A method for waste disposal of die-cut FDC copper foil

By setting a release film before die-cutting FDC copper foil and using multiple protective films, the problem of unreliable waste discharge after die-cutting was solved, achieving stable waste discharge of copper foil and improving production efficiency and product quality.

CN116442323BActive Publication Date: 2026-01-30SUZHOU ANJIE TECH
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Patent Information

Application Number
CN202310345819.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-03
Publication Date
2026-01-30
Estimated Expiration
2043-04-03

AI Technical Summary

Technical Problem

In existing technologies, when die-cutting FDC copper foil, inconsistent product dimensions lead to unreliable waste removal, especially when the minimum copper foil width is 0.25mm. This results in a large peeling force between the waste and the bottom protective film after die-cutting, causing the waste to break.

Method used

Before die cutting, a release film is placed between the copper foil and the bottom protective film to cover the shape of the copper foil and extend outward. After the copper foil is cut by the die, the waste is removed by the protective film. The use of multiple protective films reduces the peeling force and ensures stable waste discharge.

Benefits of technology

This achieves stable and reliable waste discharge of copper foil, avoids breakage of waste during die-cutting, and improves production efficiency and product quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a waste removal method for die-cut FDC copper foil. A release film is placed in the area below the formed copper foil, reducing the peel force between the copper foil and the process protective film, thereby ensuring stable and reliable waste removal of the die-cut copper foil. Depending on the shape of the copper foil, a release film is placed between the copper foil and the bottom protective film before die-cutting. The release film completely covers the shape of the copper foil and extends outwards by a predetermined distance. Most of the surface area of ​​the copper foil to be die-cut into waste remains covered by the bottom protective film. The copper foil is then cut downwards using a copper foil die, and the waste copper foil is then removed through the protective film.
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Description

Technical Field

[0001] This invention relates to the technical field of die-cutting methods, specifically a waste removal method for die-cutting FDC copper foil. Background Technology

[0002] FDC products refer to flexible copper foil ribbon cables manufactured using a die-cutting process, with a structure such as... Figure 1 The product shown is mainly a PSA+PI thermosetting film + CU+PI thermosetting film. It has multiple structural layers, with a copper foil layer in the middle. Currently, the copper foil is directly obtained through a single die-cutting process. However, in actual manufacturing, some areas of the copper foil show… Figure 2 The shaded area represents the product, and the blank area represents waste. The product size is too large, and the copper foil size in the middle of the product varies, with the smallest copper foil width being 0.25mm and the largest being 40.08mm. The existing single-blade forming die-cutting cannot reliably remove waste in the subsequent process.

[0003] Therefore, there is an urgent need to develop a die-cutting waste removal method applicable to FDC copper foil. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a waste removal method for die-cut FDC copper foil, which involves placing a release film in the area below the formed copper foil, thereby reducing the peel force between the copper foil and the process protective film, and ensuring stable and reliable waste removal of the die-cut copper foil waste.

[0005] A waste removal method for die-cut FDC copper foil is characterized in that: according to the shape of the copper foil, before die-cutting the copper foil, a release film is set between the copper foil and the bottom protective film. The release film completely covers the shape of the copper foil and extends outward by a set distance. Most of the surface area of ​​the copper foil to be die-cut into waste is still covered on the bottom protective film. The copper foil is punched downward by the copper foil die to complete the punching. Then the copper foil waste is discharged through the protective film.

[0006] Its further features are:

[0007] The release film is laminated onto the bottom protective film and conveyed forward. Then, it is half-cut by a die-cutting area that mimics the shape of the copper foil, so that the release film completely covers the final formed copper foil shape and extends outward by a set distance.

[0008] Then, the waste release film after punching is removed from the production line through the first intermediate protective film, and then the copper foil is pressed onto the surface of the release film and the bottom protective film, so that the bottom of the final forming area of ​​the copper foil is pressed onto the release film.

[0009] The copper foil is then die-cut using a copper foil die, and the waste copper foil is then removed using a second intermediate protective film.

[0010] The shielding area formed by the release film extends outward from the boundary of the final formed copper foil by 0.4 mm to 0.8 mm;

[0011] Preferably, the shielding area formed by the release film extends outward by 0.5 mm from the boundary of the finally formed copper foil;

[0012] The bottom protective film is specifically a 60μm thick protective film;

[0013] The release film is specifically a PET release film;

[0014] The first intermediate protective film and the second intermediate protective film are protective films of the same material, both of which are 60μm thick.

[0015] The first intermediate protective film, the second intermediate protective film, and the bottom protective film are all of the same type, which makes the number of material types required for the entire operation relatively small and reduces the number of classified storage cavities.

[0016] By adopting this invention, according to the final shape of the copper foil, an additional process is added to the copper foil waste area before die-cutting the copper foil. A release film is die-cut as a shielding layer using a die. This release film is left between the copper foil and the bottom protective film, reducing the relative peeling force between the copper foil and the bottom protective film during waste removal. The shape of the release film as the shielding layer imitates the size of the waste area, and the shielding size is extended outward by a set distance relative to the copper foil waste. After the shielding layer is die-cut, the copper foil is then attached for die-cutting. In this way, during waste removal, the waste will not break due to the large relative peeling force between the copper foil waste and the bottom protective film, making it impossible to produce. This results in a release film being placed in the area below the formed copper foil, which reduces the peeling force between the copper foil and the process protective film, thereby ensuring stable and reliable waste removal of the die-cut copper foil waste. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the product manufactured according to the present invention;

[0018] Figure 2 This is a partial enlarged view of the copper foil corresponding to the product of this invention;

[0019] Figure 3 This is a schematic diagram of the process flow corresponding to the present invention;

[0020] Figure 4 This is a partial schematic diagram of the die-cutting mold for the shielding area applicable to the present invention;

[0021] Figure 5 This is a partial schematic diagram of a copper foil die suitable for use in this invention. Detailed Implementation

[0022] A waste removal method for die-cut FDC copper foil, see Figures 3-5Based on the shape of the copper foil, a release film is placed between the copper foil and the bottom protective film before die-cutting. The release film completely covers the shape of the copper foil and extends outward by a set distance. Most of the surface area of ​​the copper foil to be die-cut into waste is still covered on the bottom protective film. The copper foil is cut by punching downward through the copper foil die, and then the copper foil waste is discharged through the protective film.

[0023] The specific process flow is as follows:

[0024] The release film is laminated onto the bottom protective film and conveyed forward, then die-cut into the shielding area, which mimics the shape of copper foil forming (see...). Figure 4 The release film is cut in half so that it completely covers the final formed copper foil shape and extends outward by 0.5mm.

[0025] Then, the waste release film after punching is removed from the production line through the first intermediate protective film, and then the copper foil is pressed onto the surface of the release film and the bottom protective film, so that the bottom of the final forming area of ​​the copper foil is pressed onto the release film.

[0026] Then, through copper foil die-cutting (see...) Figure 5 The copper foil is die-cut, and then the copper foil waste is discharged through the second intermediate protective film.

[0027] In practice, the bottom protective film, the first intermediate protective film, and the second intermediate protective film are all 60μm thick protective films; the release film is specifically a PET release film.

[0028] Its working principle is as follows: Based on the final shape of the copper foil, before die-cutting the copper foil, an additional process is added to the copper foil waste area. A release film is die-cut as a masking layer using a die. This release film is left between the copper foil and the bottom protective film, reducing the relative peeling force between the copper foil and the bottom protective film when the copper foil is discharged. The shape of the release film as the masking layer imitates the size of the waste area, and the masking size is extended outward by a set distance relative to the copper foil waste. After the masking layer is die-cut, the copper foil is then attached for die-cutting. In this way, the waste will not break and become unusable due to the large relative peeling force between the copper foil waste and the bottom protective film when the waste is discharged. This results in a release film being placed in the area below the formed copper foil, which reduces the peeling force between the copper foil and the process protective film, thereby ensuring stable and reliable discharge of the die-cut copper foil waste.

[0029] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0030] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A method of waste disposal for die cutting FDC copper foil, characterized by: According to the shape of the product copper foil, a release film is arranged between the copper foil and the bottom protective film before the copper foil is die-cut, the release film completely covers the copper foil shape and extends outward by a set distance, most of the surface area of the copper foil waste formed by die-cutting is still covered on the bottom protective film, the punching of the copper foil is completed by punching down the copper foil die, and then the copper foil waste is discharged through the protective film; The release film is compounded on the bottom protective film and then forwarded, and then half-cut by the shielding area die according to the copper foil forming shape, so that the release film completely covers the finally formed copper foil shape and extends outward by a set distance; Then, the release film waste after punching is discharged out of the production line through the first intermediate protective film, and then the copper foil is laminated on the surface of the release film and the bottom protective film, so that the bottom of the finally formed area of the copper foil is laminated on the release film; Then, the die-cutting of the copper foil is completed by the copper foil die, and then the discharge of the copper foil waste is completed by the second intermediate protective film; The shielding area formed by the release film extends outward by 0.4mm-0.8mm from the boundary of the finally formed copper foil.

2. A method of waste removal for die cutting FDC copper foil as claimed in claim 1, characterized by: The shielding area formed by the release film extends outward by 0.5mm from the boundary of the finally formed copper foil.

3. A method of waste removal for die cutting FDC copper foil as claimed in claim 1, characterized by: The bottom protective film is specifically a 60μm thick protective film.

4. A method of waste removal for die cutting FDC copper foil as claimed in claim 1, characterized by: The release film is specifically a PET release film.

5. A method of waste removal for die cutting FDC copper foil as claimed in claim 1, wherein: The first intermediate protective film and the second intermediate protective film are protective films of the same material, both of which are 60μm thick protective films.

6. A method of waste disposal for die cutting FDC copper foil as claimed in claim 5, wherein: The first intermediate protective film, the second intermediate protective film and the bottom protective film are protective films of the same type.

Citation Information

Patent Citations

  • Waste discharge structure of perforated product and waste discharge process thereof

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