Electronic component frame-out system and apparatus and method therefor

Abstract

An electronic component bounding system for bounding an electronic component on a circuit board includes an image capturing device and a computing device. The image capturing device is configured to capture the electronic component to obtain a first image. The computing device is electrically connected to the image capturing device. The computing device stores a reference bounding box. The computing device sequentially performs a color space conversion and a binarization process on the first image to generate a second image. The second image has a color block distribution. The computing device obtains a position of the electronic component based on the color block distribution. The computing device sets a detection bounding box in the first image based on the position of the electronic component in the second image. The computing device determines a degree of coincidence between the detection bounding box and the reference bounding box and an offset corresponding to the degree of coincidence. When the offset is greater than a threshold, the computing device corrects the detection bounding box based on the offset.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic component bounding system, and more particularly to an electronic component bounding system using color space conversion, binarization procedure and offset correction, and the apparatus and method thereof. BACKGROUND

[0002] Generally, an operator operates an automated optical inspection (AOI) machine to detect electronic components (e.g. capacitors or digital logic elements) on a circuit board. The operator manually bounds the electronic components to be detected. However, the number of electronic components on a circuit board can be as many as 100-200, and the electronic components to be detected are thus increased, and the operator needs to spend a long time to bound the electronic components.

[0003] In view of the foregoing, the present application provides an electronic component bounding system, and the apparatus and method thereof, to improve the prior art and to promote industrial implementation. SUMMARY

[0004] In view of the foregoing, the present application provides an electronic component bounding system, and the apparatus and method thereof, to improve the prior art and to promote industrial implementation.

[0005] According to an embodiment of the present application, an electronic component bounding system for bounding electronic components on a circuit board includes an image capturing device and a computing device. The image capturing device is configured to capture the electronic components to obtain a first image. The computing device is electrically connected to the image capturing device and pre-stores a reference bounding box. The computing device sequentially performs color space conversion and binarization procedure on the first image to generate a second image having a color block distribution. The computing device obtains a position of the electronic component based on the color block distribution. The computing device sets a bounding box in the first image based on the position of the electronic component in the second image, and compares the bounding box with the reference bounding box to obtain an offset. The computing device generates a degree of correspondence based on the offset, and corrects the bounding box based on the offset when the offset is greater than a threshold.

[0006] An electronic component bounding device according to an embodiment of the present application is used for bounding an electronic component on a circuit board. The electronic component bounding device includes a detection platform, an image capturing device, a light source, and a computing device. The detection platform includes a first surface and a second surface. The first surface is used for bearing the circuit board. A receiving area is arranged between the first surface and the second surface. The image capturing device is arranged above the detection platform and is used for receiving reflected light and generating a first image according to the reflected light. The light source is arranged in the receiving area or adjacent to the image capturing device. The light source is used for emitting incident light to the electronic component to generate the reflected light. The computing device is electrically connected to the image capturing device. The computing device pre-stores a reference bounding box. The computing device sequentially performs color space conversion and binarization on the first image to generate a second image. The second image has a color block distribution. The computing device obtains a position of the electronic component according to the color block distribution. The computing device arranges a detection bounding box in the first image according to the position of the electronic component in the second image. The computing device compares the detection bounding box with the reference bounding box to obtain an offset. The computing device generates a coincidence degree according to the offset. When the offset is greater than a threshold, the computing device corrects the detection bounding box according to the offset.

[0007] An electronic component bounding method according to an embodiment of the present application is used for bounding an electronic component on a circuit board. The electronic component bounding method includes: capturing the electronic component to obtain a first image; sequentially performing color space conversion and binarization on the first image to generate a second image. The second image has a color block distribution. The electronic component bounding method further includes: obtaining a position of the electronic component according to the color block distribution; arranging a detection bounding box in the first image according to the position of the electronic component in the second image; comparing the detection bounding box with a reference bounding box to obtain an offset; generating a coincidence degree according to the offset; and correcting the detection bounding box that does not coincide with the reference bounding box according to the offset when the offset is greater than a threshold.

[0008] In summary, the electronic component bounding system and method according to the present application capture the electronic component to obtain a first image. The computing host sequentially performs color space conversion and binarization on the first image to obtain a position of the electronic component. The computing host arranges a detection bounding box in the first image according to the position of the electronic component to bound the electronic component. When the detection bounding box corresponding to the electronic component is offset, the computing host corrects the detection bounding box. The problem of long time consumption of manual bounding is improved.

[0009] In summary, the electronic component bounding device according to the present application applies the electronic component bounding system of the present application to an automatic optical inspection machine to improve the work efficiency of the automatic optical inspection machine.

[0010] The above description of the present disclosure and the following description of the embodiments are used to demonstrate and explain the spirit and principles of the present application, and provide further explanation of the claims of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1System block diagram of an embodiment of the electronic component mounting system of the present invention.

[0012] Figure 2 Schematic diagram of a circuit board of an embodiment of the present invention.

[0013] Figure 3 Flowchart of an embodiment of the electronic component mounting method of the present invention.

[0014] Figure 4 Schematic diagram of a first image of an embodiment of the present invention.

[0015] Figure 5 Schematic diagram of a second image of an embodiment of the present invention.

[0016] Figure 6A Schematic diagram of a pre-corrected result image of an embodiment of the present invention.

[0017] Figure 6B Schematic diagram of a post-corrected result image of an embodiment of the present invention.

[0018] Figure 7 Schematic diagram of an embodiment of the electronic component mounting apparatus of the present invention.

[0019] Figure 8 Schematic diagram of another embodiment of the electronic component mounting apparatus of the present invention.

[0020] In the drawings, the following reference numerals are used:

[0021] 10: image capturing device

[0022] 20: arithmetic device

[0023] 21: processor

[0024] 22: memory

[0025] 30: detection platform

[0026] 40: light source

[0027] AS: accommodation area

[0028] B: circuit board

[0029] C1: first color area

[0030] C2: second color area

[0031] DF: detection frame

[0032] EC1, EC2: electronic component

[0033] F1: first face

[0034] F2: second face

[0035] IL: incident light

[0036] I1: first image

[0037] I2: second image

[0038] RL: reflected light

[0039] RF: reference frame

[0040] S: screen

[0041] S11-S21: steps DETAILED DESCRIPTION

[0042] The following detailed description of the application is provided as a specific example of the application and is not intended to limit the application in any way. The following examples are intended to further illustrate the application and are not intended to limit the scope of the application. The scope of the application is defined with reference to the following claims.

[0043] It should be understood that, although the terms "first", "second" and the like can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer and / or section from another element, component, region, layer and / or section.

[0044] In addition, the terms "comprise" and / or "comprising", as used herein, refer to the presence of the stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

[0045] Reference is made to Figure 1 and Figure 2 which are a block diagram of a system of an embodiment of the electronic component frame selection system of the present application and a schematic diagram of a circuit board of an embodiment of the present application and a schematic diagram of a circuit board of an embodiment of the present application. As shown in Figure 1As shown, the electronic component framing system of the present application for framing an electronic component EC1 on a circuit board B includes an image capturing device 10 and a computing device 20. The image capturing device 10 is configured to capture the electronic components EC1 and EC2 to obtain a first image I1. In one embodiment, the computing device 20 can include a processor 21 electrically connected to the image capturing device 10 and a memory 22 coupled to the processor 21 and pre-stored with a reference frame. In one embodiment, the computing device 20 sequentially performs a color space conversion and a binarization procedure on the first image to generate a second image having a color block distribution, and the computing device 20 obtains the position of the electronic component EC1 according to the color block distribution of the second image I2. Subsequently, the computing device 20 sets a detection frame DF in the first image I1 according to the position of the electronic component EC1 in the second image I2 to form a preliminary framed image, the computing device 20 compares the detection frame DF in the preliminary framed image with the reference frame to obtain an offset, the computing device 20 judges the coincidence degree between the detection frame and the reference frame according to the offset, and when the offset is greater than a threshold value, the computing device 20 corrects the detection frame DF in the preliminary framed image according to the offset to obtain a result image. When the offset is not greater than the threshold value, the computing device 20 uses the preliminary framed image as the result image.

[0046] In the above, the electronic component EC1 is the electronic component to be framed (i.e., the target electronic component to be framed as described later), and the electronic component EC2 is the electronic component not to be framed in the current execution process. The electronic components EC1 and EC2 can include a capacitor, a resistor, a dual in-link package (DIP) component, or other types of electronic components. The image capturing device 10 can be a camera or a lens on a mobile device; the computing device 20 can use a microcontroller unit (MCU) as the processor 21, or can be a computer, a mobile device, or a supercomputer using a central processing unit (CPU) as the processor 21, and the memory 22 can be, for example, a flash memory, a hard disk (HDD), a solid state disk (SSD), a dynamic random access memory (DRAM), a static random access memory (SRAM), or other non-volatile memories. However, the image capturing device 10 and the computing device 20 can also be other types of optical capturing devices and electronic devices, and are not limited to the ranges listed in the present application.

[0047] In addition, the computing device 20 can further include a filter and a color space converter (both not shown) coupled to the processor 21, respectively, wherein the filter (e.g., a Gaussian filter) can pre-filter the first image I1 to remove noise, and the color space converter (e.g., an image processor) can assist the processor 21 to perform the color space conversion.

[0048] Referring to Figure 3 , which is a flowchart of an embodiment of the electronic component bounding method of the present application, and is used to explain in detail how the result image is obtained by the electronic component bounding system as described above. Referring to Figure 1 and Figure 2 , and in combination with Figures 4 to 6B , the electronic component bounding method of the present application is described as follows: Step S11: the image capturing device 10 is used to capture the circuit board B to obtain a first image I1, which presents the electronic components EC1 and EC2 as shown in Figure 4 . The processor 21 receives the first image I1 from the image capturing device 10, and filters the noise of the first image I1; the step of filtering the noise of the first image I1 can also be performed by a filter. Step S12 is then performed.

[0049] Step S12: the processor 21 is used to pre-set the type of the electronic component EC1 to be bounded, and set it as a target electronic component. The memory 24 stores a reference frame and a threshold value. The processor 21 extracts the reference frame from the memory 24. The processor 21 sets the size of the reference frame and the detection frame DF according to the size corresponding to the target electronic component. The detection frame DF has a plurality of vertex coordinates, and the reference frame has a plurality of reference vertex coordinates. Step S13 is then performed.

[0050] Step S13: the processor 21 is used to perform color space conversion on the first image I1 belonging to a first color space (for example, the RGB color space, where R represents red, G represents green, and B represents blue) to generate a converted image belonging to a second color space (for example, the HSV color space, where H represents hue, S represents saturation, and V represents brightness); the step S13 can also be performed by a color space converter. Step S14 is then performed.

[0051] Step S14: the processor 21 is used to find the hue value of the target electronic component in the converted image according to the target electronic component. The processor 21 sets the threshold value according to the hue value of the target electronic component in the converted image. Step S15 is then performed.

[0052] Step S15: the processor 21 is used to compare the threshold value with the hue values of the electronic components EC1 and EC2 in the converted image. If the processor 21 determines that the hue value of the electronic component EC1 is greater than the threshold value, the processor 21 marks the electronic component EC1 as a first color region C1 (which can be, for example, the white part shown in Figure 5 ), which is the location of the target electronic component. If the processor 21 determines that the hue value of the electronic component EC2 is less than the threshold value, the processor 21 marks the electronic component EC2 as a second color region C2 (which can be, for example, the black part shown in Figure 5The first color region C1 and the second color region C2 constitute a color block distribution, thereby generating a second image I2 with a color block distribution as shown in Figure 5 Step S16 is followed by step S17.

[0053] Step S16: The processor 21 obtains the positions of the target electronic components from the first color region C1 of the second image I2, i.e., the processor 21 obtains the positions of the plurality of electronic components EC1. Step S16 is followed by step S17.

[0054] Step S17: The processor 21 sets a plurality of detection frames DF in the first image I1 according to the positions of the plurality of electronic components EC1 in the second image I2 (i.e., generates a result image), and the plurality of detection frames DF frame the plurality of electronic components EC1. Step S17 is followed by step S18.

[0055] Step S18: The processor 21 translates the plurality of vertex coordinates of each detection frame DF to the plurality of reference vertex coordinates and compares the plurality of vertex coordinates of each detection frame DF with the plurality of reference vertex coordinates to calculate a displacement, and the processor 21 generates a degree of coincidence according to the displacement, for example, the displacement is 10 units and the degree of coincidence is 25%. Step S18 is followed by step S19.

[0056] Step S19: The processor 21 compares the displacement with a threshold value, if the processor 21 determines that the displacement is less than the threshold value, the detection frame DR is not displaced, and step S21 is followed. If the processor 21 determines that the displacement is greater than the threshold value, the detection frame DR is displaced, i.e., the electronic component EC1 can be displaced (e.g., translated or rotated), and the displacement condition of the electronic component EC1 can be as shown in Figure 6A Step S19 is followed by step S20.

[0057] Step S20: The processor 21 corrects the detection frame DF according to the displacement, and the corrected detection frame DF can be as shown in Figure 6B Step S20 is followed by step S21.

[0058] Step S21: The screen S can display the result image as shown in Figure 6A and Figure 6B so that the detection personnel can know the condition of the target electronic component and the remaining electronic components.

[0059] For example, the processor 21 sets the type of the electronic component ECl to be framed as a capacitor and sets it as a target electronic component, the processor 21 sets the sizes of the reference frame RF and the detection frame DF according to the size of the capacitor, the processor 21 receives the first image I1, the filter filters the noise of the first image I1, the color space of the first image I1 is the RGB color space, the color space converter 22 performs color space conversion on the RGB color space of the first image I1 to generate a converted image belonging to the HSV color space. The processor 21 finds a plurality of capacitors in the converted image and measures the hue values of the plurality of capacitors, the processor 21 sets a threshold value according to the hue values of the plurality of capacitors, the processor 21 compares the hue values of each electronic component ECl and EC2 in the converted image with the value of the threshold value, and the hue value of part of the electronic component ECl is greater than the threshold value, which is marked as a first color area (the color of the first color area may be white, for example), and the first color area is the location of the capacitor. The hue value of part of the electronic component EC2 is less than the threshold value, which is marked as a second color area (the color of the second color area may be black, for example), thereby generating a second image I2 with color block distribution.

[0060] Then, the processor 21 sets a plurality of detection frames DF in the first image I1 according to the first color area of the second image I2, the plurality of detection frames DF frame a plurality of capacitors respectively, the processor 21 translates the plurality of vertex coordinates of each detection frame DF to a plurality of reference vertex coordinates and compares the plurality of vertex coordinates of each detection frame DF with the plurality of reference vertex coordinates to calculate the offset, and the processor 21 generates a degree of correspondence according to the offset, the offset corresponding to each detection frame DF is different from each other, and the degree of correspondence corresponding to each detection frame DF is also different from each other.

[0061] If the processor 21 judges that the offset is less than a threshold value, the detection frame DR has no offset, and the capacitor has no rotation; if the processor 21 judges that the offset is greater than the threshold value, that is, the detection frame DF may generate rotation, and the capacitor may generate rotation as shown in Figure 6A , the processor 21 corrects the detection frame DF according to the offset, and the corrected detection frame DF may be as shown in Figure 6B , the screen S can display the result image as shown in Figure 6A and Figure 6B , and the detection personnel can know the status of the capacitor and the remaining electronic components.

[0062] Please refer to Figure 7 , which is a schematic diagram of an embodiment of the electronic component framing device of the present application. As Figure 7As shown, the electronic component selection device of the present invention is used to select electronic component EC1 on circuit board B. It includes an image capturing device 10, a computing device 20, a detection platform 30, and a light source 40. The detection platform 30 includes a first surface F1 and a second surface F2, with the first surface F1 supporting circuit board B. The light source 40 is disposed adjacent to the image capturing device 10. The light source 40 emits incident light IL to electronic components EC1 and EC2 and generates reflected light RL which is reflected back to the image capturing device 10. The number of light sources 40 can be single or multiple. The light source 40 can be, for example, a light-emitting diode (LED), but can also be other types of light-emitting devices, and is not limited to the scope listed in this invention. The image capturing device 10 generates a first image I1. The configuration of the image capturing device 10 and the computing device 20 is as follows... Figure 1 and Figure 2 As shown, its relevant configuration has been described above and will not be repeated here.

[0063] In this embodiment, the electronic component selection device of the present invention is a corresponding automatic optical inspection machine. The electronic component selection device of the present invention applies the electronic component selection of the present invention to the automatic optical inspection machine to improve the working efficiency of the automatic optical inspection machine.

[0064] Please see Figure 8 This is a schematic diagram of another embodiment of the electronic component selection device of the present invention. Figure 8 As shown, the electronic component selection device of the present invention is used to select electronic components EC on circuit board B. It includes an image capturing device 10, a computing device 20, a detection platform 30, and a light source 40, and their configuration is as follows: Figure 7 The embodiments described are similar, and the similarities will not be repeated here, but... Figure 8 The described embodiments and Figure 7 The embodiments described above still have some differences. The difference is that an accommodating area AS is provided between the first surface F1 and the second surface F2, and the light source 40 is provided in the accommodating area AS. The light source 40 emits incident light IL, which is incident in the forward direction on the electronic components EC1 and EC2 on the circuit board B. Reflected light RL is generated on the electronic components EC1 and EC2, and the reflected light RL is directly reflected to the image capturing device 10. This light source configuration is less likely to generate scattered light, and the noise of the first image I1 generated by the image capturing device 10 will be reduced.

[0065] As mentioned above, the electronic component framing system and method of the present application, the image capturing device 10 captures the electronic component EC1 to obtain the first image I1, the operation host 20 performs color space conversion and binarization process on the first image I1 to obtain the position of the electronic component EC1, and sets the detection frame DF in the first image I1 to frame the electronic component EC1 accordingly. If the detection frame DF corresponding to the electronic component EC1 is offset, the operation host 20 corrects the detection frame DF, thereby improving the problem of long time consumption of manual framing.

[0066] As mentioned above, the electronic component framing system and method of the present application, the image capturing device 10 captures the electronic component EC1 to obtain the first image I1, the operation host 20 performs color space conversion and binarization process on the first image I1 to obtain the position of the electronic component EC1, and sets the detection frame DF in the first image I1 to frame the electronic component EC1 accordingly. If the detection frame DF corresponding to the electronic component EC1 is offset, the operation host 20 corrects the detection frame DF, thereby improving the problem of long time consumption of manual framing.

[0067] Although the present application is disclosed with the aforementioned embodiments, it is not intended to limit the present application. Any change and modification made without departing from the spirit and scope of the present application shall fall within the scope of the patent protection of the present application. The scope of protection of the present application is subject to the appended claims.

Claims

1. An electronic component selection system for selecting an electronic component on a circuit board, characterized in that, The electronic component framing system comprises: an image capturing device for capturing the electronic component to obtain a first image; and an operation device electrically connected to the image capturing device, and pre-storing a reference frame, the operation device performing a color space conversion on the first image to obtain a converted image, and performing a binarization procedure on the converted image to obtain a second image having a color block distribution, wherein the operation device sets a threshold value in the binarization procedure according to a hue value of the electronic component in the converted image, and generates the color block distribution having a first color region and a second color region according to the threshold value, the operation device obtains the position of the electronic component according to the color block distribution, the operation device sets a detection frame in the first image according to the position of the electronic component in the second image, and compares the detection frame and the reference frame to obtain an offset, the operation device generates a coincidence degree according to the offset, and when the offset is greater than a threshold value, the operation device corrects the detection frame according to the offset.

2. The electronic component framing system of claim 1, wherein, The operation device comprises a color space converter performing the color space conversion on the first image belonging to a first color space to obtain the converted image belonging to a second color space, and the operation device performs the binarization procedure on the converted image to obtain the second image.

3. The electronic component framing system of claim 1, wherein, The operation device sets the size of the reference frame and the detection frame according to the size of the electronic component.

4. The electronic component framing system of claim 1, wherein, The detection frame has a plurality of vertex coordinates, the reference frame has a plurality of reference vertex coordinates, the operation device compares the plurality of vertex coordinates and the plurality of reference vertex coordinates to obtain the offset, and the operation device generates the coincidence degree according to the offset.

5. An electronic component selection device for selecting an electronic component on a circuit board, characterized in that, The electronic component framing device comprises: a detection platform comprising a first surface and a second surface, the first surface being used to support the circuit board, and a containing area being arranged between the first surface and the second surface; an image capturing device arranged above the detection platform, and used to receive a reflected light to generate a first image; a light source arranged in the containing area or adjacent to the image capturing device, and used to emit an incident light to the electronic component to generate the reflected light; and An operation device electrically connected to the image capturing device, and the operation device pre-stores a reference frame. The operation device performs a color space conversion on the first image to generate a converted image, and performs a binarization procedure on the converted image to generate a second image having a color block distribution. The operation device sets a threshold value in the binarization procedure according to a hue value of the electronic component in the converted image, and generates the color block distribution having a first color region and a second color region according to the threshold value. The operation device obtains the position of the electronic component according to the color block distribution. The operation device sets a detection frame in the first image according to the position of the electronic component in the second image, and compares the detection frame with the reference frame to obtain an offset. The operation device generates a coincidence degree according to the offset, and corrects the detection frame according to the offset when the offset is greater than a threshold value.

6. The electronic component frame selecting apparatus according to claim 5, wherein The operation device includes a color space converter performing the color space conversion on the first image belonging to a first color space to generate the converted image belonging to a second color space. The operation device performs the binarization procedure on the converted image to generate the second image.

7. The electronic component frame selecting apparatus according to claim 5, wherein The operation device sets the size of the reference frame and the detection frame according to the size of the electronic component.

8. The electronic component frame selecting apparatus according to claim 5, wherein The detection frame has a plurality of vertex coordinates, and the reference frame has a plurality of reference vertex coordinates. The operation device compares the plurality of vertex coordinates with the plurality of reference vertex coordinates to obtain the offset. The operation device generates the coincidence degree according to the offset.

9. An electronic component bounding method for bounding an electronic component on a circuit board, characterized by, The electronic component framing method includes the following steps: capturing the electronic component to obtain a first image; performing a color space conversion on the first image to generate a converted image, and performing a binarization procedure on the converted image to generate a second image having a color block distribution. The step of performing the binarization procedure includes setting a threshold value in the binarization procedure according to a hue value of the electronic component in the converted image, and generating the color block distribution having a first color region and a second color region according to the threshold value; obtaining the position of the electronic component according to the color block distribution; setting a detection frame in the first image according to the position of the electronic component in the second image; and comparing the detection frame with the reference frame to obtain an offset. The operation device generates a coincidence degree according to the offset; and correcting the detection frame that does not coincide with the reference frame according to the offset when the offset is greater than a threshold value.

10. The electronic component frame selection method according to Claim 9, wherein The step of performing the color space conversion includes: performing the color space conversion on the first image belonging to a first color space to generate the converted image belonging to a second color space, and performing the binarization procedure on the converted image.

11. The electronic component frame selection method according to Claim 9, wherein The step of setting the detection frame in the first image includes: setting the size of the reference frame and the detection frame according to the size of the electronic component.

12. The electronic parts frame selection method according to Claim 9, wherein The detection frame has a plurality of vertex coordinates, and the reference frame has a plurality of reference vertex coordinates. The step of judging the coincidence degree of the detection frame and the reference frame and the offset corresponding to the coincidence degree includes: comparing the plurality of vertex coordinates and the plurality of reference vertex coordinates to obtain the offset; and generating the degree of conformity according to the offset.

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