Plasma processing apparatus

Abstract

The application provides a kind of plasma processing device, including plasma, mounting mechanism and driving mechanism.Wherein, plasma includes positive electrode, negative electrode and the device body provided with vacuum cavity, positive electrode and negative electrode are arranged at the two sides of vacuum cavity with interval, so that positive electrode and negative electrode can cooperate to form plasma generating structure;Mounting mechanism is arranged in vacuum cavity, and mounting mechanism is located between positive electrode and negative electrode;Driving mechanism is drivingly connected with at least one of mounting mechanism and plasma generating structure, so that mounting mechanism can reciprocate relative to plasma generating structure along the direction perpendicular to the line connecting positive electrode and negative electrode.This application can make the circuit board on the mounting mechanism reciprocate along the direction of cutting electric field when the plasma is used to process the circuit board, so that the plasma is more evenly distributed on the circuit board, and the uniformity of the plasma processing device is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a plasma processing device. Background Art

[0002] Currently, plasma treatment equipment is widely used in applications such as plasma cleaning, etching, plasma plating, plasma debonding, plasma ashing, surface activation, and surface modification. These treatments can improve the wettability of materials, enabling coating and plating operations on a variety of materials, enhancing adhesion and bonding strength, and removing organic contaminants, oil, and grease.

[0003] With the continuous advancement of electronic products, the demand for circuit boards is increasing, and the variety of circuit boards is increasing. Plasma cleaning uniformity is particularly important, directly affecting the quality of each circuit board. Traditional plasma treatment equipment can cause uneven treatment of circuit boards. For example, the amount of glue removed is large in the center of the board, while the amount of glue removed is small in some edge areas. Summary of the Invention

[0004] Based on this, it is necessary to provide a plasma processing device to address the problem that conventional plasma processing equipment may cause uneven processing when processing circuit boards.

[0005] The technical solution is as follows:

[0006] In one aspect, a plasma processing apparatus is provided, comprising:

[0007] A plasma component, comprising a positive electrode, a negative electrode, and a device body provided with a vacuum chamber, wherein the positive electrode and the negative electrode are spaced apart and arranged on either side of the vacuum chamber so that the positive electrode and the negative electrode can cooperate to form a plasma generating structure;

[0008] A mounting mechanism, the mounting mechanism being disposed in the vacuum chamber and located between the positive electrode and the negative electrode; and

[0009] A driving mechanism is connected to at least one of the mounting mechanism and the plasma generating structure so that the mounting mechanism can reciprocate relative to the plasma generating structure in a direction perpendicular to a line connecting the positive electrode and the negative electrode.

[0010] In the plasma processing device of the above-described embodiment, when the circuit board is mounted on the mounting mechanism, the plasma generating structure is activated, generating an electric field between the positive electrode and the negative electrode. This electric field ionizes the gas between the positive and negative electrodes to generate plasma, thereby performing a process such as adhesive removal on the circuit board using the plasma. While the plasma is performing an adhesive removal process on the circuit board, the drive mechanism is activated, causing the mounting mechanism to reciprocate relative to the plasma generating structure in a direction perpendicular to the line connecting the positive and negative electrodes. This, in turn, causes the circuit board on the mounting mechanism to reciprocate along the direction of the cutting electric field. This results in a more uniform distribution of plasma on the circuit board, thereby improving the uniformity of the adhesive removal process performed by the plasma processing device on the circuit board.

[0011] The technical solution is further described below:

[0012] In one embodiment, the mounting mechanism is movably disposed in the vacuum chamber, and the driving mechanism is transmission-connected to the mounting mechanism so that the mounting mechanism can reciprocate relative to the plasma generating structure in a direction perpendicular to the line connecting the positive electrode and the negative electrode.

[0013] In one embodiment, the driving mechanism includes a driving member and a first transmission member, the driving member is in transmission connection with the first transmission member, and the mounting mechanism is provided with a second transmission member, the first transmission member is in transmission connection with the second transmission member, so that the second transmission member can drive the mounting mechanism to move back and forth in a direction perpendicular to the line connecting the positive electrode and the negative electrode.

[0014] In one embodiment, the driving mechanism further includes a third transmission member, the driving member is in transmission connection with the third transmission member, and the third transmission member is in transmission connection with the first transmission member.

[0015] In one embodiment, the outer wall of the device body is provided with a through hole communicating with the vacuum chamber, the driving member is arranged on the outside of the device body, and the third transmission member passes through the through hole and is correspondingly connected to the first transmission member.

[0016] In one embodiment, the first transmission member is configured as a gear, the second transmission member is configured as a rack, and the third transmission member is configured as a transmission rod. There are at least one gear and one rack, and each gear is correspondingly connected to each rack.

[0017] In one embodiment, a rolling element is provided at the bottom of the mounting mechanism, and the rolling element is used to roll with the bottom wall of the vacuum chamber.

[0018] In one embodiment, the rack is arranged at the bottom of the mounting structure, and the rolling element is spaced apart from the rack. The driving mechanism further includes a support element, which is rotatably connected to the transmission rod to support the transmission rod.

[0019] In one embodiment, there are at least two support members, each of which is spaced apart on the transmission rod, the gear is located between two adjacent support members, and the two adjacent support members are in one-to-one limited engagement with both sides of the gear.

[0020] In one embodiment, the installation mechanism includes a trolley and a clamp, the clamp is set on the trolley, the clamp is used to clamp the circuit board, and the driving mechanism is connected to the trolley in a transmission manner so that the clamp can drive the circuit board to move back and forth in a direction perpendicular to the connection direction between the positive electrode and the negative electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 Schematic diagram of the structure of a plasma processing device according to an embodiment.

[0024] Figure 2 for Figure 1 Schematic diagram of the structure of the plasma treatment device from another perspective.

[0025] Figure 3 for Figure 1 Schematic diagram of the structure of the plasma processing device from another perspective.

[0026] Figure 4 for Figure 3 Schematic diagram of the structure of the installation mechanism.

[0027] Figure 5 for Figure 3 Schematic diagram of the driving mechanism in .

[0028] Description of reference numerals:

[0029] 10. Plasma treatment device; 100. Plasma component; 110. Device body; 111. Vacuum chamber; 120. Plasma generating structure; 200. Mounting mechanism; 210. Second transmission component; 220. Rolling component; 230. Trolley; 240. Clamp; 300. Driving mechanism; 310. Driving component; 320. First transmission component; 330. Third transmission component; 340. Support component. DETAILED DESCRIPTION

[0030] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0031] like Figure 1 、 Figure 2 and Figure 3 As shown, in one embodiment, a plasma processing device 10 is provided, comprising a plasma component 100, a mounting mechanism 200, and a driving mechanism 300. The plasma component 100 includes a device body 110 having a positive electrode, a negative electrode, and a vacuum chamber 111. The positive electrode and the negative electrode are spaced apart on either side of the vacuum chamber 111 so that the positive electrode and the negative electrode can cooperate to form a plasma generating structure 120. The mounting mechanism 200 is disposed within the vacuum chamber 111 and is located between the positive electrode and the negative electrode. The driving mechanism 300 is in transmission connection with at least one of the mounting mechanism 200 and the plasma generating structure 120 so that the mounting mechanism 200 can reciprocate relative to the plasma generating structure 120 in a direction perpendicular to the line connecting the positive electrode and the negative electrode.

[0032] When the plasma processing device 10 in the above-described embodiment is used, after the circuit board is mounted on the mounting mechanism 200, the plasma generating structure 120 is activated, generating an electric field between the positive electrode and the negative electrode. The electric field ionizes the gas between the positive and negative electrodes to generate plasma, thereby performing a process such as debonding on the circuit board using the plasma. While the plasma is performing a process such as debonding on the circuit board, the drive mechanism 300 is activated, causing the mounting mechanism 200 to reciprocate relative to the plasma generating structure 120 in a direction perpendicular to the line connecting the positive and negative electrodes. This, in turn, causes the circuit board on the mounting mechanism 200 to reciprocate along the direction of the cutting electric field. This results in a more uniform distribution of plasma on the circuit board, thereby improving the uniformity of the debonding process performed by the plasma processing device 10.

[0033] The plasma component 100 may be a plasma device, a plasma generator or other devices capable of generating plasma.

[0034] The present application uses the example of a driving mechanism 300 being transmission-connected to the mounting mechanism 200 so that the mounting mechanism 200 can reciprocate in a direction perpendicular to the line connecting the positive electrode and the negative electrode as an example for description, and this should not be construed as limiting the present application. In other embodiments, the driving mechanism 300 can be transmission-connected to the plasma generating structure 120 so that the plasma generating structure 120 can reciprocate in a direction perpendicular to the line connecting the positive electrode and the negative electrode, or the driving mechanism 300 can be transmission-connected to both the mounting mechanism 200 and the plasma generating structure 120 so that both the mounting mechanism 200 and the plasma generating structure 120 can reciprocate in a direction perpendicular to the line connecting the positive electrode and the negative electrode, with the mounting mechanism 200 and the plasma generating structure 120 moving in opposite directions. The principles of these embodiments are the same or similar, and are not further described here.

[0035] like Figure 1 、 Figure 2 and Figure 3 As shown, the mounting mechanism 200 is further movably disposed within the vacuum chamber 111, and the driving mechanism 300 is in transmission connection with the mounting mechanism 200, enabling the mounting mechanism 200 to reciprocate relative to the plasma generating structure 120 in a direction perpendicular to the line connecting the positive and negative electrodes. This allows the plasma structure 120 to remain stationary relative to the device body, thereby increasing the stability of the electric field within the vacuum chamber 111 and ensuring that the electric field can ionize the gas between the positive and negative electrodes to generate plasma, thereby improving the stability and reliability of the plasma processing device 10.

[0036] The driving mechanism 300 may be a hydraulic driving mechanism, a pneumatic driving mechanism, a belt driving mechanism, a chain driving mechanism, a rack and pinion driving structure or other driving mechanisms.

[0037] like Figure 3 、 Figure 4 and Figure 5 As shown, the drive mechanism 300 optionally includes a drive member 310 and a first transmission member 320, with the drive member 310 being in transmission connection with the first transmission member 320. The mounting mechanism 200 is provided with a second transmission member 210, with the first transmission member 320 being in transmission connection with the second transmission member 210, so that the second transmission member 210 can drive the mounting mechanism 200 to reciprocate in a direction perpendicular to the line connecting the positive electrode and the negative electrode. In this way, the mounting mechanism 200 can stably and reliably reciprocate in a direction perpendicular to the line connecting the positive electrode and the negative electrode, thereby improving the reliability of the plasma processing apparatus 10.

[0038] Specifically in this embodiment, the positive electrode and the negative electrode (such as Figure 2The mounting mechanism 200 can be arranged in a spaced manner (as shown in the direction A in FIG). Figure 2 B direction) reciprocating, up and down (as shown in Figure 2 The mounting mechanism 200 can be reciprocated in the direction perpendicular to the line connecting the positive electrode and the negative electrode (as shown in the direction C in the middle). For example, when the mounting mechanism 200 can move forward and backward, the mounting mechanism 200 is located in the middle between the positive electrode and the negative electrode, the mounting mechanism 200 can move forward 163.5 mm, and the mounting mechanism 200 can move backward 163.5 mm (that is, when the mounting mechanism 200 is located in the middle between the positive electrode and the negative electrode, the mounting mechanism 200 is 163.5 mm away from the front end of the positive electrode and the front end of the negative electrode, and the mounting mechanism 200 is 163.5 mm away from the rear end of the positive electrode and the rear end of the negative electrode). In other embodiments, the positive electrode and the negative electrode can also be spaced apart front to back or up and down. The principle is the same or similar to the left and right spacing setting, and will not be described in detail here.

[0039] like Figure 4 and Figure 5 As shown, the drive mechanism 300 optionally further includes a third transmission member 330, the drive member 310 being in transmission connection with the third transmission member 330, and the third transmission member 330 being in transmission connection with the first transmission member 320. In this way, the position of the drive member 310 relative to the mounting mechanism 200 can be flexibly adjusted according to actual use needs, thereby improving the applicability of the plasma processing apparatus 10.

[0040] like Figure 1 、 Figure 4 and Figure 5 As shown, optionally, the outer wall of the device body 110 is provided with a through hole communicating with the vacuum chamber 111. The driving member 310 is disposed outside the device body 110. The third transmission member 330 passes through the through hole and is in corresponding transmission connection with the first transmission member 320. In this manner, the driving member 310 and the mounting mechanism 200 are spaced apart and disposed on the inner and outer sides of the device body 110, thereby preventing interference between the driving member 310 and the mounting mechanism 200 and improving the reliability of the plasma processing device 10.

[0041] Specifically in this embodiment, the third transmission member 330 is in sealing engagement with the inner sidewall of the through hole, thereby improving the safety of the plasma processing device 10 .

[0042] like Figure 4 and Figure 5As shown, in one embodiment, the first transmission member 320 is configured as a gear, the second transmission member 210 is configured as a rack, and the third transmission member 330 is configured as a transmission rod. There is at least one gear and rack, and each gear is in corresponding transmission connection with each rack. This allows the driving force output by the driving member 310 to be stably and reliably transmitted to the mounting mechanism 200, ensuring that the mounting mechanism 200 can reciprocate in a direction perpendicular to the line connecting the positive and negative electrodes, thereby improving the reliability of the plasma processing device 10.

[0043] The number of the gears and racks can be flexibly adjusted according to actual use needs. Specifically in this embodiment, the number of the gears and racks is two.

[0044] like Figure 1 and Figure 4 As shown, further, a rolling member 220 is provided at the bottom of the mounting mechanism 200, and the rolling member 220 is configured to roll with the bottom wall of the vacuum chamber 111. This reduces the friction between the mounting mechanism 200 and the bottom wall of the vacuum chamber 111, ensuring that the gear, via the rack, can drive the mounting mechanism 200 to reciprocate in a direction perpendicular to the line connecting the positive electrode and the negative electrode, thereby improving the reliability of the plasma processing device 10.

[0045] The rolling element 220 may be a roller, a rolling bearing, a ball bearing, or other rolling structure. The number of rolling elements 220 can be flexibly adjusted according to actual needs. Specifically, in this embodiment, the rolling elements 220 are configured as rollers, and there are six rollers spaced apart at the bottom of the mounting mechanism 200.

[0046] like Figure 4 and Figure 5 As shown, optionally, a rack is disposed at the bottom of the mounting mechanism 200, with the rolling element 220 spaced apart from the rack. The drive mechanism 300 further includes a support member 340 rotatably connected to the transmission rod to support the transmission rod. In this manner, the support member 340 can support and limit the transmission rod, ensuring that the gear on the transmission rod remains engaged with the rack, thereby improving the reliability of the plasma processing apparatus 10.

[0047] The support member 340 may be a support block, a support frame, a support seat or other support structures. Specifically in this embodiment, the support member 340 is disposed on the bottom wall of the vacuum chamber 111 .

[0048] like Figure 4 and Figure 5As shown, optionally, there are at least two support members 340, each spaced apart on the transmission rod. The gear is located between two adjacent support members 340, and the two adjacent support members 340 are positioned one-to-one with the two sides of the gear. In this way, the gear can be restrained by the support members 340, preventing the gear from moving relative to the transmission rod during use, ensuring that the gear maintains meshing with the rack, and improving the reliability of the plasma processing device 10.

[0049] The number of the support members 340 can be flexibly adjusted according to actual use needs. Specifically in this embodiment, four support members 340 are provided, and the four support members 340 are provided in a one-to-one correspondence with the two sides of the two gears.

[0050] like Figure 3 、 Figure 4 and Figure 5 As shown, in one embodiment, the mounting mechanism 200 includes a trolley 230 and a clamp 240. The clamp 240 is mounted on the trolley 230 and is used to clamp the circuit board. The drive mechanism 300 is in transmission connection with the trolley 230, enabling the clamp 240 to drive the circuit board to reciprocate in a direction perpendicular to the line connecting the positive and negative electrodes. In this manner, the circuit board can be secured to the trolley 230 via the clamp 240, allowing the circuit board to reciprocate synchronously with the trolley 230 in a direction perpendicular to the line connecting the positive and negative electrodes, thereby improving the reliability of the plasma processing apparatus 10.

[0051] The clamp 240 can be a pneumatic clamp, a flexible clamp, a spring clamp, or other clamping structure. The clamp 240 can clamp both rigid and flexible circuit boards. Specifically, in this embodiment, the clamp 240 can maintain the circuit board in a vertical position, ensuring that the circuit board remains in the center between the positive and negative electrodes.

[0052] The number of fixtures 240 can be flexibly adjusted based on actual usage needs. Specifically, in this embodiment, the number of fixtures 240 is at least two. In this way, the plasma processing device 10 can simultaneously perform glue removal and other processes on multiple circuit boards, thereby improving the processing efficiency of the plasma processing device 10.

[0053]

[0054] Specifically in this embodiment, a plasma processing device 10 provided with 15 fixtures 240 in this application was subjected to a glue removal test, and the etching amount of the circuit board corresponding to each fixture 240 was obtained as shown in the above table. A conventional plasma processing device provided with 15 fixtures 240 was subjected to a glue removal test, and the etching amount of the circuit board corresponding to each fixture 240 was obtained as shown in the following table.

[0055]

[0056] It can be seen that, compared with conventional plasma processing equipment, the plasma processing device 10 in this embodiment has significantly improved etching uniformity of the circuit board.

[0057] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0058] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0059] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0060] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0061] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0062] It should also be understood that when explaining the connection relationship or positional relationship of elements, even if not explicitly described, the connection relationship and positional relationship should be interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately," "approximately," or "substantially" can mean within one or more standard deviations, which is not limited here.

[0063] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above embodiments merely illustrate several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A plasma processing device, characterized in that include: A plasma component, comprising a positive electrode, a negative electrode, and a device body provided with a vacuum chamber, wherein the positive electrode and the negative electrode are spaced apart and arranged on either side of the vacuum chamber so that the positive electrode and the negative electrode can cooperate to form a plasma generating structure; A mounting mechanism, the mounting mechanism being disposed in the vacuum chamber and located between the positive electrode and the negative electrode, the mounting mechanism comprising a trolley and a clamp, the clamp being disposed on the trolley and being used to clamp a circuit board; and a driving mechanism, the driving mechanism being in driving connection with at least one of the mounting mechanism and the plasma generating structure, so that the mounting mechanism can reciprocate relative to the plasma generating structure in a direction perpendicular to a line connecting the positive electrode and the negative electrode; Wherein, a rolling member is provided at the bottom of the mounting mechanism, and the rolling member is used for rolling cooperation with the bottom wall of the vacuum chamber.

2. The plasma processing device according to claim 1, wherein: The mounting mechanism is movably arranged in the vacuum chamber, and the driving mechanism is transmission-connected to the mounting mechanism so that the mounting mechanism can reciprocate relative to the plasma generating structure along a direction perpendicular to the line connecting the positive electrode and the negative electrode.

3. The plasma processing device according to claim 2, wherein: The driving mechanism includes a driving member and a first transmission member, the driving member is in transmission connection with the first transmission member, and the mounting mechanism is provided with a second transmission member, the first transmission member is in transmission connection with the second transmission member, so that the second transmission member can drive the mounting mechanism to move back and forth in a direction perpendicular to the connecting line between the positive electrode and the negative electrode.

4. The plasma processing device according to claim 3, wherein: The driving mechanism further includes a third transmission member, the driving member is in transmission connection with the third transmission member, and the third transmission member is in transmission connection with the first transmission member.

5. The plasma processing device according to claim 4, wherein: The outer wall of the device body is provided with a through hole communicating with the vacuum chamber, the driving member is arranged on the outside of the device body, and the third transmission member passes through the through hole and is correspondingly connected to the first transmission member.

6. The plasma processing device according to claim 4, wherein: The first transmission member is configured as a gear, the second transmission member is configured as a rack, and the third transmission member is configured as a transmission rod. There are at least one gear and at least one rack, and each gear is correspondingly connected to each rack.

7. The plasma processing device according to claim 6, wherein: The rack is arranged at the bottom of the mounting mechanism, and the rolling element is spaced apart from the rack. The driving mechanism further comprises a supporting element, which is rotatably connected to the transmission rod to support the transmission rod.

8. The plasma processing device according to claim 7, wherein: There are at least two support members, each of which is spaced apart on the transmission rod. The gear is located between two adjacent support members, and the two adjacent support members are in one-to-one corresponding positional fit with both sides of the gear.

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