Laser etching device and etching method for graphene pattern

Abstract

The present invention belongs to the technical field of laser etching equipment, and discloses a laser etching device for graphene patterns, comprising a machine base, a control base fixedly mounted on the top of the machine base, and a laser etching assembly fixedly mounted on the top of the machine base. The present invention realizes the sealing control of each group of air holes by threading the threaded rod and the bottom frame, and cooperates with the negative pressure pump in the negative pressure mechanism to suck the air in the bottom frame. According to the actual size of the circuit board, the air holes at appropriate positions are rotated and opened by rotating the threaded rod, and the air in the bottom frame is sucked under the suction of the negative pressure mechanism, and the gas in the air holes at the bottom of the suction plate is connected to form a pressure difference between the upper and lower surfaces of the plate, completing the convenient adsorption and fixation before etching the graphene pattern on the circuit board, greatly reducing the obstruction of the top of the circuit board when the side or top surface is fixed, expanding the top space during actual etching, improving the etching effect, and having a good use effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser etching equipment, and in particular relates to a graphene pattern laser etching device and an etching method thereof. Background Art

[0002] Graphene is a sp 2 A new material in which hybrid connected carbon atoms are tightly packed into a single-layer two-dimensional honeycomb lattice structure [1]. Graphene has excellent optical, electrical, and mechanical properties and has important application prospects in materials science, micro-nano processing, energy, biomedicine, and drug delivery. It is considered a revolutionary material in the future. In the field of circuit boards, graphene is usually introduced for coating applications and combined with laser etching to complete the laser etching of graphene circuit patterns. Laser etching uses a high-energy pulsed laser beam to etch tiny grooves with a width of 10 to 505 μm and a depth of 5 to 1001 μm on the surface of the part.

[0003] In the prior art, the laser etching device for graphene patterns is usually used to place a circuit board with graphene attached on a placement table, and cooperate with a movable laser etching component on the top. After the circuit board is clamped and fixed in a stable position, the etching process of the graphene pattern is completed with the laser etching component close to it. Since the actual etching pattern is fine, accurate positioning is required during the etching process. However, although the clamping mechanism currently used ensures stability, there is a certain volume obstruction when clamping and fixing from the side or top, which limits the actual area that can be laser etched, affecting the actual laser etching range. In addition, when performing fixed etching on circuit boards of different sizes, the clamping position needs to be adjusted, and the use effect is not good. Summary of the Invention

[0004] The object of the present invention is to provide a graphene pattern laser etching device and etching method thereof to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned objectives, the present invention provides the following technical solutions: A laser etching device for a graphene pattern and an etching method thereof, comprising a machine base, a control base fixedly installed on the top of the machine base, a laser etching assembly fixedly installed on the top of the machine base, a placement groove provided on the top surface of the machine base, an intermediate cavity provided on the front surface of the machine base, a bottom frame fixedly connected to the top surface of the inner surface of the intermediate cavity, a threaded hole provided on the bottom surface of the bottom frame, an air hole and a connecting hole respectively provided inside the machine base, the air hole and the connecting hole are connected, the upper end of the air hole is connected to the placement groove, the lower end of the connecting hole is connected to the bottom frame, a sealing head is movably sleeved inside the air hole, a threaded rod is fixedly connected to the bottom surface of the sealing head, the lower end of the threaded rod passes through the connecting hole and the threaded hole and is threadedly sleeved in the threaded hole, the lower end of the threaded rod is fixedly connected to an operating panel, a negative pressure mechanism is fixedly installed inside the intermediate cavity, the negative pressure mechanism is connected to the bottom frame, and a limiting sleeve is fixedly sleeved on the outer surface of the threaded rod.

[0006] Preferably, the inner diameter of the air hole is smaller than the inner diameter of the connecting hole, and the air hole array is distributed at the bottom of the placement groove.

[0007] Preferably, the sealing head includes a sealing sleeve, an annular groove and a sealing ring, the sealing sleeve is fixedly connected to the end face of the threaded rod, the annular groove is opened on the outer surface of the sealing sleeve, and the sealing ring is fixedly sleeved inside the annular groove.

[0008] Preferably, the negative pressure mechanism includes a negative pressure pump, a No. 1 pipe and a No. 2 pipe. The negative pressure pump is fixedly installed in the middle cavity, and the No. 1 pipe and the No. 2 pipe are fixedly connected to the suction end and the discharge end of the negative pressure pump respectively.

[0009] Preferably, a side hole is opened on the side of the bottom frame, and both ends of the side hole are respectively connected to the No. 1 pipe and the bottom frame.

[0010] Preferably, a middle hole is opened on the front of the bottom frame, a fixed sleeve is fixedly connected to the front of the bottom frame, the fixed sleeve is communicated with the middle hole, a filter plate is provided inside the fixed sleeve, a connecting sleeve is threadedly connected to the inner surface of the fixed sleeve, and a hose is fixedly connected to the end face of the connecting sleeve.

[0011] Preferably, a clamping block is fixedly connected to the outer surface of the filter plate, a clamping groove is provided on the inner surface of the fixed sleeve, and the inner surface of the clamping groove is movably sleeved with the clamping block.

[0012] Preferably, a sealing hole is opened on the bottom surface of the bottom frame, the sealing hole is vertically connected to the middle hole, and a sealing rod is connected to the inner thread of the sealing hole.

[0013] A method for etching a graphene pattern using a laser etching device, comprising the following steps:

[0014] Step 1: Place the plate to be etched in the placement slot on the top of the machine base, and determine several sets of adapted air holes according to the shape of the plate. Operate the corresponding threaded rod from the middle cavity to rotate the threaded rod and pull the sealing head down, so that the sealing head moves from the air hole to the connecting hole, opening the air hole and starting the negative pressure mechanism.

[0015] Step 2: As the negative pressure mechanism is activated, the air in the bottom frame is sucked out through the side holes. At the same time, the bottom frame sucks air toward the operated connecting holes and air holes, so that the plate is adsorbed and fixed in the placement slot. The laser etching assembly is activated, and the laser etching assembly moves downward to etch the graphene on the top of the plate.

[0016] Step 3: After etching is completed, reset the laser etching assembly and rotate the sealing rod downward so that the middle hole is connected to the bottom frame. At the same time, rotate the reset threaded rod to completely seal the air hole. Start the negative pressure mechanism again, hold the hose toward the placement slot, and complete the suction and cleaning of impurities after etching.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. The present invention opens air holes and connecting holes inside the machine base, connects the air holes and connecting holes, cooperates with the bottom frame at the bottom to connect with multiple groups of connecting holes, and respectively sleeves sealing heads and threaded rods connected to each other in the air holes and connecting holes, so that the threaded rods are threadedly sleeved with the bottom frame to achieve sealing control of each group of air holes, and cooperates with the negative pressure pump in the negative pressure mechanism to suck the air in the bottom frame. According to the actual size of the circuit board, the air holes at appropriate positions are rotated and the threaded rods are rotated to open the air holes, and cooperates with the suction of the negative pressure mechanism to suck the gas in the bottom frame, and the gas in the air holes at the bottom of the suction board is connected to form a pressure difference between the upper and lower surfaces of the board, thereby completing convenient adsorption and fixation before etching the graphene pattern on the circuit board, greatly reducing the obstruction of the top of the circuit board when the side or top surface is fixed, expanding the top space during actual etching, improving the etching effect, and having a good use effect.

[0019] 2. The present invention uses multiple groups of threaded rods connected by threads. When the threaded rods are rotated downward, the sealing head is driven to move downward and open the pores, thereby realizing the opening control of the target pores. The pores can be opened according to the actual size of the plate, and other pores are always sealed during the actual operation, which greatly improves the fixing effect of the plate during the laser etching process. It has a wide range of usable sizes, stable adsorption, and comprehensively improves the actual etching quality, with good use effect.

[0020] 3. The present invention opens a sealing hole at the bottom of the bottom frame, connects the sealing hole with the middle hole, and makes the sealing rod threaded in the sealing hole control the opening and closing of the middle hole. After completing the laser etching, by opening the middle hole and resetting the sealing head, each group of air holes is sealed, and the negative pressure mechanism sucks air outward through the middle hole, and cooperates with the detachable connecting sleeve and the hose on the connecting sleeve to realize the suction of the top of the machine base after etching, completes the adsorption and collection of impurities after etching, and thereby completes the cleaning of the top of the graphene after laser etching. It is easy to use and has a good cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention;

[0022] Figure 2 It is a cross-sectional schematic diagram of the base and bottom frame of the present invention;

[0023] Figure 3 for Figure 2 A is an enlarged schematic diagram of the structure;

[0024] Figure 4 It is a cross-sectional schematic diagram of the machine base of the present invention;

[0025] Figure 5 Schematic diagram of the connection between the threaded rod and the sealing head of the present invention;

[0026] Figure 6 Schematic diagram of the explosion of the sealing head of the present invention;

[0027] Figure 7 This is an exploded view of the space between the bottom frame and the sealing rod of the present invention;

[0028] Figure 8 This is an explosion diagram between the fixed sleeve and the communicating sleeve of the present invention;

[0029] Figure 9 Schematic diagram of the negative pressure mechanism of the present invention.

[0030] In the figure: 1. Machine base; 2. Control base; 3. Laser etching assembly; 4. Placement groove; 5. Middle cavity; 6. Bottom frame; 7. Negative pressure mechanism; 71. Negative pressure pump; 72. No. 1 pipe; 73. No. 2 pipe; 8. Air hole; 9. Connecting hole; 10. Threaded hole; 11. Threaded rod; 12. Sealing head; 121. Sealing sleeve; 122. Ring groove; 123. Sealing ring; 13. Operating panel; 14. Limiting sleeve; 15. Side hole; 16. Middle hole; 17. Sealing hole; 18. Sealing rod; 19. Fixing sleeve; 20. Card slot; 21. Filter plate; 22. Card block; 23. Connecting sleeve; 24. Hose. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] like Figures 1 to 9 As shown, the embodiment of the present invention provides a graphene pattern laser etching device and etching method thereof, including a machine base 1, a control base 2 is fixedly installed on the top of the machine base 1, a laser etching component 3 is fixedly installed on the top of the machine base 1, a placement groove 4 is provided on the top surface of the machine base 1, an intermediate cavity 5 is provided on the front surface of the machine base 1, a bottom frame 6 is fixedly connected to the top surface of the inner surface of the intermediate cavity 5, a threaded hole 10 is provided on the bottom surface of the bottom frame 6, an air hole 8 and a connecting hole 9 are respectively provided inside the machine base 1, the air hole 8 and the connecting hole 9 are connected, the upper end of the air hole 8 is connected to the placement groove 4, and the connecting hole 9 is connected to the upper end of the air hole 8. The lower end of the hole 9 is connected with the bottom frame 6, and the interior of the air hole 8 is movably sleeved with a sealing head 12. The bottom surface of the sealing head 12 is fixedly connected with a threaded rod 11. The lower end of the threaded rod 11 passes through the connecting hole 9 and the threaded hole 10 and is threadedly sleeved in the threaded hole 10. The lower end of the threaded rod 11 is fixedly connected with an operating panel 13. The interior of the intermediate cavity 5 is fixedly installed with a negative pressure mechanism 7, which is connected with the bottom frame 6. The outer surface of the threaded rod 11 is fixedly sleeved with a limiting sleeve 14. The limiting sleeve 14 is used to limit the moving position of the sealing head 12 to prevent it from moving above the air hole 8.

[0033] First embodiment: Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 9As shown, the plate to be etched is placed in the placement slot 4 on the top of the machine base 1, and several groups of adapted air holes 8 are determined according to the shape of the plate. The corresponding threaded rod 11 is operated from the middle cavity 5, so that the threaded rod 11 rotates and moves downward and pulls the sealing head 12 located in the air hole 8 downward, so that the sealing head 12 moves from the air hole 8 to the connecting hole 9, so that the air hole 8 and the connecting hole 9 are connected, the air hole 8 is opened, and the negative pressure mechanism 7 is started, so that the negative pressure pump 71 in the negative pressure mechanism 7 draws air through the No. 1 pipe 72. As the negative pressure mechanism 7 is started, the air in the bottom frame 6 is sucked out into the No. 1 pipe 72 through the side hole 15. At the same time, the inside of the bottom frame 6 draws air toward the operated connecting hole 9 and air hole 8, and the plate is lightly pressed so that the bottom surface of the plate is adsorbed and fixed in the placement slot 4 through the blocked air hole 8, so that an air pressure difference is formed at the top surface of the plate and the bottom air hole 8, the plate is adsorbed and fixed, and the laser etching component 3 is started, so that the laser etching component 3 moves downward and etches the graphene pattern on the top of the plate.

[0034] First, by opening air holes 8 and connecting holes 9 inside the machine base 1, and making the air holes 8 and connecting holes 9 connected, the bottom frame 6 at the bottom is connected with multiple groups of connecting holes 9, and the sealing heads 12 and threaded rods 11 connected to each other are respectively sleeved in the air holes 8 and the connecting holes 9, so that the threaded rods 11 are threadedly sleeved with the bottom frame 6 to achieve sealing control of each group of air holes 8, and cooperate with the negative pressure pump 71 in the negative pressure mechanism 7 to suck the air in the bottom frame 6, according to the actual size of the circuit board, rotate the air holes 8 at the appropriate position and open the air holes 8 by rotating the threaded rod 11, and cooperate with the suction of the negative pressure mechanism 7 to suck the gas in the bottom frame 6, and connect the gas in the air holes 8 at the bottom of the suction plate, so that a pressure difference is formed on the upper and lower sides of the plate, completing the convenient adsorption and fixation before etching the graphene pattern on the circuit board, greatly reducing the obstruction of the top of the circuit board when the side or top surface is fixed, expanding the top space during actual etching, improving the etching effect, and having a good use effect.

[0035] In addition, through the multiple sets of threaded rods 11 connected by threads, when the threaded rods 11 are rotated downward, the sealing head 12 is driven to move downward and open the pores 8, thereby realizing the opening control of the target pores 8. The pores 8 can be opened appropriately according to the size of the actual plate, and the other pores 8 are always sealed during the actual operation, which greatly improves the fixing effect of the plate during the laser etching process, has a wide range of usable sizes, stable adsorption, and comprehensively improves the actual etching quality, with good use effect.

[0036] Among them, the inner diameter of the air hole 8 is smaller than the inner diameter of the connecting hole 9, and the air hole 8 array is distributed at the bottom of the placement groove 4. By controlling the size of the air hole 8 and the connecting hole 9, the sealing head 12 sleeved in the air hole 8 is sealed, and the air hole 8 is opened after moving to the connecting hole 9 to realize the opening of the specified air hole 8.

[0037] Among them, the sealing head 12 includes a sealing sleeve 121, an annular groove 122 and a sealing ring 123. The sealing sleeve 121 is fixedly connected to the end face of the threaded rod 11, the annular groove 122 is opened on the outer surface of the sealing sleeve 121, and the sealing ring 123 is fixedly sleeved inside the annular groove 122. By utilizing the sleeved sealing ring 123 on the sealing head 12 and cooperating with the sealing ring 123 made of elastic material, the actual sealing effect is further improved to ensure that the designated opened air hole 8 is sucked in.

[0038] Among them, the negative pressure mechanism 7 includes a negative pressure pump 71, a No. 1 pipe 72 and a No. 2 pipe 73. The negative pressure pump 71 is fixedly installed in the middle cavity 5. The No. 1 pipe 72 and the No. 2 pipe 73 are fixedly connected to the suction end and the discharge end of the negative pressure pump 71 respectively. The air in the bottom frame 6 is sucked and low pressure is formed by utilizing the negative pressure mechanism 7. When the circuit board blocks the air hole 8 corresponding to the connection with the bottom frame 6, a pressure difference is formed between the upper and lower surfaces of the plate, and adsorption and fixation are completed.

[0039] Among them, a side hole 15 is opened on the side of the bottom frame 6, and the two ends of the side hole 15 are respectively connected to the No. 1 pipe 72 and the bottom frame 6. By utilizing the side hole 15 to connect the negative pressure mechanism 7 with the bottom frame 6, negative pressure suction is achieved.

[0040] Among them, a middle hole 16 is opened on the front of the bottom frame 6, and a fixed sleeve 19 is fixedly connected to the front of the bottom frame 6. The fixed sleeve 19 is connected to the middle hole 16. The interior of the fixed sleeve 19 is provided with a filter plate 21. The inner surface of the fixed sleeve 19 is threadedly sleeved with a connecting sleeve 23. The end face of the connecting sleeve 23 is fixedly connected with a hose 24. By utilizing the middle hole 16 to connect with the fixed sleeve 19, and utilizing the hose 24 to facilitate the adjustment of the suction direction, impurities are adsorbed and cleaned after the laser etching is completed.

[0041] Among them, the outer surface of the filter plate 21 is fixedly connected with a card block 22, and the inner surface of the fixed sleeve 19 is provided with a card slot 20. The inner surface of the card slot 20 is movably connected with the card block 22. By utilizing the movably connected filter plate 21 and coordinating the movably connected connection between the card block 21 and the card slot 20, it is convenient to remove the filter plate 21 for blockage cleaning after disassembling the connecting sleeve 23.

[0042] Among them, a sealing hole 17 is opened on the bottom surface of the bottom frame 6, and the sealing hole 17 is vertically connected to the middle hole 16. The internal thread of the sealing hole 17 is sleeved with a sealing rod 18. The sealing control of the middle hole 16 is achieved by utilizing the threaded sealing rod 18, and the diameter of the sealing rod 18 is larger than the inner diameter of the middle hole 16, ensuring that the middle hole 16 is opened after moving downward.

[0043] Second embodiment: Figure 1 、 Figure 2 、 Figure 7 、 Figure 8 and Figure 9As shown, after etching is completed, reset the laser etching assembly 3 and rotate and move the sealing rod 18 downward so that the middle hole 16 is connected to the bottom frame 6. At the same time, rotate and reset the threaded rod 11 so that the air hole 8 is completely sealed, start the negative pressure mechanism 7 again, hold the hose 24 toward the placement groove 4, and complete the suction and cleaning of impurities after etching; when it is necessary to clean the adsorbed impurities, loosen the connecting sleeve and remove the filter plate 21 from the fixed sleeve 19.

[0044] First, by opening a sealing hole 17 at the bottom of the bottom frame 6, and connecting the sealing hole 17 with the middle hole 16, and making the sealing rod 18 threaded in the sealing hole 17 control the opening and closing of the middle hole 16, after completing the laser etching, by opening the middle hole 16 and resetting the sealing head 12, after each group of air holes 8 are sealed, the negative pressure mechanism 7 draws air outward through the middle hole 16, and cooperates with the detachable connecting sleeve 23 and the hose 24 on the connecting sleeve 23 to realize the suction of the top of the machine base 1 after etching, completing the adsorption and collection of impurities after etching, thereby completing the cleaning of the top of the graphene after laser etching. It is easy to use and has a good cleaning effect.

[0045] A method for etching a graphene pattern using a laser etching device, comprising the following steps:

[0046] Step 1: Place the plate to be etched in the placement slot 4 on the top of the machine base 1, and determine several groups of adapted air holes 8 according to the shape of the plate. Operate the corresponding threaded rod 11 from the middle cavity 5, so that the threaded rod 11 rotates and pulls the sealing head 12 downward, so that the sealing head 12 moves from the air hole 8 to the connecting hole 9, opens the air hole 8 and starts the negative pressure mechanism 7;

[0047] Step 2: With the activation of the negative pressure mechanism 7, the air in the bottom frame 6 is sucked out through the side holes 15. At the same time, the bottom frame 6 sucks air toward the operated communicating holes 9 and air holes 8, so that the plate is adsorbed and fixed in the placement groove 4. The laser etching assembly 3 is activated, so that the laser etching assembly 3 moves downward to etch the graphene on the top of the plate.

[0048] Step 3: After etching is completed, reset the laser etching assembly 3 and rotate the sealing rod 18 downward so that the middle hole 16 is connected to the bottom frame 6. At the same time, rotate the reset threaded rod 11 to completely seal the air hole 8. Start the negative pressure mechanism 7 again, hold the hose 24 toward the placement slot 4, and complete the suction and cleaning of impurities after etching.

[0049] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A graphene pattern laser etching device, comprising a machine base (1), characterized in that: A control base (2) is fixedly mounted on the top of the base (1), a laser etching assembly (3) is fixedly mounted on the top of the base (1), a placement groove (4) is provided on the top surface of the base (1), an intermediate cavity (5) is provided on the front surface of the base (1), a bottom frame (6) is fixedly connected to the top surface of the inner surface of the intermediate cavity (5), a threaded hole (10) is provided on the bottom surface of the bottom frame (6), an air hole (8) and a connecting hole (9) are respectively provided inside the base (1), the air hole (8) and the connecting hole (9) are connected, the upper end of the air hole (8) is connected to the placement groove (4), and the connecting hole (10) is provided on the bottom surface of the bottom frame (6). The lower end of the through hole (9) is connected to the bottom frame (6), the air hole (8) is movably sleeved with a sealing head (12), the bottom surface of the sealing head (12) is fixedly connected with a threaded rod (11), the lower end of the threaded rod (11) passes through the connecting hole (9) and the threaded hole (10) and is threadedly sleeved in the threaded hole (10), the lower end of the threaded rod (11) is fixedly connected with an operating plate (13), the interior of the intermediate cavity (5) is fixedly installed with a negative pressure mechanism (7), the negative pressure mechanism (7) is connected to the bottom frame (6), the outer surface of the threaded rod (11) is fixedly sleeved with a limiting sleeve (14), The front surface of the bottom frame (6) is provided with a middle hole (16), the front surface of the bottom frame (6) is fixedly connected with a fixing sleeve (19), the fixing sleeve (19) is connected with the middle hole (16), the interior of the fixing sleeve (19) is provided with a filter plate (21), the inner surface of the fixing sleeve (19) is threadedly sleeved with a connecting sleeve (23), the end surface of the connecting sleeve (23) is fixedly connected with a hose (24), the bottom surface of the bottom frame (6) is provided with a sealing hole (17), the sealing hole (17) is vertically connected with the middle hole (16), the interior of the sealing hole (17) is threadedly sleeved with a sealing rod (18), The plate to be etched is placed in the placement slot (4) on the top of the machine base (1), and several groups of adapted air holes (8) are determined according to the shape of the plate. The corresponding threaded rod (11) is operated from the middle cavity (5), so that the threaded rod (11) rotates and pulls the sealing head (12) downward, so that the sealing head (12) moves from the air hole (8) to the connecting hole (9), opens the air hole (8) and starts the negative pressure mechanism (7). As the negative pressure mechanism (7) is started, the air in the bottom frame (6) is sucked out through the side hole (15), and at the same time, the bottom frame (6) moves toward the operated connecting hole (9). The hole (9) and the air hole (8) absorb air so that the plate is adsorbed and fixed in the placement groove (4), and the laser etching component (3) is started so that the laser etching component (3) moves downward to etch the graphene on the top of the plate. After the etching is completed, the laser etching component (3) is reset and the sealing rod (18) is rotated downward so that the middle hole (16) is connected to the bottom frame (6). At the same time, the reset threaded rod (11) is rotated to completely seal the air hole (8). The negative pressure mechanism (7) is started again, and the hose (24) is held toward the placement groove (4) to complete the suction and cleaning of impurities after etching.

2. The graphene pattern laser etching device according to claim 1, characterized in that: The inner diameter of the air holes (8) is smaller than the inner diameter of the connecting hole (9), and the air holes (8) are distributed in an array at the bottom of the placement groove (4).

3. The graphene pattern laser etching device according to claim 1, characterized in that: The sealing head (12) comprises a sealing sleeve (121), an annular groove (122) and a sealing ring (123); the sealing sleeve (121) is fixedly connected to the end surface of the threaded rod (11); the annular groove (122) is formed on the outer surface of the sealing sleeve (121); and the sealing ring (123) is fixedly sleeved inside the annular groove (122).

4. The graphene pattern laser etching device according to claim 1, characterized in that: The negative pressure mechanism (7) comprises a negative pressure pump (71), a No. 1 pipe (72) and a No. 2 pipe (73); the negative pressure pump (71) is fixedly mounted in the middle cavity (5); the No. 1 pipe (72) and the No. 2 pipe (73) are respectively fixedly connected to the air intake end and the air outlet end of the negative pressure pump (71).

5. The graphene pattern laser etching device according to claim 1, characterized in that: A side hole (15) is provided on the side of the bottom frame (6), and both ends of the side hole (15) are respectively connected to the No. 1 pipe (72) and the bottom frame (6).

6. The graphene pattern laser etching device according to claim 1, characterized in that: The outer surface of the filter plate (21) is fixedly connected with a clamping block (22), the inner surface of the fixed sleeve (19) is provided with a clamping groove (20), and the inner surface of the clamping groove (20) is movably sleeved with the clamping block (22).

7. The etching method of a graphene pattern laser etching device according to any one of claims 1 to 6, characterized in that: The following steps are included: Step 1: Place the plate to be etched in the placement slot (4) on the top of the machine base (1), and determine several groups of adapted air holes (8) according to the shape of the plate, operate the corresponding threaded rod (11) from the middle cavity (5), so that the threaded rod (11) rotates and pulls the sealing head (12) downward, so that the sealing head (12) moves from the air hole (8) to the connecting hole (9), opens the air hole (8) and starts the negative pressure mechanism (7); Step 2: With the activation of the negative pressure mechanism 7, the air in the bottom frame (6) is sucked out through the side hole (15), and at the same time, the bottom frame (6) sucks air toward the operated connecting hole (9) and the air hole (8), so that the plate is adsorbed and fixed in the placement groove (4), and the laser etching component (3) is activated, so that the laser etching component (3) moves downward to etch the graphene on the top of the plate; Step 3: After etching is completed, reset the laser etching assembly (3) and rotate the sealing rod (18) downward so that the middle hole (16) is connected to the bottom frame (6). At the same time, rotate the reset threaded rod (11) so that the air hole (8) is completely sealed. Start the negative pressure mechanism (7) again, hold the hose (24) toward the placement groove (4), and complete the suction and cleaning of impurities after etching.

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