A wafer sampling inspection device

Abstract

The present invention relates to a wafer sampling inspection device, which includes a sampling adsorption table, an upper wafer sampling support assembly, a sampling base assembly, and a sampling camera assembly. The sampling base assembly can drive the upper wafer sampling support assembly above it to move along the X-axis direction. A sampling camera assembly is provided on the sampling base assembly on the side of the upper wafer sampling support assembly along the negative Y-axis direction, and a sampling adsorption table is provided on the upper wafer sampling support assembly. Through the structure that the sampling base assembly can drive the upper wafer sampling support assembly above it to move along the X-axis direction, for wafers that need to be manually identified or defective wafers, the wafer platform for sampling can be automatically extended or retracted.

Description

Technical Field

[0001] The present invention relates to the technical field related to chip processing, and in particular to a wafer sampling inspection device. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. Various circuit element structures can be fabricated on the wafer. Usually, the circuit surface of the wafer, that is, the side that completes the chip function, is called the front side, and the other side is the back side.

[0003] After a large amount of retrieval, it is found that the prior art publication number CN102709206B discloses an automatic defect scanning sampling inspection method and device for controlling abnormal wafer production processes. The automatic defect scanning sampling inspection method for controlling abnormal wafer production processes according to the present invention includes: an on-line abnormality detection step for performing explicit abnormality detection and implicit abnormality detection, thereby inspecting the explicit abnormalities and implicit abnormalities of the production line during the wafer production process and recording the wafers with explicit abnormalities and / or implicit abnormalities; and a fixed sampling inspection step for performing fixed sampling inspection after wafer processing. The wafers sampled in the fixed sampling inspection step include the wafers with explicit abnormalities and / or implicit abnormalities recorded in the on-line abnormality detection step.

[0004] During the wafer processing, it usually needs to be cut. After the wafer, a thin film needs to be attached to the back side of the wafer to facilitate the subsequent separation of the wafers. However, before the wafer is pasted with the film, the cut wafers need to be sampled. Currently, the commonly used sampling inspection devices are all manually pulled to open the sampling inspection device and manually inspected, with low efficiency; at the same time, the wafer sampling inspection table is also fixed and cannot be automatically micro-adjusted, resulting in large deformation when the manipulator places or removes the wafer, and it is easy to damage the manipulator.

[0005] In view of the above defects, the designer actively conducts research and innovation in order to create a wafer sampling inspection device, making it more valuable in the industry. Summary of the Invention

[0006] To solve the above technical problems, the purpose of the present invention is to provide a wafer sampling inspection device.

[0007] To achieve the above purpose, the present invention adopts the following technical solutions:

[0008] A wafer sampling inspection device includes a sampling adsorption table, a wafer sampling upper support assembly, a sampling base assembly, and a sampling camera assembly. The sampling base assembly drives the wafer sampling upper support assembly above it to move along the X-axis direction. A sampling camera assembly is arranged on the sampling base assembly on one side of the wafer sampling upper support assembly along the negative Y-axis direction. A sampling adsorption table is arranged on the wafer sampling upper support assembly.

[0009] The upper support component for wafer sampling inspection includes a first sampling inspection table bottom plate. At the middle position on the first sampling inspection table bottom plate, there is a sampling inspection adsorption table. On the first sampling inspection table bottom plate below the sampling inspection adsorption table, there are several fixed spring components and leveling spring components, and the fixed spring components and the leveling spring components are respectively in contact with the sampling inspection adsorption table above;

[0010] The sampling inspection base component includes a second sampling inspection table bottom plate. On one side of the second sampling inspection table bottom plate along the positive X-axis direction, there is a first cylinder. The first cylinder is installed on the second sampling inspection table bottom plate through a first cylinder fixing plate. The driving end on the side along the negative X-axis direction of the first cylinder is connected to the first sampling inspection table bottom plate above through a movable plate and drives it to move along the X-axis direction;

[0011] On one side of the first sampling inspection table bottom plate below along the positive Y-axis direction, there is a first slide plate assembly. On one side of the first sampling inspection table bottom plate below along the negative Y-axis direction, there is a second slide plate assembly;

[0012] The first slide plate assembly includes a left sampling inspection table slide plate, a first slide rail assembly, and a left slide rail fixing plate. The left sampling inspection table slide plate is installed on the second sampling inspection table bottom plate below along the X-axis direction. The left slide rail fixing plate is installed at the bottom of the first sampling inspection table bottom plate above along the X-axis direction. The left sampling inspection table slide plate is connected to the outer left slide rail fixing plate through the first slide rail assembly;

[0013] The second slide plate assembly includes a right sampling inspection table slide plate, a second slide rail assembly, and a right slide rail fixing plate. The right sampling inspection table slide plate is installed on the second sampling inspection table bottom plate below along the X-axis direction. The right slide rail fixing plate is installed at the bottom of the first sampling inspection table bottom plate above. The right sampling inspection table slide plate is connected to the outer right slide rail fixing plate through the second slide rail assembly.

[0014] As a further improvement of the present invention, on one side of the first sampling inspection table bottom plate along the negative X-axis direction, there is a first sensor and an amplifier assembly. The first sensor is installed on the first sampling inspection table bottom plate through a first sensor fixing plate. The amplifier assembly is installed on the first sampling inspection table bottom plate through an amplifier fixing plate. A sampling inspection table cover plate is installed on the first sampling inspection table bottom plate outside the first sensor and the amplifier assembly. A handle is arranged on the outer top of the sampling inspection table cover plate. On one side of the bottom of the first sampling inspection table bottom plate along the positive X-axis direction, there is a sensor induction piece. On one side of the second sampling inspection table bottom plate along the positive X-axis direction, there is a second sensor fixing plate, and a second sensor is installed on the second sensor fixing plate.

[0015] As a further improvement of the present invention, a magnetic buckle one and a magnetic buckle adsorption plate one are arranged on one side of the bottom of the sampling table bottom plate one along the positive direction of the X-axis. A magnetic buckle two is arranged on one side of the left slide plate of the sampling table along the negative direction of the X-axis. The magnetic buckle two is installed on the left slide plate of the sampling table through a magnetic buckle fixing plate two. A magnetic buckle adsorption plate two is arranged on one side of the sensor fixing plate two along the negative direction of the X-axis. The magnetic buckle one cooperates with the magnetic buckle adsorption plate two, and the magnetic buckle two cooperates with the magnetic buckle adsorption plate one.

[0016] As a further improvement of the present invention, a cylinder two is arranged on one side of the right slide plate of the sampling table close to the negative direction of the X-axis. The cylinder two is installed on the right slide plate of the sampling table through a cylinder fixing plate two. A locking column is arranged at the top of the cylinder two. A sampling table locking block adapted to the locking column is arranged on one side of the bottom of the sampling table bottom plate one along the positive direction of the X-axis.

[0017] As a further improvement of the present invention, a plurality of suction cups are installed at the bottom of the sampling table bottom plate one below the sampling adsorption table. The suction cups are installed at the bottom of the sampling table bottom plate one through suction cup fixing plates. Suction holes are arranged on the sampling adsorption table directly above the suction cups. The suction cups pass through the suction cup holes on the sampling table bottom plate one and are connected to the upper suction holes.

[0018] As a further improvement of the present invention, an optical fiber element is arranged at the middle position of the bottom of the sampling table bottom plate one. A drag chain is also connected and arranged between the sampling table bottom plate one and the sampling table bottom plate two.

[0019] As a further improvement of the present invention, the sampling camera assembly includes a camera bracket and a camera. A support plate is arranged at the top of the camera bracket. A slide table is arranged on the support plate. A transfer plate one is arranged on the slide table. A transfer plate two is arranged outside the transfer plate one. The transfer plate two adjusts its position in the Z-axis direction relative to the transfer plate one and is locked by a fastening pin. A camera is arranged on the transfer plate two.

[0020] As a further improvement of the present invention, the fixed spring assembly includes a limit pin one, a guide sleeve one and a pin fixing plate one. The pin fixing plate one is installed at the bottom of the sampling table bottom plate one. A guide sleeve one is installed at the middle position on the pin fixing plate one. A limit pin one is installed along the Z-axis direction inside the guide sleeve one. The limit pin one passes through the pin hole one of the sampling table bottom plate one and contacts the upper sampling adsorption table. A spring one is also arranged between the limit pin one and the guide sleeve one.

[0021] As a further improvement of the present invention, the leveling spring assembly includes a second limit pin, a second guide sleeve, a second pin fixing plate and an adjusting nut. The second pin fixing plate is installed at the bottom of the first inspection table bottom plate. A second guide sleeve is installed at the middle position of the second pin fixing plate. A second limit pin is installed along the Z-axis direction inside the second guide sleeve. The second limit pin passes through the second pin hole of the first inspection table bottom plate and contacts the upper inspection and adsorption table. An adjusting nut is installed at the bottom of the second pin fixing plate. The bottom of the second limit pin passes through the second guide sleeve and is locked by the lower adjusting nut. A second spring is also arranged between the second limit pin and the second guide sleeve.

[0022] With the above solution, the present invention has at least the following advantages:

[0023] 1. The structure that the upper wafer inspection and support assembly above can be driven to move along the X-axis direction by the inspection base assembly enables the wafer platform for inspection to automatically extend or retract for wafers that need to be manually identified or defective wafers.

[0024] 2. By setting the fixed spring assembly and the leveling spring assembly, after the chuck adsorbs the workbench, it can deform to a certain extent, which can effectively protect the fingers of the manipulator.

[0025] 3. By setting the inspection camera assembly, the wafers that need to be inspected are identified and detected, realizing the automatic inspection and identification of wafers.

[0026] The above description is only an overview of the technical solution of the present invention. In order to be able to understand the technical means of the present invention more clearly and implement it in accordance with the content of the description, the following takes the preferred embodiments of the present invention and combines with the drawings to describe in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, so they should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0028] Figure 1 is a schematic structural diagram of a wafer inspection device of the present invention;

[0029] Figure 2 is Figure 1 a schematic structural diagram of the back of the upper wafer inspection and support assembly in

[0030] Figure 3 is Figure 1 a schematic structural diagram of the front of the upper wafer inspection and support assembly in

[0031] Figure 4 is Figure 1 the structural schematic diagram of the left skateboard assembly in

[0032] Figure 5 is Figure 1 the structural schematic diagram of the sampling inspection base assembly in

[0033] Figure 6 is Figure 1 the structural schematic diagram of the right skateboard assembly in

[0034] Figure 7 is Figure 1 the structural schematic diagram of the sampling inspection camera assembly 1 in

[0035] Figure 8 is Figure 2 the structural schematic diagram of the fixed spring assembly in

[0036] Figure 9 is Figure 2 the structural schematic diagram of the leveling spring assembly in

[0037] Among them, the meanings of the reference numerals in the figure are as follows.

[0038] Handle 1, Sensor 1 2, Sampling inspection table cover 3, Sampling inspection adsorption table 4, Wafer sampling inspection upper support assembly 5, Drag chain 6, Skateboard assembly 1 7, Sampling inspection base assembly 8, Skateboard assembly 2 9, Sampling inspection camera assembly 10;

[0039] Sampling inspection table locking block 501, Fixed spring assembly 502, Magnetic buckle 1 503, Magnetic buckle adsorption plate 1 504, Sensor induction piece 505, Suction cup fixing plate 506, Optical fiber element 507, Sampling inspection table bottom plate 1 508, Leveling spring assembly 509, Suction cup 510, Amplifier fixing plate 511, Amplifier assembly 512;

[0040] Magnetic buckle 2 701, Magnetic buckle fixing plate 2 702, Sampling inspection table left skateboard 703, Slide rail assembly 1 704, Left side slide rail fixing plate 705;

[0041] Sampling inspection table bottom plate 2 801, Sensor fixing plate 2 802, Magnetic buckle adsorption plate 2 803, Sensor 2 804, Movable plate 805, Cylinder 1 806, Cylinder fixing plate 1 807;

[0042] Cylinder 2 901, Cylinder fixing plate 2 902, Sampling inspection table right skateboard 903, Slide rail assembly 2 904, Right side slide rail fixing plate 905;

[0043] Camera bracket 1001, Support plate 1002, Slide table 1003, Adapter plate 1 1004, Adapter plate 2 1005, Camera 1006;

[0044] Limit pin 1 (5021), Spring 1 (5022), Guide sleeve 1 (5023), Pin fixing plate 1 (5024), Limit pin 2 (5091), Spring 2 (5092), Guide sleeve 2 (5093), Pin fixing plate 2 (5094), Adjusting nut (5095). Detailed implementation mode

[0045] The following will, with reference to the accompanying drawings and embodiments, describe in further detail the specific implementation modes of the present invention. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0046] In order to enable those skilled in the art of this technology to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Usually, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present invention.

[0047] Embodiment

[0048] As Figures 1 to 9 shown, a wafer sampling inspection device includes a sampling adsorption table 4, a wafer sampling upper support assembly 5, a sampling base assembly 8, and a sampling camera assembly 10. The sampling base assembly 8 drives the wafer sampling upper support assembly 5 above it to move along the X-axis direction. A sampling camera assembly 10 is provided on the sampling base assembly 8 on the negative Y-axis side of the wafer sampling upper support assembly 5, and a sampling adsorption table 4 is provided on the wafer sampling upper support assembly 5.

[0049] The wafer sampling upper support assembly 5 includes a sampling table bottom plate 1 (508). A sampling adsorption table 4 is provided at the middle position on the sampling table bottom plate 508. A number of fixed spring assemblies 502 and leveling spring assemblies 509 are provided on the sampling table bottom plate 508 below the sampling adsorption table 4. The fixed spring assemblies 502 and the leveling spring assemblies 509 are respectively in contact with the sampling adsorption table 4 above.

[0050] The fixed spring assembly 502 includes a first limit pin 5021, a first guide sleeve 5023, and a first pin fixing plate 5024. The first pin fixing plate 5024 is installed at the bottom of the first sampling table bottom plate 508. A first guide sleeve 5023 is installed at the middle position on the first pin fixing plate 5024. A first limit pin 5021 is installed along the Z-axis direction inside the first guide sleeve 5023. The first limit pin 5021 passes through the first pin hole of the first sampling table bottom plate 508 and contacts the upper sampling adsorption table 4. A first spring 5022 is further provided between the first limit pin 5021 and the first guide sleeve 5023.

[0051] The leveling spring assembly 509 includes a second limit pin 5091, a second guide sleeve 5093, a second pin fixing plate 5094, and an adjusting nut 5095. The second pin fixing plate 5094 is installed at the bottom of the first sampling table bottom plate 508. A second guide sleeve 5093 is installed at the middle position on the second pin fixing plate 5094. A second limit pin 5091 is installed along the Z-axis direction inside the second guide sleeve 5093. The second limit pin 5091 passes through the second pin hole of the first sampling table bottom plate 508 and contacts the upper sampling adsorption table 4. An adjusting nut 5095 is installed at the bottom of the second pin fixing plate 5094. The bottom of the second limit pin 5091 passes through the second guide sleeve 5093 and is locked by the lower adjusting nut 5095. A second spring 5092 is further provided between the second limit pin 5091 and the second guide sleeve 5093.

[0052] A plurality of suction cups 510 are installed at the bottom of the first sampling table bottom plate 508 below the sampling adsorption table 4. The suction cups 510 are installed at the bottom of the first sampling table bottom plate 508 through the suction cup fixing plate 506. Suction holes are provided on the sampling adsorption table 4 directly above the suction cups 510. The suction cups 510 pass through the suction cup holes on the first sampling table bottom plate 508 and are connected to the upper suction holes. An optical fiber component 507 is provided at the middle position of the bottom of the first sampling table bottom plate 508. A drag chain 6 is further connected between the first sampling table bottom plate 508 and the second sampling table bottom plate 801.

[0053] A first sensor 2 and an amplifier assembly 512 are provided on one side of the first sampling table bottom plate 508 along the negative X-axis direction. The first sensor 2 is installed on the first sampling table bottom plate 508 through the first sensor fixing plate. The amplifier assembly 512 is installed on the first sampling table bottom plate 508 through the amplifier fixing plate 511. A sampling table cover plate 3 is installed on the first sampling table bottom plate 508 outside the first sensor 2 and the amplifier assembly 512. A handle 1 is provided on the top outside of the sampling table cover plate 3. A sensor induction piece 505 is provided on one side of the bottom of the first sampling table bottom plate 508 along the positive X-axis direction. A second sensor fixing plate 802 is provided on one side of the second sampling table bottom plate 801 along the positive X-axis direction. A second sensor 804 is installed on the second sensor fixing plate 802.

[0054] On one side of the bottom of the sampling table bottom plate 508 along the positive X-axis direction, there are magnetic buckle 503 and magnetic buckle adsorption plate 504. On one side of the left sliding plate 703 of the sampling table along the negative X-axis direction, there is magnetic buckle 701. Magnetic buckle 701 is installed on the left sliding plate 703 of the sampling table through magnetic buckle fixing plate 702. On one side of the sensor fixing plate 802 along the negative X-axis direction, there is magnetic buckle adsorption plate 803. Magnetic buckle 503 cooperates with magnetic buckle adsorption plate 803, and magnetic buckle 701 cooperates with magnetic buckle adsorption plate 504.

[0055] The sampling base assembly 8 includes the sampling table bottom plate 801. On one side of the sampling table bottom plate 801 along the positive X-axis direction, there is cylinder 806. Cylinder 806 is installed on the sampling table bottom plate 801 through cylinder fixing plate 807. The driving end on the negative X-axis side of cylinder 806 is connected to the upper sampling table bottom plate 508 through movable plate 805 and drives it to move along the X-axis direction.

[0056] On one side of the bottom of the sampling table bottom plate 508 along the positive Y-axis direction, there is sliding plate assembly 7. On one side of the bottom of the sampling table bottom plate 508 along the negative Y-axis direction, there is sliding plate assembly 9.

[0057] Sliding plate assembly 7 includes the left sliding plate 703 of the sampling table, rail assembly 704 and left rail fixing plate 705. The left sliding plate 703 of the sampling table is installed on the lower sampling table bottom plate 801 along the X-axis direction. The left rail fixing plate 705 is installed on the bottom of the upper sampling table bottom plate 508 along the X-axis direction. The left sliding plate 703 of the sampling table is connected to the outer left rail fixing plate 705 through rail assembly 704;

[0058] Sliding plate assembly 9 includes the right sliding plate 903 of the sampling table, rail assembly 904 and right rail fixing plate 905. The right sliding plate 903 of the sampling table is installed on the lower sampling table bottom plate 801 along the X-axis direction. The right rail fixing plate 905 is installed on the bottom of the upper sampling table bottom plate 508. The right sliding plate 903 of the sampling table is connected to the outer right rail fixing plate 905 through rail assembly 904.

[0059] On one side of the right sliding plate 903 of the sampling table close to the negative X-axis direction, there is cylinder 901. Cylinder 901 is installed on the right sliding plate 903 of the sampling table through cylinder fixing plate 902. There is a locking column at the top of cylinder 901. On one side of the bottom of the sampling table bottom plate 508 along the positive X-axis direction, there is a sampling table locking block 501 adapted to the locking column.

[0060] The sampled inspection camera assembly 10 includes a camera support 1001 and a camera 1006. A support plate 1002 is provided at the top of the camera support 1001. A slide table 1003 is provided on the support plate 1002. A first adapter plate 1004 is provided on the slide table 1003. A second adapter plate 1005 is provided outside the first adapter plate 1004. The second adapter plate 1005 adjusts its position in the Z-axis direction relative to the first adapter plate 1004 and is locked by a fastening pin. The camera 1006 is provided on the second adapter plate 1005.

[0061] The positional relationship and connection relationship between the above components:

[0062] An automatic wafer sampled inspection device has a sampled inspection camera assembly 10 installed on the upper part of a sampled inspection base assembly 8. On both sides of the sampled inspection base assembly 8, there are also a first slide plate assembly 7 and a second slide plate assembly 9. One end of a drag chain 6 is fixed to the upper part of a wafer sampled inspection upper support assembly 5, and the other end is fixed on the sampled inspection base assembly 8. A wafer sampled inspection upper support assembly 5 is installed on the first slide plate assembly 7 and the second slide plate assembly 9. A sampled inspection table cover plate 3 is installed in front of the left slide plate assembly 7 and the right slide plate assembly 9. A handle 1 and a first sensor 2 are installed on the sampled inspection table cover plate 3.

[0063] Brief description of the working principle:

[0064] After the manipulator places a wafer on the sampled inspection suction table 4 and the vacuum is turned on, the suction cup 510 adsorbs the wafer through the sampled inspection suction table 4. The sampled inspection camera assembly 10 performs a sampled inspection on the wafer and feeds back the inspection result to the control system.

[0065] When the wafer is in good condition, the manipulator takes out the wafer. During the process of taking out the wafer, after the manipulator presses down the sampled inspection suction table 4, the springs on the leveling spring assembly 509 can undergo micro-deformation to ensure the contact between the wafer and the manipulator, and at the same time avoid deformation of the manipulator.

[0066] When the wafer is defective, after the sampled inspection camera assembly 10 feeds back information to the control system, the first cylinder 806 in the sampled inspection base assembly 8 acts, causing the sampled inspection suction table 4 and the wafer sampled inspection upper support assembly 5 to slide out driven by the first slide plate assembly 7 and the second slide plate assembly 9 on both sides, and then the defective wafer can be taken out.

[0067] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0068] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection: it may be a mechanical connection or an electrical connection: it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific circumstances.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer sampling inspection device, comprising a sampling adsorption table (4), an upper support assembly (5) for wafer sampling inspection, a sampling base assembly (8), and a sampling camera assembly (10), characterized in that, The sampled inspection base assembly (8) drives the upper wafer sampled inspection upper support assembly (5) to move along the X-axis direction. A sampled inspection camera assembly (10) is arranged on the sampled inspection base assembly (8) on one side of the negative Y-axis direction of the wafer sampled inspection upper support assembly (5), and a sampled inspection adsorption table (4) is arranged on the wafer sampled inspection upper support assembly (5). The wafer sampled inspection upper support assembly (5) includes a first sampled inspection table bottom plate (508). A sampled inspection adsorption table (4) is arranged at the middle position on the first sampled inspection table bottom plate (508). A plurality of fixed spring assemblies (502) and leveling spring assemblies (509) are arranged on the first sampled inspection table bottom plate (508) below the sampled inspection adsorption table (4), and the fixed spring assemblies (502) and the leveling spring assemblies (509) are respectively arranged in contact with the upper sampled inspection adsorption table (4). The sampled inspection base assembly (8) includes a second sampled inspection table bottom plate (801). A first cylinder (806) is arranged on one side of the second sampled inspection table bottom plate (801) along the positive X-axis direction. The first cylinder (806) is installed on the second sampled inspection table bottom plate (801) through a first cylinder fixing plate (807). The driving end of the first cylinder (806) on one side of the negative X-axis direction is connected to the upper first sampled inspection table bottom plate (508) through a movable plate (805) and drives it to move along the X-axis direction. A first slide plate assembly (7) is arranged on one side of the first sampled inspection table bottom plate (508) along the positive Y-axis direction, and a second slide plate assembly (9) is arranged on one side of the first sampled inspection table bottom plate (508) along the negative Y-axis direction. The first slide plate assembly (7) includes a left sampled inspection table slide plate (703), a first slide rail assembly (704), and a left slide rail fixing plate (705). The left sampled inspection table slide plate (703) is installed on the lower second sampled inspection table bottom plate (801) along the X-axis direction. The left slide rail fixing plate (705) is installed at the bottom of the upper first sampled inspection table bottom plate (508) along the X-axis direction. The left sampled inspection table slide plate (703) is connected to the outer left slide rail fixing plate (705) through the first slide rail assembly (704). The second slide plate assembly (9) includes a right sampled inspection table slide plate (903), a second slide rail assembly (904), and a right slide rail fixing plate (905). The right sampled inspection table slide plate (903) is installed on the lower second sampled inspection table bottom plate (801) along the X-axis direction. The right slide rail fixing plate (905) is installed at the bottom of the upper first sampled inspection table bottom plate (508). The right sampled inspection table slide plate (903) is connected to the outer right slide rail fixing plate (905) through the second slide rail assembly (904).

2. The wafer sampling inspection device according to claim 1, characterized in that, On one side of the bottom plate (508) of the sampling table along the negative X-axis direction, a first sensor (2) and an amplifier assembly (512) are provided. The first sensor (2) is installed on the bottom plate (508) of the sampling table through a first sensor fixing plate. The amplifier assembly (512) is installed on the bottom plate (508) of the sampling table through an amplifier fixing plate (511). A sampling table cover plate (3) is installed on the bottom plate (508) of the sampling table outside the first sensor (2) and the amplifier assembly (512). A handle (1) is provided on the outer side of the top of the sampling table cover plate (3). On one side of the bottom of the bottom plate (508) of the sampling table along the positive X-axis direction, a sensor induction piece (505) is provided. On one side of the bottom plate (801) of the second sampling table along the positive X-axis direction, a second sensor fixing plate (802) is provided, and a second sensor (804) is installed on the second sensor fixing plate (802).

3. The wafer sampling inspection device according to claim 2, wherein, On one side of the bottom of the bottom plate (508) of the sampling table along the positive X-axis direction, a first magnetic buckle (503) and a first magnetic buckle adsorption plate (504) are provided. On one side of the left sliding plate (703) of the sampling table along the negative X-axis direction, a second magnetic buckle (701) is provided. The second magnetic buckle (701) is installed on the left sliding plate (703) of the sampling table through a second magnetic buckle fixing plate (702). On one side of the second sensor fixing plate (802) along the negative X-axis direction, a second magnetic buckle adsorption plate (803) is provided. The first magnetic buckle (503) cooperates with the second magnetic buckle adsorption plate (803), and the second magnetic buckle (701) cooperates with the first magnetic buckle adsorption plate (504).

4. A wafer sampling inspection device as claimed in claim 1, wherein, On one side of the right sliding plate (903) of the sampling table close to the negative X-axis direction, a second cylinder (901) is provided. The second cylinder (901) is installed on the right sliding plate (903) of the sampling table through a second cylinder fixing plate (902). A locking column is provided at the top of the second cylinder (901). On one side of the bottom of the bottom plate (508) of the sampling table along the positive X-axis direction, a sampling table locking block (501) adapted to the locking column is provided.

5. The wafer sampling inspection device according to claim 1, characterized in that A plurality of suction cups (510) are installed at the bottom of the bottom plate (508) of the sampling table below the sampling adsorption table (4). The suction cups (510) are installed at the bottom of the bottom plate (508) of the sampling table through suction cup fixing plates (506). Suction holes are provided on the sampling adsorption table (4) directly above the suction cups (510). The suction cups (510) pass through the suction cup holes on the bottom plate (508) of the sampling table and are connected to the upper suction holes.

6. A wafer sampling inspection device according to claim 1 or 2, characterized in that, An optical fiber component (507) is provided at the middle position of the bottom of the bottom plate (508) of the sampling table. A drag chain (6) is also connected between the bottom plate (508) of the sampling table and the bottom plate (801) of the second sampling table.

7. The wafer sampling inspection device according to claim 1, wherein, The sampled inspection camera assembly (10) includes a camera support (1001) and a camera (1006). A support plate (1002) is provided at the top of the camera support (1001). A sliding table (1003) is provided on the support plate (1002). A first adapter plate (1004) is provided on the sliding table (1003). A second adapter plate (1005) is provided on the outer side of the first adapter plate (1004). The second adapter plate (1005) adjusts its position in the Z-axis direction relative to the first adapter plate (1004) and is locked by a fastening pin. The camera (1006) is provided on the second adapter plate (1005).

8. A wafer sampling inspection device as described in claim 1, characterized in that, The fixed spring assembly (502) includes a first limit pin (5021), a first guide sleeve (5023), and a first pin fixing plate (5024). The first pin fixing plate (5024) is installed at the bottom of the first sampled inspection table bottom plate (508). A first guide sleeve (5023) is installed at the middle position on the first pin fixing plate (5024). A first limit pin (5021) is installed along the Z-axis direction in the first guide sleeve (5023). The first limit pin (5021) passes through the first pin hole of the first sampled inspection table bottom plate (508) and contacts the upper sampled inspection adsorption table (4). A first spring (5022) is further provided between the first limit pin (5021) and the first guide sleeve (5023).

9. A wafer sampling inspection device as claimed in claim 1, wherein, The leveling spring assembly (509) includes a second limit pin (5091), a second guide sleeve (5093), a second pin fixing plate (5094), and an adjusting nut (5095). The second pin fixing plate (5094) is installed at the bottom of the first sampled inspection table bottom plate (508). A second guide sleeve (5093) is installed at the middle position on the second pin fixing plate (5094). A second limit pin (5091) is installed along the Z-axis direction in the second guide sleeve (5093). The second limit pin (5091) passes through the second pin hole of the first sampled inspection table bottom plate (508) and contacts the upper sampled inspection adsorption table (4). An adjusting nut (5095) is installed at the bottom of the second pin fixing plate (5094). The bottom of the second limit pin (5091) passes through the second guide sleeve (5093) and is locked by the lower adjusting nut (5095). A second spring (5092) is further provided between the second limit pin (5091) and the second guide sleeve (5093).

Images