Induction device

Abstract

The present application proposes an introduction device, comprising a first mold body and a second mold body. The first mold body is provided with a receiving groove for placing the material to be injected with glue; the second mold body is provided with a glue injection groove and a glue injection hole connected to the glue injection groove. The glue injection groove is adapted to the receiving groove. The glue injection groove is used to accommodate the glue injected through the glue injection hole to form a protective layer on the material, and the wall surface of the glue injection groove is provided with a first non-stick layer to prevent the protective layer from adhering to the second mold body. The present application forms a protective layer on the material by cooperating with the first mold body and the wall surface of the glue injection groove is provided with the first non-stick layer. The molten glue will not corrode the first non-stick layer, thereby improving the service life of the introduction device.

Description

Technical Field

[0001] The present application relates to the technical field of glue filling, and in particular to an introduction device. Background Art

[0002] At present, in order to improve the service life and use effect of display screens, display screens are glued. The material commonly used for glue filling is epoxy resin glue. This is because epoxy resin glue has good adhesion to hard materials, high hardness, and good insulation performance.

[0003] Existing low-pressure injection molds are equipped with silicone cushioning components. These cushioning components are used to cushion the impact of the mold during closing and sealing. They also create a sealed environment for the display screen's glue filling process. However, epoxy resin can corrode the silicone cushioning components, shortening the mold's service life. Summary of the Invention

[0004] In view of the above, it is necessary to propose an introduction device to solve the technical problem of the low service life of the above-mentioned low-pressure injection mold.

[0005] The present application provides an introduction device, comprising: a first mold body, provided with a receiving groove for placing the material to be poured with glue; a second mold body, provided with a glue injection groove, and a glue injection hole connected to the glue injection groove, the glue injection groove is adapted to the receiving groove, the glue injection groove is used to accommodate the glue injected through the glue injection hole to form a protective layer on the material, and the wall surface of the glue injection groove is provided with a first non-stick layer to prevent the protective layer from adhering to the second mold body.

[0006] In some embodiments, a second non-stick layer is disposed on a side of the second mold body facing the first mold body.

[0007] In some embodiments, the first non-stick layer and the second non-stick layer are made of Teflon.

[0008] In some embodiments, the introduction device further includes: a first buffer member embedded in a side of the first mold body facing the second mold body, and the first buffer member is arranged around the accommodating groove.

[0009] In some embodiments, a portion of the first buffer member extends into the receiving groove to position the material placed in the receiving groove.

[0010] In some embodiments, the accommodating groove includes a positioning groove and a transition groove, the positioning groove is used to place materials, the transition groove is arranged around the positioning groove, and the transition groove is used to accommodate part of the first buffer member.

[0011] In some embodiments, a clamping groove for clamping a workpiece is provided on a side of the first buffer member facing the material.

[0012] In some embodiments, the upper surface of the first buffer member is higher than the upper surface of the portion of the material in the receiving groove adjacent to the buffer member.

[0013] In some embodiments, the introduction device comprises:

[0014] The rotating member is rotatably connected to the second mold body and can be snapped onto a side of the first mold body facing away from the second mold body, so that the second mold body is connected to the first mold body.

[0015] In some embodiments, a vent hole is provided on the second mold body, and the vent hole is spaced apart from the glue injection hole.

[0016] In the above-mentioned introduction device, the first mold body places the material through the receiving groove. After the second mold body is molded with the first mold body, the receiving groove is connected to the glue injection groove. The molten glue flows into the glue injection groove through the glue injection hole. The glue injection groove accommodates the glue injected through the glue injection hole to form a protective layer on the material. The wall surface of the glue injection groove is provided with a first non-stick layer to prevent the protective layer from adhering to the second mold body, thereby facilitating the demolding of the protective layer. In this application, the first mold body and the second mold body are matched to form a protective layer on the material, and the wall surface of the glue injection groove is provided with a first non-stick layer. The molten glue will not corrode the first non-stick layer, thereby improving the service life of the introduction device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the three-dimensional structure of the introduction device provided in an embodiment of the present application.

[0018] Figure 2 for Figure 1 A partial cross-sectional view of the induction device is shown.

[0019] Figure 3 for Figure 2 An enlarged view of a portion of the induction device is shown.

[0020] Figure 4 for Figure 1 The three-dimensional exploded view of the introduction device is shown.

[0021] Figure 5 for Figure 1 The three-dimensional structural diagram of the first mold body and the first buffer member is shown.

[0022] Figure 6 for Figure 1 The schematic diagram of the three-dimensional structure of the second mold body, the second buffer member and the rotating member is shown.

[0023] Figure 7 for Figure 6 The diagram shows a three-dimensional structure of the second mold body, the second buffer component and the rotating component from another angle.

[0024] Description of main component symbols

[0025] Induction device 100

[0026] First mold body 10

[0027] Accommodation tank 11

[0028] Positioning slot 111

[0029] Transition trough 112

[0030] Second phantom 20

[0031] Glue injection groove 21

[0032] Glue injection hole 22

[0033] First non-stick layer 23

[0034] Second non-stick layer 24

[0035] Exhaust hole 25

[0036] First buffer member 30

[0037] Holding slot 31

[0038] Second buffer member 40

[0039] Rotating member 50

[0040] Rotating portion 51

[0041] Connecting portion 52

[0042] Buckle portion 53

[0043] Material 200

[0044] Protective layer 201 DETAILED DESCRIPTION

[0045] In order to more clearly understand the purpose, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application. The embodiments described are only a part of the embodiments of the present application, rather than all of the embodiments.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0048] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims rather than the foregoing description, and all variations that come within the meaning and range of equivalents of the claims are intended to be embraced herein.

[0049] The present application provides an introduction device, comprising: a first mold body, provided with a receiving groove for placing the material to be poured with glue; a second mold body, provided with a glue injection groove, and a glue injection hole connected to the glue injection groove, the glue injection groove is adapted to the receiving groove, the glue injection groove is used to accommodate the glue injected through the glue injection hole to form a protective layer on the material, and the wall surface of the glue injection groove is provided with a first non-stick layer to prevent the protective layer from adhering to the second mold body.

[0050] The present application forms a protective layer on the material by cooperating with the first mold body and the second mold body, and the wall surface of the glue injection groove is provided with a first non-stick layer, and the molten glue will not corrode the non-stick layer, thereby improving the service life of the introduction device.

[0051] The embodiments of the present application are further described below with reference to the accompanying drawings.

[0052] See also Figure 1-Figure 2, an embodiment of the present application provides an introduction device 100, which is used to clamp a material 200 to be glued, and to perform glue filling on the clamped material 200, and to connect the glue with the material 200 in the introduction device 100 after curing, so that a protective layer 201 is formed on the surface of the material 200. Specifically, the material 200 can be a display panel, a touch panel, etc. of an electronic product. It can be understood that electronic products include but are not limited to mobile phones and tablet computers. In this embodiment, the material of the protective layer 201 is epoxy resin (Phenolic epoxy resin), and the protective layer 201 has good adhesion properties, so that the protective layer 201 is stably adhered to the surface of the material 200. Moreover, during the glue pouring process, the molten glue can be evenly spread on the surface of the material 200, so that the molten glue and the material 200 have better bonding. Therefore, after the molten glue solidifies, the sealing between the protective layer 201 and the material 200 is also better, so that the material 200 with the protective layer 201 has good waterproof properties. At the same time, because the protective layer 201 and the material 200 have good bonding properties, the material 200 with the protective layer 201 has good anti-drop performance.

[0053] The introduction device 100 includes a first mold body 10 and a second mold body 20, which are adapted to fit together. The first mold body 10 is provided with a receiving groove 11 for placing the material 200 to be injected with glue. The second mold body 20 is provided with a glue injection groove 21 and a glue injection hole 22. The glue injection groove 21 is adapted to fit the receiving groove 11. The glue injection groove 21 is used to inject glue onto the material 200 and form a protective layer 201 on the surface of the material 200. The glue injection hole 22 is connected to the side of the glue injection groove 21 facing away from the receiving groove 11. Molten glue flows into the glue injection groove 21 through the glue injection hole 22. The glue injection groove 21 accommodates the glue injected through the glue injection hole 22, thereby forming a protective layer 201 on the surface of the material 200. The wall surface of the glue injection groove 21 is provided with a first non-stick layer 23. The first non-stick layer 23 is not corroded by the molten glue, thereby preventing the molten glue from corroding the second mold body 20, thereby improving the service life of the introduction device 100. At the same time, the first non-stick layer 23 is provided so that when the second mold body 20 is separated from the first mold body 10, the cured rubber can be separated from the second mold body 20 and will not adhere to the second mold body 20, thereby ensuring that the cured protective layer 201 has better quality, and further in the subsequent assembly process, there is no need to reprocess the protective layer 201.

[0054] The implementation process of the embodiment of the present application is as follows: first, the material 200 to be glued is placed in the receiving groove 11, and the first mold body 10 carries the material 200; then the second mold body 20 and the first mold body 10 are molded together; then, the molten glue is transported to the glue injection groove 21 through the glue injection hole 22, and the glue injection groove 21 accommodates the glue injected through the glue injection hole 22 to form a protective layer 201 on the surface of the material 200. The first non-stick layer 23 of the second mold body 20 is in contact with the molten glue, and the first non-stick layer 23 will not be corroded by the molten glue, thereby protecting the second mold body 20; finally, after the protective layer 201 on the material 200 is cured, the first mold body 10 and the second mold body 20 are opened, and the material 200 connected with the protective layer 201 is taken out.

[0055] In some embodiments, see Figure 3 A second non-stick layer 24 is provided on a side of the second mold body 20 facing the first mold body 10, and the second non-stick layer 24 is connected to the first non-stick layer 23. When the first mold body 10 and the second mold body 20 are closed, the second non-stick layer 24 contacts the first mold body 10 to prevent the molten glue from overflowing and adhering to the closing point of the first mold body 10 and the second mold body 20 during glue injection. Therefore, when the second mold body 20 is separated from the first mold body 10, the second mold body 20 can be effectively separated from the protective layer 201, and the second mold body 20 is prevented from tearing the protective layer 201 due to the adhesive when separating from the first mold body 10, resulting in poor surface quality of the protective layer 201. Specifically, the material of the first non-stick layer 23 and the second non-stick layer 24 is Teflon (Teflon or PTFE), which has excellent chemical stability, corrosion resistance, sealing, high lubricity and non-stickiness, electrical insulation and good anti-aging resistance, thereby preventing the molten glue forming the protective layer 201 from corroding the first mold body 10 and the second mold body 20, thereby protecting the first mold body 10 and the second mold body 20 to increase the service life of the introduction device 100.

[0056] See also Figure 4 and Figure 5 The introduction device 100 also includes a first buffer member 30, which is embedded in the side of the first mold body 10 facing the second mold body 20, and the first buffer member 30 is arranged around the receiving groove 11. In this way, the first buffer member 30 can position the material 200 placed in the receiving groove 11, so that the introduction device 100 can accurately perform glue filling on the material 200 to be filled with glue. The material 200 includes a component made of glass material, and the first buffer member 30 can prevent the material 200 from colliding with the first mold body 10, thereby preventing the material 200 from being damaged. Among them, the first buffer member 30 can be made of silicone material, and the silicone can be 4-methylpentene (TPX, 4-methylpentene-1) or cycloolefin copolymers (COC, copolymers of cycloolefin), etc.

[0057] Specifically, see Figure 3 Part of the first buffer member 30 extends into the receiving groove 11. When the material 200 to be glued is placed in the receiving groove 11, the part of the first buffer member 30 extending into the receiving groove 11 is used to position the material 200 placed in the receiving groove 11, so that the introduction device 100 can accurately perform glue gluing on the material 200.

[0058] In some embodiments, a holding groove 31 is provided on the side of the first buffer member 30 facing the material 200, and the holding groove 31 is adapted to the edge of the material 200. When the material 200 to be glued is placed in the receiving groove 11, the edge of the material 200 is received in the holding groove 31 of the first buffer member 30, so that the holding groove 31 holds the material 200, thereby fixing the material 200 in the receiving groove 11, and further enabling the introduction device 100 to accurately perform glue filling on the material 200.

[0059] In some embodiments, the upper surface of the first buffer member 30 is higher than the upper surface of the portion of the material 200 located within the receiving groove 11 adjacent to the first buffer member 30. Thus, when the first mold body 10 and the second mold body 20 are closed, the first buffer member 30 abuts the second mold body 20, creating a sealed environment for the introduction device 100. This facilitates the introduction device 100 to perform the glue injection process on the material 200, thereby forming a protective layer 201 on the surface of the material 200. Furthermore, because the first buffer member 30 has a certain degree of elasticity, when the second mold body 20 and the first mold body 10 are closed, the second mold body 20 can compress the first buffer member 30, causing the compressed upper surface of the first buffer member 30 to be flush with the upper surface of the material 200. This ensures the effective formation of the protective layer 201 and enables the elastic deformation of the first buffer member 30 to effectively seal the gap between the first mold body 10 and the second mold body 20.

[0060] In some embodiments, the accommodating groove 11 includes a positioning groove 111 and a transition groove 112. The positioning groove 111 is arranged on the side of the first mold body 10 facing the second mold body 20. The positioning groove 111 is used to place the material 200. The transition groove 112 is arranged around the positioning groove 111 and is connected to the positioning groove 111. The transition groove 112 is used to accommodate part of the first buffer component 30 so that the first buffer component 30 can position the material 200 placed in the positioning groove 111.

[0061] In this example, see Figure 6The introduction device 100 also includes a second buffer member 40. The second buffer member 40 is embedded in the side of the second mold body 20 facing the first mold body 10. When the first mold body 10 and the second mold body 20 are closed, the second buffer member 40 abuts against the material 200 placed in the receiving groove 11. The second buffer member 40 is arranged in the glue injection groove 21. The second buffer member 40 and the sidewall of the glue injection groove 21 form a space for accommodating the glue material, allowing the glue material to be directly formed into the desired shape after curing. It can be understood that the second buffer member 40 is made of the same material as the first buffer member 30, and can be made of silicone material, so as to prevent the second buffer member 40 from damaging the material 200 when the introduction device 100 is closed.

[0062] In some embodiments, see Figure 7 The introduction device 100 further includes a rotating member 50, which is rotatably connected to the second mold body 20 and can be snapped onto a side of the first mold body 10 facing away from the second mold body 20, so that the second mold body 20 is snap-fastened to the first mold body 10. It is understood that there can be two rotating members 50, which are rotatably connected to opposite sides of the second mold body 20 respectively.

[0063] Specifically, the rotating member 50 includes a rotating portion 51, a connecting portion 52, and a snap portion 53. The rotating portion 51 is rotatably connected to the side wall of the second mold body 20, the connecting portion 52 is connected to the end of the rotating portion 51 away from the second mold body 20, and the snap portion 53 is connected to the end of the connecting portion 52 away from the rotating portion 51. In this way, when the first mold body 10 and the second mold body 20 are closed, the connecting portion 52 rotates toward the first mold body 10 driven by the rotating portion 51, so that the snap portion 53 snaps onto the side of the first mold body 10 facing away from the second mold body 20, thereby fixing the first mold body 10 and the second mold body 20.

[0064] In some embodiments, an exhaust hole 25 is provided on the second mold body 20. The exhaust hole 25 is spaced apart from the glue injection hole 22 and is connected to the glue injection groove 21. When the first mold body 10 and the second mold body 20 are closed, the air in the glue injection groove 21 and the receiving groove 11 is discharged from the exhaust hole 25 to avoid the generation of bubbles in the protective layer 201, thereby reducing the quality of the protective layer 201.

[0065] In some embodiments, a rubber isolation layer (not shown) is provided on the side of the first mold body 10 facing away from the second mold body 20, and a rubber isolation layer is also provided on the side of the second mold body 20 facing away from the first mold body 10. The rubber isolation layer is used to protect the first mold body 10 and the second mold body 20 to prevent the molten glue from dripping onto the first mold body 10 or the second mold body 20 and adhering to it, thereby ensuring the neat appearance of the introduction device 100, enabling it to maintain surface accuracy and higher positioning accuracy.

[0066] The working process of the embodiment of the present application is as follows: first, the material 200 to be glued is placed in the containing groove 11, the first mold body 10 carries the material 200, and the first buffer member 30 positions the position of the material 200; then the second mold body 20 and the first mold body 10 are molded together, the connecting portion 52 rotates toward the first mold body 10 under the drive of the rotating portion 51, and the buckle portion 53 is buckled on the side of the first mold body 10 away from the second mold body 20, so that the first mold body 10 and the second mold body 20 are fixedly connected; then, the glue is injected. Hole 22 delivers the molten glue into the glue injection groove 21. The glue injection groove 21 accommodates the glue injected through the glue injection hole 22 to form a protective layer 201 on the surface of the material 200. The first non-stick layer 23 of the second mold body 20 contacts the molten glue and is not corroded by the molten glue, thereby protecting the second mold body 20. Finally, after the protective layer 201 on the material 200 solidifies, the first mold body 10 and the second mold body 20 are opened to remove the material 200 connected with the protective layer 201.

[0067] In the above-mentioned introduction device 100, the first mold body 10 places the material 200 through the receiving groove 11. After the second mold body 20 is molded with the first mold body 10, the receiving groove 11 is adapted to the glue injection groove 21, and the molten glue flows into the glue injection groove 21 through the glue injection hole 22. The glue injection groove 21 accommodates the glue injected through the glue injection hole 22 to form a protective layer 201 on the material 200. The wall surface of the glue injection groove 21 is provided with a first non-stick layer 23 to prevent the protective layer 201 from adhering to the second mold body 20, thereby facilitating the demolding of the protective layer 201 and preventing corrosion of the first non-stick layer 23. The present application forms a protective layer 201 on the material 200 by cooperating with the first mold body 10 and the second mold body 20, and the wall surface of the glue injection groove 21 is provided with the first non-stick layer 23. The molten glue will not corrode the first non-stick layer 23, thereby improving the service life of the introduction device 100.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. An introduction device, characterized in that: include: The first mold body is provided with a receiving groove for placing the material to be poured; The second mold body is provided with a glue injection groove and a glue injection hole connected to the glue injection groove, the glue injection groove is adapted to the receiving groove, and the glue injection groove is used to accommodate the glue injected through the glue injection hole to form a protective layer on the material; a first buffer member embedded in a side of the first mold body facing the second mold body, the first buffer member being disposed around the receiving groove, the upper surface of the first buffer member being higher than the upper surface of a portion of the material located in the receiving groove and adjacent to the first buffer member; and when the second mold body and the first mold body are closed, the second mold body compresses the first buffer member, and the compressed upper surface of the first buffer member is flush with the upper surface of the material, so that the elastic deformation of the first buffer member seals the gap between the first mold body and the second mold body; a second buffer member, the second buffer member being embedded in a side of the second mold body facing the first mold body, so that when the first mold body and the second mold body are closed, the second buffer member abuts against the material placed in the accommodating groove, the second buffer member being disposed in the glue injection groove, and the second buffer member and the side wall of the glue injection groove forming a space for accommodating the glue material; A first non-stick layer is provided on the wall surface of the glue injection groove to prevent the protective layer from adhering to the second mold body.

2. The introduction device according to claim 1, characterized in that A second non-stick layer is provided on a side of the second mold body facing the first mold body.

3. The introduction device according to claim 2, characterized in that The first non-stick layer and the second non-stick layer are made of Teflon.

4. The introduction device according to claim 1, characterized in that A portion of the first buffer member extends into the accommodating groove to position the material placed in the accommodating groove.

5. The introduction device according to claim 4, characterized in that The accommodating groove includes a positioning groove and a transition groove. The positioning groove is used to place materials. The transition groove is arranged around the positioning groove. The transition groove is used to accommodate part of the first buffer member.

6. The introduction device according to claim 4, characterized in that A clamping groove for clamping a workpiece is provided on a side of the first buffer member facing the material.

7. The introduction device according to claim 1, characterized in that The introduction device comprises: The rotating member is rotatably connected to the second mold body and can be snapped onto a side of the first mold body facing away from the second mold body, so that the second mold body is connected to the first mold body.

8. The introduction device according to claim 1, wherein: The second mold body is provided with an exhaust hole, and the exhaust hole is spaced apart from the glue injection hole.

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