Air-cooled liquid-cooled combined electronic equipment heat dissipation device

Abstract

The application provides a combined air-cooled and liquid-cooled electronic equipment heat dissipation device, which comprises a basic heat dissipation mechanism and a combined heat dissipation mechanism cooperating with the basic heat dissipation mechanism; the basic heat dissipation mechanism comprises a condenser, a heat dissipation fan, a refrigerant pipeline and an evaporating end liquid cooling plate; the condenser is connected with the heat dissipation fan and the refrigerant pipeline; one end of the refrigerant pipeline is connected with the heat dissipation fan, and the other end is connected with the evaporating end liquid cooling plate; the evaporating end liquid cooling plate is in contact with an electronic equipment to dissipate heat of the electronic equipment; the combined heat dissipation mechanism comprises a combined heat pipe radiator, a combined micro-channel cooling plate radiator, a liquid storage tank and a peristaltic pump. The combined air-cooled and liquid-cooled cooling mode is adopted, different combined modes are adopted for different power consumption and heat flux density exchange chips, the total heat dissipation effect can be significantly improved, the chip temperature can be reduced, the chip temperature consistency can be improved, and the deformation problem caused by uneven distribution of chip thermal stress can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation devices, in particular to a wind-cooled and liquid-cooled combined electronic device heat dissipation device. BACKGROUND

[0002] At present, in the traditional design, the chip mainly relies on two ways to achieve the purpose of heat dissipation: one is wind cooling, a large power fan is installed on the radiator to improve the heat dissipation effect by forced air cooling, but due to the size and service life limitations of the radiator, the heat dissipation effect and reliability will be greatly reduced due to the failure of the fan; the other is liquid cooling, usually a refrigerant is arranged on the surface of the chip for heat dissipation, in order to ensure the heat dissipation effect, the liquid cooling device is generally large in size, which has many limitations in transportation and installation, and cannot adjust the refrigerant flow according to the actual needs, and the heat dissipation effect is poor. SUMMARY

[0003] The purpose of the present application is to provide a wind-cooled and liquid-cooled combined electronic device heat dissipation device to solve the problem of low chip heat dissipation efficiency and inability to adjust in the prior art.

[0004] The present application provides a wind-cooled and liquid-cooled combined electronic device heat dissipation device, comprising:

[0005] A basic heat dissipation mechanism, the basic heat dissipation mechanism comprises a condenser, a heat dissipation fan, a refrigerant pipeline and an evaporation end liquid cooling plate, wherein the condenser is connected with the heat dissipation fan and the refrigerant pipeline, one end of the refrigerant pipeline is connected with the heat dissipation fan, and the other end is connected with the evaporation end liquid cooling plate;

[0006] The evaporation end liquid cooling plate is in contact with the electronic device for heat dissipation of the electronic device;

[0007] A combined heat dissipation mechanism cooperating with the basic heat dissipation mechanism, the combined heat dissipation mechanism comprises a combined heat pipe radiator, a combined micro-channel cold plate radiator, a liquid storage tank and a peristaltic pump; wherein the combined heat pipe radiator and the combined micro-channel cold plate radiator are respectively connected with the evaporation end liquid cooling plate for heat dissipation of the electronic device, the liquid storage tank and the peristaltic pump are arranged on the refrigerant pipeline for adjusting the refrigerant flow in the refrigerant pipeline.

[0008] In one possible implementation of the present application, the combined heat dissipation mechanism cooperating with the basic heat dissipation mechanism comprises four combined forms, specifically comprising:

[0009] A single combined heat pipe radiator is combined with the basic heat dissipation mechanism to dissipate heat of the electronic device; and

[0010] The single combined micro-channel cold plate radiator is combined with the basic heat dissipation mechanism to dissipate heat of the electronic device; and

[0011] The combined heat pipe radiator with a liquid storage tank and a peristaltic pump is combined with the basic heat dissipation mechanism to dissipate heat of the electronic device; and

[0012] The combined micro-channel cold plate radiator with a liquid storage tank and a peristaltic pump is combined with the basic heat dissipation mechanism to dissipate heat of the electronic device.

[0013] In a possible implementation of the present application, the four combinations correspond to different power consumption heat flow density combinations of the electronic device, wherein the power consumption heat flow density combinations correspond to four groups of combinations, and the electronic device includes a high-power chip.

[0014] In a possible implementation of the present application, the single combined heat pipe radiator combined with the basic heat dissipation mechanism corresponds to a first power consumption heat flow density combination, and the single combined micro-channel cold plate radiator combined with the basic heat dissipation mechanism to dissipate heat of the electronic device corresponds to a third power consumption heat flow density combination, wherein the power consumption value of the third power consumption heat flow density combination is greater than that of the first power consumption heat flow density combination.

[0015] In a possible implementation of the present application, the combined heat pipe radiator with a liquid storage tank and a peristaltic pump combined with the basic heat dissipation mechanism to dissipate heat of the electronic device corresponds to a second power consumption heat flow density combination, and the combined micro-channel cold plate radiator with a liquid storage tank and a peristaltic pump combined with the basic heat dissipation mechanism corresponds to a fourth power consumption heat flow density combination, wherein the power consumption value of the fourth power consumption heat flow density combination is greater than that of the second power consumption heat flow density combination.

[0016] In a possible implementation of the present application, the air-cooled liquid-cooled combined electronic device heat dissipation device further includes a temperature control sensor, wherein the temperature control sensor is used to monitor the refrigerant temperature in the refrigerant pipeline and adjust the refrigerant flow when the refrigerant temperature reaches a target temperature value, and the target temperature value is 90°C.

[0017] In a possible implementation of the present application, the peristaltic pump adopts an N+1 redundancy structure for adjusting the number of the peristaltic pump.

[0018] In a possible implementation of the present application, the combined heat pipe radiator and the combined micro-channel cold plate radiator are connected to the evaporation end liquid cooling plate through a preset connecting mechanism and a heat conduction interface material.

[0019] In a possible implementation of the present application, the connecting mechanism includes a bolt and nut fastening mechanism.

[0020] In a possible implementation of the present application, the heat-conducting interface material comprises a heat-conducting phase change material.

[0021] As described above, the air-cooled liquid-cooled combined electronic equipment heat dissipation device of the present application adopts an air-cooled and liquid-cooled combined cooling mode, different combinations are adopted for different power consumption and heat flux density exchange chips, which can significantly improve the total heat dissipation effect, reduce the chip temperature and improve the chip temperature consistency, and avoid the deformation problem caused by uneven distribution of chip thermal stress. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 FIG. 7 shows a structure schematic diagram of the combined heat pipe radiator of the air-cooled liquid-cooled combined electronic equipment heat dissipation device of the present application in an embodiment combined with the basic heat dissipation mechanism;

[0023] Figure 2 FIG. 8 shows a structure schematic diagram of the combined micro-channel cold plate radiator of the air-cooled liquid-cooled combined electronic equipment heat dissipation device of the present application in an embodiment combined with the basic heat dissipation mechanism;

[0024] Figure 3 FIG. 9 shows a structure schematic diagram of the combined heat pipe radiator of the air-cooled liquid-cooled combined electronic equipment heat dissipation device of the present application in an embodiment combined with the basic heat dissipation mechanism and the liquid storage tank and peristaltic pump;

[0025] Figure 4 FIG. 10 shows a structure schematic diagram of the combined micro-channel cold plate radiator of the air-cooled liquid-cooled combined electronic equipment heat dissipation device of the present application in an embodiment combined with the basic heat dissipation mechanism and the liquid storage tank and peristaltic pump;

[0026] Figure 5 FIG. 11 shows a heat-conducting interface connection structure schematic diagram of the air-cooled liquid-cooled combined electronic equipment heat dissipation device of the present application in an embodiment.

[0027] ELEMENT NUMBER EXPLANATION

[0028] 1 condenser

[0029] 2 heat dissipation fan

[0030] 3 refrigerant pipeline

[0031] 4 evaporation end liquid-cooled plate

[0032] 5 electronic equipment

[0033] 6 combined heat pipe radiator

[0034] 7 combined micro-channel cold plate radiator

[0035] 8. Liquid storage tank

[0036] 9. Peristaltic pump

[0037] 10 Thermal interface materials Detailed Implementation

[0038] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0039] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0040] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0041] Please see Figures 1-4 This application proposes a combined air-cooled and liquid-cooled electronic device heat dissipation device, comprising: a basic heat dissipation mechanism, which includes a condenser 1, a cooling fan 2, a refrigerant pipeline 3, and an evaporator-end liquid cooling plate 4; wherein the condenser 1 is connected to the cooling fan 2 and the refrigerant pipeline 3, one end of the refrigerant pipeline 3 is connected to the cooling fan 2, and the other end is connected to the evaporator-end liquid cooling plate 4; the evaporator-end liquid cooling plate 4 abuts against an electronic device 5 for heat dissipation; and a combined heat dissipation mechanism cooperating with the basic heat dissipation mechanism, which includes a combined heat pipe radiator 6, a combined microchannel cold plate radiator 7, a liquid storage tank 8, and a peristaltic pump 9; wherein the combined heat pipe radiator 6 and the combined microchannel cold plate radiator 7 are respectively connected to the evaporator-end liquid cooling plate 4 for heat dissipation of the electronic device 5, and the liquid storage tank 8 and the peristaltic pump 9 are disposed on the refrigerant pipeline 3 for adjusting the refrigerant flow rate in the refrigerant pipeline.

[0042] Specifically, the combined heat dissipation mechanism cooperating with the basic heat dissipation mechanism includes four combined forms, specifically including: a single combined heat pipe radiator 6 is combined with the basic heat dissipation mechanism to dissipate heat for the electronic device 5; and a single combined micro-channel cold plate radiator 7 is combined with the basic heat dissipation mechanism to dissipate heat for the electronic device 5; and the combined heat pipe radiator 6 is combined with the basic heat dissipation mechanism with a liquid storage tank 8 and a peristaltic pump 9 to dissipate heat for the electronic device 5; and the combined micro-channel cold plate radiator 7 is combined with the basic heat dissipation mechanism with a liquid storage tank 8 and a peristaltic pump 9 to dissipate heat for the electronic device 5.

[0043] It should be noted that the four combined forms correspond to different power consumption heat flux density combinations of the electronic device respectively, wherein the power consumption heat flux density combinations correspond to four combinations, and the electronic device includes a high-power chip. The embodiments of the present application will be described taking the high-power chip as an example.

[0044] Specifically, as shown in Figure 1 , a structure schematic diagram of the single combined heat pipe radiator 6 combined with the basic heat dissipation mechanism is shown. Accordingly, Figure 1 , the power consumption heat flux density combination is the first power consumption heat flux density combination; as shown in Figure 3 , a structure schematic diagram of the single combined micro-channel cold plate radiator 7 combined with the basic heat dissipation mechanism is shown. Accordingly, Figure 3 , the power consumption heat flux density is the third power consumption heat flux density combination; wherein the power consumption value of the third power consumption heat flux density combination is greater than that of the first power consumption heat flux density combination.

[0045] Further, as shown in Figure 2 , a structure schematic diagram of the combined heat pipe radiator 6 combined with the basic heat dissipation mechanism with a liquid storage tank 8 and a peristaltic pump 9 is shown. Accordingly, Figure 2 , the power consumption heat flux density is the second power consumption heat flux density combination; as shown in Figure 4 , a structure schematic diagram of the combined micro-channel cold plate radiator 7 combined with the basic heat dissipation mechanism with a liquid storage tank 8 and a peristaltic pump 9 is shown. Accordingly, Figure 4 , the power consumption heat flux density is the fourth power consumption heat flux density combination; wherein the power consumption value of the fourth power consumption heat flux density combination is greater than that of the second power consumption heat flux density combination. At this point, the relationship of the four power consumption heat flux density combinations is: the power consumption value of the first power consumption heat flux density combination is less than that of the second power consumption heat flux density combination, the power consumption value of the second power consumption heat flux density combination is less than that of the third power consumption heat flux density combination, and the power consumption value of the third power consumption heat flux density combination is less than that of the fourth power consumption heat flux density combination.

[0046] Furthermore, in one embodiment of the invention, the air-cooled and liquid-cooled combined electronic device heat dissipation device further includes a temperature control sensor (not shown in the figure), wherein the temperature control sensor is used to monitor the refrigerant temperature in the refrigerant pipeline and adjust the refrigerant flow rate when the refrigerant temperature reaches a target temperature value, wherein the target temperature value is 90°C.

[0047] It should be noted that, since the above embodiments describe the peristaltic pump adjusting the refrigerant flow rate in the refrigerant pipeline using a liquid storage tank, specific adjustments can be made using a temperature control sensor. During application, the temperature control sensor monitors the refrigerant temperature in the refrigerant pipeline in real time. When the refrigerant temperature reaches 90°C, adjustments are required. At this time, the refrigerant flow rate in the refrigerant pipeline is increased to improve the heat dissipation performance for high-power chips.

[0048] Furthermore, in one embodiment of the invention, the peristaltic pump adopts an N+1 redundant structure to adjust the number of peristaltic pumps.

[0049] It should be noted that, Figure 2 and Figure 4 The peristaltic pump 9 used in the process adopts an N+1 redundant structure, so that the number of peristaltic pumps 9 can be increased as needed to better adapt to different heat dissipation requirements. For example, setting "3" peristaltic pumps 9 can increase the flow rate of refrigerant more quickly, thereby increasing the heat dissipation effect.

[0050] Furthermore, in one embodiment of the invention, the combined heat pipe radiator 6 and the combined microchannel cold plate radiator 7 are connected to the evaporation end liquid cooling plate 4 through a preset connecting mechanism and a thermally conductive interface material 10.

[0051] It should be noted that, as Figure 5 As shown, taking the combination of a single combined heat pipe radiator 6 and the basic heat dissipation mechanism as an example, the combined heat pipe radiator 6 is fastened by a bolt and nut fastening mechanism ( Figure 5 (Not shown in the figure) is connected to the evaporation end liquid cooling plate 4 in the basic heat dissipation mechanism, wherein the connection gap is filled with a thermally conductive interface material 10, which includes a thermally conductive phase change material.

[0052] In summary, this invention employs a combination of air cooling and liquid cooling, using different combinations for exchange chips with different power consumption and heat flux density. This significantly improves the overall heat dissipation effect, reduces chip temperature, and thus enhances chip temperature uniformity, avoiding deformation problems caused by uneven distribution of thermal stress in the chip.

[0053] The descriptions of the processes or structures corresponding to the above figures each have their own emphasis. For parts of a process or structure that are not described in detail, please refer to the relevant descriptions of other processes or structures.

[0054] The above embodiments are only illustrative of the principles and effects of the present application, and are not intended to limit the present application. Any modification or change made by those skilled in the art without departing from the spirit and scope of the present application shall be covered by the claims of the present application.

Claims

1. A combined air-cooled and liquid-cooled heat dissipation device for electronic equipment, characterized in that, include: The basic heat dissipation mechanism includes a condenser, a cooling fan, refrigerant piping, and an evaporator-end liquid cooling plate. The condenser is connected to the cooling fan and the refrigerant piping. One end of the refrigerant piping is connected to the cooling fan, and the other end is connected to the evaporator-end liquid cooling plate. The evaporator end liquid cooling plate is in contact with the electronic device and is used to dissipate heat from the electronic device; A combined heat dissipation mechanism, in conjunction with the basic heat dissipation mechanism, includes a combined heat pipe radiator, a combined microchannel cold plate radiator, a liquid storage tank, and a peristaltic pump. The combined heat pipe radiator and the combined microchannel cold plate radiator are respectively connected to the evaporator-end liquid cooling plate for heat dissipation of the electronic device. The liquid storage tank and the peristaltic pump are disposed on the refrigerant pipeline for adjusting the refrigerant flow rate. The combined heat dissipation mechanism in conjunction with the basic heat dissipation mechanism includes four combination forms: a single combined heat pipe radiator combined with the basic heat dissipation mechanism for heat dissipation of the electronic device; a single combined microchannel cold plate radiator combined with the basic heat dissipation mechanism for heat dissipation of the electronic device; and a combined heat pipe radiator combined with a liquid storage tank and a peristaltic pump combined with the basic heat dissipation mechanism for heat dissipation of the electronic device. The combined microchannel cold plate radiator, along with a liquid reservoir and a peristaltic pump, is integrated with the basic heat dissipation mechanism to dissipate heat from the electronic device. Specifically, a single combined heat pipe radiator integrated with the basic heat dissipation mechanism corresponds to a first power consumption heat flux density combination; a single combined microchannel cold plate radiator integrated with the basic heat dissipation mechanism corresponds to a third power consumption heat flux density combination, where the power consumption of the third power consumption heat flux density combination is greater than that of the first power consumption heat flux density combination; a combined heat pipe radiator integrated with a liquid reservoir and a peristaltic pump integrated with the basic heat dissipation mechanism corresponds to a second power consumption heat flux density combination; and a combined microchannel cold plate radiator integrated with a liquid reservoir and a peristaltic pump integrated with the basic heat dissipation mechanism corresponds to a fourth power consumption heat flux density combination, where the power consumption of the fourth power consumption heat flux density combination is greater than that of the second power consumption heat flux density combination.

2. The air-cooled and liquid-cooled combined electronic device heat dissipation device according to claim 1, characterized in that, The four combinations correspond to different power consumption and heat flux density combinations of the electronic device, wherein there are four sets of power consumption and heat flux density combinations, and the electronic device includes a high-power chip.

3. The air-cooled and liquid-cooled combined electronic device heat dissipation device according to claim 2, characterized in that, The air-cooled and liquid-cooled combined electronic device heat dissipation device also includes a temperature control sensor, wherein the temperature control sensor is used to monitor the refrigerant temperature in the refrigerant pipeline and adjust the refrigerant flow rate when the refrigerant temperature reaches a target temperature value, wherein the target temperature value is 90°C.

4. The air-cooled and liquid-cooled combined electronic device heat dissipation device according to claim 1, characterized in that, The peristaltic pump adopts an N+1 redundancy structure to adjust the number of peristaltic pumps.

5. The air-cooled and liquid-cooled combined electronic device heat dissipation device according to claim 1, characterized in that, The combined heat pipe radiator and the combined microchannel cold plate radiator are connected to the evaporation end liquid cooling plate through a preset connecting mechanism and a thermally conductive interface material.

6. The air-cooled and liquid-cooled combined electronic device heat dissipation device according to claim 5, characterized in that, The connection mechanism includes a bolt and nut fastening mechanism.

7. The air-cooled and liquid-cooled combined electronic device heat dissipation device according to claim 5, characterized in that, The thermally conductive interface material includes a thermally conductive phase change material.

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