Light-emitting module, manufacturing method thereof, and light-emitting device

Abstract

The application provides a light-emitting module, which comprises a lens layer and a substrate; the substrate comprises a first groove and a second groove; the lens layer comprises a first connecting assembly and a second connecting assembly; the bottom of the first connecting assembly is provided with a first slot, and the bottom of the second connecting assembly is provided with a second slot; the width of the first slot of the first connecting assembly inserted into the first groove is smaller than the width of the first slot of the first connecting assembly when the first connecting assembly is not inserted into the first groove; the width of the second slot of the second connecting assembly inserted into the second groove is smaller than the width of the second slot of the second connecting assembly when the second connecting assembly is not inserted into the second groove; the periphery of the substrate and the periphery of the lens layer form a third groove surrounding the lens layer; and the first groove and / or the third groove are provided with a colloid. The application solves the technical problems of the light-emitting module, such as the influence of the gap caused by heat on light distribution, local stress concentration and low automation degree, and adopts the interference fit of the lens and the substrate combined with the colloid to replace the screws, buckles and sealing rings, so that the holding force is strong and the automatic production is facilitated.

Description

Technical Field

[0001] This invention relates to the field of lighting, specifically to a light-emitting module, its manufacturing method, and a light-emitting device. Background Technology

[0002] The tightness of contact between the circuit board and the substrate, as well as the heat sink on it, in a light-emitting module affects the module's heat dissipation. During use, the module may deform due to temperature increases, and the reaction force between the circuit board and the substrate can cause partial separation or reduced contact. When the light-emitting area of ​​the module is large, the snap-fit ​​connection method around the perimeter is insufficient to support a tight fit without protrusions across the entire light-emitting area. The gaps created by protrusions reduce heat dissipation and affect light distribution. The use of fasteners such as clips and nuts, as well as sealing components such as sealing rings, complicates the manufacturing process of light-emitting modules. Even with automated production of the modules' components through molding processes, the level of automation remains limited. Summary of the Invention

[0003] To address the technical problems of existing light-emitting modules with large light-emitting areas, such as poor heat dissipation, localized stress concentration, light distribution affected by gaps between the lens layer and the substrate due to heat generation of the light-emitting module, and low automation in the manufacturing process, the first aspect of the present invention provides a light-emitting module, comprising: a lens layer and a substrate;

[0004] The substrate includes a first groove that is continuous around the support area, and the first width at the top of the first groove is greater than the second width at the bottom of the first groove; the support area includes at least one second groove.

[0005] The lens layer includes a first connecting component that is continuous around the light-emitting area. The first connecting component has a first slot at its bottom. The light-emitting area includes at least one second connecting component. The second connecting component has a second slot at its bottom.

[0006] The width of the first slot when the first connecting component is inserted into the first groove is less than the width of the first slot when the first connecting component is not inserted into the first groove; the width of the second slot when the second connecting component is inserted into the second groove is less than the width of the second slot when the second connecting component is not inserted into the second groove.

[0007] The four peripheral edges of the substrate and the four peripheral edges of the lens layer form a third groove surrounding the lens layer;

[0008] The first groove and / or the third groove contain a colloid.

[0009] In some embodiments, the second groove contains a colloid; the first side of the second connecting component includes a concave-convex structure, and the first side of the second connecting component is the contact surface between the second connecting component and the second groove.

[0010] In some embodiments, the concave-convex structure of the first side of the second connecting component is an intermittent concave-convex structure extending in a direction parallel to the lens layer.

[0011] In some embodiments, the second connecting component comprises two second connecting component connectors that combine to form the second slot.

[0012] In some embodiments, the second groove contains a colloid; the contact surfaces of the two second connecting component connectors constituting the second connecting component with the second groove both include an uneven structure.

[0013] In some embodiments, the concave-convex structure is an intermittent concave-convex structure extending in a direction parallel to the lens layer.

[0014] In some embodiments, a plurality of protrusions are provided at intervals on the inner side of the groove edge of the first groove near the lens layer, and the first connecting component includes a plurality of recesses corresponding to the protrusions on the side near the plurality of protrusions.

[0015] In some embodiments, the top width of the protrusion is greater than the bottom width of the protrusion; the top width of the recess is less than the bottom width of the recess.

[0016] The angle formed by the difference between the top width and the bottom width of the protrusion is greater than the angle formed by the difference between the bottom width and the top width of the protrusion.

[0017] In some embodiments, the top of the first connecting component includes a first step structure, and the first step structure and the four peripheral edges of the substrate form the third groove surrounding the lens layer;

[0018] and / or;

[0019] The substrate has a second step structure around its four periphery, and the second step structure and the lens layer together form the third groove surrounding the lens layer.

[0020] In some embodiments, the lens layer includes a light-emitting area and the first connecting component, the light-emitting area and the first connecting component are integral, a first gap is formed between the light-emitting area and the first connecting component, the groove edge of the first groove near the lens layer is located within the first gap, the top width of the first gap is greater than the top width of the groove edge of the first groove near the lens layer, and the bottom width of the first gap is greater than the bottom width of the groove edge of the first groove near the lens layer.

[0021] In some embodiments, the height of the first slot is less than the height of the first groove; the first groove is divided in the height direction into a deformable portion corresponding to the position of the first slot and an interference portion offset from the position of the first slot; the interference portion forms an interference fit with the first connecting component.

[0022] In some embodiments, the height of the second slot is less than the height of the second groove; the second groove is divided in the height direction into a deformable portion corresponding to the position of the second slot and an interference portion offset from the position of the second slot; the interference portion forms an interference fit with the second connecting component.

[0023] In some embodiments, the light-emitting module further includes a circuit board located on the substrate.

[0024] In some embodiments, a positioning post is provided on the substrate, the second groove is formed on the positioning post, and a through hole adapted to the positioning post is provided on the circuit board; when the circuit board is placed on the substrate, the positioning post can pass through the through hole so that the circuit board and the substrate remain relatively fixed in the horizontal direction.

[0025] A second aspect of the present invention provides a light-emitting module, comprising: a lens layer and a substrate;

[0026] The substrate includes a first groove that is continuous around the support area, and the first width at the top of the first groove is greater than the second width at the bottom of the first groove; the support area includes at least one second groove.

[0027] The lens layer includes a first connecting component that is continuous around the light-emitting area. The first connecting component has a first slot at its top. The light-emitting area includes at least one second connecting component. The second connecting component has a second slot at its bottom.

[0028] The width of the first slot when the first connecting component is inserted into the first groove is less than the width of the first slot when the first connecting component is not inserted into the first groove; the width of the second slot when the second connecting component is inserted into the second groove is less than the width of the second slot when the second connecting component is not inserted into the second groove.

[0029] The four peripheral edges of the substrate and the four peripheral edges of the lens layer form a third groove surrounding the lens layer;

[0030] The first groove and / or the third groove contain a colloid.

[0031] In some embodiments, when the first connecting component is pressed into the first groove, the top height of the first groove is equal to or slightly exceeds the top height of the first connecting component.

[0032] In some embodiments, the first connecting component is essentially a U-shaped structure.

[0033] In some embodiments, the second groove contains a colloid; the first side of the second connecting component includes a concave-convex structure, and the first side of the second connecting component is the contact surface between the second connecting component and the second groove.

[0034] In some embodiments, the concave-convex structure of the first side of the second connecting component is an intermittent concave-convex structure extending in a direction parallel to the lens layer; or the concave-convex structure of the first side of the second connecting component is an intermittent concave-convex structure extending in a direction perpendicular to the lens layer.

[0035] In some embodiments, the second connecting component comprises two second connecting component connectors that combine to form the second slot.

[0036] In some embodiments, the second groove contains a colloid; the contact surfaces of the two second connecting component connectors constituting the second connecting component with the second groove both include an uneven structure.

[0037] In some embodiments, the concave-convex structure is an intermittent concave-convex structure extending in a direction parallel to the lens layer; or, the concave-convex structure is an intermittent concave-convex structure extending in a direction perpendicular to the lens layer.

[0038] In some embodiments, a plurality of protrusions are provided at intervals on the inner side of the groove edge of the first groove near the lens layer, and the first connecting component includes a plurality of recesses corresponding to the protrusions on the side near the plurality of protrusions.

[0039] In some embodiments, the top width of the protrusion is greater than the bottom width of the protrusion; the top width of the recess is less than the bottom width of the recess.

[0040] The angle formed by the difference between the top width and the bottom width of the protrusion is greater than the angle formed by the difference between the bottom width and the top width of the protrusion.

[0041] A third aspect of the present invention provides a light-emitting device, including the light-emitting module described above.

[0042] A fourth aspect of the present invention provides a method for manufacturing a light-emitting module, comprising:

[0043] Provide lens layer and substrate;

[0044] A first colloid is placed in the first groove, and a first colloid is placed in the second groove;

[0045] The lens layer is placed on the substrate, the first connecting component is placed in the first groove, and the second connecting component is placed in the second groove;

[0046] Apply pressure to the lens layer until the lens layer adheres to the substrate;

[0047] A second colloid is placed inside the third groove.

[0048] In some embodiments, the manufacturing method further includes: placing a circuit board on the substrate; applying pressure to the lens layer until the lens layer is bonded to the substrate includes: the lens layer being bonded to the circuit board, and the circuit board being bonded to the substrate.

[0049] The light-emitting module and its manufacturing method provided by this invention use connectors and grooves on the lens and substrate in the light-emitting area to tighten the circuit board and substrate, avoiding the reduced adhesion caused by deformation of the large-area light-emitting module under elevated temperature, and further avoiding the problems of light distribution and increased local stress caused by gaps. In the light-emitting area, the interference fit between the connector and the groove replaces screws, avoiding local stress concentration and reduced resistance to water, oxygen, and dust. The interference fit between the connector and the groove around the perimeter replaces screws, clips, and other connection methods, improving installation convenience. During the pressing process, a viscous colloid deforms with the slot and eventually solidifies in its deformed form in the connector and the first groove, forming the first layer of fixation and sealing. A lower-viscosity colloid forms the second layer of fixation and sealing in the connector and the third groove after pressing. Using dispensing instead of sealing rings results in high automation, high production efficiency, and low production cost. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of the invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 This is a structural diagram of the light-emitting module provided in Embodiment 1 of the present invention;

[0052] Figure 2This is a partial enlarged view of the light-emitting module A1 provided in Embodiment 1 of the present invention;

[0053] Figure 3 This is a partial enlarged view of the light-emitting module A2 provided in Embodiment 1 of the present invention;

[0054] Figure 4 This is a structural diagram of the light-emitting module substrate provided in Embodiment 1 of the present invention;

[0055] Figure 5 This is a partial enlarged view of the light-emitting module substrate B provided in Embodiment 1 of the present invention;

[0056] Figure 6 This is a structural diagram of the lens layer of the light-emitting module provided in Embodiment 1 of the present invention;

[0057] Figure 7 This is a partial enlarged view of the lens layer C1 of the light-emitting module provided in Embodiment 1 of the present invention.

[0058] Figure 8 This is a partial enlarged view of the lens layer C2 of the light-emitting module provided in Embodiment 1 of the present invention.

[0059] Figure 9 This is a structural diagram of the light-emitting module provided in Embodiment 2 of the present invention;

[0060] Figure 10 This is a partial enlarged view of the light-emitting module D provided in Embodiment 2 of the present invention. Detailed Implementation

[0061] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0062] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0063] Example 1

[0064] This embodiment provides a light-emitting module, such as Figure 1-8 As shown.

[0065] The light-emitting module includes a lens layer 1, a circuit board 2, and a substrate 3.

[0066] The lens layer 1 includes a light-emitting region 11 and a first connecting component 12 surrounding the light-emitting region 11, with a first gap 13 between the light-emitting region 11 and the first connecting component 12. The first connecting component includes a first connecting portion 121 that protrudes upward above the light-emitting region 11, a second connecting portion 122 that is wider at the top and narrower at the bottom and connected to the first connecting portion 121, and a third connecting portion 123 with a first slot and connected to the second connecting portion 122. The first connecting portion 121, the second connecting portion 122, the third connecting portion 123, and the light-emitting region 11 (including the second connecting component 111) are integrally formed by automated production based on a mold.

[0067] The substrate 3 includes a support region 31 and a first groove 32 surrounding the support region 31. A heat sink 33 is provided under the support region of the substrate. The first groove 32 includes a first groove edge 321 near the support region 31 and a third groove edge 322 extending outward from the substrate. A second groove 311 corresponding to the second connecting component 111 is provided on the support region 31. In some embodiments, the second groove 311 is a three-dimensional trapezoid with a wider top and a narrower bottom to facilitate the insertion of the second connecting component 111. The support region 31 (including the second groove 311), the first groove edge 321, and the third groove edge 322 are integrally formed by automated production based on a mold.

[0068] The design of the second connecting portion 122, which is wider at the top and narrower at the bottom, allows the first connecting component 12 to be easily placed in the first groove 32 before pressing in, with a certain margin of error, facilitating subsequent pressing. The height of the first slot is related to the interference required during the pressing process. The greater the interference required, the greater the height of the first slot can be; the smaller the interference required, the smaller the height of the first slot can be. When the height of the first slot is small, there are certain requirements for the pressing pressure; the first connecting component 12 needs to be pressed in with greater pressure and has greater downward friction. In some preferred embodiments, the height of the first slot is 2mm-5mm.

[0069] When the first connecting component 12 is pressed into the first groove 32, the height of the first groove 32 is higher than the height of the first slot. The first groove 32 is divided into a deformable part corresponding to the position of the first slot and an interference part offset from the position of the first slot in the height direction; the interference part forms an interference fit with the first connecting component 12, that is, the height of the interference fit between the first connecting component 12 and the first groove 32 is greater than the height of the first slot.

[0070] The first slot provides deformation space for the extrusion force when the first connecting component 12 is pressed into the first groove 32. The extrusion force is equal to the elastic force provided by the deformation of the first slot. As the first connecting component 12 is pressed into the first groove 32, the interference between the first connecting component 12 and the first groove 32 increases, that is, the extrusion force increases with the pressing process, and the applied extrusion force is about 2-3 tons. When the interference position is flush with the root of the first slot, the first slot is more difficult to deform, and the elastic force provided by the first slot is the greatest. The friction caused by the increasing extrusion force and the volume change caused by the interference deformation enable the first connecting component 12 to be effectively pressed into the first groove 32, thereby enabling the lens 1 and the substrate 3 to be stably connected.

[0071] In some embodiments, if the interference fit requirement during the bonding process between the lens layer 1 and the substrate 3 allows, the first slot may not be provided. Instead, the bent shape of the first connecting component forms an interference fit with the first groove 32 to achieve a better connection effect.

[0072] The light-emitting region 11 includes at least one second connecting component 111, the number and position of which are determined based on the area of ​​the light-emitting region. In a preferred embodiment, a plurality of second connecting components 111 are centrally symmetrically arranged in the light-emitting region to ensure that each area of ​​the light-emitting region is subjected to sufficient clamping force, thereby improving the uniformity and tightness of the bonding between the circuit board and the substrate. This avoids unnecessary gaps between the circuit board and the substrate caused by deformation during the operation of the light-emitting module, especially deformation caused by pressure difference due to temperature rise, and thus avoids light distribution problems caused by deformation.

[0073] The second connecting assembly 111 is composed of two connecting members that combine to form the second slot. Preferably, the two connecting members that combine to form the second slot are configured as a first support 1111 and a second support 1112, with the second slot formed between the first support 1111 and the second support 1112. In some embodiments, the sides of the first support 1111 and the second support 1112 that contact the second groove 311 during the pressing process have a non-parallel uneven structure. Preferably, the uneven structure on the sides of the first support 1111 and the second support 1112 that contact the second groove 311 is a spaced uneven structure extending parallel to the lens layer direction.

[0074] In some preferred embodiments, the first foot 1111 and the second foot 1112 have a wavy structure. This concave-convex structure, especially the wavy structure, allows the third connecting component 111 to have better elasticity during the pressing process into the second groove 311. It replaces the full-area contact between the third connecting component 111 and the second groove 311 with partial, line, or point contact. Optimizing the contact area based on the concave-convex structure improves the pressing flexibility and avoids the third connecting component 111 failing to fully press into the second groove 311 under the specified pressure due to insufficient elasticity, thus preventing unnecessary gaps between the lens and the substrate. The wavy structure of the first foot 1111 and the second foot 1112 extending parallel to the lens layer direction also facilitates pressing with more elastic pressure.

[0075] Similarly, the height of the second groove 32 is higher than the height of the second slot. The second groove 311 is divided into a deformable portion corresponding to the position of the second slot and an interference portion offset from the position of the second slot in the height direction; the interference portion forms an interference fit with the second connecting component 111, that is, the height of the interference fit between the second connecting component 111 and the second groove 311 is greater than the height of the second slot.

[0076] In this embodiment, the second connecting component 111 and the second groove 311 are interference-fitted to achieve tensioning and fixing. Compared with traditional fasteners, such as screws, which are separate fasteners, this method has significant advantages in terms of automation, resistance to water, oxygen, and dust, and stress dispersion. Specifically, the second connecting component 111 and the lens layer 1 are integrally formed based on a mold, and the second groove 311 and the substrate 3 are integrally formed based on a mold. Assembly is achieved through pressing, eliminating the need for additional fastener gripping, positioning, and rotation assembly steps, resulting in a high degree of automation. The integrated design of the second connecting component 111 avoids the holes caused by separate fasteners, provides good sealing without extra gaps, and avoids stress concentration by eliminating extra stress boundaries, thus preventing possible breakage due to unnecessary stress during the pressing process.

[0077] The structural design of the second connecting component and the lens avoids deformation and bulges in the center of the lens, ensuring a tight, deformation-free fit against the substrate. This improves heat dissipation, ensures accurate light distribution, and results in a high light output efficiency for the light-emitting module. It avoids the possibility of lens breakage during the pressing process and the sealing losses associated with separate second connecting components and lenses, such as screws. Excessive pressure can lead to a large pressure difference between the pressure application point and the point furthest from it, increasing the likelihood of lens breakage. Unnecessary breakage and sealing losses further affect light distribution, resulting in a loss of light output efficiency and reducing the overall light output efficiency of the light-emitting module.

[0078] Simultaneously, the interference fit structure between the second connecting component and the second groove, combined with the interference fit structure between the first connecting component and the first groove, causes the lens layer 1 to be pressed down onto the circuit board 2 as a whole. This forces the upper surface of the circuit board 2 to be tightly attached to the bottom surface of the lens layer 1, and the lower surface of the circuit board 2 to be tightly attached to the substrate 3. The large contact area between the circuit board 2 and the substrate 3 results in good heat dissipation. Furthermore, the tight contact between the bottom surface of the circuit board 2 and the bottom surface of the lens layer 1 avoids any gaps between them, thus making the lens light distribution more accurate and the light output efficiency of the module higher. This structure also makes the circuit board 2 less prone to warping, allowing for the use of a thinner circuit board, resulting in relatively lower costs. Since the entire bottom surface of the lens layer 1 is tightly pressed against the circuit board 2, the tolerance for surface flatness of the circuit board 2 is increased, eliminating the need for surface flatness treatment of the circuit board 2, further reducing costs.

[0079] During the lamination process of lens layer 1 with circuit board 2 and substrate 3, the first connecting component 12 is pressed into the first groove 32. The two sides of the third connecting part 123 with slots are squeezed and deformed by the inner wall of the first groove 32, and the gap between the slots narrows. This allows the first connecting component 12 to be inserted into the first groove 32 more smoothly. The interference fit between the third connecting part 123 and the first groove 32 makes the lens layer fit tightly on the circuit board 2 and substrate 3. At the same time, the second connecting component 111 is pressed into the second groove 311. The first support 1111 and the second support 1112 deform and are squeezed by the inner wall of the second groove 311. The first support 1111 and the second support 1112 shrink and deform, and the gap between the second slots narrows.

[0080] In some embodiments, the substrate 3 is further provided with a positioning post 312, the positioning post 312 having a second groove 311, and the circuit board 2 having a through hole adapted to the positioning post. When the circuit board 2 is placed on the substrate 3, the positioning post 312 passes through the through hole to keep the circuit board 2 and the substrate 3 relatively fixed in the horizontal direction. This prevents unnecessary positional displacement of the circuit board 2 during subsequent assembly. In addition, the second groove 311 is provided on the positioning post 312, increasing the depth of the second groove 311, making the fixation between the second connecting component 111 and the second groove 311 more secure.

[0081] Before the pressing process, the first groove 32 and the second groove 311 contain a first colloid with a high viscosity. During the pressing process, the first colloid with a certain viscosity is squeezed into the grooves and fully fills the deformed grooves as the groove spacing gradually narrows due to the pressing. Since the first connecting component 12 is arranged around the light-emitting area 11, the first groove of its third connecting part 123 is a three-dimensional annular hollow area surrounding the light-emitting area 11. After the first colloid deforms and fully fills the first groove and dries, a narrow three-dimensional annular shape with a certain height and a width equal to the width of the deformed first groove is formed in the first groove. Below the first groove, at the empty height between the bottom of the first connecting component 12 and the first groove 32, a wide three-dimensional annular shape with a shorter height and a width equal to the width of the bottom of the first groove 32 is formed. Due to the fluidity of the colloid, the narrow three-dimensional annular shape in the first groove and the wide three-dimensional annular shape at the empty height between the bottom of the first connecting component 12 and the first groove 32 are a two-segment annular integral structure. Simultaneously, after the first colloid in the second slot deforms, fully fills, and dries, a three-dimensional structure with a certain height and a width equal to the width of the deformed first slot is formed within the second slot. Below the second slot, at the empty height between the bottom of the second connecting component 111 and the second groove 311, a three-dimensional structure with a shorter height and a width equal to the bottom width of the second groove 311 is formed. Due to the fluidity of the colloid, the three-dimensional structure in the second slot after drying and the three-dimensional structure at the empty height between the bottom of the second connecting component 111 and the second groove 311 are a two-segment integrated structure.

[0082] The combination of the first colloid with the first slot and the empty height at the bottom of the first connecting component 12 and the first groove 32, especially the cooperation of the first colloid with the deformation of the slot during the pressing process, effectively improves the overall connection stability after the first connecting component 12 is inserted into the first groove 32, and avoids partial separation or loose connection caused by the reaction force between the lens layer 1, the circuit board 2 and the substrate 3 due to the deformation caused by heat dissipation during the operation of the light-emitting module. On the other hand, it plays the role of replacing the conventional light-emitting module sealing ring.

[0083] This embodiment achieves fixation and sealing of the lens layer and substrate by forming a continuous ring structure in the empty height at the bottom of the first connecting component 12 and the first groove 32 and in the first slot, instead of the traditional sealing ring. It replaces the accurate positioning, placement and installation required in the sealing ring assembly process with glue application, which is more conducive to automated production, effectively improves the production efficiency of the light-emitting module and reduces the production cost of the light-emitting module.

[0084] The combination of the first colloid with the second slot and the empty height at the bottom of the second connecting component 111 and the second groove 311, especially the cooperation of the first colloid with the deformation of the second slot during the pressing process, makes the second connecting component 111 and the second groove 311 tightly fixed, thereby effectively tightening the lens layer 1, circuit board 2 and substrate 3 after the first colloid dries, avoiding separation caused by deformation due to temperature rise.

[0085] This embodiment utilizes the fixing structure formed by the second connecting component 111 and the second groove 311 in the slot and the adhesive at the bottom of the second connecting component 111 and the second groove 311 to effectively tighten the lens layer 1, the circuit board 2, and the substrate 3. When the temperature of the light-emitting module in the large area of ​​light emission rises during operation, it effectively avoids deformation that may be caused by the reverse repulsive force of the temperature rise in the area of ​​the light-emitting area that is far from the edge of the light-emitting module. It also avoids unnecessary gaps between the lens layer 1, the circuit board 2, and the substrate 3, which would result in a lack of tight contact and thus affect the sealing performance and the service life of the light-emitting module.

[0086] In the pressed state, the first groove edge 321 is placed in the first interval 13 formed by the light-emitting area 11 and the first connecting component 12. Gaps exist both horizontally and vertically between the first groove edge 321 and the first interval 13. These gaps facilitate the deformation of the third groove edge 322 and its displacement towards the light-emitting area 11 due to pressure when the first connecting component 12 of the lens layer 1 is pressed into the first groove 32. This prevents insufficient space within the first interval 13 due to deformation of the third groove edge 322 during the pressing process, which would otherwise prevent the first connecting component 12 from being fully pressed into the first groove 32, and the light-emitting area 11 and circuit board 2 from being tightly adhered to the substrate 3 without gaps. Poor contact due to failure to achieve tight adhesion will reduce the heat dissipation effect of the light-emitting module and affect its lifespan.

[0087] Multiple protrusions 3211 are spaced apart on the inner side of the first groove edge 321. Each protrusion 3211 is a three-dimensional trapezoid that is wider at the top and narrower at the bottom. In some embodiments, the bottom width of the three-dimensional trapezoid is 0, that is, the cross-section of the protrusion 3211 can be triangular. In a preferred embodiment, the slope of the first groove edge 321 at the position not involving the protrusion 3211 is 2°-5°, and the slope of the first groove edge 321 at the position of the protrusion 3211 is 8°-12°.

[0088] The inner side of the first connecting component 12 is provided with recessed portions 120 corresponding to the protrusions 3211 on the edge of the first groove 321. The recessed shape of the recessed portions 120 is a three-dimensional trapezoid that is wider at the top and narrower at the bottom. In some embodiments, the bottom width of the three-dimensional trapezoid is 0, that is, the cross-section of the recessed shape of the recessed portions 120 can be triangular. In a preferred embodiment, the slope of the inner side of the first connecting component 12 that does not involve the position of the recessed portions 120 is 1°-3°, and the slope of the inner side of the first connecting component 12 at the position of the recessed portions 120 is 4°-7°.

[0089] The multiple protrusions 3211 on the inner side of the first groove edge 321, which are spaced apart and matched, and the recessed part 120 of the first connecting component 12 increase the contact between the first groove 32 and the first connecting component 12. The protrusions 3211 form a strong clamping force on the first groove 32, which increases the biting force between the first groove 32 and the first connecting component 12. This makes the lens layer 1 and the substrate 3 more fixed and less likely to have unnecessary gaps between the lens layer 1 and the substrate 3 due to heat dissipation deformation or other reasons during the use of the light-emitting module, which would further affect the heat dissipation effect.

[0090] The slope of the inner side of the first connecting component 12 at the location not involving the recessed portion 120 is less than the slope of the first groove edge 321 at the location not involving the protrusion 3211, and the slope of the inner side of the first connecting component 12 at the recessed portion 120 is less than the slope of the first groove edge 321 at the protrusion 3211. The slopes of the recessed portions or the inner sides of the first connecting component that do not involve the recessed portions are all less than the slopes of the first groove edge 321 at the corresponding positions. This makes the first connecting component 12 looser at the top and tighter at the bottom during the pressing process into the first groove 32 when pressure is applied to the lens to make it fit the substrate, which is more conducive to assembly and production.

[0091] The first connecting portion 121 of the first connecting component 12 and the third groove edge 322 of the first groove 32 together form the third groove 5.

[0092] In some embodiments, the third groove 5 is formed recessed on the outer side of the first connecting portion 121 of the first connecting component 12.

[0093] In some embodiments, the third groove 5 is formed by recessing the inner side of the third groove edge 322 of the first groove 32.

[0094] In some embodiments, the third groove 5 is recessed on the outer side of the first connecting portion 121 of the first connecting component 12, and the third groove edge 322 of the first groove 32 is recessed on the inner side, with the two opposite recesses forming together.

[0095] The third groove 5 is used to insert colloid to complete the seal. The viscosity of the colloid in the third groove 5 is less than that of the colloid in the first groove 32. In a preferred embodiment, the viscosity of the colloid in the third groove 5 is 15,000 cps-25,000 cps, and the viscosity of the colloid in the first groove 32 is 50,000 cps-60,000 cps.

[0096] In a preferred embodiment, the outer side of the first connecting portion 121 of the first connecting component 12 is recessed, and the inner side of the third groove edge 322 of the first groove 32 is recessed. These opposing recesses together form the third groove 5. In this embodiment, the opposing recesses ensure that the space of the third groove 5 is not solely provided by the width of the first connecting portion 121 or the third groove edge 322. The shared opposing recesses allow for a better reduction in the overall width of the first connecting component 12 and the third groove edge 322 while maintaining the necessary width of the third groove 5. This results in a larger light-emitting area and a higher screen-to-body ratio for the light-emitting module. While maintaining the same light-emitting area, this embodiment, with the outer side of the first connecting portion 121 of the first connecting component 12 and the inner side of the third groove edge 322 of the first groove 32 recessed, provides a more balanced width for the first connecting portion 121 and the third groove edge 322 compared to embodiments with only the outer side of the first connecting portion 121 or only the inner side of the third groove edge 322 recessed. This ensures sufficient width for both components to avoid horizontal misalignment during pressure application to the first connecting component 12.

[0097] The light-emitting module disclosed in this embodiment exhibits significant advantages in heat dissipation among light-emitting modules with large light-emitting areas. It also boasts good fixation and sealing, supporting highly automated assembly. Specifically, this embodiment uses connectors and grooves on the lens and substrate in the light-emitting area to tighten the circuit board and substrate, preventing deformation of the large-area light-emitting module under elevated temperatures and thus avoiding light distribution problems caused by gaps. This embodiment uses an interference fit between the connector and the groove in the light-emitting area instead of screws, avoiding the gaps that can easily create with screws and other discrete fasteners, leading to unnecessary reduction in water and dust resistance and localized stress concentration. The light-emitting module disclosed in this embodiment employs a two-layer fixing and sealing mechanism. First, a viscous colloid deforms with the slot and ultimately solidifies in its deformed form within the connecting component and the first groove, constituting the first layer of fixing and sealing. Second, a less viscous colloid forms the second layer of fixing and sealing within the pressed connecting component and the third groove. These two layers work together to fix the connecting component and the groove twice at different angles and positions, improving the fixation between the lens and the substrate and providing excellent water and oxygen resistance. This embodiment uses an interference fit between the connecting component and the groove instead of screws or clips, improving installation convenience. This embodiment uses dispensing instead of sealing rings, avoiding unnecessary gripping, alignment, and installation of sealing rings during the manufacturing process of the light-emitting module, thus increasing the automation level of the manufacturing process.

[0098] Example 2

[0099] Please see Figure 9 and Figure 10 This embodiment provides a light-emitting module, including a lens layer 1, a circuit board 2, and a substrate 3. Unlike the first embodiment, the first slot of the light-emitting module in this embodiment is located on the top of a first connecting component 12, which is essentially a U-shaped structure. When the first connecting component 12 is pressed into the first groove 32, the top height of the first groove 32 is equal to or slightly exceeds the top height of the first connecting component 12. This allows the adhesive to effectively bond the first connecting component and the top of the second groove 5 after filling the interior of the essentially U-shaped first connecting component when the adhesive is injected into the second groove 5.

[0100] Other technical features and effects of this embodiment are similar to those of Embodiment 1, and will not be repeated here.

[0101] Example 3

[0102] This embodiment provides a method for manufacturing a light-emitting module, used to manufacture the light-emitting module as shown in Embodiment 1, specifically including:

[0103] The lens layer 1, circuit board 2, and substrate 3 are manufactured as provided in Example 1.

[0104] The circuit board 2 is mounted on the substrate 3. The circuit board 2 has necessary directional holes, and the substrate has necessary directional posts. The directional holes and directional posts cooperate to position the circuit board. The circuit board 2 has through holes corresponding to the position of the second groove 311, which are used for the passage of the second connecting component 111 during the pressing process between the second connecting component 111 and the second groove 311.

[0105] Waterproof wires are soldered onto the circuit board mounted on the substrate 3, with the positive and negative terminals of the waterproof wires soldered to the positive and negative terminals on the pads of the circuit board 2, respectively.

[0106] Within the first groove 32 of the substrate 3, an automated dispensing head applies adhesive around the first groove 32, evenly filling the bottom of the first groove 32. The amount of adhesive applied should exceed the amount required for the clearance between the first connecting component 12 and the bottom of the first groove 32, ensuring sufficient material for the first adhesive to be pressed into the first slot during the pressing process. Similarly, the first adhesive is placed within the second groove 311, again exceeding the amount required for the clearance between the second connecting component 111 and the bottom of the second groove 311, ensuring sufficient material for the first adhesive to be pressed into the second slot during the pressing process.

[0107] A robotic arm is used to grasp the lens layer 1 and place it above the substrate 3. The first connecting component 12 is placed into the first groove 32, which has been coated with adhesive, and the second connecting component 111 is placed into the second groove 311, which has been coated with adhesive. Pressure is applied to the lens layer 1 until it adheres to the circuit board 2 on the substrate 3. This pressure application is achieved using automated equipment capable of supporting pressure up to 0.5 tons. During the pressure application process, as the first connecting component 12 is pressed down, the first slot deforms, its spacing decreases, and a portion of the first adhesive is squeezed into the first slot, where it solidifies. The adhesive not squeezed into the first slot fully fills the empty space at the bottom of the first connecting component 12 and the first groove 32, forming a sealing ring integrally with the adhesive squeezed into the first slot. Simultaneously, as the second connecting component 111 is pressed down, the second slot deforms, its spacing decreases, and a portion of the first adhesive is squeezed into the second slot, where it solidifies. The first colloid that is not squeezed into the second slot fully fills the empty height at the bottom of the second connecting component 111 and the second groove 311, and forms a sealed structure together with the colloid squeezed into the second slot.

[0108] Within the third groove 5, an automated dispensing head is used to apply adhesive around the third groove 5, ensuring that the second adhesive evenly fills the third groove 5. The second adhesive in the third groove 5 serves as a second layer of seal, in addition to the adhesive in the first groove 32. This multi-layer sealing design improves the stability of the connection between the lens layer 1 and the substrate 3, resulting in a better overall sealing effect for the light-emitting module.

[0109] Apply adhesive to the groove at the exit point of the waterproof line on the back of the substrate, install the clips, and complete the assembly of the light-emitting module.

[0110] The light-emitting module manufactured using the method provided in this embodiment employs an interference fit between the connecting components and the grooves instead of screws, clips, or other connection methods during manufacturing and assembly, improving installation convenience. Especially for large-area light-emitting modules, the light-emitting area features an integrated connecting structure for compression, preventing deformation caused by temperature rise and thus avoiding impact on heat dissipation. Compared to discrete fastening methods such as screws, this provides better resistance to water, oxygen, and dust, and avoids unnecessary stress concentration. During the pressing process, a viscous colloid deforms with the grooves and ultimately solidifies in its deformed form within the connecting components and the first and second grooves, constituting the first layer of fixation and sealing. A lower-viscosity colloid forms the second layer of fixation and sealing within the pressed connecting components and the third groove. This dispensing method replaces sealing rings, resulting in high automation, high production efficiency, and low production costs.

[0111] For illustrative purposes, the foregoing description uses specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Therefore, for purposes of illustration and description, the foregoing description of specific embodiments described herein is presented. These descriptions are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the teachings above. Furthermore, when used herein to refer to the location of components, the terms above and below, or their synonyms, do not necessarily refer to absolute locations relative to external references, but rather to the relative locations of the components with reference to the accompanying drawings.

[0112] Furthermore, the foregoing figures and descriptions include numerous concepts and features that can be combined in various ways to achieve a variety of beneficial effects and advantages. Therefore, features, components, elements, and / or concepts from various different figures can be combined to produce embodiments or implementations that are not necessarily shown or described in this specification. Moreover, in any particular embodiment and / or implementation, not all features, components, elements, and / or concepts shown in the specific figures or descriptions are necessarily required. It should be understood that such embodiments and / or implementations fall within the scope of this specification.

Claims

1. A light-emitting module, characterized in that, include: Lens layer, substrate; The substrate includes a first groove that is continuous around the support area, and the first width at the top of the first groove is greater than the second width at the bottom of the first groove; the support area includes at least one second groove. The lens layer includes a first connecting component that is continuous around the light-emitting area. The first connecting component has a first slot at its bottom. The light-emitting area includes at least one second connecting component. The second connecting component has a second slot at its bottom. The width of the first slot when the first connecting component is inserted into the first groove is smaller than the width of the first slot when the first connecting component is not inserted into the first groove; The width of the second slot when the second connecting component is inserted into the second groove is smaller than the width of the second slot when the second connecting component is not inserted into the second groove; The four peripheral edges of the substrate and the four peripheral edges of the lens layer form a third groove surrounding the lens layer; The first groove and / or the third groove contain a colloid.

2. The light-emitting module according to claim 1, characterized in that, The second groove contains a colloid; the first side of the second connecting component includes a concave-convex structure, and the first side of the second connecting component is the contact surface between the second connecting component and the second groove.

3. The light-emitting module according to claim 2, characterized in that, The concave-convex structure on the first side of the second connecting component is an intermittent concave-convex structure extending in a direction parallel to the lens layer; or the concave-convex structure on the first side of the second connecting component is an intermittent concave-convex structure extending in a direction perpendicular to the lens layer.

4. The light-emitting module according to claim 1, characterized in that, The second connecting component consists of two second connecting component connectors that combine to form the second slot.

5. The light-emitting module according to claim 4, characterized in that, The second groove contains a colloid; the contact surfaces of the two second connecting component connectors constituting the second connecting component with the second groove both include a concave-convex structure.

6. The light-emitting module according to claim 5, characterized in that, The concave-convex structure is an intermittent concave-convex structure extending in a direction parallel to the lens layer; or, the concave-convex structure is an intermittent concave-convex structure extending in a direction perpendicular to the lens layer.

7. The light-emitting module according to claim 1, characterized in that, The first groove has a plurality of protrusions spaced apart on the inner side of the groove edge near the lens layer, and the first connecting component has a plurality of recesses corresponding to the protrusions on the side near the plurality of protrusions.

8. The light-emitting module according to claim 7, characterized in that, The top width of the protrusion is greater than the bottom width of the protrusion; the top width of the recess is greater than the bottom width of the recess. The angle formed by the difference between the top width and the bottom width of the protrusion is greater than the angle formed by the difference between the bottom width and the top width of the protrusion.

9. The light-emitting module according to claim 1, characterized in that, The top of the first connecting component includes a first step structure, and the first step structure and the four peripheral edges of the substrate form the third groove surrounding the lens layer; and / or; The substrate has a second step structure around its four periphery, and the second step structure and the lens layer together form the third groove surrounding the lens layer.

10. The light-emitting module according to claim 1, characterized in that, The lens layer includes a light-emitting area and the first connecting component. The light-emitting area and the first connecting component are integral. A first gap is formed between the light-emitting area and the first connecting component. The groove edge of the first groove on the side near the lens layer is located within the first gap. The top width of the first gap is greater than the top width of the groove edge of the first groove on the side near the lens layer. The bottom width of the first gap is greater than the bottom width of the groove edge of the first groove on the side near the lens layer.

11. The light-emitting module according to claim 1, characterized in that, The height of the first slot is less than the height of the first groove; the first groove is divided into a deformable part corresponding to the position of the first slot and an interference part offset from the position of the first slot in the height direction; the interference part forms an interference fit with the first connecting component.

12. The light-emitting module according to claim 1, characterized in that, The height of the second slot is less than the height of the second groove; the second groove is divided into a deformable part corresponding to the position of the second slot and an interference part offset from the position of the second slot in the height direction; the interference part forms an interference fit with the second connecting component.

13. The light-emitting module according to any one of claims 1-12, characterized in that, The light-emitting module also includes a circuit board, which is located on the substrate.

14. The light-emitting module according to claim 13, characterized in that, The substrate is provided with a positioning post, and the second groove is formed on the positioning post. The circuit board is provided with a through hole adapted to the positioning post. When the circuit board is placed on the substrate, the positioning post can pass through the through hole so that the circuit board and the substrate remain relatively fixed in the horizontal direction.

15. A light-emitting module, characterized in that, include: Lens layer, substrate; The substrate includes a first groove that is continuous around the support area, and the first width at the top of the first groove is greater than the second width at the bottom of the first groove; the support area includes at least one second groove. The lens layer includes a first connecting component that is continuous around the light-emitting area. The first connecting component has a first slot at its top. The light-emitting area includes at least one second connecting component. The second connecting component has a second slot at its bottom. The width of the first slot when the first connecting component is inserted into the first groove is smaller than the width of the first slot when the first connecting component is not inserted into the first groove; The width of the second slot when the second connecting component is inserted into the second groove is smaller than the width of the second slot when the second connecting component is not inserted into the second groove; The four peripheral edges of the substrate and the four peripheral edges of the lens layer form a third groove surrounding the lens layer; The first groove and / or the third groove contain a colloid.

16. The light-emitting module according to claim 15, characterized in that, When the first connecting component is pressed into the first groove, the top height of the first groove is equal to or partially exceeds the top height of the first connecting component.

17. The light-emitting module according to claim 15, characterized in that, The first connecting component has a U-shaped structure.

18. The light-emitting module according to claim 15, characterized in that, The second groove contains a colloid; the first side of the second connecting component includes a concave-convex structure, and the first side of the second connecting component is the contact surface between the second connecting component and the second groove.

19. The light-emitting module according to claim 18, characterized in that, The concave-convex structure on the first side of the second connecting component is an intermittent concave-convex structure extending in a direction parallel to the lens layer; or the concave-convex structure on the first side of the second connecting component is an intermittent concave-convex structure extending in a direction perpendicular to the lens layer.

20. The light-emitting module according to claim 15, characterized in that, The second connecting component consists of two second connecting component connectors that combine to form the second slot.

21. The light-emitting module according to claim 20, characterized in that, The second groove contains a colloid; the contact surfaces of the two second connecting component connectors constituting the second connecting component with the second groove both include a concave-convex structure.

22. The light-emitting module according to claim 21, characterized in that, The concave-convex structure is an intermittent concave-convex structure extending in a direction parallel to the lens layer; or, the concave-convex structure is an intermittent concave-convex structure extending in a direction perpendicular to the lens layer.

23. The light-emitting module according to claim 15, characterized in that, The first groove has a plurality of protrusions spaced apart on the inner side of the groove edge near the lens layer, and the first connecting component has a plurality of recesses corresponding to the protrusions on the side near the plurality of protrusions.

24. The light-emitting module according to claim 23, characterized in that, The top width of the protrusion is greater than the bottom width of the protrusion; the top width of the recess is greater than the bottom width of the recess. The angle formed by the difference between the top width and the bottom width of the protrusion is greater than the angle formed by the difference between the bottom width and the top width of the protrusion.

25. A light-emitting device comprising a light-emitting module according to any one of claims 1-24.

26. A method for manufacturing a light-emitting module, characterized in that, include: Provides a lens layer and substrate for a light-emitting module as described in any one of claims 1-24; A first colloid is placed in the first groove, and a first colloid is placed in the second groove; The lens layer is placed on the substrate, the first connecting component is placed in the first groove, and the second connecting component is placed in the second groove; Apply pressure to the lens layer until the lens layer adheres to the substrate; A second colloid is placed inside the third groove.

27. The method for manufacturing a light-emitting module according to claim 26, characterized in that, The manufacturing method further includes: placing a circuit board on the substrate; applying pressure to the lens layer until the lens layer is bonded to the substrate includes: the lens layer being bonded to the circuit board, and the circuit board being bonded to the substrate.

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