Surface mount resistor and method of manufacturing the same

Abstract

A surface mount resistor includes an insulating substrate, first and second heat conductive structures, first and second end electrodes, and a resistance layer. The insulating substrate has opposite first and second surfaces and opposite first and second side surfaces. The insulating substrate is provided with first and second through holes. The first and second through holes are adjacent to the first and second side surfaces, respectively. The first and second heat conductive structures are disposed in the first and second through holes, respectively. The first end electrode extends over the first surface, the first side surface, and the second surface and engages opposite end surfaces of the first heat conductive structure. The second end electrode extends over the first surface, the second side surface, and the second surface and engages opposite end surfaces of the second heat conductive structure. The resistance layer is disposed on the first surface and covers part of the first end electrode and part of the second end electrode. The first and second heat conductive structures can accelerate the heat conduction speed of the surface mount resistor and increase the heat conduction area, thereby increasing the load of the surface mount resistor.

Description

Technical Field

[0001] This invention relates to a resistor manufacturing technique, and more particularly to a surface-mount resistor and its manufacturing method. Background Technology

[0002] As electronic devices demand increasingly higher current throughput, the power requirements for resistors also rise. The high heat generated by large currents flowing through resistors needs to be dissipated quickly to prevent thermal impact on resistor characteristics and lifespan.

[0003] Generally, a high thermal conductivity material, such as metal, is attached below the resistive layer or added above the protective layer of the resistive layer to dissipate heat through conduction and convection. Another common approach is to increase the area of ​​the lower electrode to expand the heat convection area and thus improve the heat dissipation rate.

[0004] However, attaching thermally conductive material beneath the resistive layer results in poor thermal conductivity due to the presence of a colloid between the resistive layer and the thermally conductive material. Conversely, placing thermally conductive material above the resistive layer and increasing the area of ​​the lower electrode to enhance heat convection do not significantly contribute to thermal conductivity. Therefore, these heat dissipation methods cannot effectively increase the load power of the resistor. Summary of the Invention

[0005] One objective of this invention is to provide a surface-mount resistor and its manufacturing method, wherein a first thermally conductive structure and a second thermally conductive structure penetrating the insulating substrate are respectively provided at corresponding first and second end electrodes of the insulating substrate. Since the first thermally conductive structure can conduct heat between the portions of the first end electrode located on the opposing first and second surfaces of the insulating substrate, and the second thermally conductive structure can conduct heat between the portions of the second end electrode located on the opposing first and second surfaces of the insulating substrate, the heat generated by the resistive layer on the first surface can be rapidly conducted to the portions of the first and second end electrodes located on the second surface. This not only accelerates the heat conduction speed of the surface-mount resistor but also increases the heat conduction area, thereby increasing the load capacity of the surface-mount resistor.

[0006] According to the above-described objective of the present invention, a surface-mount resistor is provided. This surface-mount resistor includes an insulating substrate, at least one first thermally conductive structure, at least one second thermally conductive structure, a first end electrode, a second end electrode, and a resistive layer. The insulating substrate has a first surface and a second surface opposite to each other, and a first side surface and a second side surface opposite to each other and bonded between the first surface and the second surface. The insulating substrate has at least one first through-hole and at least one second through-hole extending from the first surface to the second surface. The at least one first through-hole is adjacent to the first side surface, and the at least one second through-hole is adjacent to the second side surface. The at least one first thermally conductive structure is disposed in the at least one first through-hole. The at least one second thermally conductive structure is disposed in the at least one second through-hole. The first end electrode extends on the first surface, the first side surface, and the second surface, and is bonded to the opposite two end surfaces of the at least one first thermally conductive structure. The second end electrode extends on the first surface, the second side surface, and the second surface, and is bonded to the opposite two end surfaces of the at least one second thermally conductive structure. The first end electrode and the second end electrode are separate. The resistive layer is disposed on the first surface and covers a portion of the first end electrode and a portion of the second end electrode.

[0007] According to an embodiment of the present invention, the material of at least one first thermally conductive structure is the same as the material of the first end electrode, and the material of at least one second thermally conductive structure is the same as the material of the second end electrode.

[0008] According to an embodiment of the present invention, the material of at least one first thermally conductive structure is different from the material of the first end electrode, and the material of at least one second thermally conductive structure is different from the material of the second end electrode.

[0009] According to an embodiment of the present invention, the materials of the at least one first thermally conductive structure and the at least one second thermally conductive structure include nickel, tin, copper, or any combination thereof.

[0010] According to one embodiment of the present invention, the number of the at least one first heat-conducting structure is different from the number of the at least one second heat-conducting structure.

[0011] According to the above-described objective of the present invention, a method for manufacturing a surface-mount resistor is provided. In this method, at least one first through-hole and at least one second through-hole are formed in an insulating substrate. The insulating substrate has a first surface and a second surface opposite to each other, and a first side surface and a second side surface opposite to each other and joined between the first surface and the second surface. The aforementioned at least one first through-hole and at least one second through-hole extend from the first surface to the second surface. The aforementioned at least one first through-hole is adjacent to the first side surface, and the at least one second through-hole is adjacent to the second side surface. At least one first thermally conductive structure is formed in the aforementioned at least one first through-hole. At least one second thermally conductive structure is formed in the aforementioned at least one second through-hole. A first end electrode is formed extending on the first surface, the first side surface, and the second surface, and is joined to the opposing two end surfaces of the aforementioned at least one first thermally conductive structure. A second end electrode is formed extending on the first surface, the second side surface, and the second surface, and is joined to the opposing two end surfaces of the aforementioned at least one second thermally conductive structure. The first end electrode and the second end electrode are separate. A resistive layer is formed on the first surface. The resistive layer covers a portion of the first end electrode and a portion of the second end electrode.

[0012] According to one embodiment of the present invention, the formation of at least one first thermally conductive structure, the formation of at least one second thermally conductive structure, the formation of the first end electrode, and the formation of the second end electrode are carried out using the same deposition process.

[0013] According to an embodiment of the present invention, the formation of at least one first thermally conductive structure and at least one second thermally conductive structure is carried out using a first deposition process, and the formation of the first end electrode and the formation of the second end electrode are carried out using a second deposition process.

[0014] According to one embodiment of the present invention, the formation of at least one first through hole and at least one second through hole includes using laser drilling technology or drilling technology.

[0015] According to one embodiment of the present invention, the number of the at least one first through hole and the number of the at least one second through hole are different. Attached Figure Description

[0016] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below:

[0017] Figure 1 A perspective view of a surface-mount resistor according to an embodiment of the present invention is shown;

[0018] Figure 2 A cross-sectional schematic diagram of a surface-mount resistor according to an embodiment of the present invention is shown.

[0019] Figure 3 A perspective view of an insulating substrate according to an embodiment of the present invention is shown; and

[0020] Figures 4A to 4D A cross-sectional schematic diagram illustrating the various intermediate stages of a method for manufacturing a surface-mount resistor according to an embodiment of the present invention is shown. Detailed Implementation

[0021] The embodiments of the present invention are discussed in detail below. However, it will be understood that the embodiments provide many applicable concepts that can be implemented in a wide variety of specific contexts. The embodiments discussed and disclosed are for illustrative purposes only and are not intended to limit the scope of the invention. All embodiments of the present invention disclose a variety of different features, but these features may be implemented individually or in combination as needed.

[0022] Furthermore, the terms "first," "second," etc., used in this article do not specifically refer to order or sequence; they are merely used to distinguish elements or operations described using the same technical terms.

[0023] The spatial relationship between the two elements described in this invention applies not only to the orientations shown in the accompanying drawings, but also to orientations not shown in the drawings, such as inverted orientations. Furthermore, the terms "connection," "electrical connection," or similar expressions used in this invention to refer to two components are not limited to a direct or electrical connection, but may also include indirect or electrical connections as needed.

[0024] Please refer to Figure 1 and Figure 2 The figures illustrate a perspective view and a cross-sectional view of a surface-mount resistor according to an embodiment of the present invention. In some examples, the surface-mount resistor 100 may mainly include an insulating substrate 110, at least one first thermally conductive structure 120, at least one second thermally conductive structure 130, a first terminal electrode 140, a second terminal electrode 150, and a resistive layer 160.

[0025] The insulating substrate 110 may be, for example, a quadrilateral structure. The insulating substrate 110 has a first surface 110a and a second surface 110b opposite to each other, and a first side surface 110c and a second side surface 110d opposite to each other. The first side surface 110c and the second side surface 110d are joined between the first surface 110a and the second surface 110b. That is, the first side surface 110c connects one side of the first surface 110a to one side of the second surface 110b, while the second side surface 110d connects the other opposite side of the first surface 110a to the other opposite side of the second surface 110b. For example, the first surface 110a of the insulating substrate 110 may be the upper surface of the insulating substrate 110, and the second surface 110b may be the lower surface of the insulating substrate 110.

[0026] The insulating substrate 110 has at least one first through hole 112 and at least one second through hole 114. The first through hole 112 is adjacent to a first side surface 110c of the insulating substrate 110, and the second through hole 114 is adjacent to a second side surface 110d. Therefore, the first through hole 112 and the second through hole 114 are respectively located in two opposite edge regions of the insulating substrate 110. Both the first through hole 112 and the second through hole 114 extend from the first surface 110a to the second surface 110b of the insulating substrate 110, and penetrate the insulating substrate 110. The insulating substrate 110 may be alumina (Al2O3) or aluminum nitride (AlN). In an exemplary example, the insulating substrate 110 is an alumina ceramic substrate.

[0027] like Figure 2 As shown, at least one first heat-conducting structure 120 is correspondingly embedded in at least one first through hole 112. That is, the number of first heat-conducting structures 120 is the same as the number of first through holes 112, and the size and shape of the first heat-conducting structure 120 are substantially the same as the size and shape of the corresponding first through hole 112. Depending on product requirements, there may be one or more first heat-conducting structures 120. In the example of providing multiple first heat-conducting structures 120, the shapes of these first heat-conducting structures 120 may be the same as each other, different from each other, or partially the same and partially different. Furthermore, in the example of these first heat-conducting structures 120 having the same shape, the sizes of these first heat-conducting structures 120 may be the same as each other, different from each other, or partially the same and partially different. The materials of these first heat-conducting structures 120 may be the same as each other, different from each other, or partially the same and partially different. The material of the first heat-conducting structure 120 may, for example, include nickel, tin, copper, or any combination of the above materials.

[0028] Similarly, at least one second heat-conducting structure 130 is correspondingly embedded in at least one second through hole 114. Therefore, the number of second heat-conducting structures 130 is the same as the number of second through holes 114, and the size and shape of the second heat-conducting structure 130 are substantially the same as the size and shape of the corresponding second through hole 114. One or more second heat-conducting structures 130 can also be provided according to product requirements. In the example of providing multiple second heat-conducting structures 130, the shapes of these second heat-conducting structures 130 may be the same as each other, different from each other, or partially the same and partially different. In the example of these second heat-conducting structures 130 having the same shape, the sizes of these second heat-conducting structures 130 may be the same as each other, different from each other, or partially the same and partially different. The materials of these second heat-conducting structures 130 may be the same as each other, different from each other, or partially the same and partially different. The material of the second heat-conducting structure 130 may, for example, include nickel, tin, copper, or any combination of the above materials.

[0029] In some examples, the number of first thermally conductive structures 120 is the same as the number of second thermally conductive structures 130. In other examples, the number of first thermally conductive structures 120 is different from the number of second thermally conductive structures 130. Furthermore, the material of the first thermally conductive structure 120 may be the same as, different from, or partially the same and partially different from, the material of the second thermally conductive structure 130. The first thermally conductive structure 120 may have the same shape as, or a different shape from, the second thermally conductive structure 130.

[0030] The first end electrode 140 extends from a portion of the first surface 110a of the insulating substrate 110 via the first side surface 110c to a portion of the second surface 110b, thereby forming a C-shaped structure. That is, the first end electrode 140 extends and covers a portion of the first surface 110a, the first side surface 110c, and a portion of the second surface 110b of the insulating substrate 110. Furthermore, the first end electrode 140 covers all the first thermally conductive structures 120 and is located at the two end faces 120a and 120b of the first surface 110a and the second surface 110b, respectively. In other words, the first thermally conductive structures 120 are disposed in the area where the first end electrode 140 is to be disposed. The material of the first end electrode 140 may be the same as or different from the first thermally conductive structures 120.

[0031] The second end electrode 150 extends from another portion of the first surface 110a of the insulating substrate 110, through the second side surface 110d, to another portion of the second surface 110b, thereby forming a C-shaped structure. Therefore, the second end electrode 150 extends and covers another portion of the first surface 110a, the second side surface 110d, and another portion of the second surface 110b of the insulating substrate 110. Furthermore, the second end electrode 150 covers all the second heat-conducting structures 130 and is joined to the two end faces 130a and 130b of the first surface 110a and the second surface 110b. That is, the second heat-conducting structures 130 are disposed in the area where the second end electrode 150 is to be disposed. In addition, the first end electrode 140 is separate from the second end electrode 150 and does not directly contact it. The material of the second end electrode 150 may be the same as or different from the second heat-conducting structure 130.

[0032] Please refer to this again. Figure 2A resistive layer 160 is disposed on a first surface 110a of an insulating substrate 110 and covers a portion of a first end electrode 140 and a portion of a second end electrode 150 located on the first surface 110a. In other words, the resistive layer 160 extends from the first end electrode 140 through the first surface 110a between the first end electrode 140 and the second end electrode 150, and reaches the second end electrode 150. The resistive layer 160 is separated from the first thermally conductive structure 120 by the first end electrode 140. The resistive layer 160 is separated from the second thermally conductive structure 130 by the second end electrode 150. The resistive layer 160 does not cover the first thermally conductive structure 120 and the second thermally conductive structure 130.

[0033] In some examples, the surface-mount resistor 100 may also optionally include a protective layer 170. The protective layer 170 covers the resistive layer 160 to protect it. The protective layer 170 may be made of a moisture-resistant, solder-resistant, and highly thermally conductive material.

[0034] By providing a first thermally conductive structure 120 and a second thermally conductive structure 130 through the insulating substrate 110 in the region where the first end electrode 140 and the second end electrode 150 are disposed, respectively, the first thermally conductive structure 120 connects to the first end electrode 140 located on the first surface 110a and the second surface 110b, and the second thermally conductive structure 130 connects to the second end electrode 150 located on the first surface 110a and the second surface 110b. Heat generated by the resistive layer 160 can be conducted to the outside environment quickly via portions of the first end electrode 140 and the second end electrode 150 on the first surface 110a, and then through the first thermally conductive structure 120 and the second thermally conductive structure 130, respectively, to portions of the first end electrode 140 and the second end electrode 150 on the second surface 110b. Therefore, not only can the thermal conductivity of the surface-mount resistor 100 be improved, but the thermal conductivity area can also be increased, thereby increasing the load of the surface-mount resistor 100.

[0035] Please refer to Figure 3 and Figures 4A to 4D ,in Figure 3 A perspective view of an insulating substrate according to an embodiment of the present invention is shown. Figures 4A to 4D This diagram illustrates cross-sectional schematics of various intermediate stages in a method for manufacturing a surface-mount resistor according to an embodiment of the present invention. The process involves fabricating... Figure 4D When the surface-mount resistor 100 is shown, an insulating substrate 110 can be provided first, and at least one first through hole 112 and at least one second through hole 114 can be formed in the insulating substrate 110. Figure 3In the example shown, the insulating substrate 110 has four first through holes 112 and four second through holes 114. In some examples, the first through holes 112 and second through holes 114 can be formed in the insulating substrate 110 using laser drilling or perforation techniques. Figure 4A As shown, both the first through hole 112 and the second through hole 114 extend from the first surface 110a to the second surface 110b of the insulating substrate 110, penetrating the insulating substrate 110. The first through hole 112 is adjacent to the first side surface 110c of the insulating substrate 110, and the second through hole 114 is adjacent to the second side surface 110d. The number of the first through holes 112 and the second through holes 114 may be the same or different from each other. The structure and material properties of the insulating substrate 110 have been described above and will not be repeated here.

[0036] Next, as Figure 4B As shown, a corresponding number of first thermally conductive structures 120 can be formed according to the number of first through holes 112. The first thermally conductive structures 120 are respectively disposed in the first through holes 112. The first thermally conductive structures 120 can be formed in the first through holes 112 using a deposition method. For example, the first thermally conductive structures 120 can be formed using a sputter deposition method. The shape and material properties of the first thermally conductive structures 120 have been explained above and will not be repeated here.

[0037] Similarly, a number of second thermally conductive structures 130, the same as the number of second through holes 114, can be formed. The second thermally conductive structures 130 are respectively disposed in the second through holes 114. The second thermally conductive structures 130 can be formed in the second through holes 114 using a deposition method, such as sputtering deposition.

[0038] The manufacturing order of the first heat-conducting structure 120 and the second heat-conducting structure 130 can be adjusted according to requirements, or they can be manufactured simultaneously. The shape and material properties of the second heat-conducting structure 130, as well as the design variations in quantity, material, and shape compared to the first heat-conducting structure 120, have been explained above and will not be repeated here.

[0039] The first end electrode 140 can be formed by deposition, wherein the first end electrode 140 extends on a portion of a first surface 110a, a first side surface 110c, and a portion of a second surface 110b of the insulating substrate 110. In some examples, the first end electrode 140 is fabricated using sputter deposition. The first end electrode 140 covers all the first thermally conductive structures 120 and is bonded to the opposing end faces 120a and 120b of each first thermally conductive structure 120.

[0040] The second end electrode 150 can also be formed by deposition, wherein the second end electrode 150 extends on another portion of the first surface 110a, the second side surface 110d, and another portion of the second surface 110b of the insulating substrate 110. For example, the second end electrode 150 can be fabricated by sputter deposition. The second end electrode 150 covers all the second thermally conductive structures 130 and is bonded to the opposing end faces 130a and 130b of each second thermally conductive structure 130. Furthermore, the first end electrode 140 is separate from the second end electrode 150.

[0041] The fabrication order of the first end electrode 140 and the second end electrode 150 can be adjusted according to requirements, or they can be fabricated simultaneously. The shape and material properties of the second end electrode 150, as well as the material design changes compared to the first end electrode 140, have been explained above and will not be repeated here.

[0042] In some examples, the first thermally conductive structure 120, the second thermally conductive structure 130, the first terminal electrode 140, and the second terminal electrode 150 can be fabricated separately. In other examples, the first thermally conductive structure 120, the second thermally conductive structure 130, the first terminal electrode 140, and the second terminal electrode 150 are formed using the same deposition process. In still other examples, the first thermally conductive structure 120 and the second thermally conductive structure 130 are formed using a first deposition process, while the first terminal electrode 140 and the second terminal electrode 150 are formed using a second deposition process. In yet still other examples, the first thermally conductive structure 120 and the first terminal electrode 140 are fabricated using a first deposition process, while the second thermally conductive structure 130 and the second terminal electrode 150 are fabricated using a second deposition process.

[0043] like Figure 4C As shown, after the fabrication of the first terminal electrode 140 and the second terminal electrode 150 is completed, a resistive layer 160 can be formed on the first surface 110a of the insulating substrate 110 by deposition. The resistive layer 160 covers a portion of the first terminal electrode 140 and a portion of the second terminal electrode 150 located on the first surface 110a, as well as the first surface 110a between the first terminal electrode 140 and the second terminal electrode 150. Since the first thermally conductive structure 120 and the second thermally conductive structure 130 have been covered by the first terminal electrode 140 and the second terminal electrode 150 respectively before the resistive layer 160 is fabricated, the resistive layer 160 is physically separate from the first thermally conductive structure 120 and the second thermally conductive structure 130.

[0044] like Figure 4D As shown, in some examples, after the resistive layer 160 is completed, a protective layer 170 may be selectively formed over the resistive layer 160 to protect the resistive layer 160. In some exemplary examples, the protective layer 170 may completely cover the resistive layer 160.

[0045] As can be seen from the above embodiments, one advantage of the present invention is that, in the surface-mount resistor and its manufacturing method, a first thermally conductive structure and a second thermally conductive structure penetrating the insulating substrate are respectively provided at the corresponding first and second end electrodes of the insulating substrate. Since the first thermally conductive structure can conduct heat to the portions of the first end electrode located on the opposing first and second surfaces of the insulating substrate, and the second thermally conductive structure can conduct heat to the portions of the second end electrode located on the opposing first and second surfaces of the insulating substrate, the heat generated by the resistive layer on the first surface can be quickly conducted to the portions of the first and second end electrodes located on the second surface. Therefore, not only can the heat conduction speed of the surface-mount resistor be accelerated, but the heat conduction area can also be increased, thereby achieving the effect of increasing the load of the surface-mount resistor.

[0046] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0047] [Symbol Explanation]

[0048] 100: Surface-mount resistor

[0049] 110: Insulating substrate

[0050] 110a: First surface

[0051] 110b: Second surface

[0052] 110c: First side view

[0053] 110d: Second side view

[0054] 112: First through hole

[0055] 114: Second through hole

[0056] 120: First thermally conductive structure

[0057] 120a: End face

[0058] 120b: End face

[0059] 130: Second thermal conductive structure

[0060] 130a: End face

[0061] 130b: End face

[0062] 140: First terminal electrode

[0063] 150: Second terminal electrode

[0064] 160: Resistive layer

[0065] 170: Protective layer.

Claims

1. A surface mount resistor characterized by, The surface mount resistor comprises: an insulating substrate having a first surface and a second surface opposite to each other, and a first side surface and a second side surface opposite to each other and joined between the first surface and the second surface, wherein the insulating substrate is provided with at least one first through-hole and at least one second through-hole extending from the first surface to the second surface, the at least one first through-hole being adjacent to the first side surface, and the at least one second through-hole being adjacent to the second side surface; at least one first heat-conductive structure disposed in the at least one first through-hole; at least one second heat-conductive structure disposed in the at least one second through-hole; a first end electrode extending on the first surface, the first side surface, and the second surface, and joined with opposite two end surfaces of the at least one first heat-conductive structure; a second end electrode extending on the first surface, the second side surface, and the second surface, and joined with opposite two end surfaces of the at least one second heat-conductive structure, wherein the first end electrode and the second end electrode are separated; and a resistance layer disposed on the first surface, and covering part of the first end electrode and part of the second end electrode, wherein the resistance layer does not cover the at least one first heat-conductive structure and the at least one second heat-conductive structure.

2. The surface-mount resistor according to claim 1, wherein The material of the at least one first heat-conductive structure is the same as that of the first end electrode, and the material of the at least one second heat-conductive structure is the same as that of the second end electrode.

3. The surface-mount resistor of claim 1 wherein, The material of the at least one first heat-conductive structure is different from that of the first end electrode, and the material of the at least one second heat-conductive structure is different from that of the second end electrode.

4. The surface-mount resistor of claim 1 wherein, The material of the at least one first heat-conductive structure and the at least one second heat-conductive structure comprises nickel, tin, copper, or any combination thereof.

5. The surface-mount resistor of claim 1 wherein, The number of the at least one first heat-conductive structure is different from that of the at least one second heat-conductive structure.

6. A method of manufacturing a surface mount resistor, characterized by, The manufacturing method of the surface mount resistor comprises: forming at least one first through-hole and at least one second through-hole in an insulating substrate, wherein the insulating substrate has a first surface and a second surface opposite to each other, and a first side surface and a second side surface opposite to each other and joined between the first surface and the second surface, and the at least one first through-hole and the at least one second through-hole extend from the first surface to the second surface, the at least one first through-hole being adjacent to the first side surface, and the at least one second through-hole being adjacent to the second side surface; forming at least one first heat-conductive structure in the at least one first through-hole; forming at least one second heat-conductive structure in the at least one second through-hole; forming a first end electrode extending on the first surface, the first side surface, and the second surface, and joined with opposite two end surfaces of the at least one first heat-conductive structure; forming a second end electrode extending on the first surface, the second side surface, and the second surface, and joined with opposite two end surfaces of the at least one second heat-conductive structure, wherein the first end electrode and the second end electrode are separated; and forming a resistance layer on the first surface, wherein the resistance layer covers part of the first end electrode and part of the second end electrode, and the resistance layer does not cover the at least one first heat-conductive structure and the at least one second heat-conductive structure.

7. The method of manufacturing a surface-mount resistor according to claim 6, wherein The at least one first heat-conductive structure, the at least one second heat-conductive structure, the first end electrode, and the second end electrode are formed by using the same deposition process.

8. The method for manufacturing a surface-mounted resistor according to claim 6, wherein The at least one first heat-conductive structure and the at least one second heat-conductive structure are formed by using a first deposition process, and the first end electrode and the second end electrode are formed by using a second deposition process.

9. The method of manufacturing a surface-mount resistor according to claim 6, wherein The at least one first through hole and the at least one second through hole are formed by using a laser drilling technique or a drilling technique.

10. The method of manufacturing a surface-mount resistor according to claim 6, wherein The number of the at least one first through hole is different from the number of the at least one second through hole.

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