A method for embedding a copper block in a multilayer wiring board

Abstract

The application discloses a kind of multilayer circuit board copper block embedding process;First support frame and second support frame are connected with polishing assembly;Workbench is connected with clamping assembly;When using, through polishing rod, several vertical grooves are polished on the side wall of the hole slot of circuit board body, glue flows into the vertical groove in the side wall of the hole slot of circuit board body, fully contacts circuit board body and copper block, avoids the problem that glue can only penetrate to the upper position of the gap between copper block and circuit board body after existing technology directly drops glue to the gap between copper block and circuit board body, and leads to unstable bonding, and the polishing rod is hollow opening structure, so that it can be scraped up and collected while polishing, cooperate with external dust removal pipeline to remove the dust generated during polishing, realize dust removal effect, through polishing block, multiple horizontal grooves are polished on the side wall of the hole slot of circuit board body, and the horizontal groove is communicated with the vertical groove, for improving the bonding area of circuit board body and copper block.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing. More particularly, the present application relates to a method for embedding copper blocks in a multilayer circuit board. BACKGROUND

[0002] The existing technology embeds metal copper blocks or other metal blocks in the printed circuit board, and cooperates with the external heat dissipation equipment to dissipate heat for the circuit board, so as to prevent the circuit board from overheating and affecting its normal operation. When the existing technology inlays the copper block into the circuit board, a hole slot with the same size as the copper block is first formed on the circuit board, then the copper block is inlaid into the hole slot, and then glue is injected into the gap between the copper block and the hole slot for bonding. Then the circuit board and the copper block are clamped between two pressing plates until the glue is completely dried. However, during the drying process, the glue in the gap between the copper block and the hole slot will overflow onto the pressing plate. When the pressing plate is taken out subsequently, the pressing plate exerts a pulling force on the copper block through the glue, thereby reducing the connection stability between the copper block and the circuit board, and leaving a glue layer on the surface of the copper block, which affects heat dissipation. Therefore, a polishing process needs to be added to the surface of the copper block, which prolongs the production process and reduces the efficiency. SUMMARY

[0003] The present application provides a multilayer circuit board copper block embedding process, which aims to overcome the shortcomings of the prior art that when the pressing plate is taken out, the pressing plate exerts a pulling force on the copper block through the glue, thereby reducing the connection stability between the copper block and the circuit board, and leaving a glue layer on the surface of the copper block, which affects heat dissipation.

[0004] TECHNICAL SOLUTION

[0005] A multilayer circuit board copper block embedding process, which is used in cooperation with a multilayer circuit board copper block embedding device. The multilayer circuit board copper block embedding device comprises a workbench, a first support frame, a second support frame, a polishing rod, a polishing block, a pressing block, a polishing assembly, and a clamping assembly. The first support frame is fixedly connected to the middle of the upper side of the workbench. The second support frame is fixedly connected to the middle of the upper side of the workbench and is located inside the first support frame. The first support frame and the second support frame are connected with the polishing assembly for polishing the body of the circuit board and dust removal. The polishing assembly is connected with a plurality of polishing rods on the upper side. The polishing assembly is connected with four polishing blocks on the lower side. A vertical groove is polished in the hole slot side wall of the circuit board body through the polishing rod, and the vertical groove is used for absorbing glue. A horizontal groove is polished in the hole slot side wall of the circuit board body through the polishing block, and the horizontal groove is used for absorbing glue. The workbench is connected with the clamping assembly, and the clamping assembly is located between the first support frame and the second support frame. The clamping assembly is connected with eight pressing blocks. The copper block is pressed tightly on the circuit board body through the pressing block, and the gap between the pressing block far away from the copper block and the circuit board body;

[0006] The steps of a multilayer circuit board copper block embedding process are as follows:

[0007] Step one: milling hole, milling hole on the circuit board body through milling machine, the size of the hole is the same as the copper block;

[0008] Step two: pickling, the circuit board body treated in step one is put into pickling tank for pickling;

[0009] Step three: washing, the circuit board body treated in step two is put into clean water pool for immersion washing;

[0010] Step four: drying, the clean water on the surface of the circuit board body treated in step three is dried;

[0011] Step five: polishing, polishing assembly is used to polish the horizontal grooves and vertical grooves which are interconnected on the sidewall of the hole of the circuit board body;

[0012] Step six: inlaying, the copper block is inlaid into the hole of the circuit board body;

[0013] Step seven: bonding, the glue is dropped into the horizontal grooves and vertical grooves on the sidewall of the hole of the circuit board body, so that the copper block is bonded on the circuit board body;

[0014] Step eight: drying, the glue between the copper block and the circuit board body is dried.

[0015] As a preferred, the polishing rod is hollow structure, and an opening is arranged on one side of the polishing rod for collecting the dust generated by polishing.

[0016] As a preferred, the polishing assembly comprises first telescopic cylinders, first linkage blocks, a first motor, a cam, first grinding groove units, second grinding groove units, a linkage unit and rotating units; at least four first telescopic cylinders are fixedly connected in the middle of the first support frame; the telescopic ends of the first telescopic cylinders are fixedly connected with the first linkage blocks; the first linkage blocks are fixedly connected with the first motor at the lower middle side; the output shaft of the first motor is fixedly connected with the cam; four first grinding groove units are connected with the first linkage blocks; the second support frame is connected with the second grinding groove units; the linkage unit is connected with the second grinding groove units; one rotating unit is connected with each of the four first grinding groove units; the rotating units are used to drive the first grinding groove units.

[0017] As a preferred, the first grinding groove unit on the left side comprises a sliding sleeve block, first sliding blocks, elastic telescopic rods, a second linkage block, a first connecting block, hollow rods and second pipelines; the sliding sleeve block is fixedly connected with the first linkage block at the left side of the upper side; the first sliding blocks are slidingly connected with the inner side of the sliding sleeve block; the elastic telescopic rods are fixedly connected with the first sliding blocks at the front side and the rear side; the second linkage block is fixedly connected between the telescopic ends of the two elastic telescopic rods; the second linkage block is fixedly connected with the first sliding blocks; the first connecting block is fixedly connected with the first sliding blocks at the left side; the hollow rods are rotatably connected with the first connecting block; each of the hollow rods is connected with a corresponding polishing rod; each of the hollow rods is connected with a second pipeline at the upper side; each of the second pipelines is connected with a corresponding hollow rod.

[0018] As preferred, the second grinding groove unit comprises a second telescopic air cylinder, a second connecting block, a first electric push rod, a third connecting block, a second electric push rod, a third linkage block, a second sliding block, a first spring, a flow guide block and a first pipeline; at least one second telescopic air cylinder is fixedly connected to the middle of the second support frame; the telescopic end of the second telescopic air cylinder is fixedly connected with the second connecting block; the front side, the rear side, the left side and the right side of the second connecting block are fixedly connected with one first electric push rod; the telescopic end of the four first electric push rods is fixedly connected with one third connecting block; one second electric push rod is fixedly connected to the four third connecting blocks; the telescopic end of the four second electric push rods is fixedly connected with one third linkage block; one second sliding block is slidingly connected to the four third linkage blocks; one first spring is fixedly connected to the upper and lower sides of the four second sliding blocks; each first spring is fixedly connected with the corresponding third linkage block; the four second sliding blocks are fixedly connected with the corresponding grinding blocks; one flow guide block is fixedly connected to the upper side and the lower side of the grinding block; at least one first pipeline is communicated in the middle of the grinding block.

[0019] As preferred, the linkage unit comprises a first round rod and a limiting block; eight first round rods are fixedly connected to the second connecting block; one limiting block is fixedly connected to each of the eight first round rods.

[0020] As preferred, the side surface of the limiting block near the lower part of the corresponding second sliding block is a slope, which is used for cooperating with the second sliding block.

[0021] As preferred, the clamping assembly comprises a third support frame, a bearing block, a fourth connecting block, a first clamping block, a third round rod, a second clamping block, a third spring, a fixing unit and a pressing unit; one third support frame is fixedly connected to the upper left part and the upper right part of the workbench; one bearing block is fixedly connected to the upper side of the two third support frames; one fourth connecting block is inserted into the upper end of the two third support frames; the two fourth connecting blocks are in contact with the corresponding bearing blocks; one first clamping block is fixedly connected to the opposite side of the two fourth connecting blocks; two third round rods are fixedly connected to the upper side of the two first clamping blocks; one second clamping block is slidingly connected between each of the two third round rods; the two second clamping blocks are in contact with the corresponding first clamping blocks; one third spring is sleeved on each of the four third round rods, the upper end of the third spring is fixedly connected with the corresponding third round rod, and the upper end of the third spring is fixedly connected with the corresponding second clamping block; the fixing unit is connected to the fourth connecting block; the pressing unit is connected to the second clamping block.

[0022] As preferred, the fixing unit comprises a second round rod, a second spring and a push block; one second round rod is inserted into each of the two fourth connecting blocks; the two second round rods are inserted into the corresponding third support frames; one push block is fixedly connected to the opposite side of the two second round rods; one second spring is sleeved on each of the two second round rods, one end of the second spring is fixedly connected with the corresponding fourth connecting block, and the other end of the second spring is fixedly connected with the corresponding push block.

[0023] Preferably, the pressing unit comprises a fourth linkage block, a fourth round rod, a fifth connecting block and a fourth spring; one fourth linkage block is rotatably connected to the middle of the lower side of each first clamping block; one fourth linkage block is rotatably connected to the middle of the upper side of each second clamping block; one fourth round rod is slidably connected to each fourth linkage block; one fifth connecting block is fixedly connected to each fourth round rod; one fourth spring is sleeved on each fourth round rod, one end of the fourth spring is fixedly connected to the corresponding fourth linkage block, and the other end of the fourth spring is fixedly connected to the corresponding fifth connecting block; each fifth connecting block is fixedly connected to the corresponding pressing block; the upper pressing block is rotatably connected to the corresponding second clamping block; and the lower pressing block is rotatably connected to the corresponding first clamping block.

[0024] Beneficial effects: the present application adopts the above technical scheme, a plurality of vertical grooves are polished on the side wall of the hole and groove of the circuit board body by the polishing rod, the glue flows into the vertical grooves on the side wall of the hole and groove of the circuit board body, fully contacts the circuit board body and the copper block, avoids the problem that the glue can only penetrate to the upper position of the gap between the copper block and the circuit board body after being directly dropped to the gap between the copper block and the circuit board body in the prior art, and the adhesion is not stable, and the polishing rod is a hollow opening structure, so that the dust can be scraped and collected while polishing, and the dust generated during polishing is removed clean by cooperating with the external dust removal pipeline, so that the dust removal effect is realized.

[0025] By polishing a plurality of horizontal grooves on the side wall of the hole and groove of the circuit board body by the polishing block, and the horizontal grooves are communicated with the vertical grooves, when the glue is applied, the glue flows into the horizontal grooves through the vertical grooves, the amount of glue is increased, and the adhesion area of the circuit board body and the copper block is also increased, so that the adhesion stability of the circuit board body and the copper block is further improved, and at the same time, the movement mode of the polishing block is switched by cooperating the second sliding block with the limiting block, a wide and deep horizontal groove is polished on the side wall of the hole and groove of the circuit board body, more glue can be collected, and the problem that manual glue extrusion is difficult due to too little amount of glue is avoided.

[0026] Many problems caused by the spread of glue on the pressing block in the prior art are effectively avoided, and the pressing block is positioned by the circuit board body, so that the pressing block is always flush with the circuit board body, and the pressing block does not slide on the inner side of the circuit board body after pressing the copper block, so that the deviation phenomenon is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0027] The contents shown in the drawings and the marks in the drawings are briefly described as follows:

[0028] Figure 1 A first structure schematic view of a copper block embedding device for a multilayer circuit board is shown;

[0029] Figure 2A second structural schematic diagram of the copper block embedding device of the multilayer circuit board of the present application is shown.

[0030] Figure 3 A first partial structural schematic diagram of the polishing assembly of the present application is shown.

[0031] Figure 4 A second partial structural schematic diagram of the polishing assembly of the present application is shown.

[0032] Figure 5 A third partial structural schematic diagram of the polishing assembly of the present application is shown.

[0033] Figure 6 A fourth partial structural schematic diagram of the polishing assembly of the present application is shown.

[0034] Figure 7 A structural schematic diagram of the second grinding groove unit of the present application is shown.

[0035] Figure 8 A first partial structural schematic diagram of the second grinding groove unit of the present application is shown.

[0036] Figure 9 A second partial structural schematic diagram of the second grinding groove unit of the present application is shown.

[0037] Figure 10 A structural schematic diagram of the clamping assembly of the present application is shown.

[0038] Figure 11 A partial structural schematic diagram of the clamping assembly of the present application is shown.

[0039] Marked as in the figure:

[0040] 1-Workbench, 2-First support frame, 3-Second support frame, 4-Circuit board body, 201-First telescopic cylinder, 202-First linkage block, 203-First motor, 204-Cam, 205-Sliding sleeve block, 206-First slider, 207-Elastic telescopic rod, 208-Second linkage block, 209-First connecting block, 2010-Hollow rod, 2011-Grinding rod, 2012-Second telescopic cylinder, 2013-Second connecting block, 2014-First electric push rod, 2015-Third connecting block, 2016-Second electric push rod, 2017-Third linkage block, 2018-Second slider, 2019-First Spring, 2020-Grinding block, 2021-Guide block, 2022-First pipe, 2023-First round rod, 2024-Limiting block, 2025-Second motor, 2026-Spur gear, 2027-Second pipe, 301-Third support frame, 302-Receiving block, 303-Fourth connecting block, 304-Second round rod, 305-Second spring, 306-Pulling block, 307-First clamping block, 308-Third round rod, 309-Second clamping block, 3010-Third spring, 3011-Fourth linkage block, 3012-Fourth round rod, 3013-Fifth connecting block, 3014-Fourth spring, 3015-Pressure block. Detailed Implementation

[0041] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, so as to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of the present invention.

[0042] Implementation Plan 1

[0043] A multilayer circuit board copper block embedding process, which is used in conjunction with a multilayer circuit board copper block embedding device, such as... Figures 1-9 As shown, the multilayer circuit board copper block embedding device includes a worktable 1, a first support frame 2, a second support frame 3, a grinding rod 2011, a grinding block 2020, a pressure block 3015, a grinding assembly, and a clamping assembly. The first support frame 2 is bolted to the upper center of the worktable 1. The second support frame 3 is bolted to the upper center of the worktable 1, and the second support frame 3 is located inside the first support frame 2. The grinding assembly is connected to the first support frame 2 and the second support frame 3. Several grinding rods 2011 are connected to the grinding assembly, and the grinding rods 2011 are made of wear-resistant material. Four grinding blocks 2020 are connected below the grinding assembly. A clamping assembly is provided between the first support frame 2 and the second support frame 3. Eight pressure blocks 3015 are connected to the clamping assembly. The grinding rod 2011 has a hollow structure, and an opening is provided on one side of the grinding rod 2011 for collecting dust generated during grinding.

[0044] The steps of a multilayer circuit board copper block embedding process are as follows:

[0045] Step one: milling hole, milling hole groove on the circuit board body 4 through milling machine, the size of the hole groove is the same as the copper block;

[0046] Step two: pickling, the circuit board body 4 treated in step one is put into pickling tank for pickling;

[0047] Step three: washing, the circuit board body 4 treated in step two is put into clean water pool for immersion washing;

[0048] Step four: drying, the clean water on the surface of the circuit board body 4 treated in step three is dried;

[0049] Step five: polishing, the horizontal grooves and vertical grooves connected with each other are polished on the hole groove side wall of the circuit board body 4 through polishing assembly;

[0050] Step six: inlaying, the copper block is inlaid into the hole groove of the circuit board body 4;

[0051] Step seven: bonding, the glue is dropped into the horizontal grooves and vertical grooves on the hole groove side wall of the circuit board body 4, so as to bond the copper block on the circuit board body 4;

[0052] Step eight: drying, the glue between the copper block and the circuit board body 4 is dried.

[0053] The polishing assembly comprises four first telescopic cylinders 201, a first linkage block 202, a first motor 203, a cam 204, four first groove polishing units, a second groove polishing unit, a linkage unit and a rotating unit. The four first telescopic cylinders 201 are bolted in the middle of the first support frame 2. The telescopic ends of the four first telescopic cylinders 201 are fixedly connected with the first linkage block 202. The lower middle of the first linkage block 202 is bolted with the first motor 203. The output shaft of the first motor 203 is fixedly connected with the cam 204. The first linkage block 202 is connected with the four first groove polishing units, and the cam 204 is used for continuously driving the four first groove polishing units. The second support frame 3 is connected with the second groove polishing unit. The second groove polishing unit is connected with the linkage unit. Each of the four first groove polishing units is connected with a rotating unit. The rotating unit is used for driving the first groove polishing unit.

[0054] The first grinding groove unit located on the left side comprises a sliding sleeve block 205, a first sliding block 206, a elastic telescopic rod 207, a second linkage block 208, a first connecting block 209, a hollow rod 2010 and a second pipeline 2027; the upper left side of the first linkage block 202 is welded with the sliding sleeve block 205; the inner side of the sliding sleeve block 205 is slidingly connected with the first sliding block 206; the front side and the rear side of the first sliding block 206 are fixedly connected with one elastic telescopic rod 207; the telescopic ends of the two elastic telescopic rods 207 are welded with one second linkage block 208; the second linkage block 208 is welded with the first sliding block 206; the left side of the first sliding block 206 is bolted with the first connecting block 209; the first connecting block 209 is rotatably connected with a plurality of hollow rods 2010; each hollow rod 2010 is communicated with and detachably connected with the corresponding polishing rod 2011; the upper side of each hollow rod 2010 is communicated and bolted with one second pipeline 2027; each second pipeline 2027 is communicated with the corresponding hollow rod 2010, and the powder in the polishing rod 2011 is sucked away through the cooperation of the hollow rod 2010 and the second pipeline 2027.

[0055] The second grinding groove unit comprises a second telescopic cylinder 2012, a second connecting block 2013, a first electric push rod 2014, a third connecting block 2015, a second electric push rod 2016, a third linkage block 2017, a second sliding block 2018, a first spring 2019, a flow guide block 2021 and a first pipeline 2022; the middle part of the second support frame 3 is bolted with the second telescopic cylinder 2012; the telescopic end of the second telescopic cylinder 2012 is fixedly connected with the second connecting block 2013, and the second connecting block 2013 is made of alloy material; the front side, the rear side, the left side and the right side of the second connecting block 2013 are fixedly connected with one first electric push rod 2014; the telescopic end of each of the four first electric push rods 2014 is fixedly connected with one third connecting block 2015; each of the four third connecting blocks 2015 is fixedly connected with one second electric push rod 2016; the telescopic end of each of the four second electric push rods 2016 is fixedly connected with one third linkage block 2017; each of the four third linkage blocks 2017 is slidingly connected with one second sliding block 2018; the upper and lower sides of each of the four second sliding blocks 2018 are welded with one first spring 2019; each first spring 2019 is welded with the corresponding third linkage block 2017; each of the four second sliding blocks 2018 is bolted with the corresponding polishing block 2020; the upper side and the lower side of the polishing block 2020 are welded with one flow guide block 2021, and the powder generated by the polishing of the polishing block 2020 is diffused between the two flow guide blocks 2021; the middle part of the polishing block 2020 is communicated with the first pipeline 2022, and the first pipeline 2022 sucks away the powder diffused between the two flow guide blocks 2021 to avoid the powder from continuing to diffuse into the air.

[0056] The linkage unit comprises a first round rod 2023 and a limiting block 2024; eight first round rods 2023 are welded on the second connecting block 2013; one limiting block 2024 is bolted on each of the eight first round rods 2023; the side surface of the limiting block 2024 close to the corresponding second sliding block 2018 is a bevel; when the movement stroke of the second sliding block 2018 is lengthened, the second sliding block 2018 contacts the bevel of the limiting block 2024, so that the second sliding block 2018 moves downward, cooperates with the first spring 2019, and makes the second sliding block 2018 simultaneously perform vertical reciprocating movement and horizontal reciprocating movement, and further makes the polishing block 2020 polish a larger groove for collecting excess glue.

[0057] The rotating unit comprises a second motor 2025 and a spur gear 2026; the second motor 2025 is bolted on the lower side of the first connecting block 209; the output shaft of the second motor 2025 is fixedly connected with the spur gear 2026; one spur gear 2026 is also fixedly connected on the outer side of the upper part of each hollow rod 2010; every two adjacent spur gears 2026 are engaged.

[0058] First, manually connect the external dust suction pipe to the second pipe 2027 and the first pipe 2022, start the first telescopic cylinder 201, the first telescopic cylinder 201 drives the first linkage block 202 to move downward, the first linkage block 202 drives the parts on it to move downward, the polishing rod 2011 moves to the inside of the hole slot of the circuit board body 4, start the second motor 2025, the second motor 2025 drives the straight gear 2026 to rotate, the straight gear 2026 drives its adjacent straight gear 2026 to rotate, so that the same group of straight gears 2026 rotate at the same time, the hollow rod 2010 is driven to rotate by the straight gear 2026, the polishing rod 2011 is driven to rotate by the hollow rod 2010, start the first motor 203, the first motor 203 drives the cam 204 to rotate, the cam 204 drives the second linkage block 208 to move when rotating, the second linkage block 208 compresses the elastic telescopic rod 207, the second linkage block 208 drives the first sliding block 206 to slide in the sliding sleeve block 205, so that the first sliding block 206 drives the first connecting block 209 to move to the side wall of the hole slot of the circuit board body 4, the first connecting block 209 drives the hollow rod 2010 to move, the hollow rod 2010 drives the polishing rod 2011 to move to the side wall of the hole slot of the circuit board body 4, the polishing rod 2011 is in a rotating state, so that the polishing rod 2011 polishes a vertical groove on the side wall of the hole slot of the circuit board body 4, during polishing, the polishing rod 2011 scrapes the dust generated by polishing into its inside, then the external dust suction pipe inhales air through the second pipe 2027, so that external air flows into the second pipe 2027 through the polishing rod 2011, the hollow rod 2010 and the second pipe 2027 in turn, realizing dust removal effect while polishing, the cam 204 continues to rotate and stops contacting the second linkage block 208, the elastic telescopic rod 207 rebounds and drives the second linkage block 208 to move back to the original position, the second linkage block 208 drives the parts on it to move back to the original position, so that the polishing rod 2011 moves away from the circuit board body 4, then the cam 204 continues to rotate for one revolution, cooperating with the operation of the other three groups of polishing rods 2011, polishing the other three side walls of the hole slot of the circuit board body 4, the cam 204 rotates back to the original position, the first motor 203 and the second motor 2025 are turned off, at this time, a plurality of vertical grooves are formed on the side wall of the hole slot of the circuit board body 4, and the upper end of the groove extends to the upper side of the circuit board body 4, and the lower end of the groove terminates above the lower side of the circuit board body 4, then manually embed the copper block into the hole slot of the circuit board body 4, and then drop glue into the gap between the copper block and the circuit board body 4, the glue flows into the vertical groove on the side wall of the hole slot of the circuit board body 4, fully contacting the circuit board body 4 and the copper block, avoiding the problem that in the prior art, after dropping glue directly into the gap between the copper block and the circuit board body 4, the glue can only penetrate to the upper part of the gap between the copper block and the circuit board body 4, resulting in unstable bonding, and the polishing rod 2011 is a hollow opening structure, so that it can scrape and collect dust while polishing, cooperating with the external dust removal pipe to clean the dust generated during polishing, realizing dust removal effect;

[0059] After the polishing rod 2011 polishes the vertical grooves on the hole groove side wall of the circuit board body 4, the first telescopic cylinder 201 drives the parts on it to move back to the original position, and then the second telescopic cylinder 2012 drives the second connecting block 2013 to move upward, the second connecting block 2013 drives the parts on it to move upward, and the polishing block 2020 moves to the inside of the hole groove of the circuit board body 4, then the second electric push rod 2016 drives the third linkage block 2017 to move linearly, the third linkage block 2017 drives the parts on it to move linearly, and the polishing block 2020 moves linearly, and the first electric push rod 2014 pushes the third connecting block 2015 to move, the third connecting block 2015 drives the parts on it to move, so that the polishing block 2020 moves linearly while moving towards the hole groove side wall of the circuit board body 4, thereby polishing the hole groove side wall of the circuit board body 4 to form a horizontal groove, the horizontal groove penetrates through the vertical grooves in the same column and connects the vertical grooves in the same column together, while polishing, the external dust collection pipe inhales the first pipeline 2022, so that the external air is sequentially discharged into the external dust collection pipe through the polishing block 2020 and the first pipeline 2022, thereby sucking the powder generated during polishing, and at the same time, the airflow is guided by the flow guide block 2021, so that the air flows into the inside of the polishing block 2020 from the contact position between the polishing block 2020 and the circuit board body 4, thereby improving the dust removal effect, then the first electric push rod 2014 drives the third connecting block 2015 to move back to the original position, so that the polishing block 2020 moves away from the circuit board body 4, then the second telescopic cylinder 2012 drives the second connecting block 2013 to move, adjusts the height position of the polishing block 2020, then the first electric push rod 2014 pushes the third connecting block 2015 to move, so that the polishing block 2020 polishes the hole groove side wall of the circuit board body 4 again, and the operation is repeated, a plurality of horizontal grooves are polished on the hole groove side wall of the circuit board body 4, and the horizontal grooves are connected with the vertical grooves, and when the glue is applied, the glue flows into the horizontal grooves through the vertical grooves, increases the amount of glue, and at the same time, also improves the bonding area between the circuit board body 4 and the copper block, further improves the bonding stability of the circuit board body 4 and the copper block;

[0060] When polishing the horizontal groove on the hole groove side wall of the circuit board body 4, the second telescopic cylinder 2012 drives the second connecting block 2013 to move, the second connecting block 2013 drives the parts above it to move, so that the polishing block 2020 is aligned with the lower end of the vertical groove, then the second electric push rod 2016 drives the third linkage block 2017 to move linearly and reciprocally, and increases the movement stroke of the third linkage block 2017, so that the third linkage block 2017 drives the second sliding block 2018 to contact the inclined surface of the limiting block 2024, thereby enabling the second sliding block 2018 to move downward relative to the third linkage block 2017 and compress or stretch the first spring 2019, when the second sliding block 2018 moves back to the middle part, the first spring 2019 rebounds to drive the second sliding block 2018 to move back to the original position, that is, the second sliding block 2018 moves horizontally and reciprocally while moving upward and downward reciprocally, so that the polishing block 2020 polishes a wide and deep horizontal groove on the hole groove side wall of the circuit board body 4, and when in use, the second sliding block 2018 cooperates with the limiting block 2024 to switch the movement mode of the polishing block 2020, so as to polish a wide and deep horizontal groove on the hole groove side wall of the circuit board body 4, and collect more glue, thereby avoiding the problem of difficult manual glue extrusion due to insufficient amount of glue.

[0061] Embodiment 2

[0062] On the basis of Embodiment 1, as shown in Figures 1-2 and Figures 10-11 , the clamping assembly comprises a third support frame 301, a receiving block 302, a fourth connecting block 303, a first clamping block 307, a third circular rod 308, a second clamping block 309, a third spring 3010, a fixing unit and a pressing unit; the upper left part and the upper right part of the workbench 1 are both bolted with a third support frame 301, and the third support frame 301 is made of alloy material; the upper side of each of the two third support frames 301 is welded with a receiving block 302; the upper end of each of the two third support frames 301 is inserted with a fourth connecting block 303; the two fourth connecting blocks 303 are in contact with the corresponding receiving blocks 302; the opposite sides of the two fourth connecting blocks 303 are both bolted with a first clamping block 307; the upper side of each of the two first clamping blocks 307 is welded with two third circular rods 308; each of the two third circular rods 308 is slidably connected with a second clamping block 309 between the front and rear adjacent two third circular rods 308, so as to conveniently clamp the circuit board body 4 through the first clamping block 307 and the second clamping block 309; the two second clamping blocks 309 are in contact with the corresponding first clamping blocks 307; each of the four third circular rods 308 is sleeved with a third spring 3010, the upper end of the third spring 3010 is welded with the corresponding third circular rod 308, and the upper end of the third spring 3010 is welded with the corresponding second clamping block 309; the fourth connecting block 303 is connected with the fixing unit; the second clamping block 309 is connected with the pressing unit.

[0063] The fixing unit comprises a second round rod 304, a second spring 305 and a knob 306; one second round rod 304 is inserted into each of the two fourth connecting blocks 303; the two second round rods 304 are respectively inserted into the corresponding third support frames 301; one knob 306 is welded to the opposite side of each of the two second round rods 304, so that the line board body 4 and the parts thereon can be taken out by manually rotating the knob 306; one second spring 305 is sleeved on each of the two second round rods 304, one end of the second spring 305 is welded to the corresponding fourth connecting block 303, and the other end of the second spring 305 is welded to the corresponding knob 306.

[0064] The pressing unit comprises a fourth linkage block 3011, a fourth round rod 3012, a fifth connecting block 3013 and a fourth spring 3014; one fourth linkage block 3011 is rotatably connected to the middle of the lower side of each of the two first clamping blocks 307; one fourth linkage block 3011 is rotatably connected to the middle of the upper side of each of the two second clamping blocks 309; one fourth round rod 3012 is slidably connected to each of the four fourth linkage blocks 3011, wherein the fourth round rod 3012 can be a round rod or a square rod; one fifth connecting block 3013 is welded to each of the four fourth round rods 3012; one fourth spring 3014 is sleeved on each of the four fourth round rods 3012, one end of the fourth spring 3014 is welded to the corresponding fourth linkage block 3011, and the other end of the fourth spring 3014 is welded to the corresponding fifth connecting block 3013; each fifth connecting block 3013 is boltedly connected to the corresponding pressing block 3015; the pressing blocks 3015 located at the upper side are rotatably connected to the corresponding second clamping blocks 309; the pressing blocks 3015 located at the lower side are rotatably connected to the corresponding first clamping blocks 307.

[0065] After the copper block is inlaid into the line board body 4, the fourth linkage block 3011 is manually rotated by ninety degrees, the fourth linkage block 3011 drives the parts thereon to move, the pressing blocks 3015 away from the fourth connecting block 303 move to the upper side of the copper block, and the pressing blocks 3015 close to the fourth connecting block 303 move to the upper side of the line board body 4, the fourth spring 3014 drives the fifth connecting block 3013 to move downward by the elastic force, the fifth connecting block 3013 drives the fourth round rod 3012 to move downward, the fifth connecting block 3013 drives the pressing blocks 3015 to move downward, so that the pressing blocks 3015 adjacent to each other clamp the copper block and the line board body 4, and the pressing blocks 3015 do not contact the gap between the copper block and the line board, which effectively avoids the problems caused by the spread of glue on the pressing blocks 3015 in the prior art, and the line board body 4 positions the pressing blocks 3015, so that the pressing blocks 3015 are always flush with the line board body 4, which avoids the sliding of the pressing blocks 3015 inside the line board body 4 after the pressing blocks 3015 clamp the copper block, thereby avoiding the deviation phenomenon;

[0066] After the bonding is completed, the push block 306 is manually moved to move the second round rod 304, and the second spring 305 is stretched to move the second round rod 304 away from the third support frame 301. Then the fourth connecting block 303 is manually pushed away from the third support frame 301 to take out the parts thereon, and then the next bonding operation is performed. After the glue is dried, the second clamping block 309 is manually moved upward, the second clamping block 309 slides upward on the third round rod 308, and the third spring 3010 is compressed to stop clamping the circuit board body 4. Then the circuit board body 4 and the copper block are taken out.

[0067] It should be understood that the above description is for illustrative purposes only and is not intended to limit the present application. Those skilled in the art will understand that variations of the present application will be included within the scope of the claims herein.

Claims

1. A method for embedding copper blocks in a multilayer circuit board, characterized in that, This method is used in conjunction with a multilayer circuit board copper block embedding device, which includes a worktable (1), a first support frame (2), a second support frame (3), a grinding rod (2011), a grinding block (2020), a pressure block (3015), a grinding assembly, and a clamping assembly; the first support frame (2) is fixedly connected to the upper middle part of the worktable (1); the second support frame (3) is fixedly connected to the upper middle part of the worktable (1), and the second support frame (3) is located inside the first support frame (2); a grinding assembly for grinding the circuit board body (4) and dust removal is connected to the first support frame (2) and the second support frame (3); several grinding rods (2011) are connected to the upper side of the grinding assembly. 11) Four grinding blocks (2020) are connected to the lower side of the grinding assembly; a vertical groove is ground in the side wall of the hole slot of the circuit board body (4) by the grinding rod (2011), and the vertical groove is used to absorb glue; a horizontal groove is ground in the side wall of the hole slot of the circuit board body (4) by the grinding blocks (2020), and the horizontal groove is used to absorb glue; a clamping assembly is connected to the worktable (1), and the clamping assembly is located between the first support frame (2) and the second support frame (3); eight pressure blocks (3015) are connected to the clamping assembly; the copper block is pressed on the circuit board body (4) by the pressure blocks (3015), and the pressure blocks (3015) are far away from the gap between the copper block and the circuit board body (4); The grinding assembly includes a first telescopic cylinder (201), a first linkage block (202), a first motor (203), a cam (204), a first grinding groove unit, a second grinding groove unit, a linkage unit, and a rotating unit; at least four first telescopic cylinders (201) are fixedly connected to the middle of the first support frame (2); the telescopic end of the first telescopic cylinder (201) is fixedly connected to the first linkage block (202); the lower middle of the first linkage block (202) is fixedly connected to the first motor (203); the output shaft of the first motor (203) is fixedly connected to the cam (204); four first grinding groove units are connected to the first linkage block (202); the second support frame (3) is connected to the second grinding groove unit; the second grinding groove unit is connected to the linkage unit; each of the four first grinding groove units is connected to a rotating unit; the rotating unit is used to drive the first grinding groove unit; The steps of a method for embedding copper blocks in a multilayer circuit board are as follows: Step 1: Milling holes. Using a milling machine, mill holes and grooves into the circuit board body (4). The size of the holes and grooves is the same as that of the copper block. Step 2: Pickling. The circuit board body (4) treated in Step 1 is placed into the pickling tank for pickling. Step 3: Water washing. The circuit board body (4) treated in step 2 is placed in a clean water pool for immersion washing. Step 4: Drying. Dry the surface of the circuit board body (4) treated in Step 3 with clean water. Step 5: Grinding. Using the grinding component, interconnected horizontal and vertical grooves are ground on the side wall of the hole slot in the circuit board body (4). Step 6: Embedding, embedding the copper block into the slot of the circuit board body (4); Step 7: Adhesion. Apply glue to the horizontal and vertical grooves on the sidewall of the hole slot of the circuit board body (4) to bond the copper block to the circuit board body (4). Step 8: Drying. Dry the glue between the copper block and the circuit board body (4).

2. The method for embedding copper blocks in a multilayer circuit board according to claim 1, characterized in that: The grinding rod (2011) has a hollow structure, and an opening is provided on one side of the grinding rod (2011) to collect the dust generated during grinding.

3. The method for embedding copper blocks in a multilayer circuit board according to claim 1, characterized in that: The first grinding groove unit located on the left includes a sliding sleeve block (205), a first slider (206), a spring telescopic rod (207), a second linkage block (208), a first connecting block (209), a hollow rod (2010), and a second pipe (2027); the sliding sleeve block (205) is fixedly connected to the upper left side of the first linkage block (202); the first slider (206) is slidably connected to the inner side of the sliding sleeve block (205); a spring telescopic rod (207) is fixedly connected to both the front and rear sides of the first slider (206); the extension and retraction of the two spring telescopic rods (207) A second linkage block (208) is fixedly connected between the ends; the second linkage block (208) is fixedly connected to the first slider (206); a first connecting block (209) is fixedly connected to the left side of the first slider (206); a number of hollow rods (2010) are rotatably connected to the first connecting block (209); each hollow rod (2010) is connected to the corresponding grinding rod (2011); a second pipe (2027) is connected to the upper side of each hollow rod (2010); each second pipe (2027) is connected to the corresponding hollow rod (2010).

4. The method for embedding copper blocks in a multilayer circuit board according to claim 3, characterized in that: The second grinding unit includes a second telescopic cylinder (2012), a second connecting block (2013), a first electric push rod (2014), a third connecting block (2015), a second electric push rod (2016), a third linkage block (2017), a second slider (2018), a first spring (2019), a guide block (2021), and a first pipe (2022); at least one second telescopic cylinder (2012) is fixedly connected to the middle of the second support frame (3); the telescopic end of the second telescopic cylinder (2012) is fixedly connected to the second connecting block (2013); a first electric push rod (2014) is fixedly connected to the front, rear, left, and right sides of the second connecting block (2013); a third connecting block (2015) is fixedly connected to the telescopic end of each of the four first electric push rods (2014). 015); a second electric push rod (2016) is fixedly connected to each of the four third connecting blocks (2015); a third linkage block (2017) is fixedly connected to the telescopic end of each of the four second electric push rods (2016); a second slider (2018) is slidably connected to each of the four third linkage blocks (2017); a first spring (2019) is fixedly connected to the upper and lower sides of each of the four second sliders (2018); each first spring (2019) is fixedly connected to the corresponding third linkage block (2017); each of the four second sliders (2018) is fixedly connected to the corresponding grinding block (2020); a guide block (2021) is fixedly connected to the upper and lower sides of the grinding block (2020); at least one first pipe (2022) is connected to the middle of the grinding block (2020).

5. The method for embedding copper blocks in a multilayer circuit board according to claim 4, characterized in that: The linkage unit includes a first round rod (2023) and a limiting block (2024); eight first round rods (2023) are fixedly connected to the second connecting block (2013); and a limiting block (2024) is fixedly connected to each of the eight first round rods (2023).

6. The method for embedding copper blocks in a multilayer circuit board according to claim 5, characterized in that: The lower part of the side of the limiting block (2024) near the corresponding second slider (2018) is inclined, which is used to cooperate with the second slider (2018).

7. The method for embedding copper blocks in a multilayer circuit board according to claim 1, characterized in that: The clamping assembly includes a third support frame (301), a receiving block (302), a fourth connecting block (303), a first clamping block (307), a third round rod (308), a second clamping block (309), a third spring (3010), a fixing unit, and a clamping unit; a third support frame (301) is fixedly connected to the upper left and upper right sides of the worktable (1); a receiving block (302) is fixedly connected to the upper side of each of the two third support frames (301); a fourth connecting block (303) is inserted into the upper end of each of the two third support frames (301); the two fourth connecting blocks (303) are in contact with the corresponding receiving blocks (302); the two fourth connecting blocks (303) are fixedly connected to each other on opposite sides. There is a first clamping block (307); two third round rods (308) are fixedly connected to the upper side of each of the two first clamping blocks (307); a second clamping block (309) is slidably connected between each pair of adjacent third round rods (308); the two second clamping blocks (309) are in contact with the corresponding first clamping blocks (307); a third spring (3010) is sleeved on each of the four third round rods (308), the upper end of the third spring (3010) is fixedly connected to the corresponding third round rod (308), and the upper end of the third spring (3010) is fixedly connected to the corresponding second clamping block (309); a fixing unit is connected to the fourth connecting block (303); a pressing unit is connected to the second clamping block (309).

8. The method for embedding copper blocks in a multilayer circuit board according to claim 7, characterized in that: The fixing unit includes a second round rod (304), a second spring (305), and a lever (306); a second round rod (304) is inserted into each of the two fourth connecting blocks (303); the two second round rods (304) are respectively inserted into the corresponding third support frame (301); a lever (306) is fixedly connected to the opposite side of each of the two second round rods (304); a second spring (305) is sleeved on each of the two second round rods (304), one end of the second spring (305) is fixedly connected to the corresponding fourth connecting block (303), and the other end of the second spring (305) is fixedly connected to the corresponding lever (306).

9. The method for embedding copper blocks in a multilayer circuit board according to claim 8, characterized in that: The clamping unit includes a fourth linkage block (3011), a fourth round rod (3012), a fifth connecting block (3013), and a fourth spring (3014); a fourth linkage block (3011) is rotatably connected to the lower center of each of the two first clamping blocks (307); a fourth linkage block (3011) is also rotatably connected to the upper center of each of the two second clamping blocks (309); a fourth round rod (3012) is slidably connected to each of the four fourth linkage blocks (3011); and a fifth connecting block (3013) is fixedly connected to each of the four fourth round rods (3012). Each of the four fourth round rods (3012) is fitted with a fourth spring (3014). One end of the fourth spring (3014) is fixedly connected to the corresponding fourth linkage block (3011), and the other end of the fourth spring (3014) is fixedly connected to the corresponding fifth connecting block (3013). Each fifth connecting block (3013) is fixedly connected to the corresponding pressure block (3015). The upper pressure block (3015) is rotatably connected to the corresponding second clamping block (309). The lower pressure block (3015) is rotatably connected to the corresponding first clamping block (307).

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