A capacitor high temperature welding reliability test method

Abstract

A method for testing the reliability of high-temperature welding of capacitors is conducted based on a test device. The test device includes a base, a mounting seat for mounting the capacitor to be tested, a heating mechanism arranged in the mounting seat to heat the capacitor to be tested, a linear reciprocating mechanism arranged on the base and connected to the mounting seat to drive the mounting seat to move back and forth, an angle adjustment mechanism arranged on the base and connected to the linear reciprocating mechanism and driving the mounting seat to slide back and forth left and right along a direction perpendicular to the movement of the mounting seat to adjust the inclination angle of the mounting seat, a fan unit arranged on the base and above the mounting seat, and a visual feedback mechanism arranged on the mounting seat opposite to the capacitor to be tested. This application simulates the welding conditions of the capacitor under various working conditions in the reflow soldering equipment by limiting the structure of the test device and coordinating with a specific test method, so as to facilitate adjustment and verification of the capacitor to meet reliability requirements and meet usage needs.

Description

Technical Field

[0001] The invention belongs to the field of capacitor testing, and in particular relates to a capacitor high-temperature welding reliability test method. Background Art

[0002] The welding quality of ceramic capacitor chips, bracket capacitors and molded multi-core capacitors cannot be guaranteed during the reflow soldering process due to the product process characteristics, structural features or quality differences, making it difficult to ensure product reliability and requiring further improvement. Summary of the Invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a capacitor high temperature welding reliability test method.

[0004] The present invention adopts the following technical solutions:

[0005] A method for testing the reliability of high-temperature soldering of capacitors is disclosed. The capacitor comprises two frames arranged opposite to each other and a porcelain body arranged between the two frames. The porcelain body comprises a plurality of chips stacked in sequence one above the other. The test is conducted based on a test apparatus, the test apparatus comprising a base, a mounting seat for mounting the capacitor to be tested, a heating mechanism disposed in the mounting seat for heating the capacitor to be tested, a linear reciprocating mechanism disposed on the base and connected to the mounting seat to drive the mounting seat to move back and forth, an angle adjustment mechanism disposed on the base and connected to the linear reciprocating mechanism to drive the mounting seat to slide back and forth left and right in a direction perpendicular to the movement of the mounting seat to adjust the inclination angle of the mounting seat, a fan unit disposed on the base above the mounting seat, and a visual feedback mechanism disposed on the mounting seat and opposite the capacitor to be tested.

[0006] The test method comprises the following steps:

[0007] Product welding suitability test:

[0008] According to the existing reflow process curve, the linear reciprocating mechanism is controlled to simulate the transport speed of the capacitor reflow, the heating mechanism is controlled to simulate the temperature of the capacitor reflow, the angle adjustment mechanism is controlled to simulate the installation tilt angle of the capacitor reflow, and the fan unit is controlled to simulate the wind force of the capacitor reflow; and the visual feedback mechanism then provides feedback on the capacitor test process.

[0009] When the visual feedback mechanism reports that the capacitor is melting and falling apart, the test is terminated and the same type of capacitor is placed again for testing. Then, based on the feedback from the visual feedback mechanism about the capacitor melting and falling apart, the linear reciprocating mechanism, the heating mechanism, the angle adjustment mechanism and the fan unit are controlled to adjust the transport speed, temperature, the installation tilt angle and / or the wind force so that the capacitor under test does not fall apart, and a new reflow process curve is output.

[0010] The test ends when the visual feedback mechanism indicates that the capacitor has not melted or fallen apart, indicating that the capacitor meets the existing reflow process curve.

[0011] Furthermore, when the capacitor melts and falls apart, the test process parameters are adjusted as follows: when the chip and the frame are skewed, the angle adjustment mechanism is controlled to reduce the installation tilt angle of the capacitor reflow soldering; when the porcelain body and the frame are laterally offset, the linear reciprocating mechanism is first controlled to reduce the transport speed of the capacitor reflow soldering. If the capacitor continues to melt and fall apart at this time, the angle adjustment mechanism is continued to be controlled to reduce the installation tilt angle of the capacitor reflow soldering; when the frames on both sides are separated from the chip ends, the fan unit is first controlled to reduce the wind force of the capacitor reflow soldering. If the capacitor continues to melt and fall apart at this time, the heating mechanism is continued to be controlled to reduce the temperature of the capacitor reflow soldering; when the bottom solder is separated from the chip end, the heating mechanism is controlled to reduce the temperature of the capacitor reflow soldering.

[0012] Furthermore, the method further includes the following steps:

[0013] Product welding strength limit test:

[0014] According to the existing reflow process curve, the linear reciprocating mechanism is controlled to simulate the transport speed of the capacitor reflow, the heating mechanism is controlled to simulate the temperature of the capacitor reflow, the angle adjustment mechanism is controlled to simulate the installation tilt angle of the capacitor reflow, and the fan unit is controlled to simulate the wind force of the capacitor reflow; and the visual feedback mechanism then provides feedback on the capacitor test process.

[0015] When the capacitor appears to be melted but not falling apart, adjust the speed, temperature, installation tilt angle and wind force parameters one by one until the capacitor is slightly melted and falling apart, and then obtain the extreme environmental parameters of the capacitor;

[0016] When the capacitor does not melt or fall apart, adjust the speed, temperature, installation tilt angle, and wind speed parameters one by one until the capacitor begins to melt or fall apart slightly, thereby obtaining the extreme environmental parameters of the capacitor.

[0017] When the capacitor begins to fall apart, the test is terminated and the same capacitor is re-placed for testing. The speed, temperature, installation tilt angle, and wind force parameters are adjusted downward one by one until the capacitor begins to melt and fall apart, thereby obtaining the extreme environmental parameters of the capacitor.

[0018] Furthermore, the test device also includes a control mechanism, which is respectively connected to the heating mechanism, the linear reciprocating mechanism, the angle adjustment mechanism and the visual feedback mechanism, and controls the operation of the heating mechanism, the linear reciprocating mechanism and the angle adjustment mechanism according to the information feedback from the visual feedback mechanism.

[0019] Furthermore, the control mechanism includes a controller arranged in the base, a display screen arranged on the base and connected to the controller, and a control button arranged on the base and connected to the controller. The controller processes the information fed back by the visual feedback mechanism and displays the processing results through the display screen.

[0020] Furthermore, the linear reciprocating mechanism includes a positioning seat arranged on the angle adjustment mechanism, a movable seat arranged on the positioning seat that can move back and forth, and a driving member connected to and driving the movable seat to move back and forth. The mounting seat is arranged on the movable seat, and the driving member includes a rotating screw rod rotatably arranged in the movable seat and a driving motor arranged on the positioning seat that is connected to and drives the rotating screw rod to rotate.

[0021] Furthermore, the visual feedback mechanism includes a camera arranged on a mounting base opposite to the capacitor to be tested, and the mounting base is provided with a mounting plate for mounting the camera.

[0022] Furthermore, the temperature increasing mechanism includes a heating plate arranged on a mounting base, and the capacitor to be tested is mounted on the heating plate.

[0023] Furthermore, the angle adjustment mechanism includes a fixed seat arranged on the base, a sliding seat slidably arranged in the fixed seat, and an adjustment member arranged on the fixed seat and connected to and driving the sliding seat to slide. The linear reciprocating mechanism is arranged on the sliding seat, and the sliding seat slides back and forth left and right along a direction perpendicular to the moving direction of the mounting seat to adjust the inclination angle of the mounting seat.

[0024] Furthermore, the fan assembly includes two fans arranged on the base opposite to the mounting base.

[0025] From the above description of the present invention, it can be seen that compared with the prior art, the beneficial effect of the present invention is: this application simulates the welding conditions of capacitors under various working conditions in reflow soldering equipment by limiting the structure of the test device and coordinating specific test methods, so as to facilitate the adjustment and verification of the capacitors to meet the reliability requirements and meet the use needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the structure of the capacitor high temperature welding reliability test device Figure 1 ;

[0027] Figure 2 Schematic diagram of the structure of the capacitor high temperature welding reliability test device Figure 2 ;

[0028] Figure 3 It is a structural diagram of a capacitor;

[0029] In the figure, 1-base, 2-mounting seat, 3-heating plate, 4-linear reciprocating mechanism, 5-angle adjustment mechanism, 6-fan unit, 7-visual feedback mechanism, 8-control mechanism, 9-capacitor, 41-positioning seat, 411-moving slot, 42-moving seat, 43-driving member, 431-rotating screw, 432-driving motor, 51-fixed seat, 52-sliding seat, 53-adjusting member, 61-fan, 71-camera, 72-mounting plate 81-display screen, 82-control button, 91-frame, 92-ceramic body, 93-chip. DETAILED DESCRIPTION

[0030] The present invention is further described below through specific embodiments.

[0031] Reference Figures 1 to 2 As shown, a capacitor high-temperature welding reliability test device includes a base 1, a mounting base 2, a heating mechanism, a linear reciprocating mechanism 4, an angle adjustment mechanism 5, a fan unit 6, a visual feedback mechanism 7 and a control mechanism 8.

[0032] The capacitor 9 includes two frames 91 arranged opposite to each other and a ceramic body 92 arranged between the two frames 91 . The ceramic body 92 includes a plurality of chips 93 stacked in sequence one above the other.

[0033] The mounting seat 2 is used for mounting the capacitor 9 to be tested.

[0034] The heating mechanism is provided in the mounting seat 2 to heat the capacitor 9 to be tested, and includes a heating plate 3 provided on the mounting seat 2. The capacitor 9 to be tested is mounted on the heating plate 3 to simulate the temperature of the capacitor 9 during reflow soldering.

[0035] The linear reciprocating mechanism 4 is arranged on the angle adjustment mechanism 5 and is connected to the mounting seat 2 to drive the mounting seat 2 to move back and forth, simulating the transportation speed of the capacitor 9 in the reflow soldering process. It includes a positioning seat 41 arranged on the angle adjustment mechanism 5, a moving seat 42 that can move back and forth and is arranged on the positioning seat 41, and a driving member 43 that is connected to and drives the moving seat 42 to move back and forth. Specifically, the driving member 43 includes a rotating screw rod 431 that can be rotatably arranged in the moving seat 42 and a driving motor 432 that is arranged on the positioning seat 41 and is connected to and drives the rotating screw rod 431 to rotate. A screw hole that cooperates with the rotating screw rod 431 is provided in the moving seat 42. The mounting seat 2 is driven back and forth by the driving motor 432, the rotating screw rod 431 and the screw hole to simulate the transportation speed of the capacitor 9 in the reflow soldering process. Furthermore, the positioning seat 41 is provided with a moving groove 411 extending downward from its top surface for the moving seat 42 to move back and forth.

[0036] The angle adjustment mechanism 5 is arranged on the base 1, connected to the positioning seat 41 and drives the mounting seat 2 to slide back and forth along the direction perpendicular to the moving direction of the mounting seat 2 to adjust the inclination angle of the mounting seat 2, and cooperates with the linear reciprocating mechanism 4 to realize linear motion under a certain inclination angle, including a fixed seat 51 arranged on the base 1, a sliding seat 52 slidably arranged in the fixed seat 51 and an adjustment member 53 arranged on the fixed seat 51 and connected to and driving the sliding seat 52 to slide. Specifically, the positioning seat 41 is arranged on the sliding seat 52, and the sliding seat 52 is driven by the adjustment member 53 to slide back and forth left and right on the fixed seat 51 along the direction perpendicular to the moving direction of the mounting seat 2 to adjust the inclination angle of the mounting seat 2; further, the angle adjustment mechanism 5 is a mechanism commonly used in multi-axis degree of freedom adjustment equipment, and its specific mechanism and working principle will not be further described here.

[0037] The fan group 6 is arranged on the base 1 above the mounting base 2 to simulate the wind force of the capacitor 9 during reflow soldering. It includes two fans 61 arranged on the top of the base 1 opposite to the mounting base 2. Specifically, the two fans 61 can be controlled separately to realize the effect of the wind force difference on the reflow soldering of the capacitor 9.

[0038] The visual feedback mechanism 7 is arranged on the mounting base 2 and is opposite to the capacitor 9 to be tested. It includes a camera 71 arranged on the mounting base 2 and opposite to the capacitor 9 to be tested. The camera 71 provides real-time feedback on the condition of the capacitor 9 during the simulated reflow soldering test, so as to facilitate the judgment of the high-temperature welding reliability of the capacitor 9; specifically, the mounting base 2 is provided with a mounting plate 72 for mounting the camera 71.

[0039] The control mechanism 8 is respectively connected to the heating mechanism, the linear reciprocating mechanism 4, the angle adjustment mechanism 5, the fan group 6 and the visual feedback mechanism 7, and controls the operation of the heating mechanism, the linear reciprocating mechanism 4, the angle adjustment mechanism 5 and the fan group 6 according to the information fed back by the visual feedback mechanism 7. Specifically, the control mechanism 8 includes a controller arranged in the base 1, a display screen 81 arranged on the base 1 and connected to the controller, and a control button 82 arranged on the base 1 and connected to the controller. The controller receives and processes the information fed back by the visual feedback mechanism 7 and displays the processing results through the display screen 81; further, the controller adopts a PLC controller.

[0040] The test method for the high-temperature welding reliability of capacitors based on the above device includes the following steps: product welding adaptability test and product welding strength limit test.

[0041] Product welding suitability test

[0042] According to the existing reflow process curve, the linear reciprocating mechanism 4 is controlled to simulate the transport speed of the capacitor 9 during reflow, the heating mechanism is controlled to simulate the temperature of the capacitor 9 during reflow, the angle adjustment mechanism 5 is controlled to simulate the installation tilt angle of the capacitor 9 during reflow, and the fan unit 6 is controlled to simulate the wind force of the capacitor 9 during reflow. The visual feedback mechanism 7 then provides feedback on the test process of the capacitor 9.

[0043] When the visual feedback mechanism 7 reports that the capacitor 9 is melting and falling apart, the test is terminated and the same type of capacitor is placed again for testing. Then, based on the feedback from the visual feedback mechanism 7 about the capacitor 9 melting and falling apart, the linear reciprocating mechanism 4, the heating mechanism, the angle adjustment mechanism 5 and the fan unit 6 are controlled to adjust the transport speed, temperature, the installation tilt angle and / or the wind force so that the capacitor 9 under test does not fall apart, and a new reflow process curve is output.

[0044] When the visual feedback mechanism 7 indicates that the capacitor 9 has not melted or fallen apart, the test is completed, indicating that the capacitor 9 meets the existing reflow process curve.

[0045] Among them, when the capacitor 9 melts and falls apart, the test process parameters are adjusted as follows: when the chip 93 and the frame 91 are skewed, the angle adjustment mechanism 5 is controlled to reduce the installation tilt angle of the capacitor reflow soldering; when the porcelain body 92 and the frame 91 are laterally offset, the linear reciprocating mechanism 4 is first controlled to reduce the transportation speed of the capacitor reflow soldering. If the capacitor 9 continues to melt and fall apart at this time, the angle adjustment mechanism 5 is continued to be controlled to reduce the installation tilt angle of the capacitor reflow soldering; when the two side frames 91 and the chip 93 ends are separated, the fan group 6 is first controlled to reduce the wind force of the capacitor reflow soldering. If the capacitor continues to melt and fall apart at this time, the heating mechanism is continued to be controlled to reduce the temperature of the capacitor reflow soldering; when the bottom solder and the chip 93 end are separated, the heating mechanism is controlled to reduce the temperature of the capacitor reflow soldering.

[0046] Product welding strength limit test:

[0047] According to the existing reflow process curve, the linear reciprocating mechanism 4 is controlled to simulate the transport speed of the capacitor reflow, the heating mechanism is controlled to simulate the temperature of the capacitor reflow, the angle adjustment mechanism 5 is controlled to simulate the installation tilt angle of the capacitor reflow, and the fan unit 6 is controlled to simulate the wind force of the capacitor reflow. The visual feedback mechanism 7 then provides feedback on the capacitor test process.

[0048] When the capacitor appears to be melted but not falling apart, adjust the speed, temperature, installation tilt angle and wind force parameters one by one until the capacitor is slightly melted and falling apart, and then obtain the extreme environmental parameters of the capacitor;

[0049] When the capacitor does not melt or fall apart, adjust the speed, temperature, installation tilt angle, and wind speed parameters one by one until the capacitor begins to melt or fall apart slightly, thereby obtaining the extreme environmental parameters of the capacitor.

[0050] When the capacitor begins to fall apart, the test is terminated and the same capacitor is re-placed for testing. The speed, temperature, installation tilt angle, and wind force parameters are adjusted downward one by one until the capacitor begins to melt and fall apart, thereby obtaining the extreme environmental parameters of the capacitor.

[0051] This application simulates the welding conditions of capacitors under various working conditions in reflow soldering equipment by limiting the structure of the test device and coordinating specific test methods, so as to facilitate adjustment and verification of the capacitors to meet reliability requirements and meet usage needs.

[0052] The above description is merely a preferred embodiment of the present invention and therefore cannot be used to limit the scope of the present invention. In other words, equivalent changes and modifications made according to the scope of the patent application and the contents of the specification should still fall within the scope of the patent of the present invention.

Claims

1. A method for testing the reliability of high-temperature soldering of a capacitor, wherein the capacitor comprises two opposing frames and a ceramic body disposed between the frames, wherein the ceramic body comprises a plurality of chips stacked one above the other, characterized in that: The test is conducted based on a test device, the test device including a base, a mounting base for mounting a capacitor to be tested, a heating mechanism disposed in the mounting base for heating the capacitor to be tested, a linear reciprocating mechanism disposed on the base and connected to the mounting base to drive the mounting base to move back and forth, an angle adjustment mechanism disposed on the base and connected to the linear reciprocating mechanism and driving the mounting base to slide back and forth left and right in a direction perpendicular to the movement direction of the mounting base to adjust the inclination angle of the mounting base, a fan unit disposed on the base above the mounting base, and a visual feedback mechanism disposed on the mounting base opposite to the capacitor to be tested; The test method comprises the following steps: Product welding suitability test: According to the existing reflow process curve, the linear reciprocating mechanism is controlled to simulate the transport speed of the capacitor reflow, the heating mechanism is controlled to simulate the temperature of the capacitor reflow, the angle adjustment mechanism is controlled to simulate the installation tilt angle of the capacitor reflow, and the fan unit is controlled to simulate the wind force of the capacitor reflow; and the visual feedback mechanism then provides feedback on the capacitor test process. When the visual feedback mechanism reports that the capacitor is melting and falling apart, the test is terminated and the same type of capacitor is placed again for testing. Then, based on the feedback from the visual feedback mechanism about the capacitor melting and falling apart, the linear reciprocating mechanism, the heating mechanism, the angle adjustment mechanism and the fan unit are controlled to adjust the transport speed, temperature, the installation tilt angle and / or the wind force so that the capacitor under test does not fall apart, and a new reflow process curve is output. The test ends when the visual feedback mechanism indicates that the capacitor has not melted or fallen apart, indicating that the capacitor meets the existing reflow process curve.

2. A capacitor high temperature soldering reliability test method according to claim 1, characterized in that: When the capacitor melts and falls apart, the test process parameters are adjusted as follows: when the chip and the frame are skewed, the angle adjustment mechanism is controlled to reduce the installation tilt angle of the capacitor reflow soldering; when the porcelain body and the frame are laterally offset, the linear reciprocating mechanism is first controlled to reduce the transport speed of the capacitor reflow soldering. If the capacitor continues to melt and fall apart at this time, the angle adjustment mechanism is continued to be controlled to reduce the installation tilt angle of the capacitor reflow soldering; when the frames on both sides are separated from the chip ends, the fan unit is first controlled to reduce the wind force of the capacitor reflow soldering. If the capacitor continues to melt and fall apart at this time, the heating mechanism is continued to be controlled to reduce the temperature of the capacitor reflow soldering; when the bottom solder is separated from the chip end, the heating mechanism is controlled to reduce the temperature of the capacitor reflow soldering.

3. The capacitor high temperature soldering reliability test method according to claim 1, characterized in that: The following steps are also included: Product welding strength limit test: According to the existing reflow process curve, the linear reciprocating mechanism is controlled to simulate the transport speed of the capacitor reflow, the heating mechanism is controlled to simulate the temperature of the capacitor reflow, the angle adjustment mechanism is controlled to simulate the installation tilt angle of the capacitor reflow, and the fan unit is controlled to simulate the wind force of the capacitor reflow; and the visual feedback mechanism then provides feedback on the capacitor test process. When the capacitor appears to be melted but not falling apart, adjust the speed, temperature, installation tilt angle and wind force parameters one by one until the capacitor is slightly melted and falling apart, and then obtain the extreme environmental parameters of the capacitor; When the capacitor does not melt or fall apart, adjust the speed, temperature, installation tilt angle, and wind speed parameters one by one until the capacitor begins to melt or fall apart slightly, thereby obtaining the extreme environmental parameters of the capacitor. When the capacitor begins to fall apart, the test is terminated and the same capacitor is re-placed for testing. The speed, temperature, installation tilt angle, and wind force parameters are adjusted downward one by one until the capacitor begins to melt and fall apart, thereby obtaining the extreme environmental parameters of the capacitor.

4. The capacitor high temperature soldering reliability test method according to claim 1, characterized in that: The test device also includes a control mechanism, which is connected to the heating mechanism, the linear reciprocating mechanism, the angle adjustment mechanism and the visual feedback mechanism respectively, and controls the operation of the heating mechanism, the linear reciprocating mechanism and the angle adjustment mechanism according to the information fed back by the visual feedback mechanism.

5. A capacitor high temperature soldering reliability test method according to claim 4, characterized in that: The control mechanism includes a controller arranged in the base, a display screen arranged on the base and connected to the controller, and a control button arranged on the base and connected to the controller. The controller processes the information fed back by the visual feedback mechanism and displays the processing results through the display screen.

6. A capacitor high temperature soldering reliability test method according to claim 1, characterized in that: The linear reciprocating mechanism includes a positioning seat arranged on the angle adjustment mechanism, a moving seat arranged on the positioning seat that can move back and forth, and a driving member connected to and driving the moving seat to move back and forth. The mounting seat is arranged on the moving seat, and the driving member includes a rotating screw rod rotatably arranged in the moving seat and a driving motor arranged on the positioning seat and connected to drive the rotating screw rod to rotate.

7. A capacitor high temperature soldering reliability test method according to claim 1, characterized in that: The visual feedback mechanism comprises a camera arranged on a mounting base opposite to the capacitor to be tested, and a mounting plate for mounting the camera is arranged on the mounting base.

8. The capacitor high temperature soldering reliability test method according to claim 1, characterized in that: The temperature raising mechanism comprises a heating plate arranged on a mounting seat, and the capacitor to be tested is mounted on the heating plate.

9. The capacitor high temperature soldering reliability test method according to claim 1, characterized in that: The angle adjustment mechanism includes a fixed seat arranged on the base, a sliding seat slidably arranged in the fixed seat, and an adjustment member arranged on the fixed seat and connected to and driving the sliding seat to slide. The linear reciprocating mechanism is arranged on the sliding seat, and the sliding seat slides back and forth left and right along a direction perpendicular to the moving direction of the mounting seat to adjust the inclination angle of the mounting seat.

10. The capacitor high temperature soldering reliability test method according to claim 1, characterized in that: The fan assembly includes two fans arranged on a base and opposite to a mounting base.

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