Semiconductor chip forming and stripping apparatus

Abstract

The present application relates to a kind of semiconductor granulation forming stripping device, comprising: support;It is set on the support hopper, with top opening and bottom opening, and the hopper is variable cross-section structure, the size of top opening is greater than the size of bottom opening, top opening is formed with the support platform for placing the product to be stripped;And vibrator connected with hopper.The stripping device of the present application supports the product to be stripped by the support platform on the hopper, then realizes stripping by the vibration of vibrator, by vibration, product falls into the hopper, and then falls out from the bottom opening of the hopper, placing collection box at the bottom opening of the hopper can realize collecting product, the present application realizes automatic stripping, saves labor, can solve the problem of heavy workload of manual operation, also can improve the efficiency of stripping, and product will not contact with the support platform of hopper, can avoid the phenomenon that product is scratched, also will not have the risk of dropping material.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, in particular to a semiconductor cutting and forming stripping device. BACKGROUND

[0002] After the semiconductor device is packaged, it is cut and formed. The cut semiconductor device needs to be stripped and collected together. The existing method is to use a circular filter screen to collect the cut semiconductor lead frame, place the cut semiconductor lead frame on the circular filter screen, let part of the semiconductor device correspond to the opening of the circular filter screen, and then use tweezers to scrape the back of the lead frame to make the semiconductor device, i.e. the product, fall into the circular filter screen to achieve product collection. The existing method has the following technical problems: the size of the circular filter screen is smaller than the size of the rectangular lead frame, which is placed on the circular filter screen, which can easily cause the product to be attached to the top surface of the filter screen, resulting in product scratches. In addition, the risk of material falling is also prone to occur. In addition, manual scraping with tweezers or other tools to achieve stripping has the problems of large workload and low efficiency. SUMMARY

[0003] The purpose of the present application is to overcome the defects of the prior art and provide a semiconductor cutting and forming stripping device to solve the problems of existing stripping methods, such as easy product scratching, risk of material falling, and large workload and low efficiency of manual operation.

[0004] The technical solution to achieve the above-mentioned purpose is:

[0005] The present application provides a semiconductor cutting and forming stripping device, comprising:

[0006] a support;

[0007] a hopper provided on the support, having a top opening and a bottom opening, and the hopper is a variable cross-section structure, the size of the top opening is larger than the size of the bottom opening, and a supporting platform for placing products to be stripped is formed at the top opening; and

[0008] a vibrator connected to the hopper.

[0009] The stripping device of the present application supports the products to be stripped on the supporting platform of the hopper, and then strips the products by vibrating the vibrator. The products are dropped into the hopper by vibration, and then fall out of the bottom opening of the hopper. A collection box is placed at the bottom opening of the hopper to collect the products. The present application realizes automatic stripping, saves labor, solves the problem of large workload of manual operation, improves the efficiency of stripping, and avoids the phenomenon of product scratching and the risk of material falling.

[0010] The further improvement of the semiconductor chip forming and stripping device lies in that a cover shell is arranged above the hopper, and an ultraviolet lamp is arranged in the cover shell.

[0011] The further improvement of the semiconductor chip forming and stripping device lies in that the cover shell is rotatably arranged on the hopper, and the cover shell is adjusted to be opened by rotation, so as to facilitate the taking and placing of the product to be stripped.

[0012] The further improvement of the semiconductor chip forming and stripping device lies in that a pressing part is arranged on the cover shell, and the pressing part is adjusted by extension and retraction, so as to press the product to be stripped.

[0013] The further improvement of the semiconductor chip forming and stripping device lies in that a storage frame is arranged on the supporting platform of the hopper, and an opening corresponding to the top opening is formed in the storage frame.

[0014] The further improvement of the semiconductor chip forming and stripping device lies in that a baffle is arranged around the storage frame, and at least one of the baffles is provided with a gap.

[0015] The further improvement of the semiconductor chip forming and stripping device lies in that a ventilation hole is arranged on the side wall of the hopper.

[0016] The stripping device further comprises an ion fan arranged outside the hopper and connected with the ventilation hole of the hopper, so as to blow ion wind into the hopper.

[0017] The further improvement of the semiconductor chip forming and stripping device lies in that an outer shell is connected with the outside of the hopper, and a communication space is formed between the outer shell and the outside of the hopper.

[0018] The ion fan is arranged on the outer shell, and the air outlet of the ion fan is connected with the communication space.

[0019] The further improvement of the semiconductor chip forming and stripping device lies in that an electromagnetic adsorption plate is arranged on the supporting platform.

[0020] The product to be stripped is arranged on a metal ring.

[0021] The electromagnetic adsorption plate generates magnetism by power supply to adsorb the metal ring.

[0022] The further improvement of the semiconductor chip forming and stripping device lies in that a Teflon coating is arranged on the inner side of the hopper. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1The structure diagram of the first embodiment of the semiconductor cutting forming and stripping device.

[0024] Figure 2 The structure diagram of the second embodiment of the semiconductor cutting forming and stripping device.

[0025] Figure 3 The structure diagram of the semiconductor cutting forming and stripping device. Figure 2 The structure diagram of the semiconductor cutting forming and stripping device.

[0026] Figure 4 The structure diagram of the third embodiment of the semiconductor cutting forming and stripping device.

[0027] Figure 5 The structure diagram of the fourth embodiment of the semiconductor cutting forming and stripping device.

[0028] Figure 6 The structure diagram of the fifth embodiment of the semiconductor cutting forming and stripping device.

[0029] Figure 7 The structure diagram of the sixth embodiment of the semiconductor cutting forming and stripping device.

[0030] Figure 8 The structure diagram of the seventh embodiment of the semiconductor cutting forming and stripping device. DETAILED DESCRIPTION

[0031] The present application will be further described below in conjunction with the drawings and specific embodiments.

[0032] Referring to Figure 1 The present application provides a semiconductor cutting forming and stripping device, which is used to solve the problems of product scratch and material dropping caused by the round filter screen used in the existing manual stripping, and the problems of heavy workload and low efficiency of manual operation. The stripping device can realize automatic stripping, and the vibrator is arranged to vibrate the products cut and formed on the lead frame one by one, so that the products fall into the hopper, and then the collecting box is placed at the bottom of the hopper to collect the products. The stripping device does not contact the products, thereby solving the problem of product scratch, and the products directly fall into the hopper, which can reduce the problem of product dropping. Automatic stripping can reduce the workload of manual operation, and can also improve the work efficiency. The semiconductor cutting forming and stripping device will be described below in conjunction with the drawings.

[0033] Referring to Figure 1 The structure diagram of the first embodiment of the semiconductor cutting forming and stripping device is shown. The semiconductor cutting forming and stripping device will be described below in conjunction with Figure 1 ​

[0034] As Figure 1 shown, the semiconductor chip forming and stripping device of the present application comprises a support 21, a hopper 22 and a vibrator 23, the hopper 22 is arranged on the support 21, the hopper 22 has a top opening and a bottom opening, the hopper 22 is of a variable cross-section structure, the size of the top opening is larger than that of the bottom opening, a supporting platform 221 for placing products to be stripped is formed at the top opening, and the vibrator 23 is connected with the hopper 22.

[0035] In use, the products to be stripped are placed on the supporting platform 221 of the hopper 22, the products are arranged downwardly and face the top opening of the hopper 22, then the vibrator 23 is started to generate vibration so that the hopper 22 also vibrates, and the products on the supporting platform 221 also vibrate, thereby the products are vibrated to fall into the hopper 22, and the stripping is realized.

[0036] Preferably, the products to be stripped are pasted on a UV film before cutting, and a metal ring is arranged around the UV film for facilitating the turnover of the products, and the products are still pasted on the UV film after cutting without falling off. The size of the supporting platform 221 of the hopper 22 of the present application is consistent with that of the metal ring, so that the metal ring can be placed on the supporting platform 221, and then the lead frame in the metal ring is completely placed in the range of the top opening of the hopper 22, so that the stripped products can completely fall into the hopper 22 without the risk of falling off.

[0037] After the metal ring is placed on the supporting platform 221, the UV film can be made to lose adhesion by irradiating ultraviolet rays on the UV film, and then the products can be made to fall off by the vibration generated by the vibrator.

[0038] In one specific embodiment of the present application, as Figure 2 shown, a second embodiment of the present application is shown, in which, as Figure 3 shown, the stripping device further comprises a cover shell 24 covering above the hopper 22, and an ultraviolet lamp 241 is installed in the cover shell 24.

[0039] In this way, after the metal ring carrying the cut and formed products is placed on the supporting platform 221 of the hopper 22, the ultraviolet lamp 241 in the cover shell 24 is turned on to irradiate ultraviolet rays on the UV film, the UV film loses adhesion by the irradiation of the ultraviolet rays, and then the vibrator 23 is started to vibrate, thereby the stripping of the products is realized.

[0040] Preferably, the ultraviolet lamp 241 is multiple, and is arrayed on a lamp panel 242 which is fixedly connected in the cover shell 24.

[0041] Further, the cover 24 is rotatably mounted on the hopper 22, and is adjusted to be open by rotation, so as to facilitate taking and placing the product to be stripped.

[0042] In use, the cover 24 is first rotated to be open, and the metal ring of the product to be stripped is placed on the supporting platform 221 of the hopper 22, at this time, the product is arranged downwardly, then the cover 24 is rotated to be buckled, the ultraviolet lamp 241 is turned on to irradiate the UV film, after the UV film loses the adhesion (i.e. reaches the set irradiation time), the ultraviolet lamp 241 is turned off, and the vibrator 23 is turned on to vibrate, so as to realize the stripping of the product, and the stripped product falls into the hopper 22. At this time, a collecting box can be placed at the bottom opening of the hopper 22 to collect the product.

[0043] Further, the cover 24 is rotatably mounted on the hopper 22, and is adjusted to be open by rotation, so as to facilitate taking and placing the product to be stripped.

[0044] By arranging the pressing member 243 to press the product to be stripped, the efficiency of the product stripping can be improved, and the metal ring for fixing the product can be prevented from greatly shaking up and down, so as to ensure the safety of the product and avoid scratching the product.

[0045] Preferably, the pressing member 243 is arranged corresponding to the metal ring, and is adjusted by extension and retraction to press the metal ring, so that the metal ring is pressed on the supporting platform 221, and thus the metal ring can vibrate together with the hopper 22 and the vibrator 23.

[0046] Preferably, the pressing member 243 is arranged corresponding to the metal ring, and is adjusted by extension and retraction to press the metal ring, so that the metal ring is pressed on the supporting platform 221, and thus the metal ring can vibrate together with the hopper 22 and the vibrator 23.

[0047] In another preferable embodiment, the pressing member 243 comprises a threaded sleeve and a screw rod threadedly connected with the threaded sleeve, and the screw rod is adjusted to move up and down relative to the threaded sleeve by screwing the screw rod. Preferably, the top of the screw rod protrudes out of the top of the cover 24 to form an operation end, and when the cover is buckled on the hopper 22, the screw rod is adjusted to move downward by screwing the operation end of the screw rod, so as to press the bottom of the screw rod against the corresponding metal ring.

[0048] In one specific embodiment of the present application, as shown in Figure 4 Fig. 3 shows a third embodiment of the present application, in which the stripping device of the present application further comprises an ion fan 26 arranged outside the hopper 22, the sidewall of the hopper 22 is provided with a ventilation hole, the ion fan 26 is communicated with the ventilation hole of the hopper 22, and the ion fan 26 is used to blow ion wind into the interior of the hopper 22.

[0049] The ion wind is blown into the interior of the hopper 22 to eliminate the static electricity of the products and avoid the phenomenon that the products are broken due to the static electricity generated when the products are stripped.

[0050] Further, as shown in Figure 1 and Figure 4 , the outer side of the hopper 22 is connected with a shell 27, an air inlet 271 is arranged on the shell 27, the shell 27 and the outer side of the hopper 22 form a communication space, an ion wind machine 26 is arranged on the shell 27, and the air outlet of the ion wind machine 26 is communicated with the air inlet 271 arranged on the shell 27. The ion wind can enter the communication space through the air inlet 271 and then enter the interior of the hopper 22 through the air vent of the hopper 22.

[0051] Further, the top of the shell 27 is higher than the top of the hopper 22 to form a blocking part, the blocking part can block the metal ring loaded with the products placed on the supporting platform 221, and recesses are arranged on the opposite sides of the blocking part to facilitate the taking and placing of the metal ring.

[0052] In one specific embodiment of the present application, as shown in Figure 5 , a fourth embodiment of the present application is shown, the fourth embodiment is provided with the ion wind machine 26 and the shell 27 on the basis of the second embodiment, the ion wind generated by the ion wind machine 26 is blown into the hopper 22 to eliminate the static electricity of the products.

[0053] The cover 24 is preferably rotatably connected with the shell 27 through a hinge.

[0054] In the present embodiment, the top of the shell 27 is higher than the top of the hopper 22 to form a blocking part, the blocking part can block the metal ring loaded with the products placed on the supporting platform 221, and recesses are arranged on the opposite sides of the blocking part to facilitate the taking and placing of the metal ring.

[0055] In one specific embodiment of the present application, as shown in Figure 6 , a fifth embodiment of the present application is shown, in the fifth embodiment, the stripping device further comprises a storage frame 25 slidably arranged on the supporting platform 221 of the hopper 22, and an opening corresponding to the top opening is formed in the storage frame 25.

[0056] The storage frame 25 is used for supporting the metal ring loaded with the products, and the size of the storage frame 25 is matched with the size of the metal ring.

[0057] A handle 252 is arranged on the storage frame 25 to facilitate the pulling of the storage frame 25 through the handle 252, the storage frame 25 is similar to a drawer, and when the products are taken and placed, the storage frame 25 can be pulled out and then pushed into the hopper 22.

[0058] Further, a stop plate 222 is arranged on one side of the hopper 22, and is used to stop the sliding of the storage frame 25, so as to avoid the storage frame 25 from sliding out of the side of the hopper 22. Assuming that the side of the storage frame 25 on which the handle 252 is arranged is the rear side, and the side opposite to the rear side is the front side, the stop plate 222 is arranged on the side of the hopper 22 opposite to the front side of the storage frame 25.

[0059] Further, at least one of the baffle plates 251 is provided with an opening 2511.

[0060] Preferably, the openings 2511 are arranged on the front side and the rear side of the storage frame 25, and the frame body of the storage frame 25 is recessed inwardly at the positions of the openings 2511 to form recessed regions.

[0061] Preferably, the storage frame 25 is a square frame.

[0062] Further, a chute is arranged on the top surface of the hopper 22, and the bottom of the storage frame 25 is provided with a roller corresponding to the chute, and the roller is arranged to slide in the chute.

[0063] Further, an electromagnetic adsorption plate is arranged on the frame body of the storage frame 25, and the electromagnetic adsorption plate can generate magnetism when powered on, so as to adsorb the metal ring loaded with the product, to improve the stability of the metal ring, and effectively transmit the vibration generated by the vibrator to the product, so as to realize the peeling of the product.

[0064] In one specific embodiment of the present application, as shown in Figure 7 Fig. 6, a sixth embodiment of the present application is shown, which is based on the fifth embodiment, and is additionally provided with a cover 24, which is fixedly connected to the stop plate 222, and the cover 24 is internally provided with an ultraviolet lamp.

[0065] In order to improve the stability of the cover 24, a support plate can be arranged on one side of the stop plate 222, and the cover 24 and an outer shell 27 arranged outside the hopper 22 are fixedly connected through the support plate.

[0066] In use, the storage frame 25 is pulled out, the product is arranged in the storage frame 25, and then the storage frame 25 is pushed back to the cover 24 and the bracket of the hopper 22, and then the ultraviolet lamp is turned on to irradiate the UV film loaded with the product, after a certain time, the ultraviolet lamp is turned off, and the vibrator is turned on to vibrate, so that the product falls into the hopper 22.

[0067] In one specific embodiment of the present application, as shown in Figure 8As shown, a seventh embodiment of the present application is shown, which is based on the sixth embodiment and additionally comprises an ion fan 26, which is installed on a housing 27 arranged outside the hopper 22, and blows the ion wind generated by the ion fan 26 into the hopper 22 through an air inlet 271 of the housing 27 to eliminate the static electricity of the product.

[0068] In one specific embodiment of the present application, an electromagnetic adsorption plate is arranged on the supporting platform 221 of the hopper 22, and the product to be stripped is arranged on a metal ring; the electromagnetic adsorption plate generates magnetism when powered to adsorb the metal ring.

[0069] The electromagnetic adsorption plate can be arranged on the first, third and fourth embodiments of the present application.

[0070] In one specific embodiment of the present application, the inner side of the hopper 22 is provided with a Teflon coating. By arranging the Teflon coating, the risk of product scratching and sticking can be reduced.

[0071] The Teflon coating can be arranged in the first to seventh embodiments of the present application.

[0072] In one specific embodiment of the present application, a collecting box is further arranged below the hopper 22 and corresponds to the bottom opening of the hopper 22, the top opening of the collecting box is larger than the bottom opening of the hopper 22, and the product is collected through the collecting box.

[0073] The collecting box can be arranged in the first to seventh embodiments of the present application.

[0074] The stripping device of the present application can support the hopper 22 through the support 21, so that the bottom of the hopper 22 can be placed on a collecting box for product collection.

[0075] The vibrator of the present application is preferably a pneumatic vibrator.

[0076] In another preferred embodiment, the vibrator is an ultrasonic oscillator, which is installed on the side of the hopper 22, and the probe of the ultrasonic oscillator extends into the interior of the hopper 22 and can contact the UV film carrying the product, thereby stripping the product.

[0077] The above embodiments of the present application are described in detail in combination with the drawings, and those of ordinary skill in the art can make various changes to the present application according to the above description. Therefore, certain details in the embodiments should not constitute a limitation on the present application, and the scope of protection of the present application will be defined by the appended claims.

Claims

1. A semiconductor pellet forming and stripping apparatus, characterized by comprising: The device comprises: a support; a hopper arranged on the support, having a top opening and a bottom opening, and the hopper is of a variable cross-section structure, the size of the top opening is larger than that of the bottom opening, and a supporting platform for placing products to be stripped is formed at the top opening; and a vibrator connected with the hopper; further comprising a storage frame sliding on the supporting platform of the hopper, an opening corresponding to the top opening is formed on the storage frame, the storage frame is used for supporting a metal ring loaded with products, the size of the storage frame is matched with that of the metal ring, a handle is arranged on the storage frame to facilitate pulling the storage frame by the handle, a stop plate is arranged on one side of the hopper, the stop plate is used for stopping the sliding storage frame to avoid the storage frame sliding out of the side of the hopper, a sliding groove is arranged on the top surface of the hopper, a roller corresponding to the sliding groove is arranged on the bottom of the storage frame, the roller slides in the sliding groove, and an electromagnetic adsorption plate is arranged on the frame body of the storage frame, the electromagnetic adsorption plate generates magnetism when powered to adsorb the metal ring loaded with products.

2. The semiconductor die formation and stripping apparatus of claim 1 wherein, Further comprising a cover shell arranged above the hopper, and an ultraviolet lamp is installed in the cover shell.

3. The semiconductor die formation and stripping apparatus of claim 2, wherein, The cover shell is rotatably arranged on the hopper, and the cover shell is opened by rotating adjustment, so as to facilitate taking and placing the products to be stripped.

4. The semiconductor die formation and stripping apparatus of claim 2, wherein, A pressing member is arranged on the cover shell, the pressing member is adjustable in extension and retraction, and the pressing member is pressed against the products to be stripped by extension and retraction adjustment.

5. The semiconductor die formation and stripping apparatus of claim 1 wherein, At least one baffle is arranged around the storage frame, and a notch is arranged on the baffle.

6. The semiconductor die formation and stripping apparatus of claim 1 wherein, A ventilation hole is arranged on the side wall of the hopper. The stripping device further comprises an ion fan arranged outside the hopper and connected with the ventilation hole on the hopper to blow ion wind into the hopper.

7. The semiconductor die formation and stripping apparatus of claim 6 wherein, An outer shell is connected with the outside of the hopper, and a communication space is formed between the outer shell and the outside of the hopper. The ion fan is installed on the outer shell, and the air outlet of the ion fan is connected with the communication space.

8. The semiconductor die formation and stripping apparatus of claim 1 wherein, An electromagnetic adsorption plate is arranged on the supporting platform. The products to be stripped are arranged on a metal ring. The electromagnetic adsorption plate generates magnetism when powered to adsorb the metal ring.

9. The semiconductor die formation and stripping apparatus of claim 1 wherein, A Teflon coating is arranged on the inner side of the hopper.

Images