Transfer method of light emitting chip and display panel

By using adhesive layers and solvents with opposite polarities during the transfer of light-emitting chips, the problems of slow transfer speed and small adhesion differences in the prior art are solved, achieving efficient transfer of light-emitting chips and improved yield.

CN116344570BActive Publication Date: 2026-07-03CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
Filing Date
2021-12-24
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

In existing technologies, the use of van der Waals forces to transfer light-emitting chips suffers from slow transfer speed and small differences in adhesion, resulting in low transfer yield.

Method used

By using a first adhesive layer and a second adhesive layer with opposite polarities between the donor substrate and the acceptor substrate, and removing the adhesive layers with corresponding first and second solvents, a large difference in adhesion is formed, thereby improving the transfer yield of the light-emitting chip.

Benefits of technology

This improved the transfer yield of light-emitting chips, ensured effective bonding between electrodes and pads, and enhanced the efficiency and reliability of the transfer process.

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Abstract

This application relates to a method for transferring light-emitting chips, comprising the following steps: docking a first substrate having a first adhesive layer with a growth substrate on which multiple light-emitting chips are grown; separating the light-emitting chips and the growth substrate so that a portion of the light-emitting chips is exposed above the first adhesive layer; docking a second substrate having a second adhesive layer with the first substrate to which the light-emitting chips are attached so that a portion of the light-emitting chips extends into the second adhesive layer; separating the first substrate and the first adhesive layer, and removing the first adhesive layer using a first solvent so that at least a portion of the electrodes are exposed above the second adhesive layer; docking the second substrate with a driving backplane having first pads so that the electrodes of the light-emitting chips are bonded to the first pads; separating the second substrate and the light-emitting chips, and removing the second adhesive layer using a second solvent. The light-emitting chip transfer method of this application has a faster transfer speed and improves the transfer yield. This application also provides a display panel.
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