Thermal superconducting heat-dissipating plate and heat-dissipating device with heat storage function and preparation method thereof

Abstract

The application provides a heat superconducting heat-dissipating plate and heat-dissipating device with heat storage function and a preparation method thereof. The heat superconducting heat-dissipating plate combines the blown heat superconducting plate and the phase change heat storage part to form the heat superconducting plate with heat storage function, so that the heat superconducting plate has the functions of heat storage and rapid heat conduction and dissipation. The blown heat superconducting plate is the main body of heat conduction and dissipation, is a thin plate type device, has high heat conduction rate, good temperature uniformity, high reliability and low cost. The phase change heat storage material absorbs a large amount of heat by using phase change latent heat at the phase change temperature, and can temporarily store the excess heat. The heat superconducting heat-dissipating device composed of multiple heat superconducting heat-dissipating plates and heat-dissipating device substrates can effectively solve the design problem of the heat-dissipating device of the intermittent operation electronic device and the transient overload electrical equipment, so that the heat-dissipating device has the double functions of heat storage and heat dissipation, has high heat conduction rate, large heat dissipation capacity, small volume, light weight, low cost, energy saving and material saving and other advantages.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a thermal superconducting heat sink and a heat sink with heat storage function, and a method for preparing the same. Background Technology

[0002] With the rapid development of semiconductor and electronic technologies, the integration and power of high-power devices are becoming increasingly higher. While electronic devices are significantly increasing their power, the requirements for small size and light weight are also increasing. The heat dissipation problem of electronic devices has become a bottleneck restricting the development of modern electronic equipment.

[0003] Electronic devices typically operate under short-term overload or intermittent conditions, such as the starting overload of traction and drive equipment, and the intermittent operation of radar, radio frequency, and laser equipment. Currently, thermal engineers usually design heat sinks based on the heat dissipation requirements of electronic devices under maximum load and most severe operating conditions. This results in large, heavy, and costly heat sinks, causing unnecessary losses and waste, and failing to meet the demands of modern electronic equipment development. Furthermore, some heat sinks have heat storage functions, but their heat storage components have poor thermal conductivity and slow heat storage efficiency, significantly impacting their heat dissipation performance in special environments. For example, using steam, hot water, or even electric heating as a heat storage source is feasible, but it involves large-scale engineering, high costs, and poses safety hazards such as leaks.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application.

[0005] In view of the above, it is necessary for the present invention to provide a thermal superconducting heat sink and heat sink with heat storage function and its preparation method, so as to solve the problem of slow heat dissipation and high cost of electronic devices under maximum load and most severe working conditions in the prior art, so as to meet the development trend requirements of modern electronic devices. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a thermal superconducting heat sink and heat sink with heat storage function and its preparation method, so as to solve the problem of slow heat dissipation and high cost of electronic devices under maximum load and most severe working conditions in the prior art, so as to meet the development trend requirements of modern electronic devices.

[0007] To achieve the above and other related objectives, the present invention provides a thermal superconducting heat sink with heat storage function, the thermal superconducting heat sink with heat storage function comprising:

[0008] The blown thermal superconducting plate includes two opposite sides, and at least one side is provided with interconnected network-like protruding heat transfer pipes. The heat transfer pipes are filled with heat transfer working fluid and are sealed to the outside. The heat transfer working fluid is used to rapidly conduct heat from the heat transfer pipes to the entire surface of the blown thermal superconducting plate.

[0009] A phase change heat storage unit is disposed on the side of the blown thermal superconducting plate. The phase change heat storage unit is used to store and release heat. The phase change heat storage unit includes a heat storage unit shell, heat-conducting fins, and phase change heat storage material. The heat-conducting fins are corrugated fins, disposed on the blown thermal superconducting plate, and fixedly connected to the inner surface of the heat storage unit shell. The two ends of the heat-conducting fins maintain a gap with the heat storage unit shell. The heat storage unit shell and the blown thermal superconducting plate constitute a sealed heat storage unit cavity. The phase change heat storage material fills the heat storage cavity. The heat-conducting fins are evenly distributed in the phase change heat storage material to increase the thermal conductivity of the phase change heat storage material and improve the heat storage and heat release rate of the phase change heat storage material.

[0010] Optionally, the phase change heat storage section is disposed on the lower part of the side of the blown thermal superconducting plate.

[0011] Optionally, the number of phase change heat storage units is two, which are respectively disposed on both sides of the blown thermal superconducting plate.

[0012] Optionally, the phase change heat storage material is an organic phase change heat storage material, and it fills the cavity of the heat storage section; when the temperature of the thermal superconducting heat sink is higher than the phase change temperature of the phase change heat storage material, the phase change heat storage material changes from a solid phase to a liquid phase to absorb heat and temporarily store the heat, and the temperature of the thermal superconducting heat sink no longer rises; when the temperature of the thermal superconducting plate is lower than the phase change temperature of the phase change heat storage material, the phase change heat storage material changes from a liquid phase to a solid phase to release heat, which is then conducted out and dissipated by the thermal superconducting heat sink.

[0013] Optionally, the heat-conducting fins are aluminum alloy corrugated fins, the spacing between two adjacent corrugations is in the range of 2mm to 5mm, the thickness of the heat-conducting fins is in the range of 0.1mm to 1.0mm, and the height of the heat-conducting fins is in the range of 10mm to 50mm.

[0014] Optionally, the thermal superconducting heat sink with heat storage function further includes heat dissipation fins, which are disposed on the side of the blown thermal superconducting plate excluding the phase change heat storage part.

[0015] Optionally, the heat dissipation fins are aluminum alloy corrugated fins, the spacing between two adjacent corrugations is in the range of 2mm to 5mm, the thickness of the heat dissipation fins is in the range of 0.1mm to 1.0mm, and the height of the heat dissipation fins is in the range of 50mm to 100mm.

[0016] The present invention also provides a thermal superconducting radiator with heat storage function, the thermal superconducting radiator with heat storage function comprising:

[0017] The thermal superconducting heat sink with heat storage function described in any of the above items;

[0018] A heat sink substrate, wherein one surface of the heat sink substrate is provided with a number of pre-arranged parallel grooves for inserting the heat storage superconducting heat sink plate vertically and parallelly into the grooves.

[0019] Optionally, one end of the phase change heat storage section of the thermal superconducting heat sink with heat storage function is close to the heat sink substrate.

[0020] This invention also provides a method for preparing a thermal superconducting heat sink with heat storage function, the method comprising:

[0021] S1: Two aluminum plates are provided, at least one of the aluminum plates is provided with a slurry coating in the shape of a pipe, the two aluminum plates are fastened together and riveted to fix them, wherein the slurry coating surface is located on the inner side, and a blown plate with a network of interconnected protruding heat transfer pipes is prepared by a rolling blown plate process.

[0022] S2: Provide a heat storage housing and heat-conducting fins, and arrange the heat-conducting fins on the inner surface of the heat storage housing and the surface of the blown plate, and braze them together to form an assembly, wherein the two ends of the heat-conducting fins maintain a gap with the heat storage housing;

[0023] S3: Vacuum the blown plate in the assembly, fill it with a preset amount of heat transfer medium, and seal the injection port to form a blown thermal superconducting plate.

[0024] S4: Provide a phase change heat storage material, heat and melt the phase change heat storage material into a liquid, fill the cavity of the heat storage part, and seal it to finally obtain the heat superconducting heat sink with heat storage function.

[0025] As an example, step S2 further includes providing heat dissipation fins, which are disposed on the side of the blown plate excluding the heat storage housing and are brazed together.

[0026] The present invention also provides a method for preparing a thermal superconducting heat sink with heat storage function, the method comprising:

[0027] The method for preparing a thermal superconducting heat sink with heat storage function as described in any of the above-mentioned items;

[0028] A heat sink substrate is provided, wherein one surface of the heat sink substrate is provided with a number of pre-arranged parallel grooves, and a heat superconducting heat sink with heat storage function is vertically inserted into the grooves at parallel intervals and fixedly connected.

[0029] As described above, the thermal superconducting heat sink and heat exchanger with heat storage function of the present invention and their preparation method have the following beneficial effects: The thermal superconducting heat sink with heat storage function of the present invention combines a blown thermal superconducting plate with a phase change heat storage part to form a thermal superconducting plate with heat storage function, which has the functions of heat storage and rapid heat conduction and heat dissipation. The blown thermal superconducting plate, as the main body for heat conduction and heat dissipation, is a thin plate device with fast heat conduction rate, good temperature uniformity, high reliability, and low cost. The phase change heat storage material, at the phase change temperature, utilizes the latent heat of phase change to absorb a large amount of heat with a small volume and weight, and can temporarily store excess heat; the thermally conductive fins of the thermal superconducting heat sink with heat storage function of the present invention... The heat sink features wavy, corrugated fins connected to a blown thermal superconducting plate and situated within a phase change heat storage material. This design results in a short, fast heat conduction path and high thermal efficiency, while simultaneously addressing the technical challenges of low thermal conductivity, high thermal resistance, and slow heat storage and release rates in phase change heat storage materials. The thermal superconducting heat sink of this invention has a plate-type structure, making it convenient to use, highly efficient, and leak-proof. The thermal superconducting heat sink of this invention consists of multiple thermal superconducting heat sinks with heat storage functions and a heat sink substrate. It effectively solves the heat sink design challenges for intermittently operating electronic devices and electrical equipment subjected to transient overloads, resulting in a heat sink with advantages such as fast heat conduction rate, large heat dissipation capacity, small size, light weight, low cost, and energy and material savings. Attached Figure Description

[0030] Figure 1 The diagram shown is a structural schematic of a first embodiment of the thermal superconducting heat sink with heat storage function of the present invention.

[0031] Figure 2 The diagram shown is an exploded view of a first embodiment of the thermal superconducting heat sink with heat storage function of the present invention.

[0032] Figure 3 Displayed as Figure 1 A cross-sectional schematic diagram.

[0033] Figure 4 Displayed as Figure 3 A magnified view of a portion of the image.

[0034] Figure 5 The diagram shown is a schematic representation of a second embodiment of the thermal superconducting heat sink with heat storage function of the present invention.

[0035] Figure 6 The diagram shown is a structural schematic of Embodiment 3 of the thermal superconducting heat sink with heat storage function of the present invention.

[0036] Figure 7 The diagram shown is an exploded view of Embodiment 3 of the thermal superconducting heat sink with heat storage function of the present invention.

[0037] Figure 8 The diagram shown is a structural schematic of Embodiment 4 of the thermal superconducting heat sink with heat storage function of the present invention.

[0038] Figure 9 The diagram shown is a structural schematic of Embodiment 5 of the thermal superconducting heat sink with heat storage function of the present invention.

[0039] Figure 10 The diagram shown is a structural schematic of Embodiment Six of the thermal superconducting radiator with heat storage function of the present invention.

[0040] Figure 11 Displayed as Figure 10 A side view diagram.

[0041] Figure 12 The diagram shows a process flow diagram of the preparation method of the thermal superconducting heat sink with heat storage function according to the present invention.

[0042] Component designation explanation

[0043] 10 Inflatable thermal superconducting plate

[0044] 11 Heat transfer piping

[0045] 20 Phase Change Heat Storage Unit

[0046] 21 Heat storage unit shell

[0047] 22 Thermal fins

[0048] 23 Phase Change Thermal Storage Materials

[0049] 30 Heat dissipation fins

[0050] 40 Heatsink base plate

[0051] 50 Heating electronic devices Detailed Implementation

[0052] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0053] When describing the embodiments of the present invention in detail, for ease of explanation, the cross-sectional views showing the device structure will be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of the present invention.

[0054] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one structure or feature shown in the accompanying drawings and other structures or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the accompanying drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it can be the only layer between the two layers, or there may be one or more layers in between. The term “between” as used herein includes both endpoint values.

[0055] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are formed in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0056] Please see Figures 1 to 12 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0057] Example 1

[0058] like Figures 1 to 4 As shown, this embodiment provides a thermal superconducting heat sink with heat storage function. The thermal superconducting heat sink with heat storage function includes: a blown thermal superconducting plate 10. The blown thermal superconducting plate 10 includes two opposite sides. At least one side is provided with interconnected network-like protruding heat transfer pipes 11. The heat transfer pipes 11 are filled with heat transfer medium and are isolated and sealed from the outside. The heat transfer medium is used to rapidly conduct heat along the heat transfer pipes to the entire surface of the blown thermal superconducting plate 10.

[0059] A phase change heat storage unit 20 is disposed on the side of the blown thermal superconducting plate 10. The phase change heat storage unit 20 is used for temporary heat storage and heat release. The phase change heat storage unit 20 includes a heat storage unit shell 21, heat-conducting fins 22, and phase change heat storage material 23. The heat-conducting fins 22 are wavy fins disposed on the blown thermal superconducting plate 10 and fixedly connected to the inner surface of the heat storage unit shell 21. The two ends of the heat-conducting fins 22 maintain a gap with the heat storage unit shell 21. The heat storage unit shell 21 and the blown thermal superconducting plate 10 constitute a sealed heat storage unit cavity. The phase change heat storage material 23 is filled in the heat storage unit cavity. The heat-conducting fins 22 are evenly distributed in the phase change heat storage material 23 to increase the thermal conductivity of the phase change heat storage material 23 and improve the heat storage and heat release rate of the phase change heat storage material 23.

[0060] It should be noted that the opposite sides of the blown thermal superconducting plate 10 can have interconnected raised heat transfer pipes 11 on one side (a raised surface) and the other side flat, or both opposite sides can have interconnected raised heat transfer pipes 11 (both raised surfaces). The blown thermal superconducting plate 10 is manufactured by a blown process. In this embodiment, only one side has interconnected raised heat transfer pipes 11. The ends of the heat-conducting fins 22 maintain a gap with the heat storage housing 21 to maintain the communication of the phase change heat storage material 23 and accelerate the heat storage and release rates.

[0061] The working principle of the thermal superconducting heat sink with phase change heat storage function is as follows: When the thermal superconducting heat sink with heat storage function comes into contact with a heat source, the blown thermal superconducting plate 10 rapidly conducts heat to the rest of the surface of the blown thermal superconducting plate 10 through the heat transfer medium in the heat transfer pipe 11. Most of the heat is released to the external environment through convection heat exchange between the blown thermal superconducting plate 10 and the surrounding air. Another part of the heat is conducted from the surface of the blown thermal superconducting plate 10 to the phase change heat storage part 20, and then conducted to the phase change heat storage material 23 surrounding it through the heat-conducting fins 22. The phase change heat storage material 23 absorbs the heat. When the temperature on the thermal superconducting heat sink is higher than the phase change temperature of the phase change heat storage material, the phase change heat storage material 23 begins to gradually melt from a solid to a liquid phase change material. During this process, it continuously absorbs heat, and the temperature of the thermal superconducting heat sink remains basically unchanged. The temperature only begins to rise again after the solid phase change heat storage material 23 has completely melted. When the heat generated by the superconducting heat sink with heat storage function in contact with the heat source decreases, the temperature of the superconducting heat sink drops. When the temperature of the superconducting heat sink falls below the phase change temperature of the phase change heat storage material, the phase change heat storage material begins to gradually change from liquid to solid, releasing heat. This heat temporarily stored in the phase change heat storage material 23 is conducted to the blown superconducting heat sink 10 through the heat-conducting fins 22, then conducted to the entire surface of the blown superconducting heat sink 10 through the heat transfer medium within the blown superconducting heat sink 10, and finally released to the external environment through convective heat exchange between the blown superconducting heat sink 10 and the surrounding air. This ensures that even when the heat load of the heat source suddenly increases, the temperature can still be maintained at a certain level for safe operation, achieving a heat storage and heat dissipation effect with thermal buffering capacity.

[0062] In this embodiment, the thermal superconducting heat sink combines the blown thermal superconducting plate 10 with the phase change heat storage unit 20 to form a thermal superconducting heat sink with heat storage function, enabling it to have both heat storage and rapid heat conduction and dissipation functions. The blown thermal superconducting plate 10, as the main body for heat conduction and dissipation, is a thin-plate device with fast heat conduction rate, good temperature uniformity, high reliability, and low cost. At the phase change heat storage temperature, the phase change heat storage material utilizes the latent heat of phase change to absorb a large amount of heat with a small volume and weight, temporarily storing excess heat. This embodiment of the thermal superconducting heat sink with heat storage function... The heat-conducting fins 22 are wavy, corrugated fins connected to the blown thermal superconducting plate 10 and evenly distributed in the phase change heat storage material 23. They are used to increase the thermal conductivity of the phase change heat storage material 23 and improve its heat storage and release rates, resulting in a short heat conduction path, high rate, and high thermal efficiency. At the same time, it solves the technical problems of low thermal conductivity, high thermal resistance, and slow heat storage and release rates of the phase change heat storage material 23. The thermal superconducting heat sink with heat storage function in this embodiment has a plate structure, which is convenient to use, highly efficient, and leak-proof.

[0063] like Figure 1 and Figure 3 As shown, as an example, the phase change heat storage unit 20 is disposed on the lower part of the side of the blown thermal superconducting plate 10.

[0064] In this embodiment, the phase change heat storage unit 20 is disposed on the lower part of the side of the blown thermal superconducting plate 10. This facilitates close contact between the phase change heat storage unit 20 and the heat source when the heat-storing superconducting heat sink with heat storage function approaches the heat source, enabling the phase change heat storage unit 20 to store and release heat, thus accelerating the process. Of course, the phase change heat storage unit 20 can also be disposed at any position on the side of the blown thermal superconducting plate 10, and can be selected according to actual needs. No limitation is made here.

[0065] As an example, the phase change heat storage material 23 is an organic phase change heat storage material, such as paraffin wax, and fills the cavity of the heat storage section. When the temperature of the thermal superconducting heat sink is higher than the phase change temperature of the phase change heat storage material, the phase change heat storage material 23 changes from a solid phase to a liquid phase to absorb heat and temporarily store the heat, and the temperature of the thermal superconducting heat sink no longer rises; when the temperature of the thermal superconducting heat sink is lower than the phase change temperature of the phase change heat storage material, the phase change heat storage material 23 changes from a liquid phase to a solid phase to release heat, which is then conducted out and dissipated by the thermal superconducting heat sink.

[0066] The phase change heat storage material 23 absorbs and stores a large amount of heat with a small volume and weight by utilizing the latent heat of phase change at its own phase change temperature, and the temperature remains constant during the heat storage process. Specifically, the spatial proportion of the phase change heat storage material 23 in the heat storage cavity can be set according to the actual situation. In this embodiment, the heat storage cavity is filled with the phase change heat storage material 23 to accelerate the heat storage and heat release rate.

[0067] As an example, the connection between the blown thermal superconducting plate 10 and the phase change heat storage unit 20 is brazing.

[0068] By using solder with a melting point lower than that of the base material, the liquid brazing filler metal is used to fill the space between the blown thermal superconducting plate 10 and the phase change heat storage part 20, connecting them together. The phase change heat storage part 20, which is connected to the blown thermal superconducting plate 10, includes the periphery of the heat storage part shell 21 and the heat-conducting fins 23. The heat-conducting fins 23 are directly brazed to the blown thermal superconducting plate and the inner surface of the heat storage part shell 21, and are located in the phase change heat storage material 23. This results in a short heat conduction path, fast rate, and high thermal efficiency during the storage and release of heat, solving the technical problems of low thermal conductivity, high thermal resistance, and slow rate of the phase change heat storage material 23.

[0069] The phase change heat storage unit 20 can be disposed on one side of the protruding surface of the blown thermal superconducting plate 10, or it can be disposed on one side of the flat surface of the blown thermal superconducting plate 10. In this embodiment, for example... Figures 1 to 2 As shown, it is preferable to place the phase change heat storage unit 20 on one side of the flat surface of the blown thermal superconducting plate 10 to facilitate brazing between the two. If the phase change heat storage unit 20 is placed on one side of the raised surface of the blown thermal superconducting plate 10, then the connection between the heat storage unit shell 21 and the heat storage unit fins 23 and the blown thermal superconducting plate 10 needs to be made of a composite solder plate with a solder layer on both sides and a substrate in the middle. Alternatively, the external shape of the heat transfer pipe 11 can be changed to match, which increases the process steps and difficulty. Or, more solder can be used for brazing, which increases the cost. It can also be set according to actual needs, and there is no restriction here.

[0070] like Figure 2As shown, as an example, the heat-conducting fin 22 is an aluminum alloy corrugated fin, and the spacing between two adjacent corrugations ranges from 2mm to 5mm, for example, it can be 2mm, 3mm, 4mm, or 5mm; the thickness of the heat-conducting fin 22 ranges from 0.1mm to 1.0mm, for example, it can be 0.1mm, 0.3mm, 0.5mm, 0.7mm, or 1mm; the height of the heat-conducting fin 22 ranges from 10mm to 50mm, for example, it can be 10mm, 20mm, 30mm, 40mm, or 50mm.

[0071] It should be noted that the spacing, thickness and height between each fold of the heat-conducting fin 22 should be consistent, in order to facilitate processing and maintain uniformity during heat conduction.

[0072] As an example, the heat transfer pipe 11 is a vacuum-sealed system, and the heat transfer medium filled inside it is a fluid. The heat transfer pipe 11 can be manufactured using a blow-filling process, and the heat transfer medium can be a gas, a liquid, or a mixture of gas and liquid. In this embodiment, the heat transfer medium is preferably a mixture of liquid and gas, and the liquid occupies a proportion of 10% to 50% of the space of the heat transfer pipe 11, for example, 10%, 20%, 30%, 40%, or 50%. The interconnected heat transfer pipes 11 cover the entire side of the blow-filled thermal superconducting plate 10, making the temperature of the entire blow-filled thermal superconducting plate 10 uniform and the heat transfer efficiency high. The vacuum-sealed environment further ensures and improves the heat transfer efficiency and heat transfer capacity of the blow-filled thermal superconducting plate 10. Of course, one side of the blown thermal superconducting plate with the heat transfer pipe 11 is also provided with a pipe connected to the heat transfer pipe 11 for extracting non-condensable gas and injecting the heat transfer medium.

[0073] As an example, the heat transfer pipes 11 are distributed on the plate surface in at least one of the following shapes: circular honeycomb, hexagonal honeycomb, quadrilateral honeycomb, crisscrossing mesh, series-connected triangles, and rhombuses. The specific shape of the heat transfer pipes 11 can be selected according to actual needs and is not limited here.

[0074] Example 2

[0075] like Figure 5As shown, this embodiment provides a thermal superconducting heat sink with heat storage function. The difference between this thermal superconducting heat sink and the one in Embodiment 1 is that the number of phase change heat storage units 20 is two. Increasing the number of phase change heat storage units 20 accelerates heat storage. The phase change heat storage units 20 can be disposed on the same side of the blown thermal superconducting plate, or they can be disposed on both sides. For uniformity and convenience of heat conduction during operation, in this embodiment, it is preferable to symmetrically arrange the phase change heat storage units 20 on the lower part of both sides of the blown thermal superconducting plate 10.

[0076] Example 3

[0077] like Figures 6 to 7 As shown, this embodiment provides a thermal superconducting heat sink with heat storage function. The difference between the thermal superconducting heat sink and the first embodiment is that the thermal superconducting heat sink further includes heat dissipation fins 30, which are disposed on the side of the blown thermal superconducting plate 10 except for the phase change heat storage part 20.

[0078] The blown thermal superconducting plate 10 is provided with heat dissipation fins 30 to increase the heat dissipation area and improve the heat dissipation capacity, while reducing the weight and cost of the thermal superconducting heat dissipation plate.

[0079] In this embodiment, the phase change heat storage unit 20 is disposed on the lower part of one side of the plane of the blown thermal superconducting plate 10, and the heat dissipation fins 30 are disposed on the plane of the blown thermal superconducting plate 10 excluding the phase change heat storage unit 20.

[0080] As an example, the connection between the blown thermal superconducting plate 10 and the heat dissipation fins 30 is brazing.

[0081] As an example, the heat dissipation fins 30 are aluminum alloy corrugated fins, and the spacing between two adjacent corrugations ranges from 2mm to 5mm, for example, 2mm, 3mm, 4mm, or 5mm; the thickness of the heat dissipation fins 30 ranges from 0.1mm to 1.0mm, for example, 0.1mm, 0.3mm, 0.5mm, 0.7mm, or 1mm; the height of the heat dissipation fins 30 ranges from 50mm to 100mm, for example, 50mm, 60mm, 70mm, 80mm, 90mm, or 100mm.

[0082] It should be noted that the spacing, thickness and height between each fold of the heat dissipation fin 30 should be consistent. This is not only convenient for processing, but also facilitates the convective heat exchange between the blown thermal superconducting plate 10 and the outside air through itself and the heat dissipation fin 30, thereby releasing heat into the external environment and improving the heat dissipation rate.

[0083] Example 4

[0084] like Figure 8 As shown, this embodiment provides a thermal superconducting heat sink with heat storage function. The difference between the thermal superconducting heat sink and Embodiment 3 is that the thermal superconducting heat sink further includes a second heat sink 30. The second heat sink 30 is disposed on one side of the protruding surface of the blown thermal superconducting plate 10 to further increase the heat dissipation area and improve the heat dissipation capacity.

[0085] In this embodiment, the phase change heat storage unit 20 is disposed on the lower part of one side of the plane of the blown thermal superconducting plate 10, the first heat dissipation fin 30 is disposed on the plane of the blown thermal superconducting plate 10 excluding the phase change heat storage unit 20, and the second heat dissipation fin 30 is disposed on one side of the protruding surface of the blown thermal superconducting plate 10.

[0086] Example 5

[0087] like Figure 9 As shown, this embodiment provides a thermal superconducting heat sink with heat storage function. The difference between the thermal superconducting heat sink and the one in Embodiment 4 is that the thermal superconducting heat sink further includes a second phase change heat storage part 20. The second phase change heat storage part 20 is disposed on the lower part of one side of the protruding surface of the blown thermal superconducting plate 10, and is symmetrically arranged with the first phase change heat storage part 20 to increase the heat storage.

[0088] In this embodiment, the two phase change heat storage units 20 are symmetrically arranged on the lower part of the two sides of the blown thermal superconducting plate 10, and the two heat dissipation fins 30 are symmetrically arranged on the sides of the blown thermal superconducting plate 10 except for the phase change heat storage units 20.

[0089] Example 6

[0090] like Figures 10 to 11 As shown, this embodiment provides a thermal superconducting heat sink with heat storage function, the thermal superconducting heat sink comprising:

[0091] The thermal superconducting heat sink with heat storage function described in any one of Examples 1 to 5;

[0092] The heat sink substrate 40 has a number of parallel grooves on one surface for inserting the heat storage superconducting heat sink plate vertically and parallelly into the grooves.

[0093] Of course, the heat-storage superconducting heat sink also includes a heat-generating electronic device 50, which is disposed on another surface of the heat sink substrate 40. The heat-generating electronic device 50 generates heat when it is working, and the heat-storage superconducting heat dissipation plate is used to dissipate the heat generated by the heat-generating electronic device 50.

[0094] The working principle of the thermal superconducting heat sink with heat storage function is as follows: The heating electronic component 50 is fixed on the heat sink substrate 40. When the heating electronic component 50 is instantaneously overloaded or intermittently fully loaded, a large amount of heat generated instantaneously is conducted through the heat sink substrate 40 to the lower part of the thermal superconducting heat sink with phase change heat storage function. The blown thermal superconducting plate 10, through the heat transfer medium in the heat transfer pipe 11, rapidly conducts the heat along the network of heat transfer pipes 11 to the other surfaces of the entire blown thermal superconducting plate 10. Most of the heat is released to the external environment through convective heat exchange between the blown thermal superconducting plate itself and the surrounding air. If the thermal superconducting heat sink has heat dissipation fins 30, most of the heat is released to the external environment through convective heat exchange between the blown thermal superconducting plate 10 itself and the heat dissipation fins 30 and the surrounding air.

[0095] Another portion of the heat is transferred from the surface of the blown thermal superconducting plate 10 to the phase change heat storage fins 22, and then conducted through the heat-conducting fins 22 to the phase change heat storage material 23 surrounding it. When the temperature of the blown thermal superconducting plate combined with the phase change heat storage part is higher than the phase change temperature of the phase change heat storage material, the phase change heat storage material 23 begins to change from solid to liquid to absorb heat. During this process, it continuously absorbs heat, and the temperature of the thermal superconducting heat sink and the corresponding heat-generating electronic device are maintained within a certain small range of fluctuation. When the heat-generating electronic component 50 is working normally or intermittently stopping, the heat generated decreases, and the heat conducted from the heat sink substrate 40 to the blown thermal superconducting plate 10 decreases, resulting in a lower temperature. When the temperature of the thermal superconducting heat sink is lower than the phase change temperature of the phase change heat storage material, the phase change heat storage material 23 begins to change from liquid to solid to release heat. This heat temporarily stored in the phase change heat storage material 23 is conducted to the blown thermal superconducting plate 10 through the heat-conducting fins 22, and then conducted to the entire surface of the blown thermal superconducting plate 10 through the heat transfer medium within the blown thermal superconducting plate 10. Then, the heat is released into the external environment through convective heat exchange between the blown thermal superconducting plate itself and the surrounding air. If the thermal superconducting heat sink has heat dissipation fins 30, the heat is released into the external environment through convective heat exchange between the blown thermal superconducting plate 10 itself and the heat dissipation fins 30 and the surrounding air. As the overload and normal operation, or the intermittent full load and intermittent stop, of the heat-generating electronic component 50 change, the phase change heat storage section 20 also cycles through heat storage and heat release, thereby ensuring that the thermal superconducting heat sink can withstand the impact of intermittent transient large heat under constant heat dissipation capacity and meet the heat dissipation requirements of the heat-generating electronic component.

[0096] As an example, one end of the phase change heat storage section 20 of the thermal superconducting heat sink with heat storage function is close to the heat sink substrate 40. This arrangement allows the phase change heat storage section 20 to be placed close to the heat-generating electronic component 50, thereby accelerating the heat storage and release rate.

[0097] The thermal superconducting heat sink with heat storage function of the present invention can effectively solve the design problem of heat sink for intermittently operating electronic devices and electrical equipment subjected to transient overload, so that the heat sink has the advantages of fast heat conduction rate, large heat dissipation capacity, small size, light weight, low cost, energy saving and material saving.

[0098] Example 7

[0099] like Figure 12 As shown, this embodiment provides a method for preparing a thermal superconducting heat sink with heat storage function, used to prepare any one of the embodiments one to five above. The method for preparing the thermal superconducting heat sink with heat storage function includes:

[0100] First, in step S1, two aluminum plates are provided, at least one of which has a slurry coating in the shape of a pipe. The two aluminum plates are fastened together and riveted, with the slurry coating surface located on the inside. A blown plate with interconnected network-like protrusions of heat transfer pipes 11 is prepared by a rolling and blowing process.

[0101] Next, step S2 is performed, providing a heat storage housing 21 and heat-conducting fins 22. The heat-conducting fins 22 are disposed on the inner surface of the heat storage housing 21 and the surface of the blown plate, and brazed together to form an assembly, wherein the two ends of the heat-conducting fins maintain a gap with the heat storage housing.

[0102] In this embodiment, when forming the assembly, the components are connected by a composite solder plate. The composite solder plate is respectively disposed on the inner surface of the heat storage housing 21 and the surface of the blown plate. The heat-conducting fins are disposed inside the heat storage housing 21 and between the composite solder plate of the blown plate, and fixed with a welding clamp at one end near the blown plate. The fixed assembly is then connected and sent into a brazing furnace for brazing connection.

[0103] It should be noted that, because the heat transfer pipes 11 on the inflated plate are raised, the composite solder plate has a better welding effect when connecting with other components. Compared with solder flakes, i.e. pure solder, the solder flakes will flow to the areas without pipe protrusions after melting, causing poor welding in some areas where there is no solder.

[0104] As an example, step S2 further includes providing heat dissipation fins 30, which are disposed on the side of the blown plate excluding the heat storage housing 21 and are brazed together.

[0105] In this embodiment, the connection between the heat dissipation fins 30 and the blown plate is also achieved by fixing the composite solder plate with a welding fixture and sending them together into the brazing furnace for brazing connection.

[0106] Next, in step S3, the blown plate in the assembly is evacuated, a preset amount of heat transfer medium is injected, and the injection port is sealed to form a blown thermal superconducting plate 10.

[0107] In this embodiment, a mixed heat transfer medium of gas and liquid is used, and the vacuum sealing environment further ensures and improves the heat transfer efficiency and heat transfer capacity of the blown thermal superconducting plate 10.

[0108] Finally, in step S4, phase change heat storage material 23 is provided, the phase change heat storage material 23 is heated and melted into a liquid and filled into the cavity of the heat storage part, and then sealed to finally obtain the heat superconducting heat sink with heat storage function.

[0109] In this embodiment, the phase change heat storage material 23 is preferably paraffin wax, and it is filled into the cavity of the heat storage part.

[0110] Example 8

[0111] This embodiment provides a method for preparing a thermal superconducting radiator with heat storage function, used to prepare the above-mentioned embodiment six. The method for preparing the thermal superconducting radiator with heat storage function includes:

[0112] The method for preparing a thermal superconducting heat sink with heat storage function as described in Example 7 above;

[0113] A heat sink substrate 40 is provided, and a number of parallel grooves are provided on one surface of the heat sink substrate 40. The heat superconducting heat sink with heat storage function is vertically inserted into the grooves at parallel intervals and fixedly connected.

[0114] Of course, the method for preparing the heat-storing superconducting heat sink also includes bringing the other side of the heat sink substrate 40 close to the heat-generating electronic device 50, or directly connecting the heat-generating electronic device 50 to the other side of the heat sink substrate 40, so that the heat-storing superconducting heat sink can dissipate heat for the heat-generating electronic device 50.

[0115] As an example, the bonding method between the thermal superconducting heat dissipation plates of the heat sink substrate 40 can be any one of mechanical extrusion embedding, welding, and thermally conductive adhesive bonding. The specific method can be selected according to actual needs and is not limited here.

[0116] It should be noted that during installation and preparation, one end of the phase change heat storage section 20 of the thermal superconducting heat sink with heat storage function is close to the heat sink substrate 40 to facilitate heat dissipation for the heat-generating electronic device 50. In summary, this invention provides a thermal superconducting heat sink and a heat sink. The thermal superconducting heat sink includes: a blown thermal superconducting plate 10, which includes two opposing sides, at least one side having interconnected network-like protruding heat transfer pipes 11. The heat transfer pipes 11 are filled with a heat transfer medium, which is used to rapidly conduct heat along the heat transfer pipes to the entire surface of the blown thermal superconducting plate 10; and a phase change heat storage section 20, which is disposed on the side of the blown thermal superconducting plate 10. The phase change heat storage section 20 is used to store and release heat, and includes heat storage... The heat storage unit comprises a housing 21, heat-conducting fins 22, and phase change heat storage material 23. The heat-conducting fins 22 are corrugated fins, disposed on the blown thermal superconducting plate 10, and fixedly connected to the inner surface of the heat storage unit housing 21. The two ends of the heat-conducting fins 22 maintain a gap with the heat storage unit housing 21. The heat storage unit housing 21 and the blown thermal superconducting plate 10 constitute a heat storage cavity. The phase change heat storage material 23 is filled in the heat storage cavity. The heat-conducting fins are evenly distributed in the phase change heat storage material to increase the thermal conductivity of the phase change heat storage material 23 and improve the heat storage and heat release rate of the phase change heat storage material. The thermal superconducting heat sink of this invention combines a blown thermal superconducting plate with a phase change heat storage component to form a thermal superconducting plate with heat storage function. This allows it to perform both heat storage and rapid heat conduction and dissipation. The blown thermal superconducting plate, as the main body for heat conduction and dissipation, is a thin-plate device with fast heat conduction rate, good temperature uniformity, high reliability, and low cost. The phase change heat storage material, at the phase change temperature, utilizes the latent heat of phase change to absorb a large amount of heat with a small volume and weight, temporarily storing excess heat. The heat-conducting fins of the thermal superconducting heat sink of this invention are corrugated fins connected to the blown thermal superconducting plate. The heat exchanger is located on top of a phase change heat storage material, resulting in a short, fast heat conduction path and high thermal efficiency. It also solves the technical problems of low thermal conductivity, high thermal resistance, and slow heat storage and release rates in phase change heat storage materials. The superconducting heat sink of this invention has a plate structure, making it convenient to use, highly efficient, and leak-proof. The superconducting heat sink of this invention consists of multiple superconducting heat sinks with heat storage functions and a heat sink substrate. It effectively solves the design problems of heat sinks for intermittently operating electronic devices and electrical equipment subjected to transient overloads, giving the heat sink advantages such as fast heat conduction rate, large heat dissipation capacity, small size, light weight, low cost, and energy and material savings. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0117] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A thermal superconducting heat dissipation plate with heat storage function, characterized in that, The heat-conducting heat sink with heat storage function includes: The blown thermal superconducting plate includes two opposite sides, and at least one side is provided with interconnected network-like protruding heat transfer pipes. The heat transfer pipes are filled with heat transfer working fluid and are sealed to the outside. The heat transfer working fluid is used to rapidly conduct heat along the heat transfer pipes to the entire surface of the blown thermal superconducting plate. A phase change heat storage unit is disposed on the lower part of the side of the blown thermal superconducting plate. The phase change heat storage unit is used to store and release heat. The phase change heat storage unit includes a heat storage unit shell, heat-conducting fins, and phase change heat storage material. The heat-conducting fins are corrugated fins, disposed on the blown thermal superconducting plate, and fixedly connected to the inner surface of the heat storage unit shell. The two ends of the heat-conducting fins maintain a gap with the heat storage unit shell. The heat storage unit shell and the blown thermal superconducting plate constitute a sealed heat storage unit cavity. The phase change heat storage material is filled in the heat storage unit cavity. The heat-conducting fins are evenly distributed in the phase change heat storage material to increase the thermal conductivity of the phase change heat storage material and improve the heat storage and heat release rate of the phase change heat storage material. The heat-storage superconducting heat sink with heat storage function also includes heat dissipation fins, which are disposed on the side of the blown heat-storage superconducting plate excluding the phase change heat storage part.

2. The thermal superconducting heat dissipation plate with heat storage function according to claim 1, characterized in that: The number of phase change heat storage units is 2, and they are respectively arranged on both sides of the blown thermal superconducting plate.

3. The thermal superconducting heat dissipation plate with heat storage function according to claim 1, characterized in that: The phase change heat storage material is an organic phase change heat storage material, which fills the heat storage cavity. When the temperature of the thermal superconducting heat sink is higher than the phase change temperature of the phase change heat storage material, the phase change heat storage material changes from a solid phase to a liquid phase to absorb heat and temporarily store the heat, and the temperature of the thermal superconducting heat sink no longer rises. When the temperature of the thermal superconducting heat sink is lower than the phase change temperature of the phase change heat storage material, the phase change heat storage material changes from a liquid phase to a solid phase to release heat, which is then conducted out and dissipated by the thermal superconducting heat sink.

4. The thermal superconducting heat dissipation plate with heat storage function according to claim 1, characterized in that: The heat-conducting fins are aluminum alloy corrugated fins, with the spacing between two adjacent corrugations ranging from 2 mm to 5 mm, the thickness of the heat-conducting fins ranging from 0.1 mm to 1.0 mm, and the height of the heat-conducting fins ranging from 10 mm to 50 mm.

5. The thermal superconducting heat dissipation plate with heat storage function according to claim 1, characterized in that: The heat dissipation fins are aluminum alloy corrugated fins, with the spacing between two adjacent corrugations ranging from 2 mm to 5 mm, the thickness of the heat dissipation fins ranging from 0.1 mm to 1.0 mm, and the height of the heat dissipation fins ranging from 50 mm to 100 mm.

6. The thermally superconducting heat sink according to claim 1, characterized in that: The heat transfer pipeline is a vacuum-sealed system, and the heat transfer medium inside it is a fluid; the distribution shape of the heat transfer pipeline on the blown thermal superconducting plate is at least one of the following: circular honeycomb, hexagonal honeycomb, quadrilateral honeycomb, crisscrossing mesh, and triangular and rhomboid extensions connected end to end.

7. A thermal superconducting radiator with heat storage function, characterized in that, The heat-storage superconducting heat sink includes: a heat-storage superconducting heat sink plate as described in any one of claims 1 to 6; A heat sink substrate, wherein one surface of the heat sink substrate is provided with a number of pre-arranged parallel grooves for inserting the heat storage superconducting heat sink plate vertically and parallelly into the grooves.

8. The thermal superconducting radiator with heat storage function according to claim 7, characterized in that: One end of the phase change heat storage section of the thermal superconducting heat sink with heat storage function is close to the heat sink substrate.

9. A method for preparing a thermally superconducting heat sink with heat storage function, characterized in that, The method for preparing the thermal superconducting heat sink with heat storage function includes: S1: Two aluminum plates are provided, at least one of the aluminum plates is provided with a slurry coating in the shape of a preset pipeline, the two aluminum plates are fastened together and riveted to fix them, wherein the surface with the slurry coating is located on the inner side, and a blown plate with interconnected pipelines inside is prepared by rolling and blown expansion processes. S2: Provide a heat storage housing and heat-conducting fins, and arrange the heat-conducting fins on the inner surface of the heat storage housing and the surface of the blown plate, and braze them together to form an assembly, wherein the two ends of the heat-conducting fins maintain a gap with the heat storage housing; S3: Vacuum the blown plate in the assembly, fill it with a preset amount of heat transfer medium, and seal the injection port to form a blown thermal superconducting plate. S4: Provide a phase change heat storage material, heat and melt the phase change heat storage material into a liquid, fill the cavity of the heat storage part, and seal it to finally obtain the heat superconducting heat sink with heat storage function.

10. The method for preparing a thermally superconducting heat sink with heat storage function according to claim 9, characterized in that: Step S2 further includes providing heat dissipation fins, which are disposed on the side of the blown plate excluding the heat storage housing and are brazed together.

11. A method for preparing a thermally superconducting radiator with heat storage function, characterized in that, The method for preparing the thermal superconducting radiator with heat storage function includes: The method for preparing a thermal superconducting heat sink with heat storage function as described in any one of claims 9 to 10; A heat sink substrate is provided, wherein one surface of the heat sink substrate is provided with a number of pre-arranged parallel grooves, and a heat superconducting heat sink with heat storage function is vertically inserted into the grooves at parallel intervals and fixedly connected.

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