Silicon wafer conveying device and conveying method

Abstract

Embodiments of the present invention provide a silicon wafer conveying device and method, relating to the field of solar cell manufacturing. The silicon wafer conveying device includes a support, a porous medium, and an air flotation plate. The support is provided with a vent hole for connecting to an external first air source. The porous medium is disposed on the support and below the silicon wafer. The pores of the porous medium are used to output a positive pressure airflow, thereby forming an air film on the surface of the porous medium. The air flotation plate and the support are disposed adjacent to each other. The air flotation plate is provided with airflow guide grooves. The porous medium supplies air from below the silicon wafer. The airflow enters the cavities of the porous medium through the vent hole, forming an air film on the surface of the porous medium to suspend the silicon wafer. The airflow guide grooves of the air flotation plate can guide the airflow direction to align with the transport direction of the silicon wafer, thereby improving the transport stability of the silicon wafer, avoiding affecting the quality of the silicon wafer, and improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the field of solar cell manufacturing, and in particular to a silicon wafer conveying device and a conveying method. Background Art

[0002] With the development of the photovoltaic industry, the demand for silicon wafers is increasing day by day, and the handling effect of silicon wafers greatly affects the quality and quality of silicon wafers. Existing silicon wafer transportation generally includes contact and non-contact types. The use of contact silicon wafer transportation is prone to problems such as silicon wafer breakage. The contact type is prone to surface contamination and scratches on the lower surface of the silicon wafer, which in turn affects the surface quality of the silicon wafer, reducing its production efficiency and silicon wafer utilization rate. The use of non-contact silicon wafer transportation has hidden dangers such as unstable adsorption force and silicon wafer falling off. The non-contact silicon wafer transportation mostly utilizes the Bernoulli principle of aerodynamics, which is prone to large gas consumption leading to large power loss in the pipeline and high noise, or small gas consumption, uneven force, weak adsorption force, poor stability, and inability to achieve stable clamping of the silicon wafer.

[0003] Therefore, the silicon wafer conveying device in the prior art has the problems of poor silicon wafer transportation stability and easy damage to the silicon wafers. Summary of the Invention

[0004] The present invention provides a silicon wafer conveying device and a conveying method, which can improve the transportation stability of silicon wafers, reduce the damage rate of silicon wafers, avoid affecting the quality of silicon wafers, and improve production efficiency.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] An embodiment of the present invention provides a silicon wafer conveying device, comprising:

[0007] A support, wherein the support is provided with a vent hole, and the vent hole is used to connect to an external first air source;

[0008] A porous medium, wherein the porous medium is disposed on the support and below the silicon wafer, and the pores of the porous medium are used to output a positive pressure airflow, thereby forming an air film on the surface of the porous medium;

[0009] The air floating plate is adjacent to the support and is provided with an air flow guiding groove. The setting direction of the air flow guiding groove is consistent with the conveying direction of the silicon wafer. The air flow guiding groove is used to guide the air flow.

[0010] Optionally, an oblique nozzle is provided below the air flotation plate. The nozzle's spray direction is aligned with the conveying direction of the silicon wafers. The oblique nozzle is connected to the airflow guide groove and is configured to form a directional airflow below the air flotation plate. Specifically, the oblique nozzle forms a directional airflow below the air flotation plate, directing the airflow toward the conveying direction of the silicon wafers, thereby achieving directional conveying of the silicon wafers.

[0011] Optionally, there are multiple airflow guide grooves, all of which are connected to the oblique nozzles, and the multiple airflow guide grooves are spaced apart. Specifically, the multiple airflow guide grooves are used to guide the airflow toward the transport direction of the silicon wafers, thereby achieving directional transportation of the silicon wafers.

[0012] Optionally, the support is a circular structure, a groove is axially provided in the middle of the support, the vent is radially provided in the support, and the vent penetrates the sidewall of the groove, and the porous medium is disposed in the groove. Specifically, the support is defined as a circular structure, and the vent and the groove are connected to convey external airflow to the porous medium.

[0013] Optionally, the groove includes a conical groove segment and an annular groove segment, one side edge of the conical groove segment is connected to the outer edge of the annular groove segment, and the other side edge of the conical groove segment is connected to the support. The vent is provided in the annular groove segment, and the diameter of the conical groove segment on the side closest to the annular groove segment is smaller than the diameter of the conical groove segment on the side away from the annular groove segment. Specifically, the groove can form a buffer chamber, utilizing the Bernoulli principle to achieve positive pressure adsorption of the silicon wafer under low airflow.

[0014] Optionally, the silicon wafer conveying device further includes a first limiting plate and a second limiting plate, the first limiting plate and the second limiting plate being arranged parallel to and spaced apart from each other, the first limiting plate and the second limiting plate being arranged in a direction consistent with the conveying direction of the silicon wafer, and the first limiting plate and the second limiting plate being used to jointly limit and correct the deviation of the silicon wafer. Specifically, the first limiting plate and the second limiting plate can jointly limit the position of the silicon wafer to ensure the stability of silicon wafer transportation.

[0015] Optionally, the first and second limiting plates are both L-shaped, and are each provided with an anti-collision member. Specifically, the specific shapes of the first and second limiting plates are limited, and the anti-collision member can protect the silicon wafer.

[0016] Optionally, the silicon wafer conveying device further comprises an airflow guide plate, which is used to generate negative pressure to adsorb the silicon wafer. Specifically, the airflow guide plate can achieve continuous and stable conveyance of the silicon wafer while limiting the floating height of the silicon wafer.

[0017] Optionally, there are multiple supports, and the multiple supports are evenly spaced. Specifically, the number of supports is limited, and the multiple supports jointly perform positive pressure adsorption on the silicon wafer.

[0018] An embodiment of the present invention further provides a conveying method for a silicon wafer conveying device, the conveying method comprising the following steps:

[0019] The first gas source provides the first gas to form a positive pressure airflow;

[0020] Positive pressure airflow passes through the porous medium, forming an air film on the surface of the porous medium;

[0021] The silicon wafers are transported through the air film.

[0022] Optionally, the delivery method further comprises:

[0023] An external first air source is connected through the air vents of the support, and the first air flow formed is positive pressure, enters the porous medium, and forms an air film on the surface of the porous medium, thereby suspending the silicon wafer;

[0024] The air flotation device is connected to a second air source, and the generated second airflow moves along the airflow guide. The airflow guide makes the moving direction of the second airflow coincide with the transport direction of the silicon wafer, thereby achieving directional transport of the silicon wafer.

[0025] During the transportation of the silicon wafers, the limiting assembly is used to limit and correct the position of the silicon wafers, so that the silicon wafers can be transported stably.

[0026] The beneficial effects of the silicon wafer conveying device and conveying method according to the embodiments of the present invention include, for example:

[0027] The silicon wafer transport device includes a support, a porous medium, and an air flotation plate. The support is provided with an air vent for connecting to an external first air source. The porous medium is disposed on the support and below the silicon wafer. The pores of the porous medium are configured to output a positive pressure airflow, thereby forming an air film on the surface of the porous medium. The air flotation plate and the support are adjacent to each other. The air flotation plate is provided with an airflow guide groove, and the direction of the airflow guide groove is aligned with the transport direction of the silicon wafer. The airflow guide groove is configured to guide the airflow. When the silicon wafer transport device is in use, the porous medium is supplied with air from below the silicon wafer. After the air vent is connected to the external first air source, the airflow passes through the air vent and enters the cavities of the porous medium, forming an air film on the surface of the porous medium, thereby suspending the silicon wafer, thereby reducing surface contact of the silicon wafer, preventing the surface of the silicon wafer from being damaged during transport, thereby affecting quality, and improving production efficiency. At the same time, the airflow guide groove of the air flotation plate can guide the flow direction of the airflow to be aligned with the transport direction of the silicon wafer, thereby achieving the purpose of directional transport of the silicon wafer and improving the transport stability of the silicon wafer. When in use, the silicon wafer transportation device can improve the transportation stability of silicon wafers, while reducing the damage rate of silicon wafers, avoiding affecting the quality of silicon wafers, and improving production efficiency.

[0028] The conveying method of the silicon wafer conveying device includes providing a first gas from a first gas source to form a positive pressure airflow; the positive pressure airflow passes through a porous medium to form an air film on the surface of the porous medium; and the silicon wafers are conveyed through the air film. This conveying method can improve the production efficiency and production quality of the silicon wafer conveying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 A schematic structural diagram of a silicon wafer transport device provided in this embodiment from a first perspective;

[0031] Figure 2 A schematic structural diagram of a silicon wafer transport device provided in this embodiment from a second perspective;

[0032] Figure 3 A schematic structural diagram of the support provided in this embodiment;

[0033] Figure 4 A schematic structural diagram of the air flotation plate provided in this embodiment;

[0034] Figure 5 This is a schematic structural diagram of the first limiting plate provided in this embodiment.

[0035] Icons: 10-support; 11-vent; 12-groove; 121-cone groove section; 122-annular groove section; 20-air flotation plate; 21-air flow guide groove; 30-first limit plate; 40-second limit plate; 50-air flow guide plate; 60-air flotation mounting portion; 70-support mounting portion; 80-transport plate; 100-silicon wafer transport device. DETAILED DESCRIPTION

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0039] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.

[0040] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0041] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0042] Example 1

[0043] With the development of the photovoltaic industry, the demand for silicon wafers is increasing day by day, and the handling effect of silicon wafers greatly affects the quality and quality of silicon wafers. Existing silicon wafer transportation generally includes contact and non-contact types. The use of contact silicon wafer transportation is prone to problems such as silicon wafer breakage. The contact type is prone to surface contamination and scratches on the lower surface of the silicon wafer, which in turn affects the surface quality of the silicon wafer, reducing its production efficiency and silicon wafer utilization rate. The use of non-contact silicon wafer transportation has hidden dangers such as unstable adsorption force and silicon wafer falling off. The non-contact silicon wafer transportation mostly utilizes the Bernoulli principle of aerodynamics, which is prone to excessive gas consumption, resulting in large power loss in the pipeline and loud noise, or too little gas consumption, uneven force, weak adsorption force, poor stability, and inability to achieve stable clamping of the silicon wafer.

[0044] Therefore, the silicon wafer conveying device in the prior art has the problems of poor silicon wafer transportation stability and easy damage to the silicon wafers.

[0045] Please refer to Figure 1-Figure 5 This embodiment provides a silicon wafer conveying device, which can effectively improve the technical problems mentioned above, improve the transportation stability of silicon wafers, and at the same time reduce the damage rate of silicon wafers, avoid affecting the quality of silicon wafers, and improve production efficiency.

[0046] Please refer to Figure 1 and Figure 2 The silicon wafer conveying device includes a support 10, a porous medium and an air flotation plate 20. The support 10 is provided with an air vent 11, which is used to connect to an external first air source. The porous medium is arranged on the support 10 and below the silicon wafer. The pores of the porous medium are used to output positive pressure airflow, thereby forming an air film on the surface of the porous medium. The air flotation plate 20 and the support 10 are arranged adjacent to each other. The air flotation plate 20 is provided with an airflow guide groove 21, and the setting direction of the airflow guide groove 21 is consistent with the conveying direction of the silicon wafer. The airflow guide groove 21 is used to guide the airflow.

[0047] Specifically, the existing silicon wafer transportation in the prior art generally includes two types: contact type and non-contact type. Among them, the contact type silicon wafer transportation generally includes methods such as clamping with claws, conveying with belts, or adsorption using vacuum. When using a mechanical mechanism for grasping or conveying with a belt, it is easy to cause problems such as silicon wafer breakage during transportation. When using the vacuum adsorption method, there are hidden dangers such as unstable adsorption force and silicon wafer falling off. In addition, the contact type silicon wafer transportation is prone to surface contamination and scratches on the lower surface of the silicon wafer, which in turn affects the surface quality of the silicon wafer and reduces its production efficiency and silicon wafer utilization rate. The non-contact silicon wafer transportation mostly utilizes the Bernoulli principle of aerodynamics, which is prone to excessive gas consumption, resulting in large power loss in the pipeline and high noise, or too little gas consumption, uneven force, weak adsorption force, poor stability, and inability to achieve stable clamping of the silicon wafer. To address these technical issues, the silicon wafer transport device 100 provided in this embodiment, when in use, uses a porous medium to supply air from below the silicon wafer. After the air vents 11 are connected to an external first air source, air flows through the air vents 11 into the cavities of the porous medium, forming an air film on the surface of the porous medium, thereby suspending the silicon wafer. This reduces surface contact with the silicon wafer, prevents the surface of the silicon wafer from being damaged during transportation, and thus affects its quality, thereby improving production efficiency. Simultaneously, the air flow guide grooves 21 of the air float plate 20 can guide the air flow direction to align with the transportation direction of the silicon wafer, thereby achieving the purpose of directional transport of the silicon wafer and improving the transportation stability of the silicon wafer. When in use, the silicon wafer transport device 100 can improve the transportation stability of the silicon wafer, reduce the damage rate of the silicon wafer, avoid affecting the quality of the silicon wafer, and improve production efficiency.

[0048] Among them, after the vent 11 of the support 10 is connected to the external first gas source, the gas enters the support 10 through the vent 11 to form a positive pressure airflow, and forms an air film on the surface of the porous medium to transport the silicon wafer in a non-contact manner.

[0049] Specifically, the silicon wafer transport device 100 in this embodiment realizes non-contact transport of silicon wafers through porous media, which can reduce the risk of damaging the surface of the silicon wafers, avoid affecting the surface quality of the silicon wafers, and further improve the production efficiency and utilization rate of silicon wafers.

[0050] In this embodiment, the porous medium is preferably graphite. The porosity of graphite is 15%-35%, and the air film formed at this time has been experimentally verified to meet the transportation requirements of silicon wafers. In other embodiments, the porous medium can also be a metallic porous material, a non-metallic porous material, a metallic porous material such as a metallic aluminum foam porous material, or a non-metallic porous material such as a porous porcelain; as long as it has a large number of pores that allow gas to pass through. In this embodiment, graphite is preferred because the porosity of graphite is relatively uniform, the air film formed is relatively stable, and the force formed on the surface of the silicon wafer is uniform. The porous medium has a porosity of 0-1, including solid forms, dense media, loose media, fibrous media, etc.

[0051] It should be noted that due to the relatively uniform pore distribution of porous media, when positive pressure air is input into the porous media, the airflow passes through the pores of the porous media and forms an air film on the surface of the porous media, thereby creating an air suspension effect, thereby achieving the effect of suspending the silicon wafer. This is not specifically limited here.

[0052] Please refer to Figure 3 A groove 12 is axially provided in the middle of the support 10 , a vent hole 11 is radially provided in the support 10 , and the vent hole 11 passes through the side wall of the groove 12 , and a porous medium is provided in the groove 12 .

[0053] It should be noted that the vent holes 11 are provided on the side walls of the groove 12 . When air enters the groove 12 through the vent holes 11 , it flows outward along the side walls of the groove 12 , that is, flows along the tangential direction, which can offset the tangential force of the support 10 .

[0054] It should also be explained that the groove 12 includes a conical groove section 121 and an annular groove section 122, one side edge of the conical groove section 121 is connected to the outer edge of the annular groove section 122, the other side edge of the conical groove section 121 is connected to the support 10, the vent 11 is provided in the annular groove section 122, and the diameter of the side of the conical groove section 121 close to the annular groove section 122 is smaller than the diameter of the side of the conical groove section 121 away from the annular groove section 122.

[0055] It should be noted that when air enters the groove 12 through the air vent 11, the groove 12 can form a buffer cavity, generating a small rotation effect inside the support 10, thereby generating suction. Since the side wall shape of the groove 12 is an inwardly inclined cone, the compressed gas impacts the bottom surface of the groove 12 and converges toward the inside, and diffuses circumferentially along the side wall of the groove 12. Since the outlet flow channel of the groove 12 is set at the upper position of the outside, the airflow can be evenly diffused until it fills the entire groove 12. At the same time, the cross-section of the outlet flow channel of the groove 12 is arc-shaped, which can reduce the vertical flow velocity of the outlet gas, thereby reducing the vertical impact of the airflow on the silicon wafer, and thereby enhancing the adsorption capacity and adsorption stability of the air film. The airflow flowing out of the groove 12 radiates outward in a ring shape, thereby generating a ring-shaped positive pressure adsorption area. According to Bernoulli's principle, the pressure is smaller at the position where the air velocity is high, and a pressure difference between the inside and outside can be generated, thereby achieving the purpose of positive pressure adsorption of the silicon wafer using a smaller airflow.

[0056] Furthermore, the silicon wafer transport device 100 further includes a transport plate 80 , on which an air-floating mounting portion 60 and a support mounting portion 70 are provided. The air-floating plate 20 is mounted on the air-floating mounting portion 60 , and the support 10 is mounted on the support mounting portion 70 .

[0057] In this embodiment, the transport plate 80 is a rectangular structure.

[0058] Please refer to Figure 4 An oblique nozzle is located below the air flotation plate 20. Its spray direction aligns with the wafer conveying direction. The oblique nozzle is connected to the airflow guide groove 21 and is used to create a directional airflow below the air flotation plate 20. Together, the oblique nozzle and the airflow guide groove 21 directionalize the airflow, guiding it toward the wafer conveying direction, thereby achieving directional transport of the wafers.

[0059] Specifically, there are multiple oblique nozzles.

[0060] In this embodiment, there are multiple airflow guide grooves 21, each of which is connected to an oblique nozzle, and the multiple airflow guide grooves 21 are spaced apart. Specifically, there are three airflow guide grooves 21 on the air floatation plate 20, which are spaced apart, and each airflow guide groove 21 is connected to multiple oblique nozzles.

[0061] In other embodiments, the number of the air flow guiding grooves 21 on the air floating plate 20 can be adjusted according to actual conditions and is not specifically limited here.

[0062] More preferably, the air floating plate 20 in this embodiment is a square structure.

[0063] In addition, in order to ensure the airtightness of the support 10, a positioning column or a positioning ring can be provided in the groove 12 for positioning and installing the porous medium.

[0064] More preferably, the number of supports 10 is multiple, and the multiple supports 10 are evenly spaced. In the present application, the supports are preferably circular, and the porous medium matched therewith is preferably circular, which has an outstanding effect in ensuring the airtightness effect; if other shapes such as square are used, it is easy to cause the porous medium to have sharp corners, and the airtightness cannot be guaranteed, especially increasing the difficulty in the processing process, and having a higher airtightness requirement.

[0065] Please refer to Figure 5 and combined Figure 1 When the air vent 11 is connected to an external air source, the air flow passes through the porous medium and forms an air film on its surface, thereby suspending the silicon wafer. Since the air flow velocity leaving the porous medium area is always in a deceleration state, the pressure of the air film will decrease with the increase of the radius of the silicon wafer. At the same time, since the silicon wafer itself is light in weight, the negative pressure hole does not work and the air film has weak anti-interference ability. The silicon wafer will slide around during transportation and cannot achieve static suspension. In order to achieve continuous and stable transportation of the silicon wafer, the silicon wafer conveying device also includes a first limit plate 30 and a second limit plate 40. The first limit plate 30 and the second limit plate 40 are parallel and spaced apart. The setting directions of the first limit plate 30 and the second limit plate 40 are consistent with the transportation direction of the silicon wafer. The first limit plate 30 and the second limit plate 40 are used to jointly limit and correct the silicon wafer.

[0066] Specifically, the first limiting plate 30 and the second limiting plate 40 are spaced apart in the width direction of the transport plate 80 , and the first limiting plate 30 and the second limiting plate 40 are respectively disposed at edge positions of the transport plate 80 .

[0067] The first and second limiting plates 30 and 40 are both L-shaped. The L-shaped structures of the first and second limiting plates 30 and 40 restrict the upward and outward movement of the silicon wafers, ensuring that the silicon wafers always move in the direction of transport, thereby improving the transport stability of the silicon wafers.

[0068] Furthermore, in order to achieve anti-collision effect for the silicon wafers during transportation, anti-collision parts are provided on the first limiting plate 30 and the second limiting plate 40. Specifically, the anti-collision parts in this embodiment are rubber-coated cams.

[0069] It should also be noted that the silicon wafer conveying device further includes an air flow guide plate 50 , which is used to generate negative pressure to adsorb the silicon wafers.

[0070] Specifically, there are two airflow guide plates 50, one at each end of the transport plate 80. These airflow guide plates 50 are positioned above the silicon wafers. After connecting to an external air source, the airflow guide plates 50 adjust the airflow to accelerate the movement of the silicon wafers. Furthermore, the airflow guide plates 50 limit the levitation height of the silicon wafers, thereby increasing the rigidity of the air film and further improving transport stability.

[0071] In summary, an embodiment of the present invention provides a silicon wafer conveying device, which includes a support 10, a porous medium and an air flotation plate 20. The support 10 is provided with an air vent 11, which is used to connect to an external first air source. The porous medium is arranged on the support 10, and the porous medium is arranged below the silicon wafer. The pores of the porous medium are used to output positive pressure airflow, thereby forming an air film on the surface of the porous medium. The air flotation plate 20 and the support 10 are arranged adjacent to each other, and the air flotation plate 20 is provided with an airflow guide groove 21, and the setting direction of the airflow guide groove 21 is consistent with the conveying direction of the silicon wafer, and the airflow guide groove 21 is used to guide the airflow. When the silicon wafer transport device 100 is in use, the porous medium supplies air from below the silicon wafer. After the air vents 11 are connected to an external first air source, the air flows through the air vents 11 into the cavities of the porous medium, forming an air film on the surface of the porous medium, thereby suspending the silicon wafer. This reduces surface contact with the silicon wafer, prevents the surface of the silicon wafer from being damaged during transportation, thereby affecting its quality and improving production efficiency. At the same time, the air flow guide grooves 21 of the air float plate 20 can guide the flow direction of the air flow to be consistent with the transportation direction of the silicon wafer, thereby achieving the purpose of directional transportation of the silicon wafer and improving the transportation stability of the silicon wafer. When in use, the silicon wafer transport device 100 can improve the transportation stability of the silicon wafer, reduce the damage rate of the silicon wafer, avoid affecting the quality of the silicon wafer, and improve production efficiency.

[0072] Example 2

[0073] This embodiment provides a conveying method for a silicon wafer conveying device, which is used for using the silicon wafer conveying device. The conveying method can improve the transportation stability of silicon wafers, reduce the damage rate of silicon wafers, avoid affecting the quality of silicon wafers, and improve production efficiency.

[0074] Specifically, the conveying method of the silicon wafer conveying device includes the following steps:

[0075] S1: A first gas source provides a first gas to form a positive pressure airflow;

[0076] Specifically, the vent hole 11 can be connected to an external first gas source, and after the first gas source starts working, it can generate a positive pressure first gas;

[0077] S2: Positive pressure airflow passes through the porous medium, forming an air film on the surface of the porous medium;

[0078] Specifically, an external first air source is connected through the air vent 11 of the support 10, and the first air flow formed is positive pressure. The first air flow enters the porous medium and forms an air film on the surface of the porous medium through the pores of the porous medium, thereby suspending the silicon wafer;

[0079] S3: Non-contact transportation of silicon wafers through air film;

[0080] Specifically, the non-contact conveying achieved by the air film can reduce the risk of damaging the surface of the silicon wafer and avoid affecting the surface quality of the silicon wafer;

[0081] S4: connecting a second air source to the air flotation device to form a second air flow that moves along the air flow guide. The air flow guide ensures that the moving direction of the second air flow is the same as the transport direction of the silicon wafer, thereby achieving directional transport of the silicon wafer.

[0082] Specifically, the air flotation plate 20 is connected to an external second gas source. The second gas can move along the air flow guide grooves 21 on the air flotation plate 20, thereby guiding the second gas to flow in the direction of transport of the silicon wafers, thereby achieving directional transportation of the silicon wafers. At the same time, the air flotation plate 20 is also provided with an oblique nozzle connected to the air flow guide grooves 21. The spray direction of the oblique nozzle is the same as the transportation direction of the silicon wafers. The oblique nozzle can form a directional spray below the air flotation plate 20, further ensuring the directional transportation of the silicon wafers.

[0083] S5: Connecting a plurality of air pipes to the transport plate 80 to form a negative pressure on the transport plate 80, thereby generating a downward suction force;

[0084] Specifically, the transport plate 80 is connected to a third gas source through an air pipe. The third gas generated by the third gas source is a negative pressure, so that the transport plate 80 forms a negative pressure to adsorb the silicon wafers.

[0085] S6: During the wafer conveying process, the limiting components are used to limit and correct the position of the wafers, so that the wafers can be transported stably.

[0086] In this embodiment, the limiting assembly includes a first limiting plate 30 and a second limiting plate 40. The first limiting plate 30 and the second limiting plate 40 are respectively arranged on both sides of the transport plate 80 to limit the upward and outward movement of the silicon wafer, limit and correct the silicon wafer, and ensure stable transportation of the silicon wafer.

[0087] The transport method of the silicon wafer transport device 100 includes providing a first gas from a first gas source to form a positive pressure airflow; the positive pressure airflow passes through a porous medium to form an air film on the surface of the porous medium; and the silicon wafers are transported via the air film. This transport method can improve the production efficiency and production quality of the silicon wafer transport device 100.

[0088] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A silicon wafer conveying device, characterized in that: include: A support, wherein the support is provided with an air vent, and the air vent is used to connect to an external first air source. The support is a circular structure, and a groove is provided in the middle part of the support along the axial direction. The air vent is arranged along the radial direction of the support, and the air vent passes through the side wall of the groove. The groove includes a frustum groove segment and an annular groove segment. One side edge of the frustum groove segment is connected to the outer edge of the annular groove segment, and the other side edge of the frustum groove segment is connected to the support. The air vent is arranged in the annular groove segment, and the diameter of the side of the frustum groove segment close to the annular groove segment is smaller than the diameter of the side of the frustum groove segment away from the annular groove segment. A porous medium, wherein the porous medium is disposed in the groove and below the silicon wafer, and the pores of the porous medium are used to output a positive pressure airflow, thereby forming an air film on the surface of the porous medium; An air flotation plate, the air flotation plate and the support are arranged adjacent to each other, the air flotation plate is provided with an air flow guiding groove, and the setting direction of the air flow guiding groove is consistent with the conveying direction of the silicon wafer, and the air flow guiding groove is used to guide the air flow; An oblique nozzle is provided below the air flotation plate. The spraying direction of the oblique nozzle is the same as the conveying direction of the silicon wafer. The oblique nozzle is connected to the air flow guide groove. The nozzle is used to form a directional air flow below the air flotation plate.

2. The silicon wafer conveying device according to claim 1, wherein: There are multiple airflow guide grooves, all of which are connected to the oblique nozzles, and the multiple airflow guide grooves are arranged at intervals.

3. The silicon wafer conveying device according to claim 1, wherein: The silicon wafer conveying device also includes a first limit plate and a second limit plate. The first limit plate and the second limit plate are parallel and spaced apart. The setting directions of the first limit plate and the second limit plate are consistent with the conveying direction of the silicon wafer. The first limit plate and the second limit plate are used to jointly limit and correct the silicon wafer.

4. The silicon wafer conveying device according to claim 3, characterized in that: The first limiting plate and the second limiting plate are both L-shaped structures, and anti-collision parts are provided on the first limiting plate and the second limiting plate.

5. The silicon wafer conveying device according to claim 1, wherein: The silicon wafer conveying device further includes an air flow guide plate, which is used to generate negative pressure to adsorb the silicon wafer.

6. The silicon wafer conveying device according to claim 1, wherein: There are multiple supports, and the multiple supports are evenly spaced.

7. A method for conveying a silicon wafer conveying device, characterized in that: The silicon wafer conveying device according to any one of claims 1 to 6 is used for conveying, and the conveying method comprises the following steps: The first gas source provides the first gas to form a positive pressure airflow; Positive pressure airflow passes through the porous medium, forming an air film on the surface of the porous medium; Silicon wafers are transported in a non-contact manner via the air film.

8. The method for conveying a silicon wafer conveying device according to claim 7, wherein: The delivery method further comprises: An external first air source is connected through the air vents of the support, and the first air flow formed is positive pressure, enters the porous medium, and forms an air film on the surface of the porous medium, thereby suspending the silicon wafer; The air flotation plate is connected to a second air source, and the generated second airflow moves along the airflow guide groove. The airflow guide groove makes the moving direction of the second airflow coincide with the transport direction of the silicon wafer, thereby realizing directional transport of the silicon wafer; During the transportation of the silicon wafers, the limiting assembly is used to limit and correct the position of the silicon wafers, so that the silicon wafers can be transported stably.

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