ) or silicon nitride (SiN) x Insulating materials are formed.

[0305] The semiconductor layer 530 can be formed on the gate insulating layer 520. For example, the semiconductor layer 530 can be formed from polycrystalline silicon obtained by crystallizing amorphous silicon using a laser or the like.

[0306] In this embodiment, in addition to polycrystalline silicon, the semiconductor layer 530 may be formed of amorphous silicon, oxide semiconductor, etc.

[0307] The source / drain electrodes 540a and 540b can be located on both sides of the semiconductor layer 530, respectively.

[0308] The planarization layer 550 can be located above the driving transistor Tr and has contact holes 560 that expose the source electrode 540a or the drain electrode 540b. Figure 15A and Figure 15B The example shown illustrates the case where the drain electrode 540b is exposed through the contact hole 560.

[0309] The gate electrode 510 and the source / drain electrodes 540a and 540b may be formed of metals such as molybdenum (Mo), tungsten (W), titanium (Ti) or aluminum (Al), their alloys or their stacked structures, but this disclosure is not limited thereto.

[0310] In the embodiments, the driving transistor Tr is not limited to Figure 15A and Figure 15B The structure shown can be modified to have another structure. For example, although in Figure 15A and Figure 15B The image shows a transistor Tr with a bottom gate structure, but transistor Tr can be modified to have a top gate structure.

[0311] The first electrode 511 is formed on the planarization layer 550 and can be connected to the source electrode 540a or the drain electrode 540b through the contact hole 560. Figure 15A and Figure 15B The example shown illustrates the case where the first electrode 511 is connected to the drain electrode 540b via the contact hole 560.

[0312] For example, the planarization layer 550 can be formed of an insulating material such as silicon oxide or silicon nitride.

[0313] The pixel defining layer 570 may be located on the planarization layer 550. In an embodiment, the pixel defining layer 570 may define the position of the organic light-emitting diode (OLED).

[0314] In one embodiment, the pixel defining layer 570 may expose at least a portion of the first electrode 511.

[0315] In an embodiment, multiple openings 571 may exist in the pixel defining layer 570, and the first electrode 511 of the organic light-emitting diode OLED may be exposed through the openings 571 respectively.

[0316] For example, the pixel defining layer 570 may be made of an organic insulating material such as an acrylic organic compound, polyamide, or polyimide. However, this disclosure is not limited thereto, and the pixel defining layer 570 may be formed of various insulating materials.

[0317] In the embodiment, as described above, the emitting layer 512 and the second electrode 513 may be sequentially disposed on the first electrode 511.

[0318] In one embodiment, the second electrode 513 may extend along the pixel defining layer 570 to connect to the second electrode 513 of an adjacent organic light-emitting diode (OLED). In another embodiment, the second electrodes 513 of the OLEDs may be connected to each other.

[0319] As a result, the pixel defining layer 570 can define the position of the organic light-emitting diode (OLED) through the opening 571 that determines the position of the first electrode 511.

[0320] The encapsulation layer 420 can be located above the organic light-emitting diode (OLED). Specifically, the encapsulation layer 420 can be located above the second electrode 513.

[0321] Reference Figure 15B The display device 2 according to the embodiment may further include a buffer layer 590 located on the encapsulation layer 420. In the embodiment, the touch electrode 110 may be located on the buffer layer 590.

[0322] A buffer layer 590 can be provided to minimize damage to the encapsulation layer 420 and the organic light-emitting diode OLED during the formation of the touch electrode 110.

[0323] For example, buffer layer 590 may include inorganic and organic insulating materials. However, if desired, buffer layer 590 may be integrated with encapsulation layer 420 or omitted.

[0324] Reference Figure 15C According to this embodiment, the drive pad 310 may include a first conductive pattern 311 and a second conductive pattern 312.

[0325] The first conductive pattern 311 may be located on the substrate 10, and the insulating layer 421 with contact hole 422 may be located on the first conductive pattern 311.

[0326] The insulating layer 421 can be formed by the same process as the encapsulation layer 420 described above, and has the same structure as the encapsulation layer 420.

[0327] The second conductive pattern 312 may be located on the insulating layer 421 and contact the first conductive pattern 311 through the contact hole 422.

[0328] For example, the second conductive pattern 312 can be electrically connected to demultiplexers 200a and 200b via a wire (not shown) located on the insulating layer 421.

[0329] In one embodiment, the connecting member 450 may be attached to the second conductive pattern 312 to perform an electrical connection between the drive pad 310 and the contact drive unit 460.

[0330] Figure 16A and Figure 16B This is a diagram illustrating a display device according to an embodiment.

[0331] Reference Figure 16A In the display device 2' according to the embodiment, the touch driving unit 460' may be located on the second region A2 of the substrate 10.

[0332] In an embodiment, the touch driving unit 460' may be integrated with the demultiplexer 200 described above to be implemented in a single integrated circuit (IC).

[0333] In this embodiment, the drive pad 310 and the demultiplexer 200 built into the touch drive unit 460' can be used to supply the drive signal Ds to the touch electrode 110 during the pre-shipment testing process. However, when the display device 2' is actually used after the product is completed, the touch drive unit 460' can directly supply the drive signal Ds to the touch electrode 110 without going through the demultiplexer 200. Therefore, when the display device 2' is actually used, the operation of the demultiplexer 200 can be stopped.

[0334] In one embodiment, the drive lines 480 connected to the touch electrode 110 may be concentrated on the upper side of the curved region BA to form a group, and connected to the touch drive unit 460' by crossing the curved region BA.

[0335] In an embodiment, the total area of ​​the invalid space can be minimized.

[0336] Reference Figure 16B In the display device 2 according to the embodiment, the drive lines 480a and 480b connected to the touch electrode 110 can form multiple groups.

[0337] In one embodiment, some drive lines 480a may be concentrated on the upper side of the curved region BA to form a group and connected to the touch drive unit 460' by crossing the curved region BA.

[0338] In one embodiment, other drive lines 480b may be concentrated on the upper side of the curved region BA to form another group, and connected to the touch drive unit 460' by crossing the curved region BA and then passing through the path between the curved region BA and the display driver 430.

[0339] In an embodiment, the total area of ​​the invalid space can be minimized.

[0340] According to an embodiment, the number of pads in the touch sensor and / or display device can be minimized.

[0341] Example embodiments have been disclosed. Although specific terminology has been used, it is used in a general and descriptive sense and is to be interpreted rather than for limiting purposes. In some instances, unless specifically indicated otherwise, features, characteristics, and / or elements described in connection with specific embodiments may be used alone or in combination with features, characteristics, and / or elements described with respect to other embodiments. Various changes in form and detail may be made to the example embodiments without departing from the spirit and scope set forth in the claims.

Claims

1. A touch sensor comprising: a substrate; a plurality of electrode units each including a plurality of electrode groups each including touch electrodes arranged in a first direction on the substrate; a first demultiplexer each including a plurality of sub-demultiplexers and each electrically connected to a corresponding one of the plurality of electrode units on the substrate; a driving pad on the substrate; and a second demultiplexer provided on the substrate and configured to switch an electrical connection between the first demultiplexer and the driving pad, wherein each of the plurality of sub-demultiplexers is connected to a corresponding one of the plurality of electrode groups, and wherein the plurality of electrode groups includes a first electrode group and a second electrode group adjacent to each other in a second direction crossing the first direction. the plurality of electrode groups further includes a third electrode group and a fourth electrode group adjacent to each other in the second direction, 2. The touch sensor of claim 1, wherein, wherein the first electrode group and the third electrode group are adjacent to each other in the first direction, and wherein the second electrode group and the fourth electrode group are adjacent to each other in the first direction. the first electrode group and the third electrode group are provided on an i-th column, i being a natural number of 1 or more, and 3. The touch sensor of claim 2, wherein, wherein the second electrode group and the fourth electrode group are provided on an (i+1)-th column. operations of the first demultiplexer are controlled by a same first control signal, 4. The touch sensor of claim 1, wherein, wherein operations of the second demultiplexer are controlled by a same second control signal, and wherein the touch sensor further includes a first control pad on the substrate and configured to provide the first control signal to the first demultiplexer, and a second control pad on the substrate and configured to provide the second control signal to the second demultiplexer. the touch sensor further includes:

5. The touch sensor of claim 1, wherein, a first voltage pad on the substrate; and a third demultiplexer electrically connected between the plurality of electrode units and the first voltage pad. 6.The touch sensor according to claim 5, further comprising: a second voltage pad on the substrate; and a fourth demultiplexer electrically connected between the plurality of electrode units and the second voltage pad. each of the third demultiplexers includes sub-demultiplexers respectively connected to different electrode groups, and wherein each of the fourth demultiplexers includes sub-demultiplexers respectively electrically connected to different electrode groups.

7. The touch sensor of claim 6, wherein, the first voltage pad provides a first voltage to the third demultiplexers, wherein the second voltage pad provides a second voltage to the fourth demultiplexers, and 8. The touch sensor of claim 6, wherein, wherein a voltage value of the first voltage is higher than a voltage value of the second voltage. operations of the third demultiplexers are controlled by a same third control signal, and wherein operations of the fourth demultiplexers are controlled by a same fourth control signal.

9. The touch sensor of claim 6, wherein, 10.The touch sensor according to claim 9, further comprising: ​ ​ a third control pad disposed on the substrate and configured to provide the third control signal to the third demultiplexer; and a fourth control pad disposed on the substrate and configured to provide the fourth control signal to the fourth demultiplexer.

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