A non-contact three-dimensional vibration measurement sensor system

Abstract

This invention discloses a non-contact three-dimensional vibration sensor system, comprising three optical chip measurement modules arranged in a triangle; an optical path deflection unit for deflecting three parallel measurement laser beams to the same point on the object being measured, with this point located on the central axis; and a calculation unit for calculating the three-dimensional vibration value of the vibrating object based on the displacement values ​​measured by the three optical chip measurement modules. This invention utilizes the optical path deflection unit to deflect three parallel measurement laser beams to the same point on the object being measured, thereby changing the laser optical axis so that all three measurement laser beams are at the same angle to the central axis, thus achieving three-dimensional vibration measurement of a vibrating object at a fixed distance and realizing the miniaturization of the sensor system. Furthermore, this non-contact three-dimensional vibration sensor system has the advantages of simple structure, convenient operation, miniaturization, and low cost, while effectively ensuring measurement accuracy.

Description

Technical Field

[0001] This invention relates to the field of vibration measurement technology, and in particular to a non-contact three-dimensional vibration sensor system. Background Technology

[0002] Frequency Modulated Continuous Wave (FMCW) ranging works by transmitting a continuous signal with a certain bandwidth and linearly varying frequency, then performing a Fast Fourier Transform (FFT) on the received signal. The time difference between the transmitted and received signals is calculated using the frequency difference, and the distance is obtained from this time difference. Based on the principle of coherence, FMCW has gained widespread attention due to its strong anti-interference capabilities and high signal-to-noise ratio. Because of its high precision, it has been widely applied to the vibration measurement of vibrating objects to obtain their acceleration values. However, most existing three-dimensional vibration measurement systems based on the FMCW method suffer from complex structures and difficulties in miniaturization. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is to provide a non-contact three-dimensional vibration sensor system with a reasonable structure and small size.

[0004] To address the aforementioned technical problems, this invention provides a non-contact three-dimensional vibration sensor system, which includes:

[0005] Three optical chip measurement modules are arranged in a triangle. The three optical chip measurement modules are used to emit three parallel measurement laser beams. The circle defined by the three parallel measurement laser beams is the target circle, the surface on which the target circle is located is the target surface, and the axis passing through the center of the target circle and perpendicular to the target surface is denoted as the central axis.

[0006] An optical path deflection unit is used to deflect three parallel measuring laser beams to the same point on the object being measured, and this point is located on the central axis.

[0007] The calculation unit is used to calculate the three-dimensional vibration value of the vibrating object under test based on the displacement values ​​measured by the three optical chip measurement modules respectively.

[0008] In one embodiment of the present invention, the plane in which the three optical chip measurement modules are located is parallel to the target plane.

[0009] In one embodiment of the present invention, the three optical chip measurement modules include a first optical chip measurement module, a second optical chip measurement module, and a third optical chip measurement module. The projection of the laser emitted by the first optical chip measurement module onto the XY plane coincides with the X-axis, and the central axis coincides with the Z-axis. The angles between each measurement laser beam and the X, Y, and Z axes after deflection are as follows:

[0010] θ x1 =π / 2 - θ,θ y1 =π / 2,θ z1 =θ,

[0011]

[0012]

[0013] Wherein, the distance between each measurement laser beam and the central axis before deflection is r, the angle between each measurement laser beam and the central axis after deflection is θ, and the distance between each optical chip measurement module and the optical path deflection unit is d, θ x1 θ x2 θ x3 θ represents the angles between the laser emitted by the first optical chip measurement module and the X, Y, and Z axes after passing through the optical path deflection unit; y1 θ y2 θ y3 θ represents the angles between the laser emitted by the second optical chip measurement module and the X, Y, and Z axes after passing through the optical path deflection unit; z1 θ z2 θ z3 These represent the angles between the laser emitted by the third optical chip measurement module and the X, Y, and Z axes after passing through the optical path deflection unit;

[0014] The three-dimensional vibration value of the tested vibrating object is calculated using the following formula:

[0015] d1 = v x cos(θ x1 )+v y cos(θ y1 )+v z cos(θ z1 )

[0016] d2=v x cos(θ x2 )+v y cos(θ y2 )+v z cos(θ z2 )

[0017] d3=v x cos(θ x3)+v y cos(θ y3 )+v z cos(θ z3 )

[0018] Wherein, d1, d2, and d3 are the displacement values ​​of the vibrating object along their respective laser directions measured by the first, second, and third optical chip measurement modules, respectively; v x v y v z These represent the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes, respectively.

[0019] In one embodiment of the present invention, the three optical chip measurement modules are arranged in an equilateral triangle.

[0020] In one embodiment of the present invention, a collimation unit is provided between each optical chip measurement module and the optical path deflection unit, and the collimation unit is used to collimate the measurement laser and then incident it onto the optical path deflection unit.

[0021] In one embodiment of the present invention, the optical path deflection unit is a focusing lens or a prism.

[0022] In one embodiment of the invention, a retainer is also included, on which the three optical chip measurement modules are disposed.

[0023] In one embodiment of the invention, a cover plate is also included, the cover plate being disposed on the retainer.

[0024] In one embodiment of the present invention, a PCBA board is also included, which is connected to three optical chip measurement modules.

[0025] In one embodiment of the present invention, a connector is also included, through which the PCBA board is connected to the outside.

[0026] The technical solution of the present invention has the following advantages over the prior art:

[0027] The non-contact three-dimensional vibration sensor system of this invention utilizes an optical path deflection unit to deflect three parallel measuring laser beams to the same point on the object being measured, thereby changing the laser optical axis so that all three measuring laser beams are at the same angle to the central axis. This enables three-dimensional vibration measurement of a vibrating object at a fixed distance, achieving miniaturization of the sensor system. Furthermore, the non-contact three-dimensional vibration sensor system of this invention has the advantages of simple structure, convenient operation, miniaturization, and low cost, while effectively ensuring measurement accuracy.

[0028] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0029] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0030] Figure 1 This is a schematic diagram of the structure of the non-contact three-dimensional vibration sensor system in an embodiment of the present invention;

[0031] Figure 2 This is an optical path diagram of the non-contact three-dimensional vibration sensor system in an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the vibration measurement principle of the non-contact three-dimensional vibration sensor system in this embodiment of the invention.

[0033] Marker explanation:

[0034] 1. Optical chip measurement module; 2. Collimation unit; 3. Holder; 4. Optical path deflection unit; 5. Lens retainer; 6. Main PCBA board; 7. Synchronous PCBA board; 8. Connector; 9. Cover plate; 11. First optical chip measurement module; 12. Second optical chip measurement module; 13. Third optical chip measurement module. Detailed Implementation

[0035] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0036] Example 1

[0037] Reference Figure 1-3 As shown, this embodiment discloses a non-contact three-dimensional vibration sensor system, which includes:

[0038] Three optical chip measurement modules 1 are arranged in a triangle. The three optical chip measurement modules 1 are used to emit three parallel measurement laser beams. The circle defined by the three parallel measurement laser beams is the target circle, the surface on which the target circle is located is the target surface, and the axis passing through the center of the target circle and perpendicular to the target surface is denoted as the central axis.

[0039] The optical path deflection unit 4 is used to deflect three parallel measuring laser beams to the same point on the object being measured, and this point is located on the central axis. Optionally, the optical path deflection unit 4 can be a focusing lens or prism, as long as it can deflect and converge the three parallel measuring laser beams to the same point.

[0040] The calculation unit is used to calculate the three-dimensional vibration value of the vibrating object under test based on the displacement values ​​measured by the three optical chip measurement modules respectively.

[0041] The non-contact three-dimensional vibration sensor system of this invention utilizes an optical path deflection unit 4 to deflect three parallel measuring laser beams to the same point on the object being measured, thereby changing the laser optical axis so that all three measuring laser beams are at the same angle to the central axis. This enables three-dimensional vibration measurement of a vibrating object at a fixed distance, achieving miniaturization of the sensor system. Furthermore, the non-contact three-dimensional vibration sensor system of this invention has the advantages of simple structure, convenient operation, miniaturization, and low cost, while effectively ensuring measurement accuracy.

[0042] For ease of calculation, in one embodiment, the plane containing the three optical chip measurement modules 1 is parallel to the target plane. The three optical chip measurement modules 1 include a first optical chip measurement module 11, a second optical chip measurement module 12, and a third optical chip measurement module 13. The projection of the laser emitted by the first optical chip measurement module 11 onto the XY plane is aligned with the X-axis, and the central axis is aligned with the Z-axis. Figure 3 The angles between each measuring laser beam and the X, Y, and Z axes after deflection are as follows:

[0043] θ x1 =π / 2 - θ,θ y1 =π / 2,θ z1 =θ,

[0044]

[0045]

[0046] Wherein, the distance between each measurement laser beam and the central axis before deflection is r, the angle between each measurement laser beam and the central axis after deflection is θ, and the distance between each optical chip measurement module and the optical path deflection unit is d, θ x1 θ x2 θ x3 θ represents the angles between the laser emitted by the first optical chip measurement module 11 and the X, Y, and Z axes after passing through the optical path deflection unit; y1 θ y2 θ y3These represent the angles between the laser emitted by the second optical chip measurement module 12 and the X, Y, and Z axes after passing through the optical path deflection unit; θ z1 θ z2 θ z3 These represent the angles between the laser emitted by the third optical chip measurement module 13 and the X, Y, and Z axes after passing through the optical path deflection unit;

[0047] The three-dimensional vibration value of the tested vibrating object is calculated using the following formula:

[0048] d1 = v x cos(θ x1 )+v y cos(θ y1 )+v z cos(θ z1 )

[0049] d2=v x cos(θ x2 )+v y cos(θ y2 )+v z cos(θ z2 )

[0050] d3=v x cos(θ x3 )+v y cos(θ y3 )+v z cos(θ z3 )

[0051] Wherein, d1, d2, and d3 are the displacement values ​​of the vibrating object along their respective laser directions measured by the first optical chip measurement module 11, the second optical chip measurement module 12, and the third optical chip measurement module 13, respectively; v x v y v z These represent the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes, respectively.

[0052] When the optical path deflection unit 4 is a focusing lens, f is the focal length of the focusing lens, and θ = arctan(r / f).

[0053] Furthermore, the three optical chip measurement modules 1 are arranged in an equilateral triangle, which simplifies the calculation.

[0054] Since the laser emitted by the optical chip measurement module 1 is divergent light, a collimation unit 2 is further provided between each optical chip measurement module 1 and the optical path deflection unit 4. The collimation unit 2 is used to collimate the measurement laser into parallel light before it is incident on the optical path deflection unit 4. Optionally, the collimation unit 2 is a collimating lens, etc.

[0055] Optionally, a retainer 3 is also included, on which the three optical chip measurement modules 1 are mounted. This facilitates the positioning of the three optical chip measurement modules 1 and allows them to be arranged in an equilateral triangle. A lens retainer 5 is also provided at the front end of the retainer 3, which is used to assemble the optical path deflection unit 4 at the front end of the retainer 3.

[0056] In some embodiments, a cover plate 9 is further included, which is disposed on the retainer 3. Multiple cover plates 9 surround the retainer 3 circumferentially, forming a cavity for accommodating three optical chip measurement modules 1. Further, a PCBA board is included, which is connected to the three optical chip measurement modules. The PCBA board is disposed inside the cavity. In one embodiment, the PCBA board includes a main PCBA board 6, which enables data acquisition and algorithm implementation. The main PCBA board, through a synchronization PCBA board 7, achieves synchronized input and output of information data, thereby realizing synchronized control and data extraction of the three optical chip measurement modules. Further, a connector 8 is included, through which the PCBA board connects to the outside, enabling power supply and information input and output to the three-dimensional vibration sensor. The main PCBA board 6 and the synchronization PCBA board 7 can be integrated into a single PCBA board, or each optical chip measurement module can be equipped with one main PCBA board 6 and one synchronization PCBA board 7.

[0057] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A non-contact three-dimensional vibration sensor system, characterized in that, include: Three optical chip measurement modules are arranged in a triangle. The three optical chip measurement modules are used to emit three parallel measurement laser beams. The circle defined by the three parallel measurement laser beams is the target circle, the surface on which the target circle is located is the target surface, and the axis passing through the center of the target circle and perpendicular to the target surface is denoted as the central axis. An optical path deflection unit is used to deflect three parallel measuring laser beams to the same point on the object being measured, and this point is located on the central axis. The calculation unit is used to calculate the three-dimensional vibration value of the vibrating object under test based on the displacement values ​​measured by the three optical chip measurement modules respectively. The plane containing the three optical chip measurement modules is parallel to the target surface; The three optical chip measurement modules include a first optical chip measurement module, a second optical chip measurement module, and a third optical chip measurement module. The projection of the laser emitted by the first optical chip measurement module onto the XY plane coincides with the X-axis, and the central axis coincides with the Z-axis. The angles between each measurement laser beam and the X, Y, and Z axes after deflection are as follows: Wherein, the distance between each measurement laser beam and the central axis before deflection is r, the angle between each measurement laser beam and the central axis after deflection is θ, and the distance between each optical chip measurement module and the optical path deflection unit is d. , , These represent the angles between the laser emitted by the first optical chip measurement module and the X, Y, and Z axes after passing through the optical path deflection unit; , , These represent the angles between the laser emitted by the second optical chip measurement module and the X, Y, and Z axes after passing through the optical path deflection unit; , , These represent the angles between the laser emitted by the third optical chip measurement module and the X, Y, and Z axes after passing through the optical path deflection unit; The three-dimensional vibration value of the tested vibrating object is calculated using the following formula: Where d1, d2, and d3 are the displacement values ​​of the vibrating object along their respective laser directions measured by the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module, respectively. , , These represent the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes, respectively.

2. The non-contact three-dimensional vibration sensor system according to claim 1, characterized in that, The three optical chip measurement modules are arranged in an equilateral triangle.

3. The non-contact three-dimensional vibration sensor system according to claim 1, characterized in that, Each optical chip measurement module is equipped with a collimation unit between itself and the optical path deflection unit. The collimation unit is used to collimate the measurement laser before it is incident on the optical path deflection unit.

4. The non-contact three-dimensional vibration sensor system according to claim 1, characterized in that, The optical path deflection unit is a focusing lens or a prism.

5. The non-contact three-dimensional vibration sensor system according to claim 1, characterized in that, It also includes a retainer on which the three optical chip measurement modules are mounted.

6. The non-contact three-dimensional vibration sensor system according to claim 5, characterized in that, It also includes a cover plate, which is disposed on the retainer.

7. The non-contact three-dimensional vibration sensor system according to claim 1, characterized in that, It also includes a PCBA board, which is connected to three optical chip measurement modules.

8. The non-contact three-dimensional vibration sensor system according to claim 7, characterized in that, It also includes connectors, through which the PCBA board is connected to the outside.

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