A mounting method for optical assembly and optical assembly

Abstract

The application discloses a mounting method suitable for a light assembly and the light assembly. The mounting method comprises the following steps: mounting a detector chip on a first preset position of a second substrate to form a back-illumination detector; recognizing a surface pattern of a first substrate, constructing a first coordinate system, and obtaining the mounting position coordinates of the detector chip on the first substrate according to the mounting position of the detector chip; recognizing a back surface pattern of the detector chip on the second substrate, constructing a second coordinate system, and obtaining a compensation angle of the back-illumination detector and compensation amounts of a horizontal axis and a vertical axis of the back-illumination detector by using the first coordinate system and the second coordinate system; and compensating the back-illumination detector by using the compensation angle and the compensation amounts of the horizontal axis and the vertical axis of the back-illumination detector, so as to mount the detector chip on the mounting position. The application can obtain the conversion relationship between the coordinates and the compensation angle of the back-illumination detector by constructing the coordinate systems, and can accurately mount the detector chip on the first substrate according to the compensation angle.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a mounting method for optical components and an optical component. Background Technology

[0002] In the assembly of multi-channel optical devices, the consistency of the channel spacing between optical chips has a significant impact on the coupling efficiency of the devices. To meet the high-precision requirements (micrometer level) of the channel spacing, a high-precision pick-and-place machine is generally used. The placement process involves first using a high-magnification CCD (Charge-Coupled Device) to identify the pattern on the chip surface, then moving the nozzle or chip stage to ensure that the nozzle and chip are in the relative positions set by the program. The nozzle then descends to the chip surface and picks up the chip using vacuum suction. Because the chip size is generally small, centering the nozzle during pickup ensures that the chip displacement during the pickup process is at the sub-micrometer level. The nozzle then moves to the substrate to be mounted, identifies the substrate pattern, calculates the required displacement, and then moves to the corresponding position for placement.

[0003] The above placement methods assume that the chip displacement during the pick-up process is much smaller than the tolerance requirements. However, in many current applications, such as back-illuminated detector chips and high-speed EML (ElectroAbsorption Modulated Laser) chips, the chip is first eutectic bonded to a small carrier plate, and then the chip and the small carrier plate (COC) are attached together to the large substrate of the optical device. The chip is not necessarily in the center of the small carrier plate, and there are also capacitors and other components on the small carrier plate. Therefore, when the nozzle picks up the COC, because the COC is generally several times heavier than the chip, and the weight varies at different locations, the COC is prone to micron-level displacement and angular deflection during the pick-up process. Therefore, if the conventional placement method is still used, the final inter-channel error will be greater than the tolerance range, causing the coupling efficiency of the optical device to fail to meet the requirements.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0005] The technical problem to be solved by the present invention is how to solve the problem of inaccurate mounting accuracy caused by displacement and deflection due to the weight of the back-illuminated detector during the mounting process of existing optical components.

[0006] The present invention adopts the following technical solution:

[0007] In a first aspect, the present invention proposes a mounting method suitable for optical components, the optical components including a first substrate and a back-illuminated detector, the back-illuminated detector including a detector chip and a second substrate, the mounting method specifically including:

[0008] The detector chip is mounted onto a first predetermined position on the second substrate. The optical component includes a first substrate and a back-illuminated detector. The back-illuminated detector includes a detector chip and a second substrate. The mounting method specifically includes:

[0009] The detector chip is mounted on the first preset position on the second substrate to form a back-illuminated detector.

[0010] The surface pattern of the first substrate is identified, a first coordinate system is constructed, and the mounting position coordinates of the detector chip on the first substrate are obtained according to the mounting position of the detector chip on the first substrate.

[0011] The back-illuminated detector is sampled, the back pattern of the detector chip on the second substrate side is identified, a second coordinate system is constructed, and the compensation angle of the back-illuminated detector and the compensation amount of the horizontal and vertical axes of the back-illuminated detector are obtained using the first and second coordinate systems.

[0012] The back-illuminated detector is compensated using the compensation angle, the compensation amount of the horizontal axis and the vertical axis of the back-illuminated detector, so as to facilitate the mounting of the detector chip to the mounting position.

[0013] Preferably, the step of identifying the surface pattern of the first substrate and constructing the first coordinate system specifically includes:

[0014] The first CCD camera is used to identify the surface pattern of the first substrate, and the first pattern and the second pattern on the first substrate are obtained.

[0015] Connect the centers of the first and second patterns with a straight line, use the straight line as the X-axis, the midpoint of the straight line as the origin of the first coordinate system, and a straight line perpendicular to and passing through the origin as the Y-axis to construct the first coordinate system.

[0016] Preferably, obtaining the mounting position coordinates of the detector chip on the first substrate based on the mounting position of the detector chip on the first substrate specifically includes:

[0017] Based on the mounting relationship between the detector chip and the first substrate, the mounting position of the detector chip is obtained, and the unit length in the first coordinate system is set.

[0018] The mounting position is projected onto the first coordinate system to obtain the mounting position coordinates corresponding to the mounting position.

[0019] Preferably, before the back-illuminated detector is picked up, the method further includes determining the center point position of the detector chip by the nozzle based on the surface pattern of the detector, specifically including:

[0020] The upper surface pattern of the detector chip is acquired using a first CCD camera, and the third, fourth, fifth, and sixth patterns that are symmetrical about the chip center within the upper surface pattern are selected.

[0021] The third, fourth, fifth, and sixth patterns are connected sequentially to form a rectangular pattern, and the diagonal of the rectangular pattern is drawn to obtain the center point position of the detector chip.

[0022] Preferably, the step of identifying the back pattern of the second substrate-side detector chip and constructing a second coordinate system specifically includes:

[0023] The back pattern of the detector chip on the second substrate side is identified using a second CCD camera, the center pattern of the back of the detector chip is obtained, and the seventh and eighth patterns that are symmetrical about the center pattern are selected.

[0024] Connect the centers of the seventh and eighth patterns with a straight line, use the perpendicular bisector of the line as the y-axis, use the center pattern on the back of the detector chip as the origin of the coordinate system, and use the line perpendicular to the y-axis and passing through the origin of the coordinate system as the y-axis to construct a second coordinate system.

[0025] Preferably, the step of obtaining the compensation angle, the compensation amount of the horizontal axis and the vertical axis of the back-illuminated detector using the first coordinate system and the second coordinate system specifically includes:

[0026] The back-illuminated detector is moved to the mounting position coordinates using a suction nozzle, and the second coordinate system is projected onto the first coordinate system to obtain the compensation angle of the back-illuminated detector.

[0027] By rotating the suction nozzle in the opposite direction at the compensation angle, the back-illuminated detector is aligned with the mounting position to obtain the compensation amounts for the horizontal and vertical axes.

[0028] Preferably, the back-illuminated detector is compensated using the compensation angle and the compensation amounts of the horizontal and vertical axes of the back-illuminated detector to facilitate the mounting of the detector chip to the mounting position, specifically including:

[0029] Rotate the nozzle in the opposite direction to adjust the back-illuminated detector to be parallel to the mounting position;

[0030] Based on the compensation amounts of the horizontal and vertical axes, the back-illuminated detector is moved to coincide with the mounting position, the nozzle is pressed down, and the detector chip is mounted onto the first substrate at the mounting position.

[0031] Secondly, in contrast to the mounting method for optical components in the first aspect, the present invention also proposes an optical component that is applicable to the mounting method for optical components in the first aspect. The optical component includes a first substrate and a back-illuminated detector, and the back-illuminated detector includes a detector chip and a second substrate.

[0032] The detector chip is mounted at a first preset position on the second substrate to form a back-illuminated detector.

[0033] The first substrate has a mounting position for the back-illuminated detector so that the back-illuminated detector can be mounted onto the mounting position.

[0034] Preferably, the second substrate is a transparent quartz substrate to facilitate the identification of the back pattern of the detector chip.

[0035] Preferably, the second substrate has an extension portion along its length.

[0036] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows:

[0037] This invention utilizes the surface pattern of a first substrate to construct a first coordinate system, thereby obtaining the mounting position coordinates of the detector chip on the first substrate. Then, it uses the backside pattern of the detector chip on the second substrate to construct a second coordinate system and obtains the relationship between the first and second coordinate systems. The compensation angle of the back-illuminated detector is obtained through the relationship between the two coordinate systems, and the detector chip is moved to the mounting position coordinates. Based on the compensation angle, the detector chip is aligned with the mounting position on the first substrate, facilitating accurate mounting of the detector chip to its designated mounting position on the first substrate. This invention uses the coordinate system construction method to calculate the compensation angle required during detector chip assembly, enabling the detector chip to be accurately mounted at its corresponding mounting position on the first substrate. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0039] Figure 1 This is a flowchart of a mounting method for optical components provided in an embodiment of the present invention;

[0040] Figure 2a This is a schematic diagram of the structure of an optical component provided in an embodiment of the present invention;

[0041] Figure 2b This is a schematic diagram of a back-illuminated detector structure for an optical component provided in an embodiment of the present invention;

[0042] Figure 2c This is a schematic diagram of a back-illuminated detector suction nozzle structure provided in an embodiment of the present invention;

[0043] Figure 2d This is a schematic diagram of the angular deflection of a back-illuminated detector of an optical component provided in an embodiment of the present invention;

[0044] Figure 2e A schematic diagram of the mounting and calibration of a back-illuminated detector for an optical component provided in an embodiment of the present invention;

[0045] Figure 3a This is a flowchart of a method for constructing a first coordinate system in a mounting method for optical components, provided by an embodiment of the present invention.

[0046] Figure 3b This is a schematic diagram of the structure of a back-illuminated detector using a first CCD camera, provided in an embodiment of the present invention.

[0047] Figure 4 This is a schematic diagram of the construction of a first coordinate system in a mounting method for optical components provided by an embodiment of the present invention;

[0048] Figure 5 This is a flowchart of a method for obtaining the mounting position coordinates of a detector chip on a first substrate, which is applicable to the mounting method of optical components according to an embodiment of the present invention.

[0049] Figure 6a This is a flowchart of a method for determining the center position of a detector chip picked up by a suction nozzle, which is applicable to the mounting method of optical components according to an embodiment of the present invention.

[0050] Figure 6b This is a schematic diagram of the structure of using a second CD camera to identify the back of a back-illuminated detector according to an embodiment of the present invention;

[0051] Figure 6c This is a schematic diagram of another perspective structure for identifying the back of a back-illuminated detector using a second CD camera, provided in an embodiment of the present invention.

[0052] Figure 6d This is a schematic diagram of the structure for obtaining the center point position of the detector chip using the third, fourth, fifth, and sixth patterns provided in an embodiment of the present invention;

[0053] Figure 7a This is a flowchart of a method for constructing a second coordinate system according to an embodiment of the present invention for mounting optical components;

[0054] Figure 7b This is a schematic diagram of a method for constructing a second coordinate system for mounting optical components, provided by an embodiment of the present invention.

[0055] Figure 8 This is a flowchart of a method for obtaining the relationship between a first coordinate system and a second coordinate system, which is provided by an embodiment of the present invention for mounting optical components.

[0056] Figure 9 This is a flowchart of a method for obtaining the supplementary angle of a back-illuminated detector using a mounting method applicable to optical components, provided by an embodiment of the present invention.

[0057] Figure 10 This is a schematic diagram of a back-illuminated detector suction nozzle structure provided in an embodiment of the present invention;

[0058] In the attached figures, the following labels are used:

[0059] 1-First substrate; 2-Back-illuminated detector; 21-Detector chip; 22-Second substrate; 3-First CCD camera; 4-Second CCD camera; 5-Nose. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0061] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0062] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0063] Example 1:

[0064] Embodiment 1 of the present invention provides a mounting method suitable for optical components, such as... Figure 1 and Figure 2a As shown, the optical component includes a first substrate 1 and a back-illuminated detector 2. The back-illuminated detector 2 includes a detector chip 21 and a second substrate 22. The mounting method specifically includes:

[0065] Step 201: Mount the detector chip 21 onto the first preset position on the second substrate 22 to form a back-illuminated detector 2.

[0066] like Figures 2a-2b As shown, the back-illuminated detector 2 of this embodiment includes a detector chip 21 and a second substrate 22, and the second substrate 22 is made of transparent quartz glass. The detector chip 21 is relatively lightweight, and the mounting position of the detector chip 21 and the second substrate 22 can be identified by the pattern on the back of the second substrate 22. Therefore, when the detector chip 21 is mounted onto the second substrate 22 in this embodiment, it can be considered that the two are precisely mounted at corresponding positions, and there is no mounting error in the mounting process. In addition, this embodiment typically uses a eutectic bonding process to mount the detector chip 21 onto the second substrate 22, and after the detector chip 21 and the second substrate 22 are mounted, they will not slip.

[0067] Step 202: Identify the surface pattern of the first substrate 1, construct a first coordinate system, and obtain the mounting position coordinates of the detector chip 21 on the first substrate 1 according to the mounting position of the detector chip 21 on the first substrate 1.

[0068] The first substrate 1 is mainly used to support the back-illuminated detector 2 and some other electronic components. Since the detector chip 21 needs to be connected to the first substrate 1, some patterns need to be etched on the first substrate 1 (for example, multiple pads are etched, and the corresponding pad patterns can be used as the surface patterns of the first substrate 1). The surface patterns on the first substrate 1 are identified by a CCD camera. A first coordinate system is constructed using any two specific surface patterns, and then the first coordinate position on the first substrate 1 is obtained within the first coordinate system. When the detector chip 21 of this embodiment moves to the mounting position coordinate, the detector chip 21 itself may be deflected and cannot be directly mounted at the mounting position coordinate. The detector chip 21 needs to be angle-compensated, as well as the horizontal and vertical axes compensated, before it can be mounted at the mounting position coordinate to make the detector chip 21 coincide with the mounting position.

[0069] Step 203: Take the back-illuminated detector 2, identify the back pattern of the detector chip 21 on the second substrate 22, construct a second coordinate system, and use the first and second coordinate systems to obtain the compensation angle of the back-illuminated detector 2 and the compensation amount of the horizontal and vertical axes of the back-illuminated detector 2.

[0070] Among them, such as Figure 2cAs shown, this invention typically employs a nozzle to pick up the back-illuminated detector 2, then uses the nozzle to move the back-illuminated detector 2 to the first coordinate position corresponding to the first substrate 1, and then uses a eutectic bonding process to complete the mounting of the two. When the nozzle picks up the back-illuminated detector 2, because the back-illuminated detector 2 is relatively heavy and the weight distribution at different positions is different, the back-illuminated detector 2 is very prone to displacement and deflection at a certain angle during the picking process (see...). Figure 2d In this diagram, the dashed lines represent the position and orientation of the target's back-illuminated detector 2, while the solid lines represent the back-illuminated detector 2 after displacement and deflection.

[0071] Furthermore, after being picked up, the nozzle obstructs the view, making it impossible to identify the pattern on the chip's surface from the front for orientation calibration. In this embodiment of the invention, the pattern on the back of the detector chip 21 is used for positioning. The displacement and deflection angle of the back-illuminated detector 2 picked up by the nozzle can be detected. The back pattern of the detector chip 21 is identified from the second substrate 22 side by a CCD camera. Then, a second coordinate system is constructed. Through the second coordinate system, the displacement of the back-illuminated detector 2 relative to the second coordinate system can be obtained. Then, the relationship between the first and second coordinate systems is constructed to obtain the compensation angle of the detector chip 21 and the compensation amounts of the horizontal and vertical axes of the back-illuminated detector 2. The detector chip 21 can be accurately moved to the required mounting position (at this time, the detector chip 21 can only be moved to the required mounting position, without correcting the deflection angle of the detector chip 21).

[0072] Step 204: The back-illuminated detector 2 is compensated using the compensation angle, the compensation amount of the horizontal axis and the vertical axis of the back-illuminated detector 2, so as to facilitate the mounting of the detector chip 21 to the mounting position.

[0073] In an optional embodiment, after determining the compensation angle, the suction nozzle is rotated in the opposite direction to perform angle compensation, combined with... Figure 2e The back-illuminated detector 2 is adjusted to be parallel to the mounting position and also parallel to the first substrate. Then, the nozzle is moved to compensate for displacement in the X and Y directions, achieving alignment with the mounting position. The nozzle is then pressed down, and the back-illuminated detector 2 is mounted onto the large substrate. Finally, the nozzle is lifted to complete the mounting of one channel of the back-illuminated detector 2.

[0074] In this embodiment of the invention, the compensation angle of the back-illuminated detector 2, as well as the compensation amounts of the horizontal and vertical axes of the back-illuminated detector 2, are obtained by utilizing the relationship between the first and second coordinate systems. The back-illuminated detector 2 is rotated in the opposite direction using the nozzle to adjust its compensation angle, aligning it with the mounting position. Then, the detector chip 21 is aligned with the mounting position using the compensation amounts of the horizontal and vertical axes. Finally, the nozzle is pressed down to accurately mount the detector chip 21 onto the mounting position (see [reference]). Figure 2e It is worth noting that, in order to facilitate obtaining the compensation angle of the back-illuminated detector 2, when constructing the first coordinate system in this embodiment of the invention, the horizontal axis (or vertical axis) of the first coordinate system is usually related to the mounting position. For example, a pattern mark with the same pattern as the back of the detector chip 21 is set at the same position as the mounting position. Through the reference function of the pattern mark, the compensation angle of the detector chip 21 is accurately obtained using the first and second coordinate systems. In addition, in this embodiment of the invention, the detector chip 21 is first mounted to the second substrate 22 to form the back-illuminated detector 2. When describing the movement of the detector chip 21 to the required mounting position and the angle compensation of the detector chip 21, theoretically, the back-illuminated detector 2 can be used instead of the detector chip 21 for description. The mounting position in this embodiment of the invention means that the back-illuminated detector 2 is just mounted to the required mounting position on the first substrate 1 and is precisely aligned.

[0075] This invention utilizes the surface pattern of the first substrate 1 to construct a first coordinate system, obtaining the mounting position coordinates of the detector chip 21 on the first substrate 1. Then, it utilizes the backside pattern of the detector chip 21 on the second substrate 22 to construct a second coordinate system. The relationship between the first and second coordinate systems is used to obtain the compensation angle of the back-illuminated detector 2, as well as the compensation amounts for the horizontal and vertical axes of the back-illuminated detector 2. The detector chip 21 is then moved to the mounting position coordinates. Based on the compensation angle and the compensation amounts for the horizontal and vertical axes of the back-illuminated detector 2, the detector chip 21 is aligned with the corresponding mounting position. Finally, the nozzle is pressed down to accurately mount the detector chip 21 onto the mounting position corresponding to the mounting position. This invention utilizes the coordinate system construction method to calculate the angle that needs compensation during the assembly of the detector chip 21, as well as the compensation amounts for the horizontal and vertical axes, thereby enabling the detector chip 21 to be accurately mounted on the corresponding mounting position on the first substrate 1.

[0076] To illustrate the complete solution of this invention, the specific details of this invention will be explained in detail below. The embodiment of this invention describes identifying the surface pattern of the first substrate 1 and constructing a first coordinate system, as follows... Figure 3a and Figure 3b As shown, it specifically includes:

[0077] Step 301: Use the first CCD camera 3 to identify the surface pattern of the first substrate 1 and obtain the first pattern and the second pattern on the first substrate 1.

[0078] Among them, such as Figure 3b As shown, in this embodiment of the invention, a first CCD camera 3 is used to identify the surface pattern of a first substrate 1, and two patterns on the first substrate 1 (such as...) are selected. Figure 4 As shown, a first coordinate system is established using the first pattern and the second pattern. During the construction of the first coordinate system, the coordinate system is located in the plane containing the surface of the first substrate 1. The first coordinate system can be constructed through this plane and two specific points (the points where the first pattern and the second pattern are located).

[0079] Step 302: Connect the centers of the first pattern and the second pattern with a straight line, take the straight line as the X-axis, the midpoint of the straight line as the origin of the first coordinate system, and the straight line perpendicular to and passing through the origin as the Y-axis to construct the first coordinate system.

[0080] In this embodiment of the invention, a first coordinate system is constructed on the surface of the first substrate 1 using a first pattern and a second pattern. A line is drawn connecting the centers of the first and second patterns, and this line is used as the X-axis. The midpoint of this line (actually a line segment) is used as the origin of the first coordinate system, and a line perpendicular to and passing through the origin is used as the Y-axis. Once the first coordinate system is constructed, the mounting position coordinates of the detector chip 21 (or back-illuminated detector 2) within the first coordinate system can be obtained. Theoretically, this embodiment of the invention can construct the first coordinate system at any position within the plane containing the surface of the first substrate 1. Preferably, this embodiment of the invention uses the method described above to construct the first coordinate system.

[0081] The first and second patterns can be circles, rectangles, or polygons, etc. This embodiment uses circles for illustration. A straight line is drawn connecting the centers of the first and second patterns, with the midpoint of the line as the origin of the coordinate system. The direction perpendicular to the line is the Y-axis, and the direction parallel to the line is the X-axis. After determining the coordinate system, (X1, Y1) is the coordinate point of the back-illuminated detector 2 in channel 1, (X1+L, Y1) is the coordinate point of the back-illuminated detector 2 in channel 2, (X1+2L, Y1) is the coordinate point of the back-illuminated detector 2 in channel 3, and (X1+3L, Y1) is the coordinate point of the back-illuminated detector 2 in channel 4, where L is the distance between adjacent channels in the X-axis direction. After confirming the coordinate points of each channel, the machine begins dispensing adhesive. Since the leads on the surface of the back-illuminated detector 2 generally carry high-frequency signals, a good reference ground is required at the bottom. Therefore, conductive silver paste is preferred.

[0082] After establishing the first coordinate system, it is necessary to obtain the mounting coordinates of the back-illuminated detector 2 within the first coordinate system, which corresponds to the mounting coordinates in this embodiment of the invention. This embodiment describes obtaining the mounting coordinates of the detector chip 21 on the first substrate 1 based on its mounting position on the first substrate 1, as follows: Figure 5 As shown, it specifically includes:

[0083] Step 401: Obtain the mounting position of the detector chip 21 according to the mounting relationship between the detector chip 21 and the first substrate 1.

[0084] After constructing the first coordinate system (i.e., obtaining the origin, X-axis, and Y-axis within the first coordinate system), it is also necessary to set the unit length within the first coordinate system (i.e., the actual length represented by each unit scale) to facilitate the subsequent acquisition of the mounting position coordinates of the back-illuminated detector 2, as well as the relationship between the first and second coordinate systems.

[0085] Step 402: Project the mounting position onto the first coordinate system to obtain the mounting position coordinates corresponding to the mounting position.

[0086] Once the first coordinate system is constructed and the unit length within the first coordinate system is set, the mounting position coordinates of the detector chip 21 can be obtained by using the mounting position of the detector chip 21.

[0087] To avoid larger angles of deflection and displacement when the nozzle picks up the back-illuminated detector 2 due to differences in mass at various points on the detector chip 21, this embodiment of the invention further includes determining the center point position of the nozzle picking up the detector chip 21 by examining the surface pattern of the detector before picking it up, such as... Figure 6a and Figure 6b As shown, it specifically includes:

[0088] Step 501: Use the first CCD camera 3 to acquire the upper surface pattern of the detector chip 21, and select the third, fourth, fifth and sixth patterns that are symmetrical about the chip center within the upper surface pattern.

[0089] Among them, such as Figures 6b-6c As shown, in this embodiment of the invention, the first CCD camera 3 is used to identify the pattern on the upper surface of the detector chip 21 (e.g., the pins on the chip), and the center of symmetry of the upper surface of the detector chip 21 is obtained by selecting the third, fourth, fifth, and sixth patterns. For the detector chip 21, the pattern on its upper surface is typically set in a regular pattern to facilitate better connection to external devices. The third, fourth, fifth, and sixth patterns in this embodiment of the invention can also be manually set.

[0090] Step 502: Connect the third, fourth, fifth and sixth patterns in sequence to form a rectangular pattern, and draw the diagonal of the rectangular pattern to obtain the center point position of the detector chip 21.

[0091] like Figure 6d As shown, the third, fourth, fifth, and sixth patterns in this embodiment of the invention can be selected or set on the detector chip 21 to facilitate obtaining the center point position of the detector chip 21. This center point position is the position where the nozzle picks up the detector chip 21. Since the mass distribution of the detector chip 21 is usually difficult to measure, the position picked up by the nozzle is typically the center position of the detector chip 21.

[0092] This embodiment of the invention also requires the construction of a second coordinate system. The relationship between the second coordinate system and the first coordinate system facilitates the precise mounting of the detector chip 21 at the mounting position. This involves identifying the back pattern of the detector chip 21 on the second substrate 22 side and constructing the second coordinate system, as follows: Figure 7a As shown, it specifically includes:

[0093] Step 601: Use the second CCD camera 4 to identify the back pattern of the detector chip 21 on the side of the second substrate 22, obtain the center pattern of the back of the detector chip 21, and select the seventh and eighth patterns that are symmetrical about the center pattern.

[0094] To implement the solution of the embodiment of the present invention, the back of the detector chip 21 of the present invention is provided with a central pattern at the center, and the back of the detector chip 21 is provided with a seventh pattern and an eighth pattern symmetrical about the central pattern. The shapes of the central pattern, the seventh pattern and the eighth pattern can be set according to the actual situation (e.g., set as a circle, a square or a triangle), and the central pattern, the seventh pattern and the eighth pattern can be set manually, or they can be electrical structures on the chip, such as metal pads.

[0095] Step 602: Connect the centers of the seventh and eighth patterns with a straight line, take the perpendicular bisector of the straight line as the y-axis, take the center pattern on the back of the detector chip 21 as the origin of the coordinate system, and take the straight line perpendicular to the y-axis and passing through the origin of the coordinate system as the y-axis to construct a second coordinate system.

[0096] Among them, such as Figure 7bAs shown, in this embodiment of the invention, the directions of the chip's x-axis and y-axis can be determined by the two angle recognition patterns (the seventh and eighth patterns) above the photosensitive surface on the back of the detector chip 21 and the center pattern on the photosensitive surface. Then, the angular deflection value of the back-illuminated detector 2 is calculated. To distinguish between the first and second coordinate systems, this embodiment uses the x-axis and y-axis to represent the horizontal and vertical axes of the first coordinate system, respectively; and uses the x-axis and y-axis to represent the horizontal and vertical axes of the second coordinate system, respectively. The method for establishing the second coordinate system is the same as that for the first coordinate system and will not be described in detail here.

[0097] The following details the process of obtaining the compensation angle of the back-illuminated detector 2 and the corresponding compensation amounts on the horizontal and vertical axes using the first and second coordinate systems. This embodiment describes the process of obtaining the compensation angle of the back-illuminated detector 2 and the compensation amounts on the horizontal and vertical axes using the first and second coordinate systems, as follows: Figure 8 As shown, it specifically includes:

[0098] Step 701: Use the nozzle to move the back-illuminated detector 2 to the mounting position coordinates, and project the second coordinate system onto the first coordinate system to obtain the compensation angle of the back-illuminated detector 2.

[0099] After the back-illuminated detector 2 is moved to the mounting position coordinates using the nozzle, it does not coincide with the mounting position. Therefore, it cannot be directly mounted on the mounting position coordinates. The second coordinate system is projected onto the first coordinate system (actually projecting the back-illuminated detector 2 onto the mounting position corresponding to the first substrate). The first coordinate system is compared with the second coordinate system. Specifically, the horizontal (or vertical) coordinate of the first coordinate system is compared with the horizontal (or vertical) coordinate of the second coordinate system to obtain the angle between the horizontal (or vertical) coordinates of the first and second coordinate systems. This angle is the corresponding compensation angle.

[0100] Step 702: Rotate the suction nozzle in the opposite direction to adjust the compensation angle, making the back-illuminated detector 2 parallel to the mounting position, and obtain the compensation amounts for the horizontal and vertical axes.

[0101] To obtain the offset of the back-illuminated detector 2 in the horizontal and vertical coordinates, embodiments of the present invention typically require deflecting the back-illuminated detector 2 according to the corresponding compensation angle to make the back-illuminated detector 2 parallel to the mounting position, and then measuring the compensation amounts of the horizontal and vertical axes of the back-illuminated detector 2. In the embodiments of the present invention, the compensation amounts of the horizontal and vertical axes of the back-illuminated detector 2 represent the compensation coordinates of the horizontal and vertical axes of the back-illuminated detector 2, respectively. These compensation coordinates facilitate the alignment of the back-illuminated detector 2 with the mounting position.

[0102] The following describes how, according to an embodiment of the present invention, by acquiring the compensation angle of the back-illuminated detector 2, as well as the compensation amounts on the horizontal and vertical axes, the back-illuminated detector 2 is moved to the mounting position coordinates, and then the back-illuminated detector 2 is mounted at the mounting position. For example... Figure 9 As shown, the back-illuminated detector is compensated using the compensation angle and the compensation amounts of the horizontal and vertical axes of the back-illuminated detector to facilitate the mounting of the detector chip to the mounting position. Specifically, this includes:

[0103] Step 801: Rotate the nozzle in the opposite direction to adjust the back-illuminated detector 2 to be parallel to the mounting position.

[0104] After obtaining the corresponding compensation angle and the corresponding compensation amounts for the horizontal and vertical axes, rotate the nozzle in the opposite direction to adjust the back-illuminated detector 2 to be parallel to the mounting position.

[0105] Step 802: Based on the compensation amounts of the horizontal and vertical axes, move the back-illuminated detector to coincide with the mounting position, press down the nozzle, and mount the detector chip 21 onto the first substrate at the mounting position.

[0106] After moving the back-illuminated detector 2 to be parallel to the mounting position, move the back-illuminated detector 2 along the horizontal axis using the compensation amount corresponding to the horizontal axis, and move the back-illuminated detector 2 along the vertical axis using the compensation amount corresponding to the vertical axis, so that the back-illuminated detector 2 coincides with the mounting position (actually, it is directly above the mounting position, at which point the projection of the back-illuminated detector 2 coincides with the mounting position).

[0107] This invention utilizes the surface pattern of the first substrate 1 to construct a first coordinate system, obtaining the mounting position coordinates of the detector chip 21 on the first substrate 1. Then, it utilizes the backside pattern of the detector chip 21 on the second substrate 22 to construct a second coordinate system. The relationship between the first and second coordinate systems is used to obtain the compensation angle of the back-illuminated detector 2, as well as the compensation amounts for the horizontal and vertical axes of the back-illuminated detector 2. The detector chip 21 is then moved to the mounting position coordinates. Based on the compensation angle and the compensation amounts for the horizontal and vertical axes of the back-illuminated detector 2, the detector chip 21 is aligned with the corresponding mounting position. Finally, the nozzle is pressed down to accurately mount the detector chip 21 onto the mounting position corresponding to the mounting position. This invention utilizes the coordinate system construction method to calculate the angle that needs compensation during the assembly of the detector chip 21, as well as the compensation amounts for the horizontal and vertical axes, thereby enabling the detector chip 21 to be accurately mounted on the corresponding mounting position on the first substrate 1.

[0108] Example 2:

[0109] Compared with the mounting method for optical components in Embodiment 1 of the present invention, Embodiment 2 of the present invention also proposes an optical component, as shown in FIG2. The optical component includes a first substrate 1 and a back-illuminated detector 2. The back-illuminated detector 2 includes a detector chip 21 and a second substrate 22.

[0110] The detector chip 21 is mounted at a first preset position on the second substrate 22 to form a back-illuminated detector 2;

[0111] The first substrate 1 is provided with a mounting position for the back-illuminated detector 2, so as to mount the back-illuminated detector 2 onto the mounting position.

[0112] To implement the solution of this embodiment of the invention, the second substrate 22 is a transparent quartz substrate to facilitate the second CCD camera 4 in recognizing the back pattern of the detector chip 21 and constructing a second coordinate system. In addition, a first CCD camera 3 is disposed above the first substrate 1, and a second CCD camera 4 is disposed on the back of the second substrate 22. The first CCD camera 3 is used to recognize the upper surface patterns of the first substrate 1 and the detector chip 21, and the second CCD camera 4 is used to recognize the back pattern of the detector chip 21. Furthermore, as... Figure 10 As shown, in an optional embodiment of the present invention, the second substrate 22 is provided with an extension portion along its length direction. By increasing the length of the second substrate 22, sufficient space is reserved, and an angled suction nozzle (not in the...) is provided. Figure 10 (Marked in the middle) to be absorbed.

[0113] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A mounting method suitable for optical components, characterized in that, The optical component includes a first substrate and a back-illuminated detector, the back-illuminated detector including a detector chip and a second substrate, and the mounting method specifically includes: The detector chip is mounted on a first preset position on the second substrate to form a back-illuminated detector; wherein the second substrate is a transparent quartz substrate to facilitate the identification of the back pattern of the detector chip. The surface pattern of the first substrate is identified, a first coordinate system is constructed, and the mounting position coordinates of the detector chip on the first substrate are obtained according to the mounting position of the detector chip on the first substrate. The process of absorbing a back-illuminated detector, identifying the back pattern of the second substrate-side detector chip, and constructing a second coordinate system includes: using a second CCD camera to identify the back pattern of the second substrate-side detector chip, obtaining the center pattern of the back of the detector chip, and selecting a seventh pattern and an eighth pattern that are symmetrical about the center pattern; connecting the centers of the seventh pattern and the eighth pattern with a straight line, using the perpendicular bisector of the straight line as the y-axis, using the center pattern of the back of the detector chip as the origin of the coordinate system, and using a straight line perpendicular to the y-axis and passing through the origin of the coordinate system as the y-axis, thus constructing a second coordinate system. Using the first coordinate system and the second coordinate system, the compensation angle of the back-illuminated detector and the compensation amounts of the horizontal and vertical axes of the back-illuminated detector are obtained. The back-illuminated detector is compensated using the compensation angle, the compensation amount of the horizontal axis and the vertical axis of the back-illuminated detector, so as to facilitate the mounting of the detector chip to the mounting position. Before the back-illuminated detector is picked up, the process further includes determining the center point position of the detector chip by the nozzle based on the surface pattern of the detector, specifically including: The upper surface pattern of the detector chip is acquired using a first CCD camera, and the third, fourth, fifth, and sixth patterns that are symmetrical about the chip center within the upper surface pattern are selected. The third, fourth, fifth, and sixth patterns are connected sequentially to form a rectangular pattern, and the diagonal of the rectangular pattern is drawn to obtain the center point position of the detector chip.

2. The mounting method for optical components according to claim 1, characterized in that, The step of identifying the surface pattern of the first substrate and constructing the first coordinate system specifically includes: The first CCD camera is used to identify the surface pattern of the first substrate, and the first pattern and the second pattern on the first substrate are obtained. Connect the centers of the first and second patterns with a straight line, use the straight line as the X-axis, the midpoint of the straight line as the origin of the first coordinate system, and a straight line perpendicular to and passing through the origin as the Y-axis to construct the first coordinate system.

3. The mounting method for optical components according to claim 1, characterized in that, The step of obtaining the mounting position coordinates of the detector chip on the first substrate based on the mounting position of the detector chip on the first substrate specifically includes: The mounting position of the detector chip is obtained based on the mounting relationship between the detector chip and the first substrate. The mounting position is projected onto the first coordinate system to obtain the mounting position coordinates corresponding to the mounting position.

4. The mounting method for optical components according to claim 1, characterized in that, The process of obtaining the compensation angle, horizontal axis, and vertical axis compensation values ​​of the back-illuminated detector using the first and second coordinate systems specifically includes: The back-illuminated detector is moved to the mounting position coordinates using a suction nozzle, and the second coordinate system is projected onto the first coordinate system to obtain the compensation angle of the back-illuminated detector. By rotating the suction nozzle in the opposite direction at the compensation angle, the back-illuminated detector is aligned with the mounting position to obtain the compensation amounts for the horizontal and vertical axes.

5. The mounting method for optical components according to claim 1, characterized in that, The back-illuminated detector is compensated using the compensation angle and the compensation amounts of the horizontal and vertical axes of the back-illuminated detector to facilitate the mounting of the detector chip at the mounting position. Specifically, this includes: Rotate the nozzle in the opposite direction to adjust the back-illuminated detector to be parallel to the mounting position; Based on the compensation amounts of the horizontal and vertical axes, the back-illuminated detector is moved to coincide with the mounting position, the nozzle is pressed down, and the detector chip is mounted onto the first substrate at the mounting position.

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