Transducer with a stack structure

Abstract

The present application relates to a kind of transducer with laminated structure, including m laminated structure, m≥3;Laminated structure is arranged from near end to far end spacing, and the spacing of the i-th laminated structure and the i+1 laminated structure≤The spacing of the i+1 laminated structure and the i+2 laminated structure, i=1,...,m-2, i is more close to far end more big.This transducer of the present application is simple in structure, effectively solve the existing thrombolytic catheter transducer laminated structure collinear metal sheet manufacturing process complex, transducer whole manufacturing difficulty, the problem of higher cost and laminated structure spacing fixed, catheter near and far end thrombolytic effect is not consistent.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of medical devices, and relates to a transducer with a laminated structure. BACKGROUND

[0002] Thrombosis is a common clinical vascular disease. When the thrombus in the blood vessel forms to the extent of blocking the blood vessel, thromboembolism occurs. The impact of blood vessel blockage can be very serious, even life-threatening. Catheter contact thrombolysis is a common clinical thrombolysis treatment method. This method directly delivers thrombolytic drugs to the inside of the thrombus through a multi-side hole catheter, increases the drug concentration inside the thrombus, and removes the thrombus in a short time while retaining the structure and function of the venous valve. It can effectively prevent the recurrence of thrombosis and the occurrence of post-thrombotic syndrome. However, the catheter contact thrombolysis method still has the problems of relatively long infusion time and the risk of massive bleeding. Intravascular ultrasound thrombolysis is an ultrasound thrombolysis system guided by a catheter, which can emit ultrasound in the blood vessel lumen and directly act on the thrombus while inhibiting the excessive exposure of surrounding tissues and organs. The ultrasound thrombolysis catheter needs to simultaneously function as a catheter contact thrombolysis and an ultrasound thrombolysis. The ultrasound signal is generated by an internal electro-acoustic conversion device, namely an ultrasonic transducer.

[0003] The manufacturing method of a laminated structure transducer of EKOS company (CN107708581A) is that the ground electrode is led out through a common metal sheet, and the anode is led out through a lead wire. This transducer can only work at a single frequency. The method of CN107708581A for leading out the middle electrode of the laminated structure is to lead out the common line metal sheet. The common line metal sheet can play the roles of positioning, supporting, and conducting electricity. However, for an intravascular thrombolysis transducer with extremely small size, the processing of the common line metal sheet and the manufacturing of the overall laminated structure are extremely difficult. When the number of laminated structures increases, the manufacturing difficulty of the transducer also increases, and the cost also increases (the unit price of the EKOS related ultrasound thrombolysis catheter is higher than 1,000 US dollars).

[0004] EKOS catheter is the only ultrasound-assisted thrombolysis product for pulmonary embolism treatment on the international market. The spacing of the laminated structure is fixed in the whole catheter. In clinical practice, when the drug is transmitted from the proximal end to the distal end through the catheter, the drug concentration at the distal end will accumulate in the direction of blood flow. Therefore, the drug concentration is higher at the distal end of the pulmonary artery, and the thrombolysis effect is better. The concentration is lower at the proximal end, and the thrombolysis effect is poorer. Especially when the distance of embolism is long, the difference between the two ends will be very obvious. In order to overcome the prolongation of thrombolysis time caused by the difference in thrombolysis effect, it is necessary to design a new structure to balance the difference in thrombolysis effect caused by the inconsistent concentration. SUMMARY

[0005] To achieve the above-mentioned purposes, the technical solutions adopted by the present application are as follows:

[0006] The transducer with the laminated structure comprises m laminated structures, m>=3; the laminated structures are arranged at intervals from the proximal end to the distal end, and the interval between the i-th laminated structure and the i+1-th laminated structure is less than the interval between the i+1-th laminated structure and the i+2-th laminated structure, i=1,...,m-2, and the larger i is, the closer to the distal end.

[0007] One of the purposes of the present application is to solve the problem that the interval of the laminated structure of the existing thrombolytic catheter transducer is fixed, and the thrombolytic effect of the proximal end and the distal end of the catheter is inconsistent. The intravascular thrombolytic ultrasonic transducer provided by the present application can design different intervals according to different clinical needs. In the proximal end, the interval of the laminated structure is smaller, the number of laminated structures in a unit length is more, and the energy generated is intensive, so the disadvantage of low drug concentration can be effectively offset, and the beneficial clinical effect of consistent thrombolytic effect of the proximal end and the distal end is realized.

[0008] As a preferred technical solution:

[0009] The transducer with the laminated structure as described above has a range of 0.2-5mm for the interval between the two adjacent laminated structures.

[0010] The transducer with the laminated structure as described above has all the laminated structures divided into n laminated groups, n>=1, and the laminated structures in the same laminated group are arranged adjacent to each other.

[0011] The transducer with the laminated structure as described above has the number of laminated structures in each laminated group equal, and the range of values is 1~16.

[0012] The transducer with the laminated structure as described above has n>1; all the laminated structures in the j-th laminated group are arranged at equal intervals from the proximal end to the distal end, and the interval is d j ; all the laminated structures in the j+1-th laminated group are arranged at equal intervals from the proximal end to the distal end, and the interval is d j+1 ; d j <=d j+1 , j=1,...,n-1, and the larger j is, the closer to the distal end;

[0013] Alternatively, n>1; all the laminated structures in the j-th laminated group are arranged at unequal intervals from the proximal end to the distal end, and the maximum interval is d jmax ; all the laminated structures in the j+1-th laminated group are arranged at unequal intervals from the proximal end to the distal end, and the minimum interval is d (j+1)min ; d jmax <=d (j+1)min , j=1,...,n-1, and the larger j is, the closer to the distal end.

[0014] The transducer with the laminated structure as described above, each laminated structure is composed of an upper piezoelectric material layer, a bonding layer and a lower piezoelectric material layer arranged in sequence from top to bottom; the upper surface of the upper piezoelectric material layer is provided with a first outer electrode, and the lower surface is provided with a first inner electrode; the upper surface of the lower piezoelectric material layer is provided with a second inner electrode, and the lower surface is provided with a second outer electrode.

[0015] The connection mode of the laminated structure in each laminated group is that the first outer electrodes of any two adjacent laminated structures are each connected by a conductive wire II, the second outer electrodes of any two adjacent laminated structures are each connected by a conductive wire III, and the opposite surfaces of any two adjacent laminated structures are each connected by a conductive wire I; the conductive wire I should have good conductivity, toughness and strength, and can play the roles of bending, supporting and conducting; the conductive wire I is fixed with the laminated structure by conductive adhesive a, the conductive adhesive a is in contact with the first inner electrode and the second inner electrode, the conductive adhesive a is not in contact with the first outer electrode and the second outer electrode, otherwise it will cause short circuit, and the conductive adhesive a should have a certain viscosity to prevent contact with the outer electrode due to gravity;

[0016] In each laminated group, the first outer electrode of the proximal laminated structure is connected to the main board signal output control port by a conductive wire II, the second outer electrode of the proximal laminated structure is connected to the main board signal output control port by a conductive wire III, and the first inner electrode and the second inner electrode of the proximal laminated structure are connected to the ground by a conductive wire I;

[0017] The same laminated group is connected to the same main board signal output control port; different laminated groups are respectively connected to different main board signal output control ports, and they have different signal inputs and can work independently.

[0018] In some or all of the laminated structures as described above, the bonding layer is conductive adhesive b, and the conductive adhesive b is connected with the conductive adhesive a;

[0019] Alternatively, in some or all of the laminated structures, the bonding layer is non-conductive adhesive, the surface of the upper piezoelectric material layer bonded with the conductive adhesive a is provided with a first edge electrode, the first edge electrode is connected with the first inner electrode and the conductive adhesive a at the same time, the surface of the lower piezoelectric material layer bonded with the conductive adhesive a is provided with a second edge electrode, the second edge electrode is connected with the second inner electrode and the conductive adhesive a at the same time, and the first edge electrode and the second edge electrode are not in contact with the first outer electrode and the second outer electrode.

[0020] The diameter of the conductive wire I is in the range of 0.05-2mm, the conductive wire I is a metal wire, a conductive fiber, a conductive gel or the like, and the diameter of the conductive wire I is relatively large, which is to make it have a certain strength and bending ability, and facilitate insertion into the human body blood vessels.

[0021] The transducer with the laminated structure as described above, the conductive wire II is connected with the first outer electrode by means of conductive glue c or welding, the conductive wire III is connected with the second outer electrode by means of conductive glue d or welding, the diameter of the conductive wire II and the conductive wire III ranges from 0.01mm to 1mm.

[0022] The transducer with the laminated structure as described above, in each laminated structure, the thickness of the first outer electrode ranges from 0.02mm to 0.50mm, the thickness of the upper piezoelectric material layer ranges from 0.05mm to 1mm, the thickness of the first inner electrode ranges from 0.001mm to 0.1mm, the thickness of the adhesive layer ranges from 0.01mm to 0.5mm, the thickness of the second inner electrode ranges from 0.001mm to 0.1mm, the thickness of the lower piezoelectric material layer ranges from 0.05mm to 1mm, and the thickness of the second outer electrode ranges from 0.02mm to 0.50mm.

[0023] The transducer with the laminated structure as described above, in each laminated structure, the thickness and material of the first outer electrode and the second outer electrode are the same, the thickness and material of the upper piezoelectric material layer and the lower piezoelectric material layer are the same, and the thickness and material of the first inner electrode and the second inner electrode are the same, the upper piezoelectric material layer and the lower piezoelectric material layer are both rectangular and have the same length and the same width.

[0024] The transducer with the laminated structure as described above, in each laminated structure, the thickness and material of the first outer electrode and the second outer electrode are different, the thickness and material of the upper piezoelectric material layer and the lower piezoelectric material layer are different, and the thickness and material of the first inner electrode and the second inner electrode are different, the upper piezoelectric material layer and the lower piezoelectric material layer are both rectangular and have the same length and the same width.

[0025] The transducer with the laminated structure as described above, the upper piezoelectric material layer and the lower piezoelectric material layer are material layers capable of performing electro-acoustic conversion with surface plated conductive metal, the conductive metal is gold, silver, etc., and the material capable of performing electro-acoustic conversion is piezoelectric ceramic, piezoelectric single crystal, piezoelectric composite material, etc.

[0026] The transducer with the laminated structure as described above, the shape and structure of different laminated structures are the same.

[0027] The transducer with the laminated structure as described above, the normal direction of different laminated structures are the same or all cross 90°.

[0028] The transducer with the laminated structure as described above, the surface of all laminated structures is wrapped with an insulating layer, the insulating layer can be Paralyne material, and the thickness of the insulating layer ranges from 0.002mm to 0.1mm.

[0029] The transducer with the laminated structure as described above, all the laminated structures are wrapped in a protective tube, the protective tube is a kind of elastic, semi-transparent or transparent material with biocompatibility, the part is in contact with the human body when the transducer is used, the protective tube is filled with soft non-conductive material, the soft non-conductive material can be UV glue or epoxy glue, etc., the soft non-conductive material protects the transducer while not affecting the bending of the transducer.

[0030] The second purpose of the present application is to solve the problems of complex manufacturing process, high cost and difficulty in manufacturing the whole transducer of the existing thrombolytic catheter transducer laminated structure, the present application provides an intravascular thrombolytic ultrasonic transducer, the transducer is composed of multiple laminated structures, the laminated structure is formed by bonding the upper and lower piezoelectric material layers, the anode is led out to the main board signal output control port by the conductive wire II and the conductive wire III, the laminated structures are connected in parallel by the conductive wire I, the ground electrode is led out, and the supporting and positioning functions are provided, when multiple independent laminated groups are provided, each independent laminated group has an anode and a ground electrode. The intravascular thrombolytic ultrasonic transducer provided by the present application can lead out the middle electrode of the laminated structure without the common line metal sheet, and ensure the positioning accuracy and supporting capacity, thereby reducing the manufacturing difficulty and cost of the transducer.

[0031] Advantages:

[0032] The present application provides a new multi-group laminated structure and a preparation method thereof, which is more simple, economical and reliable than the prior art, and has higher reliability; at the same time, the new laminated structure can easily control the spacing of the laminated groups, and expand the application range of the product. The present application also provides a laminated structure with the spacing of the laminated groups increasing from the distal end to the proximal end, which effectively solves the problem of inconsistent thrombolytic effect caused by uneven drug concentration in clinical application, and shortens the thrombolytic time, thereby further reducing the clinical risk of patients. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 FIG. 1 is a schematic view of a part of the transducer with the laminated structure;

[0034] Figure 2 FIG. 2 is a schematic view of the laminated structure, Figure 2 (a) in FIG. 2 is an exploded schematic view of the laminated structure, Figure 2 (b) in FIG. 2 is a combined schematic view of the laminated structure;

[0035] Figure 3 FIG. 3 is a schematic view of the electrode leading-out mode of the laminated structure;

[0036] Figure 4 FIG. 4 is a schematic view of the electrode leading-out mode in the laminated structure, Figure 4 (a) in FIG. 4 is a schematic view of the conductive glue a and the conductive wire I not being connected,Figure 4 (b) in the diagram is a schematic diagram of the connection between conductive adhesive a and conductive wire I;

[0037] Figure 5 This is a schematic diagram of the electrode lead-out method within the stacked structure.

[0038] Figure 6 This is a schematic diagram showing the intersection of the normal directions of adjacent stacked structures at 90°. The arrows in the diagram indicate the direction of the normal.

[0039] Figure 7 This is a schematic diagram of the transducer packaging structure;

[0040] Wherein, 1-Layered structure, 1.1-Upper piezoelectric material layer, 1.2-Adhesive layer, 1.3-Lower piezoelectric material layer, 2-First external electrode, 3-First internal electrode, 4-Second internal electrode, 5-Second external electrode, 6-Conductive wire II, 7-Conductive wire III, 8-Conductive adhesive a, 9-Conductive wire I, 10-First edge-wrapping electrode, 11-Second edge-wrapping electrode, 12-Protective tube. Detailed Implementation

[0041] The present invention will be further described below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the invention, and these equivalent forms also fall within the scope defined by the appended claims.

[0042] A transducer with a stacked structure includes m stacked structures, where m ≥ 3; the stacked structures are arranged from near end to far end, and the distance between the i-th stacked structure and the (i+1)-th stacked structure is less than or equal to the distance between the (i+1)-th stacked structure and the (i+2)-th stacked structure, where i = 1, ..., m-2, and the larger i is, the closer to the far end. The distance between two adjacent stacked structures ranges from 0.2 to 5 mm.

[0043] like Figures 1-2 As shown, each stacked structure 1 is composed of an upper piezoelectric material layer 1.1, an adhesive layer 1.2, and a lower piezoelectric material layer 1.3 arranged in order from top to bottom; the upper surface of the upper piezoelectric material layer 1.1 is provided with a first external electrode 2, and the lower surface is provided with a first internal electrode 3; the upper surface of the lower piezoelectric material layer 1.3 is provided with a second internal electrode 4, and the lower surface is provided with a second external electrode 5.

[0044] In each stack structure 1, the thickness of the first outer electrode 2 ranges from 0.02 mm to 0.50 mm, the thickness of the upper piezoelectric material layer 1.1 ranges from 0.05 mm to 1 mm, the thickness of the first inner electrode 3 ranges from 0.001 mm to 0.1 mm, the thickness of the adhesive layer 1.2 ranges from 0.01 mm to 0.5 mm, the thickness of the second inner electrode 4 ranges from 0.001 mm to 0.1 mm, the thickness of the lower piezoelectric material layer 1.3 ranges from 0.05 mm to 1 mm, and the thickness of the second outer electrode 5 ranges from 0.02 mm to 0.50 mm;

[0045] In each stack structure 1, the thickness and material of the first outer electrode 2 are the same as those of the second outer electrode 5, the thickness and material of the upper piezoelectric material layer 1.1 are the same as those of the lower piezoelectric material layer 1.3, and the thickness and material of the first inner electrode 3 are the same as those of the second inner electrode 4. The upper piezoelectric material layer 1.1 and the lower piezoelectric material layer 1.3 are both rectangular and have the same length and the same width. Alternatively, in each stack structure 1, the thickness and material of the first outer electrode 2 are different from those of the second outer electrode 5, the thickness and material of the upper piezoelectric material layer 1.1 are different from those of the lower piezoelectric material layer 1.3, and the thickness and material of the first inner electrode 3 are different from those of the second inner electrode 4. The upper piezoelectric material layer 1.1 and the lower piezoelectric material layer 1.3 are both rectangular and have the same length and the same width. The upper piezoelectric material layer 1.1 and the lower piezoelectric material layer 1.3 are material layers capable of performing electroacoustic conversion, which are coated with a conductive metal on the surface. The conductive metal is gold, silver, or the like. The material capable of performing electroacoustic conversion is piezoelectric ceramic, piezoelectric single crystal, piezoelectric composite material, or the like.

[0046] All the stack structures are divided into n stack groups, n≥1, and the stack structures in the same stack group are arranged adjacently. Preferably, in each stack group, the number of stack structures is equal, and the value range is 1-16. Preferably, n>1, in the jth stack group, all the stack structures are arranged at equal intervals from the proximal end to the distal end, and the interval is d j ; in the j+1th stack group, all the stack structures are arranged at equal intervals from the proximal end to the distal end, and the interval is d j+1 ; d j ≤d j+1 , j=1,...,n-1, and j is closer to the distal end as it is larger. Alternatively, preferably, n>1, in the jth stack group, all the stack structures are arranged at unequal intervals from the proximal end to the distal end, and the maximum interval is d jmax ; in the j+1th stack group, all the stack structures are arranged at unequal intervals from the proximal end to the distal end, and the minimum interval is d (j+1)min ; d jmax ≤d (j+1)min , j=1,...,n-1, and j is closer to the distal end as it is larger.

[0047] As Figure 3As shown, the connection method of the stacked structure 1 in each stacked group is as follows: the first external electrode 2 of any two adjacent stacked structures 1 is connected by a conductive wire II 6 (diameter range of 0.01-1mm), and the second external electrode 5 of any two adjacent stacked structures 1 is connected by a conductive wire III 7 (diameter range of 0.01-1mm); on each stacked structure 1, the conductive wire II 6 is connected to the first external electrode 2 by conductive adhesive c or welding, and the conductive wire III 7 is connected to the second external electrode 5 by conductive adhesive d or welding; the opposite surfaces of any two adjacent stacked structures 1 are connected by a conductive wire I 9 (diameter range of 0.05-2mm, conductive wire I 9 can be metal wire, conductive fiber, conductive gel, etc.), and the conductive wire I 9 is fixed together with the stacked structure 1 by conductive adhesive a 8. The conductive adhesive a 8 is in contact with the first internal electrode 3 and the second internal electrode 4, and the conductive adhesive a 8 is not in contact with the first external electrode 2 and the second external electrode 5.

[0048] Within each stacked assembly, the first external electrode 2 of the near-end stacked structure 1 is connected to the motherboard signal output control port via a conductive line II 6, the second external electrode 5 of the near-end stacked structure 1 is connected to the motherboard signal output control port via a conductive line III 7, and the first internal electrode 3 and the second internal electrode 4 of the near-end stacked structure 1 are grounded via a conductive line I 9.

[0049] Preferably, the inner electrodes of all stacked groups can be collinearly connected to the conductive line I 9 and grounded together, which can effectively reduce the number of inner electrodes, reduce unnecessary volume occupation, and play a continuous supporting role in the conduit.

[0050] The same stack-up group is connected to the same motherboard signal output control port; different stack-up groups are connected to different motherboard signal output control ports respectively;

[0051] like Figure 4 As shown, in the partially or fully laminated structure 1, the adhesive layer 1.2 is conductive adhesive b, and conductive adhesive b is connected to conductive adhesive a 8; or, as shown... Figure 5 As shown, in the partially or fully laminated structure 1, the adhesive layer 1.2 is a non-conductive adhesive. The surface of the upper piezoelectric material layer 1.1 bonded to the conductive adhesive a 8 is provided with a first edge-sealing electrode 10. The first edge-sealing electrode 10 is simultaneously connected to the first inner electrode 3 and the conductive adhesive a 8. The surface of the lower piezoelectric material layer 1.3 bonded to the conductive adhesive a 8 is provided with a second edge-sealing electrode 11. The second edge-sealing electrode 11 is simultaneously connected to the second inner electrode 4 and the conductive adhesive a 8. Neither the first edge-sealing electrode 10 nor the second edge-sealing electrode 11 is in contact with the first outer electrode 2 or the second outer electrode 5.

[0052] Different stacked structures 1 have the same shape and structure; the normal directions of different stacked structures 1 are all the same or intersect at 90° (e.g.,Figure 6 As shown in the figure, all the stacked structures 1 are wrapped in a protective tube 12, the protective tube 12 is a kind of elastic, semi-transparent or transparent material with biocompatibility, the protective tube 12 is filled with soft non-conductive material, and the soft non-conductive material can be UV glue or epoxy glue, etc.

[0053] All the surfaces of the stacked structures 1 are wrapped with an insulating layer, the insulating layer can be Paralyne material, and the thickness of the insulating layer is 0.002-0.1 mm.

[0054] As shown in the figure, all the stacked structures 1 are wrapped in a protective tube 12, the protective tube 12 is a kind of elastic, semi-transparent or transparent material with biocompatibility, the protective tube 12 is filled with soft non-conductive material, and the soft non-conductive material can be UV glue or epoxy glue, etc. Figure 7

[0055] The preparation method of the transducer with the stacked structure is as follows:

[0056] Step 1: making the stacked structure;

[0057] Each stacked structure can be prepared separately, or two larger piezoelectric material pieces can be selected, bonded into a larger piece of stacked structure and then cut, the latter manufacturing method can prepare multiple stacked structures at one time and has higher precision;

[0058] Step 2: connecting the first inner electrodes of adjacent stacked structures in series through the conductive glue a and the conductive wire I, and connecting the second inner electrodes of adjacent stacked structures in series through the conductive glue a and the conductive wire I;

[0059] Step 3: repeating step 2;

[0060] Step 4: connecting the first outer electrodes of adjacent stacked structures in series through the conductive wire II, and connecting the second outer electrodes of adjacent stacked structures in series through the conductive wire III;

[0061] Step 5: according to the appropriate number, repeating the above steps, connecting the conductive wire I to the ground, connecting the conductive wire II and the conductive wire III to the same mainboard signal output control port, and obtaining an independently working stacked group;

[0062] Step 6: repeating the above steps to obtain a proper number of independently working stacked groups, and connecting different stacked groups to different mainboard signal output control ports respectively;

[0063] Step 7: assembling all the stacked groups into the protective tube and filling the sealing material as protection, if necessary, each stacked structure can be protected by Paralyne before being assembled into the protective tube.

[0064] The transducer with the stacked structure of the present application is described as follows:

[0065] ​In the laminated structure of the multi-group laminated structure transducer: the upper and lower piezoelectric material layers are both ceramic sheets (specifically PZT-4 material), with a length, width and thickness of 2 mm, 0.4 mm and 0.5 mm respectively; the bonding layer is conductive silver paste, with a thickness of 0.05-0.2 mm; the thicker metal wire (conductive wire I) is copper enameled wire, with a diameter of 0.3-1 mm; the thinner conductive material (conductive wire II and conductive wire III) is copper enameled wire, with a diameter of 0.1 mm;

[0066] The total thickness of the laminated structure is about 1.1 mm;

[0067] 6 laminated structures form an independently working laminated group;

[0068] The transducer contains 5 independently working laminated groups, numbered 1, 2, 3, 4 and 5 from the proximal end to the distal end; the laminated structure spacing in the same laminated group is the same, from 1 to 5, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm and 1.2 mm respectively; the transducer is placed in an in-vitro simulated thrombus model, which can achieve more uniform thrombolytic effect, with almost the same proximal and distal ends;

[0069] The protective tube material is non-conductive plastic such as PI or PET / PU, with an inner diameter of 1.5 mm;

[0070] The protective tube is filled with UV glue or epoxy glue.

Claims

1. A transducer having a stacked structure, characterized by, The stack structure includes m layers, m≥3; the layers are arranged at intervals from the proximal end to the distal end, and the interval between the ith layer and the (i+1)th layer is less than the interval between the (i+1)th layer and the (i+2)th layer, i=1,...,m-2, i is closer to the distal end; All the layers are divided into n groups, n≥1, and the layers in the same group are arranged adjacently; Each layer is composed of an upper piezoelectric material layer, a bonding layer and a lower piezoelectric material layer arranged in order from top to bottom; the upper surface of the upper piezoelectric material layer is provided with a first outer electrode, and the lower surface is provided with a first inner electrode; the upper surface of the lower piezoelectric material layer is provided with a second inner electrode, and the lower surface is provided with a second outer electrode; The connection mode of the layers in each group is that the first outer electrodes of any two adjacent layers are connected by a conductive wire II respectively, the second outer electrodes of any two adjacent layers are connected by a conductive wire III respectively, and the opposite surfaces of any two adjacent layers are connected by a conductive wire I respectively; the conductive wire I is fixed to the layers by conductive adhesive a, the conductive adhesive a is in contact with the first inner electrode and the second inner electrode, and the conductive adhesive a is not in contact with the first outer electrode and the second outer electrode.

2. The transducer with a stacked structure according to claim 1, characterized in that, The interval between the two adjacent layers is in the range of 0.2-5mm.

3. The transducer with a stacked structure according to claim 1, characterized in that, The number of layers in each group is equal, and the value is in the range of 1-16.

4. The transducer with a stacked structure according to claim 1, characterized in that, n>1; all the stack structures in the jth stack group are arranged at unequal intervals from proximal to distal, and the maximum interval is d jmax ; In the j+1th stack group, all the stack structures are arranged at unequal intervals from the proximal end to the distal end, and the minimum interval is d (j+1)min ; d jmax ≤ d (j+1)min , j = 1,..., n-1, and the larger j is, the closer to the distal end.

5. The transducer with a stacked structure according to claim 1, characterized in that, In each group, the first outer electrode of the proximal layer is connected to the mainboard signal output control port through a conductive wire II, the second outer electrode of the proximal layer is connected to the mainboard signal output control port through a conductive wire III, and the first inner electrode and the second inner electrode of the proximal layer are connected to the ground through a conductive wire I; The same group is connected to the same mainboard signal output control port; different groups are connected to different mainboard signal output control ports.

6. The transducer with a stacked structure according to claim 5, characterized in that, In part or all of the layers, the bonding layer is conductive adhesive b, and the conductive adhesive b is connected to the conductive adhesive a.

7. The transducer with a stacked structure according to claim 5, characterized in that, In part or all of the layers, the bonding layer is non-conductive adhesive, the surface of the upper piezoelectric material layer bonded with the conductive adhesive a is provided with a first edge electrode, the first edge electrode is connected to the first inner electrode and the conductive adhesive a, the surface of the lower piezoelectric material layer bonded with the conductive adhesive a is provided with a second edge electrode, the second edge electrode is connected to the second inner electrode and the conductive adhesive a, and the first edge electrode and the second edge electrode are not in contact with the first outer electrode and the second outer electrode.

8. The transducer with a stacked structure according to claim 5, characterized in that, The diameter of the conductive wire I is in the range of 0.05-2mm.

9. The transducer with a stacked structure according to claim 5, characterized in that, The conductive wire II is connected to the first outer electrode by conductive adhesive c or welding, and the conductive wire III is connected to the second outer electrode by conductive adhesive d or welding; the diameter of the conductive wire II and the conductive wire III is in the range of 0.01-1mm.

10. The transducer with a stacked structure according to claim 1, characterized in that, In each stack structure, the thickness of the first outer electrode ranges from 0.02 to 0.50 mm, the thickness of the upper piezoelectric material layer ranges from 0.05 to 1 mm, the thickness of the first inner electrode ranges from 0.001 to 0.1 mm, the thickness of the adhesive layer ranges from 0.01 to 0.5 mm, the thickness of the second inner electrode ranges from 0.001 to 0.1 mm, the thickness of the lower piezoelectric material layer ranges from 0.05 to 1 mm, and the thickness of the second outer electrode ranges from 0.02 to 0.50 mm.

11. The transducer with a stack structure according to claim 10, characterized in that, In each stack structure, the thickness and material of the first outer electrode and the second outer electrode are the same, the thickness and material of the upper piezoelectric material layer and the lower piezoelectric material layer are the same, and the thickness and material of the first inner electrode and the second inner electrode are the same.

12. The transducer with a stacked structure according to claim 10, characterized in that, In each stack structure, the thickness and material of the first outer electrode and the second outer electrode are different, the thickness and material of the upper piezoelectric material layer and the lower piezoelectric material layer are different, and the thickness and material of the first inner electrode and the second inner electrode are different.

13. The transducer with a stack structure according to claim 11 or 12, characterized in that, The upper piezoelectric material layer and the lower piezoelectric material layer are layers of materials that can perform electro-acoustic conversion and are plated with conductive metal on the surface.

14. The transducer with a stacked structure according to claim 1, characterized in that, The shapes and structures of the different stack structures are the same.

15. The transducer with a stacked structure according to claim 1, characterized in that, The normal directions of the different stack structures are the same or all cross 90°.

16. The transducer with a stacked structure according to claim 1, characterized in that, The surfaces of all the stack structures are wrapped with an insulating layer, and the thickness of the insulating layer ranges from 0.002 to 0.1 mm.

17. The transducer with a stacked structure according to claim 1, characterized in that, All the stack structures are wrapped in a protective tube, the protective tube is a kind of elastic, semi-transparent or transparent material with biocompatibility, and the protective tube is filled with soft non-conductive material.

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