Heat pump

Abstract

The invention relates to a heat pump comprising a refrigerant circuit (1) for a refrigerant, a refrigerant collector (2) belonging to the refrigerant circuit (1) and being flowed through by the refrigerant, an expansion device (3) belonging to the refrigerant circuit (1) and being flowed through by the refrigerant and being connected downstream of the refrigerant collector (2) as viewed in the flow direction of the refrigerant, an evaporator (4) belonging to the refrigerant circuit (1) and being flowed through by the refrigerant and being connected downstream of the expansion device (3) as viewed in the flow direction of the refrigerant, and a condensate pan (5) assigned to the evaporator (4) for collecting condensate accumulating at the evaporator (4), wherein the refrigerant collector (2) is configured to be thermally conductively connected to the condensate pan (5). According to the invention, the distance between the refrigerant collector (2) and the condensate pan (5) is at most 15 cm in order to transfer heat present outside the refrigerant collector (2) to the condensate pan by thermal conduction.

Description

TECHNICAL FIELD

[0001] The invention relates to a heat pump. BACKGROUND

[0002] A heat pump of the type mentioned in the opening part is known from the patent document EP 3 358 277 A1. In this solution, the refrigerant collector arranged there is configured to be thermally connected by means of a tube to the condensate pan arranged there, as broadly as possible.

[0003] A further heat pump of a similar type is known from the patent document EP 2 500 676 B1. This heat pump comprises a refrigerant circulation circuit for a refrigerant, a refrigerant collector belonging to the refrigeration circulation circuit and being flowed through by the refrigerant, an expansion device belonging to the refrigeration circulation circuit and being flowed through by the refrigerant and connected downstream of the refrigerant collector, viewed in the flow direction of the refrigerant, an evaporator belonging to the refrigeration circulation circuit and being flowed through by the refrigerant and connected downstream of the expansion device, viewed in the flow direction of the refrigerant, and a condensate pan configured to the evaporator for collecting condensate accumulated at the evaporator. In this solution, a heat transfer is arranged in the condensate pan in order to keep said condensate pan from freezing. Said heat transfer is flowed through by the refrigerant, which is then fed to the evaporator itself. SUMMARY

[0004] The task of the invention is to improve a heat pump of the type mentioned in the opening part. In particular, the efficiency of the heat pump shall be increased.

[0005] This task is solved by means of a heat pump of the type mentioned in the opening part by the features indicated in the description.

[0006] That is to say, according to the invention, in order to transfer the heat present outside the refrigerant collector to the condensate pan by means of heat conduction, the spacing between the refrigerant collector and the condensate pan is at most 15 cm.

[0007] In other words, the solution according to the application is thus characterized in that heat that has accumulated at the outer wall of the refrigerant collector is transferred to the condensate pan in particular by thermal conduction. In the prior art described above, the heat transfer is achieved in general in particular alternatively to a foreseeable only very small extent by means of the aforementioned line (EP 3 358 277 Al) or by convection (EP 2 500 676 Bl), that is to say by means of the fact that new, hot refrigerant is continuously conveyed through the line and the aforementioned heat exchanger to the condensate pan, that is to say that heat is additionally transferred to the condensate pan by means of the refrigerant. In the solution according to the application, as has been described, the heat that is present outside the refrigerant collector is transferred to the condensate pan in particular by thermal conduction (and if necessary also by thermal radiation), which accordingly increases the efficiency of the heat pump. The condition: the refrigerant collector is configured to be thermally conductively connected to the condensate pan comprises on the one hand the possibility that it is arranged directly on the condensate pan, that is to say in direct contact with the condensate pan, and on the other hand it is also possible to provide a thermally conductive body arranged between the refrigerant collector and the condensate pan, which conducts heat from the refrigerant collector to the condensate pan.

[0008] Further advantageous further developments of the heat pump according to the application result from the description. BRIEF DESCRIPTION OF DRAWINGS

[0009] The heat pump according to the application and advantageous further developments thereof according to the dependent claims are explained in detail below with the aid of two figures of embodiments.

[0010] In the drawings:

[0011] Figure 1 A first embodiment of the heat pump according to the application is shown schematically, in which the refrigerant collector and the condensate pan are configured to be directly connected to one another; and

[0012] Figure 2 A second embodiment of the heat pump according to the application is shown schematically, in which the refrigerant collector and the condensate pan are configured to be connected to one another by means of a thermally conductive element. DETAILED DESCRIPTION

[0013] Figure 1 and 2The invention shown relates to a heat pump. The heat pump comprises a refrigerant circuit 1 for a refrigerant, a refrigerant collector 2 belonging to the refrigerant circuit 1 and flowed through by the refrigerant, an expansion device 3 belonging to the refrigerant circuit 1 and flowed through by the refrigerant and connected downstream of the refrigerant collector 2 viewed in the flow direction of the refrigerant, an evaporator 4 belonging to the refrigerant circuit 1 and flowed through by the refrigerant and connected downstream of the expansion device 3 viewed in the flow direction of the refrigerant, and a condensate pan 5 assigned to the evaporator 4 for collecting condensate accumulating at the evaporator 4.

[0014] Furthermore, it is provided that the refrigerant collector 2 is configured to be thermally conductively connected with the condensate pan 5. It is particularly preferred that the refrigerant collector 2 is configured to be connected "without convection" with the condensate pan 5. It is also preferred here that the thermally conductive element 6 is configured without contact with the refrigerant. This means, for example, that in particular the refrigerant-guiding lines do not serve as thermally conductive elements 6, but separate thermally conductive elements 6 are provided for the thermal conduction.

[0015] As can be seen, the solution according to the invention can cancel the electric heating device that can be provided on the condensate pan for keeping from freezing, thereby ultimately increasing the efficiency of the heat pump.

[0016] It is now essential for the heat pump according to the invention that the spacing between the refrigerant collector 2 and the condensate pan 5 is at most 15 cm, preferably less than 10 cm, particularly preferably less than 5 cm, or even (only) 0 cm. The last case is shown in Figure 1 , that is to say, in this solution it is provided that the refrigerant collector 2 is configured to be in contact with the condensate pan 5. Alternatively preferred is that a thermally conductive element 6, preferably (because well thermally conductive) metallic, is arranged between the refrigerant collector 2 and the condensate pan 5, see Figure 2 . The condition according to the invention of "at most 15 cm" is here based on the practical consideration that with significantly greater spacing (as in EP 3 358 277 Al mentioned at the beginning, for example) the heat transfer important for the purpose set is no longer achieved.

[0017] Furthermore, the refrigerant collector 2 is preferably arranged below the condensate pan 5 in the prescribed operation of the heat pump. It is also preferred that the condensate pan 5 has a drain groove, and / or the refrigerant collector 2 is configured to be at least thermally conductively connected with the drain groove.

[0018] Furthermore, preferably, the refrigerant collector 2 is configured as a high-pressure collector. Here, the refrigerant circulation loop 1 preferably has a high-pressure side 1.1 with a condenser 8 and a low-pressure side 1.2 with an evaporator 4. Furthermore, preferably, the refrigerant collector 2 is arranged on the high-pressure side 1.1 of the refrigerant circulation loop 1. This causes the refrigerant in the refrigerant collector 2 and thus the refrigerant collector 2 itself to have a relatively high temperature. This allows a large amount of heat energy to be transferred to the condensate pan 5, causing the condensate pan to thaw.

[0019] Furthermore, preferably, the refrigerant circulation loop 1 has a compressor 7 that is connected downstream of the evaporator 4 and through which the refrigerant flows, as viewed along the refrigerant flow direction. Finally, preferably, the refrigerant circulation loop 1 has a condenser 8 that is connected downstream of the compressor 7 and through which the refrigerant flows, as viewed along the refrigerant flow direction.

[0020] According to the present invention, and in accordance with the origin Figure 1 The heat pump in this embodiment operates normally as follows ( Figure 2 Similarly:

[0021] During normal operation of the heat pump, condensate forms at the relatively cold evaporator 4, dripping down from the evaporator and collected in the condensate pan 5. Because the condensate itself is cold, it is possible that the condensate pan 5 freezes and the condensate can no longer be discharged from the condensate pan 5 through the drain outlet as intended. According to the invention, and in accordance with... Figure 1 In this embodiment of the heat pump, the refrigerant collector 2 is now arranged directly below the condensate pan 5. Hot refrigerant is placed in the refrigerant collector 2, which heats the refrigerant collector 2. Because the refrigerant collector 2 is in direct contact with the condensate pan 5 (or according to...), Figure 2 (Connected to the condensate pan via a heat-conducting element 6), so the refrigerant collector transfers a portion of its heat energy to the condensate pan, thereby causing the ice in the condensate pan to melt or not form at all during the operation of the heat pump. In other words, the heat pump according to the invention prevents the condensate pan 5 from freezing in a simple and efficient manner, which in turn improves the efficiency of the heat pump itself.

[0022] List of reference signs

[0023] 1 Refrigeration cycle loop

[0024] 1.1 High-voltage side

[0025] 1.2 Low-pressure side

[0026] 2. Refrigerant Collector

[0027] 3. Expansion device

[0028] 4. Evaporator

[0029] 5 condensate pan

[0030] 6 heat conducting element

[0031] 7 compressor

[0032] 8 condenser

Claims

1. Heat pump comprising a refrigerant circuit (1) for a refrigerant, a refrigerant collector (2) belonging to the refrigerant circuit (1) and being flowed through by the refrigerant, an expansion device (3) belonging to the refrigerant circuit (1) and being flowed through by the refrigerant and being connected downstream of the refrigerant collector (2) as seen in the direction of flow of the refrigerant, an evaporator (4) belonging to the refrigerant circuit (1) and being flowed through by the refrigerant and being connected downstream of the expansion device (3) as seen in the direction of flow of the refrigerant, and a condensate pan (5) assigned to the evaporator (4) for collecting condensate accumulating at the evaporator (4), wherein The refrigerant collector (2) is configured to be thermally connected to the condensate pan (5), characterized in that, in order to transfer heat present outside the refrigerant collector (2) to the condensate pan by thermal conduction, the spacing between the refrigerant collector (2) and the condensate pan (5) is at most 15 cm.

2. Heat pump according to claim 1, characterized in that The spacing between the refrigerant collector (2) and the condensate pan (5) is less than 10 cm.

3. Heat pump according to claim 1 or 2, characterized in that A thermally conductive element (6) is arranged between the refrigerant collector (2) and the condensate pan (5).

4. Heat pump according to claim 3, characterized in that The thermally conductive element (6) is configured without contact with the refrigerant.

5. Heat pump according to claim 1 or 2, characterized in that The refrigerant collector (2) is arranged below the condensate pan (5) in a prescribed operation of the heat pump.

6. The heat pump of claim 1 or 2, wherein, The condensate pan (5) has a drain groove, characterized in that the refrigerant collector (2) is configured to be thermally connected to at least the drain groove.

7. Heat pump according to claim 1 or 2, characterized in that The refrigerant collector (2) is configured as a high-pressure collector.

8. The heat pump of claim 1 or 2, wherein, The refrigerant circulation circuit (1) has a high-pressure side (1.1) and a low-pressure side (1.2), characterized in that the refrigerant collector (2) is arranged on the high-pressure side (1.1) of the refrigerant circulation circuit (1).

9. Heat pump according to claim 1 or 2, characterized in that The refrigerant circulation circuit (1) has a compressor (7) connected downstream of the evaporator (4) in the flow direction of the refrigerant.

10. Heat pump according to claim 9, characterized in that The refrigerant circulation circuit (1) has a condenser (8) connected downstream of the compressor (7) in the flow direction of the refrigerant.

11. The heat pump of claim 2, wherein, The spacing between the refrigerant collector (2) and the condensate pan (5) is less than 5 cm.

12. The heat pump of claim 2, wherein, The spacing between the refrigerant collector (2) and the condensate pan (5) is 0 cm.

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