A fully automatic and efficient semiconductor wafer debonding device with automatic loading

Abstract

The present application discloses a fully automatic and efficient degumming device for semiconductor wafers with automatic loading, comprising a bottom substrate, a storage unit, a transfer unit and a plurality of degumming units, wherein the bottom substrate comprises a plurality of mounting positions, and the plurality of mounting positions are distributed in a circular shape with equal spacing, wherein one mounting position is installed with the storage unit, and the remaining mounting positions are installed with the degumming units; the transfer unit can move a wafer in any degumming unit to the storage unit, or transfer a wafer in the storage unit to any degumming unit. The degumming device of the present application integrates a plurality of degumming units and has a high transfer efficiency, thereby improving the degumming efficiency of the degumming device as a whole.

Description

Technical Field

[0001] The present application relates to the field of semiconductor wafers, and in particular to a fully automatic and efficient semiconductor wafer degumming device with automatic loading. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. After high-purity polycrystalline silicon is dissolved, silicon crystal seeds are added, and then slowly pulled out to form cylindrical single-crystal silicon. After the silicon crystal rod is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. Semiconductor wafers are the basis for making chips. During the manufacturing process, chips need to go through steps such as cleaning, coating, exposure, and degumming. The existing degumming methods are divided into wet degumming and dry degumming. Wet degumming is to soak the wafer with photoresist in an appropriate organic solvent to dissolve or decompose the photoresist and remove the photoresist on the surface of the wafer. Dry degumming is mainly plasma degumming, which usually uses plasma oxidation or decomposition to remove the photoresist. Dry degumming is widely used because it does not require a subsequent drying step and has a good degumming effect. However, in order to ensure the degumming effect, a single wafer needs to be placed in a degumming device for degumming. Each degumming process takes tens or even hundreds of seconds, so each degumming process takes a long time. When degumming a large number of wafers, it takes a long time. In addition, the degumming process also requires steps such as wafer transportation. The transportation time plus the degumming time can easily lead to low overall degumming efficiency. Summary of the invention

[0003] Purpose of the invention: This application aims to overcome the defects of the prior art and provide a fully automatic and efficient semiconductor wafer degumming device with automatic loading.

[0004] Technical solution: A semiconductor wafer degumming device with automatic loading, comprising a bottom substrate, a storage unit, a transfer unit and a plurality of degumming units, wherein the bottom substrate comprises a plurality of mounting positions, and the plurality of mounting positions are distributed in a circular shape with equal intervals, wherein the storage unit is installed in one mounting position, and the degumming units are installed in the remaining mounting positions; the transfer unit can move the wafer in any degumming unit to the storage unit, or transfer the wafer in the storage unit to any degumming unit.

[0005] Furthermore, the degumming unit is a vacuum plasma degumming unit, which includes a chassis with an inlet and outlet and a chassis electric door installed on the chassis and capable of closing the inlet and outlet, and a chassis carrying platform for carrying wafers is installed in the chassis.

[0006] Furthermore, the storage unit includes a storage box, a carrier frame located in the storage box, and a driving unit for driving the carrier frame to move up and down in the storage box, and the carrier frame has a plurality of storage carrier platforms for carrying wafers distributed in a row from top to bottom; the storage box has a first opening and a second opening.

[0007] Furthermore, the first opening is provided with a first electric door capable of closing the first opening, and the second opening is provided with a second electric door capable of closing the second opening; the storage box is in the shape of a rectangular parallelepiped, including a panel facing the transfer unit, a back panel away from the transfer unit, a top plate, a bottom plate and two side plates, the first opening is located at the panel, and the second opening is located at one of the side plates; the driving unit includes a lifting motor installed on the top plate, a screw bearing installed on the bottom plate, a vertical guide rod installed between the top plate and the bottom plate, and a screw connected between the lifting motor and the screw bearing, and the supporting frame includes a threaded channel cooperating with the screw and a vertical limiting channel cooperating with the vertical guide rod.

[0008] Furthermore, the transfer unit includes a rotating unit installed on the bottom substrate, a first lifting unit installed on the rotating unit, a mounting seat installed on the top of the first lifting unit, a telescopic unit installed on the mounting seat, and a material picking unit installed on the telescopic unit.

[0009] Furthermore, it also includes a standby unit, which includes a rotating motor installed on the bottom substrate, a driving gear installed on the rotating motor, a first annular plate installed on the bottom substrate and capable of rotating on the bottom substrate, and a second annular plate connected to the first annular plate through a plurality of second lifting units; the bottom substrate has an annular slide groove, the first annular plate has an annular slide rail that cooperates with the annular slide groove; the second annular plate has a plurality of standby positions, the number of the standby positions is equal to the number of the degumming units; the standby position has a first bearing seat fixed to the second annular plate and a second bearing seat connected to the second annular plate through a connecting frame. A second bearing seat fixedly connected to the annular plate, the horizontal height of the second bearing seat is higher than that of the first bearing seat, the connecting frame includes a first horizontal rod connected to the second bearing seat, a first vertical rod connected to the first horizontal rod, a second horizontal rod connected to the top of the first vertical rod, and a second vertical rod connecting the second horizontal rod and the second annular plate; the standby unit can be in an initial standby state, when the standby unit is in the initial standby state, a plurality of standby positions and a plurality of degumming units correspond one to one, each standby position faces one of the degumming units, and for each standby position, the connecting frame is closer to the storage unit relative to the first bearing seat.

[0010] Furthermore, the first bearing seat and the second bearing seat both include an arc-shaped rod and a plurality of support blocks located at the arc-shaped rod; for any standby position, the axis of the arc-shaped rod of the first bearing seat, the axis of the arc-shaped rod of the second bearing seat and the axis of the second annular plate are located in the same plane.

[0011] Furthermore, the number of the degumming units is 4, and the number of the standby positions of the second annular plate is 4.

[0012] Further, when the standby unit is in the initial standby state, for each standby position, the connecting frame is closer to the storage unit along the direction of the second annular plate relative to the first bearing seat.

[0013] Furthermore, when the standby unit is in the initial standby state, for two of the standby positions, the connecting frame is closer to the storage unit along the clockwise direction of the second annular plate relative to the first bearing seat; for the other two standby positions, the connecting frame is closer to the storage unit along the counterclockwise direction of the second annular plate relative to the first bearing seat.

[0014] Furthermore, the number of the storage unit is one, and the sum of the number of the storage units and the degumming units is equal to the number of the mounting positions of the bottom substrate.

[0015] Furthermore, the degumming unit also includes electrodes, a radio frequency power supply, a vacuum pump and a gas supply unit.

[0016] Furthermore, the electric door of the chassis is provided with an observation window.

[0017] Furthermore, the telescopic unit is multi-stage electric telescopic.

[0018] Furthermore, the second lifting unit and the first lifting unit are both electric telescopic rods.

[0019] Furthermore, the material taking unit comprises a circular ring-shaped plate and a connecting plate connected to the circular ring-shaped plate, and the connecting plate is connected to the telescopic unit.

[0020] The present application also discloses a degumming method, a degumming method based on the above-mentioned fully automatic and efficient degumming device for semiconductor wafers with automatic loading, comprising the following steps:

[0021] 1) The degumming operation of one of the degumming units is completed and the electric door of the chassis is opened;

[0022] 2) The material taking unit extends into the debonding unit and takes out the debonded wafer on the chassis support platform;

[0023] 3) The material taking unit places the wafer from which the debonding has been completed on the second supporting seat;

[0024] 4) The second annular plate rises, and the material taking unit lifts the wafer to be debonded on the first supporting seat to take the material;

[0025] 5) The material taking unit moves the wafer to be debonded into the debonding unit, and in the process of the material taking unit moving the wafer to be debonded into the debonding unit, the rotating motor simultaneously drives the second annular plate to rotate so that the wafer that has been debonded moves toward the storage unit;

[0026] 6) The material taking unit is withdrawn from the debonding unit, the electric door of the debonding unit is closed, and the material taking unit moves to the bottom of the wafer that has been debonded and lifts it to take the material;

[0027] 7) The material taking unit transfers the above-mentioned wafers that have been stripped to the storage unit, takes a wafer to be stripped from the storage unit, and places it on the first supporting seat of the standby position where the above-mentioned wafers that have been stripped are located;

[0028] 8) The standby unit returns to the initial standby state. When the standby unit returns to the initial standby state, the material receiving unit moves to the next degumming unit position where material needs to be taken.

[0029] Beneficial effects: 1) The degumming device of the present application integrates a storage unit, a degumming unit and a transfer unit, so as to realize the integrated operation of feeding, degumming and taking materials, thereby avoiding the tedious operation of feeding and taking materials one by one manually;

[0030] 2) The debonding device of the present application integrates multiple debonding units, so that multiple wafers can be debonded at the same time, thereby achieving higher debonding efficiency;

[0031] 3) The degumming device of the present application is provided with a standby unit, and the standby unit can rotate, thereby further improving the transfer efficiency of the wafer, thereby improving the overall degumming efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the degumming device in the initial standby state;

[0033] Figure 2 Schematic diagram of the material taking unit extending into the glue unit to take materials;

[0034] Figure 3 Schematic diagram of the material taking unit transferring the wafer after debonding to the top of the second supporting seat;

[0035] Figure 4 is a schematic diagram of the second annular plate rising;

[0036] Figure 5 It is a schematic diagram of a material taking unit taking a wafer from a first supporting seat;

[0037] Figure 6 A schematic diagram showing that the material taking unit transfers the wafer at the first supporting seat to the debonding unit, and the second annular plate rotates;

[0038] Figure 7 A schematic diagram of a material taking unit moving a wafer at a first supporting seat into a debonding unit;

[0039] Figure 8 A schematic diagram of a material taking unit holding up a wafer that has been stripped of adhesive;

[0040] Fig. 9 Schematic diagram of the material taking unit transferring the wafer whose adhesive has been removed to the storage unit. DETAILED DESCRIPTION

[0041] Figure numerals: 1 bottom substrate; 1.1 driving gear; 2 degumming unit; 2.1 chassis electric door; 2.2 observation window; 2.3 vacuum pump; 2.4 chassis support platform; 3 storage unit; 3.1 storage support platform; 3.2.1 first opening; 3.2.2 second opening; 4.1 first annular plate; 4.2 second lifting unit; 4.3 second annular plate; 4.4 first support seat; 4.5 second support seat; 4.6 connecting frame; 4.6.1 first horizontal rod; 4.6.2 first vertical rod; 4.6.3 second horizontal rod; 4.6.4 second vertical rod; 5.1 rotating unit; 5.2 first lifting unit; 5.3 mounting seat; 5.4 telescopic unit; 5.5 material receiving unit; 10 wafer; 10.1 wafer from which degumming has been completed; 10.2 wafer to be degummed.

[0042] As shown in the figure: a fully automatic and efficient degumming device for semiconductor wafers with automatic loading, comprising a bottom substrate 1, a storage unit 3, a transfer unit and a plurality of degumming units 2, wherein the bottom substrate 1 comprises a plurality of mounting positions, and the plurality of mounting positions are distributed in a circular shape with equal spacing, wherein one mounting position is installed with the storage unit 3, and the remaining mounting positions are installed with the degumming units 2; the transfer unit can move the wafer 10 in any degumming unit 2 to the storage unit 3, or transfer the wafer 10 in the storage unit 3 to any degumming unit 2. The degumming unit 2 is a vacuum plasma degumming unit, and the degumming unit 2 comprises a chassis with an inlet and outlet and a chassis electric door installed at the chassis and capable of closing the inlet and outlet, and a chassis support table 2.4 for carrying wafers is installed in the chassis. The storage unit includes a storage box, a carrier frame located in the storage box, and a driving unit for driving the carrier frame to move up and down in the storage box. The carrier frame has a plurality of storage carrier platforms 3.1 for carrying wafers distributed in a row from top to bottom; the storage box has a first opening 3.2.1 and a second opening 3.2.2. The first opening 3.2.1 is provided with a first electric door (not shown in the figure) capable of closing the first opening 3.2.1, and the second opening 3.2.2 is provided with a second electric door (not shown in the figure) capable of closing the second opening 3.2.2; the storage box is in the shape of a rectangular parallelepiped, including a panel facing the transfer unit, a back panel away from the transfer unit, a top plate, a bottom plate and two side plates, the first opening 3.2.1 is located at the panel, and the second opening 3.2.2 is located at one of the side plates; the driving unit includes a lifting motor installed at the top plate, a screw bearing installed at the bottom plate, a vertical guide rod installed between the top plate and the bottom plate, and a screw connected between the lifting motor and the screw bearing, and the supporting frame includes a threaded channel cooperating with the screw and a vertical limiting channel cooperating with the vertical guide rod.

[0043] The transfer unit includes a rotating unit 5.1 installed on the bottom substrate, a first lifting unit 5.2 installed on the rotating unit 5.1, a mounting seat 5.3 installed on the top of the first lifting unit 5.2, a telescopic unit 5.4 installed at the mounting seat 5.3, and a material picking unit 5.5 installed at the telescopic unit 5.4. The degumming device also includes a standby unit, which includes a rotating motor installed on the bottom substrate, a driving gear 1.1 installed on the rotating motor, a first annular plate 4.1 installed on the bottom substrate and capable of rotating on the bottom substrate, and a second annular plate 4.3 connected to the first annular plate 4.1 through a plurality of second lifting units 4.2; the bottom substrate 1 has an annular groove, and the first annular plate 4.1 has an annular slide rail that cooperates with the annular groove; the second annular plate 4.3 has a plurality of standby positions, and the number of the standby positions is equal to the number of the degumming units 2; the standby position has a first bearing seat 4.4 fixed on the second annular plate 4.3, and a second bearing seat 4.6 fixedly connected to the second annular plate 4.3 through a connecting frame 4.6. The carrier 4.5, the horizontal height of the second carrier 4.5 is higher than the horizontal height of the first carrier 4.4, the connecting frame 4.6 includes a first horizontal rod 4.6.1 connected to the second carrier 4.5, a first vertical rod 4.6.2 connected to the first horizontal rod 4.6.1, a second horizontal rod 4.6.3 connected to the top of the first vertical rod 4.6.2, and a second vertical rod 4.6.4 connecting the second horizontal rod 4.6.3 and the second annular plate 4.3; the standby unit can be in an initial standby state, when the standby unit is in the initial standby state, a plurality of standby positions correspond to a plurality of degumming units one by one, each standby position faces one of the degumming units 2, and for each standby position, the connecting frame is closer to the storage unit relative to the first carrier 4.4. The first bearing seat 4.4 and the second bearing seat 4.5 both include an arc rod and a plurality of support blocks located at the arc rod; for any standby position, the axis of the arc rod of the first bearing seat 4.4, the axis of the arc rod of the second bearing seat 4.5 and the axis of the second annular plate are located in the same plane.

[0044] As shown in the figure, the degumming device of the present application distributes multiple degumming units in an arc shape with equal spacing, and has a storage unit, so that the transfer unit can transfer the wafer between the storage unit and the degumming unit, thereby realizing automatic material collection, degumming and recycling of the wafer. And a standby unit is set, and the standby unit can be rotated and lifted, so that the standby unit can place the wafer waiting for degumming, and can also place the wafer that has just been degummed, thereby providing a buffer, making the operation of the transfer unit more flexible. And the standby unit can also help transport the wafer, so that the overall handling efficiency is high. In addition, a storage unit and a transfer unit are used in conjunction with multiple degumming units, and the overall collocation is more reasonable, and the degumming working time of the degumming unit is also utilized to save the time between two adjacent degumming operations, thereby improving the efficiency of degumming as a whole. And the storage unit is shown in the figure, and the wafer that has been degummed by the degumming unit can be sent into the storage unit from the first opening, and the wafer that has been degummed by the storage unit can be transported to the next process from the second opening.

[0045] The specific operation is as follows: A method for removing adhesive from a fully automatic and efficient semiconductor wafer removing device with automatic loading includes the following steps;

[0046] 1) One of the degumming units (i.e. Figure 1 The degumming operation of the degumming unit A) shown in the figure is completed, and the electric door of the chassis is opened;

[0047] 2) The material taking unit extends into the debonding unit and takes out the debonded wafer 10.1 on the chassis support table. Figure 2 As shown;

[0048] 3) The material taking unit places the wafer 10.1 which has been stripped of the adhesive on the second supporting seat. Figure 3 , 4 As shown;

[0049] 4) The second annular plate rises, and the material taking unit lifts the wafer 10.2 to be debonded on the first supporting seat to take the material. Figure 5 As shown;

[0050] 5) The material taking unit moves the wafer 10.2 to be debonded into the debonding unit, and in the process of the material taking unit moving the wafer 10.2 to be debonded into the debonding unit, the rotating motor simultaneously drives the second annular plate to rotate so that the wafer 10.1 that has been debonded moves toward the storage unit, as shown in FIG. Figure 6 , 7As shown; As shown in the figure, since the receiving unit does not need to worry about the wafer falling when there is no material, it can be quickly lifted and rotated, so it can move at a faster speed. However, the first and second bearing seats are relatively stable because the wafer can be accurately limited. Therefore, while the receiving unit is operating, the standby unit can rotate in the direction of the storage unit, so that after the receiving unit is operated, it can quickly "catch up" to the bottom of the wafer that has been debonded (at this time, the standby unit has transported the wafer box storage unit that has been debonded for a distance, so the remaining distance becomes shorter. Compared with the situation where there is no standby unit, or the standby unit cannot rotate, and only relies on the material taking unit to take and put materials over a long distance each time, the wafer transfer efficiency is greatly improved), hold up the wafer and transfer it to the storage unit.

[0051] 6) The material taking unit is withdrawn from the debonding unit, the electric door of the debonding unit is closed, and the material taking unit is moved to the bottom of the wafer 10.1 from which the debonding has been completed and lifted up to take the material. Figure 8 As shown;

[0052] 7) The material taking unit transfers the wafer 10.1 which has been stripped to the storage unit. Fig. 9 As shown; and taking a wafer 10.2 to be debonded from the storage unit, and placing it on the first supporting seat of the standby position where the wafer 10.1 from which the debonding has been completed is located;

[0053] 8) The standby unit returns to the initial standby state. When the standby unit returns to the initial standby state, the material receiving unit moves to the next degumming unit position where material needs to be taken.

[0054] Although the present invention has been illustrated and described with respect to the preferred embodiments, it will be appreciated by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A fully automatic and efficient semiconductor wafer degumming device with automatic loading, characterized in that: It comprises a bottom substrate, a storage unit, a transfer unit and a plurality of degumming units, wherein the bottom substrate comprises a plurality of mounting positions, the plurality of mounting positions are distributed in a circular shape with equal intervals, wherein the storage unit is installed in one mounting position, and the degumming units are installed in the remaining mounting positions; the transfer unit can move the wafer in any degumming unit to the storage unit, or transfer the wafer in the storage unit to any degumming unit; the degumming unit is a vacuum plasma degumming unit, the degumming unit comprises a chassis with an inlet and an outlet, and a chassis electric door installed at the chassis and capable of closing the inlet and outlet, a chassis carrying platform for carrying wafers is installed in the chassis; the storage unit comprises a storage box, a carrying rack located in the storage box, and a driving unit for driving the carrying rack to move up and down in the storage box, and the carrying rack is provided with a plurality of storage carrying platforms for carrying wafers distributed in a row from top to bottom; The storage box has a first opening and a second opening; the first opening has a first electric door capable of closing the first opening, and the second opening has a second electric door capable of closing the second opening; the storage box is in the shape of a rectangular parallelepiped, including a panel facing the transfer unit, a back panel away from the transfer unit, a top panel, a bottom panel and two side panels, the first opening is located at the panel, and the second opening is located at one of the side panels; the driving unit includes a lifting motor installed at the top panel, a screw bearing installed at the bottom panel, a vertical guide rod installed between the top panel and the bottom panel, and a screw connected between the lifting motor and the screw bearing, the supporting frame includes a threaded channel cooperating with the screw rod and a vertical limiting channel cooperating with the vertical guide rod; the transfer unit includes a rotating unit installed on the bottom substrate, a first lifting unit installed on the rotating unit, a mounting seat installed on the top of the first lifting unit, a telescopic unit installed at the mounting seat, and a material taking unit installed at the telescopic unit; the degumming device also includes a standby unit, and the standby unit includes a rotating motor installed on the bottom substrate, a driving unit installed at the rotating motor The invention relates to a movable gear, a first annular plate installed at the bottom substrate and capable of rotating at the bottom substrate, and a second annular plate connected to the first annular plate through a plurality of second lifting units; the bottom substrate is provided with an annular slide groove, and the first annular plate is provided with an annular slide rail matched with the annular slide groove; the second annular plate is provided with a plurality of standby positions, and the number of the standby positions is equal to the number of the degumming units; the standby position has a first bearing seat fixed at the second annular plate and a second bearing seat fixedly connected to the second annular plate through a connecting frame, the horizontal height of the second bearing seat is higher than the horizontal height of the first bearing seat, and the connecting frame includes a first horizontal rod connected to the second bearing seat, a first vertical rod connected to the first horizontal rod, a second horizontal rod connected to the top end of the first vertical rod, and a second vertical rod connecting the second horizontal rod and the second annular plate; the standby unit can be in an initial standby state, and when the standby unit is in the initial standby state, a plurality of standby positions correspond to a plurality of degumming units one by one, each standby position faces one of the degumming units, and for each standby position, the connecting frame is closer to the storage unit relative to the first bearing seat.

2. The fully automatic and efficient semiconductor wafer degumming device with automatic loading according to claim 1 is characterized in that: The first bearing seat and the second bearing seat both include an arc-shaped rod and a plurality of support blocks located at the arc-shaped rod; for any standby position, the axis of the arc-shaped rod of the first bearing seat, the axis of the arc-shaped rod of the second bearing seat and the axis of the second annular plate are located in the same plane.

3. A method for removing adhesive from a semiconductor wafer based on the automatic loading and efficient adhesive removal device of claim 2, characterized in that The method comprises the following steps: 1) The degumming operation of one of the degumming units is completed and the electric door of the chassis is opened; 2) The material taking unit extends into the debonding unit and takes out the debonded wafer on the chassis carrier; 3) The material taking unit places the wafer from which the debonding has been completed on the second supporting seat; 4) The second annular plate rises, and the material taking unit lifts the wafer to be debonded on the first supporting seat to take the material; 5) The material taking unit moves the wafer to be debonded into the debonding unit, and in the process of the material taking unit moving the wafer to be debonded into the debonding unit, the rotating motor simultaneously drives the second annular plate to rotate so that the wafer that has been debonded moves toward the storage unit; 6) The material taking unit is withdrawn from the debonding unit, the electric door of the debonding unit is closed, and the material taking unit moves to the bottom of the wafer that has been debonded and lifts it to take the material; 7) The material taking unit transfers the above-mentioned wafers that have been stripped to the storage unit, takes a wafer to be stripped from the storage unit, and places it on the first supporting seat of the standby position where the above-mentioned wafers that have been stripped are located; 8) The standby unit returns to the initial standby state. When the standby unit returns to the initial standby state, the material receiving unit moves to the next degumming unit position where the material needs to be taken.

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