Display module and display device

By bending the pins of the first circuit board, the overlapping of the bonding areas is achieved, which solves the problem of increased non-display area caused by bonding multiple flexible circuit boards and improves the display effect.

CN116363959BActive Publication Date: 2025-10-28KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202310296586.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-03-24
Publication Date
2025-10-28
Estimated Expiration
2043-03-24

AI Technical Summary

Technical Problem

Bonding multiple flexible circuit boards to the same side of the display body increases the size of the non-display area, affecting the display effect.

Method used

By using a pin bending configuration on the first circuit board, the bonding area and the second bonding area partially overlap along the first direction, reducing the extension length of the bonding area in the second direction. The area of ​​the non-display area is reduced by the overlapping bonding area of ​​the first and second circuit boards.

Benefits of technology

It improves the display effect of the display module, reduces the distribution area of ​​non-display areas, and enhances the display effect of the display screen.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116363959B_ABST
    Figure CN116363959B_ABST
Patent Text Reader

Abstract

This application provides a display module and a display device. The display module includes: a display screen body, including a display area and a bonding area located on one side of the display area in a first direction; a first circuit board, including a first body and a first pin, wherein the first body is provided with the first bonding area, the first pin is connected to at least one side of the first bonding area in a second direction, the first pin is provided with a second bonding area, and the second bonding area is bonded to the bonding area; the first pin is bent so that the first bonding area and the second bonding area at least partially overlap along the first direction; and a second circuit board bonded between the bonding area and the first bonding area. The at least partial overlap of the first bonding area and the second bonding area along the first direction can reduce the extension length of the bonding area in the second direction, thereby reducing the distribution area of ​​the non-display area on the display screen body and improving the display effect of the display module.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of display equipment technology, and in particular to a display module and display device. Background Technology

[0002] The display module includes a display body and a flexible circuit board. The flexible circuit board needs to be bonded to the display body. In order to achieve different functions, such as driving the display and touch screen control functions, multiple flexible circuit boards are usually set. Bonding multiple flexible circuit boards to the same side of the display body may increase the size of the non-display area on the display body and affect the display effect of the display body. Summary of the Invention

[0003] This application provides a display module and display device, which aim to improve the display effect of the display module.

[0004] An embodiment of the first aspect of this application provides a display module, including: a display screen body, including a display area and a bonding area located on one side of the display area in a first direction; a first circuit board, including a first body and a first pin, wherein the first body is provided with a first bonding area, the first pin is connected to at least one side of the first bonding area in a second direction, the first pin is provided with a second bonding area, the second bonding area is bonded to the bonding area, the first pin is bent so that the first bonding area and the second bonding area at least partially overlap along the first direction, and the first direction and the second direction intersect; and a second circuit board, bonded between the bonding area and the first bonding area.

[0005] According to an embodiment of the first aspect of this application, the display screen body includes an array substrate, a light-emitting layer, and a functional layer sequentially stacked along the thickness direction of the display module.

[0006] A first bonding portion located in the bonding area is provided on the array substrate, and the second circuit board is bonded to the first bonding portion;

[0007] The functional layer is provided with a second bonding part located in the bonding area, and the first pin is bonded to the second bonding part through the second bonding area.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the second circuit board includes:

[0009] The first connecting part is connected to the first bonding part and is located on the side of the array substrate facing the light-emitting layer, and the first connecting part is located on the side of the first body facing the array substrate.

[0010] The second connecting part is connected to the side of the first connecting part away from the display screen body. The second connecting part is located on the side of the first body facing the light-emitting surface of the display module and is connected to the first bonding area.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the second circuit board further includes a second body, which is connected between the first connecting portion and the second connecting portion;

[0012] Two first pins are respectively located on both sides of the second body in the second direction, and the maximum distance between the two first pins is greater than or equal to the width of the second connecting part in the second direction.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the extension length of the first connecting portion and / or the second connecting portion in the second direction is less than or equal to the extension length of the second body in the second direction.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the extension length of the first binding part in the second direction is greater than or equal to the extension length of the second binding part in the second direction, and the orthographic projection of the second binding part in the first direction is located within the orthographic projection of the first binding part in the first direction.

[0015] Alternatively, the extension length of the second binding part in the second direction is greater than or equal to the extension length of the first binding part in the second direction, and the orthographic projection of the first binding part in the first direction is located within the orthographic projection of the second binding part in the first direction.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the first pin has a connection terminal for connecting to the first body.

[0017] A first pin connection is located on one side of the second circuit board in the second direction;

[0018] Alternatively, the connection terminals of the two first pins may be located on opposite sides of the second circuit board in the second direction.

[0019] According to any of the foregoing embodiments of the first aspect of this application, a touch driver, a first circuit, and a second circuit are provided on a first circuit board, and a display driver is connected to a second circuit board. The display driver is interconnected with the first circuit through a first bonding area, and the touch driver is interconnected with the second circuit.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the touch driver is interconnected with the touch circuit of the display body through a first pin and a second bonding area.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the first pin includes:

[0022] An extension segment is connected to at least one side of the first binding area in the second direction and extends along the first direction.

[0023] The bent section is connected to the side of the extension section away from the first body. In the direction from the first circuit board to the display screen body, the bent section is bent in the direction close to the first bonding area.

[0024] The second aspect of this application also provides a display device, including the display module of any of the first aspects described above.

[0025] In the display module provided in this application embodiment, the display module includes a display screen body and a first circuit board and a second circuit board bonded to the display screen body. The first circuit board includes a first body and a first pin. A first bonding area is provided on the first body, so that the second circuit board can be bonded between the bonding area and the first bonding area. The first pin is located on one side of the first bonding area of ​​the first body, and the first pin is bent so that the first bonding area and the second bonding area at least partially overlap along a first direction. This causes the area in the bonding area used to bond the second circuit board to at least partially overlap with the area used to bond the first pin in the first direction, thereby reducing the extension length of the bonding area in the second direction, and thus reducing the distribution area of ​​the non-display area on the display screen body, improving the display effect of the display module. Attached Figure Description

[0026] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0027] Figure 1 This is a partial structural schematic diagram of a display module provided in an embodiment of this application;

[0028] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of this application from another perspective;

[0029] Figure 3 This is a schematic diagram of the structure of a display module provided in another embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100, Display panel; AA, Display area; BA, Bonding area; NA, Non-display area; 110, Array substrate; 111, First bonding portion; 120, Light-emitting layer; 130, Functional layer; 131, Second bonding portion;

[0032] 200, First circuit board; 210, First body; 211, First bonding area; 220, First pin; 221, Second bonding area; 222, Extension section; 223, Bending section; 230, Touch driver;

[0033] 300, Second circuit board; 310, First connecting part; 320, Second connecting part; 330, Second body; 340, Display driver;

[0034] X, the first direction; Y, the second direction. Detailed Implementation

[0035] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0036] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0037] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] To better understand this application, the following will be combined with... Figures 1 to 3 The display module and display device according to the embodiments of this application will be described in detail.

[0039] Figure 1 This is a partial structural diagram of a display module provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of this application from another perspective. Figure 2 for Figure 1 A structural diagram from the left-hand perspective.

[0040] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of this application provides a display module, which includes a display screen body 100, a first circuit board 200, and a second circuit board 300. The display screen body 100 includes a display area AA and a bonding area BA located on one side of the display area AA in a first direction X. The first circuit board 200 includes a first body 210 and a first pin 220. A first bonding area 211 is disposed on the first body 210. The first pin 220 is connected to at least one side of the first bonding area 211 in a second direction Y. A second bonding area 221 is disposed on the first pin 220 and bonded to the bonding area BA through the second bonding area 221. The first pin 220 is bent so that the first bonding area 211 and the second bonding area 221 at least partially overlap along the first direction X. The second circuit board 300 is bonded between the bonding area BA and the first bonding area 211. The first direction Z and the second direction Y intersect.

[0041] Figure 1 The positions of the first binding area 211 and the second binding area 221 are indicated by dashed boxes. The dashed lines do not constitute a limitation on the display module structure provided in the embodiments of this application.

[0042] Optional, such as Figure 1 As shown, the display body 100 also includes a non-display area NA, and the bonding area BA is located within the non-display area NA.

[0043] In the display module provided in this application embodiment, the display module includes a display screen body 100 and a first circuit board 200 and a second circuit board 300 bonded to the display screen body 100. The first circuit board 200 includes a first body 210 and a first pin 220. A first bonding area 211 is provided on the first body 210, so that the second circuit board 300 can be bonded between the bonding area 211 and the first bonding area 211. The first pin 220 is located on one side of the first bonding area 211 of the first body 210, and the first pin 220 is bent so that the first bonding area 211 and the second bonding area 221 at least partially overlap along the first direction X. As a result, the area in the bonding area 210 for bonding the second circuit board 300 and the area for bonding the first pin 220 at least partially overlap in the first direction X, which can reduce the extension length of the bonding area 211 in the second direction X, thereby reducing the distribution area of ​​the non-display area NA on the display screen body 100 and improving the display effect of the display module.

[0044] The bending configuration of the first pin 220 to at least partially overlap the first bonding area 211 and the second bonding area 221 along the first direction X means that: the first pin 220 extends along the bending path, and the end of the first pin 220 away from the first body 210 bends toward the second bonding area 221, that is, the end of the first pin 220 connected to the bonding area BA is located on one side of at least part of the second bonding area 221 in the first direction X, such that the projection of the first bonding area 211 in the first direction X and the projection of the second bonding area 221 in the first direction X at least partially overlap, and the sum of the extension dimension of the first bonding area 211 in the first direction X and the extension dimension of the second bonding area 221 in the first direction X is greater than the extension dimension of the bonding area BA in the first direction X.

[0045] Optionally, the bonding area BA is provided with multiple bonding pins, and the second bonding area 221 of the first pin 220 and the second circuit board 300 are both provided with multiple bonding pins. The first pin 220 and the second circuit board 300 are both bonded to the bonding area BA through bonding pins. Optionally, the first bonding area 211 is provided with multiple bonding pins, and the second circuit board 300 is bonded to the first bonding area 211 through bonding pins.

[0046] Optional, such as Figure 2 As shown, the bonding area BA is provided with a first bonding part 111 and a second bonding part 131. The first bonding part 111 is bonded to the second circuit board 300, and the second bonding part 131 is bonded to the second bonding area 221 of the first pin 220. Optionally, both the first bonding part 111 and the second bonding part 131 include a plurality of bonding pins arranged side by side along the second direction Y. The first bonding part 111 is bonded to the second circuit board 300 by the plurality of bonding pins, and the second bonding part 131 is bonded to the first pin 220 by the plurality of bonding pins.

[0047] Optionally, the second circuit board 300 extends along the first direction X and is connected between the first bonding portion 111 and the first bonding area 211 of the first body 210. Optionally, at least a portion of the first pin 220 is located on one side of at least a portion of the second circuit board 300 in the second direction Y. In the direction from the first body 210 to the display screen body 100, the first pin 220 is bent from one side of the second circuit board 300 to at least partially overlap with the second circuit board 300 along the thickness direction of the display module, such that the second bonding area 221 and the first bonding area 211 at least partially overlap along the first direction X, and the second bonding portion 131 and the first bonding portion 111 at least partially overlap along the first direction X.

[0048] Optionally, the first circuit board 200 is connected to the touch circuit of the display screen via the first pin 220 for transmitting touch signals. The second circuit board 200 is connected to the light-emitting driving circuit of the display screen for transmitting light-emitting driving signals.

[0049] There are multiple ways to configure the display screen 100; please refer to the following documentation. Figure 1 and Figure 2 The display screen body 100 includes an array substrate 110, a light-emitting layer 120, and a functional layer 130 stacked sequentially along its thickness direction. Optionally, the display screen body 100 also includes a substrate located on the side of the array substrate 110 opposite to the light-emitting layer 120. Optionally, the array substrate 110 includes a light-emitting driving circuit, and the light-emitting layer 120 includes light-emitting units, the light-emitting driving circuit being used to drive the light-emitting units to emit light. Optionally, the functional layer 130 includes a cover plate and a touch circuit layer, the touch circuit layer including touch circuitry and used to implement the touch function of the display module.

[0050] In some optional embodiments, the first bonding portion 111 is disposed on the array substrate 110 and located in the bonding area BA, and the second bonding portion 131 is disposed on the functional layer 130 and located in the bonding area BA. In these optional embodiments, the first bonding portion 111 and the second bonding portion 131 are staggered, which can further reduce the overall distribution area of ​​the bonding area BA, increase the distribution ratio of the display area AA of the display screen body 100, and thus improve the display effect of the display module.

[0051] Optionally, the first bonding part 111 is connected to the light-emitting driving circuit, and the second circuit board 300 is used to connect to the display driver 340, so that the display driver 340 can transmit control signals to the light-emitting driving circuit through the second circuit board 300 and the first bonding part 111. Optionally, the first circuit board 200 is used to connect to the touch driver 230, and the second bonding part 131 is connected to the touch circuit, so that the touch driver 230 can transmit control signals to the touch circuit through the first circuit board 200 and the second bonding part 131.

[0052] Optionally, the second circuit board 300 is provided with binding pins on both sides opposite to each other along its thickness direction, so that the second circuit board 300 is connected between the first binding part 111 and the first binding area 211 by the binding pins located on both sides opposite to each other in its thickness direction.

[0053] In some alternative embodiments, the second circuit board 300 includes a first connecting portion 310 and a second connecting portion 320. The first connecting portion 310 is interconnected with the first bonding portion 111 and is located on the side of the array substrate 110 facing the light-emitting layer 120, and the first connecting portion 310 is located on the side of the first body 210 facing the array substrate 110. The second connecting portion 320 is connected to the side of the first connecting portion 310 away from the display screen body 100, and the second connecting portion 320 is located on the side of the first body 210 facing the light-emitting surface of the display module and is interconnected with the first bonding area 211.

[0054] In these optional embodiments, the first connection portion 310 of the second circuit board 300 is located on the side of the array substrate 110 facing the light-emitting layer 120, that is, the first connection portion 310 is located on the side of the array substrate 110 facing the light-emitting surface of the display module. The second connection portion 320 of the second circuit board 300 is also located on the side of the first body 210 facing the light-emitting surface of the display module. Therefore, the first bonding portion 111 and the first bonding area 211 can be connected using a second circuit board 300 with bonding pins on only one side. That is, bonding pins can be provided on one surface of the second circuit board 300, which simplifies the structure of the second circuit board 300.

[0055] In some optional embodiments, the second circuit board 300 further includes a second body 330 connected between the first connecting portion 310 and the second connecting portion 320; two first pins 220 are respectively disposed on both sides of the second body 330 in the second direction Y, and the maximum distance between the two first pins 220 is greater than or equal to the width of the second connecting portion 320 in the second direction Y.

[0056] In these optional embodiments, the distance between the two first pins 220 located on both sides of the second body 330 is relatively large. During the assembly process of the display module, it is convenient to bend the second connecting part 320 from the lower side of the first circuit board 200 (i.e. the side away from the light-emitting surface of the display module) between the two first pins 220 to the upper side of the first circuit board 200 (i.e. the side facing the light-emitting surface of the display module), which can simplify the assembly process of the display module and improve the assembly efficiency of the display module.

[0057] In some alternative embodiments, the extension length of the first connecting portion 310 and / or the second connecting portion 320 in the second direction Y is less than or equal to the extension length of the second body 330 in the second direction Y.

[0058] In these alternative embodiments, the second body 330 has a larger extension length in the second direction Y, while the first connecting portion 310 and / or the second connecting portion 320 have a smaller extension length in the second direction Y. This allows the extension length of the first bonding portion 111 connected to the first connecting portion 310 in the second direction Y to be designed to be smaller, reducing the distribution area of ​​the non-display area NA on the display screen body 100 and improving the display effect. Alternatively, the extension length of the first bonding area 211 connected to the second connecting portion 320 in the second direction Y can be designed to be smaller, reducing the size of the second circuit board 300 and improving the structure of the display module. In addition, the larger size of the second body 330 makes it less likely for the first connecting portion 310 and / or the second connecting portion 320 to be bumped during transportation.

[0059] This application also provides an assembly method for a display module, wherein the display module is any of the display modules described in the first aspect of the above-described embodiment, and the assembly method includes:

[0060] Step 1: Provide the above-mentioned display screen body 100, which includes a display area AA and a binding area BA located on at least one side of the display area AA.

[0061] Step two, the first circuit board 200 is bonded to the bonding area BA. As described above, the first circuit board 200 includes a first body 210 and a first pin 220. The first pin 220 is connected to at least one side of the first bonding area 211 in the second direction Y. A second bonding area 221 is provided on the first pin 220 and it is bonded to the bonding area BA through the second bonding area 221. The first pin 220 is bent so that the first bonding area 211 and the second bonding area 221 at least partially overlap in the first direction X.

[0062] Step 3: The first connecting portion 310 of the second circuit board 300 is bonded to the bonding area BA from the side of the first circuit board 200 away from the light-emitting surface of the display module. For example, the first connecting portion 310 is bonded to the first bonding portion 111. At this time, at least a portion of the first connecting portion 310 and at least a portion of the first pin 220 are overlapped along the thickness direction.

[0063] Step four, at least a portion of the second circuit board 300 is bent from the first pin 220 on one side of the second direction Y to the side of the first circuit board 200 facing the light-emitting surface of the display module, and the second connection portion 320 of the second circuit board 300 is bound to the first binding area 211.

[0064] Alternatively, in some alternative embodiments, in step two, the second circuit board 300 can be first bonded between the bonding area BA and the first bonding area 211 of the first circuit board 200. For example, the first connecting portion 310 of the second circuit board 300 can be bonded to the first bonding portion 111 of the array substrate 110, and the second connecting portion 320 of the second circuit board 300 can be bonded to the side of the first body 210 facing the light-emitting surface of the display module. Then, in step three, the first pin 220 is bent and bonded to the bonding area BA. For example, the first pin 220 can be bonded to the second bonding portion 131, and the first pin 220 overlaps with at least a portion of the second circuit board 300 in the thickness direction.

[0065] In any of the above embodiments, the relative positions of the first binding part 111 and the second binding part 131 can be arranged in various ways. For example, the projections of the first binding part 111 and the second binding part 131 along the first direction X can completely overlap, that is, the lengths of the first binding part 111 and the second binding part 131 in the second direction Y are equal, and the first binding part 111 and the second binding part 131 are aligned along the first direction X. This can further reduce the size of the binding area BA in the second direction Y, making it easier to arrange the first binding part 111 and the second binding part 131 containing more pins within the same length. It can also increase the screen ratio of the display area AA and improve the display effect of the display module.

[0066] In some alternative embodiments, for example, the extension length of the first binding portion 111 in the second direction Y is greater than the extension length of the second binding portion 131 in the second direction Y, and the orthographic projection of the second binding portion 131 in the first direction X is located within the orthographic projection of the first binding portion 111 in the first direction X. In these alternative embodiments, the length of the first binding portion 111 is greater than the length of the second binding portion 131, so the projection of the second binding portion 131 is located within the first binding portion 111, the second binding portion 131 does not occupy additional length, and the length of the first binding portion 111 is the length of the entire binding area BA, which can reduce the length of the binding area BA.

[0067] In some other embodiments, the extension length of the second binding portion 131 in the second direction Y is greater than the extension length of the first binding portion 111 in the second direction Y, and the orthographic projection of the first binding portion 111 in the first direction X is located within the orthographic projection of the second binding portion 131 in the first direction X. In these optional embodiments, the length of the second binding portion 131 is greater than the length of the first binding portion 111, so the projection of the first binding portion 111 is located within the second binding portion 131, the first binding portion 111 does not occupy additional length, and the length of the second binding portion 131 is the length of the entire binding area BA, which can reduce the length of the binding area BA.

[0068] There are several ways to set the number of pins 220, such as Figure 3 As shown, the first pin 220 has a connection terminal for connecting to the first body 210. There can be only one first pin 220. The connection terminal of one first pin 220 is located on one side of the second circuit board 300 in the second direction Y. For example, one first pin 220 is located on one side of the second body 330 in the second direction Y. Or, as... Figure 1 As shown above, there are two first pins 220. The connection ends of the two first pins 220 are distributed on both sides of the second circuit board 300 in the second direction Y. For example, the two first pins 220 are respectively located on both sides of the second body 330 in the second direction Y.

[0069] Optionally, as described above, the second circuit board 300 is connected to a display driver 340, and the first circuit board 200 is connected to a touch driver 230. The touch driver 230 can be disposed on the first circuit board 200, which may further include a first circuit and a second circuit. The display driver 340 is interconnected with the first circuit through a first bonding area 211, thereby enabling the display driver 340 to be interconnected with an external controller through the first circuit. The touch driver 230 is interconnected with the second circuit, thereby enabling the touch driver 230 to be interconnected with an external controller through the second circuit.

[0070] In this embodiment, both the display driver 340 and the touch driver 230 are electrically connected to the outside via circuits on the second circuit board 300. The second circuit board 300 does not need to be bonded to the outside again, which simplifies the structure of the display module and improves the manufacturing efficiency of the display module.

[0071] Optionally, a touch circuit is provided in the functional layer 130. The touch driver 230 is interconnected with the touch circuit of the display body 100 through the first pin 220 and the second bonding area 221, so that the touch driver 230 can transmit control signals to the touch circuit.

[0072] There are multiple ways to set the shape of the first pin 220, as long as the first pin 220 is bent so that the first binding area 211 and the second binding area 221 at least partially overlap along the first direction X.

[0073] In some alternative embodiments, the first pin 220 includes an extension 222 and a bend 223. The extension 222 is connected to at least one side of the first bonding area 211 in the second direction Y and extends along the first direction X; the bend 223 is connected to the side of the extension 222 away from the first body 210, and in the direction from the first circuit board 200 to the display body 100, the bend 223 is bent in a direction close to the first bonding area 211.

[0074] In these alternative embodiments, the first pin 220 includes an extension 222 and a bend 223. The extension 222 connects to the first body 210 and is located on at least one side of the first bonding region 211 in the second direction Y. For example, the extension 222 may be located on at least one side of the second connection portion 320 and the second body 330 in the second direction Y. The extension 222 extending along the first direction X simplifies the structure of the first pin 220. The bend 223 bends along a direction close to the first bonding region 211, such that the first bonding region 211 and the second bonding region 221 can at least partially overlap along the first direction X.

[0075] Optionally, when there are two first pins 220, the extensions 222 of the two first pins 220 are respectively disposed on both sides of the first bonding area 211 in the second direction Y. In the direction from the first circuit board 200 to the display body 100, that is, in the direction close to the display body 100, the bent sections 223 of the two first pins 220 are bent in a direction close to each other.

[0076] The second aspect of this application also provides a display device, including the display panel of any of the first aspect embodiments described above. Since the display device provided in the second aspect of this application includes the display panel of any of the first aspect embodiments described above, it has the beneficial effects of the display panel of any of the first aspect embodiments described above, which will not be elaborated further here.

[0077] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0078] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display module, characterized in that, include: The display screen body includes a display area and a binding area located on one side of the display area in a first direction; A first circuit board includes a first body and a first pin. The first body is provided with a first bonding area. The first pin is connected to at least one side of the first bonding area in a second direction. The first pin is provided with a second bonding area. The second bonding area is bonded to the bonding area. The first pin is bent so that the first bonding area and the second bonding area at least partially overlap along the first direction. The first direction and the second direction intersect. The second circuit board is bonded between the bonding area and the first bonding area.

2. The display module according to claim 1, characterized in that, The display screen body includes an array substrate, a light-emitting layer, and a functional layer, which are sequentially stacked along the thickness direction of the display module. The array substrate is provided with a first bonding part located in the bonding area, and the second circuit board is bonded to the first bonding part; The functional layer is provided with a second binding part located in the binding area, and the first pin is bound to the second binding part through the second binding area.

3. The display module according to claim 2, characterized in that, The second circuit board includes: The first connecting part is interconnected with the first binding part and is located on the side of the array substrate facing the light-emitting layer. The first connecting part is located on the side of the first body facing the array substrate. The second connecting part is connected to the side of the first connecting part away from the display screen body. The second connecting part is located on the side of the first body facing the light-emitting surface of the display module and is connected to the first bonding area.

4. The display module according to claim 3, characterized in that, The second circuit board further includes a second body, which is connected between the first connecting portion and the second connecting portion; The two first pins are respectively disposed on both sides of the second body in the second direction, and the maximum distance between the two first pins is greater than or equal to the width of the second connection portion in the second direction.

5. The display module according to claim 4, characterized in that, The extension length of the first connecting portion and / or the second connecting portion in the second direction is less than or equal to the extension length of the second body in the second direction.

6. The display module according to claim 2, characterized in that, The extension length of the first binding part in the second direction is greater than or equal to the extension length of the second binding part in the second direction, and the orthographic projection of the second binding part in the first direction is located within the orthographic projection of the first binding part in the first direction; Alternatively, the extension length of the second binding part in the second direction is greater than or equal to the extension length of the first binding part in the second direction, and the orthographic projection of the first binding part in the first direction is located within the orthographic projection of the second binding part in the first direction.

7. The display module according to claim 1, characterized in that, The first pin has a connection terminal that connects to the first body; The connection terminal of one of the first pins is located on one side of the second circuit board in the second direction; Alternatively, the connection terminals of the two first pins may be located on opposite sides of the second circuit board in the second direction.

8. The display module according to claim 1, characterized in that, The first circuit board is provided with a touch driver, a first circuit and a second circuit. The second circuit board is connected to a display driver. The display driver is interconnected with the first circuit through the first bonding area. The touch driver is interconnected with the second circuit. Preferably, the touch driver is interconnected with the touch circuit of the display body through the first pin and the second bonding area.

9. The display module according to claim 1, characterized in that, The first pin includes: An extension segment is connected to at least one side of the first binding area in the second direction and extends along the first direction. A bent section is connected to the side of the extension section away from the first body. In the direction from the first circuit board to the display screen body, the bent section is bent in a direction close to the first bonding area.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

Citation Information

Patent Citations

  • Display substrate, flexible circuit board and display device

    CN114783291A

  • Binding structure, display module and electronic equipment

    CN115311949A