Electronic device

Abstract

The present application relates to an electronic device, and provides an electronic device capable of accommodating multiple components and suppressing the depth size of a frame. The electronic device is provided with a frame, a substrate on which a processing device is mounted, a speaker device, and a cooling device for cooling the processing device. The substrate is placed vertically. The cooling device is provided with a fan, an air inlet provided on the upper surface and the lower surface, an air outlet provided on the side surface, and an impeller, the rotation shaft of the impeller being arranged along the vertical direction of the frame, so that the fan is placed horizontally in the frame; a vane arranged to face the air outlet of the fan and placed horizontally in the frame; and a heat pipe, the first end of which is connected to the processing device, and the second end of which is connected to the vane.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic device that can be used as a terminal device for a communication conference. BACKGROUND

[0002] Nowadays, electronic devices that enable a conference or a call via sound and images between remote locations using the Internet, a telephone line, or the like are being utilized. Such electronic devices are equipped with a speaker device for outputting sound or the like emitted from an object side (see, for example, Patent Literature 1).

[0003] Patent Literature 1: Japanese Patent Application Publication No. 2020-178244

[0004] However, in recent years, the demand for online conferences using a display has increased. Therefore, it is desired that the above-described electronic device be used in a wall-mounted manner on the upper or lower side of a large display that is wall-mounted. In this case, the electronic device needs to suppress the depth dimension of the frame to a minimum and suppress the length protruding from the wall.

[0005] However, such an electronic device is sometimes equipped with a substrate on which a processing device for control is mounted or a cooling device for cooling thereof or the like in addition to the speaker device, and needs to be able to house these components in the frame with the limitation of the depth dimension. Of course, such an electronic device is also preferably small in the depth dimension in the case of being used by being placed on a table or the like. SUMMARY

[0006] The present application was completed in consideration of the problems of the above-described related art, and aims to provide an electronic device that can house a plurality of components and suppress the depth dimension of a frame.

[0007] The electronic device according to the first aspect of the present application includes a frame, a substrate housed in the frame and having a processing device mounted thereon, a speaker device housed in the frame and having a speaker unit and a speaker box, and a cooling device housed in the frame and cooling the processing device. The substrate is longitudinally placed along the up-down direction of the frame. The cooling device includes a fan having a suction port provided on an upper surface and a lower surface, an exhaust port provided on a side surface, and an impeller. The rotation axis of the impeller is disposed along the up-down direction of the frame, and the fan is transversely placed in the frame. The cooling device also includes a vane disposed facing the exhaust port of the fan and transversely placed in the frame. The cooling device also includes a heat pipe having a first end portion connected to the processing device and a second end portion connected to the vane. Thus, the electronic device houses the substrate, the speaker device, and the cooling device in the frame, and the substrate is longitudinally placed, and the fan and the vane are transversely placed, so that the depth dimension of the frame can be suppressed to a minimum.

[0008] The electronic device according to the second aspect of the present application includes: a housing; a substrate housed in the housing and having a processing device mounted thereon; a speaker device housed in the housing and having a speaker unit and a speaker box; and a cooling device housed in the housing and cooling the processing device, the cooling device having: a fan having a suction port provided on an upper surface and a lower surface, an exhaust port provided on a side surface, and an impeller, the rotation axis of the impeller being arranged in the up-down direction of the housing; a vane arranged facing the exhaust port of the fan; a heat pipe having a first end portion connected to the processing device and a second end portion connected to the vane; and a duct member arranged facing the vane on the lower surface of the speaker box and allowing air discharged from the exhaust port and passing through the vane to flow out to the outside of the housing. Thus, in the electronic device, the components of the cooling device are arranged in the left-right direction of the housing, and the speaker box is arranged thereon, so that the depth dimension D of the housing can be minimized, and the components can be effectively housed in the housing.

[0009] According to the above-described aspect of the present application, an electronic device capable of housing a plurality of components and suppressing the depth dimension of a housing is provided. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a system diagram showing one use aspect of the electronic device according to one embodiment.

[0011] Figure 2A is a front view of the electronic device.

[0012] Figure 2B is a rear view of the electronic device.

[0013] Figure 2C is a bottom view of the electronic device.

[0014] Figure 2D is a side view of the electronic device.

[0015] Figure 3 is a top view schematically showing the internal configuration of the electronic device.

[0016] Figure 4 is a schematic cross-sectional view along the IV-IV line in Figure 3 .

[0017] Figure 5 is a schematic cross-sectional view along the V-V line in Figure 3 .

[0018] Figure 6 is a schematic front cross-sectional view of the cooling device and the surrounding portion thereof shown on the right in Figure 3 .

[0019] Figure 7A is Figure 3 is an enlarged schematic view of the cooling device on the right side and its peripheral portion.

[0020] Figure 7B is a view showing a state in which a speaker device is provided on the cooling device on the right side. Figure 7A

[0021] Figure 8 is an exploded perspective view showing a state immediately before the speaker device on the right side is mounted to the frame.

[0022] BRIEF DESCRIPTION OF DRAWINGS

[0023] 10... electronic device; 22... frame; 27L, 27R... back suction port; 30... connection terminal portion; 32L, 32R... bottom suction port; 34L, 34R... side exhaust port; 36... bracket plate; 38... substrate; 38a... processing device; 40L, 40R... cooling device; 42L, 42R... speaker device; 46... fan; 48... blade; 50... heat pipe; 50c... bent portion; 52... duct member; 62... speaker unit; 64... speaker box. DETAILED DESCRIPTION

[0024] Hereinafter, an electronic device according to the present application will be described in detail with reference to preferred embodiments, with reference to the accompanying drawings.

[0025] Figure 1 is a system diagram showing one use of the electronic device 10 according to one embodiment. The electronic device 10 according to the present embodiment is, for example, a terminal device that can be used in an online conference system for conducting a conference or a call using sound and images between a remote location connected via the Internet.

[0026] Figure 1 The online conference system shown in FIG. 1 includes the electronic device 10 according to the present embodiment, a touch panel operation portion 12, an external display 14, and a personal computer 16. As shown in FIG. 2, the electronic device 10 is, for example, fixed to the upper or lower side of the external display 14 which is fixed to a wall of a conference room by a wall mounting. The electronic device 10 can also be placed on a table or the like and used. Figure 1

[0027] ​​The touch panel operation unit 12 is a touch panel terminal for inputting operations onto the electronic device 10. The external display 14, for example, can display information from a personal computer 20 connected to the electronic device 10 via the Internet 18 and a cloud server 19 on the meeting participant's side. Specifically, the external display 14 displays facial images, data, etc., of the meeting participants under the control of the electronic device 10. The personal computer 16, for example, can send user data from the electronic device 10 to the external display 14 and the personal computer 20 on the meeting participant's side. The personal computer 16 can also be used as an input device for the electronic device 10, replacing the touch panel operation unit 12.

[0028] Electronic device 10, touch panel operation unit 12, external display 14 and personal computer 16 are connected, for example, using connectors and cables according to connection standards such as USB standard, HDMI (registered trademark) standard.

[0029] First, the appearance and structure of the electronic device 10 will be described.

[0030] Figure 2A , Figure 2B , Figure 2C as well as Figure 2D These are the front view, rear view, bottom view, and side view of the electronic device 10. Figure 2D The diagram shows a left-side view of the electronic device 10, but the right-side view shows a structure that is symmetrical to its left and right sides.

[0031] like Figures 2A-2D As shown, the electronic device 10 includes a housing 22. Hereinafter, the electronic device 10 and its components will be described in detail. Figure 2A Based on the direction shown in the front view, the height direction of the frame 22 is referred to as up and down, the width direction of the frame 22 is referred to as left and right, and the depth direction of the frame 22 is referred to as front and back.

[0032] The frame 22 has a horizontally elongated rod shape and is a roughly rectangular box. Specifically, the front 22a and back 22b of the frame 22 have a width W that is horizontally elongated in the left-right direction and a height H that is smaller than the width W. The upper surface 22c and lower surface 22d of the frame 22 have a width W that is horizontally elongated in the left-right direction and a depth D that is smaller than the width W and narrower in the front-back direction. The left side 22e and right side 22f of the frame 22 have a depth D that is narrower in the front-back direction and a height H that is slightly larger than the depth D in the vertical direction.

[0033] like Figure 2A As shown, a camera 24, a microphone 25, and a light 26 are provided on the front side 22a.

[0034] Camera 24 is a camera device for taking pictures of the user located on the front side of the electronic device 10. Camera 24 is positioned on the upper part of the front side 22a, approximately in the center. Figure 2A Reference numeral 24a in the attached diagram refers to a sliding shutter that can physically cover the camera 24. Microphone 25 is a microphone device that picks up the voice of the user of the electronic device 10. Microphone 25 faces the front panel 22a from multiple microphone holes arranged horizontally below the camera 24. Lamp 26 is a light notification unit used to inform the user of the operating status of the electronic device 10, the recording status of the microphone 25, etc., and is also called a smart lamp. Lamp 26 faces the front panel 2a from a narrow, horizontally elongated light-transmitting window located between the camera 24 and the microphone 25. A power indicator for the electronic device 10 is also provided on the front panel 22a.

[0035] like Figure 2B As shown, a pair of rear air intakes 27L and 27R and a cover plate 28 are provided on the rear side 22b.

[0036] The rear air intakes 27L and 27R are openings that connect the inside and outside of the frame 22. The rear air intakes 27L and 27R may be, for example, a mesh structure composed of multiple holes, or a structure with multiple slits arranged side-by-side. Relative to the center of the rear surface 22b in the left-right direction, the rear air intake 27L is located on the left side, and the rear air intake 27R is located on the right side.

[0037] Cover plate 28 is used to cover such as Figure 2C The detachable plate has recessed portions 28a formed in the center of the left and right sides of the back surface 22b. A connecting terminal portion 30 is provided in the recessed portion 28a (see reference). Figure 3 The connection terminal section 30 is an external terminal group connected to a connector 30a, which is used to connect the electronic device 10 to the touch panel operation section 12, the external display 14, the personal computer 16, and the Internet 18, etc. The cables 30b from these external devices and the connector 30a are housed in the recessed portion 28a and covered by the cover plate 28. Figure 3 Reference numeral 31 in the figure is a stand for hooking a cable tie, which is used to bundle the cables 30b together. The power cable for connecting the electronic device 10 to an external power source is also connected to the connection terminal 30.

[0038] like Figure 2C As shown, a pair of bottom air intakes 32L and 32R and a pair of rubber feet 33L and 33R are provided on the lower surface 22d. The upper surface 22c has a shape that is approximately the same as the lower surface 22d, but is formed of a flat plate.

[0039] The bottom surface suction ports 32L, 32R are openings that communicate the inside and outside of the frame 22. The bottom surface suction ports 32L, 32R are preferably configured by the same mesh structure or slit structure as the back surface suction ports 27L, 27R. The bottom surface suction port 32L is disposed at substantially the same position as the back surface suction port 27L with the left-right direction of the frame 22 as a reference, and the bottom surface suction port 32R is disposed at substantially the same position as the back surface suction port 27R (see also Figure 8 ).

[0040] The rubber feet 33L, 33R are foot portions used when the electronic device 10 is placed on a table or the like. The rubber feet 33L, 33R are disposed so as to straddle the left and right bottom surface suction ports 32L, 32R and are fixed to positions slightly closer to the center than the left and right ends of the lower surface 22d. The rubber feet 33L, 33R need to prevent the bottom surface suction ports 32L, 32R from being blocked when the electronic device 10 is placed on a table or the like. That is, the rubber feet 33L, 33R need to be a height that sufficiently ensures passage of air to the bottom surface suction ports 32L, 32R. In the present embodiment, the height of the rubber feet 33L, 33R is, for example, about 5 mm.

[0041] As shown in Figure 2D , a side surface exhaust port 34L is provided in the left side surface 22e.

[0042] The side surface exhaust port 34L is an opening that communicates the inside and outside of the frame 22. The side surface exhaust port 34L is preferably configured by the same mesh structure or slit structure as the back surface suction ports 27L, 27R. The side surface exhaust port 34L is disposed at the lowermost portion of the left side surface 22e. The right side surface 22f is configured in left-right symmetry with the left side surface 22e shown in Figure 2D , and is provided with a side surface exhaust port 34R (see also Figure 3 ).

[0043] As described above, the electronic device 10 can also be disposed in a wall-mounted manner on a wall or the like of a conference room without using the rubber feet 33L, 33R. In the case of being used in a wall-mounted manner, as shown in Figure 2C , the electronic device 10 is used with the bracket plate 36 attached to the back surface 22b. The bracket plate 36 is a long metal plate in the left-right direction, and link plates 36a, 36b protruding from the left and right surfaces are fixed to the back surface 22b by screwing or the like. The link plates 36a, 36b are linked at positions overlapping the cooling devices 40L, 40R and the speaker devices 42L, 42R described later with the left-right direction of the frame 22 as a reference (see also Figure 3 ). Thus, the electronic device 10 can be easily disposed in a wall-mounted manner by fixing the bracket plate 36 to a wall by screwing or the like.

[0044] Next, the internal configuration of the electronic device 10 will be described.

[0045] Figure 3 is a plan view schematically showing the internal configuration of the electronic device 10. Figure 3 is a view showing the inside of the frame 22 when a plate forming the upper surface 22c of the frame 22 is removed.

[0046] As shown in Figure 3 , the electronic device 10 houses the substrate 38, the left and right pair of cooling devices 40L, 40R, and the left and right pair of speaker devices 42L, 42R in the inside of the frame 22.

[0047] The substrate 38 is a mother board of the electronic device 10. The substrate 38 is mounted with various electronic components such as a memory and an SSD (Solid State Drive) in addition to the processing device 38a. The processing device 38a is, for example, a CPU (Central Processing Unit).

[0048] The bracket 44 is fixed in the inside of the frame 22 by screwing or the like. The substrate 38 is fixed to the bracket 44, and thereby supported in the frame 22. The bracket 44 is a metal plate having a horizontal bracket 44a and a vertical bracket 44b, and configured in a substantially T shape. The horizontal bracket 44a is a plate-shaped member placed horizontally along the bottom surface 22g in the frame 22. The vertical bracket 44b is a plate-shaped member erected upward from the upper surface of the horizontal bracket 44a, and placed vertically along the 2a and the back surface 22b.

[0049] The substrate 38 is fixed to the rear surface of the vertical bracket 44b by screwing or the like. Thereby, the substrate 38 is placed vertically along the lower direction in the frame 22 (see also Figure 4 ). That is, the substrate 38 is disposed in a posture in which the surface direction is along the up-down and left-right directions, and the plate thickness direction is along the front-rear direction.

[0050] The front surface of the substrate 38 becomes a mounting surface of the bracket 44, and the rear surface becomes a mounting surface of the processing device 38a or the like. The daughter card 38b is connected to the mounting surface of the substrate 38 with a prescribed interval. The daughter card 38b is also supported by the vertical bracket 44b, and placed vertically in the frame 22.

[0051] Figure 4 is a schematic cross-sectional view along the IV-IV line in Figure 3 . Figure 5 is a schematic cross-sectional view along the V-V line in Figure 3 . Figure 4 and Figure 5 show the structure of the cooling device 40R on the right in Figure 3 and its periphery. Figure 4 and Figure 5 omit the illustration of the bracket 44, the daughter card 38b, and the like. Figure 6is Figure 3 is a schematic front cross-sectional view of the cooling device 40R on the right side and its peripheral portion. Figure 7A is Figure 3 is a schematic enlarged view of the cooling device 40R on the right side and its peripheral portion. Figure 6 The illustration of the bracket 44 and the like is omitted.

[0052] As Figure 3 illustrated, the cooling devices 40L, 40R are of a left-right symmetrical configuration, and the same applies to the speaker devices 42L, 42R. Therefore, hereinafter, the cooling device 40R on the right side and the speaker device 42R will be described representatively, and detailed description of the cooling device 40L on the left side and the speaker device 42L will be omitted.

[0053] The cooling devices 40L, 40R cool the processing device 38a mounted on the substrate 38 and other electronic components.

[0054] As Figures 3-7A illustrated, the cooling device 40R has a fan 46, a vane 48, a heat pipe 50, and a duct member 52.

[0055] The fan 46 has a fan frame body 46a, and a rotating shaft portion 46b and an impeller 46c housed in the fan frame body 46a. The fan 46 is a centrifugal fan that rotates the rotating shaft portion 46b by a motor, thereby rotating the impeller 46c provided on the outer peripheral side thereof. The rotating shaft of the impeller 46c, that is, the axial direction of the rotating shaft portion 46b is arranged along the up-down direction of the frame body 22, and the fan 46 is horizontally placed in the frame body 22. More specifically, the fan 46 is fixed to the lower surface of the horizontal bracket 44a of the bracket 44, and is horizontally placed along the bottom surface 22g of the frame body 22 with only a slight gap formed therebetween. The fan 46 can also be placed on the bottom surface 22g.

[0056] The fan 46 has an upper air inlet 54, a lower air inlet 55, and an air outlet 56.

[0057] The upper air inlet 54 is an opening formed on the upper surface of the fan frame body 46a. The lower air inlet 55 is an opening formed on the lower surface of the fan frame body 46a. The air inlets 54, 55 are, for example, circular, annular, or through-holes in which a plurality of ellipses are juxtaposed in the circumferential direction. The upper air inlet 54 overlaps the back air inlet 27R in the left-right direction, and mainly sucks air from the back air inlet 27R. The lower air inlet 55 opposes the bottom air inlet 32R, and mainly sucks air from the bottom air inlet 32R. The air outlet 56 is an opening formed on the side surface of the fan frame body 46a on the side opposite to the substrate 38 side in the left-right direction. That is, the air outlet 56 is formed on the right side surface of the fan frame body 46a in the cooling device 46R, and is formed on the left side surface of the fan frame body 46a in the cooling device 46L.

[0058] Blade 48 is a heat dissipation blade formed by arranging multiple thin metal plates at equal intervals. Blade 48 is positioned facing the exhaust port 56 of fan 46. That is, blade 48 faces the right side of fan housing 46a in cooling unit 46R and faces the left side of fan housing 46a in cooling unit 46L. The metal plates constituting blade 48 stand upright in the vertical direction, extend in the horizontal direction, and are arranged parallel in the front-back direction. As a result, gaps are formed between adjacent metal plates to allow air supplied from fan 46 to pass through.

[0059] The heat pipe 50 is a tubular heat transfer device. The heat pipe 50 is formed by flattening a metal tube into an elliptical cross-section, and a working fluid is sealed within its internal enclosed space. The first end 50a of the heat pipe 50 is connected to the processing device 38a via a heat receiving plate 58, and the second end 50b is connected to the blades 48. The heat receiving plate 58 is formed of a metal with high thermal conductivity, such as copper or aluminum. The heat receiving plate 58 ensures a seamless, airtight connection between the processing device 38a and the heat pipe 50, improving heat transfer efficiency.

[0060] In the electronic device 10 of this embodiment, the substrate 38 is placed vertically, and the blades 48 and the fan 46 are placed horizontally near the bottom surface 22g. That is, in the vertical direction of the frame 22, the processing device 38a is positioned above the blades 48. Furthermore, the processing device 38a and the heat receiving plate 58 are located approximately at the center in the front-rear direction of the frame 22. On the other hand, the blades 48 extend approximately along the entire length of the internal dimensions in the front-rear direction of the frame 22 to ensure maximum heat dissipation area. The first end 50a of the heat pipe 50 is fitted into a groove formed on the rear surface of the heat receiving plate 58, and is substantially connected to the side end face of the heat receiving plate 58. The second end 50b is connected to the front end face of the blades 48.

[0061] Therefore, the positional relationship between the first end 50a and the second end 50b of the heat pipe 50 is offset in the up-down, left-right, front-back directions. Therefore, the heat pipe 50 has a curved portion 50c between the ends 50a and 50b, which is three-dimensionally curved in the up-down, left-right, front-back directions.

[0062] like Figure 4 , Figure 6 as well as Figure 7A As shown, the curved portion 50c of this embodiment has a first curved portion B1, a second curved portion B2 and a third curved portion B3 sequentially from the first end portion 50a toward the second end portion 50b.

[0063] The following explanation, regarding the bending direction of the bend 50c, illustrates how the extension direction of the heat pipe 50 changes in the up-down, left-right, front-back directions of the frame 22. Furthermore, as described above, the following explanation illustrates the bending direction of the heat pipe 50 in the right-hand cooling device 50R; the bending direction of the heat pipe 50 in the left-hand cooling device 50L is the opposite of that in the right-hand cooling device 50R.

[0064] The first end portion 50a is connected to the right end face of the longitudinally placed heat receiving plate 58 and extends in the left-right direction. The first curved portion B1 bends in the direction from the first end portion 50a toward the second end portion 50b (hereinafter referred to as the "first direction") by gradually twisting in the right, forward and downward directions simultaneously.

[0065] The first curved portion B1 and the second curved portion B2 form a straight section that moves to the right in the first direction and diagonally downwards and forwards. The second curved portion B2 bends in the first direction by gradually twisting to the right and downwards simultaneously.

[0066] The section between the second curved portion B2 and the third curved portion B3 forms a straight section that slopes diagonally downwards and to the right in the first direction. The third curved portion B3 curves in the first direction by gradually twisting to the right, backwards, and downwards simultaneously. The second end portion 50b extends relatively shortly in the front-rear direction and connects to the front side of the laterally placed blade 48.

[0067] Of course, the bending direction of the bend 50c is not limited to the aforementioned bends B1 to B3. That is, the bending direction of the bend 50c can be changed to various directions based on the positional relationship between the heat receiving plate 58 and the blade 48, as well as its positional relationship with other components. Furthermore, the number of bends in the bend 50c can be more than three. However, to avoid the sealed space inside the heat pipe 50 being flattened, the bend 50c preferably avoids bends such as right angles. Additionally, the overall length of the heat pipe 50 is preferably as short as possible. In this respect, in the configuration of the heat receiving plate 58 and the blade 48 in this embodiment, a structure having the aforementioned bends B1 to B3 is preferred.

[0068] like Figures 5-7A As shown, the duct component 52 forms an air duct for passing air from the exhaust port 56 of the fan 46 through the air guide side exhaust port 34R of the blade 48. The duct component 52 is made of resin or metal. The duct component 52 is, for example, constructed of a generally U-shaped plate with three sides orthogonal to each other. The height of the duct formed by the duct component 52 is the same as or slightly higher than the height of the blade 48. The front-to-back width of the duct formed by the duct component 52 is the same as or slightly wider than the front-to-back width of the blade 48.

[0069] The duct member 52 can also be composed of a square tube of rectangular cross section. In the present embodiment, the bottom surface 22g of the flat frame 22 functions as a lower wall of the duct formed by the duct member 52, and therefore the duct member 52 is formed in a substantially U shape without a lower plate.

[0070] Figure 7B is a view showing a state in which the speaker device 42R is provided above the cooling device 40R on the right side. Figure 7A is a view showing a state in which the speaker device 42R is provided above the cooling device 40R on the right side. Figure 8 is an exploded perspective view showing a state immediately before the speaker device 42R on the right side is mounted to the frame 22.

[0071] The speaker devices 42L, 42R are devices that output sound to the outside of the frame 22. Specifically, the speaker devices 42L, 42R emit sound through the mesh 60 provided to the outer surface of the frame 22 (see Figures 2A-2D ).

[0072] The mesh 60 is a mesh member for passing sound from the speaker devices 42L, 42R to the outside of the frame 22. The mesh 60 can be replaced by providing a plurality of hole portions to the frame 22. As shown in Figures 2A-2D , in the case of the present embodiment, the mesh 60 is provided, for example, to the substantially lower half of the front surface 22a and the side surfaces 22e, 22f of the frame 22, and the substantially lower half of the left and right end portions of the back surface 22b.

[0073] As shown in Figure 7B and Figure 8 , the speaker device 42R has a speaker unit 62 and a speaker box 64.

[0074] The speaker unit 62 is a portion that actually outputs sound. The speaker unit 62 is, for example, a combination of a diaphragm, a magnet, and a voice coil, and can be the same as or similar to a publicly known speaker unit.

[0075] The speaker box 64 is a box that forms a hollow that becomes a back chamber of the speaker unit 62, and is also called a housing. The speaker unit 62 is mounted to the front surface of the speaker box 64. As shown in Figure 7A and Figure 7B , the speaker box 64 is provided above the fan 46, the vane 48, and the duct member 52 so as to shield them. That is, the speaker box 64 has a large front-to-back and left-to-right width dimension that covers substantially the entire fan 46, vane 48, and duct member 52. Thus, the speaker box 64 can secure as large a volume as possible within the frame 22.

[0076] A pair of mounting rods 64a and 64a are fixed to the front and rear surfaces of the speaker enclosure 64, respectively. The mounting rod 64a is a plate-shaped support member used to support the speaker assembly 42R within the frame 22. The mounting rod 64a needs to prevent the transmission of vibrations from the speaker assembly 42R to the frame 22, and is, for example, made of rubber. The mounting rod 64a is inserted into a pouch-like portion 66 formed above the inner surface of the frame 22, its lower surface supported by the bottom surface 22g. At this time, a predetermined gap is formed between the speaker enclosure 64 and the fan 46, blades 48, and duct component 52 within the inner surface of the frame 22. That is, the speaker enclosure 64 is elastically supported within the frame 22 in a substantially floating state.

[0077] like Figure 6 As shown, a recessed clearance portion 64b is provided on the lower surface of the speaker enclosure 64, which is recessed upward compared to the lower surfaces of other parts. The clearance portion 64b is located directly above the fan 46, offset one level upward compared to the directly above the duct component 52. The clearance portion 64b serves to minimize the reduction in the volume of the speaker enclosure 64 and to prevent the upper air intake 54 of the fan 46 from being blocked.

[0078] In the cooling devices 40L and 40R configured in this way, the heat pipe 50 absorbs heat from the processing device 38a, etc., mounted on the substrate 38 via the heat receiving plate 58. In this embodiment, the left and right cooling devices 40L and 40R share a single heat receiving plate 58 (see reference). Figure 3 The heat receiving plate 58 can also be installed as a dedicated cooling device for each of the cooling devices 40L and 40R.

[0079] Heat transferred from the heat receiving plate 58 to the heat pipe 50 is efficiently transferred by the heat pipe 50 to the blades 48. The heat transferred to the blades 48 is efficiently dissipated by air intake from the exhaust port 56 of the fan 46. The high-temperature exhaust air passing through the blades 48 then passes through an air duct formed by the pipe component 52 and the bottom surface 22g of the frame 22, and is discharged outside the frame 22 through the side exhaust ports 34L and 34R. Figure 4 and Figure 6 The arrows shown by the dotted lines schematically represent the flow of air drawn in by fan 46 and the flow of air exhausted by fan 46.

[0080] At this time, fan 46 draws air from outside the frame 22 through bottom air intakes 32L and 32R from bottom air intake 55. Additionally, fan 46 draws air from outside the frame 22 through rear air intakes 27L and 27R from upper air intake 54. Here, most of the space between the rear air intakes 27L and 27R and the upper air intake 54 is blocked by speaker enclosure 64, but air is drawn to the upper air intake 54 through gaps around speaker enclosure 64. At this time, speaker enclosure 64 has a clearance portion 64b on its lower surface directly above fan 46 (see reference).Figure 6 ). Therefore, air is smoothly drawn to the upper air intake port 54 through the back air intake ports 27L, 27R.

[0081] As above, the electronic device 10 of the present embodiment is provided with the frame 22, the substrate 38 on which the processing device 38a is mounted, the speaker devices 42L, 42R, and the cooling devices 40L, 40R that cool the processing device 38a. Here, the substrate 38 is placed vertically along the up-down direction of the frame 22. In addition, the cooling devices 40L, 40R have the fans 46 and the fins 48 placed horizontally within the frame 22, and the heat pipes 50 that connect the processing device 38a and the fins 48. Further, the cooling devices 40L, 40R can have only one side. Similarly, the speaker devices 42L, 42R can have only one side as well.

[0082] In this way, the electronic device 10 houses the substrate 38, the speaker devices 42L, 42R, and the cooling devices 40L, 40R within the frame 22. However, the electronic device 10 places the substrate 38 vertically, places the fans 46 and the fins 48 horizontally, and connects the processing device 38a mounted on the substrate 38 and the fins 48 with the heat pipes 50. Thereby, the electronic device 10 can avoid the influence of the substrate 38 on the depth dimension D of the frame 22 by placing the substrate 38, which requires a large surface area, vertically, and can suppress the depth dimension D of the frame 22 to the minimum. For example, the depth dimension D of the electronic device 10 of the present embodiment is 90 mm or less. As a result, the electronic device 10, when disposed in a wall-mounted manner, suppresses the length protruding from the wall surface (refer to FIG. 1). Also, the electronic device 10 places the fans 46 and the fins 48 horizontally. Therefore, a large space can be ensured above it, and the setting space of the speaker box 64 can be ensured there, which also contributes to the increase in the volume of the speaker box 64. Figure 2C ). Also, the electronic device 10 places the fans 46 and the fins 48 horizontally. Therefore, a large space can be ensured above it, and the setting space of the speaker box 64 can be ensured there, which also contributes to the increase in the volume of the speaker box 64.

[0083] The processing devices 38a of the electronic device 10 are disposed at positions higher than the fins 48. Also, the heat pipes 50 connect between these processing devices 38a and the fins 48. That is, the heat pipes 50 have the curved portions 50c that curve in the up-down direction, the left-right direction, and the front-rear direction of the frame 22 between the first end portions 50a and the second end portions 50b. Thereby, the heat pipes 50 can reliably connect between the processing devices 38a and the fins 48, which are different in position in the up-down, left-right, front-rear directions, within the frame 22 having a narrow depth dimension D. Also, the heat pipes 50 have the three-dimensional curved portions 50c, and thereby do not make a difficult-to-achieve bending in the pipe, and can suppress the internal closed space from being closed to reduce the heat transfer performance.

[0084] The cooling device 40L, 40R has a duct member 52 disposed facing the vane 48 below the speaker box 64 for the air discharged from the exhaust port 56 of the fan 46 and passing through the vane 48 to flow outside the frame 22. Thus, the air discharged from the fan 46 can be prevented from leaking into the frame 22 to reduce the air volume. In addition, the so-called air noise can be reduced, and the influence on the microphone 25 can be suppressed. The duct member 52 can be omitted, for example, in a case where the speaker box 64 can be used instead.

[0085] In addition, the electronic device 10 of the present embodiment is provided with the frame 22, the substrate 38 on which the processing device 38a is mounted, the speaker devices 42L, 42R, and the cooling devices 40L, 40R that cool the processing device 38a. Further, the cooling devices 40L, 40R have the fan 46 whose rotation shaft portion 46b of the impeller 46c is disposed along the up-and-down direction of the frame 22, the vane 48, the heat pipe 50 that connects the processing device 38a and the vane 48, and the duct member 52. The duct member 52 is disposed facing the vane 48 below the speaker box 64 to form an air duct that allows the air discharged from the exhaust port 56 of the fan 46 and passing through the vane 48 to flow outside the frame 22.

[0086] Thus, the electronic device 10 is provided with the exhaust port 56 on the side of the fan 46, the vane 48 and the duct member 52 disposed on the side of the exhaust port 56, and the speaker box 64 disposed thereon. That is, the components of the cooling devices 40L, 40R of the electronic device 10 are disposed along the left-and-right direction of the frame 22, and the speaker box 64 is disposed thereon. As a result, the electronic device 10 can minimize the depth dimension D of the frame 22, and effectively accommodate the components in the frame 22.

[0087] Further, the electronic device 10 of the present embodiment is provided with the pair of speaker devices 42L, 42R and the pair of cooling devices 40L, 40R, and thus good sound quality and high cooling performance are obtained. At this time, the speaker devices 42L, 42R and the cooling devices 40L, 40R are disposed left and right with the central substrate 38 therebetween, and thus the depth dimension D of the frame 22 does not need to be increased. In addition, the electronic device 10 is provided with the speaker devices 42L, 42R and the cooling devices 40L, 40R equally on the left and right of the central substrate 38, and thus the weight balance is also good.

[0088] At this time, the electronic device 10 is provided with the recessed portion 28a on the back surface 22b on the rear side of the substrate 38 where the speaker devices 42L, 42R and the cooling devices 40L, 40R are not present and the space in the frame 22 is relatively easy to secure, and the connection terminal portion 30 is provided thereon. Thus, as shown in FIG. 6, the electronic device 10 can be connected to an external device such as a computer or the like via the connection terminal portion 30. Figure 2CAs shown, the electronic device 10, in the case of being fixed in a wall-mounted manner, does not increase the substantial depth dimension due to the connector 30a and the cable 30b connected to the connection terminal portion 30.

[0089] Further, for the bracket plate 36 for fixing the electronic device 10 in a wall-mounted manner, the coupling plates 36a, 36b are coupled at positions overlapping the cooling devices 40L, 40R and the speaker devices 42L, 42R with the left-right direction of the frame 22 as a reference. Thus, the frame 22 can directly bear the weight of the cooling devices 40L, 40R and the speaker devices 42L, 42R, which are heavier than the substrate 38, through the bracket plate 36. Thus, the electronic device 10, when fixed in a wall-mounted manner, can suppress the left and right side portions of the frame 22 from being deformed by the weight of the cooling devices 40L, 40R and the speaker devices 42L, 42R.

[0090] Further, the present application is not limited to the above-described embodiments, and can of course be freely changed within the scope not departing from the gist of the present application.

Claims

1. An electronic device, comprising: Possessing: a frame having a bar shape that is long in a lateral direction; a substrate housed in the frame and on which a processing device is mounted; a speaker device housed in the frame and having a speaker unit and a speaker box; and a cooling device housed in the frame and cooling the processing device, the substrate is disposed in a manner that a face direction is along the up-and-down and left-and-right of the frame and a plate thickness direction is along the front-and-back of the frame, and is thus longitudinally placed in the frame in the up-and-down direction, the cooling device has: a fan having a suction port provided on an upper surface and a lower surface, an exhaust port provided on a side surface, and an impeller whose rotation axis is disposed along the up-and-down direction of the frame, whereby the fan is placed laterally in the frame; a vane disposed facing the exhaust port of the fan and placed laterally in the frame; and a heat pipe having a first end portion connected to the processing device and a second end portion connected to the vane, the front-and-back direction of the electronic device coincides with the depth direction of the frame, the fan and the vane are disposed on the left-and-right sides of the substrate.

2. The electronic device according to claim 1, wherein the processing device is disposed at a position higher than the vane in the up-and-down direction of the frame, the heat pipe has a bent portion that is bent in the up-and-down direction, the left-and-right direction, and the front-and-back direction of the frame between the first end portion and the second end portion.

3. The electronic device according to claim 1, wherein the speaker box is disposed above the fan and the vane.

4. The electronic device according to claim 3, wherein the cooling device further has a duct member disposed facing the vane on a lower side of the speaker box and causing air that has been exhausted from the exhaust port and passed through the vane to flow out to the outside of the frame.

5. The electronic device according to claim 4, wherein the frame has: a bottom surface suction port formed on a bottom surface and opposing the suction port provided on the lower surface of the fan; a back surface suction port formed on a back surface orthogonal to the bottom surface and communicating with the suction port provided on the upper surface of the fan; and a side surface exhaust port formed on a side surface orthogonal to the bottom surface and the back surface and opposing an outlet of the duct member.

6. The electronic device according to any one of claims 1 to 5, wherein the substrate is disposed at a position including a center in the left-and-right direction of the frame, the speaker device and the cooling device are each provided with a pair of left and right, and are disposed on the left and right sides of the substrate.

7. The electronic device according to claim 6, further comprising: a connection terminal portion disposed behind the substrate, the connection terminal portion is disposed in a concave portion formed on a part of the back surface of the frame. ​

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